CN1331243C - Structure of LED base and pins and producing method - Google Patents

Abstract

The invention describes a structure and a manufacturing method of four pins of a three-primary-color LED and a packaging base. One of the pins forms the die holder and the shared negative terminal, and the other three pins form the positive terminal. The aforementioned negative pole terminal block and the positive pole terminal block are located on the four corners of the square, two pins extend to the right, and the other two pins extend to the left. Stamping with a die, or forming by etching or electroplating, forming several at a time, and then bending the four pins downward from the vicinity of the terminal block by 90° in the same direction to form a standing posture, and then perform grain welding first And wire, then cut into a single structure, and then sealed with a transparent plastic mold; or first sealed with a mold with transparent plastic, and then cut into a single structure. Another configuration is to bend the ends of the four pins inwards for surface mount packaging.

Description

Structure and manufacturing method of LED packaging base and pins

technical field

The present invention relates to LED packages, in particular to the structure and manufacturing method of the base and pins of the three-primary-color LED packages.

Background technique

Generally, a single-color light-emitting diode (LED) is packaged with two pins, while a two-complementary color LED is packaged with three pins, and a three-primary color (red, blue, green) LED is packaged with three or four pins. FIG. 1 is a cross-sectional view of a conventional single-color LED two-pin package. Negative terminal block 3 has a groove for die seat 2, die 1 is welded on die seat 2 by die bond, and then the positive and negative electrodes are respectively connected to the positive electrode with gold wire or aluminum wire 9 The terminal block 4 and the negative electrode terminal block 3 are then sealed with a transparent plastic 8 to form a ring-shaped focusing lens. Fig. 2 is a cross-sectional view of a three-primary-color LED package with four pins. The shared negative terminal block 3 has a groove as the die seat 2, the die 1 is welded on the die seat 2 by die welding method, and the negative pole of the die (that is, the back side of the die) is directly welded on the shared negative pole 3, red The anodes of the , blue, and green LEDs are respectively connected to the red positive (R+) terminal block 5, the blue positive (B+) terminal block 4, and the green positive (G+) terminal block 6, and then sealed with transparent plastic to form an oval ring. The focusing lens of the shape lens, its top view is shown in Fig. 3. Wherein the die seat 2 is rectangular, and the red, blue and green LED dies are arranged perpendicular to the width of the package in order to reduce the width of the package. Returning to FIG. 2 , four pins are exposed from the package so as to be inserted into sockets on a printed circuit board (not shown) for soldering. With reference to Fig. 4, this kind of known three pins or four pins and the assembly of the base utilizes the metal sheet to punch the negative electrode terminal seat 3 of the plane in the direction of the arrow A in the figure with a die, and there are crystal grains formed by grooves on it. Seat 2, as shown in Figure 3, punch out pins 3, 4, 5, 6, small connecting rod 57 and large connecting rod 55 with another die in the direction perpendicular to the plane of Figure 4, and then cut into a single package. The base pins are shown as the package base pins 12 between the dotted lines 10-10' and 11-11' in FIG. 4, which are used for die soldering and wire bonding. The width of each pin is at least 0.5mm, and the width of the negative and positive terminal blocks is 0.5mm+0.2mm+0.2mm=0.9mm, and the distance between the terminal blocks is at least 0.5mm, so the distance between the two pins (from the center of a pin to the center of another pin) must not be less than 0.5+2×0.9/2=0.5+0.9+0.1=1.5mm, with an alignment tolerance of 0.1mm. The four pins need 4×1.5=6mm, which makes the package too wide and forms an ellipse, as shown in Figure 3. In order to shrink the package, if the above distance is further reduced, it will be very difficult to make a die, and the forming construction will be more difficult. The focus of the ellipse is not good, and the width and spacing of the pins affect the difficulty of drilling the PC board and the integrity of the plating in the hole. Figure 3 The blue, green and red LEDs need to be arranged in a straight line perpendicular to the width of the package to avoid increasing the package width. When viewed from the blue (B) direction, the green (G) light may not be visible, otherwise in the green (G) direction ) light direction, the blue (B) light cannot be seen. Recently, there is a suggestion that three-color light is made to be stacked, and red, green, and blue three-color LEDs are stacked into a stack. See the Taiwan patent application No. 90122555 on September 11, 1990 by Zhang Xiuheng, named " "Packaging of stacked full-color LED light source with transparent conductive layer and reflective layer directly combined with crystal grains", its structure is shown in Figure 8. Wherein the red LED is at the bottom layer, and the epitaxial PN junction is on the opaque GaAs substrate 71 . The negative electrode of the red LED is under the substrate 71, and the positive electrode 72 of the red LED is a metal reflective layer. The negative electrode of the blue LED is the metal reflective layer 73 on the N-type semiconductor, and the positive electrode 74 is the metal reflective layer on the P-type semiconductor. The same is true for the negative electrode 75 and positive electrode 76 of the green LED, but the conductive layer between the LEDs of each color is transparent ITO (containing tin indium oxide), so that the three-color light can be mixed and irradiated forward. But the LED grain of this kind of device can't use the known three-pin packaging structure, changing to four pins will make the width wider, which is unfavorable for miniaturization. Reducing the pitch of the pins will increase the difficulty of drilling the PC board, and the too small hole diameter will make the thickness of the electroplating in the hole uneven.

Contents of the invention

Therefore, the object of the present invention is to provide a structure of LED package base and pins, to reduce the width of LED package and reduce the area occupied by the circuit board, and to make the drilling of the PC board easy to reduce the thickness of the metal layer in the hole during electroplating. Evenly, making good contact. Facilitate the manufacture of LED arrays.

The second purpose of the present invention is to provide a structure of LED packaging base and pins, so that the LED packaging is circular, and the side wall in the base forms a circular paraboloid to focus the reflected light and then shine forward to increase the brightness. . On the other hand, the circular paraboloid on the surface of the transparent package has good focus, increasing the visual effect.

Another object of the present invention is to provide an LED packaging base and pin structure, which is suitable for the packaging of multi-color stacked LED chips, shortens the length of bonding wires to increase reliability and reduce wiring resistance.

Yet another object of the present invention is to provide a kind of LED package base and pin structure and manufacturing method thereof, make four pins be arranged in a square and can stand, make surface mount (SMT) become possible, and assemble conveniently, and PC board does not need Drilling and electroplating to reduce production costs.

Another object of the invention is to provide an LED packaging base and pin structure and manufacturing method thereof, so that stamping can be done in the same direction, reducing the difficulty of the work.

In order to achieve the above object and improve the shortcomings of general LED packaging, the structure of the four pins of the three-primary-color LED and the packaging base of the present invention, the structure of the base, the pins, and the wiring seat for LED packaging include: a base with a circle inside The groove on the side wall of the surrounding paraboloid is used as a die seat for die welding and as a shared negative terminal seat, which extends to form the first pin and extends to the right;

A first LED positive pole terminal block, extending to form a second pin parallel to the first pin and extending to the right;

A second LED positive terminal block, extending to form a third pin that is in line with the first pin and extending to the left; a third LED positive terminal block, extending to form a fourth pin that is parallel to the third pin and in line with the second pin Extending to the left; the above-mentioned shared negative terminal block and three positive terminal blocks are located on the four corners of the square, and the base and the die seat are located in the center of the square; a plurality of small tie bars and large pins at the end of the pin The connecting rod (large tie bar) connects the adjacent pins into one body to facilitate construction. The large tie bar has small gear holes for transmission and transmission to facilitate automatic transmission. It is cut off after packaging. The aforementioned die seat is a groove with a circular parabolic side wall, and the aforementioned base is extended to a square space except for the three positive terminal seats to facilitate heat dissipation. The positive terminal block is square or round.

The manufacturing method of this kind of three-primary-color stacked LED package includes the following steps: (a) The first step is to form a die structure, which has: a base with a groove on the side wall of a circular paraboloid to form a die seat, and a corner In order to share the negative terminal block, the first pin is extended to the right; the first LED positive terminal block is extended to form the second pin extending to the right in parallel with the first pin; the second LED positive terminal block is extended to form the third pin Extending to the left in a straight line opposite to the first pin; a third LED positive terminal block, extending to form a fourth pin parallel to the third pin and in line with the second pin, extending to the left; the shared negative terminal block and the three The first positive terminal seat is located on the four corners of the square, and the base and the die seat are located in the center of the square; a plurality of small connecting rods and a large connecting rod at the end of the pin connect the adjacent pins into one, and the large connecting rod has a small transmission drive. Tooth holes; a plurality of the aforementioned structures are arranged in a row; (b) the second step is to punch the metal sheet into the aforementioned base and pins with a die; (c) the third step is to punch a groove on the base with a die, and the side The wall is a circular parabolic reflective surface to form a grain seat; (d) the fourth step is to bend the four pins from the vicinity of the wiring seat downwards toward the same direction by 90° so that the grain seat is upward and the pins are downward; (e ) the fifth step, soldering the three-primary-color stacked LED die on the die seat; (f) the sixth step, connecting the negative pole on the die to the shared negative pole with a metal wire, and connecting the positive pole to the positive pole terminal seat; ( g) the seventh step, cutting a plurality of the aforementioned structures into a single structure; (h) the eighth step, sealing with a molded transparent plastic; (i) the ninth step, cutting off the small connecting rod and the large connecting rod. But the seventh step can be carried out after the eighth step is completed. The first step and the second step can be formed by etching or electroplating. In the present invention, after the transparent plastic is sealed, the ends of the four pins can be bent outwards or inwards to form a shape that can be directly connected to the circuit board by surface mount technology (SMT), and the circuit board can be used without Drilling and electroplating to reduce operating procedures.

Description of drawings

Figure 1: (Known technology) sectional view of monochromatic LED two-pin package.

Fig. 2: (Known technology) The cross-sectional view of the three-primary-color white light LED package.

Figure 3: Top view of (known technology) three-primary-color white LED package.

Figure 4: Plan view of a four-pin and base package (known in the art) stamped and molded from sheet metal.

FIG. 5 : Plan view of four pins and base assembly molded from sheet metal according to the present invention.

Figure 6: Perspective view of four pin and base package with pins separated and bent 90°.

Figure 7: Die seat of a groove with circular parabolic sidewalls.

Figure 8: A perspective view of the construction of a three-primary-color stacked LED.

Figure 9: A perspective view of the four-pin and base package after soldering the LED die and bonding wires.

Fig. 10: (a) (b) Perspective view of four pins and base package in surface mount technology according to the present invention, (a) the end is bent inward again, (b) the end is bent outward again.

Explanation of reference signs:

1: LED grain 2: Die seat

3: Base (negative terminal block) 4: Blue positive (B+) terminal block

5: Red positive (R+) terminal block 6: Green positive (G+) terminal block

7: Pin 8: Transparent plastic

9: Metal connection 10-10′: Cutting line

11-11′: Cutting line 12: Package base and pins

51, 52, 53, 54: Pin 55: Large connecting rod

56: The end of the pin is bent 57: The small connecting rod

58: Circular parabolic side wall reflective surface 59: Three primary colors stacked LED grains

60: Conveyor drive small tooth hole

71: Substrate 72: Red LED anode

73: Blue LED negative pole 74: Blue LED positive pole

75 Green LED Negative 76 Green LED Positive

Detailed ways

The content of the present invention can be illustrated through the following embodiments with the accompanying drawings. The structure and manufacturing method of the package base and the pins of the present invention take the package of four pins as an example. However, three or more pins can also be implemented utilizing the principles of the present invention.

According to the first embodiment of the present invention, referring to FIG. 5 , it is a plan view of the structure of the four pins and the base of the three-primary-color LED. One end of the first pin 51 forms the base and the shared negative terminal block 3, and a groove forms a crystal grain. Seat 2 is used for stacking LED crystal grains of three primary colors. Die seat 2 is a groove with a side wall of a circular paraboloid, which focuses the reflected light and then shines forward to increase brightness. One end of the second, third, and fourth pins 52, 53, and 54 form blue, red, and green LED positive terminal blocks 4, 5, and 6; the first and second pins 51, 52 extend horizontally to one side; the third, The four pins 53, 54 extend horizontally to the other side. The base and the pins are arranged as a group of four pins, and the adjacent pins are connected into one with the small connecting rod 57 and the large connecting rod 55 at the end of the pins to facilitate construction. The large connecting rod has a transmission transmission small tooth hole 60 to facilitate Automated delivery. The metal sheet is stamped and formed by a die, and a plurality of bases and pins are punched first, and then the grooves on the side wall of the circular paraboloid are stamped to form the die seat 2, as shown in FIG. 5 . After stamping and forming, the edge DD' line is bent 90°, as shown in Figure 6. That is to say, it can automatically carry out die welding and wire bonding packaging, and then cut along the CC' line, as shown in Figure 9. Then cut off the small connecting rod 57 and the large connecting rod 55 with a molded transparent plastic seal (not shown). Since there are only two pins on each side, there is enough space between them. If the width of each pin is 0.5mm, the distance between the two pins has enough space and does not need to be less than 0.5mm, so the minimum area of the four pins is ( 0.5mm+0.5m) ² =1mm ² , it can also be larger without limitation. And shorten the wire length to increase the reliability, and make the drilling of the PC board easy, and the hole diameter can be enlarged to make the plating distribution even and the contact good, so that the qualified rate of LED welding on the PC board is increased, and the reliability is increased. And because the four pins are arranged at four corners, the LED can stand up, which is beneficial to installation and welding, which is one of the advantages of the present invention.

According to the second embodiment of the present invention, as shown in Fig. 5, the metal sheet is stamped and formed with a die, and then the die welding and wire bonding are carried out, and then bent 90° along the D-D' line, and the transparent mold is completed. After the plastic 8 is sealed, the small connecting rod 57 and the large connecting rod 55 are cut off. In this way, automated production can be utilized to enable mass production, which is one of the advantages of the present invention.

According to the third embodiment of the present invention, as shown in FIG. 10 , after the transparent plastic seal of the second embodiment is completed and the small connecting rod 57 and the large connecting rod 55 are cut off, the ends 56 of the four pins are bent inward or outward, It can be directly connected to the circuit board by surface mount technology (SMT), and the circuit board does not need to be drilled and plated, so as to reduce the work process and facilitate the production of LED arrays on PC boards. This is one of the advantages of the present invention. one.

The above description is only an embodiment of the present invention, and it is not intended to limit the completion of the present invention. All other equivalent changes or modifications that do not depart from the spirit of the present invention, such as three pins or more pins, or Forming not by stamping but by other methods such as etching forming, electroplating forming, etc. should be included in the scope of the patent application claims.

Claims (10)

1. the structure of four pins of a primitive colours LED and encapsulation base is the structure of the pedestal of LED encapsulation usefulness and pin, junction block, it is characterized by: comprise:

One pedestal, in have the groove of an annulus paraboloid sidewall do die pad with do the crystal grain welding with and do to share the negative pole junction block, extend to form first pin, extend to the right;

The anodal junction block of one the one LED, it is parallel with first pin to extend to form second pin, extension to the right;

The anodal junction block of one the 2nd LED extends to form the relative extension left in line with first pin of the 3rd pin;

The anodal junction block of one the 3rd LED extends to form parallel with the 3rd pin and relative with second pin extension left in line of four-limbed;

Aforementioned shared negative pole junction block and three anodal junction blocks are positioned on four square angles, and pedestal and die pad then are positioned at square central authorities;

The big connecting rod of a plurality of small rods and pin end links into an integrated entity adjacent pin, and big connecting rod has the little perforation of the transmission of conveying, and big small rod finishes in encapsulation and promptly gives excision.

2. structure as claimed in claim 1 is characterized by: wherein aforementioned pedestal extends to the square space except that three anodal junction blocks that four pins form.

3. structure as claimed in claim 1 is characterized by: wherein aforementioned anodal junction block is square.

4. structure as claimed in claim 1 is characterized by: wherein aforementioned anodal junction block is for circular.

5. the manufacture method of superposition of three primary colors LED encapsulation is characterized by: comprise the following step:

(a) first step forms a punch die structure, has:

One pedestal, in have the groove of an annulus paraboloid sidewall to form die pad, an a corner is for sharing the negative pole junction block, extending to form first pin extends to the right;

The anodal junction block of one the one LED extends to form the parallel extension to the right with first pin of second pin;

The anodal junction block of one the 2nd LED extends to form the relative extension left in line with first pin of the 3rd pin;

The anodal junction block of one the 3rd LED, extend to form four-limbed parallel with the 3rd pin and relative with second pin in line, extension left;

Described shared negative pole junction block and three anodal junction blocks are positioned on square four jiaos, and pedestal and die pad then are positioned at square central authorities;

The big connecting rod of a plurality of small rods and pin end links into an integrated entity adjacent pin, and big connecting rod has the little perforation of the transmission of conveying;

A plurality of aforementioned structure form a line;

(b) second step strikes out aforementioned pedestal and pin with punch die with sheet metal;

(c) third step, with pedestal punching press one groove, its sidewall is annulus projectile reflecting surface to form die pad with punch die;

(d) the 4th step bends 90 ° downwards in the same direction with four pins and makes die pad upwards near junction block, pin is downward;

(e) the 5th step is welded in superposition of three primary colors LED crystal grain on the crystal grain;

(f) the 6th step is connected to the negative pole on the crystal grain on the shared negative pole with metal wire, and positive pole is connected on the anodal junction block;

(g) the 7th step cuts into single structure with a plurality of aforementioned structure;

(h) the 8th step seals with the mold transparent plastic;

(i) the 9th step, excision small rod and big connecting rod.

6. manufacture method as claimed in claim 5 is characterized by: wherein the 7th step can be carried out after the 8th step is finished.

7. manufacture method as claimed in claim 5 is characterized by: wherein the first step and second step form with etching method.

8. manufacture method as claimed in claim 5 is characterized by: wherein the first step and second step form with galvanoplastic.

9. manufacture method as claimed in claim 5 is characterized by: wherein four pins can be further with the inwardly bending again of four pin ends, to stick together the usefulness of encapsulation as the surface.

10. manufacture method as claimed in claim 5 is characterized by: wherein four pins can be further with the outwards bending again of four pin ends, to stick together the usefulness of encapsulation as the surface.

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