CN1485660A - Work-piece loading device for heat treating apparatus - Google Patents
Work-piece loading device for heat treating apparatus Download PDFInfo
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- CN1485660A CN1485660A CNA021435685A CN02143568A CN1485660A CN 1485660 A CN1485660 A CN 1485660A CN A021435685 A CNA021435685 A CN A021435685A CN 02143568 A CN02143568 A CN 02143568A CN 1485660 A CN1485660 A CN 1485660A
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Abstract
The invention provides a work piece loading device for use in heat treating field for making liquid crystal plate and other plate-like electronic parts, which can eliminate the imperfectness caused by the localized deformation of the work piece, wherein the work piece loading apparatus comprises a multiple stage loading portion for loading plate-like work pieces and a loading portion supporting member, each loading portion contains a plurality of work piece bearing carriers for supporting the work piece directly.
Description
Technical field
The present invention relates to carry out employed workpiece loading attachment in the heat-treating apparatus of tabular electronic components such as liquid crystal board.
Background technology
For example in making the process of liquid crystal board, with sealants such as epoxide resin materials the driving side substrate and colored filter substrate stickup that are provided with TFT etc.When carrying out this stickup,, use annealing device that it is implemented the thermal treatment of certain hour in order to make sealant cures.It is substrate or the substrate that is pasted together that desire is implemented heat treated workpiece, be tabular, by the workpiece loading attachment supporting that is called thermal treatment frame etc.Workpiece loading attachment always generally is the many places with the pin holding workpieces.In addition, in patent documentation 1 (spy opens the 2002-130959 communique), disclose the replacement pin and used elongated circular shaft, leaned on the only annealing device workpiece loading attachment of two edge of holding workpieces of a pair of circular shaft as the Workpiece carrier member.
In making the liquid crystal board process, when substrate is pasted each other, be necessary to make the pixel of face-off to carry out the contraposition of micron order, if do not have at sealant under the state of sufficient intensity, substrate bends, and then follows dislocation to produce display dot.In recent years, liquid crystal board etc. gradually to height become more meticulous, maximization, thin plate development, when making this liquid crystal board, in the occasion that the workpiece loading attachment with above-mentioned pin supporting type always comes holding workpieces, the problem of generation display dot has appearred.The reason that display dot takes place can be thought because workpiece is a contact with contacting of pin, so the deadweight concentrated area of workpiece acts on pin in thermal treatment, produces due to the local deformation on the substrate.Display dot is that gap size is inaccurate to be caused because the distortion of glass substrate makes, and can consider the compression deformation that the high-temperature capability deficiency of resin separation layer causes as the inaccurate reason of gap size, or the position changing of the relative positions of separation layer etc.Equally, even the device in the patent documentation 1, also because workpiece is the line contact with contacting of pin, so the deadweight concentrated area of workpiece acts on the circular shaft of two edge, and whole workpiece generation concavity distortion, so can think that the display dot of eliminating reliably as the liquid crystal board of final products is difficult.
Be not limited only to the situation of the substrate sticking of liquid crystal board, even on substrate, form the occasion of line pattern, local deformation is also taken place in substrate during thermal treatment, exist the bad problem of product that has this distortion to cause because of residual, in addition, though this thermal treatment is to carry out under clean environment, if but the horizontality of carrying plane (flatness) is different between the Workpiece carrier member, then exist on workpiece and to produce the part and float, workpiece vibrates and has become the such problem of reason of dirt because of the flow velocity of hot blast, in device always, this point also is not enough.
Moreover, contact with line in the device of supporting in a contact supporting, though the quantity that to consider to increase the supporting position of concentrating for fear of the workpiece deadweight, but the occasion of accelerating, not only manufacturing cost raises, and to accomplish to support equably at all places, contact site be difficult, the result, still be easy to generate local deformation, can't eliminate the problems referred to above fully.
Summary of the invention
The product bad phenomenon that the object of the present invention is to provide a kind of local deformation that can eliminate in heat treatment process by workpiece to cause can suppress the annealing device workpiece loading attachment of the vibration of workpiece in addition.
Annealing device workpiece loading attachment according to the present invention, it is characterized in that having and to reserve multistage loading part and the loading part supporting mass that predetermined distance ground loads the plate workpiece of desiring to heat-treat up and down respectively, wherein each loading part has a plurality of Workpiece carrier members of direct holding workpieces, and have at least one to be to carry workpiece on the position of the periphery that leaves workpiece, each Workpiece carrier member is microscler and upper surface is smooth.
The Workpiece carrier member is from practical aspects such as thermotolerance, intensity, low distortion, low dirt, low cost, the preferably rectangular tube of stainless steel.
At workpiece is rectangular tabular occasion, the direction of Workpiece carrier member can be taken as along the direction of the long side direction of workpiece, also can be taken as along the direction of the short side direction of workpiece, but from the quantity that reduces supporting member to seek weight reduction, and improve the thermal storage effect aspect, preferably the direction of Workpiece carrier member is taken as along the direction of the long side direction of workpiece.More particularly, can use 5 Workpiece carrier members of total of the long side direction that is parallel to workpiece, it is disposed near two edge portions, central portion and each the edge portion of workpiece the position, perhaps, also can use 6 Workpiece carrier members of total of the long side direction that is parallel to workpiece, it equally spaced is disposed between the two edge portions and two edge portions of workpiece.
Moreover the number of above-mentioned Workpiece carrier member can be made suitable change according to the size of workpiece.
Annealing device workpiece loading attachment according to the present invention, because workpiece supports by a plurality of Workpiece carrier members, and wherein have at least on the position that is located at the periphery that leaves workpiece, so can prevent the vibration of workpiece, and then, because each Workpiece carrier member is microscler and its upper surface is smooth, workpiece supports by surface of contact, so can prevent to produce on the workpiece product bad phenomenon that local deformation causes.
On the upper surface at least of each Workpiece carrier member, be provided with padded coaming.
Padded coaming can use the thermal shrinkage cladding material to cover the whole surface of rectangular tube of stainless steel, in addition, also can only be pasted on banded padded coaming the surface that is contacted with workpiece of the rectangular tube of stainless steel.As the material that padded coaming uses, preferably resin or rubber etc. have elasticity, and are not easy stripping charge, and do not play dirt or the material of the degassing of the liquid crystal board that do not exert an influence under heat treatment temperature (for example about 200 ℃ or below it).
Though the rectangular tube of stainless steel exists and makes the impaired possibility of workpiece (for example glass substrate),,, load relievedly even easy impaired workpiece also can be got rid of this worry by on the Workpiece carrier member, padded coaming being set.And the sort buffer material can absorb irregular between the member of work mounting s face of Workpiece carrier member, holding workpieces more equably.
In addition, in order to relax workpiece is subjected to deriving from the Workpiece carrier member when loading impact, each Workpiece carrier member can be supported by the loading part supporting mass to run-off the straight when the deadweight of bearing workpiece.That is to say, the Workpiece carrier member is taken as by inside can accommodate the rectangular tube that globe bearing ground forms, with the formation that is fixed in the loading part supporting mass and can forms around the globe bearing of any horizontal rotational shaft ground holding workpieces, perhaps, the Workpiece carrier member is taken as the rectangular tube that can be formed with a gap by the Z-axis member with inserting, be fixed in the Z-axis member that loading part supporting mass and its top can be inserted with doing relative motion in rectangular tube, and the formation that is clipped between rectangular tube lower surface and the loading part supporting mass and rectangular tube is formed the elastic components such as compression helical spring of its supporting up or down.
So, when being placed on workpiece on the loading attachment by robot, though workpiece can produce distortion because of deadweight, but because each Workpiece carrier member can run-off the straight corresponding to workpiece, the phenomenon that acts on a Workpiece carrier member, balancedly holding workpieces are concentrated in the deadweight that can prevent workpiece.
Description of drawings
Fig. 1 is the vertical view of expression according to one of employed annealing device of workpiece loading attachment of the present invention example.
Fig. 2 is the vertical view of annealing device according to the present invention with the workpiece loading attachment.
Fig. 3 is the front view of Fig. 2.
Fig. 4 is the local enlarged front view of the major part of enlarged drawing 3.
Fig. 5 is with the action effect of workpiece loading attachment and go through the synoptic diagram that the person that has come compares annealing device according to the present invention.
Fig. 6 is the stereographic map of expression annealing device according to the present invention with the Workpiece carrier deformation of members example of workpiece loading attachment.
Fig. 7 is the vertical cut-open view of expression annealing device according to the present invention with another variation of the Workpiece carrier member of workpiece loading attachment.
Embodiment
Embodiments of the invention are described with reference to the accompanying drawings.
It is overall that Fig. 1 illustrates annealing device, and annealing device has heating chamber 2, is arranged at the workpiece loading attachment 1 in the heating chamber 2, and carry out the robot 3 that moving of workpiece W put between the outside of heating chamber 2 and workpiece loading attachment 1.
Workpiece W is loaded into workpiece loading attachment 1 as follows: make its long side direction towards with heating chamber 2 in the direction of flow direction quadrature of hot blast and processed.
There is a plurality of (illustrating 3) arm 3a of holding workpieces W in robot 3.
Shown in the enlarged drawing among Fig. 2 and Fig. 3,, have multistage loading part 10 that loads the workpiece W that desires to heat-treat and the loading part supporting mass 11 that supports these loading parts 10 according to workpiece loading attachment 1 of the present invention.
The 3 pairs of pillars 13 and respectively across the strenthening member 12 of being fixed in 13 of left and right sidesing pillars and supporting loading parts 10 at different levels about loading part supporting mass 11 has.
Each loading part 10 is by being supported on 3 shape strenthening members 12 arranged side by side, and directly 6 shape Workpiece carrier members 14 arranged side by side of holding workpieces W constitute.
Each Workpiece carrier member 14 is formed by the rectangular tube of microscler stainless steel.6 Workpiece carrier members 14 do not have Workpiece carrier member ground equally spaced to dispose at central portion.
Each strenthening member 12 on the position that the robot arm 3a of each strenthening member 12 inserts, shown in amplifying among Fig. 4, is provided with the breach 15 of avoiding interfering usefulness by can manufacturing.Whereby, can suppress the overall height of workpiece loading attachment 1, make multistage loading part 10 is set becomes possibility.
Moreover the quantity of Workpiece carrier member 14 is not limited to 6.The quantity of robot arm 3a except 3, also have 2 etc., it in the quantity of robot arm 3a 3 occasion, preferably the quantity of Workpiece carrier member 14 is taken as even number, make central portion not have the Workpiece carrier member, it in the quantity of robot arm 3a 2 occasion, preferably the quantity of Workpiece carrier member 14 is taken as odd number, makes central portion also be provided with the Workpiece carrier member.
Fig. 5 schematically represents to act on the power of the workpiece W that is bearing on the workpiece loading attachment, (a) occasion with the Workpiece carrier member 14 direct holding workpieces W of rectangular tube of the present invention is shown, the occasion of coming holding workpieces W with the semisphere pin 32 that is fixed in rectangular tube 31 upper surfaces of mode always (b) is shown.Workpiece W is a liquid crystal board, is pasted via sealant W3 such as epoxy resin by driving side substrate W1 that is provided with TFT etc. and colored filter substrate W2, by thermal treatment sealant W3 is solidified and obtains.The clearance G of driving side substrate W1 and colored filter substrate W2 is about 5 μ m, is formed with by photolithography etc. to obtain the separation layer that clearance G is used on colored filter substrate W2.The size of workpiece W for example is about 1500mm * 1800mm, and the condition of cure of sealant is about 120 ℃～180 ℃, the retention time is taken as 30 fens～and about 120 minutes.As can be seen among pin supporting type persons, act on direct supporting its pin 32 because the deadweight of workpiece W is concentrated from Fig. 5 (b), the size of clearance G is inaccurate so be contacted with that pin 32 1 sides' substrate W1 is out of shape.The compression deformation that the high-temperature capability deficiency that the inaccurate reason estimation of the size of clearance G is a separation layer causes, or due to the position changing of the relative positions of separation layer.So, in pin supporting type person, on pin 32 positions, produce display dot because of clearance G is inaccurate.Be directed to this, from the present invention shown in Fig. 5 (a) as can be seen, because the Workpiece carrier member 14 by square control bears workpiece W, workpiece W contacts with 14 of Workpiece carrier members on the long side direction total length so become, the pressure that puts on Workpiece carrier member 14 because of the deadweight of workpiece W reduces significantly, and the size of clearance G keeps constant as a result.That is to say that workpiece loading attachment 1 of the present invention has as can be seen been eliminated the reason of display dot.According to the simulation analysis of the stress that acts on workpiece, it is 6.917E+005Pa that the peak stress under the situation of 6 Workpiece carrier members 14 is arranged, and this expresses stress and concentrates and obtain relaxing.Moreover, as the pin supporting type, put contact supporting person or as section the hemispheric long elements line contact among the supporting person, except the local deformation of workpiece W, thereby exist problem, and workpiece loading attachment 1 of the present invention can also be eliminated this problem to the easy vibration of supporting instability workpiece W of large-scale workpiece W.
As above-mentioned Workpiece carrier member 14, certainly continue to use the rectangular tube of stainless steel, in addition, also can be taken as the structure of padded coaming.That is to say, shown in Fig. 6 (a), also can on the whole surface of the rectangular tube 14a of the stainless steel of Workpiece carrier member 14, paste padded coaming 14b such as rubber, plastics.This formation can easily obtain.For example, make cover rectangular tube as the thermal shrinkage cladding material of padded coaming after, by heating its contraction is formed.In addition, Workpiece carrier member 14 also can constitute shown in Fig. 6 (b),, on the upper surface of the rectangular tube 14a of stainless steel, pastes padded coaming 14c such as rubber, plastics with bonding agent that is.Whereby, not only can prevent from workpiece W is damaged, and there is not an occasion of padded coaming having only rectangular tube, because of having a little inclination just to make Workpiece carrier member 14 become line with workpiece W easily, Workpiece carrier member 14 contacts, be directed to this, by getting involved padded coaming 14b, 14c, can make it to become reliable face contact.
In addition, in order to relax workpiece W is subjected to deriving from Workpiece carrier member 14 when loading impact, can pass through globe bearing 22, compression bung flange spring 25 etc. can be supported on run-off the straight ground Workpiece carrier member 14 by loading part supporting mass 11 when the deadweight of bearing workpiece W.That is to say, Workpiece carrier member 14 can be as shown in Fig. 7 (a), be taken as by inside and can accommodate the rectangular tube 21 that globe bearing 22 ground form, with the formation that is individually fixed in each reinforcing member 12 and rectangular tube 21 is formed around the globe bearing 22 of any horizontal rotational shaft ground holding workpieces, also can be as shown in Fig. 7 (b), be taken as the rectangular tube 23 that can form with a gap by Z-axis member 24 with inserting, be individually fixed in the Z-axis member 24 that each reinforcing member 12 and its top can do relative motion and insert (rectangular tube 23 can move up and down and rectangular tube 23 upper surfaces can favour surface level with respect to Z-axis member 24) in rectangular tube 23, and the formation that is clipped between rectangular tube 23 lower surfaces and the strenthening member 12 and rectangular tube 23 is formed the elastic components such as compression helical spring 25 of its supporting up or down.
Moreover workpiece loading attachment according to the present invention is not limited to above-mentioned disclosed device, certainly makes suitable change according to workpiece size, weight etc.
Claims (3)
1. annealing device, use the workpiece loading attachment, it is characterized in that having and to reserve multistage loading part and the loading part supporting mass that predetermined distance ground loads the plate workpiece of desiring to heat-treat up and down respectively, wherein each loading part has a plurality of Workpiece carrier members of direct holding workpieces, and have at least one to be to be used for carrying workpiece on the position of the periphery that leaves workpiece, each Workpiece carrier member is microscler and upper surface is smooth.
2. annealing device workpiece loading attachment as claimed in claim 1 is characterized in that, is provided with padded coaming on the upper surface at least of each Workpiece carrier member.
3. annealing device workpiece loading attachment as claimed in claim 1 or 2 is characterized in that each Workpiece carrier member can tilt when the deadweight of bearing workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021435685A CN1324670C (en) | 2002-09-29 | 2002-09-29 | Work-piece loading device for heat treating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021435685A CN1324670C (en) | 2002-09-29 | 2002-09-29 | Work-piece loading device for heat treating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1485660A true CN1485660A (en) | 2004-03-31 |
| CN1324670C CN1324670C (en) | 2007-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021435685A Expired - Fee Related CN1324670C (en) | 2002-09-29 | 2002-09-29 | Work-piece loading device for heat treating apparatus |
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| Country | Link |
|---|---|
| CN (1) | CN1324670C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100479117C (en) * | 2004-05-12 | 2009-04-15 | 微传科技有限公司 | System for heat treatment of semiconductor device |
| CN1691209B (en) * | 2004-04-28 | 2010-05-12 | 光洋热系统株式会社 | Display board cooling device |
| CN102446798A (en) * | 2010-10-08 | 2012-05-09 | 光洋热系统株式会社 | Substrate support member and substrate storage device |
| CN101054262B (en) * | 2006-04-10 | 2012-10-03 | 光洋热系统株式会社 | Heat treatment device |
| CN108139164A (en) * | 2015-10-15 | 2018-06-08 | 丰田铁工株式会社 | heating equipment |
| CN109459874A (en) * | 2018-11-14 | 2019-03-12 | 蚌埠高华电子股份有限公司 | A kind of ito glass sylphon frame glue curing mechanism device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5326240A (en) * | 1991-10-12 | 1994-07-05 | Sony Corporation | Metal mold device for molding a disc substrate |
| KR0147403B1 (en) * | 1994-06-24 | 1998-11-02 | 문정환 | Device of automatic chip loading |
| JP3212244B2 (en) * | 1995-11-21 | 2001-09-25 | 中津川包装工業株式会社 | Cardboard holding member for plate products |
| JP3924661B2 (en) * | 1996-12-04 | 2007-06-06 | 光洋サーモシステム株式会社 | Device for loading / unloading thin plate-like workpiece into / from vertical heat treatment furnace and method for loading / unloading thin plate-like workpiece using the same |
| JP3741401B2 (en) * | 1998-02-27 | 2006-02-01 | キヤノン株式会社 | Substrate transport device, semiconductor manufacturing device, and liquid crystal plate manufacturing device |
-
2002
- 2002-09-29 CN CNB021435685A patent/CN1324670C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1691209B (en) * | 2004-04-28 | 2010-05-12 | 光洋热系统株式会社 | Display board cooling device |
| CN100479117C (en) * | 2004-05-12 | 2009-04-15 | 微传科技有限公司 | System for heat treatment of semiconductor device |
| CN101054262B (en) * | 2006-04-10 | 2012-10-03 | 光洋热系统株式会社 | Heat treatment device |
| CN102446798A (en) * | 2010-10-08 | 2012-05-09 | 光洋热系统株式会社 | Substrate support member and substrate storage device |
| CN102446798B (en) * | 2010-10-08 | 2016-01-20 | 光洋热系统株式会社 | Supporting member for substrate and substrate storing apparatus |
| CN108139164A (en) * | 2015-10-15 | 2018-06-08 | 丰田铁工株式会社 | heating equipment |
| CN108139164B (en) * | 2015-10-15 | 2019-11-15 | 丰田铁工株式会社 | heating equipment |
| US10612853B2 (en) | 2015-10-15 | 2020-04-07 | Toyoda Iron Works Co., Ltd. | Heating device |
| CN109459874A (en) * | 2018-11-14 | 2019-03-12 | 蚌埠高华电子股份有限公司 | A kind of ito glass sylphon frame glue curing mechanism device |
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| Publication number | Publication date |
|---|---|
| CN1324670C (en) | 2007-07-04 |
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Granted publication date: 20070704 Termination date: 20210929 |