CN1330220C - Structure of signal transferring - Google Patents
Structure of signal transferring Download PDFInfo
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- CN1330220C CN1330220C CNB2003101026176A CN200310102617A CN1330220C CN 1330220 C CN1330220 C CN 1330220C CN B2003101026176 A CNB2003101026176 A CN B2003101026176A CN 200310102617 A CN200310102617 A CN 200310102617A CN 1330220 C CN1330220 C CN 1330220C
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- signal conductor
- signal
- ledge
- transmission structure
- reference zone
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- 230000008054 signal transmission Effects 0.000 claims abstract description 36
- 239000004020 conductor Substances 0.000 claims description 102
- 238000003780 insertion Methods 0.000 abstract description 9
- 230000037431 insertion Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 230000005540 biological transmission Effects 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 12
- 238000013461 design Methods 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 4
- 206010028400 Mutagenic effect Diseases 0.000 description 3
- 231100000243 mutagenic effect Toxicity 0.000 description 3
- 230000003505 mutagenic effect Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The present invention relates to a signal transmission structure which is at least provided with a reference plane surface and a signal conducting wire, wherein the reference plane surface has a non-reference area, while the signal conducting wire has a bulge part correspondingly; the bulge part is correspondingly positioned in the non-reference area and projects out of the edges of the signal conducting wire. When signals are transferred on the signal conducting wire, a parasitic-capacitance effect generated by the bulge part and the reference plane surface can be used for improving the phenomenon of the mismatch of characteristic impedance. Therefore, the signal transmission structure can reduce the insertion loss generated by the mismatch of impedance of signals during the transmission with a high speed or high frequency by the signal transmission structure. Moreover, the present invention can relatively improve back loss which is reduced during the transference of signals so as to achieve the goals of partial compensation and impedance match.
Description
Technical field
The present invention is relevant for a kind of signal transmission structure, and particularly relevant for a kind of unmatched signal transmission structure of characteristic impedance that improves signal conductor.
Background technology
On large-sized print circuit board and base plate for packaging, be used to be electrically connected the signal conductor between two element or two end points, its live width all need be consistent, so that electronic signal is when transmitting between signal conductor, the characteristic impedance of signal conductor (characteristic impedance) can remain unchanged, especially transmit at the signal of high speed and high frequency, more need to utilize good impedance matching (impedancematching) design between the two-end-point, be used to reduce the reflection that impedance does not match and caused, insertion loss (insertion loss) when promptly reducing the signal transmission, and improve the return loss (return loss) that is reduced when signal transmits relatively, to avoid influencing the quality that signal transmits.
Please refer to Figure 1A and 1B, it represents a conventional signal conductor the pass through schematic top plan view and the schematic side view of a non-reference zone respectively.Signal transmission structure 110 comprises reference planes 120 and a signal conductor 130 at least.Reference planes 120 for example are power plane (power plane) or ground plane (ground plane), and the live width unanimity of signal conductor 130.It should be noted that conventional line design, reference planes 120 can form a plurality of through holes or perforate because of boring or interplanar cutting, or form a non-reference zone 122 because avoiding short circuit between two signal conductors, for example are a non-reference zone opening.Thereby, when electronic signal is transmitted on signal conductor 130, can in this non-reference zone 122 of passing through, cause the mutagenic effect of high impedance, the insertion loss that makes impedance not match to be caused increases, and makes signal can't be intactly be crossing to another end points by an end points of non-reference zone 122.
Please also refer to Figure 1A and 2A, wherein Fig. 2 A represents that pass through the respectively frequency response of S21 of a complete reference plane (shown in solid line R1) and a non-reference zone (shown in solid line T1) of a conventional signal conductor concerns schematic diagram.When operating frequency heals when high, under same operating frequency, the pass through return loss of non-reference zone 122 of signal conductor 130 will descend the more, make distorted signals the more.Please also refer to Figure 1A and 2B, wherein Fig. 2 B represents that pass through the respectively frequency response of S11 of a complete reference plane (shown in solid line R2) and a non-reference zone (shown in solid line T2) of a conventional signal conductor concerns schematic diagram.When operating frequency heals when high, under same operating frequency, the pass through insertion loss of non-reference zone 122 of signal conductor 130 will be risen the more, make distorted signals the more equally.
Please also refer to Figure 1A and 2C, wherein Fig. 2 C represents that a conventional signal leads the pass through schematic diagram that concerns of the frequency of a complete reference plane (shown in solid line R3) and a non-reference zone (shown in solid line T3) and characteristic impedance of line respectively, when operating frequency heals when high, under same operating frequency, the pass through characteristic impedance of non-reference zone 122 of signal conductor 130 will be risen the more, thereby produce the unmatched situation of impedance.
Can know by above explanation and to learn, when in case signal conductor passed through non-complete reference plane, rising along with frequency, its return loss will diminish thereupon, and the corresponding characteristic impedance also becomes greatly thereupon, and also will become greatly with the resistance value difference of original design, thereby the situation that makes impedance not match to occur on the signal conductor will become even more serious.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of signal transferring structure exactly, is used to improve the pass through unmatched phenomenon of impedance of a non-reference zone of signal conductor.
For reaching above-mentioned purpose of the present invention, the present invention proposes a kind of signal transmission structure, is applicable to a wiring board, and above-mentioned signal transmission structure comprises at least: reference planes and signal conductor with a perforate.Above-mentioned signal conductor and above-mentioned reference planes are disposed at same plane, and above-mentioned signal conductor on above-mentioned reference planes across crossing above-mentioned perforate, and above-mentioned signal conductor has at least one ledge, it is corresponding to the position of above-mentioned non-reference zone, and above-mentioned ledge extends within the above-mentioned perforate, and keeps a distance with above-mentioned reference planes.
Based on above-mentioned, the present invention is because of adopting the signal transmission structure of outstanding design, and this ledge correspondence is positioned on the position of non-reference zone, and protrudes in the lateral margin of signal conductor.When signal transmitted on signal conductor, the parasitic capacitance effect that can utilize this ledge and reference planes to be produced was improved the unmatched phenomenon of characteristic impedance.Therefore, signal transmission structure is when high speed or high-frequency transmission, and this signal transmission structure can reduce the insertion loss that signal does not match and produced because of impedance, and improves the return loss that is reduced when signal transmits relatively, to reach the purpose of local equalize and impedance matching.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Figure 1A and 1B represent a conventional signal conductor the pass through schematic top plan view and the schematic side view of a non-reference zone.
Fig. 2 A represents that pass through the respectively frequency response of S21 of a complete reference plane and a non-reference zone of a conventional signal conductor concerns schematic diagram.
Fig. 2 B represents that pass through the respectively frequency response of S11 of a complete reference plane and a non-reference zone of a conventional signal conductor concerns schematic diagram.
Fig. 2 C represents pass through the respectively schematic diagram that concerns of the frequency response of a complete reference plane and a non-reference zone and characteristic impedance of a conventional signal conductor.
Fig. 3 A and 3B represent a kind of signal transmission structure of a preferred embodiment of the present invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of I-I line.
Fig. 4 A represents that pass through the respectively frequency response of S21 of a non-reference zone of signal conductor of the present invention and conventional signal conductor concerns schematic diagram.
Fig. 4 B represents that pass through the respectively frequency response of S11 of a non-reference zone of signal conductor of the present invention and conventional signal conductor concerns schematic diagram.
Fig. 4 C represents pass through the respectively schematic diagram that concerns of the frequency response of a non-reference zone and characteristic impedance of signal conductor of the present invention and conventional signal conductor.
Fig. 5 A and 5B represent a kind of signal transmission structure of another preferred embodiment of the present invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of II-II line.
Fig. 6 A and 6B represent a kind of signal transmission structure of the another preferred embodiment of the present invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of III-III line.
Fig. 7 represents the present invention's a kind of signal transmission structure of a preferred embodiment again, and it is applicable to the schematic top plan view of a wiring board.
Accompanying drawing indicates explanation
110: signal transmission structure
120: reference planes
122: non-reference zone
130: signal conductor
210: signal transmission structure
220: reference planes
222: non-reference zone
230: signal conductor
232: ledge
310: signal transmission structure
320: reference planes
322: non-reference zone
330: signal conductor
332: ledge
410: signal transmission structure
420: reference planes
422: non-reference zone
430: signal conductor
432: ledge
432a: first ledge
432b: second ledge
510: signal transmission structure
520,540: reference planes
522: perforate
530: signal conductor
532: ledge
D: distance
Embodiment
Please refer to Fig. 3 A and 3B, it represents a kind of signal transmission structure of a preferred embodiment of the present invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of I-I line.Signal transmission structure 210 is applicable to a wiring board, for example is a printed circuit board (PCB) or a base plate for packaging, and signal transmission structure 210 has a signal conductor 230 and reference planes 220 at least.Wherein, signal conductor 230 for example is positioned at the top of reference planes 220, and coplane and overlapping each other not between signal conductor 230 and the reference planes 220.In addition, reference planes 220 for example are power plane or ground plane, and partial reference plane 220 for example is a non-reference zone opening because of holing or cutting and cause a non-reference zone 222.Thereby, when electronic signal is transmitted on signal conductor 230, for avoiding signal in this non-reference zone 222 of passing through, to cause the mutagenic effect of high impedance, present embodiment is to utilize to widen the area of partial row through the signal conductor 230 of this non-reference zone 222, promptly extend a ledge 232 in the top of non-reference zone 222, and local ledge 232 also may extend to the top outside the non-reference zone 222.Therefore, when the ledge 232 of the signal conductor 230 of signal rows, can utilize this ledge 232 and the parasitic capacitance effect that reference planes 220 are produced to improve the unmatched phenomenon of impedance through widening relatively.On the impedance computation of signal conductor 230, the equivalent approximate formula of characteristic impedance Z is
Wherein L is the equivalent inductance of signal conductor, and C is the equivalent capacity of signal conductor.With regard to routine techniques, the equivalent inductance L of transmission line improves through non-reference zone 122 because of signal rows, and increases characteristic impedance Z relatively and produce the mutagenic effect of high impedance.Yet, present embodiment is to utilize the equivalent capacity C that improves signal conductor 230, so that characteristic impedance Z reduces because of parasitic capacitance effect in the position of non-reference zone 222, and can make the characteristic impedance Z of signal conductor reach unanimity, to reach the purpose of local equalize and impedance matching.
Because the relative area A between equivalent capacity C and signal conductor 230 and the reference planes 220 is proportional, and equivalent capacity C again and the relative distance d between signal conductor 230 and the reference planes 220 be inverse ratio, so improve the relative area A of signal conductor 230 or reduce both relative distance d, can improve equivalent capacity C thereupon.Therefore, when the ledge 232 of the signal conductor 230 of signal rows through widening relatively, the parasitic capacitance effect that can utilize this ledge 232 to be produced is improved the unmatched phenomenon of characteristic impedance of signal conductor 230.
Please also refer to 3A and 4A figure, wherein pass through the respectively frequency response of S21 of a non-reference zone of 4A figure expression signal conductor of the present invention and conventional signal conductor concerns schematic diagram.When operating frequency heals when high, under same operating frequency, the pass through insertion loss (shown in solid line T1) of non-reference zone 122 of conventional signal conductor 132 will be risen the more, make distorted signals more serious, and signal conductor 230 of the present invention can reduce the insertion loss that is improved (shown in solid line P1) of the non-reference zone 222 of passing through, and levels off to the status transmission of complete reference plane (shown in solid line R1) of passing through under perfect condition.
Please also refer to Fig. 3 A and 4B, wherein Fig. 4 B represents that pass through the respectively frequency response of S11 of a non-reference zone of signal conductor of the present invention and conventional signal conductor concerns schematic diagram.When operating frequency more height, under same operating frequency, the pass through return loss (shown in solid line T2) of non-reference zone 122 of conventional signal conductor 132 will descend the more, make distorted signals more serious, and signal conductor 230 of the present invention can improve the return loss (shown in solid line P2) of the non-reference zone 222 of passing through, and levels off to the status transmission of complete reference plane (shown in solid line R2) of passing through under perfect condition.
Please also refer to Fig. 3 A and 4C, wherein Fig. 4 C represents pass through the respectively schematic diagram that concerns of the frequency response of a non-reference zone and characteristic impedance of signal conductor of the present invention and conventional signal conductor.When operating frequency more height, under same operating frequency, the pass through characteristic impedance (shown in solid line T3) of non-reference zone 122 of conventional signal conductor 132 will be risen the more, make that the unmatched situation of impedance is more serious, and signal conductor 230 of the present invention can reduce the characteristic impedance (shown in solid line P3) of the non-reference zone 222 of passing through, and levels off to the status transmission of complete reference plane (shown in solid line R3) of passing through under perfect condition.
Please refer to Fig. 5 A and 5B, it represents a kind of signal transmission structure of another preferred embodiment of the present invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of II-II line.Signal transmission structure 310 has a signal conductor 330 and reference planes 320 at least.Wherein, signal conductor 330 for example is positioned on the reference planes 320, and coplane and overlapping each other not between signal conductor 330 and the reference planes 320.Under the wiring density that does not influence adjacent signal lead 330, can widen relatively and the extend ledge 332 of signal conductor 330, and this ledge 332 is covered on the non-reference zone 322 fully, and local ledge 332 also may extend to the top outside the non-reference zone 322, and make ledge 332 can be surrounded on non-reference zone 322 around, and make the area of the area of ledge 332 greater than non-reference zone 322.So, utilize to improve the equivalent capacity C of the ledge 332 of signal conductor 330, so that the characteristic impedance Z of signal conductor 330 can reach unanimity, to reach the purpose of local equalize and impedance matching.
Please refer to Fig. 6 A and 6B, it represents a kind of signal transmission structure of the another preferred embodiment of the present invention respectively, and it is applicable to the schematic top plan view of a wiring board and the generalized section of III-III line.Signal transmission structure 410 has a signal conductor 430 and reference planes 420 at least.Wherein, signal conductor 430 for example is positioned on the reference planes 420, and coplane and overlapping each other not between signal conductor 430 and the reference planes 420.Transfer wire 430 has a ledge 432, this ledge 432 comprises one first ledge 432a and one second ledge 432b, and the first ledge 432a is distributed in the side with respect to the bearing of trend of signal conductor 430 of non-reference zone 422, and the second ledge 432b is distributed in the opposite side with respect to the bearing of trend of signal conductor 430 of non-reference zone 422, makes ledge 432 be distributed in the both sides of non-reference zone 422 with dumb-bell shape.So, utilize the equivalent capacity C of the ledge 432 that improves signal conductor 430, the characteristic impedance Z of signal conductor 430 will be reached unanimity, to reach the purpose of local equalize and impedance matching.
Please refer to Fig. 7, its expression the present invention is a kind of signal transmission structure of a preferred embodiment again, and it is applicable to the schematic top plan view of a wiring board.Signal transmission structure 510 has a signal conductor 530 and two reference planes 520,540 at least.Wherein, signal conductor 530 is in the same plane with reference planes 520,540, and reference planes 520 have a perforate 522, and it is positioned at the lateral margin of the adjacent signal lead 530 of reference planes 520, and perforate 522 constitutes a non-reference zone.In addition, signal conductor 530 correspondences have a ledge 532, and it protrudes in the lateral margin of signal conductor 530, and ledge 532 more extends within the perforate 522, keep one apart from d so that signal conductor 530 utilizes ledge 532 with reference planes 520.Therefore, utilize the equivalent capacity C (relative distance d minimizing) of the ledge 532 that improves signal conductor 530, the characteristic impedance Z of signal conductor 532 will be reached unanimity, to reach the purpose of local equalize and impedance matching.
As shown in the above description, signal transferring structure of the present invention comprises reference planes and a signal conductor at least.Reference planes have a non-reference zone, and signal conductor is disposed at the adjacent side of reference planes, and signal conductor has at least one ledge.This ledge is corresponding to the position of non-reference zone, and protrudes in the lateral margin of signal conductor.Wherein, reference planes for example are a power plane or a ground plane, and for example non-copline and overlapping each other between reference planes and the signal conductor, or both coplines and in the same plane.In addition, when overlapping each other between reference planes and the signal conductor, its ledge for example extends to the top of non-reference zone, and utilizes overhang with the characteristic impedance that changes signal conductor it to be reached unanimity, to reach impedance matching effect.In addition, when reference planes and signal conductor were in the same plane, its ledge for example extended within the perforate of reference planes, and utilized ledge with the characteristic impedance that changes signal conductor it to be reached unanimity, to reach impedance matching effect.
In sum, signal transmission structure of the present invention has the following advantages:
(1) the present invention utilizes the equivalent capacity of the ledge that improves signal conductor, is used to overcome signal rows through the high impedance effect that non-reference zone produced, and the characteristic impedance of signal conductor is reached unanimity, to reach the purpose of local equalize and impedance matching.
(2) the present invention utilizes the equivalent capacity of the ledge that improves signal conductor, is used to promote the return loss that signal rows is reduced when non-reference zone.
(3) the present invention utilizes the equivalent capacity of the ledge that improves signal conductor, is used to reduce the insertion loss that signal rows is risen when non-reference zone.
(4) signal transmission structure of the present invention can be widely used on the transmission line design of large-sized print circuit board or base plate for packaging.
In sum, though the present invention with preferred embodiment openly as above, so it is not to be used to limit the present invention, any those skilled in the art, under the situation that does not break away from the spirit and scope of the present invention, can carry out various changes and modification, therefore scope of the present invention is as the criterion with the claim restricted portion that is proposed.
Claims (2)
1. a signal transmission structure is applicable to a wiring board, and this signal transmission structure comprises at least:
One reference planes have a perforate; And
One signal conductor, be disposed at same plane with these reference planes, and this signal conductor on these reference planes across crossing this perforate, and this signal conductor has at least one ledge, it is corresponding to the position of this perforate, and this ledge extends within this perforate, and keeps a distance with these reference planes.
2. signal transmission structure as claimed in claim 1, wherein, these reference planes be power plane and ground plane one of them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101026176A CN1330220C (en) | 2003-10-27 | 2003-10-27 | Structure of signal transferring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101026176A CN1330220C (en) | 2003-10-27 | 2003-10-27 | Structure of signal transferring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1541045A CN1541045A (en) | 2004-10-27 |
| CN1330220C true CN1330220C (en) | 2007-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101026176A Expired - Lifetime CN1330220C (en) | 2003-10-27 | 2003-10-27 | Structure of signal transferring |
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| Country | Link |
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| CN (1) | CN1330220C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9035714B2 (en) * | 2012-07-03 | 2015-05-19 | Cisco Technology, Inc. | Parasitic capacitance compensating transmission line |
| CN109496065B (en) * | 2018-12-30 | 2021-07-13 | 生益电子股份有限公司 | A method of making an impedance |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5093639A (en) * | 1990-09-20 | 1992-03-03 | The United States Of America As Represented By The Secretary Of The Air Force | Electromagnetic stripline coupler apparatus |
| US5525953A (en) * | 1993-04-28 | 1996-06-11 | Murata Manufacturing Co., Ltd. | Multi-plate type high frequency parallel strip-line cable comprising circuit device part integratedly formed in dielectric body of the cable |
| US6023210A (en) * | 1998-03-03 | 2000-02-08 | California Institute Of Technology | Interlayer stripline transition |
| CN2653840Y (en) * | 2003-10-27 | 2004-11-03 | 威盛电子股份有限公司 | Signal transmission structure |
-
2003
- 2003-10-27 CN CNB2003101026176A patent/CN1330220C/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5093639A (en) * | 1990-09-20 | 1992-03-03 | The United States Of America As Represented By The Secretary Of The Air Force | Electromagnetic stripline coupler apparatus |
| US5525953A (en) * | 1993-04-28 | 1996-06-11 | Murata Manufacturing Co., Ltd. | Multi-plate type high frequency parallel strip-line cable comprising circuit device part integratedly formed in dielectric body of the cable |
| US6023210A (en) * | 1998-03-03 | 2000-02-08 | California Institute Of Technology | Interlayer stripline transition |
| CN2653840Y (en) * | 2003-10-27 | 2004-11-03 | 威盛电子股份有限公司 | Signal transmission structure |
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| Publication number | Publication date |
|---|---|
| CN1541045A (en) | 2004-10-27 |
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