CN1641476A - Cooling module - Google Patents

Abstract

The invention relates to a heat radiation module which is suitable for bearing a projector power supply circuit board and a projector starting circuit board and radiating heat of the projector power supply circuit board and the projector starting circuit board. The heat dissipation module comprises a frame body, a fan assembling groove, a fan and an elastic fastener, wherein the frame body is provided with an air inlet and an air outlet, the projector power supply circuit board and the projector starting circuit board are fixed in the frame body, and an air channel is formed between the air inlet and the air outlet. In addition, the fan assembling groove is connected to the air outlet of the frame body, and the matching of the elastic fastener and the fan assembling groove can quickly fix the fan in the fan assembling groove, so that the cost for assembling the heat dissipation module can be reduced.

Description

Cooling module

technical field

The present invention relates to a heat dissipation module, in particular to a heat dissipation module which uses an elastic fastener and a fan assembly groove to quickly fix the fan in the fan assembly groove.

Background technique

In modern society, projection displays have been widely used, whether in classrooms in schools or presentations in companies. In order to prevent the electronic components on the circuit board inside the projection display from overheating, resulting in temporary or permanent failure of the circuit board, it is necessary to provide a good heat dissipation design to ensure the normal operation of the internal components of the projection display. Taking the heat dissipation of the circuit board as an example, in order to effectively reduce the heat generated by the circuit board when the projection display is in operation, a heat dissipation fan is usually installed on one side of each of the plurality of circuit boards. In this way, the circuit boards are dissipated separately, so that the projection display can maintain normal operation.

Please refer to FIG. 1A , which is an exploded perspective view of a conventional heat dissipation module. The conventional heat dissipation module 101 is usually arranged on the casing (not shown) of a projection display (not shown), which mainly includes a fan 110 and a fan assembly groove 120, wherein the fan 110 There are a plurality of positioning holes 112, and the fan assembly groove 120 has a plurality of assembly holes 122, while the fan 110 and the fan assembly groove 120 are matched with the positioning holes 112 and the assembly holes 122 on the fan 110, and the fan 110 Locked in the fan assembly groove 120 .

Please refer to FIG. 1B , which is a conventional schematic diagram of using a fan to dissipate heat from a projector power circuit board and a projector startup circuit board. The heat dissipation modules 101 and 102 respectively dissipate heat from the projector power circuit board 10 and the projector startup circuit board 20 . As can be seen from FIG. 1B, the projector power supply circuit board 10 and the projector startup circuit board 20 are usually arranged on the casing (not shown in the figure) of the projection display (not shown in the figure), and the projector power supply circuit board 10 And the projector startup circuit board 20 is fixed on the casing of the projection display with a plurality of screws 4 and copper pillars (not shown in the figure) matched with the screw holes 12 and 22 thereon.

It is worth noting that in the prior art, the assembler must use a hand tool to lock the fan 110 in the fan assembly slot 120 with the screws 2, and during the locking process, the fan 110 may be disconnected from the fan assembly. The distorted deformation or cracking of the assembly groove 120 will cause defective products, and the assembly between the fan 110 and the fan assembly groove 120 will consume assembly man-hours, and the effect of preventing vibration of the assembled fan module 101 is poor, resulting in no noise. reduce.

In addition, the projector power supply circuit board 10 and the projector startup circuit board 20 must be equipped with cooling modules 101 and 102 for individual cooling, so as to achieve the desired cooling effect. Therefore, the manufacturer of the projection display must determine the number of fans according to the number of required circuit boards, so that the cost of the fans and the man-hours for assembling cannot be effectively reduced.

In addition, the assembler must use a hand tool to lock the projector power supply circuit board 10 and the projector startup circuit board 20 to the casing of the projection display with screws 50. During the locking process, the projector power supply circuit board 10 and the projector startup circuit board 20 are often damaged. The circuit board 10 and the projector starting circuit board 20 are distorted or cracked, resulting in defective products. In addition, the assembly between the projector power circuit board 10 and the projector starting circuit board 20 and the casing not only consumes man-hours of assembly, but also easily causes the risk of electric shock to the assembler.

It can be seen that the above-mentioned existing heat dissipation module still has many defects, and needs to be further improved urgently. In order to solve the problems of heat dissipation modules, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and general products do not have a suitable structure to solve the above problems, which is obvious. It is a problem that relevant industry players are eager to solve.

In view of the defects in the above-mentioned existing heat dissipation modules, the inventor actively researches and innovates based on years of rich practical experience and professional knowledge engaged in the design and manufacture of such products, in order to create a new type of heat dissipation module that can improve the existing heat dissipation modules. Some cooling modules make it more practical. Through continuous research, design, and after repeated trial samples and improvements, the present invention with practical value is finally created.

Contents of the invention

The purpose of the present invention is to overcome the defects existing in the existing heat dissipation module, and provide a heat dissipation module with a new structure. The technical problem to be solved is to make it have a fan assembly groove and an elastic fastener. The fan is arranged in the fan assembly slot without hand tools, which is more suitable for practical use and has industrial utilization value.

Another object of the present invention is to provide a heat dissipation module. The technical problem to be solved is to make it have a frame with multiple sets of channels or ribs, and the assembler can arrange multiple circuit boards without hand tools. In the frame, it is more suitable for practical use.

Another object of the present invention is to provide a heat dissipation module. The technical problem to be solved is to make it have a frame and only use a fan arranged at an air outlet of the frame to dispose the heat dissipation module in the frame. The proper heat dissipation of the circuit board is more suitable for practical use.

Another object of the present invention is to provide a heat dissipation module. The technical problem to be solved is to make it have an insulating material frame, which can prevent the assembler from getting an electric shock when assembling the heat dissipation module, so that it is more suitable for practical use.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. A heat dissipation module proposed according to the present invention is suitable for carrying a projector power supply circuit board and a projector startup circuit board, and dissipating heat from the projector power supply circuit board and the projector startup circuit board. It includes: a frame, which has an air inlet and an air outlet, wherein the projector power circuit board and the projector startup circuit board are fixed in the frame, and the air inlet and the air outlet are An air duct is formed; a fan assembly groove is connected to the air outlet of the frame body; a fan is arranged in the fan assembly groove; and an elastic fastener is used to fix the fan in the fan assembly groove.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the heat dissipation module mentioned above, the frame body includes a plurality of sets of slots, and the projector power circuit board and the projector startup circuit board are assembled in the frame through the sets of slots.

The aforementioned heat dissipation module, wherein the frame includes: a top plate; a bottom plate, located below the top plate; and two side plates, respectively connected between the top plate and the bottom plate, wherein the side plates have the Group slots.

In the heat dissipation module mentioned above, some of the sets of channels are distributed adjacent to the top plate, and some of the sets of channels are distributed adjacent to the bottom plate.

In the aforementioned heat dissipation module, the frame body further includes a hole, and the hole extends from the bottom plate to a partial area of the side plates.

In the heat dissipation module mentioned above, the top board, the bottom board and the side boards are integrally formed.

In the aforementioned heat dissipation module, the frame body includes multiple sets of ribs, and the projector power circuit board and the projector startup circuit board are assembled in the frame by the sets of ribs.

The aforementioned heat dissipation module, wherein the frame includes: a top plate; a bottom plate, located below the top plate; and two side plates, respectively connected between the top plate and the bottom plate, wherein the side plates have the Group of ribs.

In the heat dissipation module mentioned above, some of the groups of ribs are distributed adjacent to the top plate, and some of the groups of ribs are distributed adjacent to the bottom plate.

In the aforementioned heat dissipation module, the frame body further includes a hole, and the hole extends from the bottom plate to a partial area of the side plates.

In the heat dissipation module mentioned above, the top board, the bottom board and the side boards are integrally formed.

In the aforementioned heat dissipation module, the fan assembly groove has a plurality of protruding points.

In the aforementioned heat dissipation module, the elastic fastener has a plurality of openings, and the elastic fastener is arranged on the fan assembly slot through the matching of the openings and the protruding points.

The aforementioned heat dissipation module further includes a plurality of buffer pads disposed between the elastic fastener and the fan.

The aforementioned cooling module further includes a plurality of buffer pads disposed between the fan and the fan assembly groove.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. It can be known from the above technical solutions that, in order to achieve the aforementioned object of the invention, the present invention proposes a heat dissipation module, which is suitable for carrying a projector power circuit board and a projector startup circuit board, and dissipating heat on them. The cooling module includes a frame body, a fan assembly slot, a fan and an elastic fastener. The frame body has an air inlet and an air outlet, wherein the projector power circuit board and the projector start circuit board are fixed in the frame, and an air duct is formed between the air inlet and the air outlet. In addition, the fan assembly slot is connected to the air outlet of the frame, and the elastic fastener can fix the fan in the fan assembly slot, so that the fan can dissipate heat from the projector power circuit board and the projector startup circuit board at the same time outside the frame .

According to the heat dissipation module described in the preferred embodiment of the present invention, wherein the frame body includes multiple groups of grooves or multiple groups of ribs, and the projector power circuit board and the projector startup circuit board are formed by these groups of grooves or ribs. The rib-shaped body is assembled in the frame, and the frame body includes a top board, a bottom board and two side boards. The bottom plate is located below the top plate, and the two side plates are respectively connected between the top plate and the bottom plate, and the side plates have these groups of grooves or these groups of ribs. Some of the sets of channels or sets of ribs are located adjacent to the top plate, and some of the sets of channels or sets of ribs are located adjacent to the bottom plate.

According to the heat dissipation module described in the preferred embodiment of the present invention, the frame body further includes a hole, and the hole extends from the bottom plate to some areas of the side plates.

According to the heat dissipation module described in the preferred embodiment of the present invention, the top board, the bottom board and the side boards are integrally formed.

According to the heat dissipation module described in the preferred embodiment of the present invention, wherein the fan assembly groove has a plurality of protrusions, and the elastic fastener has a plurality of openings, and the elastic fastener is connected by these openings and these protrusions. Matched and arranged on the fan assembly slot.

The heat dissipation module according to a preferred embodiment of the present invention further includes a plurality of buffer pads disposed between the elastic fastener and the fan and between the fan and the fan assembly groove.

With the above technical solution, the cooling module of the present invention has at least the following advantages:

Because the present invention adopts a cooling module with a fan assembly slot and an elastic fastener, by matching the protruding points of the fan assembly slot with the openings of the elastic fastener, the assembler can dispose the fan on the fan without hand tools. Inside the fan assembly slot.

In addition, because the present invention arranges a plurality of buffer pads between the elastic fastener and the fan and between the fan and the fan assembly groove, it can reduce the vibration generated by the locked fan during operation, thereby reducing the vibration of the fan. Noise made during operation.

In addition, because the present invention adopts a heat dissipation module with a frame body with multiple groups of channels or ribs, the assembler can arrange a plurality of circuit boards in the frame without using hand tools, thus saving the cost of assembling circuit boards. time, thereby reducing the assembly cost, and avoiding electric shock to the assembler when assembling the cooling module.

Furthermore, the present invention can properly dissipate heat from the circuit board in the frame because only a fan is arranged at an air outlet of the frame, so it can save the cost of purchasing a fan and assembling the fan. Assembly costs to the projection display cabinet.

To sum up, the heat dissipation module with special structure of the present invention has the above-mentioned many advantages, and there is no similar structural design publicly published or used in similar products, so it is indeed innovative. Great improvement, great progress in technology, and produced easy-to-use and practical effects, so that it is more suitable for practical use, and has wide industrial application value. It is a novel, progressive and practical new design.

The above description is only an overview of the technical solutions of the present invention. In order to understand the technical means of the present invention more clearly and implement them according to the contents of the description, the preferred embodiments of the present invention and accompanying drawings are described in detail below.

Description of drawings

FIG. 1A is an exploded perspective view of a conventional heat dissipation module.

FIG. 1B is a schematic diagram of a known conventional method for dissipating heat from a projector power circuit board and a projector startup circuit board by a fan.

FIG. 2A is an exploded perspective view of a heat dissipation module according to the first embodiment of the present invention.

FIG. 2B is a schematic perspective view of a combined structure of a heat dissipation module according to the first embodiment of the present invention.

3A is an exploded perspective view of a heat dissipation module according to a second embodiment of the present invention.

FIG. 3B is a schematic perspective view of the assembled structure of a heat dissipation module according to the second embodiment of the present invention.

2, 4: Screws 10: Projector power circuit board

12, 22: Screw holes 20: Projector startup circuit board

101, 102: cooling module 110: fan

112: Positioning hole 120: Fan assembly slot

122: Assembly hole 201, 202: Heat dissipation module

210: frame body 212a: top plate

212b: bottom plate 212c, 212d: side plate

214a: Air inlet 214b: Air outlet

216a: channel 216b: rib

218: Broken hole 220: Fan assembly slot

222: Bump 230: Fan

240: elastic fastener 242: opening

250: cushion

Detailed ways

The specific implementation, structure, features and functions of the heat dissipation module according to the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

first embodiment

FIG. 2A is an exploded perspective view of a heat dissipation module according to the first embodiment of the present invention, and FIG. 2B is an assembled perspective view of a heat dissipation module according to the first embodiment of the present invention. 2A and 2B, the heat dissipation module 201 of the first embodiment of the present invention can be used to carry a projector power circuit board (power board) 10 and a projector startup circuit board (ballast board) 20, and The projector power circuit board (power board) 10 and the projector startup circuit board (ballast board) 20 are radiated.

The cooling module 201 includes a frame body 210, a fan assembly slot 220, a fan 230, an elastic fastener 240 and a plurality of buffer pads 250, wherein the frame body 210 includes a top plate 212a, a bottom plate 212b, and two side plates 212c , 212d. The bottom plate 212b is located below the top plate 212a, and the two side plates 212c, 212d are respectively connected between the top plate 212a and the bottom plate 212b, wherein the top plate 212a, the bottom plate 212b and the side plates 212c, 212d are integrally formed, which together form an The air outlet 214a and an air outlet 214b corresponding to the air inlet 214a allow outside air to be guided to the air outlet 214b through the air inlet 214a, so the frame body 210 has an effect of guiding airflow.

The inner walls of the side plates 212c and 212d of the frame body 210 have multiple groups of channels 216a, wherein part of the channels 216a are distributed adjacent to the top plate 212a, and part of the channels 215a are distributed adjacent to the bottom plate 212b, so that the assembler can pass through the channels. The projector power supply circuit board 10 and the projector startup circuit board 20 are assembled in the frame body 210 through the passage 216a without any hand tools.

The fan assembly groove 220 is integrally connected to the air outlet 214b of the frame body 210, and the fan assembly groove 220 has a plurality of convex points 222, and the elastic fastener 240 has a plurality of openings 242, and a plurality of buffer pads 250 are arranged Between the elastic fastener 240 and the fan 230 and between the fan 230 and the fan assembly groove 220, the elastic fastener 240 fixes the fan 230 on the fan assembly groove 220 through the matching of its opening 242 and these protrusions 222 .

That is to say, the fan 230 is located at the air outlet 214b of the frame body 210. Under the operation of the fan 230, the outside air can enter the frame body 210 through the air inlet 214a of the frame body 210, and the projector power supply circuit board 10 and the heat generated by the projector startup circuit board 20 during operation, the heat is discharged to the outside through the air outlet 214b of the frame body 210 in the form of heat convection, so that the projector power supply circuit board 10 and the projector startup circuit board 20 able to maintain normal operation.

The frame body 210 further includes a hole 218 extending from the bottom plate 212b to a partial area of the side plate 212d. The perforated hole 218 can increase the stress tolerance of the frame body 210 . In other words, the perforated hole 218 can buffer part of the stress of the frame body 210 to reduce the cracking of the frame body 210 at its stress concentration.

The material of the frame body 210 is, for example, a plastic insulating material. Therefore, the heat dissipation module 201 of the first embodiment can fully utilize the characteristics of plastic injection molding, mold processing and manufacturing technologies to increase the manufacturing speed of the frame body 210 .

The material of the elastic fastener 240 is, for example, stainless metal with good elasticity, and the material of the buffer pad 250 is, for example, a material with good elasticity. Therefore, the heat dissipation module 201 can make full use of the above-mentioned material properties to reduce the speed of the fan 230 running at high speed. The noise produced by the vibration.

In addition, the shape of the frame body 210 is not limited to the above-mentioned hollow rectangular tube, and can also be a hollow circular tube (not shown in the figure), which includes a hole (not shown in the figure) in the hollow circular tube. The side of the tube body, wherein one end of the hollow tube body can be a rectangle (not shown in the figure), which can be connected to the fan assembly groove 220 and the fan 230 can be arranged in the fan assembly groove 220 .

second embodiment

FIG. 3A is an exploded perspective view of a heat dissipation module according to the second embodiment of the present invention, and FIG. 3B is a perspective view of an assembled structure of a heat dissipation module according to the second embodiment of the present invention. Please refer to Fig. 3A and Fig. 3B, compared with the first embodiment, the inner wall of the frame body 210 of the heat dissipation module 202 of the second embodiment of the present invention has multiple groups of ribs 216b, and the rest of the heat dissipation module 202 The components and their relative positions are the same as those of the heat dissipation module 201 of the first embodiment. In other words, the heat dissipation module 202 of the second embodiment of the present invention mainly changes the channel 216a of the frame body 210 of the heat dissipation module 201 of the first embodiment into ribs 216b, in order to achieve the same effect as that of the first embodiment .

Anyone who is familiar with this technology can also know that since the size of each circuit board is not the same, the assembler can arrange it in the groove 216a or the rib 216b of the frame body 210 according to the size of each circuit board. Therefore, the arrangement of each circuit board in the frame body 210 is not only parallel to the top plate 212a or the bottom plate 212b, but also can be arranged in the frame body 210 at an angle with the top plate 212a or the bottom plate 212b. In other words, as long as each circuit board can be arranged in the frame body 210 , any arrangement thereof and any included angle of the top board 212 a or the bottom board 212 b are possible. In addition, as long as the frame body 210 is a hollow body, the shape of the hollow body is not limited.

In summary, the heat dissipation module of the present invention has the following structural features and advantages:

(1), the heat dissipation module of the present invention has a fan assembly groove and an elastic fastener. By matching the convex points of the fan assembly groove with the openings of the elastic fastener, the assembler can do it without hand tools. The fan is arranged in the fan assembly groove, so the assembler's time for assembling the fan in the fan assembly groove can be saved, thereby reducing the assembly cost.

(2) Since the elastic fastener of the heat dissipation module of the present invention is, for example, a stainless metal with good elasticity, and the material of the cushion pad is, for example, a material with good elasticity, the heat dissipation module of the present invention can make full use of the above-mentioned material characteristics, In order to reduce the vibration generated by the fan at high speed, and reduce the noise it emits.

(3), the heat dissipation module of the present invention has a frame body with multiple sets of channels or ribs, so that the assembler can arrange a plurality of circuit boards in the frame without using any hand tools, so that the assembler can be saved. The time for assembling the circuit board can further reduce the assembly cost and prevent the assembler from getting an electric shock when assembling the heat dissipation module, thus protecting the safety of the assembler when assembling the heat dissipation module.

(4), the present invention only uses a fan to be arranged at an air outlet of the frame body, and the circuit board in the frame body can be properly dissipated heat, so it can save the material cost of manufacturing the heat dissipation module, and the fan can be assembled to the projection display Assembly costs on the chassis.

(5) The present invention uses a heat dissipation module with a frame made of insulating material such as plastic, and the frame further includes a hole, which can increase the stress tolerance of the frame. Therefore, the manufacturing speed of the frame of the heat dissipation module and the yield of injection molding can be improved by utilizing the characteristics of plastic injection molding, mold processing and manufacturing technologies.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes. Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solution of the present invention.

Claims (15)

1, a kind of heat radiation module is suitable for carrying projector's power supply circuit board and projector's start-up circuit plate, and this projector's power supply circuit board and this projector's start-up circuit plate are dispelled the heat, and it is characterized in that this heat radiation module comprises:

One framework, this framework have an air intake vent and an air outlet, and wherein this projector's power supply circuit board and this projector's start-up circuit plate are to be fixed in this framework, and are to form an air channel between this air intake vent and this air outlet;

One fan assembling grove is connected in this air outlet place of this framework;

One fan is disposed in this fan assembling grove; And

One spring secures rail to sleeper is fixed in this fan in this fan assembling grove.

2, heat radiation module according to claim 1 it is characterized in that wherein said framework comprises most group conduits, and this projector's power supply circuit board and this projector's start-up circuit plate is to be assembled in this framework by those group conduits.

3, heat radiation module according to claim 2 is characterized in that wherein said framework comprises:

One top board;

One base plate is positioned at this top board below; And

Two side plates are connected between this top board and this base plate, wherein have those group conduits on those side plates.

4, heat radiation module according to claim 3 it is characterized in that wherein those group conduits of part are to be adjacent to this top board to distribute, and those group conduits of part is to be adjacent to this backplane.

5, heat radiation module according to claim 3 is characterized in that wherein said framework more comprises a holes, and this holes is the subregion that is extended to those side plates by this base plate.

6, heat radiation module according to claim 3 is characterized in that wherein said top board, base plate and those side plates are integrally formed.

7, heat radiation module according to claim 1 it is characterized in that wherein said framework comprises most group ribs, and this projector's power supply circuit board and this projector's start-up circuit plate is to be assembled in this framework by those group ribs.

8, heat radiation module according to claim 7 is characterized in that wherein said framework comprises:

One top board;

One base plate is positioned at this top board below; And

Two side plates are connected between this top board and this base plate, wherein have those group ribs on those side plates.

9, heat radiation module according to claim 8 it is characterized in that wherein those group ribs of part are to be adjacent to this top board to distribute, and those group ribs of part is to be adjacent to this backplane.

10, heat radiation module according to claim 8 is characterized in that wherein said framework more comprises a holes, and this holes is the subregion that is extended to those side plates by this base plate.

11, heat radiation module according to claim 8 is characterized in that wherein said top board, base plate and those side plates are one-body molded.

12, heat radiation module according to claim 1 is characterized in that wherein said fan assembling grove has most salient points.

13, heat radiation module according to claim 12 is characterized in that wherein said spring secures rail to sleeper has most perforates, and this spring secures rail to sleeper is the collocation by those perforates and those salient points, and is equipped on this fan assembling grove.

14, heat radiation module according to claim 1 is characterized in that it more comprises most cushion pads, is disposed between this spring secures rail to sleeper and this fan.

15, heat radiation module according to claim 1 is characterized in that it more comprises most cushion pads, is disposed between this fan and this fan assembling grove.

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