CN1542962A - Electrostatic discharge protection mechanism and liquid crystal display panel using the same - Google Patents
Electrostatic discharge protection mechanism and liquid crystal display panel using the same Download PDFInfo
- Publication number
- CN1542962A CN1542962A CNA2003101138129A CN200310113812A CN1542962A CN 1542962 A CN1542962 A CN 1542962A CN A2003101138129 A CNA2003101138129 A CN A2003101138129A CN 200310113812 A CN200310113812 A CN 200310113812A CN 1542962 A CN1542962 A CN 1542962A
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- CN
- China
- Prior art keywords
- electrostatic discharge
- protective equipment
- discharge protective
- solder joint
- channel width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Semiconductor Integrated Circuits (AREA)
- Liquid Crystal (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
An electrostatic discharge protection mechanism is characterized in that an electrostatic discharge protection device arranged corresponding to a signal line fanned out from the outermost side of an integrated circuit is designed to have smaller impedance relative to other signals or have longer equivalent channel width relative to other signals, so that electrostatic charges can be discharged more effectively.
Description
Technical field
The present invention is relevant for a kind of electrostatic discharge (ESD) protection, particularly relevant for a kind of electrostatic discharge (ESD) protection mechanism that is applied to electronic installation.
Background technology
LCD panel (liquid crystal display panel; Be designated hereinafter simply as the LCD plate), mainly include an array of display (or claiming pel array, pixel array), cooperate integrated circuit (for example data driver and scanner driver), to carry out the function of show image in order to drive above-mentioned array of display.
Fig. 1 represents the signal line structure figure of LCD plate.As shown in Figure 1, on the LCD plate, have a plurality of bonding pads 10, each bonding pad 10 has a plurality of solder joint P
1-P
nBe provided with in regular turn, in order to the integrated circuit that drives this array of display to be installed; And, many fan-out lines (fan-out line) F
1-F
n, by each above-mentioned solder joint (P
1-P
n) extend.By above-mentioned fan-out line F
1-F
n, said integrated circuit is provided drive signal, and for example sweep signal or data-signal are to array of display 12; Also or from outside received signal give integrated circuit.
Because thin-film transistor (thin film transistor; TFT) manufacture process of LCD plate can be passed through many equipment and personnel operation, when equipment or personnel have serious static discharge to plate, can cause holding wire to open circuit (open) or short circuit (short), make acceptance rate reduce or cause the damage of intraware, the defective that makes the LCD plate bright line or concealed wire occur produces.Therefore on the LCD plate, must design ESD protection circuit, to avoid static discharge (electro-static discharge; ESD) destroy the LCD plate.
Please refer to Fig. 1 again, the LCD industry is at the protection of ESD, how corresponding to above-mentioned many fan-out line (F at present
1-F
n) and set up a plurality of electrostatic protection device (ES
1-ES
n).Common each electrostatic protection device (ES
1-ES
n) all have substantially an impedance that equates; When the LCD plate suffers esd event, in the holding wire of single IC for both institute fan-out, be disposed at this bonding pad 10 outermosts, one signal line (that is P
1And P
n) electrostatic protection device ES
1And ES
n(corresponding to the integrated circuit outermost) has the longest path, and therefore the most difficult dispersion electrostatic charge will make the protection effect of static discharge have a greatly reduced quality thus.
Summary of the invention
In view of this; a purpose of the present invention is a kind of electrostatic discharge (ESD) protection of proposition mechanism; be applicable to electronic installation (for example LCD plate); with individual integrated circuits from the holding wire of its outermost fan-out the corresponding electrostatic discharge protective equipment that is provided with; be designed to have less impedance with respect to other; or have long equivalent channel width with respect to other, so that electrostatic charge can more effectively discharge.
Another object of the present invention is a kind of electrostatic discharge (ESD) protection of proposition mechanism; be applicable to electronic installation (for example LCD plate); the pairing electrostatic discharge protective equipment of fan-out holding wire with individual integrated circuits; be designed to have minimum impedance (or the longest equivalent channel width) with respect to said integrated circuit outermost person; and more near its impedance of integrated circuit central authorities person also with increase progressively (or its equivalent channel width with successively decrease) so that electrostatic charge can more effectively discharge.
A further object of the present invention is a kind of electrostatic discharge (ESD) protection of proposition mechanism; be applicable to electronic installation (for example LCD plate); the pairing arbitrary electrostatic discharge protective equipment of holding wire with same integrated circuit institute fan-out; electrostatic charge is designed to have different impedances (or equivalent channel width), so that can more effectively discharge with other electrostatic discharge protective equipment.
A further object of the present invention is used the above-mentioned electrostatic discharge (ESD) protection mechanism that proposes for proposing a kind of LCD panel, avoids suffering that to guarantee the LCD plate ESD destroys.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail as follows.In the following accompanying drawing, have identical, similar with previous accompanying drawing or corresponding person all uses identical symbol or numeral to represent.
Fig. 1 represents the signal line structure figure of LCD plate.
One example of the electrostatic discharge protective equipment that is constituted by two polar circuits that Fig. 2 represents.
Fig. 3 represents the possible circuit arrangement map (layout) of diode circuit shown in Figure 2.
Fig. 4 represents that electrostatic discharge (ESD) protection of the present invention mechanism is applied in the embodiment on the electronic installation.
Fig. 5 represents that electrostatic discharge (ESD) protection of the present invention mechanism is applied in another embodiment on the electronic installation.
Symbol description:
The 10-bonding pad; P
1-P
n-solder joint; F
1-F
n-fan-out line;
The 12-array of display; ES
1-ES
n-electrostatic protection device;
D
1-D
6-diode; CH
1-CH
2-channel width.
Embodiment
Diode circuit is the most normal to be applied in the electronic installation, with as electrostatic discharge protective equipment.The electrostatic discharge protective equipment ES that represents as Fig. 2
1, by 6 diode D
1-D
6Constitute the fan-out line F of corresponding diagram 1
1And dispose.Generally speaking at solder joint P
1Two ends all are provided with electrostatic discharge protective equipment ES
1, Fig. 2 only shows one of them.
Static discharge device ES
1In diode circuit (D
1-D
6) use the assembly with mos transistor structure to finish the MOS transistor of for example using drain and gate to be connected mostly.Fig. 3 represents diode circuit (D shown in Figure 2
1-D
6) possible circuit arrangement map (layout).As shown in Figure 3, diode D
1-D
3Has identical channel width CH
1, diode D
4-D
6Then has identical channel width CH in addition
2Therefore, static discharge device ES
1Equiva lent impedance, promptly depend on the channel width CH of diode circuit
1And CH
2, that is channel width CH
1And CH
2The equivalent channel width that is constituted is longer, then static discharge device ES
1Equiva lent impedance lower.
Embodiment one:
Fig. 4 represents that electrostatic discharge (ESD) protection of the present invention mechanism is applied in the embodiment on the electronic installation; Above-mentioned in this embodiment electronic installation is the LCD plate.
LCD panel shown in Figure 4 comprises: an array of display 12; A plurality of bonding pads 10, each bonding pad have a plurality of solder joint (P
1-P
n) be provided with in regular turn, in order to the integrated circuit that drives this array of display to be installed; Many fan-out line (F
1-F
n), by above-mentioned solder joint (P
1-P
n) extend; And, a plurality of electrostatic protection device (ES
1-ES
n), to should fan-out line (F
1-F
n) and be provided with; Wherein, solder joint P
1And P
nBe positioned at the side (or ragged edge) of bonding pad 10.In addition, above-mentioned electrostatic discharge protective equipment is made of at least one assembly with mos transistor structure, for example the MOS transistor that is connected with drain electrode by grid.
With reference to aforementioned explanation about equiva lent impedance and equivalent channel width, of the present invention focusing on above-mentioned electrostatic discharge protective equipment ES
1And ES
nEquiva lent impedance be designed to be lower than other electrostatic discharge protective equipment (ES
2-ES
N-1) impedance.That is to say, with electrostatic discharge protective equipment ES
1And ES
nEquivalent channel width L
1Be designed to greater than other electrostatic discharge protective equipment (ES
2-ES
N-1) equivalent channel width L
2, as shown in Figure 4.
By the design of embodiment one, because electrostatic discharge protective equipment ES
1And ES
nEquiva lent impedance lower (that is equivalent channel width is longer), at the longest fan-out holding wire that be difficult for to divide electric charge (as F
1And F
n) on occurred electrostatic charges accumulated, can more effectively pass through electrostatic discharge protective equipment ES
1And ES
nDisperse, avoid the LCD plate to suffer the destruction of static discharge.
Embodiment two:
Fig. 5 represents that electrostatic discharge (ESD) protection of the present invention mechanism is applied in another embodiment on the electronic installation; Above-mentioned in this embodiment electronic installation is the LCD plate.
LCD panel shown in Figure 5 comprises: an array of display 12; A plurality of bonding pads 10, each bonding pad have a plurality of solder joint (P
1-P
n) be provided with in regular turn, in order to the integrated circuit that drives this array of display to be installed; Many fan-out line (F
1-F
n), by above-mentioned solder joint (P
1-P
n) extend; And, a plurality of electrostatic protection device (ES
1-ES
n), to should fan-out line (F
1-F
n) and be provided with; Wherein, solder joint P
1And P
nBe positioned at the side (or ragged edge) of bonding pad 10.In addition, above-mentioned electrostatic discharge protective equipment is made of at least one assembly with mos transistor structure, for example the MOS transistor that is connected with drain electrode by grid.
In like manner, with reference to aforementioned explanation about equiva lent impedance and equivalent channel width, present embodiment focus on the middle fan-out line F in arbitrary bonding pad 10 (a corresponding integrated circuit)
1-F
nPairing electrostatic discharge protective equipment ES
1-ES
n, its equiva lent impedance is by bonding pad 10 outermost electrostatic discharge protective equipment (P
1And P
n) toward the electrostatic discharge protective equipment of bonding pad 10 central authorities (P for example
j, 1＜j＜n) increase progressively gradually.That is to say, with electrostatic discharge protective equipment ES
1-ES
jEquivalent channel width be designed to successively decrease in regular turn and this electrostatic discharge protective equipment ES
J+1-ES
nEquivalent channel width then increase progressively in regular turn, as shown in Figure 5.
Design by embodiment two; the characteristic of successively decreasing by the lateral central authorities of bonding pad 10 according to the width of fan-out holding wire; and design makes the corresponding electrostatic discharge protective equipment equiva lent impedance that disposes of institute be increased progressively by lateral, bonding pad central authorities; that is equivalent channel width is successively decreased by lateral, bonding pad central authorities; can more effectively disperse electrostatic charge by this, avoid the LCD plate to suffer the destruction of static discharge by electrostatic discharge protective equipment.
Embodiment three:
Electrostatic discharge (ESD) protection of the present invention mechanism is applied in the embodiment again (not shown) on the electronic installation, mainly with this electrostatic discharge protective equipment (ES
1-ES
n) in, arbitrary electrostatic discharge protective equipment ES
k(1≤k≤n) its equiva lent impedance is designed to different with the equiva lent impedance of other electrostatic discharge protective equipment.Wherein, each above-mentioned electrostatic discharge protective equipment constitutes by at least one assembly with mos transistor structure; Therefore, also can be with this electrostatic discharge protective equipment ES
kIt is different with the equivalent channel width of other electrostatic discharge protective equipment that its equivalent channel width is designed to.
In sum, though the present invention with preferred embodiment openly as above, right its is not in order to limit the present invention, any those skilled in the art, under the situation that does not break away from the spirit and scope of the present invention, can carry out various changes and modification, therefore scope of the present invention is as the criterion with the claim restricted portion that is proposed.
Claims (11)
1. an electrostatic discharge (ESD) protection mechanism is applicable to an electronic installation, and this electronic installation has at least one bonding pad, has a plurality of solder joint (P
1-P
n) be provided with in regular turn, in order to integrated circuit, this solder joint P to be installed
1And P
nBe positioned at the side of bonding pad, and by this solder joint (P
1-P
n) extend many fan-out line (F are arranged
1-F
n); This electrostatic discharge (ESD) protection mechanism comprises:
A plurality of electrostatic discharge protective equipment (ES
1-ES
n), to should fan-out line (F
1-F
n) and be provided with;
Wherein, this electrostatic discharge protective equipment ES
1And ES
nEquiva lent impedance be lower than other electrostatic discharge protective equipment (ES
2-ES
N-1).
2. electrostatic discharge (ESD) protection as claimed in claim 1 mechanism, wherein, this electrostatic discharge protective equipment is made of at least one assembly with mos transistor structure, and electrostatic discharge protective equipment ES
1And ES
nEquivalent channel width greater than other electrostatic discharge protective equipment (ES
2-ES
N-1).
3. an electrostatic discharge (ESD) protection mechanism is applicable to an electronic installation, and this electronic installation has at least one bonding pad, has a plurality of solder joint (P
1-P
n) be provided with in regular turn, in order to integrated circuit, this solder joint P to be installed
1And P
nBe positioned at the side of bonding pad, and by this solder joint (P
1-P
n) extend many fan-out line (F
1-F
n); This electrostatic discharge (ESD) protection mechanism comprises:
A plurality of electrostatic discharge protective equipment (ES
1-ES
n), to should fan-out line (F
1-F
n) and be provided with;
Wherein, this electrostatic discharge protective equipment ES
1-ES
jEquiva lent impedance increase progressively this electrostatic discharge protective equipment ES in regular turn
J+1-ES
nEquiva lent impedance then successively decrease 1＜j＜n in regular turn.
4. electrostatic discharge (ESD) protection as claimed in claim 3 mechanism, wherein, this electrostatic discharge protective equipment is made of at least one assembly with mos transistor structure, and this electrostatic discharge protective equipment ES
1-ES
jEquivalent channel width successively decrease this electrostatic discharge protective equipment ES in regular turn
J+1-ES
nEquivalent channel width then increase progressively in regular turn.
5. an electrostatic discharge (ESD) protection mechanism is applicable to an electronic installation, and this electronic installation has at least one bonding pad, has a plurality of solder joint (P
1-P
n) be provided with in regular turn, in order to integrated circuit, this solder joint P to be installed
1And P
nBe positioned at the side of bonding pad, and by this solder joint (P
1-P
n) extend many fan-out line (F
1-F
n); This electrostatic discharge (ESD) protection mechanism comprises:
A plurality of electrostatic discharge protective equipment (ES
1-ES
n), to should fan-out line (F
1-F
n) and be provided with;
Wherein, this electrostatic discharge protective equipment (ES
1-ES
n) in, arbitrary electrostatic discharge protective equipment ES
kIts equiva lent impedance is different with the equiva lent impedance of other electrostatic discharge protective equipment, 1≤k≤n.
6. electrostatic discharge (ESD) protection as claimed in claim 5 mechanism, wherein, this electrostatic discharge protective equipment is made of at least one assembly with mos transistor structure, and this electrostatic discharge protective equipment ES
kIts equivalent channel width is different with the equivalent channel width of other electrostatic discharge protective equipment.
7. LCD panel comprises:
One array of display;
At least one bonding pad has a plurality of solder joint (P
1-P
n) be provided with in regular turn, in order to the integrated circuit that drives this array of display to be installed; Wherein, solder joint P
1And P
nBe positioned at the side of bonding pad;
Many fan-out line (F
1-F
n), by this solder joint (P
1-P
n) extend; And
A plurality of electrostatic protection device (ES
1-ES
n), to should fan-out line (F
1-F
n) and be provided with;
Wherein, this electrostatic discharge protective equipment ES
1And ES
nEquiva lent impedance be lower than other electrostatic discharge protective equipment (ES
2-ES
N-1).
8. LCD panel as claimed in claim 7, wherein, this electrostatic discharge protective equipment is made of at least one assembly with mos transistor structure, and electrostatic discharge protective equipment ES
1And ES
nEquivalent channel width greater than other electrostatic discharge protective equipment (ES
2-ES
N-1).
9. LCD panel as claimed in claim 8, wherein, this electrostatic discharge protective equipment ES
1-ES
jEquivalent channel width successively decrease this electrostatic discharge protective equipment ES in regular turn
J+1-ES
nEquivalent channel width then increase progressively 1＜j＜n in regular turn.
10. LCD panel comprises:
One array of display;
At least one bonding pad has a plurality of solder joint (P
1-P
n) be provided with in regular turn, in order to the integrated circuit that drives this array of display to be installed; Wherein, solder joint P
1And P
nBe positioned at the side of bonding pad;
Many fan-out line (F
1-F
n), by this solder joint (P
1-P
n) extend; And
A plurality of electrostatic discharge protective equipment (ES
1-ES
n), to should fan-out line (F
1-F
n) and be provided with;
Wherein, this electrostatic discharge protective equipment (ES
1-ES
n) in, arbitrary electrostatic discharge protective equipment ES
kIts equiva lent impedance is different with the equiva lent impedance of other electrostatic discharge protective equipment, 1≤k≤n.
11. LCD panel as claimed in claim 10, wherein, this electrostatic discharge protective equipment is made of at least one assembly with mos transistor structure, and this electrostatic discharge protective equipment ES
kThe equivalent channel width be different from other electrostatic discharge protective equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101138129A CN1319168C (en) | 2003-11-04 | 2003-11-04 | Electrostatic discharge protection mechanism and liquid crystal display panel using the mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101138129A CN1319168C (en) | 2003-11-04 | 2003-11-04 | Electrostatic discharge protection mechanism and liquid crystal display panel using the mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1542962A true CN1542962A (en) | 2004-11-03 |
| CN1319168C CN1319168C (en) | 2007-05-30 |
Family
ID=34336976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101138129A Expired - Lifetime CN1319168C (en) | 2003-11-04 | 2003-11-04 | Electrostatic discharge protection mechanism and liquid crystal display panel using the mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1319168C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100389341C (en) * | 2005-08-08 | 2008-05-21 | 友达光电股份有限公司 | Active element array substrate |
| CN101064984B (en) * | 2006-04-29 | 2010-12-22 | 中华映管股份有限公司 | Electrostatic discharge protection structure |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2764139B2 (en) * | 1989-10-20 | 1998-06-11 | ホシデン・フィリップス・ディスプレイ株式会社 | Active matrix liquid crystal display |
| US5233448A (en) * | 1992-05-04 | 1993-08-03 | Industrial Technology Research Institute | Method of manufacturing a liquid crystal display panel including photoconductive electrostatic protection |
| JP2000510653A (en) * | 1997-04-16 | 2000-08-15 | ザ ボード オブ トラスティーズ オブ ザ リーランド スタンフォード ジュニア ユニバーシティ | Distributed ESD protection device for high-speed integrated circuits |
| US5946057A (en) * | 1997-05-28 | 1999-08-31 | Nec Corporation | Liquid crystal display having electrostatic discharge damage prevention |
| US6337722B1 (en) * | 1997-08-07 | 2002-01-08 | Lg.Philips Lcd Co., Ltd | Liquid crystal display panel having electrostatic discharge prevention circuitry |
| US6043971A (en) * | 1998-11-04 | 2000-03-28 | L.G. Philips Lcd Co., Ltd. | Electrostatic discharge protection device for liquid crystal display using a COG package |
-
2003
- 2003-11-04 CN CNB2003101138129A patent/CN1319168C/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100389341C (en) * | 2005-08-08 | 2008-05-21 | 友达光电股份有限公司 | Active element array substrate |
| CN101064984B (en) * | 2006-04-29 | 2010-12-22 | 中华映管股份有限公司 | Electrostatic discharge protection structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1319168C (en) | 2007-05-30 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070530 |