CN1440057A - Circuit board manufacturing method and device - Google Patents

Abstract

This wiring board manufacturing method includes a liquid removing process of supplying the liquid 22 to the surface of a board 10 and removing some of the liquid 22 on the surface of the board 10 by moving a pair of rollers each kept in contact with the surfaces of the board 10 relatively to the board 10. The object of invention is to remove a liquid so as to manufacture a product of high reliability by wiring board manufacturing method.

Description

Circuit board manufacturing method and manufacturing device

technical field

The invention relates to a manufacturing method and a manufacturing device of a circuit board.

Background technique

In the method of manufacturing a circuit board, a liquid such as water, acid, or alkali is supplied to the surface of the circuit board. Then remove the liquid and wash the board. In the past, liquid was removed by blowing air.

However, in the conventional method, since a large amount of air is blown, the manufacturing equipment is enlarged and the operation is complicated. Also, since a large amount of air is blown, oxidation of the circuit board is promoted, and product quality deteriorates.

Contents of the invention

The object of the present invention is to provide a liquid removal method capable of producing a high-reliability product.

The method for manufacturing a circuit board according to claim 1 of the present invention includes a step of supplying a liquid to the surface of a substrate and removing at least a part of the liquid on the surface of the substrate. A pair of rollers in surface contact removes at least a portion of the liquid.

According to the present invention, since the roller is used, at least a part of the liquid on the surface of the substrate can be easily removed. In addition, since the circuit board is clamped to a certain extent only to remove the liquid, it is possible to prevent the deterioration of the quality of the circuit board without promoting the oxidation of the wiring. Therefore, a high-reliability product can be manufactured.

In the method for manufacturing a circuit board according to the second aspect of the present invention, the step of removing the liquid may be continuously performed after the step of supplying the liquid.

In the method for manufacturing a circuit board according to claim 3 of the present invention, the circuit board is formed in an elongated shape, and may be in a region including a liquid supply unit for performing the process of supplying the liquid and a liquid removal process unit for performing the process of removing the liquid, The aforementioned substrates are conveyed from one roller to the other.

According to the present invention, since the continuous operation of the circuit board manufacturing process can be realized, the production efficiency can be improved and the manufacturing cost can be reduced.

In the method for manufacturing a circuit board according to claim 4 of the present invention, the step of removing the liquid may include removing the liquid with the roller and then blowing air to the substrate to remove at least a part of the liquid on the substrate.

Thereby, liquid can be removed more reliably.

In the manufacturing method of the circuit board of Claim 5 of this invention, the said board|substrate has wiring, and the surface of the said roller which contacts the said board|substrate may be formed with the material softer than the said wiring material.

Thereby, the liquid can be removed without damaging the wiring.

In the manufacturing method of the circuit board of Claim 6 of this invention, the process of washing the said board|substrate may be further included after the said liquid removal process.

A circuit board manufacturing apparatus according to claim 7 of the present invention includes a liquid supply unit for supplying liquid to the surface of the substrate, a liquid removal unit for removing at least a part of the liquid on the surface of the substrate, and a liquid removal unit provided in the liquid removal unit and connected to each surface of the substrate. A pair of rollers in contact, wherein said rollers move relative to said substrate and thereby remove at least a portion of said liquid on said substrate.

According to the present invention, at least a part of the liquid on the surface of the substrate can be easily removed using a roller. And only by sandwiching the circuit board to the extent that the liquid is removed, the oxidation of the wiring is not promoted and the deterioration of the quality of the circuit board can be prevented. Therefore, it is possible to manufacture a highly reliable product.

In the circuit board manufacturing apparatus according to the eighth aspect of the present invention, the liquid removing unit may be provided continuously on the downstream side of the substrate conveying direction with respect to the liquid supply unit.

In the circuit board manufacturing apparatus according to claim 9 of the present invention, the board is formed in an elongated shape, and further includes a pair of rollers on which the board is placed in a region including the liquid supply unit and the liquid removal unit, for One roller conveys the above-mentioned substrate to the other roller.

As a result, since the continuous operation of the circuit board manufacturing process can be realized, the production efficiency can be improved and the manufacturing cost can be reduced.

In the circuit board manufacturing apparatus according to claim 10 of the present invention, the liquid removal unit is provided with a blowing unit for blowing air to the board.

Thereby, liquid can be removed more reliably.

In the circuit board manufacturing apparatus according to the eleventh aspect of the present invention, the air blowing unit may be provided on a downstream side in a direction in which the board is conveyed with respect to the rollers.

Accordingly, when the liquid remains on the substrate, at least a part of the liquid can be removed by using a roller.

In the circuit board manufacturing apparatus according to claim 12 of the present invention, the board has wiring, and a surface of the roller that contacts the board may be formed of a material softer than a material of the wiring.

Thereby, the liquid can be removed without damaging the wiring.

In the circuit board manufacturing apparatus according to claim 13 of the present invention, a cleaning unit for cleaning the substrate may be further included on the downstream side of the conveyance direction of the substrate relative to the liquid removal unit.

In the above method of manufacturing a circuit board, between the liquid supply unit and the liquid removal unit, the substrate may be conveyed approximately horizontally from one roller to the other roller.

As a result, the liquid often flows out from the substrate during the approximately horizontal conveyance, but the liquid can be easily removed by using rollers.

In the manufacturing method of the above-mentioned substrate, in the step of removing the liquid, the air may be blown after removing the liquid with a roller.

Accordingly, when liquid remains on the substrate, at least a part of the liquid can be removed by using a roller.

In the above method of manufacturing a circuit board, in the step of supplying the liquid, the liquid may be distributed on the substrate.

In the manufacturing apparatus of the circuit board described above, the substrate may be conveyed approximately horizontally from one roller to the other roller between the liquid supply unit and the liquid removal unit.

As a result, the liquid often flows out from the substrate during the approximately horizontal conveyance, but the liquid can be easily removed by using rollers.

In the manufacturing apparatus of the circuit board described above, a nozzle for dispersing the liquid onto the substrate may be provided in the liquid supply unit.

Description of drawings

FIG. 1 is a diagram showing a method and apparatus for manufacturing a circuit board according to Embodiment 1 of the present invention.

FIG. 2 is a diagram showing a method and apparatus for manufacturing a circuit board according to Embodiment 2 of the present invention.

FIG. 3 is a diagram showing an electronic device according to an embodiment of the present invention.

FIG. 4 is a diagram showing an electronic device according to an embodiment of the present invention.

Detailed ways

Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the following examples.

(Example 1)

FIG. 1 is a diagram showing a method and apparatus for manufacturing a circuit board according to Embodiment 1 of the present invention.

The manufacturing apparatus 1 is used for wet processing of the substrate 10 . The form of wet processing is not limited. For example, a developing step in photolithography, surface treatment (plating treatment) of a circuit board, wet etching, dissolution (stripping) of a protective layer, washing step, and the like can be exemplified.

The substrate 10 is a flexible substrate (flexible substrate) and is usually made of an organic material (such as polyimide). Depending on the type of wet processing, the structure of the substrate 10 is also different, for example, it may have a material as a wiring. The substrate 10 may be a substrate for COF (Chip On Film) or a substrate for TAB (Tape Automated Bonding).

In the manufacturing apparatus 1 , a so-called roller-to-roller conveyance method in which the substrate 10 is laid and conveyed by a plurality of rollers 12 and 14 can be used. That is, the manufacturing device 1 includes a pair of rollers 12 , 14 .

The manufacturing device 1 may be a part of a circuit board (or semiconductor device) manufacturing line. That is, by the roller-to-roller transfer method, other steps can be performed in parallel with the steps shown in this embodiment (liquid supply, removal, and washing steps) (as front and rear steps).

The substrate 10 is formed in a strip shape (or a tape shape). The substrate 10 is rolled into a cylindrical shape by a pair of rollers 12 and 14 provided at both ends of one production line (including the production apparatus 1 ). In the example shown in FIG. 1 , the substrate 10 is fed out from the roller 12 and the substrate is wound on the roller 14 . Between the rollers 12 , 14 , the substrate 10 is conveyed in the longitudinal direction of the substrate 10 . The rollers 12 and 14 are in contact with at least both ends in the width direction of the substrate 10 . The rollers 12 and 14 may be conveyed with their sprockets fitted into the holes at both ends in the width direction of the substrate 10 , or may be conveyed without using sprockets. If the conveyance from roller to roller is adopted, since the manufacturing process of the circuit board can be made into a continuous operation, the production efficiency can be improved and the manufacturing cost can be reduced.

The manufacturing apparatus 1 includes a liquid supply unit 20 for supplying a liquid to the surface of the substrate 10 and a liquid removal unit 30 for removing at least part of the liquid 22 on the surface of the substrate 10 . As shown in FIG. 1 , when the liquid supply and liquid removal units 20 and 30 are installed on one production line (it has nothing to do with the transfer of roller to roller), the liquid removal unit 30 is arranged at The downstream side of the substrate 10 direction is conveyed. In the example shown in FIG. 1, the liquid supply and liquid removal units 20, 30 are arranged consecutively so that there is no other process between them.

The substrate 10 is conveyed between the liquid supply and liquid removal units 20 and 30 by one roller to the other roller. As shown in FIG. 1 , the substrate 10 can be transported approximately horizontally between the liquid supply and liquid removal units 20 and 30 . As a result, since the substrate 10 can be transported without bending as much as possible, it is possible to prevent the substrate 10 from being subjected to stress. In addition, when the substrate 10 is transported approximately horizontally between the liquid supply and liquid removal units 20, 30, the liquid 22 often flows out from the substrate 10 without being accumulated during the transport process, but by using this embodiment, the liquid 22 can be easily removed. at least partly.

In the example shown in FIG. 1 , the liquid supply unit 20 is provided with one or more (three in FIG. 1 ) nozzles 24 for supplying the liquid 22 to at least the surface of the substrate 10 subjected to the wet process. That is, the nozzle 24 may be provided above or below the substrate. The composition of the above-mentioned liquid 22 depends on the form of wet treatment, for example, it may be an alkaline solution, an acidic solution, or water.

The nozzle 24 distributes the liquid 22 over the surface of the substrate 10 . For example, the liquid 22 can be sprayed out through the nozzle 24 in the form of mist (droplet). Alternatively, the method of supplying the liquid 22 is not limited to the above-mentioned spraying method. For example, the method of treating the surface of the substrate 10 may also be a method of coating the surface of the substrate 10 with the liquid 22 or immersing the substrate 10 in the liquid 22.

In the example shown in FIG. 1 , the liquid 22 is supplied to one surface of the substrate 10 . For example, the liquid 22 may be supplied to the surface of the substrate 10 on which wiring is formed. Alternatively, the liquid 22 may be supplied to both surfaces of the substrate 10 . In this case, nozzles 24 are provided on each surface of the substrate 10 .

As shown in FIG. 1 , a pair of rollers 32 and 34 in contact with both main surfaces of the substrate 10 are provided in the liquid removal unit 30 . As shown in FIG. 1 , the rollers 32 and 34 rotate relative to the substrate 10 by moving while contacting the surface of the substrate 10 . At least a portion of the liquid 22 on the surface of the substrate 10 is removed by the substrate 10 passing between the rollers 32 , 34 which contact the substrate 10 . That is, the liquid on the substrate 10 can be removed.

In the example shown in FIG. 1 , the roller 32 is provided on the first surface of the substrate 10 , and the roller 34 is provided on the second surface which is the back side of the first surface of the substrate 10 . The respective rollers 32 and 34 are provided at overlapping positions in a plan view of the substrate 10 . The rollers 32, 34 and the surface of the substrate 10 are in approximately line contact. Accordingly, the rollers 32 and 34 are moved in a direction perpendicular to the line contact direction of the surface of the substrate 10 with respect to the substrate 10 , and the liquid 22 on the surface of the substrate 10 is removed. The width of the rollers 32 and 34 (roller axial width) is ideally larger than the width of the substrate 10, but the size is not limited.

In the example shown in FIG. 1, relative movement of the substrate 10 and the rollers 32, 34 is achieved by conveying the substrate 10 from one roller to the other. At this time, in the liquid removal unit 30, the positions of the rollers 32 and 34 may be fixed in the longitudinal direction of the substrate 10, or may be movable in a direction opposite to the direction in which the substrate 10 is transported. In addition, the rollers 32 and 34 may be rollers whose position can be adjusted in a direction perpendicular to the surface of the substrate 10 . Thus, the width between the rollers 32 and 34 can be adjusted according to the thickness of the substrate 10 .

Each roller 32, 34 may have the same form (eg same diameter and width) as in Fig. 1, or a different form (eg different diameter and width).

The surfaces of the rollers 32 and 34 that come into contact with the substrate 10 may be formed of a softer material (for example, plastic (PET resin, etc.)) than the wiring (for example, copper) formed on the substrate 10 . More specifically, among the rollers 32 and 34 , the portion (for example, the surface of the roller 32 ) that is in contact with the wiring material (for example, conductive foil) on the substrate 10 may be formed of a material softer than the wiring. Thereby, at least a part of the liquid 22 can be removed without damaging the wiring.

The contact surfaces of the rollers 32, 34 in contact with the substrate 10 may be formed of an elastic material, and the above-mentioned elasticity should make the unevenness on the rollers 32, 34 and the substrate 10 (for example, the unevenness formed by the wiring material and the base material) ) stick together tightly. Accordingly, the liquid 22 can be more reliably removed from the substrate 10 .

In addition, a plurality of pairs of rollers 32 and 34 may be provided in the liquid removal unit 30 differently from FIG. 1 . At this time, each pair of rollers 32, 34 is aligned in the conveying direction of the substrate.

In the example shown in FIG. 1 , manufacturing apparatus 1 includes cleaning unit 40 for cleaning substrate 10 . The cleaning unit 40 is provided on the downstream side in the transport direction of the substrate 10 with respect to the liquid removal unit 30 . In the cleaning unit 40 , when a part of the liquid 22 remains on the substrate 10 after passing through the liquid removing unit 30 , the substrate 10 is washed (eg, washed with water) to almost completely remove the liquid 22 remaining on the substrate 10 . As a result, since at least a part of the liquid 22 is removed in the liquid removing unit 30 in the above process, the amount of washing liquid in the washing unit 30 can be reduced. Thereby, the structure of the washing unit 30 can be simplified.

The circuit board manufacturing apparatus of the present embodiment has the above-mentioned structure, and a circuit board manufacturing method using the above-mentioned manufacturing apparatus 1 will be described below. In addition, in the following method of manufacturing a circuit board, any one of the contents that can be derived from the above-mentioned contents can be selected and used.

The manufacturing method of this embodiment includes the above-mentioned wet processing steps. In this embodiment, as a form of wet processing, an example of dissolving (peeling off) a protective layer on the substrate 10 (for example, a protective layer used as a mask for forming wiring) will be described. However, the manufacturing method of this embodiment is not limited to the above example.

First, the board|substrate 10 which provided the conductive foil (for example, copper foil) on the base material (for example, polyimide) is prepared. The conductive foil is attached to the entire surface of the substrate (the above-mentioned surface on the front side), for example, with an adhesive. And on the substrate 10, a photosensitive protective layer is formed, and the protective layer is exposed and developed through a mask with a certain pattern shape. Then, the portion exposed from the protective layer in the conductive foil is immersed in an etchant (etching solution) to perform etching. As a result, wiring of a fixed shape is formed on the substrate 10, and the protective layer remains on the wiring.

As shown in FIG. 1, the above-mentioned substrate 10 rides on rollers 12, 14, and is conveyed from one roller to the other roller. In addition, in the liquid supply unit 20 , a liquid 22 (such as an alkaline solution) for dissolving the above-mentioned protective layer is supplied to the substrate 10 . In the example shown in FIG. 1 , the liquid 22 is supplied to the substrate 10 using a nebulizer. By supplying the liquid 22, the protective layer on the substrate 10 is dissolved, and the liquid 22 remains on the substrate.

Next, the substrate 10 is transported to the liquid removal unit 30 , and at least a part of the liquid 22 remaining on the substrate 10 is removed by the rollers 32 and 34 . Specifically, at least a part of the liquid 22 on the substrate 10 is removed by bringing the rollers 32 and 34 into contact with the substrate 10 . At this time, part of the liquid 22 remaining on the surface of the wiring on the substrate 10 can be removed by the rollers 32 and 34 . Alternatively, not only a part of the liquid 22 remaining on the surface of the wiring on the substrate 10 but also a part of the liquid 22 remaining on the surface of the inter-wiring base material on the substrate 10 may be removed. Then, if necessary, the substrate 10 is transported to the washing unit 40 to wash the substrate 10 and remove the liquid 22 almost completely.

Thereby, a plurality of wirings having a fixed shape can be formed on the substrate 10, and a circuit board can be obtained. Finally, electronic components such as semiconductor chips are mounted on the strip-shaped circuit board, and are separated in a predetermined area.

In addition, the detailed description of each process is the same as the description of each process in the said manufacturing apparatus.

According to this embodiment, since the rollers 32 and 34 are used, at least a part of the liquid 22 on the substrate 10 can be easily removed. In addition, since the removal liquid 22 sandwiches the circuit board to a certain extent, oxidation is not promoted, and deterioration of the quality of the circuit board can be prevented. Especially as the liquid 22, when using alkali or acid solution, if the process of blowing air is carried out at the same time, the oxidation of the circuit board will be promoted, so the use of this embodiment will have a good effect. And thus can manufacture high reliability products.

(Example 2)

Fig. 2 is a diagram showing a method and apparatus for manufacturing a circuit board according to Embodiment 2 of the present invention. In this embodiment, the form of the liquid removal unit 130 is different from the above-described embodiments. In the following description, any content derived from the above content can be selected and used.

As shown in FIG. 2 , the liquid removal unit 130 has the aforementioned rollers 32 , 34 and a blower for blowing out air 38 . The blower can be an air knife. The blower has one or more (one in FIG. 2 ) blowing parts 36 for air 38 . The blowing unit 36 blows air 38 to at least one surface of the substrate 10 . By blowing air, the liquid 22 can be volatilized and removed. According to this embodiment, since the rollers 32 and 34 are used together, the amount of air 38 used is less than that of the method of removing the liquid 22 by blowing only the air 38 . As a result, oxidation of the circuit board can be prevented.

As shown in FIG. 2 , the blowing portion 36 of the air 38 may be provided on the downstream side in the conveying direction of the substrate 10 with respect to the rollers 32 and 34 . Thereby, when the liquid 22 remains on the substrate 10, even if the rollers 32 and 34 are used, at least a part of the liquid 22 can be removed.

In this embodiment as well, the above effects can be achieved, and the liquid 22 on the substrate 10 can be removed more reliably. In addition, since the structure and effect of the circuit board manufacturing method of this embodiment can be derived from the above, description is omitted.

As electronic equipment having the circuit board of this embodiment, a notebook computer 200 is shown in FIG. 3 , and a mobile phone 300 is shown in FIG. 4 .

The present invention is not limited to the above-described embodiments, and various changes can be made. For example, the present invention includes structures substantially the same as those described in the embodiments (for example, structures with the same function, method, and effect, or structures with the same purpose and result). In addition, this invention includes the structure which replaced the insubstantial part demonstrated in the Example. In addition, the present invention includes structures that have the same effect or achieve the same purpose as the structures described in this embodiment. In addition, the present invention includes configurations in which known techniques are added to the configurations described in the embodiments.

Claims (13)

1, a kind of manufacture method of circuit board, comprise to the substrate surface feed fluid, remove the operation of at least a portion of the lip-deep aforesaid liquid of aforesaid substrate, in above-mentioned operation of removing liquid, with respect to aforesaid substrate, move a pair of roller that contacts with each surface of aforesaid substrate and at least a portion of removing aforesaid liquid.

2, the manufacture method of circuit board according to claim 1, the operation of after the operation of above-mentioned feed fluid, removing aforesaid liquid continuously.

3, the manufacture method of circuit board according to claim 1 and 2, aforesaid substrate forms strip, and, aforesaid substrate is transported to another roller from a roller at the fluid supply unit that comprises the operation of carrying out above-mentioned feed fluid and carry out the zone that the above-mentioned liquid of removing the operation of liquid is removed the operation unit.

4, the manufacture method of circuit board according to claim 1 and 2, above-mentioned operation of removing liquid comprise that removing aforesaid liquid by above-mentioned roller blows air to aforesaid substrate afterwards, thereby remove at least a portion of the aforesaid liquid on the aforesaid substrate.

5, the manufacture method of circuit board according to claim 1 and 2, aforesaid substrate has distribution, and the face that contacts with aforesaid substrate in the above-mentioned roller can be formed by the material than above-mentioned wiring material softness.

6, the manufacture method of circuit board according to claim 1 and 2 also comprises the operation of cleaning aforesaid substrate after the above-mentioned operation of removing liquid.

7, a kind of manufacturing installation of circuit board, the liquid of comprise fluid supply unit to the substrate surface feed fluid, removing the lip-deep aforesaid liquid at least a portion of aforesaid substrate is removed the unit and is arranged at a pair of roller that aforesaid liquid is removed the unit and contacted with each surface of aforesaid substrate, wherein, above-mentioned roller is to move with respect to aforesaid substrate, and removes at least a portion of the aforesaid liquid on the aforesaid substrate thus.

8, according to the manufacturing installation of the described circuit board of right claim 7, aforesaid liquid is removed the unit with respect to the aforesaid liquid feed unit, is arranged on the downstream of aforesaid substrate throughput direction continuously.

9, according to the manufacturing installation of right claim 7 or 8 described circuit boards, aforesaid substrate forms elongate in shape, and also comprise in the zone of unit and take a pair of roller of putting aforesaid substrate comprising that aforesaid liquid feed unit and aforesaid liquid are removed, be used for carrying aforesaid substrate to another roller from a roller.

10, according to the manufacturing installation of right claim 7 or 8 described circuit boards, remove the unit at aforesaid liquid the portion that blows out of blowing air to aforesaid substrate is set.

11, according to the manufacturing installation of the described circuit board of right claim 10, above-mentioned air blows out portion can be arranged on the downstream of carrying the aforesaid substrate direction with respect to above-mentioned roller.

12, according to the manufacturing installation of right claim 7 or 8 described circuit boards, aforesaid substrate has distribution, and the face that contacts with aforesaid substrate in the above-mentioned roller can be formed by the material than above-mentioned wiring material softness.

13, according to the manufacturing installation of right claim 7 or 8 described circuit boards, remove the unit, also comprise the washing unit of cleaning aforesaid substrate in the downstream of aforesaid substrate throughput direction with respect to liquid.