CN1484067A - Display panel using bypass bus line to improve electrical connection - Google Patents
Display panel using bypass bus line to improve electrical connection Download PDFInfo
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- CN1484067A CN1484067A CNA021426880A CN02142688A CN1484067A CN 1484067 A CN1484067 A CN 1484067A CN A021426880 A CNA021426880 A CN A021426880A CN 02142688 A CN02142688 A CN 02142688A CN 1484067 A CN1484067 A CN 1484067A
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- display panel
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Abstract
A display panel with bypass bus lines for improving electrical connection, at least comprising: a pixel array formed by arranging a plurality of pixel elements on the display panel and capable of generating corresponding images according to input signals; a plurality of chip on glass packages fabricated in series at the edge of the display panel, wherein the chip on glass packages are capable of transmitting the signal to the pixel array to drive the selected pixel elements; a plurality of segment array upper wiring lines defined on the display panel and respectively located between the adjacent crystal plates to connect all the crystal plates in series and provide transmission paths for the signals; and the bypass flat cable is manufactured at the side of the crystal plate and is respectively connected with the array upper wiring at the two sides of the crystal plate so as to provide a bypass path for the signal.
Description
Technical field
The present invention relates to LCD, especially a kind of flexible printed wiring board (flexibleprinted circuit that utilizes; FPC) LCD of enhancement electrically connect goes up the stickup flexible printed wiring board at display pannel (panel), covers crystal glass encapsulated wafer (chip glass with reduction; COG) with array on circuit (wire on array; WOA) the too high problem of impedance.
Background technology
Quick progress along with the thin film transistor (TFT) manufacturing technology, LCD has been owing to possessed advantages such as frivolous, power saving, no width of cloth ray, and is widely used in PDA(Personal Digital Assistant), notebook computer, digital camera, takes the photograph in the various electronic products such as video recorder, mobile phone.Add the positive input research and development of industry and adopt the production equipment that maximizes, the crystalloid of LCD is constantly promoted, and the lasting decline of price, more make the application of LCD enlarge rapidly.
Please refer to Fig. 1, shown the typical liquid crystal panel construction.Generally speaking, in the manufacturing process of panel of LCD, tend to by processing procedures such as film deposition and lithographies, on lower glass substrate 10, make a large amount of thin film transistor (TFT) (TFT), pixel electrode (pixel electrode) and crisscross each other sweep trace and data line pattern, and construct required pel array (pixelarray).Then, will make colored filter (color filter; CF) top glass substrate 12 is covered in lower glass substrate 10 tops, liquid crystal layer is injected between top glass substrate 12 and the lower glass substrate 10 again, seals liquid crystal injecting port at last and constitutes required panel of LCD.
For required operating voltage and the signal of each pixel element thin film transistor (TFT) on the panel of LCD is provided, around panel, also can make interlock circuit, wafer and element.As shown in Figure 1, lower edge in lower glass substrate 10, can link a printed-wiring board (PWB) 14, on this bar printing wiring board 14, except having sequential control wafer (timing controller), and have several source drive wafers (sourcedriver IC), so that by the data line on the panel of LCD, be linked to each pixel element.The back side that for convenience printed circuit board (PCB) 14 is folded to display is to save the space, and the source drive wafer 16 on the printed-wiring board (PWB) 14 is linked to display pannel with flexible flat cable 18 separately, again via circuit on the panel and pel array electrically connect.
Except the described source drive wafer 16 that is positioned at the display pannel downside,, also can make several gate driving wafers (gate driver IC) 20, so that be linked to each pixel element via sweep trace on the right border surface of lower glass substrate 10.It should be noted that these gate driving wafers 20 generally are by covering crystal glass encapsulation (chip on glass; COG) technology directly is produced on the surface of lower glass substrate 10.And because the space that lower glass substrate 10 right side edge keep is very narrow, therefore described gate driving wafer 20 is in series connection (cascade) mode, on the from top to bottom linearly surface that is distributed in lower glass substrate 10.Again by wiring on the array that is defined in lower glass substrate 10 surfaces (wireon arrar, WOA) 22, each gate driving wafer 20 is connected in series.
Yet along with the display pannel size constantly rises, the length of wiring 22 all can increase on required gate driving wafer 20 quantity and the array, and causes the generation of impedance and loading problem.Wherein, owing to wiring 22 on the array that directly is made in lower glass substrate 10 surfaces only has about 50 microns width, therefore when transmitting relevant voltage and control signal, tend to be limited by its higher impedance, the signal intensity attenuation and the distortion of feasible transmission.And for each gate driving wafer 20, it also has suitable impedance, is when rising with the number of wafers when series connection, also can cause and transmit the operation that signal can't the service load element.Thus, for being series at the gate driving wafer 20 of tail end, voltage or control signal that it is relevant may can't effectively drive pixel element owing to overdamping, cause serious loading problem.
Summary of the invention
Purpose of the present invention is providing a kind of display pannel with flexible printed wiring board, by with this flexible printed wiring board with cover crystal glass encapsulated wafer or array on wiring in parallel, can reduce impedance therebetween.
Another object of the present invention is providing mode of connection between a kind of wafer that is applied to large-sized display pannel device, with signal and underloaded problem in the wafer that prevents to connect.
For achieving the above object, the present invention proposes a kind of bypass winding displacement that is made on the glass substrate, the wafer that has a plurality of series connection on this glass substrate, in order to drive the transistor unit on this glass substrate, and between those wafers, link together and transmit signal with the wiring pattern that is defined in this glass baseplate surface, wherein this bypass winding displacement is linked to this wiring pattern of this both sides of wafers respectively, to provide a bypass path to this signal.Wherein this bypass winding displacement is made of flexible circuit board.This wiring pattern has a plurality of, and between this adjacent wafer, is linked with this binding pattern, and this bypass winding displacement is linked to the two ends of this wiring pattern, and presents state in parallel with this wiring pattern.
In addition, the invention also discloses a kind of bypass winding displacement that is made on the display pannel, this display panel have a plurality of be one another in series cover the crystal glass encapsulated wafer, be used for driving the pixel element array that is positioned on this display pannel, and those cover between the crystal glass encapsulated wafer, link together and transmit control signal to be defined on the array on this display pannel wiring, wherein this bypass winding displacement is connected to wiring on this this array that covers crystal glass encapsulated wafer both sides, to provide a bypass path to this drive signal.
The present invention proposes a kind of display pannel again, and it comprises at least: a pel array, form by a plurality of pixel elements arrangements that are made on this display pannel, and can produce corresponding image according to the signal of input; A plurality of crystal glass encapsulated wafers that cover are made in this display pannel edge with series system, and wherein this covers the crystal glass encapsulated wafer and can transmit this signal to this pel array, to drive this selected pixel element; Wiring on the plural number section array is defined on this display pannel, lays respectively at adjacent this and covers between the crystal glass encapsulated wafer, and all cover the crystal glass encapsulated wafer to connect, and provide transmission path to this signal; And the bypass winding displacement, be made in the side that this covers the crystal glass encapsulated wafer, and be connected to wiring on this this array that covers crystal glass encapsulated wafer both sides, to provide a bypass path to this signal.
Use bypass winding displacement of the present invention, can produce lot of advantages:
Therefore 1, because flexible printed wiring board has splendid electric conductivity, can provide splendid bypass path, and with gate driving wafer or array on wiring form framework in parallel, and reduction impedance problems therebetween significantly.
2, because the bypass winding displacement can effectively reduce impedance, even therefore the quantity of gate driving wafer increases, or the length of wiring on the array increases, and still can complete control signal be sent to the gate driving wafer of caudal end by the bypass path.So, can avoid because signal attenuation and problem that can't service load.
Description of drawings
Fig. 1 shows that tradition is in the not so structure complied with of face of Zhi Shuzhong liquid crystal;
Fig. 2 shows according to the LCD display panel structure with bypass winding displacement provided by the present invention;
Fig. 3 A～3C shows the bypass winding displacement layout type according to different embodiments of the invention provided;
Fig. 4 is the panel of LCD sectional view, shows the situation that the bypass winding displacement is electrically connected at wiring on the array by one deck Anisotropically conductive glue;
Fig. 5 shows the bypass bus-bar construction according to another embodiment of the present invention provided; And
Fig. 6 A～6B shows according to the present invention the practice that the flexible printed wiring board contraposition is attached on the panel of LCD.
Embodiment
Please refer to Fig. 2, use flexible flat cable that the mode of signal bypass path is provided in showing according to the present invention.As above-mentioned, panel of LCD 50 is by a lower glass substrate 52 and top glass substrate 54 clampings, one layer of liquid crystal molecule and constitute, in general, can production quantity on lower glass substrate 52 extremely many thin film transistor (TFT)s (TFT) and staggered in length and breadth sweep trace and data line are to constitute required pixel element array.Then can make required colored filter (color filter as for lower surface in upper glass base and 54; CF), so that after making up, can produce required image effect by layer of liquid crystal molecule therebetween with lower glass substrate 52.
In addition, describe identical with the front, for the thin film transistor (TFT) in the valid function panel of LCD 50, downside at panel of LCD 50 has linked a printed-wiring board (PWB) 56, so that utilize sequential control wafer (not shown) and source drive wafer 58 on the printed-wiring board (PWB) 56, by soft busbar wire 60, transmit drive signal to panel of LCD 50.And, in the right side edge of lower glass substrate 52, can keep a very narrow strip zone, so that wiring (wire on array, WOA) 64 on several gate driving wafers (gatedriver IC) 62 and the array are set.These gate driving wafers 62 can be cascaded by wiring 64 on the array that is defined in lower glass substrate 52 surfaces.
Generally speaking, described gate driving wafer 62 is covering the crystal glass encapsulation technology, directly to be made on lower glass substrate 52 surfaces, so that transmit sweep signal to the pixel element array, and drive defined pixel element.As for wiring on the array 64, also be directly to be made in lower glass substrate 52 surfaces, it is distributed between each gate driving wafer 62, so that each gate driving wafer 62 is together in series.So, by the control signal that is sent to panel of LCD 50 on the printed-wiring board (PWB) 56, just can see through wiring 64 on these arrays, from head end near printed-wiring board (PWB) 56, tail end to contiguous panel of LCD 50 upper limbs transmits, and makes the gate driving wafer 62 of each serial connection all can receive control signal.
The impedance and the loading problem of being derived for wiring 64 on the gate driving wafer 62 that solves series connection and the array, a bypass winding displacement 66 can be attached at by the side of gate driving wafer 62 in the present invention, and make bypass winding displacement 66 be linked to wiring 64 on the array of gate driving wafer 62 both sides respectively, and provide an extra bypass path to above-mentioned control signal.In preferred embodiment, this bypass winding displacement 66 can select to use a flexible printed wiring board to constitute, and in the time of on being in the layout of panel of LCD 50, the profile of bypass winding displacement 66 can be designed to a softpanel structure with comb shape.This comb shape soft board as shown in FIG., be to constitute by a long transmission line and several short-term roads, the layout direction of its long transmission line is parallel to the gate driving wafer 62 of series connection, then vertical and be linked to long transmission line as for a plurality of short-term roads, and extend to the left and be linked to wiring 64 on each section array respectively by long transmission line.Thus, the comb shape design through using bypass winding displacement 66 can make all gate driving wafers 62 present state in parallel, and the impedance when signal is transmitted effectively reduces.
Wanting ben be, although in Fig. 2, bypass winding displacement 66 can link with wiring on each section array 64, and makes each gate driving wafer 62 all present state in parallel, in actual applications, and the also special circumstances of visual processing procedure and adjusting arbitrarily.Particularly for the design of some panel of LCD, the available space of its right side edge may be very limited, under this kind situation, do not need to make that wiring 64 links on bypass winding displacement 66 and each section array, and optionally allow bypass winding displacement 66 and part array on wiring 64 link.For example, please refer to Fig. 3 A～3C, show several different bypass winding displacement layout type; Bypass winding displacement 66 only can link the gate driving wafer 62 that is positioned at head, tail two ends in Fig. 3 A; In Fig. 3 B, the bypass winding displacement then only is linked to wiring 64 on the array partly; In Fig. 3 C, then utilized two bypass winding displacements 66 gate driving wafer 62 of part in parallel separately.
Then see also Fig. 4, shown among the present invention mode the wiring 64 to the array of bypass winding displacement 66 electrically connects.Generally speaking, since when wiring 64 is on lower glass substrate 52 surfaces on the making array, except the required metal tie line pattern of definition earlier, also can be at this metal tie line patterned surfaces, form a protection top layer in addition, to prevent metal binding pattern oxidation or to be short-circuited with other leads.Therefore, before linking bypass winding displacement 66, need earlier the SI semi-insulation protection top layer of coupling position to be removed, and expose part metals line 65.Then, coating one deck anisotropic conducting rubber 68 is on the surface of wiring on the array 64, pass through short circuit again with the comb shape structure of bypass winding displacement 66, push and be pasted on anisotropic conducting rubber 68 surfaces of part metals line 65 tops, certainly, for bypass winding displacement 66, the part of wiring 64 conductings on its desire and the array, also can remove the insulation top layer earlier, so that inner metal wire exposes to the open air out, thus, the part anisotropic conducting rubber of being pushed 68 will discharge conductive ion and form a conducting region 70, and makes bypass winding displacement 66 and part metals line metal connecting line 65 produce electrically connect.
What specify is, because described bypass winding displacement 66 is to be used to provide a bypass path that impedance is less, to reduce the high impedance problem of wiring 64 on the array.So except above-mentioned comb shape structure, bypass winding displacement 66 also can have other shapes, reaches the effect of above-mentioned reduction wiring impedance.For example, please refer to Fig. 5, be attached at lower glass substrate 52 lip-deep bypass winding displacements 76 and also can be a long slab structure, and on the long slab left side edge, have several inwardly rectangular indentation of retraction.When the bypass winding displacement 76 of long plate shape was attached on the panel of LCD 50, these rectangular indentation just in time can be used to hold each gate driving wafer 62.As for the part that protrude in long plate shape bypass winding displacement 76 left sides, then just in time be covered in the top of wiring on the described array.
It should be noted that as shown in Figure 5 the dotted line square 78 on the position of long slab left side protrusion has been represented the position that wiring produces electrically connect on this bypass winding displacement 76 and its array.In other words, the bypass winding displacement 76 at dotted line square 78 places will be removed its insulation top layer, district, and make it produce electrically connect with wiring on the array.Solving the another kind of way of wiring high impedance problem on the array, is with the two ends of wiring on one section array, is electrically connected at bypass winding displacement 76 simultaneously.In other words, make that wiring presents state in parallel with the bypass winding displacement 76 of its side on this section array,, provide control signal a bypass path with by the less impedance of bypass winding displacement 76.As above-mentioned, this bypass winding displacement 76 can select to use a flexible printed wiring board to constitute.
Then, please refer to Fig. 6 A, 6B, shown the relevant processing procedure that the bypass winding displacement is attached at the lower glass substrate surface.In general, because that the lower glass substrate right side edge is used for making the zone of gate driving wafer is very narrow and small, so when making bypass winding displacement 76, its flexible printed wiring board will be designed to as the situation among Fig. 6 A.Wherein, the left-hand portion of the flexible printed wiring board 80 of whole strip has one and from top to bottom traverses whole piece flexible printed wiring board stamp hole 82 end to end.Stamp hole 82 whereby, flexible printed wiring board 80 can be divided into the bypass winding displacement 76 in left side and the contraposition material 78 on right side.
As shown in Figure 6A, the contraposition material 78 on right side has sizable width compared to bypass winding displacement 76.Thus, can make things convenient for robotic arm by gripping contraposition material 78, and this flexible printed wiring board 80 is moved on the panel of LCD, and, allow bypass winding displacement 76 be pasted on gate driving wafer 62 sides by accurate contraposition and attaching program.After in case bypass winding displacement 76 is attached on the panel of LCD 50 accurately, then can be along above-mentioned stamp hole 82, unnecessary contraposition material 78 is torn it down, and form as the situation among Fig. 5, certainly, the contraposition when attaching bypass winding displacement 76 makes things convenient for, be positioned at the contraposition material 78 on stamp hole 82 right sides, the cutting of also can going ahead of the rest along with the needs of processing procedure for example in Fig. 6 B, has promptly shown the situation that part contraposition material 78 is cut away.
Though the present invention discloses as above with preferred embodiment, right its is not in order to limit the present invention, for example, in the above-described embodiments, though be that gate driving wafer with chip package (COG) is used as explanation, any those who are familiar with this art, when understanding any other easily with the wafer of chip package setting or the wafer that links in the mode of connecting, all can utilize mode of the present invention that the signal bypass path is provided or form conducting wire framework in parallel, and reach Low ESR, prevent the purpose of signal attenuation.So any change and the retouching done without departing from the spirit and scope of the invention all should be included in of the present invention looking in the scope that claims scope defined.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02142688 CN1243273C (en) | 2002-09-17 | 2002-09-17 | Method for manufacturing glass substrate and display panel by using bypass cable, and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02142688 CN1243273C (en) | 2002-09-17 | 2002-09-17 | Method for manufacturing glass substrate and display panel by using bypass cable, and display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1484067A true CN1484067A (en) | 2004-03-24 |
| CN1243273C CN1243273C (en) | 2006-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02142688 Expired - Fee Related CN1243273C (en) | 2002-09-17 | 2002-09-17 | Method for manufacturing glass substrate and display panel by using bypass cable, and display panel |
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| Country | Link |
|---|---|
| CN (1) | CN1243273C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157250A (en) * | 2014-07-25 | 2014-11-19 | 京东方科技集团股份有限公司 | Display device and manufacture method thereof |
| CN105242466A (en) * | 2015-10-27 | 2016-01-13 | 南京中电熊猫液晶显示科技有限公司 | A liquid crystal display panel |
| CN107608103A (en) * | 2017-10-26 | 2018-01-19 | 惠科股份有限公司 | Display panel and display device using same |
| CN107765483A (en) * | 2017-10-26 | 2018-03-06 | 惠科股份有限公司 | Display panel and display device for its application |
| CN107783344A (en) * | 2017-10-26 | 2018-03-09 | 惠科股份有限公司 | Display panel and display device using same |
-
2002
- 2002-09-17 CN CN 02142688 patent/CN1243273C/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157250A (en) * | 2014-07-25 | 2014-11-19 | 京东方科技集团股份有限公司 | Display device and manufacture method thereof |
| CN105242466A (en) * | 2015-10-27 | 2016-01-13 | 南京中电熊猫液晶显示科技有限公司 | A liquid crystal display panel |
| CN107608103A (en) * | 2017-10-26 | 2018-01-19 | 惠科股份有限公司 | Display panel and display device using same |
| CN107765483A (en) * | 2017-10-26 | 2018-03-06 | 惠科股份有限公司 | Display panel and display device for its application |
| CN107783344A (en) * | 2017-10-26 | 2018-03-09 | 惠科股份有限公司 | Display panel and display device using same |
| WO2019080291A1 (en) * | 2017-10-26 | 2019-05-02 | 惠科股份有限公司 | Display panel and display device applying same |
| WO2019080290A1 (en) * | 2017-10-26 | 2019-05-02 | 惠科股份有限公司 | Display panel and display device applying same |
| WO2019080293A1 (en) * | 2017-10-26 | 2019-05-02 | 惠科股份有限公司 | Display panel and display device applying same |
| CN107783344B (en) * | 2017-10-26 | 2020-07-10 | 惠科股份有限公司 | Display panel and display device using same |
| CN107608103B (en) * | 2017-10-26 | 2020-07-10 | 惠科股份有限公司 | Display panel and display device using same |
| US11145681B2 (en) | 2017-10-26 | 2021-10-12 | HKC Corporation Limited | Display panel and display device applying the same |
| US11300839B2 (en) | 2017-10-26 | 2022-04-12 | HKC Corporation Limited | Display panel and display device applying the same |
| US11532644B2 (en) | 2017-10-26 | 2022-12-20 | HKC Corporation Limited | Display panel and display device applying the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1243273C (en) | 2006-02-22 |
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