CN1642028A - Front-end module for multi-frequency multi-mode wireless network system - Google Patents
Front-end module for multi-frequency multi-mode wireless network system Download PDFInfo
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Abstract
Description
技术领域technical field
本发明主要是关于一种前端模块,尤其是关于一种用于多频多模(multi-band and multi-mode)无线网络系统的前端模块。The present invention mainly relates to a front-end module, in particular to a front-end module for a multi-band and multi-mode wireless network system.
背景技术Background technique
无线网络的技术主要有两大分类,一是利用无线电波作为数据传输的载波(Carrier),另一是利用诸如红外线(Infrared)与激光(Laser)的光波作为数据传输的载波。There are two main classifications of wireless network technology, one is to use radio waves as the carrier of data transmission, and the other is to use light waves such as infrared (Infrared) and laser (Laser) as the carrier of data transmission.
就利用无线电波作为数据传输的载波而言,又可分为二个发展方向,一是使用于短距离(10公尺)、低功率(100mW)及低成本的蓝牙技术,另一是使用于办公室无线传输的IEEE802.11技术(频宽最高可达54Mbps,而使用距离可达100公尺左右)。As far as the use of radio waves as a carrier for data transmission can be divided into two development directions, one is used in short-distance (10 meters), low power (100mW) and low-cost Bluetooth technology, and the other is used in IEEE802.11 technology for office wireless transmission (bandwidth up to 54Mbps, and use distance up to about 100 meters).
自1997年以来,无线网络系统的标准规格已从IEEE802.11拓展到IEEE802.11b/g/a,也就是说多频多模的需求已成为必要的发展趋势。另一方面,一般的无线网络系统是由前端模块(front-end module)、基频处理器(baseband Processor,定义为PHY)与介质存取控制器(Media Access Controller;MAC)等三部份所组成,其中前端模块通常包含了大量的电容器、电感器、电阻器、滤波器及阻抗转换器等被动组件,而为了满足成本低、体积小、耗电少的目标,必须将这些组件以模块化且微型化的型式整合起来,减少搭配的独立零组件。Since 1997, the standard specifications of wireless network systems have been expanded from IEEE802.11 to IEEE802.11b/g/a, which means that the demand for multi-frequency and multi-mode has become a necessary development trend. On the other hand, a general wireless network system is composed of three parts: front-end module (front-end module), baseband processor (baseband processor, defined as PHY) and media access controller (Media Access Controller; MAC). The front-end module usually contains a large number of passive components such as capacitors, inductors, resistors, filters, and impedance converters. In order to meet the goals of low cost, small size, and low power consumption, these components must be modularized. And the miniaturized types are integrated to reduce the number of independent components.
本发明在此提出一种用于无线网络系统的前端模块,其同时满足多频多模的需求以及模块化且微型化的需求。The present invention proposes a front-end module for a wireless network system, which simultaneously meets the requirements of multi-frequency and multi-mode as well as the requirements of modularization and miniaturization.
发明内容Contents of the invention
为了满足目前除了移动电话之外的无线通讯系统的无线网络系统应用的多频多模以及微型化的需求,本发明提出一种用于多频多模无线网络的前端模块,此一前端模块采用积层低温共烧陶瓷(Low Temperature CofiredCeramic;LTCC)的方法制作。In order to meet the requirements of multi-frequency, multi-mode and miniaturization of wireless network system applications in wireless communication systems other than mobile phones, the present invention proposes a front-end module for multi-frequency and multi-mode wireless networks. This front-end module adopts Laminated low temperature co-fired ceramics (Low Temperature CofiredCeramic; LTCC) method of production.
依本发明一实施例的用于多频多模无线网络系统的前端模块,包含两个波段分隔组件、一个分集切换开关、多个带通滤波器、多个非平衡至平衡转换器及多个第二低通滤波器。上述带通滤波器的个数、非平衡至平衡转换器的个数、低通滤波器的个数均与一射频信号所能搭载的波段的个数相同。A front-end module for a multi-frequency multi-mode wireless network system according to an embodiment of the present invention includes two band separation components, a diversity switch, a plurality of bandpass filters, a plurality of unbalanced to balanced converters and a plurality of Second low pass filter. The number of band-pass filters, the number of unbalanced-to-balanced converters, and the number of low-pass filters are all the same as the number of bands that can be carried by a radio frequency signal.
此外,各波段分隔组件至少包含一高通滤波器及一第一低通滤波器,负责在无线网络系统接收射频信号时将所能搭载的无线波段进行分离。分集切换开关则将任一波段分隔组件与任一天线接通。带通滤波器连接至一波段分隔组件,低通滤波器连接至另一波段分隔组件,非平衡至平衡转换器一对一地连接至带通滤波器。In addition, each band separation component includes at least a high-pass filter and a first low-pass filter, which are responsible for separating the wireless bands that can be carried when the wireless network system receives radio frequency signals. The diversity switching switch connects any band separation component to any antenna. The bandpass filter is connected to one band-splitting component, the low-pass filter is connected to the other band-separating component, and the unbalanced-to-balun converter is connected to the bandpass filter one-to-one.
另一方面,本发明的波段分隔组件、带通滤波器、非平衡至平衡转换器及低通滤波器是以图案化方式形成于多个低温共烧陶瓷基板内部,而分集切换开关则以表面黏着技术装设于低温共烧陶瓷基板的表层。On the other hand, the band separation component, band-pass filter, unbalanced-to-balanced converter, and low-pass filter of the present invention are formed in a plurality of low-temperature co-fired ceramic substrates in a patterned manner, and the diversity switch is formed on the surface Adhesive technology is installed on the surface of the low temperature co-fired ceramic substrate.
本发明的优点在于:第一、具备多频多模的特性而增加应用性。第二、前端模块具有体积小、电路散热性佳、成本低及可靠度高的优势。第三、设计与制作搭配度高,减少生产时间。The advantages of the present invention are as follows: first, it has the characteristics of multi-frequency and multi-mode to increase applicability. Second, the front-end module has the advantages of small size, good circuit heat dissipation, low cost and high reliability. Third, the design and production are highly matched, reducing production time.
附图说明Description of drawings
图1是一方块图,显示本发明第一实施例的用于多频多模无线网络系统的前端模块。FIG. 1 is a block diagram showing a front-end module for a multi-frequency multi-mode wireless network system according to a first embodiment of the present invention.
图2是一方块图,显示本发明第二实施例的用于多频多模无线网络系统的前端模块。FIG. 2 is a block diagram showing a front-end module for a multi-frequency multi-mode wireless network system according to a second embodiment of the present invention.
图3是一立体图,显示本发明的用于多频多模无线网络系统的前端模块在低温共烧陶瓷基板的配置。FIG. 3 is a perspective view showing the configuration of the front-end module for the multi-frequency multi-mode wireless network system of the present invention on the low temperature co-fired ceramic substrate.
图4A是一示意图,显示本发明的用于多频多模无线网络系统的前端模块的电感在低温共烧陶瓷基板的配置型态。FIG. 4A is a schematic diagram showing the arrangement of the inductor of the front-end module for the multi-frequency multi-mode wireless network system on the low-temperature co-fired ceramic substrate of the present invention.
图4B是一示意图,显示本发明的用于多频多模无线网络系统的前端模块的电容在低温共烧陶瓷基板的配置型态。FIG. 4B is a schematic diagram showing the arrangement of the capacitors of the front-end module for the multi-frequency multi-mode wireless network system on the low-temperature co-fired ceramic substrate of the present invention.
其中,附图中的组件符号说明如下:Among them, the component symbols in the accompanying drawings are explained as follows:
1、2前端模块1, 2 front-end module
10a、10b、20a、20b天线10a, 10b, 20a, 20b antenna
11、21分集切换开关11, 21 Diversity switch
12a、12b双工器12a, 12b duplexer
22a、22b多任务器22a, 22b multiplexer
121a、121b、221a、221b高通滤波器121a, 121b, 221a, 221b high pass filter
122a、122b、222a、222b低通滤波器122a, 122b, 222a, 222b low pass filter
13a、13b、23a、23b、23c带通滤波器13a, 13b, 23a, 23b, 23c bandpass filter
15a、15b、25a、25b、25c非平衡至平衡转换器15a, 15b, 25a, 25b, 25c Unbalanced to Balun
14a、14b、24a、24b、24c低通滤波器14a, 14b, 24a, 24b, 24c low pass filter
3~集成电路模块3~integrated circuit module
31~低温共烧陶瓷基板31~Low temperature co-fired ceramic substrate
311~低温共烧陶瓷基板表层311~Low temperature co-fired ceramic substrate surface layer
41、51~导电层41, 51~conductive layer
42、52~金属导通孔42, 52~Metal vias
具体实施方式Detailed ways
以下将以实施例配合对应的附图来说明本发明用于多频多模无线网络系统的前端模块内部的配置组件及其与信号接收与传输的关系。The configuration components inside the front-end module used in the multi-frequency multi-mode wireless network system of the present invention and their relationship with signal reception and transmission will be described below with reference to the corresponding drawings.
请参见图1,本发明第一实施例的用于多频多模无线网络系统的前端模块1内部至少具有一分集切换开关(diversity switch)11、两个双工器(diplexer)12a及12b、两个带通滤波器(band pass filter)13a及13b、两个低通滤波器(low pass filter)14a及14b、两个非平衡至平衡转换器(balun)15a及15b。带通滤波器的个数、低通滤波器的个数、非平衡至平衡转换器的个数均与一射频信号所能搭载的波段的个数相同。另外,前端模块1的前端连接有两个外部天线10a及10b,后端则有与无线网络系统连接的接收端RX11、RX12、RX21、RX22以及传输端TX1、TX2。Referring to Fig. 1, the front-
在本实施例中,分集切换开关11会在整个无线网络系统基于天线10a或天线10b的信号接收状况自动选择一信号接收状况最佳的天线后,将前端模块1内部的双工器12a或12b连接至一被选定的天线。In this embodiment, the
这些双工器12a及12b的内部至少具有一高通滤波器121a、121b及一低通滤波器122a、122b,作为波段分隔组件。换言之,双工器12a负责在无线网络系统接收射频信号时将所能搭载的无线波段f1~f2及f3~f4,例如是熟知的ISM(Industrial,Science,Medical)公用频带-2.4~2.5GHz及5.15~5.85GHz,进行分离使得搭载于不同无线波段的射频信号能够被区分开来。举例而言,双工器12a的低通滤波器122a只能让小于等于f2的频率通过,而双工器12a的高通滤波器121a只能让大于等于f3的频率通过。而双工器12b则负责在无线网络系统传送射频信号时让搭载于不同无线波段的射频信号能够分别被传送出去。These
此外,双工器12a后端连接有带通滤波器13a及13b,这些带通滤波器13a及13b在无线波段f1~f2及f3~f4被分开之后,分别负责将非无线波段f1~f2及f3~f4的信号滤除。带通滤波器13a及13b后端还一对一地连接有非平衡至平衡转换器15a及15b,通过这些非平衡至平衡转换器15a及15b可以将分别搭载于波段f1~f2及f3~f4的射频信号转换成两个相位差为180度的射频信号,并分别由无线网络系统的接收端RX11、RX12、RX21、RX22接收。In addition, band-
双工器12b后端则连接有低通滤波器14a及14b,低通滤波器14a及14b在无线网络系统通过接收端TX1及TX2将待传输射频信号送往前端模块1时,只让搭载于波段f1~f2以及f3~f4的射频信号通过,而将无线网络系统中所产生的不必要信号滤除。这些在无线网络系统中所产生的不必要信号包含有待传输信号在通过一功率放大器(power amplifier;PA)将信号放大后所产生的高频信号f11~f21、f31~f41以及一些噪声(noise)。接着,再通过双工器12b将搭载于波段f1~f2以及f3~f4的射频信号分别传输出去。The back end of the
请参见图2,本发明第二实施例中的用于多频多模无线网络系统的前端模块2至少具有一分集切换开关21、两个多任务器(multi-plexer)22a及22b、多个带通滤波器23a、23b、23c...、多个低通滤波器24a、24b、24c...、多个非平衡至平衡转换器25a、25b、25c...。带通滤波器的个数、低通滤波器的个数、非平衡至平衡转换器的个数均与一射频信号所能搭载的波段的个数相同。另外,前端模块2的前端连接有两个外部天线20a及20b,后端则有与无线网络系统连接的接收端RX11、RX12、RX21、RX22、RX31、RX32...以及传输端TX1、TX2、TX3...。Referring to Fig. 2, the front-
在本实施例中,分集切换开关21会在整个无线网络系统基于天线20a或天线20b的信号接收状况,自动选择一信号接收状况最佳的天线后,将前端模块2内部的多任务器22a或22b连接至一被选定的天线。In this embodiment, the
这些多任务器22a及22b内部至少具有一高通滤波器221a、221b及一低通滤波器222a、222b,有时可以还具有一带通滤波器(未显示),以作为波段分隔组件。换言之,多任务器22a负责在无线网络系统接收射频信号时将所能搭载的无线波段f1~f2、f3~f4、f5~f6...进行分离,使得搭载于不同无线波段的射频信号能够被区分开来,而多任务器22b则负责在无线网络系统传送射频信号时让搭载于不同无线波段f1~f2、f3~f4、f5~f6...的射频信号能够分别被传送出去。These
此外,多任务器22a后端连接有带通滤波器23a、23b、23c...,这些带通滤波器23a、23b、23c...在无线波段f1~f2、f3~f4、f5~f6...被分开之后,分别负责将不是无线波段f1~f2、f3~f4、f5~f6...所搭载的信号滤除。带通滤波器23a、23b、23c...后端还一对一地连接有非平衡至平衡转换器25a、25b、25c...,通过这些非平衡至平衡转换器25a、25b、25c...可以将分别搭载于波段f1~f2、f3~f4、f5~f6...的射频信号转换成两个相位差为180度的射频信号,并分别由无线网络系统的接收端RX11、RX12、RX21、RX22、RX31、RX32...接收。In addition,
多任务器22b后端则连接有低通滤波器24a、24b、24c...,这些低通滤波器24a、24b、24c...在无线网络系统通过接收端TX1、TX2、TX3...将待传输射频信号送往前端模块2时,只让搭载于波段f1~f2、f3~f4、f5~f6...的射频信号通过,而将无线网络系统中所产生的不必要信号滤除。这些在无线网络系统中所产生的不必要信号包含有待传输射频信号在通过一功率放大器将信号放大后所产生的高频信号f11~f21、f31~f41、f51~f61...以及一些噪声。接着,再通过多任务器22b将搭载于波段f1~f2、f3~f4、f5~f6...的射频信号分别传输出去。The back end of the
在上述各实施例中,分集切换开关11及21的内部分别包含有至少一砷化镓(GaAs)开关及其附属的被动组件(如:大电容值的电容器、以及电阻器),而双工器12a及12b、多任务器22a及22b、带通滤波器13a、13b、23a、23b、23c...、非平衡至平衡转换器15a、15b、25a、25b、25c...、低通滤波器14a、14b、24a、24b、24c...均包含有由电容器及电感器所构成的LC电路。In each of the above-mentioned embodiments, the diversity switches 11 and 21 respectively include at least one gallium arsenide (GaAs) switch and its associated passive components (such as capacitors with large capacitance and resistors), and the
请参见图3,本发明的用于多频多模无线网络系统的前端模块1及2均采用多层的低温共烧陶瓷(Low Temperature Cofired Ceramic;LTCC)基板31来制作成一集成电路模块3。在此,各层低温共烧陶瓷基板31主要是由许多陶瓷介电材料所构成且其中夹藏许多导电层。Please refer to FIG. 3 , the front-
详言之,由于本发明的用于多频多模无线网络系统的前端模块1及2的部分组件,包括双工器12a及12b、多任务器22a及22b、带通滤波器13a、13b、23a、23b、23c...、非平衡至平衡转换器15a、15b、25a、25b、25c...、低通滤波器14a、14b、24a、24b、24c...,是由电容器及电感器等被动组件所组成,因此发明人利用图案化的方式将这些电容器及电感器形成在各层低温共烧陶瓷基板31内部。此外,发明人将分集切换开关11及21的砷化镓(GaAs)开关及其附属被动组件(如:大电容值的电容器、以及电阻器)及其它如IC的半导体组件等主动组件以表面黏着技术(surface mounting technology;SMT)装设在集成电路模块3的最上层,亦即最上一层低温共烧陶瓷基板31的表层311。In detail, due to the partial components of the front-
如图4A所示,在制作过程上,上述电感器是以条状图案化的方式形成在各层低温共烧陶瓷基板31内部的导电层41上而成为条状电极,各导电层41之间具有电介质层(未显示),且导电层41之间是以金属导通孔(via hole)42连接,因此,电感器在多层低温共烧陶瓷基板31内部所呈现的连结型态为一螺旋型态。另一方面,如图4B所示,这些电容器是以块状图案化的方式形成在各层低温共烧陶瓷基板31内部的导电层51上而成为块状电极,各导电层51之间具有电介质层(未显示),且导电层51之间是以金属导通孔52连接,因此,电容器在多层低温共烧陶瓷基板31内部所呈现的连结型态为一重迭型态。As shown in FIG. 4A , in the manufacturing process, the above-mentioned inductors are formed on the
另外,在低温共烧陶瓷基板表层311下方各层低温共烧陶瓷基板31内部的LC电路是通过上述各导电层之间的金属导通孔42及52与低温共烧陶瓷基板表层311上分集切换开关11及21的砷化镓(GaAs)开关及其附属被动组件及IC等主动组件电连接。In addition, the LC circuit inside the low-temperature co-fired
本发明的用于多频多模无线网络系统的前端模块1及2的部分组件在以图案化的方式埋入多层陶瓷基板中而集成电路化后,可有效地缩小这些组件所占据的体积,因此除了满足多频多模的需求外,亦能够同时满足无线网络系统的模块化且微型化的需求。Part of the components of the front-
综上,本发明已通过上述的实施例及变化例来详加描述。然而,本领域技术人员应当了解的是,本发明的所有的实施例在此仅为示例性而非为限制性,也就是,在不脱离本发明实质精神及范围之内,上述的用于多频多模无线网络系统的前端模块的其它变化例及修正例均被本发明所涵盖。因此,本发明由后附的权利要求加以界定。To sum up, the present invention has been described in detail through the above-mentioned embodiments and variations. However, it should be understood by those skilled in the art that all the embodiments of the present invention are merely illustrative rather than restrictive. Other variations and modifications of the front-end module of the frequency multi-mode wireless network system are covered by the present invention. Accordingly, the invention is defined by the appended claims.
Claims (11)
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| CN 200410001304 CN1642028A (en) | 2004-01-06 | 2004-01-06 | Front-end module for multi-frequency multi-mode wireless network system |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101198160B (en) * | 2007-05-25 | 2010-08-04 | 北京大学 | Method and device for realizing GNSS multi-mode parallel reception by using single-channel radio frequency front-end |
| CN101641989B (en) * | 2007-03-21 | 2013-01-09 | 高通股份有限公司 | Methods and apparatus for RF channel switching in a multi-frequency network |
| TWI642961B (en) * | 2018-02-13 | 2018-12-01 | 瑞昱半導體股份有限公司 | Satellite signal receiving circuit and satellite signal receiving method |
| CN109560833A (en) * | 2019-01-28 | 2019-04-02 | 惠州Tcl移动通信有限公司 | A kind of descending carrier polymerization radio circuit, antenna assembly and electronic equipment |
-
2004
- 2004-01-06 CN CN 200410001304 patent/CN1642028A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101641989B (en) * | 2007-03-21 | 2013-01-09 | 高通股份有限公司 | Methods and apparatus for RF channel switching in a multi-frequency network |
| CN101198160B (en) * | 2007-05-25 | 2010-08-04 | 北京大学 | Method and device for realizing GNSS multi-mode parallel reception by using single-channel radio frequency front-end |
| TWI642961B (en) * | 2018-02-13 | 2018-12-01 | 瑞昱半導體股份有限公司 | Satellite signal receiving circuit and satellite signal receiving method |
| CN109560833A (en) * | 2019-01-28 | 2019-04-02 | 惠州Tcl移动通信有限公司 | A kind of descending carrier polymerization radio circuit, antenna assembly and electronic equipment |
| WO2020155817A1 (en) * | 2019-01-28 | 2020-08-06 | 惠州Tcl移动通信有限公司 | Downlink carrier aggregation radio frequency circuit, antenna device, and electronic apparatus |
| CN109560833B (en) * | 2019-01-28 | 2022-01-11 | 惠州Tcl移动通信有限公司 | Downlink carrier aggregation radio frequency circuit, antenna device and electronic equipment |
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