CN1458562A

CN1458562A - Heat radiation or shielding method with heat source near outer casing inner wall for color display screen electric appliance

Info

Publication number: CN1458562A
Application number: CN 03103616
Authority: CN
Inventors: 王松
Original assignee: Individual
Current assignee: Individual
Priority date: 2002-01-31
Filing date: 2003-01-31
Publication date: 2003-11-26

Abstract

The heat radiating or shielding method for electric appliance with color display screen is to make the heat radiating or shielding structure near the inner wall of the casing. The casing or heat conducting body with great heat capacity is used for accumulating heat; the electromagnetic radiation is suppressed through close contact or the heat source is fixed to the back side to result in even higher effect; and combined heat dissipating and shielding structure is provided to obtain high effect. Specifically, the interval between the heat source and the outer casing is lower than 0.4 mm, the minimum heat conducting path is 0-277 mm and the ratio between the heat conducting path length and maximum heat conducting path cross section size is 0-2400 %.

Description

The heat source near outer casing inner wall heat radiation of color display screen electric appliance or the method for shielding

The title of instructions and page number:

One. technical field ... 1

Two. background technology is about the present situation of heat radiation with shielding ... 1

Three. technical matters ... 3

Four. technical scheme ... 4

Five. technical scheme is about thermal source ... 4

Six. technical scheme is about heat conductor ... 5

Seven. technical scheme is about shell ... 5

Eight. technical scheme is about the combination of heat source near outer casing inner wall ... 7

Nine. technical scheme is about the application contrast of various computer types ... 8

Ten. beneficial effect ... 9

11. Summary of drawings ... 10

12. embodiment ... 10

One. technical field:

This case relates to and combination of colorful display screen one or the supporting relevant electrical equipment of split, is called for short: color screen electrical equipment.

Described color screen, being meant can active illuminating or passive reflective or the control printing opacity, the color/graphics of energy display text or image, minimumly comprise or made up: video screen CRT, liquid crystal display LCD, projection screen, PDP display PDP, field cause screen FED, the organic LED screen OLED (new-type display screen that can roll of micromolecule organic material or macromolecule polyalcohol made, ginseng " electronics newspaper " March 4 calendar year 2001, ginseng " the household PC world " 33 pages of April calendar year 2001), 3D shields.

Described color screen electrical equipment, minimum comprising: 1. computer, 2. the audio and video appliances of hard disk, 3. colour TV (containing: analog machine and teaching machine), 4. colored display arranged.

Two. background technology is about dispelling the heat and the present situation that shields:

Known technology normally dispels the heat with heating radiator, and the thermal source heating radiator big for power consumption also must rely on active radiating elements such as electric fan or electric pump.

A. electric fan or electric pump running, the directly normal operation of influence service thermal source, the plug of electric fan comes off, the power lead of electric fan was joined " computer newspaper " on 05 13rd, 2002 by heating radiator roastingization and problems such as short circuit are more.

The resonance that shake that produces when B. electric fan or electric pump rotate and shake thereof cause, also have of the interference of its inductive load to power supply, all influenced the speed of the contact reliability of hard disk, CPU and near other device and hard disk operation and stable, " the household PC world " 95 pages of in March, 20002 are joined in the frequent deadlock that ginseng cabinet electric fan in " computer newspaper " on January 28th, 2002 and 09 month 09 day causes.

C. the louvre of heating radiator many dusts that waftd into; External electric fan also can suck more dust; Inner electric fan also can be assembled many dusts, various dusts all can influence even damage the stability of various devices because of factor such as the moisture absorption, burn into influence heat radiation, as the contact of internal memory, the running of CD-ROM drive, the operation of hard disk, join " computer newspaper " on October 16th, 2000, on Dec 18th, 2000, on November 5 calendar year 2001, join " electronics newspaper " Dec 2 calendar year 2001.

D. a large amount of dusts must cleaned at regular intervals safeguards, electric fan also will refuel maintenances, and the wear and aging of electric fan is changed, and these have all increased the incidence that the workloads of safeguarding have also increased fault, join on " computer newspaper " August calendar year 2001 27.

E. the heat of heat sink radiates also must have other electric fan once more heat to be discharged shell, and secondary has source heat-dissipating to produce secondary power consumption, has increased configuration amount, workload, the thermal value of power circuit.

The increase configuration of the F. configuration of heating radiator, active radiating element and supporting power-supply system thereof has all increased weight, volume, cost and the structural complexity of computer and the cost of making, assembling, carry, keeping in repair and the difficulty of operation etc.

G. portable machine has been increased power consumption, brought the trouble of use operation and the increase of battery use cost, the increase of battery consumption is unfavorable for environmental protection.

H. known radiating element all is to rely on jump ring to be adjacent to the heat-delivery surface at CPU, because the die sites at CPU middle part is all less, and jump ring is for fixed heat sink part that can be stable, the elastic force of design is all bigger, if the insulating protective layer outside the core cpu is thinner, be easy to when heating radiator is installed by the corner of being crushed by jump ring; For preventing that heating radiator from damaging the corner of CPU by pressure, the outer insulating protective layer of the core of CPU must be thickeied, and the protective seam of thickening has influenced the radiating effect of core cpu greatly, joins on " computer newspaper " Dec calendar year 2001 17.

I. the electric fan noise effect of rotating people's work.

J. big heavier heating radiator on the circuit board has influenced the vibration resistance of system, ginseng " computer is done certainly " 84 pages of in February, 2002.

K. for the computer of many hard disks, server etc. for example is because problems such as power consumption, socket number, reliabilities, with many electric fans or the heat radiation of many electric pumps obviously not improperly.

L. the passage of radiating airflow has taken more outer casing space.

Known heat dissipating method has the semiconductor cooling device heat radiation in addition, though radiating effect increases, but the dewfall condensate water that semiconductor cooling device produces damages the thermal source device easily, and it seems also will be between thermal source and active radiating element, increase the derby that reduces heat transfer and radiating effect again, perhaps, design specialized is controlled heat-conducting plate in addition, with the relieved use of less dewfall ability, join " computer newspaper " on July 31st, 2000, January 1 calendar year 2001.

Along with the raising of hard disk speed, the high temperature that hard disk produces when operation has had influence on the raising of the stable and performance of hard disk operation, and the magnetic storage medium of hard disk is more avoided in high temperature than semiconductor thermal source.Hard disk heat radiation device known on the market is the structure of electric fan casket, and existing describedly has the drawback of source heat-dissipating still to exist.Hard disk is because mutual copy and peculation often needs instrument carefully to operate with bolt, and dismounting bothers.Because the running of hard disk and the resonance between the shell, noise is bigger when making the hard disk operation.Because hard disk directly is fixed on no any protection on the member of enclosure, causes the antidetonation of hard disk not good enough, shell had vibrations slightly when system moved; will influence the operation of hard disk; join on " computer newspaper " April calendar year 2001 16, July 30 calendar year 2001, on 01 28th, 2002.

At present the high-resolution digital televisor is popularized, and computer has laser phonotape and videotape function and also become a reality, and simultaneously, laser audio-video-equipment has the correlation function of computer, also is trend of the times.At present, the heat dissipating method of colour television set, color monitor and laser laser audio-video-equipment but is similar to host computer, rest on the method for radiator heat-dissipation, radiating effect is not good enough, its shell has stayed many louvres in order to dispel the heat, also because high pressure also inspiration many dusts, its drawback and can cause the high-voltage breakdown of high voltage arc, arcing and device as previously mentioned.

Known display interior has several kilovolts high pressure; and shell all is plastics; just high-grade at last had about 0.3 millimeter very thin barricade only; because the thermal source device of display interior all is to rely on radiator heat-dissipation, so also have the louvre of many about 10 mm dias on the barricade usually.Barricade is promptly thin many bigger holes again, and shield effectiveness is well imagined.Especially wait the more public place of personnel in office, the stronger proceeds posterolateral of color monitor electromagnetic radiation is to corresponding many people often, and is bigger to people's health hazard.

The metal shell of known electric brain server all is that iron is zinc-plated.Because the running frequency of computer is very high, the frequency band of radiation is very wide, the centering low frequency radiation, thicker iron shell can play the effect of shielding, and to high frequency radiation because high-frequency vortex resistance, the shield effectiveness of iron shell and zinc coating thereof is not good enough.

At present power consumption is bigger, and in the very high electrical equipment of frequency of operation, computer will be obviously outstanding.The fixed position of known heat sources does not more have the outer casing inner wall of being adjacent to relatively away from outer casing inner wall.The cmos device that is more vulnerable to interference owing to input impedance is very high is used more and more; Because the frequency of operation of device is high more, the digital signal pulse of output is just sharp more, just can disturb the normal operation of other device or assembly more, and the frequency of operation of thermal source is very high, but also can be more and more higher; Because the volume of computer is more and more littler, like this, the phase mutual interference of thermal source and thermal source all can be also increasing to the interference of other assembly.Described assembly comprises: internal modem, and television receivers etc. are joined on " computer newspaper " March calendar year 2001 12, on February 25th, 2002.

Because the thermal source of colour television set, color monitor and laser laser audio-video-equipment and the thermal source and the circuit board profile thereof of circuit board and host computer thereof are similar, just this case is used plastic casing instead metal shell in addition., suitable equally by this case to colour television set, color monitor and hard disk audio and video equipment to the improved detailed description of host computer.Three. technical matters:

Color screen electrical equipment is based on civilian and commercial popularization and application on consumption, and on performance index and stability index based on military and important application scientific research, must consider many special problems simultaneously:

To civilian and commercial, 1. at first profile should be succinctly attractive in appearance; 2. color screen electrical equipment especially computer become the highest electrical equipment of common electrical equipment medium frequency, the digital colour TV of computer combination colour TV and high-resolution high-frequency is being come into the crowd, long-time crowd near contact is more and more, it is low that people require that radiation tries one's best, rather than be satisfied with artificially and formulate ' safety standard ' based on prior art; 3. the quantification of the product for civilian use require cost to try one's best simple can the province then that the end, structure try one's best economized, this is related to the employing and the popularization of civilian new technology; 4. weight, volume are little, are convenient for carrying or move; 5. noise is as far as possible little, helps the working and learning that people stabilize.

To military and scientific research, from other angle color screen electrical equipment is had higher requirement, not only claimed structure is simple, in light weight more, volume is little, and more requiring 6., environment for use can adapt to field or even dirt sand rainwater environment; 7. very high reliability and stability can be arranged: 8. to the also requirement of movability color screen electrical equipment, environmental protection requirement is not only in power saving as much as possible, the requirement of long-time continuous use after the product charging especially.

Described problem is more outstanding with the performance of computer CPU, the frequency of operation numerical value that fast speed improves and frequency of operation has reached significantly, be other any electrical equipment, comprise what colour TV all was difficult to compare, the perviousness of its electromagnetic interference (EMI) and penetrability are improving too, and important shell protection structure does not change, in order to solve the problem that the CPU heat increases, louvre on the shell and electric fan hole are more and more, increasing on the contrary, and so inevitable electromagnetic radiation exceeds standard.

This case purpose:

1. dispel the heat with heat accumulation, make full use of the large tracts of land that shell contacts with air and dispel the heat, main is that the big thermal capacitance that makes full use of shell or heat conductor is carried out heat accumulation.

2. shield with close, with the house of opening door and window than the shell of doing many louvres, the middle part that stands in the house is than close wall, scenery is more outside the room of seeing, also can be seen by more room stranger, electromagnetic two-way direct radiation is also similar, and the various configurations of this case all have shielding action separately.

3. overcome the drawback of known heat radiation and shield technology, for the combination of multiple heat radiation provides supporting preferably, more the color screen electrical equipment of new function provides necessary supporting.Four. technical scheme:

This case scheme: indivedual thermals source are adjacent to outer casing inner wall;

Perhaps, thermal source is adjacent to outer casing inner wall through heat conductor, the diameter of hot road xsect or width and thickness all be 1～5mm or 〉=5mm;

Perhaps, thermal source is 0～33mm through the near-thermal road length that real core heat conductor or container heat conductor are adjacent to outer casing inner wall, contain 0mm or, 33～66mm, contain 33mm or, 66～99mm, contain 66mm or, 99～122mm, contain 99mm or, 122～155mm, contain 122mm or, 155～277mm contains 155mm

And the diameter of near-thermal road xsect or width and thickness all are 0.4～0.8mm, contain 0.8mm or, 0.8～1.6mm, contain 1.6mm or, 1.6～3.2mm, contain 3.2mm or, 3.2～6.4mm, contain 6.4mm or, 6.4～12.8mm, contain 12.8mm or,＞12.8mm

And near-thermal road length is the diameter of near-thermal road xsect or cornerwise 0～300%, contain 0% or, 300～600%, contain 300% or, 600～1200%, contain 600% or, 1200～2400%, contain 1200% or, 2400～4800%, contain 2400%.

Described thermal source is adjacent to outer casing inner wall, the fixed position that is meant thermal source is as far as possible near outer casing inner wall, thermal source can select directly to be adjacent to outer casing inner wall, and at this moment thermal source is to the hot road length=0mm of outer casing inner wall, and near-thermal road length is 0% of the round diameter of hot road xsect or square catercorner length; Thermal source also can be selected to be adjacent to outer casing inner wall indirectly through the low thermal resistance heat conductor.

Described near-thermal road length is meant that thermal source is adjacent to the position of heat conductor and the position that heat conductor is adjacent to outer casing inner wall, the length between its two positions between nearest two points of hot approach, and hot road length is short more good more, best=0.

Diameter or the width and the thickness of described hot road xsect are meant that one or more right cylinder or rectangular parallelepiped separate side by side or be adjacent to the total size at the minimum position of total size of stack, and this is to realize this case purpose important structure condition.As adopt metal forming individual layer or the less stacked use that adds, and hot road cross-sectional area thermal resistance is bigger, and big width metal forming can increase the area of dissipation of enclosure, makes the corresponding minimizing of the heat that passes to outer casing inner wall, and the less shielding of the electromagnetic wave of isolation loss is not good enough.

As adopting the thicker use that is added to of the thin metal of multilayer, hot road cross-sectional area will comparatively fast strengthen, and help heat conductor and the contact flexibility of thermal source with outer casing inner wall.

The diameter or the diagonal line of described near-thermal road xsect are meant that one or more right cylinder or rectangular parallelepiped separate side by side or be adjacent to the total size at the minimum position of total size of stack.In order to keep less thermal resistance, longer as hot road, then hot road cross-sectional area must corresponding increasing, table 1: be nearest familiar route length and the diameter or the diagonal line comparison example of near-thermal road xsect.

Table 1: feature ratio	???300％?600％?600％?1200％?1200％?2400％?2400％?4800％
Table 1: feature ratio	???300％?600％?600％?1200％?1200％?2400％?2400％?4800％	Near-thermal road length	????9????12????18?????24?????36????48?????72??????96
The diameter of xsect or diagonal line	????3?????2?????3?????2??????3?????2??????3???????2	Near-thermal road length	????9????12????18?????24?????36????48?????72??????96

The left and right sides louvre on Fig. 1 shell 1 top respectively has an electromagnetic interference (EMI) emissions source 10, and the inwall and the middle part of Fig. 1 and Fig. 2 shell 1 have thermal source 2 and thermal source 3 respectively.Thermal source 2 directly externally and the electromagnetic radiation that directly is subjected to all lack than thermal source 3.Thermal source 2 helps to utilize shell 1 to absorb the more low frequency magnetic line of force near shell 1.Five. technical scheme is about thermal source:

Described thermal source minimumly comprises or has made up: single-chip or, integrated chip or, CPU or, GPU or, north bridge or, hard disk or, CD drive or, high power valve or, battery, and the assembly of described thermal source (contains; Have metal cap or shell Hard disc module, the power supply unit of high power valve is arranged).

Described indivedual thermal source is meant that the thermal source that is adjacent to outer casing inner wall preferably is allowed a choice, if whole thermals source all are adjacent to shell, effect increases progressively limited, and increases the assembling difficulty.With CPU is this case emphasis, heat maximum, frequency are the highest, lead-in wire at most and volume less, the heat maximum, dispel the heat important, frequency the maximum data stream is maximum, shield important, lead-in wire is maximum, the resonance of fearness electric fan or electric pump.The interface of CPU minimumly comprises or made up: the line of common plane interface, similar Slot1 slot interface is on the next door of CPU, ginseng Figure 17.

Described single-chip is meant the chip that one or more CPU and other computer chip is integrated in single chip.

Described integrated chip is meant the chip with one or more CPU and the integrated encapsulation of other computer chip.

Because hard disk is the sophisticated product of dynamo-electric combination, it is also a lot of go between, and data stream is bigger, and heat is bigger, be afraid of most to vibrate, and also be preferably to the application of this case.

Described CD drive minimumly comprises or has made up: CD-R, CD-RW, DVD-R, DVD+R, DVD-RW, DVD+RW.

Described high power valve minimumly comprises or has made up: the triode of power-supply system, diode.

Described battery, minimum comprising: rechargeable battery, fuel cell.The thermal value of fuel cell is also more many greatly than rechargeable battery, but the power capacity of fuel cell is very big, be subject to people's attention,, its heat radiation can be directly carried out with reference to the radiator structure of other thermal source of this case for the effect of its heat radiation will directly influence the promotion and application of fuel cell.Six. technical scheme is about heat conductor:

The material of described heat conductor minimumly comprises or has made up: metal or nonmetal heat conductor, rigid or elastic heat conducting body.Heat conductor can select rubber or plastics to manufacture the elastic heat conducting body, and the rigid damage when the elastic heat conducting body can reduce thermal source when mounted with use can suppress resonance.

Described heat conductor shape or structure, minimumly comprise or made up: square, L shaped, U-shaped, cylindrical, square tube shape, heating radiator, heat-conducting plate, internal mix have the elastic heat conducting body of the little metallic object of diameter or thickness＜5mm, can be silk thread or the fractionlet or the comminutions of metal.Tiny metallic object helps shielding and heat conduction.For the thermal source that should consider to insulate, can increase silicon rubber or other insulation course on the top layer of heat conductor.Heat conductor can select real core to lead ripe body or container heat conductor.

Described container heat conductor is meant the various containers that contain liquid or steam, but the selected sealed container heat conductor, also can select at any time can liquid make-up or vapor species through hole container heat conductor arranged.Minimum comprising: the liquid thermal conductivity pipe of sealing, the vapour vessel heat conductor-heat pipe of sealing etc.

Thermal source, heat conductor, outer casing inner wall, its position that is adjacent to mutually can select the Heat Conduction Material of softnesses such as the cushion of heat conductive silica gel or graphite film or aluminium foil or copper film or heat conduction with phase change pad to set up heat-conducting layer, in order to the reinforced heat conduction effect.

Known technology heat conductor or heating radiator and outer casing inner wall insulation or contact resistance are bigger, and its structure had not been considered shielding.

Described heat conductor effect is; The heat-delivery surface and the outer casing inner wall of 1. working as thermal source, height or direction are not simultaneously, can give hot road with heat conductor and connect, 2. also can strengthen the quantity of heat storage and the temperature difference that reduces each position of shell, 3. also can cooperate outer casing inner wall that thermal source is formed electromagnetic wave isolation and low frequency electromagnetic absorption.Described thermal source is adjacent to outer casing inner wall through the heat conductor of low thermal resistance, and for shielding, low thermal resistance should be that the heat xsect of trying one's best big is arranged also is bigger shielding surface.Seven. technical scheme is about shell:

Described outer casing inner wall minimumly comprises or has made up: the door of panel, base plate, side, shell or lid.Described shell position comprises keyboard and keyboard periphery position with the shell combination for the computer of shell and keyboard combination.

Described outer casing inner wall minimumly comprises or has made up: upwards inwall or, downwards inwall or, left inwall or, to the right inwall or, forward inwall or, inwall backward.Each thermal source should disperse to be distributed in each position of outer casing inner wall as far as possible.For example: CPU is fixed on upwards inwall, so that heat is transmitted to other position of shell as early as possible; Because hard disk is compared with other semiconductor devices thermal source, the thermal value of hard disk is less, so main is that hard disk is tried one's best away from other thermal source, so that hard disk better utilization outer casing inner wall is dispelled the heat, hard disk is fixed on the CPU of downward inwall tall and big heat far away; CD drive is fixed on inwall left; High power valve is fixed on inwall to the right.

Described shell, minimumly comprise or made up: the planar metal plate shell, have the bending groove the sheet metal shell, with sheet metal be fixed on case surface and shell, part of local thickening or all be shell, the metal casting of shape shell, metal level and non-metallic layer combined housing, contain the synthetic material shell of metal, join 38 pages of " electronics technology " 2002 years 12 phases.If adopt the synthetic material that contains metal to make shell, its thickness especially fixed sturcture of internals must have specific difference with metal shell.

1. known enclosure is erect fixing circuit board and all is fixed on independent metal frame, does not have directly with outer casing inner wall to be connected.

This case enclosure is erect the member that fixing circuit board can select directly to be fixed on outer casing inner wall, be that outer casing inner wall has the directly fixing member of erectting circuit board, this structure simplifies the structure greatly, its member can be with method manufacturings such as shell punching press, accessory electric welding, accessory are gluing or be fixed on outer casing inner wall, ginseng Fig. 4 example 2.Described fixed component minimumly comprises or has made up: threaded hardware.Described setting circuit board not only comprises 90 ° and stands vertically, and also comprises when outer casing inner wall to tilt and the situation of circuit board when also tilting, and the setting angle of erectting circuit board is 10～30～60～90 °.

2. for better heat radiation and shielding, can select the hacking of wall interpolation in the enclosure processing layer, the method for hacking can be known method, blackout interpolation layers such as sandblast.Shell have resistivity less than gold or silver or other electrodeposition of metals of copper, it is outermost layer or the middle layer or the bottom that this electrodeposited coating can be selected, and can select earlier shell to be electroplated the copper of 30～50 μ m, the silver of re-plating 10～20 μ m.

3. this case can select high power valve directly is fixed on the inwall of shell, is fixed on circuit board reverse side or circuit board next door, has reduced thermal source to greatest extent and has been adjacent to the approach that shell dispels the heat, and has reduced the electric capacity heating temperature on high power valve next door.For the shielding of accentuator plate, the radome of the direct fixing circuit board of wall in the enclosure.

4. for to make thermals source highly different on the common circuit board can both be adjacent to outer casing inner wall, the outer casing inner wall structure can be selected: shell be provided with the position, just, the size boss face corresponding with thermal source, as adopting thin resilient made shell, boss face can also apply the elastic force that compresses to thermal source, heat conductor, outer casing inner wall cascaded structure.The heat-conducting plate that wall setting in the enclosure is corresponding with thermal source, the heat-conducting plate of interpolation can also be accelerated heat conduction, and heat-conducting plate also can select to be arranged on outer shell outer wall.

5. fixing for drivers such as hard disk, CD writer, can with bolt from the outside of shell directly and the screw of driver bottom surface or side fix, also can select hard disk is sealed to anti-noise box inside, to prevent that again the noise box is fixed on outer casing inner wall, expose at shell side face or end face rightly when the bolt end, should be beautified the end of bolt.Certainly, for make thermal source on the circuit board more reliable, be adjacent to outer casing inner wall more easily, the also fixed sturcture that can select bolt end portion to expose, with the bolt circuit board in addition the nut of side get final product.This case outer shell outer wall has fixing thermal source or the member of combinations of sources of heat part is arranged.

6. the thickness of the stamping material of known shell or welding material all is 0.6～1.0mm.

This case can select to increase the stamping parts of shell or the thickness of weldment material, it can be thicker integral thickness, also can be near certain position of the stamping parts of shell or weldment material especially thermal source, be adjacent to the heat conductor of thickening with fixed sturctures such as forging and pressing, electric welding, riveteds, perhaps, when packing shell into, thermal source is adjacent to the heat conductor of thickening, with the aggregate thickness of the single or multiple lift that increases sheathing material with structures such as bolt or Spring Cards.

Can select the aggregate thickness at certain position of the stamping parts of shell or weldment material is 1.3～1.5mm, contain 1.5mm or, 1.5～1.8mm, contain 1.8mm or, 1.8～2.2mm, contain 2.2mm or, 2.2～2.7mm, contain 2.7mm or, 2.7～5mm, contain 5mm or, 5～33mm contains 33mm.Eight. technical scheme is about the combination of heat source near outer casing inner wall:

1. the various devices of known ordinary circuit board and chip thermal source and CPU socket all are designs in the common surface front of circuit board.

This case can be adjacent to outer casing inner wall in order to make the chip thermal source, can select the socket with chip thermal source or chip thermal source, and design is at the reverse side of circuit board.For the welding of the chip thermal source or the chip thermal source socket of circuit board reverse side, can select by hand or all can weld automatically.For example: circuit board is after Reflow Soldering and wave-soldering are finished, refer back to the tin cream method of on steel mesh, scraping of fluid welding, chip thermal source hole to pcb board is coated with tin cream, expose and block the metal cap of periphery then with flanging with intermediate openings, block peripheral position, with position, the chip thermal source hole heating solder(ing) paste that heat gun exposes the metal cap middle part, Fig. 6 and Fig. 7 are respectively the upward view and the front elevations of square metal cover.When the steel mesh that also can be chosen in the pcb board Reflow Soldering is scraped tin cream, the chip thermal source hole of pcb board is coated with tin cream, load onto then chip thermal source or CPU socket and with supporting plate below support holder temporarily, carry out Reflow Soldering simultaneously with the paster pcb board then.

Circuit board is in debugging and when maintenance, and CPU should fix interim heating radiator, for this reason, on the CPU socket known heating radiator fixedly card still should keep.

The design of chip thermal source is at the circuit board reverse side, not only utilize the Copper Foil shielding of circuit board surface or interlayer, the mutual interference mutually of control thermal source and other device, and reduced thermal source taking to board area, and original vacant circuit board and the space between the outer casing inner wall have been made full use of, for the volume that reduces board area and complete machine has all been created facility, and because the plane and the outer casing inner wall plane of circuit board are all bigger, thereby avoided the less heating radiator of the area of plane when being installed to CPU, because the more pressure that tilts is big the corner of CPU is damaged by pressure, adopt the structure of CPU at the circuit board reverse side, the thickness of the outer package insulation course of attenuate core cpu that can be suitable, like this, can improve the radiating effect of core cpu greatly, core cpu helps shield effectiveness near large-area metal.

The video card slot of 2. known computer circuit board all designs the middle part at circuit board.

This case for convenience chip thermal source is adjacent to outer casing inner wall, can select the slot design of video card in position that circuit board keeps to the side.

3. be dispersed in the air for better heat shell and enclosure, and, reducing the heat that is delivered to shell conducts through circuit board, perhaps, crack convection current through circuit board and shell, return enclosure, can be chosen in have between the circuit board of thermal source and the shell thermal insulation board or with the passage of housing exterior airflow connection.

Described thermal insulation board, with the insulating material manufacturing, all there is corresponding thermal source hole the position of corresponding thermal source so that the heat conductor of thermal source or thermal source through the thermal source hole to outer casing inner wall heat conduction.

The material of described passage can be selected: metal, plastics or other material.

The structure of passage is minimum to be comprised or has made up: combination or produce the back combination respectively when shell and channel component are produced simultaneously, and shell makes up with channel component, and is more suitable for portable type; In the interlayer inside of shell and circuit board, be that the limit surrounds passage with the passage rib, outer shell passage and circuit board combination of channels, more suitable to desk-top type.

At the endpiece of passage, the electric fan or the temperature control electric fan of continuous working can be set for the use of open-air heat temperature.Electric fan can selection and shell or the combination of passage accessory.

The passage rib can make up with heat conductor, can reduce the temperature difference of each position of shell.

4. thermal source, heat conductor, outer casing inner wall are more reliable to be adjacent to mutually in order to make, can the shell fragment member be arranged in the outside of thermal source and heat conductor and outer casing inner wall tandem compound, its cascaded structure is compressed, the stress point of elastic force is in the outside of its tandem compound, and the direction of elastic force is the direction that thermal source, heat conductor, outer casing inner wall are adjacent to mutually.

Shell fragment can the plastics manufacturing, also can select sheet metal to strike out shell fragment, also can select to turn to Spring Card than hard metal wire, and there is the position of protrusion at the middle part of shell fragment, and the direction that is adjacent to mutually towards thermal source, heat conductor, outer casing inner wall applies elastic force.

Shell fragment fixing can select in the enclosure wall in advance with the fixing threaded metallic object of structures such as electric welding or stickup, then fixes with bolt and elastomeric two ends or bolt hole on every side.The fixing of shell fragment also can be fixed with Spring Card with reference to the fixed sturcture of heating radiator.

For as the server multi-CPU structure of more thermal source is arranged on the common circuit board,, all be well suited for applying the pressure that is adjacent to mutually with shell fragment for as the large span clinging structure of thermal source is arranged in the middle part of the circuit board.

Can select to make driver be adjacent to wall in the enclosure for drivers such as hard disks, make things convenient for the dismounting of driver with direct extruding of structure such as selecting shell fragment.Also hard disk can be contained in the inside of hard disk cover, then apply mechanically the shell fragment extruding and make it be adjacent to wall in the enclosure together with hard disk.Hard disk adopts the fixing means that adds the hard disk cover to help antidetonation and suppresses resonance.Nine. technical scheme contrasts about the application of various computer types:

Described computer is meant the various electrical equipment of CPU and input media or control device.Described input media or control device minimumly comprise or have made up: keyboard, mouse, touch-screen, acoustic control, remote control, smart card.

Described computer, compatible computer of minimum comprising: IBM and Apple Computers; Minimum comprising: server, workstation, industrial computer, business PC, family expenses machine; Minimum comprising: display screen part and host machine part; Minimum comprising: a. cabinet type computer, b. desktop computer, c. network computer, d. pocket computer, e. integrated computer, f. palm PC, g. portable computer, h. panel computer, i. special purpose computer, j. computer peripheral equipment, k. computer external module.

A. described cabinet type computer is meant the computer that place on various suitable ground, minimum comprising: the computer that tower computer server etc. are heavier.

B. described desktop computer is meant the computer that various suitable desktops are placed, minimum comprising: horizontal computer (containing: rack server, blade server), vertical computer.

C. described network computer is meant the desktop computer of no hard disk.

D. described pocket computer is meant the host computer of small-sized no display screen.

E. described integrated computer is meant that combined display screen is 14.5～15.5 inch, contain 15.5 inch or, 15.5～16.5 inch, contain 16.5 inch or, 16.5～17.5 inch, contain 17.5 inch or, 17.5～18.5 inch, contain 18.5 inch or, 18.5～19.5 inch, contain 19.5 inch or, the computer of＞19.5 inch can have been selected or on-keyboard, for example: the computer that 17 inch display screens and keyboard are arranged.

F. described palm PC is meant that combined display screen is 1～6.5 inch, contain 6.5 inch or, 6.5～8 inch, contain 8 inch or, 8～9.5 inch, contain 9.5 inch or, 9.5～11 inch, contain 11 inch or, 11～12.5 inch contain the computer of 12.5 inch.For example:: the notepad computer.

G. described portable computer is meant that the display screen of combination is bigger than palm computer, and is littler than integrated computer, and display screen is with upset commissure and keyboard combination, and the computer of radiating electric fan or heat radiation electric pump is arranged, for example: the mobile PC of no cell arrangement.

H. described panel computer is meant that the display screen of combination is bigger than palm computer, and is littler than integrated computer, gets rid of other computer of portable computer, for example: the computer of board PC, intelligent display, radio display, electronic reader, rotatable display screen etc.

I. described special purpose computer is meant display, video player, game machine, mobile phone, wrist-watch, the colour TV of CPU.

J. described computer peripheral equipment, minimum comprising: display, switch, router, hub, modulator-demodular unit, disk array, projector.

K. described computer external module minimumly comprises or has made up: the various outside removable drives that use.

This case is to the application and the combination of various thermals source, heat conductor and shell, and its effect has bigger difference and limitation.Cabinet type computer and the desktop computer bigger for shell are thicker owing to sheathing material, the effect of utilizing shell heat accumulation and shielding all is best, the more important thing is that for server especially important events are required cocksure computer, the reliability of heat accumulation has obtained important performance at this.

For panel computer and special purpose computer, because frivolous, the low consumption of lay special stress on, noiselessness, though utilize the direct quantity of heat storage of this case to decrease, but should adopt the CPU heat itself of low consumption and relative low speed also less usually by the series computer, this case thermal source is adjacent to the structure of shell and can works good greatly, externally be adjacent to the structure that thermal store carries out big heat heat accumulation, can resolve a heat accumulation difficult problem fully.

For portable computer,, utilize then relative other computer of importance of this case structure lower slightly because to frivolous, low consumption, especially noiseless custom requires relatively low.

This case also can be used for the electrical equipment of part achromaticity display screen, and just necessity and applicability decrease.Ten. beneficial effect:

The known technology heating radiator is isolated to be fixed on chip surface, damages the exposed die core easily by pressure.

The temperature of chip core is the highest, also is the fastest, the most obvious, the most important position of conducting heat.This case chip directly is adjacent to outer casing inner wall, perhaps to be adjacent to hot road cross-sectional area big and be adjacent to the heat conductor of outer casing inner wall for chip, because circuit board plane and outer casing inner wall plane are all bigger, avoided tilting to damage by pressure chip core, help to promote the use of exposed die core, the packaging insulating layer thickness that helps the attenuate chip core can improve the radiating effect of chip core greatly.

Thermal source is adjacent to outer casing inner wall, has improved the resonant frequency after shell makes up, and has suppressed the resonance of shell, helps the raising of complete machine performance and stability.

Heat source near outer casing inner wall, reduced the temperature difference on the inside and outside hot road of shell greatly, reduced the heat of enclosure, improved heat resistance, can reduce the air-conditioning of low temperature service, and the bigger effect of generation, reduce air-conditioning quantity, economize Air Conditioning Facilities, economize the air-conditioning power consumption, no air-conditioning noise, highly reliable, low-cost, high-level efficiency, indirect raising convenience (computer can be used UPS, air-conditioning must prepare highly energy-consuming, the engine of high noisy), directly and the high reliability of indirect effect, the various faults of contingency have been prevented, for military, aviation, space flight, meteorological, scientific research, the website, server, key areas such as industrial computer, and high-end applications that must the long-time continuous computing is extremely important.

Reduced the external noise of radiating element; Reduced the noise of configuration air-conditioning.

Dispel the heat with heat accumulation, help the heat radiation of plateau low pressure environment.

People get used to after heat source position is fixing, consider to adopt what scheme again, and adopt what radiating equipment, and the heat absorption of thermal source behind radiating equipment, is dispersed housing exterior again.People get used to block heating radiator, have ignored the shell heat accumulation of sheet.

Before this case heat source position is fixing, consider earlier which position thermal source is fixed on, and thermal source directly is adjacent to or more close outer casing inner wall, make heat be delivered to shell as early as possible and store or distribute.Improved radiating effect, changed color screen electrical equipment, especially computer must rely on radiating element to disperse the idea that heat dispels the heat.

Known technology: to loose, with Chu Weifu.This case technology:, be auxilliary to loose with Chu Weizhu.

The raising of performance causes the increase of thermal source heat and the increase of thermal source device number easily, is to be difficult to solve highly reliable, contradiction cheaply with known method.This case has reduced in the shell and the outer temperature difference of shell, has reduced in the shell and has flowed with the shell outer air, has desalinated in the shell and the outer difference of shell for heat radiation.With an almost nil cost and an absolute reliable difficult problem that has solved insoluble highly reliable, low-cost, the low-noise heat radiation of people for many years, such heat radiation also helps shielding, be that people are long-expected.

1. heat source near outer casing can reduce or exempt louvre; 2. heat conductor that thermal source and hot road cross-sectional area are bigger and shell is adjacent to mutually; 3. thermal source is fixed on the circuit board reverse side because the interlayer that the isolation of multilayer copper foil and Copper Foil and shell form has suppressed the mutual interference mutually of thermal source with other device, these all help shielding; The electromagnetic radiation that helps to prevent computer causes leakage of information; Help to prevent destruction by High-Power Microwave.

This case has overcome the A～L drawback of the described known technology of background technology to greatest extent, and the known technology drawback is become this case effect.

Cooperate subplans such as thickening casing, cooperation that need not active radiating element can be satisfied the application of conventional environment, has reduced the necessity that active radiating element uses greatly.For higher standard or deal with possible abominable environment for use, can select heat radiator dedicated of temperature control electric fan etc. for use, but radiating element only is the effect of assisting, rather than necessary.

Heat source near outer casing inner wall is for combinations such as two-sided heat radiation, external heat radiation, external thermometric provide supporting basis.Reduce or the sealed heat-dissipating hole, dustproof sand control, waterproof are damp proof, anti-to be stolen novel color screen electrical equipment such as tamper-proof supporting basis is provided in order to make.

11. Summary of drawings:

P1 Fig. 1 is a technical matters about thermal source directly outwards and the electromagenetic wave radiation synoptic diagram that directly is subjected to.

P1 Fig. 2 is the synoptic diagram of technical matters about the directly outside radiated electromagnetic wave of thermal source.

P1 Fig. 3 is an example 1, and the thermal source of fluoroscopic color monitor or colour television set is adjacent to the vertical view of outer casing inner wall.

P1 Fig. 4 is an example 2, the synoptic diagram on the heat source near outer casing inner wall of desk-top color screen electrical equipment such as vertical computer and heat conduction body heat road.

P2 Fig. 5 is an example 3, the side view of the heat source near outer casing inner wall of small-sized color screen electrical equipment such as panel computer.

P2 Fig. 6 is when being used for chip thermal source and socket thereof and being fixed on the circuit board reverse side, peripheral devices is blocked the metal cap upward view of hot blast.

P2 Fig. 7 is Fig. 6 front elevation.

P2 Fig. 8 is an example 4, the fixation side view of the circuit board of desk-top color screen electrical equipment such as vertical computer and the passage skeleton view between the shell and hard disk, CD-ROM drive.

P2 Fig. 9 is an example 4, the hard disk cover stereographic map of Fixed disk.

P2 Figure 10 is an example 5, and the CPU that is fixed on the circuit board reverse side is adjacent to the amplification front elevation that two-sided shielding is held concurrently in the two-sided heat radiation of outer casing inner wall.

P2 Figure 11 is Figure 10 left view.

P3 Figure 12 is CPU that example 6 is fixed on the circuit board front is adjacent to outer casing inner wall through heat conductor a amplification front elevation.

P3 Figure 13 is Figure 12 left view.

P3 Figure 14 is an example 7, and the CPU that is fixed on the circuit board front is adjacent to the amplification front elevation that two-sided shielding is held concurrently in the two-sided heat radiation of outer casing inner wall.

P3 Figure 15 is Figure 14 left view.

P3 Figure 16 is an example 8, and the CPU that is fixed on the circuit board front is adjacent to other enlarged left view that two-sided shielding is held concurrently in the two-sided heat radiation of outer casing inner wall.

P3 Figure 17 is an example 9, and the CPU of monolateral socket is adjacent to the amplification front elevation of outer casing inner wall.

Table 2: the mark mark explanation of accessory.

The mark mark	Accessory instruction card 2: mark mark			The accessory explanation
The mark mark	Accessory instruction card 2: mark mark			The accessory explanation	????1	Shell	????8	Circuit board
????10	Interference source	????18	Circuit board multioutlet socket		????1	Shell	????8	Circuit board
????10	Interference source	????18	Circuit board multioutlet socket	??2～7	Thermal source	????9	Shell fragment
12～17	The heat conductor corresponding with thermal source	????19	Flat shim	??2～7	Thermal source	????9	Shell fragment
12～17	The heat conductor corresponding with thermal source	????19	Flat shim	22～27	The auxiliary heat conductor corresponding with thermal source	??28、29	Gas passage
????62	The thermal source socket	????30	Electric fan	22～27		??28、29	Gas passage
????62	The thermal source socket	????30	Electric fan	31～37	Bolt	??48、49	Snap ring, grab
41～47	The nut corresponding with bolt	????50	Spring lever	31～37	Bolt	??48、49	Snap ring, grab
41～47	The nut corresponding with bolt	????50	Spring lever	51～57	The sleeve pipe corresponding with bolt	????58	Video card

12. embodiment:

Example 1, the reverse side of Fig. 3 circuit board 8 have thermal source 2 and thermal source 3, directly are adjacent to the inwall of shell 1.For non-fluoroscopic color screen electrical equipment, adopt following example.

Example 2, the desk-top color screen electrical equipment of Fig. 4, the inwall of shell 1 have is directly fixing the member of vertical cube to circuit board 8, and the heat conductor 15 and the nut 14 of screw arranged, and so fixedly is different and known technology.

There is multioutlet socket 18 in the front of circuit board 8, thermal source 2 is through U-shaped heat conductor 12 and be adjacent to the heat conductor 22 of stack, be adjacent to shell 1 inwall indirectly, near-thermal road length=ab+bc+cd, heat conductor 12 and heat conductor 22 are adjacent to the aggregate thickness=e+f at the minimum position of stack aggregate thickness.Bolt 31 and bolt 32 make up with nut 41 and nut 42 respectively through flat shim 19, and heat conductor 22, heat conductor 12 and thermal source 2 are adjacent to mutually with shell 1.

The positive basifacial of circuit board 8 has the slot of video card 58, thermal source 3 and thermal source 4 are arranged at the bottom of video card 58, thermal source 3 is adjacent to the boss face 11 of shell 1 bottom, and the thermal source 4 of large volume directly is adjacent to shell 1, and bolt 35 is adjacent to the inwall of thermal source 3 and thermal source 4 and shell 1 with nut 45 combinations of video card 58.

The reverse side top of circuit board 8 is fixed with high power valve 5, two limits have insulating mat 43 and heat-conducting plate 15 respectively about high power valve 5, heat-conducting plate 15 inside have screw to be fixed on the inwall of shell 1, and circuit board 15 is adjacent at shell 1 inwall high power valve 5 with bolt 33 combinations.Large-area heat-conducting plate 15 can reduce the temperature difference at shell 1 thermal source position.

The reverse side of circuit board 8 has the thermal source 6 that is adjacent to shell 1 inwall through liquid container heat conductor 16, liquid container heat conductor 16 can be a large amount of heat accumulation, bolt 33 and bolt 34 make up with nut 43 that is fixed on shell 1 inwall and nut 44 respectively, bolt 33 and bolt 34 large spans fixed shell fragment 9, the tandem compound of thermal source 6, heat conductor 16, outer casing inner wall is adjacent to.

There is the thermal source 7 that is adjacent to through L shaped heat conductor 17 and shell 1 inwall the reverse side below of circuit board 8, bolt 36 and bolt 37 make up with nut 46 that is fixed on shell 1 inwall and the nut 47 that is fixed on circuit board 8 respectively, and thermal source 7, heat conductor 17, shell 1 inwall are adjacent to mutually.

Example 3, the small-sized color screen electrical equipment of Fig. 5, there is the thermal source 2 that is fixed on socket 62 below of circuit board 8, also has the thermal source 3 that is adjacent to shell 1 inwall through square heat conductor 13, directly is adjacent to the thermal source 4 of shell 1 inwall in addition, the thermal source 5 of also useful insulating mat 52 bed hedgehoppings.Bolt 31 and bolt 32 cooperate shell fragments 9 respectively with the nut 41 and nut 42 combinations of circuit board 8 upper fixed, thin shell 1 and thermal source 3 and thermal source 4 are adjacent to.

Example 4, the desk-top color screen electrical equipment of Fig. 8, shell 1 and through type passage 28 and labyrinth passage 29 with the circulation of shell 1 extraneous gas are fixedly arranged between the circuit board of thermal source 5, be used to cooperate heat accumulation and under the heat environment, be shell 1 heat accumulation and heat radiation better, electric fan 30 more cooperates field or rugged surroundings to use.The left side of shell 1 respectively has thermal source CD-ROM drive 2, thermal source CD-ROM drive 3, thermal source assembly that the hard disk 4 of seal box is arranged up and down, all is directly to be adjacent to shell 1 inwall.Hard disk 4 also can be selected behind the hard disk cover of load map 9 fixing again, better antidetonation, noise reduction sound, resonance is fallen.

Example 5, Figure 10 and Figure 11, CPU thermal source 2 fronts that are fixed on circuit board 8 reverse side directly are adjacent to shell 1 inwall, and the reverse side of thermal source 2 also is adjacent to through heat conductor 12 inwall with shell 1, the two-sided heat radiation that the forms thermal source 2 two-sided shielding of holding concurrently.The reverse side of circuit board 8 has four bolts 31 to make heat conductor 12 be fixed on the front of circuit board 8 with the screw combination of leading ripe body 12 respectively.Circuit board 8 is fixing with nut 43 combinations that are fixed on shell 1 inwall by four bolts 33.Lock thermal source 2 again after being fixed on shell 1 inwall at circuit board 8, the socket check lock lever 62 of thermal source 2 preferably is lengthened to the outside of circuit board 8.

Example 6, Figure 12 and Figure 13, the CPU thermal source 2 that is fixed on circuit board 8 fronts is adjacent to shell 1 inwall through heat conductor 12.The flexible thing 20 of the reverse side of the thermal source 2 that socket 62 cooperates is supported the thermal source 2 more reliable heat conductors 12 that are adjacent to.After relying on four groups of bolts 31, bolt 32, nut 41 to make up, heat conductor 12 is fixed on the front of circuit board 8, heat conductor 12 has cross through hole near the position of shell 1, the inwall of the left and right sides shell 1 of heat conductor 12 respectively has snap ring 48 and grab 49, spring lever 50 passes the through hole of heat conductor 12, relies on snap ring 48, grab 49, spring lever 50 to make heat conductor 12 be adjacent to shell 1 inwall.Circuit board 8 relies on quadruplet bolt 33 and sleeve pipe 53 fixing with the screw combination of shell 1 inwall respectively.

Example 7, the CPU thermal source 2 that Figure 14 and Figure 15 are fixed on circuit board 8 fronts is adjacent to shell 1 inwall through heat conductor 12, circuit board 8 through holes of thermal source 2 reverse side have passed the heat conductor 22 that heat pipe 72 structures are arranged, and thermal source 2 reverse side are adjacent to shell 1 inwall through heat conductor 22, form the two-sided heat radiation two-sided shielding of holding concurrently.Heat conductor 12 has vertical through holes near the position of shell 1, and the inwall of lower and upper shell 1 of heat conductor 12 respectively has snap ring 48 and grab 49, and spring lever 50 passes the through hole of heat conductor 12, relies on snap ring 48 and grab 49 to make heat conductor 12 be adjacent to shell 1 inwall.Circuit board 8 relies on four bolts 33 fixing with nut 43 combinations that are fixed on shell 1 inwall respectively.

The CPU thermal source 2 that example 8, Figure 16 are fixed on circuit board 8 fronts is adjacent to shell 1 inwall through L shaped heat conductor 12, and the reverse side of thermal source 2 is adjacent to through heat conductor 22 inwall with shell 1, forms the two-sided heat radiation two-sided shielding of holding concurrently.Heat conductor 12 has vertical through holes near the position of shell 1, relies on the spring lever 50 of below that the heat conductor 12 and the inwall of shell 1 reliably are adjacent to.

Example 9, the CPU thermal source 2 of the monolateral socket of Figure 17 is adjacent to shell 1 inwall through heat conductor 12, and thermal source 2 compresses and relies on the circuit board 8 and the inwall of shell 1 to be adjacent to thermal source 2 with socket 62 combinations and circuit board conduction, heat conductor 12.

The above is only for referencial use, and unrestricted.Can select 26S Proteasome Structure and Function according to actual needs and the otherwise combined application.This case is compared with traditional method or effect, and method is simpler, effect is more obvious, more reliable characteristics.

Claims

1. the method for heat radiation of the heat source near outer casing inner wall of color display screen electric appliance or shielding is made up of thermal source and shell etc., and it is characterized in that: thermal source is adjacent to outer casing inner wall;

2. according to claim 1, described thermal source minimumly comprises or has made up: single-chip or, integrated chip or, CPU or, GPU or, hard disk or, CD drive or, high power valve or, battery, and the assembly of described thermal source.

3. according to claim 1, described outer casing inner wall minimumly comprises or has made up: the door of panel, base plate, side, shell or lid, with the keyboard and the keyboard periphery position of shell combination.

4. according to claim 1, described shell minimumly comprises or has made up: the planar metal plate shell, have the bending groove the sheet metal shell, with sheet metal be fixed on case surface and shell, the part of local thickening or all be shell, the metal casting of shape shell, metal level and non-metallic layer combined housing, contain the shell of the synthetic material structure of metal.

5. according to claim 1, the feature of described shell minimumly comprises or made up: outer casing inner wall has the directly fixing member of erectting circuit board; Perhaps, outer casing inner wall has roughening layer or blackout layer or the resistivity electrodeposited coating less than copper; Perhaps, outer casing inner wall directly is fixed with the radome of circuit board; Perhaps, shell is provided with boss face corresponding with heat source position or heat-conducting plate; Perhaps, outer shell outer wall has fixing thermal source or the member of combinations of sources of heat part is arranged; Perhaps, the aggregate thickness at certain position of the stamping parts of shell or weldment material is 1.3～1.5mm, contain 1.5mm or, 1.5～1.8mm, contain 1.8mm or, 1.8～2.2mm, contain 2.2mm or, 2.2～2.7mm, contain 2.7mm or, 2.7～5mm, contain 5mm or, 5～33mm contains 33mm.

6. according to claim 1, the structure of described heat source near outer casing inner wall minimumly comprises or has made up: with the jack design of chip thermal source or the chip thermal source reverse side at circuit board; Perhaps, with the design of the slot of video card in position that mainboard keeps to the side; Perhaps, between the circuit board of thermal source and shell, have thermal insulation board or with the passage of housing exterior airflow connection; Perhaps, in the outside of thermal source and heat conductor and outer casing inner wall cascaded structure the shell fragment member is arranged

7. according to claim 1, described color display screen electric appliance, minimum comprising: cabinet type computer, desktop computer, network computer, integrated computer, pocket computer, panel computer, palm PC, special purpose computer, computer peripheral equipment, computer external module, portable computer, the audio and video appliances that hard disk is arranged, colour TV, colored display.

8. according to claim 7, described integrated computer is meant that combination has 14.5～15.5 inch, contain 15.5 inch or, 15.5～16.5 inch, contain 16.5 inch or, 16.5～17.5 inch, contain 17.5 inch or, 17.5～18.5 inch, contain 18.5 inch or, 18.5～19.5 inch, contain 19.5 inch or, the various combined computers of＞19.5 inch display screens can have been selected or on-keyboard.

9. according to claim 7, described palm PC is meant that combined display screen is 1～6.5 inch, contain 6.5 inch or, 6.5～8 inch, contain 8 inch or, 8～9.5 inch, contain 9.5 inch or, 9.5～11 inch, contain 11 inch or, 11～12.5 inch contain the computer of 12.5 inch.