CN1470922B - Substrate assembling device and substrate assembling method - Google Patents

Abstract

In order to facilitate maintenance and inspection in a decompression chamber for gluing large-sized substrates and to achieve high-precision gluing, an assembly apparatus for gluing 2 substrates in a decompressed state is divided into an upper chamber and a lower chamber, an upper table detachably holding one substrate in the upper chamber and a lower table detachably holding the other substrate in the lower chamber are provided to face the substrates held by the upper chamber, the upper table has a driving mechanism for moving the upper table and the upper chamber up and down independently from each other on the outer side of the upper chamber, the lower table is integrally coupled to the lower chamber, and the lower chamber has a driving mechanism for moving the upper chamber at least in a horizontal direction on the outer side of the lower chamber.

Description

Substrate assembly device and substrate assembly method

technical field

The present invention relates to a substrate gluing device, in particular to a substrate assembling device suitable for assembling liquid crystal display panels etc. which are bonded with each other in a decompression chamber and held and opposed to each other with a narrow gap.

Background technique

As a conventional manufacturing apparatus of a liquid crystal display panel, it describes in Unexamined-Japanese-Patent No. 10-26763. In this publication, liquid crystal is coated on one side of two glass substrates provided with a transparent electrode or a thin film transistor matrix (transistor array), and then, after distributing and disposing spacers, the other side is moved by a pin having an up-and-down mechanism. The substrate is placed on the top, and after positioning the substrate with the positioning pins provided in the left and right directions of the device, the cavity is vacuumed, and after overlapping the substrates, the positioning is performed again, and the pressure in the cavity is returned to the atmospheric pressure side to perform bonding. .

In addition, Japanese Patent Application Laid-Open No. 2001-305563 discloses a structure in which, in an integrally constructed vacuum chamber, there are a first table surface on which either one of the two substrates is detachably held on the upper or lower surface, and The other side of the two substrates is detachably held on the lower or upper second platform. Moreover, the upper and lower surfaces of the mesas holding the respective substrates are arranged oppositely, one of the two mesas is airtightly and movably combined with the vacuum chamber through the elastic body, and the one of the mesas is in the atmosphere of the vacuum chamber divided by the aforementioned elastic body. side, with a drive device that moves at least in a horizontal direction relative to the vacuum chamber.

In addition, JP-A-2001-5401 discloses a substrate assembly device in which a chamber is divided into upper and lower chambers, and a lower chamber is provided with a conveyance of a substrate and a liquid crystal dropping device.

In the above-mentioned Japanese Patent Laid-Open No. 10-26763, the pressurization of the substrates is carried out only by using the air pressure difference between the substrates and the outside of the substrates. In this case, the sealing material between the substrates must be filled to the state between the upper and lower substrates. . Therefore, a large amount of sealing material must be used, and there is a possibility that the sealing material may be extended to the display portion side. In addition, for the holding of the substrate in vacuum, the substrate on the lower side is placed on a flat stage, and the substrate on the upper side is supported by a pin-shaped member at an appropriate position on the periphery, so the length of 1m for a large substrate is In the case of a large board with a diameter of more than 1m, warpage occurs, making it difficult to determine the correct position of the upper and lower boards.

In addition, since the upper and lower substrates are directly transferred into the vacuum chamber, it takes time for the chamber to be evacuated from atmospheric pressure to vacuum after the transfer, so there is a problem that productivity cannot be improved.

In addition, in the configuration of JP-A-2001-305563, since the upper and lower tables are arranged in an integrated vacuum chamber, if the substrate is damaged in the chamber, or the surface of the table is contaminated by substances attached to the substrate, In this case, there is a problem that it is difficult to clean the table inside the chamber. In addition, the elevating mechanism that lifts the substrate in order to take out the glued substrate, or the mechanism that temporarily fixes the substrate to prevent displacement, or the mark recognition mechanism or lighting mechanism for positioning the substrate, is fixed to the integrally formed vacuum chamber or vacuum chamber. The side of the construct outside the cavity. However, since the vacuum chamber and the lower table are relatively moved during positioning, there is a problem that the size of the elevating mechanism, temporary fixing, identification or positioning grooves or holes provided on the lower table becomes large. If the size of the holes or grooves provided on the table is too large, local pressure changes will occur when the substrate is positioned and pressurized, and the adhesive may not be evenly applied.

In addition, in the conventional device having two divided chambers, the lower table and the lower chamber are not integrated, but there is a seal between the table and the chamber, and the lower table can freely rotate relative to the lower chamber. Therefore, since the positioning of the substrate is to move the entire chamber in the XY direction, and the movement in the θ direction is to move the substrate mounting table, the sealing structure is two positions between the upper and lower chambers and between the lower table and the lower chamber. From the viewpoint of airtight maintenance, there are cases where problems arise.

Contents of the invention

Therefore, an object of the present invention is to provide a highly productive substrate gluing apparatus that can perform high-precision and high-speed gluing even if the substrate is enlarged.

In order to achieve the above object, the present invention is a substrate gluing device for gluing two substrates in a chamber under reduced pressure. The first table that is detachably fixed and the second table that is detachably fixed to the other substrate in the lower chamber are provided opposite to the respective substrates. As for the drive mechanism for moving up and down in the cavity, the aforementioned second platform is integrally combined with the lower cavity, and on the atmospheric side of the aforementioned lower cavity, there is a driving device that moves slightly in the horizontal direction at least relative to the upper cavity.

Description of drawings

FIG. 1 is a diagram showing the configuration of a substrate assembly apparatus according to an embodiment of the present invention.

Fig. 2 is a diagram showing a connection mechanism for connecting and moving an upper chamber and a pressurized base plate.

Fig. 3 is a diagram showing an example of a cross-sectional shape of a seal ring between an upper chamber and a lower chamber.

Detailed ways

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, the substrate assembly apparatus is composed of a lower chamber T1 and an upper chamber T2. On the upper chamber T2 part, the upper table top 2 is vertically movably attached via the support legs 3 and the plurality of adjustment legs 4 penetrating the upper chamber T2. The supporting leg 3 passes through the O-ring 5 , and the adjusting leg 4 passes through the welded bellows 6 to block the inside of the upper chamber T2 from communicating with the atmosphere. The supporting legs 3 and the adjusting legs 4 of the upper platform 2 are fixed on the press base plate 7 .

And, the central portion of this pressurized base plate 7 is fixed to the intermediate base plate 8 . The structure of the intermediate base plate 8 is such that by actuating the drive mechanism composed of the drive motor 10, the speed reducer 11, and the ball screw 12 installed on the top frame 9, the ball spline guide mechanism 13 is used as a guide device, and it can be moved up and down. move. In addition, on the stand 1, the top frame 9 is supported by a support column provided separately from the ball spline guide mechanism. The other end side of each adjustment leg 4 whose one end is fixed to the pressure base plate 7 is connected to a ball screw 15 driven by a drive motor 14 mounted on the intermediate base plate 8 . By driving the vertical adjustment mechanism composed of the drive motor 14 and the ball screw 15, by applying a force to the press base plate 7, the upper table 2 can move up and down while maintaining the flatness.

An example of a mechanism for driving the upper chamber T2 is shown in FIG. 2 . In the upper chamber T2, a connection mechanism for the upper table 2 composed of a rod 51 driven by a cylinder 50 and a T-shaped connection member 52 is provided. The press base plate 7 is provided with a through hole through which the connecting member 52 can be moved up and down. In the state where the pressurized base plate 7 is lowered, if the rod 51 is inserted between the T-shaped connecting part 52 and the top of the pressurized base plate 7 to lift the pressurized base plate 7, the upper chamber T2 can also be moved upward together. constituted by movement. In addition, the upper chamber T2 also uses the ball spline guide 13 as a guide so that it can move up and down, and is attached in a nearly rigid form in the front, rear, left, and right (horizontal direction). One end of the ball spline 13 is fixed on the device stand 1 . That is, in order to move the upper chamber T2, the upper table 2 and the upper chamber T2 can be moved up and down together by the connection mechanism.

In addition, in the chamber, a gate valve 16 for carrying in and carrying out substrates is provided on the lateral outer wall side of the upper chamber T2. Moreover, on the side wall of the upper chamber opposite to the gate valve 16, an ion generator 17 that can remove static electricity from the substrate is provided by blowing ionized ultrasonic air onto the surface of the substrate. In addition, an ion generator 17a is also provided near the gate valve 16 outside the chamber. According to this, when the gate valve is opened, ionized air can be blown to improve the effect of dissipating electricity on the substrate. In addition, although the ion generator 17 in the chamber is installed in the upper chamber T2, of course, it only needs to blow the ion wind onto the substrate surface, and it can also be installed in the lower chamber T1. The substrate is carried in from the gate valve 16, and the liquid crystal panel is carried out after gluing.

On the upper outer wall of the upper chamber T2, a plurality of sleeve-structured secondary guides 18 are provided so that the central shaft 19 protrudes into the chamber. This center shaft 19 engages with a hole formed in a protrusion provided on the outer periphery of the upper table 2, and the horizontal direction of the upper table 2 can be adjusted. That is, the sub-guide 18 and the center shaft 19 operate as the level adjustment mechanism of the upper table 2 . In this way, the horizontal position of the upper table 2 can also be finely adjusted, and the positioning of the substrate can be facilitated, and the pressing force applied to the substrate can be equalized.

In the upper chamber T2, a plurality of observation holes for substrate mark observation are provided at the lower end of the convex window frame inside the chamber. The lens 21 of the camera is inserted into the window frame for observation, and the mark provided on the substrate is confirmed by the camera. The lens 21 of the camera is arranged on a movable stage having a moving axis in the horizontal direction (X, Y direction) and a moving axis in the vertical direction (Z direction), and the moving stage is fixed on the upper cavity T2. In addition, on the upper side table 2, a hole for substrate mark recognition is provided at a position corresponding to the above-mentioned observation hole.

In this embodiment, although the camera is arranged outside the chamber, by directly installing the camera on the upper table 2, there is no need for an observation hole, and in addition to improving the airtightness of the chamber, , It is also possible to arrange the camera close to the substrate to improve the accuracy of marking recognition based on the camera, thereby improving the positioning accuracy between the substrates.

Furthermore, a load cell 22 is provided between the intermediate base of the support leg 3 and the ball screw in order to measure the pressing force on the substrate. In addition, when adjusting the flatness of the upper table, since it is necessary to monitor that the motor 14 driving each adjustment leg 4 will not be overloaded, load sensors 23 are respectively provided on each adjustment leg on the press base plate 7 .

The lower table 24 is fixed in the lower chamber T1. If the entire surface of the lower table 24 is bonded and fixed to the lower chamber, when the lower chamber T1 is deformed during decompression, the deformation may be transmitted to the lower table as it is, causing a deviation in flatness. Therefore, in order not to be affected by the deformation of the lower chamber T1, only the peripheral portion of the lower table is fixed to the lower chamber. In addition, a seal ring 25 to be described later is disposed on the entire circumference of the lower chamber T1. The upper chamber T2 is in contact with the sealing ring 25, and when the gate valve 16 is closed, its interior is sealed to form a decompression chamber.

The lower chamber T1 is provided on a θ base table 28 configured to be rotationally driven by a motor 26 , a ball screw (not shown), and a rotary bearing 27 . A predetermined space can be ensured by interposing a box-shaped member in the connection between the θ base table 28 and the lower chamber T1. This space is provided for installing the UV irradiation mechanism 40, the substrate holding claw lifting mechanism 41, and the substrate lifting mechanism 43 on the lower side of the lower chamber T1. The θ base table 28 is mounted on the Y table 32 through a rotary bearing 27 . In addition, the Y table 32 is configured to be movable on a linear rail provided on the X table 33 by the motor 29 . Furthermore, the X stage 33 is provided to be movable on a linear rail provided on the side of the stage 1 by the drive motor 30 . In this way, the driving mechanism for the lower chamber that fixes the lower table is disposed outside the lower chamber, and by moving the lower chamber, the substrate on the lower table can be positioned. Therefore, while the sealability in the chamber can be maintained, since the drive mechanism is arranged externally, the substrates can be bonded with high precision without being affected by the dust generated by the operation of the drive mechanism.

In addition, when the upper chamber T2 is in contact with the sealing ring 25 of the lower chamber T1 to form a decompression chamber, in order to keep the crushing amount of the sealing ring 25 constant, on the outer peripheral portion of the θ base table 28, a plurality of upper chambers are provided. Ball bearing 34 and touch plate 35 with adjustment mechanism. The lowering position of the upper chamber part T2 is adjusted by these ball bearings 34 and the striker plate 35 . In addition, in this embodiment, the coupling of the upper chamber T2 and the lower chamber T1 is performed by the weight of the upper chamber T2. In this way, even with the self-weight of the upper chamber T2, the interior can be decompressed gradually, and an external force can be applied from the atmospheric side to the interior of the chamber, because the upper chamber T2 is acting with sufficient pushing force, and the chambers can be combined through a huge bonding force. In addition, the ball bearing 34 is provided with a micro-height raising and lowering mechanism for slightly moving the upper chamber T2 up and down.

And in order not to deform the θ base table 28, in order to support the outer peripheral portion of the θ base table 28, on the parts fixed on the device base (stand) 1, a plurality of ball bearings 37 and belts for the θ base pressing plate 28 are provided. There is a touch plate 38 of an adjustment mechanism. Accordingly, the load from the θ base platen 28 is received. In this way, since the two layers of the ball bearing 34 for the chamber and the ball bearing 37 for the θ foundation table receive the load around the upper and lower chambers, the deformation of the chamber can be suppressed to be small.

A plurality of transmitted lights 39 for mark recognition are provided in the lower chamber T1 , and holes are opened at positions corresponding to the lower table 24 . In addition, in the lower chamber T1, a plurality of pressurizing and UV irradiating mechanisms 40 are provided to crush and harden the UV adhesive so that the bonded substrates are not displaced. In addition, when the substrate is carried in and out, the holding claw lifting mechanism 41 is provided to prevent the bending of the substrate in the width direction, or the rotating lifting pin is used to prevent the bending of the robot and the bending of the substrate in the front and rear directions, or use The substrate lifting mechanism 43 for lifting and lowering the substrate after gluing.

A hole is provided in the lower table 24 so that the pressurization/UV irradiation mechanism 40 can move up and down in the lower table 24 . In addition, the pressurization/UV irradiation mechanism 40 can also be used as a rotary lift pin. In addition, grooves (notches) are respectively provided on the substrate supporting side so that the substrate elevating mechanism 43 can move up and down. When loading and unloading the substrate, the substrate elevating mechanism 43 is operated so that the manipulator can be inserted into the lower surface of the substrate. For these holes or grooves, since the lower table top 24 is fixed to the lower chamber T1, only a minimum margin may be provided.

In addition, the pressurization/UV irradiation mechanism 40, the holding claw elevating mechanism 41, and the substrate elevating mechanism 43 each have a vertical movement mechanism passing through the lower chamber T1, and an O-ring is provided between the lower chamber T1 and these vertical movement mechanism parts. , thereby serving as a structure to maintain the seal.

The mechanism for holding the upper substrate by the upper stage 2 in the decompressed state may be either electrically held by an electrostatic chuck or physically held by an adhesive material. In the case of electrical holding by the electrostatic chuck, the applied voltage is cut off, and the holding by the upper table 2 can be interrupted by raising the upper table 2 after a certain de-energization time. In addition, in the case of holding by a sheet-shaped adhesive member arranged on the table, a plurality of pins for mechanically pushing the upper substrate to the lower substrate are provided in advance, and in the state where the pins are pressed downward , the holding of the upper substrate can be interrupted by only raising the upper mesa 2 .

The lower substrate holding mechanism by the lower table 24 in the other decompressed state may also be electrically held by an electrostatic chuck or physically held by an adhesive member. For example, the combination of the adsorption method under the depressurized state of the upper side table 2 and the lower side table 24 can be that both the upper side table 2 and the lower side table 24 are used as electrostatic chucks or adhesive materials, or the upper side table 2 and the lower side table 24 can be used as electrostatic chucks, or the upper side table Either one of the side table 2 or the lower table 24 is used as an electrostatic chuck, and the other is used as an adhesive material. In this way, by holding the substrate on the stage under reduced pressure, a flat portion serving as a reference can be ensured, parallelism between the stages can be maintained, and the substrate can be easily assembled. Therefore, the upper and lower substrates can be bonded uniformly. In addition, in this embodiment, it is possible to combine both the configuration of suction adsorption by negative pressure and the electrostatic adsorption by static electricity.

The decompression in the decompression chamber is carried out by connecting with a vacuum valve and a vacuum pump of a dry pump or a turbomolecular pump through an unillustrated exhaust hole provided in an upper and lower chamber. In addition, the atmosphere in the chamber is exhausted by introducing an inert gas such as nitrogen or air through valves provided in any of the upper and lower chambers, which are not shown in the figure. The air discharge is preferably an inert gas such as nitrogen containing a small amount of water molecules in the sense that less moisture adheres to the chamber and shortens the time for depressurizing the chamber.

Next, the operation of gluing liquid crystal panels will be described by constituting the substrate assembly apparatus of the present invention. First, apply the adhesive in a frame shape to surround the outer periphery of the liquid crystal panel in the form of a black matrix or the upper substrate in its vicinity, arrange it with the surface coated with the adhesive facing down and turn it upside down, and mount it. On one robot arm located on the lower side of the robot, or on the lower substrate on which the liquid crystal is pre-coated on the surface, the lower side of the liquid crystal drop is placed as the upper side, and the other robot located on the upper side arm. In this way, the robot moves to the front of the board assembly apparatus with the two boards mounted on the upper and lower arms. In accordance with the instruction of the control device of the substrate assembly apparatus, the gate valve 16 of the upper chamber T2 is opened, and the robot inserts the upper substrate turned over on the lower robot arm into the chamber.

When the upper substrate is inserted, the upper table 2 is lowered according to the command of the control device, and the reversed upper substrate is sucked and held on the lower surface of the upper table 2 by suction and adsorption based on negative pressure. When the front end of the mechanical arm has a large deflection when it is extended, and it is difficult to attract and absorb, use the rotating lifting pin in the cavity to turn up and support the front end of the mechanical arm from the bottom side. The mechanical arm on the lower side retreats temporarily from the cavity, and after waiting for the retreat, the control device of the substrate assembly device sends control commands to the substrate lifting mechanism 43 or the holding claw lifting mechanism 41 for the liquid crystal panels that have been glued on the lower table 24 , lift the substrate upwards. The robot inserts the lower mechanical arm into the lower side of the liquid crystal panel in the cavity again, lifts it up by hand, makes it retreat, and takes out the liquid crystal panel from the cavity to the outside. Thereafter, the substrate elevating mechanism 43 and the holding pawl elevating mechanism 41 are lowered by a command from the control device.

Next, the robot inserts the lower substrate pre-coated with liquid crystal on the upper robotic arm into the cavity. If the lower substrate is inserted into the cavity, the holding claw elevating mechanism 41 rises, lifts the lower substrate, waits for the retreat of the mechanical arm, sets the lower substrate on the lower table 24, and sucks the lower substrate through negative pressure suction.

Then, the camera lens 21 is lowered along the moving axis CZ in the vertical direction to measure the position of the substrate mark on the upper substrate, and the center position of the mark on the upper substrate and the position of the camera lens 21 are moved using the moving axes CX and CY in the horizontal direction. The center reaches a consistent position. Next, the upper stage 2 is lowered, and the deviation of the marking positions between the upper substrate and the lower substrate is measured through the camera lens 21 . Next, lift the ball bearing 34 through a small height lifting mechanism not shown in the figure, so that the upper chamber T2 rises together with the touch plate 35 with an adjustment mechanism provided on the upper chamber side, and lifts until the sealing ring 25 is slightly in contact with the upper chamber T2 or untouched positions. Thereafter, the θ-axis drive motor 26, the Y-axis drive motor 29, and the X-axis drive motor 30 are driven to move the lower chamber T1 horizontally in the XYθ direction to perform rough positioning of the alignment marks on the lower substrate and the upper substrate.

After rough positioning, the ball bearing 34 is lowered. Then, when electrostatic chucks are provided on the upper and lower tables, a voltage is applied to the electrostatic chucks to electrostatically attract the substrate to the tables. In this state, close the gate valve 16, and use a vacuum pump to discharge the air in the cavity. During exhausting, the upper table 2 is lifted up in order to easily exhaust the gas between the upper and lower substrates. After reaching a certain decompression state in the chamber, lower the upper table 2 again, measure the positional deviation between the upper and lower substrates, and drive the motor 26, motor 29, and motor 30 to move the lower chamber T1 horizontally in the XYθ direction to perform the lower substrate and micropositioning of the calibration marks on the substrate. In this way, in the state where the upper chamber T2 and the lower chamber T1 are engaged, measures are taken for the seal ring 25 arranged on the lower chamber T1 so that the upper chamber T2 does not move when the lower chamber slightly moves in the XYθ direction.

In addition, in the holding method of the above-mentioned substrate, in the air, in the state where the suction force based on the negative pressure is applied, the electrostatic adsorption force is applied to the substrate. In this case, it is necessary to apply the The applied voltage generates a small voltage without a discharge phenomenon between the substrate and the electrostatic chuck, thereby increasing the voltage according to the decompression state. Therefore, a predetermined voltage may be applied to the electrostatic chuck after the inside of the vacuum chamber becomes a predetermined depressurized state.

FIG. 3 shows an example of the cross-sectional shape of the seal ring 25 used in this embodiment. That is, the seal ring 25 used in this embodiment is a seal ring 25 having a shape (a shape of (a) or (b) of FIG. 3 ) with less spring force in the front, rear, left and right directions than the spring force in the vertical direction. Furthermore, since the upper chamber T2 is movable in the vertical direction as described above, and is mounted on the ball spline guide 13 so as to be almost immovable in the front, rear, left, and right directions (horizontal direction), even if the lower chamber T1 is slightly moved in the horizontal direction, It cannot drive the upper cavity to move, so that the positions of the upper and lower tables can be coincident. In addition, the shape of the seal ring is not limited to the shape shown in FIG. 3 , and any shape may be used as long as the aforementioned characteristics can be exhibited.

After the micro-positioning is completed, while measuring the value of the load cell 22, the upper table 2 is further lowered to pressurize and bond the substrates. After the pressing force reaches the specified value for crushing the adhesive, the pressurization is terminated, and the UV adhesive for temporary fixing applied in advance on the temporary fixing position of the substrate is pressurized by the pressurization and UV irradiation mechanism 40. , while irradiating UV light, temporarily fix the substrate so that the position of the substrate does not deviate.

After the temporary fixation is completed, the pressurization and UV irradiation mechanism 40 is lifted. When the upper table 2 is adsorbed in a decompressed state by an electrostatic chuck, the voltage is cut off, and the static electricity is removed by the ion generator 17 . After waiting for the power-off time to elapse, the upper table 2 is lifted. In order to shorten the power dissipation time, it is also possible to ground the power supply line through a changeover switch. In the case where the upper table 2 is bonded, the upper substrate is mechanically pushed to the lower substrate by a plurality of pins, and only the upper table 2 is lifted while the pins are pushed to the lower side. The holding of the upper substrate is interrupted.

Thereafter, an inert gas such as nitrogen or air is introduced into the chamber through a valve provided on the chamber, and the chamber is opened to the atmosphere. Next, the gate valve 16 is opened, and substrates are carried in and out.

In the cavity of the substrate assembly device, when performing maintenance such as cleaning, the cylinder drive rod 51 installed in the upper cavity part T2 is inserted into the pressurized base plate 7 and installed in the state where the pressurized base plate 7 is lowered. Between the connection members 52 of the upper chamber T2, in this state, the drive motor 10 is used to lift up the upper table 2 in the Z-axis direction. In this way, the upper chamber T2 is combined with the upper table 2 through the connection mechanism, because the upper chamber T2 can be lifted by using the drive motor 10 for pressurizing the upper table 2, so it is not necessary to separately provide a driving mechanism for lifting the upper chamber T2. , the simplification of the device can be achieved. In addition, according to this, maintenance of the upper and lower tables can be performed in a state where the cavity is opened.

As described above, in the present invention, since the structure is such that a series of operations are performed in a state where the upper and lower chambers are integrated when the substrate is assembled, the upper and lower chambers are only connected when a predetermined amount of substrates are glued together and the maintenance of the device is performed. Separation, so while the gluing time can be shortened, the maintenance time can also be shortened.

According to the substrate gluing device of the present invention described above, because the lower table surface and the upper cavity are integrated, and the position alignment is performed by the driving mechanism arranged outside the cavity, the holes provided on the cavity can be reduced as much as possible, and the stability can be achieved. High-precision gluing is performed while maintaining a decompressed state, and since the upper chamber can be moved up and down, maintenance in the vacuum chamber becomes easy.

Claims (10)

1. substrate assembling apparatus, the substrate that should glue together is kept also relatively respectively to each other up and down, when positioning, shorten at interval, by the bonding agent that on the substrate of at least any one party, is provided with, in the chamber of decompression state, two substrates is glued together, it is characterized in that, aforementioned cavities is made the structure that is divided into up and down, to in epicoele, make a side the substrate detachable the upside table top fixed, with the substrate detachable that in cavity of resorption, makes the opposing party the downside table top fixed, with relative the purchasing of substrate separately, aforementioned upside table top has the driving mechanism that makes it to move up and down in the chamber in the outside of epicoele, have for driving mechanism and drive above-mentioned epicoele up and down by above-mentioned upside table top, the bindiny mechanism that connects upside table top and epicoele, aforementioned downside table top combines with the cavity of resorption one, and the driving mechanism that aforementioned cavity of resorption is moved in the horizontal direction at least with respect to epicoele is arranged on the outside of cavity of resorption.

2. substrate assembling apparatus as claimed in claim 1 is characterized in that, is provided with the family of power and influence who is used to carry out substrate is moved into, taken out of epicoele.

3. substrate assembling apparatus as claimed in claim 1 is characterized in that, for make cavity of resorption can seal and move in the horizontal direction with respect to epicoele combination, at the outer circumferential side of aforementioned cavity of resorption, have sealing ring and a plurality of ball bearing.

4. substrate assembling apparatus as claimed in claim 1, it is characterized in that, will be in order to take out the substrate behind the gummed and promote the elevating mechanism of substrate or in order to prevent to misplace temporary fixed substrate mechanism, in order to carry out the lighting mechanism of substrate orientation, be arranged on cavity of resorption, itself and cavity of resorption and downside table top one are moved.

5. substrate assembling apparatus as claimed in claim 1 is characterized in that, is provided with the little height elevating mechanism that is used for epicoele is risen to the height that does not contact with cavity of resorption.

6. substrate assembling apparatus as claimed in claim 1 is characterized in that, is provided with the ion generator of the static that is used to remove the substrate that is glued at aforementioned epicoele.

7. substrate assembling apparatus as claimed in claim 1 is characterized in that, in the arranged outside of aforementioned epicoele the table top that can move in the XYZ direction is arranged, and on aforementioned table top, is provided with the video camera of identification substrate position.

8. substrate assembling apparatus as claimed in claim 1 is characterized in that, on aforementioned upside table top, is provided with the video camera of the involutory mark in position that is used to observe substrate.

9. substrate assembling apparatus as claimed in claim 1 is characterized in that, is provided with the adjusting mechanism of position of the horizontal direction of the aforementioned upside table top of fine setting at aforementioned epicoele, and this adjusting mechanism is made of the secondary guide piece and the central shaft of a plurality of sleeve structures.

10. substrate assembling apparatus, be provided with: the XY θ table top that on stand, is provided with, constitute the chamber of decompression chamber, and be used in aforementioned cavities, making 2 plate bases relative up and down, devices spaced apart and the upside table top and the downside table top that keep, drive the outside of the actuator configuration of aforementioned upside table top up and down in aforementioned cavities, by aforementioned driving mechanism, drive the upside table top, dwindle interval with above-mentioned downside table top, the gummed substrate, it is characterized in that, aforementioned cavities is made the structure that is divided into up and down, the epicoele that is divided in two the chamber is installed on the guide piece, constitute along aforementioned guide piece and can move up and down,, aforementioned upside table top is connected with aforementioned epicoele by bindiny mechanism, by driving the driving mechanism of aforementioned upside table top, aforementioned upside table top and epicoele are moved with this together.

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