CN1425198A - Active package for integrated circuit - Google Patents

Abstract

An active package for an integrated circuit, the package comprising an integrated circuit and an active component, the active component being part of a circuit layout of the integrated circuit. The active component forms at least a portion of the integrated circuit package. The integrated circuit may be provided in a housing formed by one or more discrete components. The active package may be fabricated with the same geometry and dimensions as a standard passive integrated circuit package, or may be shaped to fit within a standard or specially fabricated battery housing, or for other special purposes. The smart component may include a discrete component or a semiconductor-based resistor, capacitor, or inductor, and a separate integrated circuit disposed within the same housing as the discrete component or semiconductor-based resistor, capacitor, or inductor. The integrated circuit may control at least one electrical parameter of a discrete component or a semiconductor-based resistor, capacitor or inductor. In one embodiment, the integrated circuit can maintain the resistance, resistivity, capacitance, inductance, etc. of the element within a small range in order to produce a highly accurate element that is not affected by environmental changes, such as temperature, pressure, humidity, etc.

Description

Active packaging for integrated circuits

technical field

The present invention relates to an active package for an integrated circuit and discrete components, and more particularly to an active package for an integrated circuit, wherein the package includes the discrete component as part of an integrated circuit housing.

Background technique

A typical combination circuit (such as a PCB combination circuit) consists of an integrated circuit individually packaged in a passive plastic or ceramic package that seals and protects the integrated circuit and includes one or more integrated circuits mounted together with the integrated circuit on a PCB circuit board. discrete components (such as resistors, capacitors, or inductors). Combination circuits (such as power circuits, microprocessors, memory applications, logic devices, and RF amplifiers, etc.) often also include transmission lines and solder joints printed on the circuit board substrate. Due to the inherent resistance, capacitance, and inductance of transmission lines and solder joints, Therefore they cause additional losses. These parasitic losses increase dramatically when the circuit operates at high switching speeds. To minimize parasitic losses, circuit designers place circuit components close together on a circuit board. Although additional losses due to transmission lines may be reduced, placing components too close together will result in radiated energy, such as electromagnetic or thermal energy, from one or more components that will interfere with the operation of other components. Additionally, high current handling system design side faces special issues such as higher component size requirements due to potential dielectric or insulating material breakdown, energy storage requirements, heat dissipation, high transmission line losses, especially for switching converters , as it affects energy conversion efficiency, as well as voltage conversion efficiency and higher efficiency limits.

Power circuits such as switching power converters, linear regulators, power integrators, charge pumps, operational amplifier circuits, comparator circuits, relay driver circuits, relay enable circuits, power integrating circuits with power monitoring and power control, Proximity switches, etc., generally include one or more power conversion or adjustment components, and one or more internal energy conversion, storage or preservation components, which are individually packaged and assembled together on a single PCB substrate and/or passive plastic or in a ceramic package (such as a hybrid package). A switching converter may include a charge pump integrated circuit, a flying capacitor and a storage capacitor, or multiple capacitors that form a flying capacitor or a storage capacitor. Various components may radiate electromagnetic or thermal energy, which may affect the operation of other components. To dissipate the heat generated, many power circuits include heat sinks attached to the plastic or ceramic packages (such as the T0220 standard power converter package) that house the power conversion or conditioning components. The overall size of the package, including the heat sink, is typically at least an order of magnitude larger than the size of the integrated circuit itself, depending on power dissipation, power delivery capabilities, and the number of pins required.

Brief description of the invention

The invention relates to an integrated circuit package comprising active components which are part of the circuit layout of the integrated circuit and which form at least part of the housing of the integrated circuit. For example, in one embodiment, an integrated circuit may be disposed within an enclosure formed from one or more discrete components to form a package in which the discrete components are components of a circuit that includes the integrated circuit. Active packages can be manufactured to have the same geometry and dimensions as standard passive integrated circuit packages, can be shaped to fit in standard or specially manufactured battery enclosures, or can be shaped and sized to fit in in equipment or form part of a device housing.

In further embodiments of the invention, the smart component may comprise a discrete component or semiconductor-based resistor, capacitor or inductor, or a separate integrated circuits. An integrated circuit may control at least one electrical parameter of a discrete component or a semiconductor-based resistor, capacitor or inductor. For example, in one embodiment, an integrated circuit can maintain the resistance, resistivity, capacitance, inductance, etc. element.

Brief description of the drawings

Figure 1 shows a schematic diagram of a power integration circuit including a charge pump power converter;

FIG. 2 shows another embodiment of a power integration circuit including a charge pump power converter;

Figure 3 shows a schematic block diagram of a power integration circuit including a charge pump that may be provided in the active package of the present invention;

Figure 4 shows a simplified exploded view of one embodiment of an active package design for the power integrator circuit shown in Figure 3;

Figure 5 shows a simplified exploded cross-sectional view taken along the lateral line V-V in Figure 4;

Figure 6 shows a simplified exploded sectional view taken along the section line VI-VI in Figure 4;

Figure 7 shows a schematic diagram of a power converter circuit including a DC/DC converter;

Fig. 8 shows a schematic block diagram of the circuit design of the power converter circuit shown in Fig. 7;

Figure 9 shows a simplified exploded view of the active package structure of the present invention for housing the power converter circuit shown in Figure 7;

Figure 10 shows a simplified exploded view of the active package design of the present invention comprising an integrated circuit and a single discrete component;

Fig. 11 shows a sectional view taken along the sectional line XI-XI of the active package structure in Fig. 10;

Figure 12 shows a schematic diagram of a power amplifier circuit of an audio operational amplifier;

Fig. 13 shows another embodiment of the active packaging structure of the present invention;

Figure 14 shows a battery comprising the active packaging structure of the present invention;

Figure 15 shows another embodiment of the active packaging structure of the present invention;

Figure 16 shows a simplified exploded view of another embodiment of the invention;

Figure 17 shows a perspective view of another embodiment of the present invention;

Figure 18 shows a cross-sectional view of the embodiment shown in Figure 17;

Figure 19 shows a simplified cross-sectional view of another embodiment of the invention;

Figure 20 shows a simplified exploded cross-sectional view of the embodiment shown in Figure 19;

Figure 21 shows a simplified perspective view of another embodiment of the invention;

Figure 22 shows a simplified exploded view of another embodiment of the invention;

Detailed description of the invention

Active package as used in this application refers to a package for at least one integrated circuit and at least one discrete component that is part of the same circuit as the integrated circuit. Active packages include at least one discrete component that is part of the housing of one or more integrated circuits. Active packages may include one or more integrated circuits and one or more discrete components. An integrated circuit refers to a semiconductor chip including electronic components fabricated in the chip or on the surface side of the chip (eg, silicon, GaAs, SiGe, and SiC). Discrete components are resistors, capacitors, or inductors that are not fabricated on an integrated circuit. High-efficiency capacitors refer to capacitors with relatively low charge leakage, very low ESR (equivalent series resistance), and low dynamic series resistance, such as double-layer electrolytic capacitors (such as capacitors known as super capacitors, super capacitors, and power capacitors) ) and pseudocapacitors.

Smart components include discrete components or, in another embodiment, semiconductor-based resistors, capacitors, or inductors having at least one semiconductor chip that controls at least some portion of the operation of the discrete component disposed within a discrete component housing . For example, a smart component may include a controller that monitors environmental conditions, such as pressure, temperature, humidity, etc., and optimizes the performance of discrete components based on such conditions. For example, smart components can provide monolithic precision discrete components that maintain their desired electrical characteristics, such as resistance, capacitance, or inductance, within tight tolerances regardless of changing environmental conditions. Smart components are transparent to circuits of which discrete components are a part, or can provide input to circuits.

Combinational circuits may include discrete components that are intrinsic and/or extrinsic to the circuit layout. As used in this application, an intrinsic element is a discrete element that performs a function integral to a circuit function. For example, in a power integrator, a resistor, flying capacitor, storage capacitor, or inductor performs the energy conversion, storage, and/or conservation functions required for the power integrator to function as designed. Non-intrinsic components refer to discrete components that do not perform functions integral to circuit functions. Extrinsic components can be used to enhance the operation of the circuit. For example, filter capacitors may be connected between the input or output terminals and ground to enhance the operation of the combinational circuit, but are not required for the circuit to function as designed and would add to the overall circuit design cost.

The active packaging of the present invention can greatly reduce the cost and complexity of packaging and assembling integrated circuits. By using the active components as the housing for the integrated circuit, the present invention eliminates the need for passive materials to package the integrated circuit. Additionally, one embodiment of the present invention uses intrinsic components of the combinational circuit instead of extrinsic components, which can reduce the number of active components used in the circuit and thus reduce the final cost of the combinational circuit. The use of all inherent components of the combined circuit within the housing can greatly further reduce costs, since chip packaging and circuit assembly can be performed at the same stage. Where components can be joined mechanically, the invention also allows the use of reduced or no soldering. This can further reduce the cost of the combined circuit and make the product more environmentally friendly due to the use of less or no use of lead used in solder. Using intrinsic components (eg fly capacitors for power converters, storage capacitors) where functions should be performed by extrinsic components (eg filter capacitors) provides further cost savings because the cost of the extrinsic components is eliminated.

Active packaging also enables boardless design of combinational circuits, as discrete components are used as IC package elements. An active package may include a plurality of integrated circuits at least partially disposed within or contained by discrete components. For example, multiple chip modules may be replaced by an active package comprising two or more integrated circuits disposed in the active package of the present invention. Although not required, in one embodiment of the invention, one or more integrated circuits and/or discrete components may be mounted on a PCB disposed within the active package of the invention.

In one embodiment of the invention, the active package may include a "housing" structure that includes a top housing and/or a bottom housing. In embodiments including a double-sided housing design as shown in FIGS. 4-6 and 9, both housing sides may house integrated circuits. In a single-sided housing design, such as shown in FIGS. 10 and 11 , the side of the housing may protect one side of the integrated circuit. The other side of the integrated circuit may be protected by a passive packaging material such as plastic or ceramic material, or may be self-protected such as a flip chip. The case side may include a single discrete component protecting one side of the integrated circuit, such as the top case design shown in Figures 4-6 and the bottom case design shown in Figures 4-6 and 9-11. In addition, the housing side may also include multiple discrete components that are connected together to form one side of the housing, such as the top housing design shown in FIG. 9 .

The active components used in the enclosure can also act as a heat sink for the integrated circuit and in many cases can eliminate the need for an external heat sink entirely. Compared with commonly used plastic or ceramic packaging materials, the capacitors, resistors and inductors arranged in the housing close to the semiconductor chip can distribute and dissipate the heat generated in the semiconductor chip more effectively. In addition, discrete components used as housings may also include metal shells or metal layers, which can further assist in dissipating heat from the active package. In addition, discrete components can also be configured so that the active package is attached to a conventional heat sink. For example, a component may include holes similar to common integrated circuit package designs that may be used to connect the active package to a heat sink. The active package of the present invention also allows the integrated chip to operate at lower than usual temperatures due to the "hot" semiconductor chip due to parasitic heat dissipation.

The active packaging of the present invention also allows for higher noise immunity and allows the use of parasitic elements as part of the circuit. Encapsulating a larger portion of a circuit, or even an entire portion, allows the circuit to be more immune to noise and reduces the noise generated by the circuit that can affect other nearby circuits. Furthermore, the proximity of the semiconductor chip to other components allows for better prediction of the parasitic components of the circuit that will be used in the circuit design.

The active package of the present invention is also scalable, ie multiple active package designs can be connected together. In this embodiment, the combination of active package designs also allows the connection of boardless circuits in which all circuit elements are connected in a single package. In a particular embodiment, the encapsulation may form part, or even all parts, of the device housing in which the device circuitry is located.

An embodiment of the present invention may also include discrete components that respond to or detect environmental conditions (eg, pressure, temperature, humidity, etc.) or changes in environmental conditions. Circuitry can detect such conditions, or changes in conditions, and respond by optimizing the operation of the circuit to maximize the performance of the circuit. For example, circuit elements may include thermistors, temperature diodes, capacitors, or inductors that respond to changes in temperature by changing the resistance, capacitance, or inductance of the element. The circuit can detect these changes and use them as a feedback signal to optimize the performance of the circuit.

Any circuit having an integrated circuit and one or more inherently discrete components can be configured with the active package of the present invention. For example, a power integrator that includes a charge pump integrated circuit, a flying capacitor, and a storage capacitor includes two discrete components that may form a housing to accommodate the charge pump integrated circuit. FIG. 1 shows a simplified schematic diagram of a power integration circuit 20 including a charge pump 26 , a flying capacitor 22 and a storage capacitor 28 . In the power integrating circuit 20 , a flying capacitor 22 is electrically connected between the input terminal 21 of the power integrating circuit 20 and the neutral terminal 25 of the power integrating circuit 20 . The charge pump 26 has an input terminal 23 , a neutral terminal 27 and an output terminal 24 . The input terminal 23 of the charge pump 26 is electrically connected to the input terminal 21 of the power integration circuit 20 . The output terminal 24 of the charge pump 26 is electrically connected to the output terminal 29 of the power integrating circuit 20 . The neutral terminal 27 of the charge pump 26 is electrically connected to the neutral terminal 25 of the power integrating circuit 20 . The storage capacitor 28 is electrically connected between the output terminal 29 of the power integrating circuit 20 and the neutral terminal 25 of the power integrating circuit 20 .

In another embodiment, the power converter circuit may have elements that include environmental condition sensors or elements that change parameters in response to changes in environmental conditions (such as pressure, temperature, humidity, etc.) (such as capacitors that change capacitance when the temperature changes). ). For example, FIG. 2 shows a power integrating circuit 30, another embodiment of the power integrating circuit 20 shown in FIG. option, flying capacitors can also be used to sense temperature changes). When the temperature of the charge pump integrated circuit or the ambient temperature changes, the charge pump 26 will detect the change in the capacitance value of the energy storage capacitor 38, or receive an input from the temperature sensing element, and change the operation of the charge pump 26, such as changing the duty cycle to optimize circuit performance. For example, in this embodiment, the use of temperature sensors or changes in capacitance values enables better performance of the system controller by utilizing the resulting measurable loss information as feedback of real-time circuit operating conditions. Alternatively, the capacitors of the present circuit may comprise smart component capacitors, wherein the capacitors may comprise integrated circuits that monitor one or more environmental conditions and optimize the performance of the capacitors to maintain their performance at a desired performance within range. Other embodiments with power converters including charge pumps that can be disposed in the active package of the present invention are described in U.S. Provisional Application No. 60/141,119, entitled "Battery Having a Buikt-In Dynamically Switched Capacitive Power Conveverer ", filed June 25, 1999 by Nebrigic and Gartstein, which application is incorporated herein by reference. Other power integrators with charge pumps known in the art can also be provided in the active package of the present invention.

Figure 3 shows a schematic block diagram including a power integration circuit with a charge pump integrated circuit 42, a flying capacitor 44 and a storage capacitor 46 that may be provided in the active package of the present invention. FIG. 4 shows a simplified exploded view of one embodiment of an active package design 40 for the power integrator circuit shown in FIG. 3 . Figures 5 and 6 show two simplified exploded cross-sectional views taken along the lateral lines V-V and VI-VI in Figure 4, respectively. The active package 40 includes a power integrator with a charge pump conversion circuit having a charge pump integrated circuit 42 , a flying capacitor 44 and a storage capacitor 46 . In this embodiment, the charge pump integrated circuit 42 is disposed between the storage capacitor 46 and the flying capacitor 44. The storage capacitor 46 provides the substrate and forms one side of the housing of the active package 40. The charge pump integrated circuit 42 is located between Thereon, a flying capacitor 44 forms the second side of the active package 40 housing. The positions of capacitors 44 and 46 can also be reversed. The flying capacitor 44 and/or the energy storage capacitor 46 may also have grooves, such as grooves 51 and 52 , and the charge pump integrated circuit 42 may be partially or completely disposed in the grooves. Recesses 51 and 52 may be indentations, notches, cavities, or etched grooves formed in one or both of capacitors 44 and 46 . Grooves 51 and 52 may be milled, etched, or molded, among others.

Storage capacitor 46 and/or flying capacitor 44 may be fully or partially encapsulated in an insulator material. In one embodiment, the thicknesses 53 and 55 of the insulators 49 and 50 at least on the sides of one or both of the capacitors 44 and 46 adjacent to the charge pump integrated circuit 42 can be calculated to prevent electromagnetic waves or to be integrated by the charge pump integrated circuit 42. The field generated by circuit 42 or capacitors 44 and 46 extends into other components. In this embodiment, insulators 49 and 50 prevent closely located components from interfering with the operation of other components. In this example, flying capacitor 44 and tank capacitor 46 are shown as tantalum/polymer capacitors, where dielectric layers 41 and 53 may be molded in between electrodes 43, 45, 47 and 48 and other parts of the circuit Easier connection is provided without protruding pins from dielectric layers 41 and 53 of capacitors 44 and 46 . However, the capacitors may also be other types of capacitors known in the art, such as high efficiency capacitors, including supercapacitors, supercapacitors, double layer electrolytic capacitors or pseudocapacitors. Capacitors have terminals on the face side of the capacitor to make it easier to electrically connect the capacitor to the rest of the circuit.

Charge pump integrated circuit 42 may be electrically connected to flying capacitor 44 and storage capacitor 46 through contact pads shown in FIG. 4 . In this embodiment, the neutral terminal 64 of the charge pump integrated circuit 42 is electrically connected to the neutral terminal 74 of the active package 40 through the contact piece 54 . Negative electrode 45 of flying capacitor 44 is electrically connected to flying capacitor negative terminal 66 of charge pump integrated circuit 42 through contact pads 56 and 80 which come into physical and electrical contact with each other when active package 40 is assembled. Positive electrode 43 of flying capacitor 44 is electrically connected to flying capacitor positive terminal 72 of charge pump integrated circuit 42 through contact pads 62 and 82 which come into physical and electrical contact when active package 40 is assembled. Positive input terminal 68 of charge pump integrated circuit 42 is electrically connected to positive input pin 76 of active package 40 through contact pad 58 . The output terminal 70 of the charge pump integrated circuit 42 is electrically connected to the output pin 78 of the active package 40 through the contact pad 60 . The positive electrode 47 of the storage capacitor 46 is electrically connected to the output pin 78 of the active package 40 and the negative electrode 48 of the storage capacitor 46 is electrically connected to the neutral pin 74 of the active package 40 .

The active package 40 of the present invention can also be assembled in several different ways. For example, the charge pump integrated circuit 42 can be welded on the flying capacitor 44 and/or the energy storage capacitor 46, can be mechanically fixed together with the flying capacitor 44 and/or the energy storage capacitor 46, and can be installed in the groove through spring elastic engagement. , such as grooves 51 and/or 52, if the terminals of the charge pump integrated circuit 42 or the contacts of any of the capacitors in the grooves 51 and/or 52 have elastic members that support the charge pump integrated circuit 42 in place , or can even be placed in grooves, such as grooves 51 and/or 52. Charge pump integrated circuit 42 may also be connected to flying capacitor 44 and/or energy storage capacitor 46 by using methods known in the art. Flying capacitor 44 and storage capacitor 46 can also be connected together in many different ways to form active package 40 of the present invention. For example, capacitors may be connected together by bond pads (eg, bond pads 84, 86, 88, and 90). Bonding plates 84, 86, 88 and 90 are isolated from flying capacitor 44 and storage capacitor 46 by insulators 49 and 50, respectively. Thus, bonding tabs 84, 86, 88, and 90 provide mechanical but no electrical connection between the capacitors. Alternatively, flying capacitor 44 and energy storage capacitor 46 may be welded, mechanically connected, or connected using other methods known in the art.

FIG. 7 shows another embodiment of a power converter circuit 100 including a flying capacitor 110 , an inductor 112 , a DC/DC converter 114 and an energy storage capacitor 116 . FIG. 8 shows a schematic block diagram of a circuit designed for the power converter circuit 100 shown in FIG. 7 . FIG. 9 shows a simplified exploded view of the active package 120 of the present invention in which the power converter circuit 100 shown in FIG. 7 is disposed. In this embodiment, flying capacitor 110 and inductor 112 cooperate to form the top enclosure of active package 120 (alternatively, flying capacitor 110 and inductor 112 may form the bottom enclosure of active package 120). For example, flying capacitor 110 and inductor 112 may be connected by interlocking posts 122 and holes 124 . Post 122 and hole 124 may also be snap-fitted or connected together by other mechanical means. If a purely mechanical connection is desired, post 122 can be insulated from the electrodes of flying capacitor 110 and/or hole 124 can be insulated from inductor 112 . In this case, additional electrical contacts can also be provided if desired. For example in FIG. 9, contact pads 126 on flying capacitor 110 and inductor 112 may be used to make electrical contact between the two components. Alternatively, one or more posts 122 may be electrically connected to electrodes of flying capacitor 110 and one or more holes 124 may be electrically connected to inductor 112 . In this way, the mechanical and electrical connection between the flying capacitor 110 and the inductor 112 can be achieved through the post 122 and the hole 124 . If the discrete components do not need to be directly connected electrically to each other, they can be connected only mechanically.

As shown in FIG. 9 , the DC/DC converter integrated circuit 114 may be disposed in the groove 128 of the energy storage capacitor 116 . In addition to or instead of the grooves 128 formed in the storage capacitor 116 , grooves may be made in the flying capacitor 110 and the inductor 112 to accommodate the DC/DC converter integrated circuit 114 . part or all. The DC/DC converter integrated circuit 114 can be electrically connected to the flying capacitor 110, the inductor 112, the energy storage capacitor 116, the neutral pin 138, and the output pin 140 through the terminal 130 or the contact piece 132 in the manner described above in FIGS. 4-6 . Flying capacitor 110 and inductor 112 may be electrically connected to input pin 136 through contact pad 132 . The top and bottom housings of active package 120 may be joined by bonding pads 134 as described above. Alternatively, the top and bottom housings of active package 120 may be soldered, mechanically connected, or connected by other methods known in the art.

In another embodiment, multiple resistors, capacitors or inductors can be connected as shown in FIG. 9 and described above, as well as other methods described in the present invention or known in the art, to Make the required circuit connections. For example, multiple resistors, capacitors or inductors may be connected in parallel or in series to provide the desired resistance, capacitance or inductance value. For example in a capacitor, each post may be electrically connected to a different electrode of the capacitor and each hole may be electrically connected to a different electrode of the capacitor. Thus, the capacitors can be connected in series or in parallel, depending on which post is inserted into which hole. In addition, different types of discrete components (such as capacitors and inductors shown in Figure 9) can be connected to form various circuit configurations for special applications. FIG. 22 shows a simplified exploded view of another embodiment of the invention in which multiple discrete components 1010 together form a single housing side 1020 forming the top of the active package of the invention with integrated circuit 1012 and carrier 1014. The connections shown can be snap-mount configurations, where no solder is required, and can have purely mechanical connections where the electrical components of the discrete components are isolated from each other, or there can be electrical connections between the discrete components.

Another embodiment of the active package of the present invention is shown in FIGS. 10 and 11 . FIG. 11 shows a sectional view along the section line XI-XI in FIG. 10 . In this embodiment, the active package 200 includes an integrated circuit 210 and a single discrete component 220 . In this embodiment, the integrated circuit 210 may be designed such that the exposed side of the integrated circuit 210 is protected, such as a flip-chip design (eg, wafer-scale packaging). Alternatively, active package 200 may include a passive packaging material such as plastic or ceramic to cover exposed side 212 of integrated circuit 210 . Electrical and mounting connections between integrated circuit 210 and discrete components 220 may use any of the methods described above or any other method known in the art. For example, FIG. 11 shows a typical electrical contact pad 224 passing through insulator layer 222 of discrete component 220 . Discrete component 220 may be one or more capacitors, inductors, and/or resistors, or a combination of one or more capacitors, inductors, and/or resistors. A power amplifier circuit of an audio operational amplifier is an example of a circuit that may be provided in active package 200 with a single discrete component. FIG. 12 shows a schematic diagram of a power amplifying circuit of an audio operational amplifier that may be disposed in an active package structure (such as the active package 200).

battery top

In another embodiment, a power converter, regulator or charge pump circuit can be provided in the active package design of the present invention, which can be mounted under the false positive top or false negative bottom of the battery. For example, as shown in FIG. 13, a charge pump active package 300 is designed to fit under the false positive top of a cylindrical battery (eg, AA, AAA, C, or D). In this embodiment, storage capacitor 314 is a larger capacitor that forms the basis of active package 300 and forms the substrate on which a converter, regulator, or charge pump integrated circuit (such as a charge pump integrated circuit) is disposed. 312). Flying capacitor 310 is narrower than storage capacitor 314 and forms the top of active package 300 . As shown in FIG. 14 , the narrower top of the active package 300 may fit in the recess 324 of the false positive top 322 of a standard cylindrical cell 320 . Alternatively, the active package 300 may be shaped to fit in another location of a standard cylindrical cell, or in other cells, such as prismatic cells or other types of cells. The design of a power converter, regulator, or charge pump circuit that may be used in the package of the present invention is described in U.S. Application No. 09/054,192, entitled "Primary Battery Having a Built-In Controller to Extend Battery Run Time ", the application time was April 2, 1998, the applicants Gartstein and Nebrigic, and the US application No.09/054,191, the application name was "Primary Battery Having a Built-In Controller to Extend Battery Service Run Time", the application time was April 1998 On April 2, the applicants Gartstein and Nebrigic, and the US application No.09/054,087, the application name is "Battery Having a Built-In Controller", the application time was April 2, 1998, the applicants Gartstein and Nebrigic, and the US application No.09/054,012, the application name is "Battery Having a Built-In Controller", the application time is April 2, 1998, the applicants Gartstein and Nebrigic, and the US application No.09/275,495, the application name is "Battery Having a Built-In Controller", the application time was March 24, 1998, the applicants were Gartstein and Nebrigic, and the US application No.60/141,119, the application name was "Battery Having a Bui1t-In Indicator", the application time was April 23, 1999 Applicants dated Gartstein and Nebrigic, the contents of all of which are incorporated herein by reference.

In one embodiment, the flying capacitor 310 and the energy storage capacitor 314 may be high-efficiency capacitors, such as supercapacitor coin cells shown in Table 1 below. Supercapacitor coin cells have two terminals on the same side of the capacitor for easier connection in active packages of the present invention, such as those in this or other embodiments disclosed in this application .

Table 1 Technical Parameters flying capacitor Energy storage capacitor capacitance 0.05F (-10%, +25%) 1F (-10%, +25%) Series resistance DC 100HZ ＜0.09 Ohms＜0.08 Ohms ＜0.10 Ohms＜0.08 Ohms Voltage Continuous Voltage Peak Voltage 2.8V3.6V 2.8V3.6V size 4mmOD; 2mm high 6.5mmOD; 2.5mm high temperature operation energy storage -20C to +60C-40C to +80C -20C to +60C-40C to +80C Leakage current 0.01 to 0.02mA 0.005 to 0.01mA

In one embodiment of the invention, the active package can be fabricated as a standard integrated circuit package, such as a surface mount or wafer scale package, where one or more inherent components are combined in the active package in the same geometry as a standard integrated circuit package. In package. In this way, active packages can replace all or part of the circuitry used by standard passive packages.

As shown in FIG. 22, multiple discrete components may be mated together to form the housing side of the active package of the present invention. In this embodiment, the discrete components 1010 may fit together to form the top housing side 1020 of the active package 1000 for, eg, a microprocessor integrated circuit package. This top case side 1020 can replace the passive packaging material of common microprocessor integrated circuit packages (such as BGA-256) and allow the integration of discrete components normally placed on a PCB board into the active package 1000 of the present invention. The bottom carrier 1014 may comprise a typical pinned carrier (eg, BGA-256).

In one particular embodiment, the active package may include a fully integrated charge pump in a standard charge pump package. Active packages are available in standard forms such as TO-220, SOT-223, TO-3, TO92 and TO87. For example, Figure 15 shows an embodiment in which the active package is fabricated in a TO-220 standard form factor. In this embodiment, the flying capacitor 410 and the storage capacitor 414 form the top and bottom halves of the housing, which enclose the integrated circuit 412 . Flying capacitor 410 may be the same size as the top of a standard TO-220 package. In the embodiment shown in FIG. 15, the storage capacitor 414 is only formed as part of the bottom half of the TO-220 package, and a metal, plastic or ceramic chip is attached to the storage capacitor to completely form the bottom half of the standard package. , and leave the package connected to the heat sink. In another embodiment, the storage capacitor is the same size as the bottom of a standard TO-220 package and may have holes, if desired, to allow the package to attach to a heat sink. In one embodiment, the flying capacitor 410 and the energy storage capacitor 414 may be high-efficiency capacitors, such as supercapacitors shown in Table 2.

Table 2 Technical Parameters flying capacitor Energy storage capacitor capacitance 0.05F (-10%, +25%) 1F (-10%, +25%) Series resistance DC 100HZ ＜0.09 Ohms＜0.08 Ohms ＜0.10 Ohms＜0.08 Ohms Voltage Continuous Voltage Peak Voltage 2.8V3.6V 2.8V3.6V size 8.38mm×10.16mm×2mm 26mm×10.16mm×2.45mm to 2.65mm temperature operation energy storage -20C to +60C-40C to +80C -20C to +60C-40C to +80C Leakage current 0.01 to 0.02mA 0.005 to 0.01mA

Figure 16 shows a simplified exploded view of another embodiment of the present invention that can be used in place of a standard TO-3 package. The active package includes flying capacitor 510 , integrated circuit 512 and energy storage capacitor 514 .

FIG. 17 shows a perspective view of another embodiment of the invention, including discrete components 610 and 614 , and an integrated circuit 612 . FIG. 18 shows a cross-sectional view of the embodiment shown in FIG. 17 .

Figure 19 shows a simplified cross-sectional view of another embodiment of the invention. In this embodiment, the active package includes discrete components 810 and 814 , and integrated circuit 812 . Figure 20 shows a simplified exploded cross-sectional view of the embodiment shown in Figure 19; Figure 21 shows a simplified perspective view of another embodiment of the invention, including smart elements. The smart component is shown without a housing and shows component 910, which may be a discrete component or a semiconductor component such as a silicon based resistor, capacitor or inductor.

Claims (12)

1. integrated circuit encapsulation comprises:

(a) encapsulation input terminal, encapsulation lead-out terminal and encapsulation neutral terminal;

(b) discrete component, it is electrically connected between encapsulation input terminal or encapsulation lead-out terminal and the encapsulation neutral terminal, and preferably wherein discrete component is selected from: tantalum capacitor, high efficiency capacitor, ultracapacitor, superfine capacitor, double-layer electrolytic capacitor, pseudo-capacitor, nonlinear magnetism inductor, induction welding bead and resistor;

(c) integrated circuit, comprise first side, second side, integrated circuit input end, ic output and integrated circuit neutral terminal, integrated circuit input end is electrically connected to the encapsulation input terminal, ic output is electrically connected to the encapsulation lead-out terminal, and the integrated circuit neutral terminal is electrically connected to the encapsulation neutral terminal;

Wherein discrete component forms first side of encapsulation, protection integrated circuit first side.

2. integrated circuit encapsulation comprises:

(a) encapsulation, it comprises encapsulation input terminal and encapsulation lead-out terminal;

(b) discrete component;

(c) integrated circuit, it comprises integrated circuit input end and ic output, discrete component and integrated circuit are electrically connected between encapsulation input terminal and the encapsulation lead-out terminal, integrated circuit is suitable for changing the electric parameter of intelligent element, and preferably wherein electric parameter is selected from: resistance, resistivity, electric capacity and inductance;

Wherein sealing integrated circuit and discrete component.

3. integrated circuit encapsulation according to claim 1 and 2 is characterized in that wherein discrete component comprises a plurality of discrete components that link together, and preferably wherein a plurality of discrete components are interlocked.

4. according to the described integrated circuit encapsulation of above-mentioned any claim, it is characterized in that wherein discrete component and integrated circuit are connected or be connected in parallel between encapsulation encapsulation input terminal and the encapsulation lead-out terminal.

5. according to the described integrated circuit encapsulation of above-mentioned any claim, it is characterized in that, wherein discrete component comprises first capacitor, this capacitor electrode is connected between encapsulation input terminal and the encapsulation neutral terminal, the integrated circuit encapsulation also comprises second capacitor, this capacitor electrode is connected between encapsulation lead-out terminal and the encapsulation neutral terminal, wherein first capacitor forms first side of encapsulation, second capacitor forms second side of encapsulation, and integrated circuit is between first capacitor and second capacitor, and preferably wherein integrated circuit comprises the power charge pump integrated circuit.

6. according to the described integrated circuit encapsulation of above-mentioned any claim, it is characterized in that wherein first capacitor comprises a plurality of capacitors that link together.

7. according to the described integrated circuit encapsulation of above-mentioned any claim, it is characterized in that, wherein the integrated circuit encapsulation comprises that single element power integrator, preferably wherein single element power integrator integrated circuit include only 3 terminals and/or single element power controller is a standard packaging power controller encapsulating structure.

8. according to the described integrated circuit encapsulation of above-mentioned any claim, it is characterized in that wherein first capacitor and/or second capacitor are ultracapacitor.

9. according to the described integrated circuit encapsulation of above-mentioned any claim, it is characterized in that wherein integrated circuit is encapsulated as solderless access node structure.

10. according to the described integrated circuit encapsulation of above-mentioned any claim, it is characterized in that wherein integrated circuit comprises the power charge pump integrated circuit.

11. according to the described integrated circuit encapsulation of above-mentioned any claim, it is characterized in that, also comprise battery, battery has: the container that comprises plus end and negative terminal, with the electrochemical cell that comprises positive electrode and negative electrode, integrated circuit encapsulation is electrically connected between the plus end and negative terminal of the positive electrode of electrochemical cell and negative electrode and container.

12., it is characterized in that wherein the dimensional configurations of integrated circuit encapsulation becomes to be fit to be installed in the false top of standard size cylindrical battery according to the described integrated circuit encapsulation of above-mentioned any claim.

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