CN1336788A

CN1336788A - Electrode junction structure and manufacturing method thereof

Info

Publication number: CN1336788A
Application number: CN 00122231
Authority: CN
Inventors: 吴俊翰; 蔡增喜; 陈柏丞
Original assignee: Acer Display Technology Inc
Current assignee: AUO Corp
Priority date: 2000-07-31
Filing date: 2000-07-31
Publication date: 2002-02-20
Anticipated expiration: 2020-07-31
Also published as: CN1189064C

Abstract

An electrode bonding structure includes a panel, a flexible circuit board, and an anisotropic conductive layer. The panel surface has a panel dielectric layer and a groove-type signal connection terminal. The surface of the recessed signal connection terminal is lower than the surface of the panel dielectric layer by a recess depth (H3). The surface of the flexible circuit board has bump-type signal connection terminals, and the surface of the signal connection terminals is higher than the surface of the dielectric layer by a protruding height (H1). The anisotropic conductive layer is disposed between the panel and the flexible circuit board and has a thickness (H2). Wherein, H1> = H2+ H3. The invention can reduce the thermal expansion deformation of the flexible circuit board when the panel is jointed with the flexible circuit board, and can improve the yield of products.

Description

Electrode joint structure and manufacture method thereof

The present invention relates to a kind of electrode joint structure that reduces flexible PCB thermal expansion effects when engaging, particularly relate to a kind of panel (panel) and flexible PCB (Flexible Printed Circuit, FPC) a kind of electrode joint structure on that is used in flat-panel screens (flat display panel).

In the mounting technique of flat-panel screens, LCD (Liquid Crystal Display for example, LCD) or plasma display (Plasma Display Panel, PDP), all use a plurality of flexible PCBs that the flat display driving circuit is linked to each other with the panel (comprising header board and back plate) of flat-panel screens.Flexible PCB is sent on the panel controlling signal of drive circuit.Wherein, respectively have a plurality of electrodes on flexible PCB and the panel, the electrode on the flexible PCB is electrically connected with electrode on the panel, in order to transmit above-mentioned controlling signal.

Please refer to Figure 1A-1C, wherein, that Figure 1A illustrated is the electrode lay-out figure of traditional panel; Figure 1B illustrated is along the end view of Y directional profile among Figure 1A; And Fig. 1 C illustrates is along the cutaway view of directions X section among Figure 1A.Glass substrate 102 and a plurality of electrodes have been comprised on traditional panel 100, for example electrode 104 and electrode 106.These electrodes are strip, and are distributed in equably on the glass substrate 102.Spacing between electrode and the electrode (pitch) is P μ m (10 ^-6M), for example be 300 μ m.Wherein, electrode is made by silver metal.

Please refer to Fig. 2, the panel shown in Figure 1A～Fig. 1 C that is to use that it illustrated engages preceding cutaway view with flexible PCB.Flexible PCB 200 uses a hot pressing technology with panel 100 it is engaged.Flexible PCB 200 comprises poly-imines (polyimide) layer 202 and a plurality of electrodes.The layout type of these electrodes on poly-imine layer 202 is also as the layout type of electrode on glass substrate 102 shown in Figure 1A～Fig. 1 C.Carrying out before hot pressing technology, the spacing sum of all electrodes 216 of flexible PCB is A μ m, and the spacing sum of all electrodes 218 of panel is B μ m.Wherein, the electrode 216 of flexible PCB can be made by the copper metal.

In addition, also use an anisotropic conductive film (Anisotropic Conductive Film between flexible PCB 200 and the panel 100, ACF) (be not shown among the figure), have a plurality of conducting particless in the anisotropic conductive film, make between the electrode of the electrode of flexible PCB 200 and panel 100 only in the vertical direction conducting.

In the middle of the process that hot pressing, because panel 100 is different with the composition material of flexible PCB 200, its thermal coefficient of expansion is also inequality.If carry out hot pressing and after the technology, the spacing of all electrodes 216 of flexible PCB and be A ＇ μ m, and the spacing of all electrodes 218 of panel and be B ＇ μ m, then A ＇ must equal B ＇, can make that panel 100 and flexible PCB 200 are bonded with each other.Therefore, carry out the spacing and the A μ m of all electrodes 216 of the preceding flexible PCB 200 of hot pressing work, the pass of the spacing of all electrodes 216 of panel 100 and B μ m is: B equals A and multiply by a thermal compensation coefficient.Wherein, this thermal compensation coefficient and glass substrate 102, poly-imine layer 202, anisotropic conductive film and to influence the thermal coefficient of expansion of heat conducting material when being used for production process relevant.When influencing heat conducting substance change when selected glass substrate 102, when gathering imine layer 202, anisotropic conductive film and being used for manufacture craft, this thermal compensation coefficient also changes thereupon.

In Figure 1A, the electrode of being made by silver metal on traditional panel 100 will have silver ion migration (Ag ⁺Migration) problem produces.Along with the increase of service time, the phenomenon of silver ion migration can be more serious between silver electrode on the panel 100 and the silver electrode, even make and produce situation of short circuit between electrode.And when the requirement of the resolution of flat-panel screens improved, the spacing of electrode must reduce thereupon, and like this, the influence that the silver ion transport phenomena is caused will be more remarkable.

In addition, in Fig. 2, because the thermal compensation coefficient is seemed complicated and is difficult to design so flexible PCB 200 is considered many-sided factor because of need in design by the selected materials decision of flexible PCB 200 and panel 100.And in the middle of manufacture craft, the thermal compensation coefficient also can be subjected to the influence of environmental factor (as temperature, pressure) and change.To make all electrodes 218 of all electrodes 216 and panel of flexible PCB also have error and produce engaging inch like this, and make the rate of finished products of product reduce.

In view of this, purpose of the present invention is exactly that a kind of electrode joint structure that reduces flexible PCB thermal expansion effects when engaging is being provided.As long as make electrode end widen amplification, and change its allocation position, add that dielectric layer covers, then can solve the problem of the silver ion migration in the conventional practice.Mating surface plate electrode and the concavo-convex design of flexible PCB top electrode can make that the error when flexible PCB engages with panel reduces.Like this, can improve the rate of finished products of product.

According to purpose of the present invention, a kind of electrode joint structure that reduces flexible PCB thermal expansion effects when engaging is proposed, comprising: a panel, a flexible PCB, with an anisotropic conductive layer.Panel surface has a panel dielectric layer and a fluted body signal link.Fluted body signal link surface is lower than panel dielectric layer surface one cup depth (H3).Flexible PCB is arranged at a side of panel abreast, and the flexible PCB surface has a flexible PCB dielectric layer and a projection type signal link.Projection type signal link surface is higher than flexible PCB dielectric layer surface one projecting height (H1).Anisotropic conductive layer places between panel and the flexible PCB, and anisotropic conductive layer has an anisotropic conductive layer thickness (H2).Wherein, the projecting height (H1) of projection type signal link is more than or equal to the summation of anisotropic conductive layer thickness (H2) and cup depth (H3) (H1＞=H2+H3), so when this panel of pressing and flexible PCB, the part anisotropic conductive layer corresponding to projection type signal link can be squeezed and conducting at least.And projection type signal link can be embedded in the fluted body signal link, when engaging with flexible PCB to reduce panel, and the thermal expansion deflection of flexible PCB.

According to another object of the present invention, a kind of electrode joint structure that reduces flexible PCB thermal expansion effects when engaging is proposed, comprising: a panel, a flexible PCB, with an anisotropic conductive layer.Panel surface has a panel dielectric layer and a projection type signal link.Projection type signal link surface is higher than this panel dielectric layer surface one projecting height (H1).Flexible PCB is arranged at a side of panel abreast.The flexible PCB surface then has a flexible PCB dielectric layer and a fluted body signal link.Fluted body signal link surface is lower than flexible PCB dielectric layer surface one depression height (H3).Anisotropic conductive layer places between panel and the flexible PCB, and anisotropic conductive layer has an anisotropic conductive layer thickness (H2).Wherein, the projecting height (H1) of projection type signal link is more than or equal to the summation of anisotropic conductive layer thickness (H2) and this cup depth (H3) (H1＞=H2+H3), so, when pressing panel and flexible PCB, the part anisotropic conductive layer corresponding to projection type signal link can be squeezed and conducting at least.And projection type signal link can be embedded in the fluted body signal link, engages inch with flexible PCB, the thermal expansion deflection of panel to reduce panel.

For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. elaborates.In the accompanying drawing:

Figure 1A illustrates the electrode lay-out figure of traditional panel;

Figure 1B illustrates among Figure 1A the end view along the Y directional profile;

Fig. 1 C illustrates among Figure 1A the cutaway view along the directions X section;

Fig. 2 illustrates the panel shown in use Figure 1A～1C and engages preceding cutaway view with flexible PCB;

Fig. 3 A illustrates according to the electrode lay-out schematic diagram on a kind of panel of one embodiment of the present invention;

Fig. 3 B illustrates among Fig. 3 A the end view along the Y directional profile;

Fig. 3 C illustrates among Fig. 3 A the cutaway view along the directions X section;

Fig. 4 A illustrates when using fluted body signal link, the end view along the Y directional profile of Fig. 3 A;

Fig. 4 B illustrates when using fluted body signal link, the cutaway view along the directions X section of Fig. 3 A;

Fig. 5 A illustrates according to the electrode lay-out schematic diagram on a kind of flexible PCB of one embodiment of the present invention;

Fig. 5 B illustrates when using projection type signal link, among Fig. 5 A along the end view of Y directional profile;

Fig. 5 C illustrates when using fluted body signal link, the cutaway view along the directions X section of Fig. 5 A;

Fig. 6 A illustrates the fluted body signal link panel that uses Fig. 4 B to be illustrated, with the flexible PCB of the projection type that uses Fig. 5 C to be illustrated, and the phantom before engaging;

Fig. 6 B illustrates the panel that uses the fluted body signal link that Fig. 4 B illustrated, with the flexible PCB of the projection type that uses Fig. 5 C to be illustrated, the phantom behind the joint;

Fig. 7 A illustrates the graph of a relation of time counter plate and the system temperature variation of flexible PCB when hot pressing;

Fig. 7 B illustrates the flexible PCB hot pressing on panel the time, the graph of a relation that the pressure that the time produces the flexible PCB counter plate changes;

Fig. 8 A illustrates the flexible PCB that uses flat type signal link, with the panel that uses the projection type, and the phantom before engaging;

Fig. 8 B illustrates the flexible PCB that uses flat type signal link, with the panel that uses the projection type, the phantom behind the joint;

Fig. 8 C illustrates the flexible PCB that uses fluted body signal link, with the panel that uses the projection type, and the phantom before engaging;

Fig. 8 D illustrates the flexible PCB that uses fluted body signal link, with the panel that uses the projection type, the phantom behind the joint;

Fig. 9 illustrates the electrode lay-out figure of another kind of panel or flexible PCB.

Label declaration:

100,300: panel

102,302: glass substrate

104,106,216,218,304,306,504,506,902,906: electrode

200: flexible PCB

202: poly-imine layer

308,310,312,314,316,318,320,334,508,510,512,514,516,518,520,534,904,908: the signal link

322,522: dielectric layer

402,404,406: groove

500: flexible PCB

502: poly-imine layer

530: anisotropic conductive layer

Preferred embodiment

Please be simultaneously with reference to Fig. 3 A～3C, wherein, Fig. 3 A illustrates according to the electrode lay-out schematic diagram on a kind of panel of one embodiment of the present invention; Fig. 3 B illustrates among Fig. 3 A the cutaway view along the Y-Y cross section; And Fig. 3 C illustrates among Fig. 3 A the cutaway view along the X-X cross section.Panel 300 comprises the glass substrate 302 and the first signal output device.The first signal output device comprises a plurality of electrodes, as first, second, third panel bonding electrodes, all has one first width.The first and the 3rd panel bonding electrodes is that noncontinuous electrode 304, the second panel bonding electrodes are long electrode 306.The end of each electrode is a signal link (pad), that is to say, comprise first, second, third signal link on the glass substrate 302, lay respectively at first end of this first, second, third panel bonding electrodes, and all has one second width, as shown in the figure: the first, the 3rd signal link 308,312 of noncontinuous electrode 304 ends and the second signal link 310 of long electrode 306 ends.In an embodiment of the present invention, the signal link is added the width of its width of ambassador greater than institute's connection electrode, just second width of signal link is greater than first width of panel bonding electrodes.These long electrodes and noncontinuous electrode place on the glass substrate 302 in interconnected mode.Just, the first and the 3rd signal link all is positioned on one first horizontal linear, and the second signal link is positioned on one second horizontal linear, and this first horizontal linear and second horizontal linear have one first spacing.Wherein, two adjacent signal links 308,310 are spaced apart 300 μ m (P spacing) along directions X, and two adjacent signal links 308,310 then are 1000 μ m (D spacings) along the Y direction at interval.

Signal link shown in Fig. 3 B and Fig. 3 C is the signal link of a flat type.Except the join domain of signal link correspondence, all covered a dielectric layer (dielectric) 322 on each electrode, to improve two interelectrode isolated effects, can reduce interelectrode silver ion migration situation like this, produce the probability of short circuit to reduce panel 300.The height that this flat type signal link refers to signal link 310,314,318 end faces is identical with the apical side height of dielectric layer 322.

And interconnected mode refers to, and each electrode is extended in parallel along Y direction, and the signal link of every n electrode is placed on the X-direction parallel lines of the different Y-axis coordinates of n bar in regular turn, will make the spacing (pitch) of signal link increase like this.Now with n=2 the example explanation.In Fig. 3 A, be provided with two parallel lines L1 and L2 along X-direction, and L1 and L2 are spaced apart the D gap.Making the 1st signal link 308 and the 2nd signal link 310 is one group, and on be placed in regular turn straight line L1 and the straight line L2.In like manner as can be known, place on the straight line L1 be the 1st signal link 308, the 3rd signal link 312, the 5th signal link 316, with the 7th signal link 320 or the like.Place on the straight line L2 then be the 2nd signal link 310, the 4th signal link 314, with the 6th signal link 318 or the like.The interconnected mode of signal link makes the spacing (pitch) between the signal link broaden.In Fig. 3 A, the spacing of the 2nd signal link 310 and the 4th signal link 314 is 2P μ m, is 2 times of the spacing P μ m of conventional practice; And shown in Fig. 3 B～3C, cover upper dielectric layers 322 in other parts of electrode, can be so that adjacent electrode of two-phase and two adjacent signal links isolated effect improved.Comprehensive above-mentioned two effects will reduce the phenomenon of the silver ion migration in the conventional practice effectively.

Please refer to Fig. 4 A～Fig. 4 B, wherein, shown signal link is a fluted body signal link.Fig. 4 A illustrates when using fluted body signal link, by among Fig. 3 A along the cutaway view in Y-Y direction cross section; And Fig. 4 B illustrates when using fluted body signal link, by the cutaway view of Fig. 3 A along X-X direction cross section.Panel 300 comprises the glass substrate 302 and the first signal output device.The first signal output device comprises a plurality of electrodes, as first, second, third panel bonding electrodes, all has one first width.The first and the 3rd panel bonding electrodes is that noncontinuous electrode 304, the second panel bonding electrodes are long electrode 306.The end of each electrode is a fluted body signal link (pad), as first, second, third fluted body signal link 308,310,312, all has one second width.Second width of groove shaped signal link is greater than first width of panel bonding electrodes.These electrodes place on the glass substrate 302 in interconnected mode.Just, the first and the 3rd fluted body signal link all is positioned on the one first horizontal linear L1, and the second fluted body signal link is positioned on the one second horizontal linear L2, and this first horizontal linear and second horizontal linear have one first spacing.The height of these fluted body signal link 310,314,318 end faces is lower than this dielectric layer 322 end faces, so make signal link 310,314,318 form groove 402,404,406 respectively on dielectric layer 322.

Please refer to Fig. 5 A～5C, wherein, Fig. 5 A illustrates according to the electrode lay-out schematic diagram on a kind of flexible PCB of the embodiment of the invention; Fig. 5 B illustrates when using projection type signal link, by among Fig. 5 A along the cutaway view in Y-Y direction cross section; And Fig. 5 C illustrates and uses projection type signal link inch, by among Fig. 5 A along the cutaway view in X-X direction cross section.

For panel 300 can be combined closely with the signal link on the flexible PCB 500, therefore the position must be correctly corresponding each other.Flexible PCB 500 comprises the poly-imine layer 502 and the second signal output device.The second signal output device comprises a plurality of electrodes, as first, second, third flexible circuit plate interface electrode, all has one the 3rd width.The first and the 3rd flexible PCB bonding electrodes is that long electrode 504, the second panel bonding electrodes are noncontinuous electrode 506.These electrodes place on poly-imine layer 502 in interconnected mode.The end of each electrode is a projection type signal link (pad), comprises first, second, third projection type signal link, all has one the 4th width.As the projection type signal link 508,512 of long electrode 504 ends and the projection type signal link 510 of noncontinuous electrode 506 ends.The 4th width of projection type signal link is greater than the 3rd width of flexible PCB bonding electrodes.These long electrodes and noncontinuous electrode place on the glass substrate in interconnected mode.Just, the first and the 3rd projection type signal link 508,512 all is positioned on one the 3rd horizontal linear L3, and the second projection type signal link 510 is positioned on one the 4th horizontal linear L4, and the 3rd horizontal linear and the 4th horizontal linear have one second spacing.Two adjacent signal links 508,510 also are 300 μ m (P spacings) along directions X at interval, and two adjacent signal links 508,510 also are 1000 μ m (D spacings) along the Y direction at interval.

And the thickness of the projection type signal link that comprises on this flexible PCB 500 is greater than the thickness of dielectric layer 522.So make signal link (for example be signal link 508,510,514, with 518) end face protrude in dielectric layer 522 surfaces.

Wherein, the interconnected mode of electrode is meant, every n electrode 504,506 extends in parallel along Y direction, signal link of n electrode of this group is placed on the X-direction parallel lines of the different Y-axis coordinates of n bar in regular turn, will make spacing (pitch) increase of signal link like this.Now be that example is done explanation with n=2, be provided with two parallel lines L3 and L4, the 1st signal link 508, the 3rd signal link 512, the 5th signal link 516, be positioned on the straight line L3 with the 7th signal link 520 along X-direction.The 2nd signal link 510, the 4th signal link 514, then be positioned on the straight line L4 with the 6th signal link 518.

Please refer to Fig. 6 A, Fig. 4 B illustrates the panel 300 with fluted body signal link, before Fig. 5 C illustrates the flexible PCB 500 with projection type signal link 514 and engages, along the cutaway view in Y-Y cross section.When flexible PCB 500 will engage inch with panel 300, the projection type signal link 514 of flexible PCB 500 is aimed at (align) with the fluted body signal link 314 of panel 300, then anisotropic conductive layer (Anisotropic Conduct Film) 530 is placed between the two.Shown in Fig. 6 B, because the projecting height (H1) of projection type signal link 514 is more than or equal to the summation of fluted body signal link 314 from dielectric layer surface 522 cup depths (H3) and anisotropic conductive layer 530 thickness (H2), that is, H1＞=H2+H3.So when pressing panel 300 and flexible PCB 500, the anisotropic conductive layer 530 under the projection type signal link 514 can be squeezed and conducting at least; The anisotropic conductive layer 530 of remainder can be that state of insulation (all can by H1＞H2+H3) or conducting state (H1=H2+H3) after engaging.Projection type signal link 514 can be embedded in the fluted body signal link 314 formed groove structures, like this, can make panel 300 produce the set effect that engages with flexible PCB 500.But preferred embodiment must make projecting height (H1) greater than the summation (H1＞H2+H3), with preset clearance exempt from the entire area of sub-anisotropic conductive layer 530 of cup depth (H3) with anisotropic conductive layer 530 thickness (H2); Like this, when pressing " panel 300, anisotropic conductive layer 530, flexible PCB 500 " three-decker, most Z direction power puts on the projection type signal link 514.

Traditional flexible PCB 200 (being shown among Fig. 2) must be considered the size of the formed thermal compensation coefficient of all material, so that the signal link of panel is aimed at when engaging with the signal link of flexible PCB when design.And according to the signal link of the panel of spirit of the present invention and the signal link of flexible PCB, because the signal link of panel becomes fluted body, and the signal link of flexible PCB becomes the projection type, make between the two be easy to aim at, and the framework of this concavo-convex joint more can suppress the thermal expansion effects of poly-imine layer 502.

Please refer to Fig. 7 A and Fig. 7 B, wherein, Fig. 7 A illustrates time counter plate and the flexible PCB graph of a relation that system temperature changes in the hot pressing manufacture craft; And Fig. 7 B illustrates flexible PCB hot pressing inch on panel, the graph of a relation that the pressure that time and flexible PCB counter plate produce changes.Please also refer to Fig. 6 A, when flexible PCB 500 along Z direction hot pressing during in panel 300, flexible PCB 500 meeting expanded by heating, therefore the dielectric layer 522 of signal link 514 meeting counter plates 300 produces swelling stresses, and panel 300 engages the deflection in the time of then can reducing flexible PCB 500 thermal expansions through groove 404 with the flexible PCB projection.

From Fig. 7 A and Fig. 7 B, can learn, when hot pressing, the rate of change of the temperature transfer of the rate of change that the flexible PCB counter plate applies the Z directional pressure during much larger than panel and flexible PCB in hot pressing.For instance, within 5 seconds, the flexible PCB counter plate applies the Z directional pressure and arrives 50kg/cm from 0 ²Stable state, temperature then needs 20 seconds, can be from 20 ℃ of stable states that reach 200 ℃.That is to say that after projection type signal link 514 had embedded fluted body signal link 314, panel 300 raise gradually with the temperature side of flexible PCB 500, just have the situation of thermal expansion to produce.After temperature raises, because projection type signal link 514 has embedded in the groove 404, snap action power between the signal link can produce the effect that suppresses flexible PCB 500 thermal expansions, and the thermal expansion effects of this moment is not sufficient to destroy the situation that engages of signal link 514 and signal link 314.Therefore, in design during flexible PCB, then can not consider the influence that the thermal compensation coefficient of poly-imine layer 502 is caused, thereby make that the design of flexible PCB 500 is oversimplified.

And obtain the manufacture method of the electrode joint structure among Fig. 6 A of the present invention～Fig. 6 B, may further comprise the steps: a panel (a) is provided, form a panel dielectric layer and a fluted body signal link in this panel surface, this fluted body signal link surface is lower than this panel dielectric layer surface one cup depth (H3).(b) provide a flexible PCB, form a flexible PCB dielectric layer and a projection type signal link in this flexible PCB surface, this projection type signal link surface is higher than this flexible PCB dielectric layer surface one projecting height (H1).(c) provide an anisotropic conductive layer between this panel and this flexible PCB, the projecting height (H1) of this projection type signal link is more than or equal to the summation of this anisotropic conductive layer thickness (H2) and this cup depth (H3) (H1＞=H2+H3).(d) with this panel, this anisotropic conductive layer, with the pressing in regular turn of this flexible PCB, this projection type signal link is embedded in this fluted body signal link, and this anisotropic conductive layer of part corresponding to this projection type signal link can be squeezed and conducting.

Its thin portion step comprises, forms a plurality of electrodes that extend in parallel along Y-axis, for example noncontinuous electrode 304 and long electrode 306 earlier on glass substrate 302.And terminal every n of these a little electrodes one group, and be placed in several in regular turn along on the parallel straight line of X-axis.Then, form most signal links in the end of these a little electrodes,

signal link

308 and 310 for example, the width of each signal link is greater than the be connected width of electrode of each correspondence.Then, form a dielectric layer 322 covered substrates 302 and electrode top.At last, remove the dielectric layer of signal link top again to expose this a little signal links.

The electrode of panel 300 can use the manufacture craft mode of wire mark or sputter to finish.

Dielectric layer

522 and 322 modes that can use wire mark are exposed the part of signal link.In addition, also can after being coated with the surface of whole front panel 300, dielectric layer limit the zone of signal link again with gold-tinted.And utilize the mode of etching or sandblast, remove the dielectric layer of the top, zone that is covered in those signal links.The projection type signal link 514 of flexible PCB then can use the mode of the long projection of conventional flex circuits plate (bump) to finish.

Please refer to Fig. 8 A～8D, it shows the second embodiment of the present invention; Wherein, Fig. 8 A～Fig. 8 B illustrates the flexible PCB that uses flat type signal link 534, when using the panel of projection type signal link 334, and the phantom before and after both engage; And Fig. 8 C～8D illustrates the flexible PCB that uses fluted body signal link 534, with the panel that uses projection type signal link 334, the phantom before and after engaging.Further, form fluted body signal link or flat type signal link 534 on the flexible PCB 500, and panel 300 forms the signal link 334 of projection type, and anisotropic conductive layer 530 places between this panel 300 and the flexible PCB 500.As Fig. 8 B, shown in the 8D, because the projecting height (H1) of projection type signal link 334 is more than or equal to the summation of fluted body signal link 534 from dielectric layer 522 surperficial cup depths (H3) and anisotropic conductive layer 530 thickness (H2), H1＞=H2+H3.So when pressing panel 300 and flexible PCB 500, the anisotropic conductive layer 530 directly over the projection type signal link 334 can be squeezed and conducting at least; The anisotropic conductive layer 530 of remainder can be that state of insulation (all can by H1＞H2+H3) or conducting state (H1=H2+H3) after engaging.Shown in Fig. 8 D, projection type signal link 334 can embed in the fluted body signal link 534 formed groove shape structures, so, can make panel 300 produce the set effect that engages with flexible PCB 500.But preferred embodiment must make projecting height (H1) greater than the summation (H1＞H2+H3), with preset clearance avoid the entire area of anisotropic conductive layer 530 of cup depth (H3) with anisotropic conductive layer 530 thickness (H2); Like this can be when pressing " panel 300, anisotropic conductive layer 530, with flexible PCB 500 " three-decker, the strength of most Z direction can put on the projection type signal link 334.

Please refer to Fig. 9, that it illustrated is the electrode lay-out figure of another kind of panel or flexible PCB.Make above-mentioned n value equal at 3 o'clock, then can obtain electrode lay-out figure as shown in Figure 9.Per 3 signal links are drawn as one group, and the signal link in this group is placed in 3 in regular turn along on the parallel straight line of X-axis, that is is straight line L5, L6 and L7.To make the spacing of signal link increase to 3 times like this.For example be the signal link 904 of electrode 902 ends, increase to 3P with the spacing of the signal link 908 of electrode 906 ends.

Little spaced electrodes structure of the disclosed flat-panel screens of the above embodiment of the present invention, by being strengthened, electrode end forms the signal link, and cover upper dielectric layers in other parts of electrode, can be so that signal link isolated effect improved, and then lower the effect that silver ion moves.And because the signal link is widened, required accuracy requires to lower when making panel and flexible PCB contraposition.In addition, the signal link of panel and flexible PCB can be respectively projection type signal link and fluted body signal link, like this, will make that the design of flexible PCB is easily simple more, and makes the rate of finished products in the manufacture craft promote.

In sum; though the present invention discloses as above in conjunction with a preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art without departing from the spirit and scope of the present invention; when making various changes and retouching, so protection scope of the present invention should be defined by accompanying Claim.

Claims

1. An electrode joint structure, comprising:

A panel, the surface of the panel has a panel dielectric layer and a groove-type signal connection end, the surface of the groove-type signal connection end is lower than the surface of the panel dielectric layer by a recessed depth (H3);

A flexible circuit board is arranged parallel to one side of the panel. The surface of the flexible circuit board has a dielectric layer of the flexible circuit board and a bump-type signal connection end. The surface of the bump-type signal connection end is higher than the flexible circuit board. Surface-protrusion height of the dielectric layer of the board (H1);

an anisotropic conductive layer placed between the panel and the flexible circuit board, the anisotropic conductive layer has an anisotropic conductive layer thickness (H2);

Wherein the protruding height (H1) of the bump-type signal connection terminal is greater than or equal to the sum of the thickness (H2) of the anisotropic conductive layer and the depth (H3) of the recess (H1>=H2+H3), so when pressing the panel and the In the case of a flexible circuit board, at least the portion of the anisotropic conductive layer corresponding to the bump-type signal connection end will be squeezed to conduct,

And the bump-type signal connection end can be embedded in the groove-type signal connection end, so as to reduce the thermal expansion and deformation of the flexible circuit board when the panel is joined with the flexible circuit board.

2. An electrode joint structure, comprising:

A panel, the surface of the panel has a panel dielectric layer and a bump-type signal connection end, the surface of the bump-type signal connection end is higher than the surface of the panel dielectric layer by a protruding height (H1);

A flexible circuit board is arranged parallel to one side of the panel. The surface of the flexible circuit board has a dielectric layer of the flexible circuit board and a groove-type signal connection end. The surface of the groove-type signal connection end is lower than the surface of the flexible circuit board. Depth of a depression on the surface of the board dielectric layer (H3);

3. A method for manufacturing a micro-pitch electrode structure of a flat panel display, comprising:

Provide a panel, form a panel dielectric layer and a groove-type signal connection terminal on the surface of the panel, the surface of the groove-type signal connection terminal is lower than the surface of the panel dielectric layer by a recessed depth (H3);

A flexible circuit board is provided, a flexible circuit board dielectric layer and a bump-type signal connection end are formed on the surface of the flexible circuit board, and the surface of the bump-type signal connection end is higher than the surface of the flexible circuit board dielectric layer by a protruding height (H1);

An anisotropic conductive layer is provided between the panel and the flexible circuit board, the anisotropic conductive layer has an anisotropic conductive layer thickness (H2), and the protruding height (H1) of the bump-type signal connection terminal is greater than or Equal to the sum of the thickness of the anisotropic conductive layer (H2) and the depth of the depression (H3) (H1>=H2+H3);

The panel, the anisotropic conductive layer, and the flexible circuit board are sequentially pressed together, so that the bump-type signal connection end is embedded in the groove-type signal connection end, and at least corresponds to the bump-type signal connection end. Part of the anisotropic conductive layer at the connection end is compressed to conduct.

4. A method for manufacturing a micro-pitch electrode structure of a flat panel display, comprising:

A panel is provided, and a panel dielectric layer and a bump-type signal connection end are formed on the surface of the panel, and the surface of the bump-type signal connection end is higher than the surface of the panel dielectric layer by a protruding height (H1);

A flexible circuit board is provided, and a flexible circuit board dielectric layer and a grooved signal connection end are formed on the surface of the flexible circuit board, and the surface of the grooved signal connection end is lower than the surface of the flexible circuit board dielectric layer by a recessed depth (H3);

An anisotropic conductive layer is provided between the panel and the flexible circuit board, the anisotropic conductive layer has an anisotropic conductive layer thickness (H2), so that the anisotropic conductive layer thickness (H2) is less than or equal to The protrusion height (H1) of the bump-type signal connection end minus the difference of the recess depth (H3) (H2<=H1-H3);

The panel, the anisotropic conductive layer and the flexible circuit board are sequentially pressed, so that the bump-type signal connection end is embedded in the groove-type signal connection end, and at least corresponding to the bump-type signal connection The part of the anisotropic conductive layer at the end will be squeezed and turned on.

5. An electrode bonding structure, comprising:

A panel, the panel surface has a panel dielectric layer and a first signal output device, the first signal output device at least includes a groove-type signal connection end, the surface of the groove-type signal connection end is lower than the panel dielectric layer layer surface-depression depth (H3);

A flexible circuit board is arranged parallel to one side of the panel, the surface of the flexible circuit board has a flexible circuit board dielectric layer and a second signal output device, the second signal output device at least includes a bump type signal connection terminal, the surface of the bump-type signal connection terminal is higher than the surface of the dielectric layer of the flexible circuit board by a protruding height (H1);

6. The electrode bonding structure as claimed in claim 5, wherein the first signal output device comprises:

a first, a second, a third panel bonding electrode each having a first width; and

A first, second, third groove-type signal connection end, respectively located at the first end of the first, second, third bonding electrode, and each has a second width, the second width is greater than the first width,

The first and third grooved signal connection ends are located on a first horizontal straight line, the second grooved signal connection end is located on a second horizontal straight line, and the first horizontal straight line and the second horizontal straight line have a first pitch.

7. The electrode bonding structure as claimed in claim 6, wherein the second signal output device comprises:

a first, a second, a third flexible circuit board bonding electrode each having a third width; and

A first, second, and third bump-type signal connection ends are respectively located at the first ends of the first, second, and third flexible circuit board bonding electrodes, and all have a fourth width, and the third width is greater than the fourth width,

The first and third bump-type signal connection ends are located on a third horizontal straight line, the second bump-type signal connection end is located on a fourth horizontal straight line, and the third horizontal straight line and the fourth horizontal straight line have a second spacing.