CN1503369A - Miniature packaged image capturing chip module - Google Patents

Abstract

A miniature packaged image capturing chip module mainly comprises a chip arranged on a printed circuit board, wherein the chip is communicated with a circuit on the printed circuit board by a lead; the transparent packaging layer integrally packages the chip and the lead on the printed circuit board, so that the chip and the lead are prevented from being oxidized due to moisture in the air; and the focusing lens is convexly arranged on the top surface of the packaging layer and directly corresponds to the chip so as to focus the light on the chip. By means of the structure, the light path through which the light rays are refracted to the front of the chip can be shortened, and the size of the digital photographic device is further reduced.

Description

Miniaturized package image capture chip module

technical field

The invention relates to a digital image device, in particular to a miniaturized packaged image capture chip module capable of shortening the optical path, reducing the volume of the lens group and eliminating chromatic aberration.

Background technique

At present, digital imaging technology has been widely used in devices for shooting images, such as digital cameras, digital video cameras, and image scanners. As shown in Figure 6, it is an image lens group of an existing digital camera. Mainly, an image capture unit 61 (CMOSSensor) is arranged on a circuit board 6, the image capture unit 61 has a chip 62, and a lens mount 7 is arranged above the image capture unit 61, and the lens mount 7 is provided with There is a focusing lens 71 so that the image to be captured can be focused and developed on the chip 62 of the image capture unit 61 .

Because the chip 62 of the image capture unit 61 transmits the light reflected by the image through the lens group to the digital signal processor (DSP), and then converts the analog signal into a digital signal, which is automatically carried out by the microprocessor. Color restoration actions such as focusing, automatic exposure and white balance. However, the chip 62 of the image capture unit 61 is more sensitive to the acceptance of infrared rays, red light and other light rays, and in order to make the color of the image more realistic and avoid the chromatic aberration of the image, the lens organization focusing lens 71 and image capture A filter lens 72 is arranged between the units 61 . The filter lens 72 is coated with a color filter layer 73 on a glass sheet, for filtering dark blue, red, yellow, green (auxiliary color filter) and red, green, blue (primary color filter) contrast, in order to adjust the picture taken , to make the shooting effect better.

However, the filter lens 72 will prolong the optical path, so that the overall volume of the lens group cannot be reduced. As shown in FIG. on the image sensing area 621 of the chip 62, so that the length of the lens group will be lengthened, so it cannot meet the market trend of light, thin and short products.

Also as shown in FIG. 8, since the chip 62 of the image capture unit 61 is made of metal, and the lead frame connecting the chip 62 is also made of metal, oxidation will occur, although most image capture units are packaged. , but the moisture in the air will still cause the chip, wires and lead frame of the image capture unit to oxidize, thereby disturbing the image quality.

Contents of the invention

In order to overcome the shortcomings of existing image capture chips that are oxidized and thus affect image quality, the present invention provides a miniaturized package image capture chip module, which mainly packages the chip and wires directly on the main board or lead frame. In order to avoid the oxidation of the chip and wires, an achromatic prism is directly buried in the packaging process to eliminate the dispersion of white light caused by the refraction of the lens and improve the quality of the image.

The technical solution adopted by the present invention to solve its technical problems is:

A miniaturized packaged image capture chip module, characterized in that it includes: a chip connected to a circuit on a printed circuit board through a wire; a transparent packaging layer that encapsulates the chip and the wire on the printed circuit board to avoid Chips and wires are oxidized due to moisture in the air; a focusing lens is protruded on the top surface of the packaging layer and directly corresponds to the chip, so as to focus the light on the chip.

In the foregoing miniaturized package image capture chip module, the focusing lens is fixed on the top surface of the package layer.

In the foregoing miniaturized packaged image capture chip module, the focusing lens is integrally extended upward from the top surface of the packaged layer.

In the aforementioned miniaturized packaged image capture chip module, an achromatic prism is embedded in the transparent packaging layer. The achromatic prism is located between the chip and the focusing lens, and directly corresponds to the chip and the focusing lens.

In the aforementioned miniaturized packaged image capture chip module, a casing is placed outside the transparent packaging layer, and the casing can prevent unnecessary light from being refracted onto the chip.

In the foregoing miniaturized packaged image capture chip module, a frame body surrounds the transparent package layer, and the hollow body can limit the shape of the package layer when the package layer is injection molded.

The beneficial effects of the present invention are that the chip and the wire are directly packaged on the main board or the lead frame to avoid oxidation of the chip and the wire, and at the same time, an achromatic prism is directly embedded in the packaging process to eliminate white light. The dispersion difference caused by the refraction phenomenon of the lens improves the image quality.

Description of drawings

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

Fig. 1 is a front sectional view of the present invention.

Fig. 2 is a front sectional view of an embodiment of the present invention.

Fig. 3 is a front sectional view of another embodiment of the present invention.

Fig. 4 is a front sectional view of another embodiment of the present invention.

Fig. 5 is a front sectional view of yet another embodiment of the present invention.

FIG. 6 is a front sectional view of a conventional image capture chip module.

FIG. 7 is an optical path diagram of a conventional image capture chip module.

FIG. 8 is a top view of a conventional image capture chip module chip.

Detailed ways

As shown in Figure 1, the present invention can be fixed on a printed circuit board 100 directly or through a fixing seat (not shown in the figure), and includes a chip 10, and this chip 10 is connected with the printed circuit board by means of a plurality of wires 12. The circuit on 100 is connected, because the chip 10 is a small and thin electronic part, so in order to facilitate installation, the chip 10 is usually fixed on a connection seat 12 in advance, and then the connection seat 12 and the chip 10 are fixed on the printed circuit board. On the circuit board 100; a transparent packaging layer 20 completely encapsulates the chip 10 and the wire 11 on the printed circuit board 100 by injection molding, so as to prevent the chip 10 and the wire 11 from being oxidized due to the influence of moisture in the air. The lens 21 is protruded on the top surface of the encapsulation layer 20 and is in line with the chip 10 to focus light on the chip 10 . In this embodiment, the focusing lens 21 is integrally formed on the encapsulation layer 20 .

Of course, there are still many examples of the invention in which only the details vary. Please refer to FIG. 2, wherein the focusing lens 22 is fixed on the top surface of the encapsulation layer 20, so the focusing lens 22 can be made of different materials according to the needs of shooting images, such as a glass lens coated with a color filter layer. .

As shown in Figure 3, the present invention also includes an achromatic prism 13 embedded in the encapsulation layer 20, the achromatic prism 13 is located between the focusing lens 21 and the chip 10, and is in line with the chip 10 and the focusing lens 21 respectively Correspondingly, the achromatic prism 13 is mainly used to eliminate the phenomenon of dispersion of white light caused by the refraction of the lens, so as to improve the image quality.

Please also refer to FIG. 4 , the present invention also includes a casing 14 , which is sheathed outside the encapsulation layer 20 to prevent unnecessary light from being refracted onto the chip 10 and affecting image quality.

As shown in Figure 5, the present invention also includes a frame body 15 sleeved around the encapsulation layer 20. Before the encapsulation layer 20 is molded, the frame body 15 is preset on the printed circuit board 100 or the fixing base. When the encapsulation layer When 20 is injection molded, the frame body can limit the shape of the encapsulation layer 20 to facilitate the operation of installing the cover 14 .

To sum up, due to the special packaging technology of the present invention, the focusing lens can be molded or directly fixed on the packaging layer at the same time, so the purpose of reducing the size can be achieved, so that the digital photography device can be marketed with the smallest volume, fully satisfying the needs of consumers. In addition, the achromatic prism embedded in the packaging layer during the packaging process can eliminate the dispersion difference of white light caused by the refraction of the lens. Therefore, the application of the digital photography device of the present invention can obtain more Excellent photographic quality.

Claims (6)

1. A miniaturized package image capture chip module, characterized in that it comprises: A chip, which communicates with the circuit on the printed circuit board by wires; A transparent packaging layer, which encapsulates the chip and wires on the printed circuit board as a whole, to avoid oxidation of chips and wires due to moisture in the air; A focusing lens is protruded on the top surface of the encapsulation layer and directly corresponds to the chip, so as to focus the light on the chip. 2 . The miniaturized packaged image capture chip module according to claim 1 , wherein the focusing lens is fixed on the top surface of the packaging layer. 3 . 3 . The miniaturized package image capture chip module according to claim 1 , wherein the focusing lens is integrally extended upward from the top surface of the package layer. 4 . 4. The miniaturized package image capture chip module according to claim 2 or 3, characterized in that said achromatic prism is embedded in the transparent packaging layer, the achromatic prism is located between the chip and the focusing lens, and It directly corresponds to the chip and the focusing lens. 5 . The miniaturized packaged image capture chip module according to claim 4 , wherein a cover is placed outside the transparent packaging layer, and the cover can prevent unnecessary light from being refracted onto the chip. 6 . 6. The miniaturized package image capture chip module according to claim 4, wherein a frame surrounds the transparent package layer, and the hollow body can limit the shape of the package layer when the package layer is injection molded.

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