CN1483660A - A Micro Piezoelectric Actuator for MEMS - Google Patents
A Micro Piezoelectric Actuator for MEMS Download PDFInfo
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Abstract
本发明公开了属于微电子机械领域的一种能产生大偏转角度和垂直位移的用于MEMS的微型压电驱动器。驱动器结构为悬浮的折叠形压电复合多层膜弹性驱动臂,它具有至少两段或两段以上并列的压电驱动臂,悬浮结构两侧的驱动臂与衬底相连。在每段压电复合多层膜弹性驱动臂中含有弹性层及其上面的压电复合薄膜,在邻近平行的不同驱动臂上的压电薄膜的上、下电极施加相反极性驱动电压时,并列的相邻各段压电驱动臂发生相反方向的弯曲,由于折叠结构的连接方式,位于悬浮结构中部的驱动臂上具有最大垂直位移或偏转角度。本发明可减少微电机械系统中驱动结构的长度,具有较大的驱动力。其结构简单,器件可靠性高,工艺简单,易加工,较高的制造成品率,适合批量生产。在各种微电子机械器件和系统中具有重要价值。
The invention discloses a micro piezoelectric driver for MEMS which can produce large deflection angle and vertical displacement and belongs to the field of micro-electronic machinery. The driver structure is a suspended folded piezoelectric composite multilayer film elastic driving arm, which has at least two or more parallel piezoelectric driving arms, and the driving arms on both sides of the suspended structure are connected to the substrate. Each segment of the piezoelectric composite multilayer elastic driving arm contains the elastic layer and the piezoelectric composite film on it. When the opposite polarity driving voltage is applied to the upper and lower electrodes of the piezoelectric film on the adjacent parallel different driving arms, Adjacent sections of piezoelectric driving arms that are paralleled bend in opposite directions. Due to the connection mode of the folded structure, the driving arm located in the middle of the suspension structure has the largest vertical displacement or deflection angle. The invention can reduce the length of the driving structure in the micro-electric mechanical system, and has greater driving force. It has the advantages of simple structure, high device reliability, simple process, easy processing, high manufacturing yield, and is suitable for mass production. It is of great value in various microelectromechanical devices and systems.
Description
技术领域technical field
本发明属于微电子机械领域,特别涉及一种用于MEMS的微型压电驱动器。The invention belongs to the field of micro-electronic machinery, in particular to a micro piezoelectric driver for MEMS.
背景技术Background technique
微电子机械系统(MicroElectroMachanical System),简称MEMS。是微型化、集成化,智能化、信息化、先进制造等高新技术领域的前沿科学。MEMS是以先进的半导体工艺和集成电路制造技术为基础,拓宽了在微芯片上制造复杂电子机械系统的方法。这些方法将大规模集成电路制造技术和微机械加工技术独有的特殊工艺的相结合,集微型机械结构、微型执行器、微电子器件和电路系统于一体,形成所谓的片上系统(SOC)。整个MEMS从设计到制造,涉及到众多学科,以及计算机技术、通信技术、微电子技术、自动控制技术、机械设计与制造等多种技术学科,可以说是一门多学科交叉的综合技术。涉及的产品主要包括微型传感器、微型执行器、微光学系统、RF射频系统、微生物芯片、微流体器件、立体集成电路等复杂的微系统,已有相当多的MEMS商品化产品出现。广泛应用于工业、军事、生物、医学等行业。Micro Electro Mechanical System (MicroElectroMachanical System), referred to as MEMS. It is the cutting-edge science in high-tech fields such as miniaturization, integration, intelligence, informatization, and advanced manufacturing. MEMS is based on advanced semiconductor technology and integrated circuit manufacturing technology, which broadens the method of manufacturing complex electromechanical systems on microchips. These methods combine the large-scale integrated circuit manufacturing technology and the unique special process of micromachining technology, and integrate micromechanical structures, microactuators, microelectronic devices and circuit systems to form a so-called system on chip (SOC). The entire MEMS involves many disciplines from design to manufacture, as well as computer technology, communication technology, microelectronics technology, automatic control technology, mechanical design and manufacturing and other technical disciplines. It can be said to be a multidisciplinary comprehensive technology. The products involved mainly include complex microsystems such as microsensors, microactuators, microoptical systems, RF radio frequency systems, microbial chips, microfluidic devices, and three-dimensional integrated circuits. Quite a number of MEMS commercial products have appeared. Widely used in industry, military, biology, medicine and other industries.
目前MEMS器件采用静电、电磁、热、压电等原理实现驱动。利用这些原理的已有的微执行结构大多具有较大驱动器尺寸、占用较多的芯片面积,而实现的驱动位移和偏转量却有限,制作工艺复杂,可靠性不高,功耗大,寿命短。在已受到广泛研究的MEMS压电薄膜驱动方式中大多采用悬臂梁结构,由于压电薄膜的伸长量有限,因此悬臂梁结构上的最大偏转位移非常有限,这种特点限制了压电驱动方式在MEMS领域的广泛应用,造成目前极少有采用压电薄膜驱动的成熟MEMS商品化器件出现。这种悬臂驱动结构要实现大的垂直位移或偏转,要求加长梁的长度和增大驱动电压,这样就一方面增加了由重力引起的悬臂梁静态偏转量,致使未加电压时,悬臂即有较大偏转位移,严重限制它的应用范围。另一方面这种长的直悬臂梁驱动结构使驱动器的机械强度显著降低,工作中容易产生抖动现象,且极易受冲击折断。另外,这种长的单悬臂驱动结构增加了悬臂本身的惯性影响,使驱动器的工作频率降低,不适应许多工作频率较高的应用场合。同时,大的驱动电压极易造成压电薄膜击穿,对压电薄膜的质量提出较高的要求,增加压电薄膜淀积的工艺难度。给压电薄膜带来许多附加效应,并增加了相应电子电路的复杂性。并且在制造方面,显著增加制造的复杂性、降低微机械加工的成品率,过长的驱动器长度,也使其很难适应在一些微结构器件或器件阵列中的应用。这些都严重限制了悬臂梁压电驱动器在微电子机械器件和系统中的应用。At present, MEMS devices are driven by electrostatic, electromagnetic, thermal, piezoelectric and other principles. Most of the existing micro-execution structures using these principles have a large driver size and occupy a large chip area, but the realized driving displacement and deflection are limited, the manufacturing process is complicated, the reliability is not high, the power consumption is large, and the life is short . Most of the MEMS piezoelectric film drive methods that have been widely studied use a cantilever beam structure. Due to the limited elongation of the piezoelectric film, the maximum deflection displacement on the cantilever beam structure is very limited. This characteristic limits the piezoelectric drive method. The wide application in the field of MEMS has resulted in the emergence of very few mature MEMS commercial devices driven by piezoelectric thin films. To achieve large vertical displacement or deflection of this kind of cantilever driving structure, it is required to lengthen the length of the beam and increase the driving voltage, which increases the static deflection of the cantilever beam caused by gravity on the one hand, so that when no voltage is applied, the cantilever will have The large deflection displacement seriously limits its application range. On the other hand, this long straight cantilever beam drive structure significantly reduces the mechanical strength of the drive, which is prone to vibration during work and is extremely vulnerable to impact and breakage. In addition, this long single cantilever drive structure increases the inertial influence of the cantilever itself, which reduces the operating frequency of the drive and is not suitable for many applications with high operating frequency. At the same time, a large driving voltage can easily cause breakdown of the piezoelectric film, which puts higher requirements on the quality of the piezoelectric film and increases the difficulty of the piezoelectric film deposition process. This brings many additional effects to the piezoelectric film and increases the complexity of the corresponding electronic circuit. And in terms of manufacturing, the complexity of manufacturing is significantly increased, the yield of micromachining is reduced, and the length of the driver is too long, which also makes it difficult to adapt to the application in some microstructure devices or device arrays. These severely limit the application of cantilever piezoelectric actuators in microelectromechanical devices and systems.
发明内容Contents of the invention
本发明的目的是提供一种用于MEMS的微型压电驱动器,其特征在于:所述微型压电驱动器采用折叠形多级压电复合多层弹性悬浮薄膜结构,即是由弹性结构层形成连续的折叠形并列臂,在每段折叠臂的弹性结构层上从下至上覆盖有缓冲层、互相不连接的下薄膜电极层、具有一定形状的压电薄膜层及上薄膜电极层复合叠加而成,还可以在上电极薄膜层表面覆盖一层绝缘介质层;在每段折叠臂上形成了利用压电效应的驱动臂,驱动臂的一侧或两侧与衬底相连为固定端;并在邻近平行的不同驱动臂上的压电薄膜的上、下电极施加相反极性的驱动电压,用于使邻近驱动臂由于压电薄膜的横向伸长效应而伸长,但整个由压电复合多层薄膜材料构成的驱动臂却只能伴随着压电薄膜的伸长而发生弯曲,从而造成每个驱动臂的弯曲,由于相邻驱动臂所加电压相反,因此相邻驱动臂向相反方向偏转。在每个驱动臂的端部产生最大垂直位移,并且垂直驱动位移和偏转角度向远离固定端的方向逐级叠加,从而在较低的应用电压下可获得较大的垂直位移;当撤除所加电压后,由于折叠形悬浮驱动臂内含有弹性材料,驱动臂在弹性力作用下又恢复原状。The object of the present invention is to provide a micro piezoelectric actuator for MEMS, which is characterized in that: the micro piezoelectric actuator adopts a folded multi-stage piezoelectric composite multilayer elastic suspension film structure, that is, it is formed by an elastic structure layer. The folded side-by-side arms of each folded arm are covered from bottom to top with a buffer layer, a lower film electrode layer that is not connected to each other, a piezoelectric film layer with a certain shape, and an upper film electrode layer. , a layer of insulating dielectric layer can also be covered on the surface of the upper electrode film layer; a driving arm using piezoelectric effect is formed on each folded arm, and one or both sides of the driving arm are connected to the substrate as a fixed end; and Driving voltages of opposite polarities are applied to the upper and lower electrodes of the piezoelectric films on different adjacent parallel driving arms, which are used to make the adjacent driving arms elongate due to the transverse elongation effect of the piezoelectric film, but the whole is composed of piezoelectric composite multiple The driving arm made of a layer of thin film material can only bend along with the elongation of the piezoelectric film, resulting in the bending of each driving arm. Since the voltage applied to the adjacent driving arms is opposite, the adjacent driving arms deflect in the opposite direction. . The maximum vertical displacement is generated at the end of each driving arm, and the vertical driving displacement and deflection angle are superimposed step by step in the direction away from the fixed end, so that a larger vertical displacement can be obtained at a lower applied voltage; when the applied voltage is removed Finally, due to the elastic material contained in the folded suspension driving arm, the driving arm returns to its original shape under the action of elastic force.
所述折叠形压电复合多层膜弹性悬浮驱动臂分为一种有两个固定端和另一种只有一个固定端的形式,且可以形成轴对称结构或形成中心对称结构。The folded piezoelectric composite multilayer film elastic suspension drive arm is divided into a form with two fixed ends and a form with only one fixed end, and can form an axisymmetric structure or a central symmetric structure.
所述并列的驱动臂的数目可以为等于或大于二的整数。The number of parallel driving arms may be an integer equal to or greater than two.
所述的压电薄膜为PZT、PLZT、ZnO、AlN、PVDF中的一种压电材料或由一种以上的压电材料复合成多层压电薄膜、或压电薄膜与预先淀积的压电种子层的复合膜。The piezoelectric film is a piezoelectric material in PZT, PLZT, ZnO, AlN, PVDF, or a multilayer piezoelectric film composed of more than one piezoelectric material, or a piezoelectric film and a pre-deposited piezoelectric film. Composite membrane with electron seed layer.
所述折叠形弹性薄膜为单晶硅、多晶硅、二氧化硅、非晶硅、氮化硅、或一种以上弹性材料的复合层膜。The folded elastic film is monocrystalline silicon, polycrystalline silicon, silicon dioxide, amorphous silicon, silicon nitride, or a composite film of more than one elastic material.
本发明的有益效果是采用一种折叠形压电复合多层膜弹性悬浮驱动臂实现了大的垂直位移或偏转驱动。缩短了驱动器的长度,使其在一些应用中可大幅度节省器件面积;降低了驱动电压;提高了驱动器的工作频率,具有很好的器件驱动性能。同时,其结构简单,具有很高的器件可靠性,工艺简单,易加工,有较高的制造成品率,适合批量生产。The beneficial effect of the invention is that a large vertical displacement or deflection drive is realized by adopting a folded piezoelectric composite multi-layer elastic suspension drive arm. The length of the driver is shortened, so that it can greatly save the device area in some applications; the driving voltage is reduced; the operating frequency of the driver is increased, and it has good device driving performance. At the same time, it has simple structure, high device reliability, simple process, easy processing, high manufacturing yield, and is suitable for mass production.
附图说明:Description of drawings:
图1为悬浮的折叠形压电复合多层膜弹性驱动臂剖面图。Figure 1 is a cross-sectional view of a suspended folded piezoelectric composite multilayer elastic driving arm.
图2为一种三驱动臂轴对称驱动结构示意图。Fig. 2 is a schematic diagram of an axisymmetric driving structure of three driving arms.
图3为一种四驱动臂轴对称驱动结构示意图。Fig. 3 is a schematic diagram of an axisymmetric driving structure of four driving arms.
图4为一种五驱动臂轴对称驱动结构示意图。Fig. 4 is a schematic diagram of an axisymmetric driving structure with five driving arms.
图5为一种二驱动臂中心对称驱动结构示意图。Fig. 5 is a schematic diagram of a centrosymmetric driving structure with two driving arms.
图6为一种二驱动臂非对称驱动结构示意图。Fig. 6 is a schematic diagram of an asymmetric driving structure with two driving arms.
具体实施方式Detailed ways
本发明为一种用于MEMS的微型压电驱动器。该微型压电驱动器采用折叠形多级压电复合多层弹性悬浮薄膜结构,即是在衬底硅片1上形成连续的折叠形并列臂9,每个臂9的弹性硅衬底层1上从下至上覆盖有缓冲层4、互相不连接的下薄膜电极层5、具有一定形状的压电薄膜6及上薄膜电极层7复合叠加而成,还可以覆盖一层绝缘介质层8在上电极薄膜7表面;下薄膜电极层5和下电极引线2相接,上薄膜电极层7和上电极引线3相接(如图1所示);在每段折叠臂上形成了利用压电效应的驱动臂,驱动结构的一侧或两侧与衬底相连为固定端;并在邻近平行的不同驱动臂上的压电薄膜的上、下电极上施加相反极性驱动电压,于是使邻近驱动臂由于压电薄膜的横向伸长效应而伸长,但整个由压电复合多层薄膜材料构成的驱动臂却只能伴随着压电薄膜的伸长而发生弯曲,从而造成每个驱动臂的弯曲,由于相邻驱动臂所加电压相反,因此相邻驱动臂向相反方向偏转。在每个驱动臂的端部产生最大垂直位移,并且垂直驱动位移和偏转角度向远离固定端的方向逐级叠加,从而在较低的应用电压下可获得较大的垂直位移。当撤除所加电压后,由于折叠形悬浮驱动臂内含有弹性材料,驱动臂在弹性力作用下又恢复原状。The invention is a micro piezoelectric driver for MEMS. The micro-piezoelectric driver adopts a folded multi-stage piezoelectric composite multi-layer elastic suspended film structure, that is, a continuous folded parallel arm 9 is formed on the substrate silicon chip 1, and each arm 9 is formed from the elastic silicon substrate layer 1. Covered with a buffer layer 4 from bottom to top, a lower film electrode layer 5 that is not connected to each other, a
上述折叠形压电复合多层膜弹性悬浮驱动臂分为一种有两个固定端和另一种只有一个固定端的形式,且可以形成轴对称结构,也可以形成中心对称结构。并列的驱动臂的数目可以为等于或大于二的数目(如图2、图3、图4、图5、图6所示)。The above-mentioned folded piezoelectric composite multi-layer elastic suspension drive arm is divided into a form with two fixed ends and a form with only one fixed end, and can form an axisymmetric structure or a centrosymmetric structure. The number of parallel driving arms may be equal to or greater than two (as shown in FIG. 2 , FIG. 3 , FIG. 4 , FIG. 5 , and FIG. 6 ).
所述的压电薄膜为PZT、PLZT、ZnO、AlN、PVDF中的一种压电材料或由一种以上的压电材料复合成多层压电薄膜、或压电薄膜与预先淀积的压电种子层的复合膜。The piezoelectric film is a piezoelectric material in PZT, PLZT, ZnO, AlN, PVDF, or a multilayer piezoelectric film composed of more than one piezoelectric material, or a piezoelectric film and a pre-deposited piezoelectric film. Composite membrane with electron seed layer.
所述折叠形弹性薄膜为单晶硅、多晶硅、二氧化硅、非晶硅、氮化硅、或一种以上弹性材料的复合层膜。The folded elastic film is monocrystalline silicon, polycrystalline silicon, silicon dioxide, amorphous silicon, silicon nitride, or a composite film of more than one elastic material.
实现本专利的微型压电驱动结构有多种工艺方法。下面仅阐述其中一种方法流程予以说明:先使用双面抛光衬底硅片1,双面热氧化后淀积氮化硅,背面光刻结构窗口,刻蚀掉氮化硅,漂去露出的热氧化层,利用KOH或TMAH等各向异性腐蚀液进行体硅腐蚀,形成硅薄膜、然后去掉两面的氮化硅和热氧化层,重新生长适当厚度的热氧化薄膜作为缓冲层4,在正面进行PZT(锆钛酸铅)复合多层薄膜的制作工艺,在正面依次淀积下电极层5,压电薄膜6,上电极层7,并采用物理或化学刻蚀工艺,依次刻蚀出上电极3、下电极2和缓冲层4,最后淀积绝缘介质膜8,再采用物理或化学刻蚀工艺刻蚀上下电极引线孔,淀积金属并刻蚀连线。随后光刻并采用各向异性刻蚀工艺刻蚀硅膜,释放悬浮结构,形成驱动结构。在本方法实例中,下电极由钛/铂复合层构成,压电薄膜由压电种子层PbTiO3与PZT复合层构成,上电极由钛/铂或铂构成。There are many techniques for realizing the miniature piezoelectric driving structure of this patent. The following describes only one of the method flow for illustration: first use double-sided polishing substrate silicon wafer 1, deposit silicon nitride after double-sided thermal oxidation, and photolithographic structure window on the back, etch away silicon nitride, and float away the exposed Thermal oxide layer, use anisotropic etching solution such as KOH or TMAH to etch the bulk silicon to form a silicon film, then remove the silicon nitride and thermal oxide layers on both sides, and re-grow a thermal oxide film of appropriate thickness as a buffer layer 4, on the front Carry out the manufacturing process of PZT (lead zirconate titanate) composite multilayer film, deposit the lower electrode layer 5, the
在本结构的其它实现实例中,压电薄膜也可由其它材料构成,如PLZT、ZnO、AlN、PVDF等各种压电材料或由多种压电材料构成的复合多层压电薄膜及为淀积压电材料或改善压电材料性能而预先淀积的相关压电种子层。折叠形弹性薄膜材料也可能为其它各种弹性材料,如单晶硅、多晶硅、二氧化硅、非晶硅、氮化硅、或多种弹性材料的复合多层膜等。这种结构可使用MEMS表面微加工工艺和MEMS体加工工艺相结合的方法实现。In other implementation examples of this structure, the piezoelectric film can also be made of other materials, such as various piezoelectric materials such as PLZT, ZnO, AlN, PVDF, etc., or composite multilayer piezoelectric films composed of multiple piezoelectric materials and deposited Piezoelectric materials or pre-deposited related piezoelectric seed layers to improve the performance of piezoelectric materials. The folded elastic film material may also be various other elastic materials, such as monocrystalline silicon, polycrystalline silicon, silicon dioxide, amorphous silicon, silicon nitride, or composite multilayer films of various elastic materials. This structure can be realized by combining MEMS surface micromachining technology and MEMS body processing technology.
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| CN (1) | CN1211275C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7432208B2 (en) | 2006-06-21 | 2008-10-07 | Touch Micro-System Technology Inc. | Method of manufacturing suspension structure |
| CN101103515B (en) * | 2005-01-07 | 2010-10-13 | 波士顿大学托管委员会 | nanomechanical oscillator |
| CN101093966B (en) * | 2006-06-23 | 2010-12-22 | 株式会社东芝 | Piezoelectrically Driven MEMS Devices |
| CN101594069B (en) * | 2009-06-23 | 2011-07-27 | 南京航空航天大学 | Fold-shaped compound piezoelectric energy converting structure |
| CN103091835A (en) * | 2013-02-05 | 2013-05-08 | 无锡微奥科技有限公司 | Vertical large displacement micro-electromechanical system (MEMS) micromirror and processing technology |
| CN109844609A (en) * | 2016-10-19 | 2019-06-04 | 索尼半导体解决方案公司 | Semiconductor devices, display device and electronic equipment |
| CN110932594A (en) * | 2019-11-15 | 2020-03-27 | 河南大学 | Self-driven novel elastic actuating mechanism based on micro electro mechanical system |
| CN114735179A (en) * | 2022-04-24 | 2022-07-12 | 南京航空航天大学 | Imitative cuttlefish wave fin based on piezoelectric fiber composite drive |
| CN115608428A (en) * | 2021-07-12 | 2023-01-17 | 研能科技股份有限公司 | microfluidic components |
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2003
- 2003-08-15 CN CN03153522.4A patent/CN1211275C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101103515B (en) * | 2005-01-07 | 2010-10-13 | 波士顿大学托管委员会 | nanomechanical oscillator |
| US7432208B2 (en) | 2006-06-21 | 2008-10-07 | Touch Micro-System Technology Inc. | Method of manufacturing suspension structure |
| CN101093966B (en) * | 2006-06-23 | 2010-12-22 | 株式会社东芝 | Piezoelectrically Driven MEMS Devices |
| CN101594069B (en) * | 2009-06-23 | 2011-07-27 | 南京航空航天大学 | Fold-shaped compound piezoelectric energy converting structure |
| CN103091835A (en) * | 2013-02-05 | 2013-05-08 | 无锡微奥科技有限公司 | Vertical large displacement micro-electromechanical system (MEMS) micromirror and processing technology |
| CN103091835B (en) * | 2013-02-05 | 2015-04-15 | 无锡微奥科技有限公司 | Vertical large displacement micro-electromechanical system (MEMS) micromirror and processing technology |
| CN109844609A (en) * | 2016-10-19 | 2019-06-04 | 索尼半导体解决方案公司 | Semiconductor devices, display device and electronic equipment |
| JPWO2018074084A1 (en) * | 2016-10-19 | 2019-08-08 | ソニーセミコンダクタソリューションズ株式会社 | Semiconductor device, display device and electronic equipment |
| CN109844609B (en) * | 2016-10-19 | 2021-11-19 | 索尼半导体解决方案公司 | Semiconductor device, display device, and electronic apparatus |
| CN110932594A (en) * | 2019-11-15 | 2020-03-27 | 河南大学 | Self-driven novel elastic actuating mechanism based on micro electro mechanical system |
| CN115608428A (en) * | 2021-07-12 | 2023-01-17 | 研能科技股份有限公司 | microfluidic components |
| CN114735179A (en) * | 2022-04-24 | 2022-07-12 | 南京航空航天大学 | Imitative cuttlefish wave fin based on piezoelectric fiber composite drive |
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| CN1211275C (en) | 2005-07-20 |
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