CN1307413C - Method of Femtosecond Laser Cold Cutting of Rock and Soil Porous Media - Google Patents
Method of Femtosecond Laser Cold Cutting of Rock and Soil Porous Media Download PDFInfo
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- CN1307413C CN1307413C CNB2005100181900A CN200510018190A CN1307413C CN 1307413 C CN1307413 C CN 1307413C CN B2005100181900 A CNB2005100181900 A CN B2005100181900A CN 200510018190 A CN200510018190 A CN 200510018190A CN 1307413 C CN1307413 C CN 1307413C
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- 238000005520 cutting process Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000002689 soil Substances 0.000 title claims abstract description 20
- 239000011435 rock Substances 0.000 title claims abstract description 13
- 238000003698 laser cutting Methods 0.000 claims abstract description 9
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 6
- 238000002474 experimental method Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 230000005484 gravity Effects 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims 1
- 238000011160 research Methods 0.000 abstract description 6
- 239000010419 fine particle Substances 0.000 abstract description 4
- 238000011161 development Methods 0.000 abstract description 3
- 238000009826 distribution Methods 0.000 abstract description 3
- 238000005459 micromachining Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 239000011148 porous material Substances 0.000 description 9
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 7
- 229910052753 mercury Inorganic materials 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000011799 hole material Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
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Abstract
本发明公开了一种岩土孔隙介质飞秒激光冷切割的方法，涉及岩土孔隙介质微观研究中断面薄片微加工方法。本发明利用飞秒激光切割装置作为切割平台。所述的飞秒激光切割装置由飞秒激光切割器1、基座2、平台3组成。其中飞秒激光切割器1由电脑控制系统1.1、飞秒激光发射器1.2、透镜组合1.3组成；切割步骤依次为：参数设置5、激光定位6、试样制备7、基座定位8、激光切割9。本发明可以对粒径1mm左右的细小颗粒进行切割；不破坏介质内部裂隙的大小及分布特征，获得平整的介质断面，满足岩土微观试验研究的要求；可以根据实验要求，获得连续的介质断面薄片，这对研究岩土介质中的裂隙的发育、发展具有非常重要的意义。
The invention discloses a method for femtosecond laser cold cutting of rock-soil porous media, and relates to a method for micro-machining of fractured sections of rock-soil porous media for microscopic research. The present invention utilizes a femtosecond laser cutting device as a cutting platform. The femtosecond laser cutting device is composed of a femtosecond laser cutter 1 , a base 2 and a platform 3 . The femtosecond laser cutter 1 is composed of a computer control system 1.1, a femtosecond laser transmitter 1.2, and a lens combination 1.3; the cutting steps are: parameter setting 5, laser positioning 6, sample preparation 7, base positioning 8, laser cutting 9. The invention can cut fine particles with a particle diameter of about 1 mm; without destroying the size and distribution characteristics of the cracks inside the medium, a flat medium section can be obtained, which meets the requirements of rock and soil microscopic experimental research; and a continuous medium section can be obtained according to the experimental requirements It is of great significance to study the development and development of cracks in rock-soil media.
Description
Technical field
The present invention relates to section thin slice micro-processing method in the pore media of rock and soil microexamination, specifically, relate to the method that the femtosecond laser cold cut is cut.
Background technology
Any material all contains microporosity and micro-crack to some extent.As pore media, most typical is rock-soil material, because rock-soil material is the pore media of the Nature through deposition formation in 1 years, has a large amount of holes.Hole is an important symbol of geotechnical structure feature, and it is the space that exists of ground liquid, gas phase component, affects water cut, density, water permeability, swell-shrink characteristic, distortion and the strength characteristics of rock soil medium closely.
Present hole microexamination method can be divided into two big classes on means: direct method and indirect method.
1, direct method is a kind of method of pore media section thin slice being carried out microexamination by optical microscope, electron microscope etc.The research of direct method hole microscopic test needs the smooth section thin slice of rock-soil material, and these section thin slices are usually by machine cuts, manually method such as cutting or artificial polishing acquisition.These methods all can produce bigger acting force to medium when obtaining the medium section, correspondingly cause stress to concentrate easily in hole and crack, destroy hole periphery medium, thereby have destroyed the original true form of hole.This influence is more remarkable to the lower medium of intensity.Simultaneously, under the cutting force effect, the medium powder of cutting is filled in the micro-pore easily, and is extruded and tamps, and makes the original hole of section, crack distribute and is damaged, and has influence on microscopic test result's authenticity.In addition, common section thin slice method for making is difficult to fine particle is cut, polishes, so direct method is relatively poor to hole, crack distribution effect in the research fine particle.
2, indirect method comprises test methods such as pressing mercury, nuclear magnetic resonance, gas absorption.Mercury intrusion method is that mercury is pressed in the medium hole by certain pressure, and converses the size of all kinds of holes according to the volume that is pressed into mercury.For rock soil medium, sealing and semi-enclosed hole are same a large amount of to be existed, and this class hole is difficult to be filled by mercury when pressing mercury to test, thereby can't be measured comes out.Method such as nuclear magnetic resonance, gas absorption is under certain pressure water or inert gas to be pressed in the medium hole, measures hole according to the interaction of water in the hole or gas and pore wall.Though the infiltration performance of water or inert gas is stronger than mercury, be difficult to the sealing in the measuring media, semiclosed hole equally.Simultaneously, indirect method is when pressurizeing to sample, and for the lower rock soil medium of intensity, under certain pressure, medium can take place by partial rupture or destruction, and the part hole in the medium is released quickly, makes experimental result produce bigger error even mistake.
Summary of the invention
Purpose of the present invention just is to overcome the above-mentioned shortcoming and defect that prior art exists, and a kind of pore media of rock and soil femtosecond laser method that cold cut is cut is provided.This method can obtain the complete section of medium not destroying under the condition that the pore media of rock and soil crack distributes, and satisfies that the ground microcosmic is micro-, the requirement of scan test.Described femtosecond is 10
-15Second.
The object of the present invention is achieved like this:
1, utilize the femtosecond laser cutter sweep as Cutting platform.Described femtosecond laser cutter sweep is made up of femtosecond laser cutter 1, pedestal 2, platform 3.Wherein femtosecond laser cutter 1 is made up of computerized control system 1.1, femtosecond laser transmitter 1.2, combination of lenses 1.3, as shown in Figure 1.
2, cutting step is followed successively by as shown in Figure 2: parameter is provided with 5, laser positioning 6, specimen preparation 7, pedestal location 8, cut 9;
1. parameter is provided with 5
According to requirement of experiment, regulate the femtosecond laser parameters by computerized control system 1.1, make the size of laser facula 10 satisfy the requirement of medium microscopic test, promptly consistent with the cutting live width.
2. laser positioning 6
Start femtosecond laser transmitter 1.2, obtain laser beam J, regulate combination of lenses 1.3, laser is guided in the perform region.
3. specimen preparation 7
Femtosecond laser can produce small impact when rock-soil material is cut.When preparation cutting sample 4, for the bigger sample 4 of particle diameter, only need to make sample under gravity state, keep balance by the method for artificial polishing, do not roll; For the less sample 4 of particle diameter, need sample 4 be fixed on the smooth object, as wave carrier piece with glue.For laser beam J can be acted on the sample 4 easily, sample 4 is pasted along the fixture edge.
4. the pedestal location 8
The sample 4 for preparing is placed on the platform 3.Platform 3 can satisfy sample 4 all arounds and height is up and down regulated.Position according to the location positioning pedestal 2 of laser facula 10.Regulate platform 3, sample 4 can be met the demands in whole cutting process, need not again pedestal 2 to be located, avoid the cutting section out-of-flatness.And the height of adjusting platform 3, the cutting position of laser facula 10 is met the demands.
5. cut 9
The present invention has following key property:
1, the hot melt of process---this is the most important characteristics of femtosecond processing.Femtosecond laser owing to there is not the influence of energy dispersal, concentrates the energy that injects to obtain effectively highly to put aside in the zone of action in extremely short time and minimum space and matter interaction, has improved the utilization ratio of laser energy greatly.Temperature in the zone of action sharply rose in moment, and will be considerably beyond the fusing and the gasification temperature of material, made material generation highly ionized, finally for unprecedented high temperature, high pressure and highdensity plasmoid.At this moment, the original binding force of material internal has been not enough to check the high density ion, and the rapid expansion of electron gas makes that finally the material in the zone of action obtains removing with the form of plasma to external eruption.Because original whole energy has almost been taken away in the eruption of plasma, the temperature in the zone of action has obtained to descend suddenly, roughly returns to the preceding state of temperature of laser action.In this course, the existence of heat fusing has been avoided in strictness, has realized " cold " processing on the relative meaning, weakens greatly and has eliminated the negative effect that thermal effect is brought in traditional processing.
2, the accuracy of processing stage---process for femtosecond laser, in the extended period of each laser pulse and matter interaction, avoided the existence of thermal diffusion, fundamentally eliminating multiple effects such as the melting zone that is similar in the long pulse process, heat-affected zone, shock wave to influence and fire damage that material around caused, the spatial dimension that process is involved is dwindled greatly, thereby improved the order of accuarcy of Laser Processing, promptly use femtosecond processing, can " not hurt innocent persons ".
3, the submicron features of processing dimension---in the femtosecond process, it is to be based upon on the basis of multi-photon absorption that the energy between laser and the material shifts, and material is directly proportional with the n power of photon intensity to the absorption of energy.Because the intensity of laser spatially generally is gaussian shaped profile, promptly incident laser is through focusing on the back in the position at focal spot center intensity maximum, and intensity weakens gradually when trending towards the focal spot edge.Regulate incoming laser beam, then can get access to corresponding spot diameter about 1 μ m, in addition more small.Therefore can to obtain width when being used for cutting be cutting live width about 1 μ m to femtosecond.
By above analysis, the present invention has the following advantages and good effect:
1, can the fine particle about particle diameter 1mm be cut;
2, do not destroy the size and the distribution characteristics of medium internal crack, obtain smooth medium section, satisfy the requirement of ground microscopic test research;
3, can obtain continuous medium section thin slice according to requirement of experiment, this growth to the crack in the research rock soil medium, development have very important significance.
Description of drawings
Fig. 1-femtosecond laser cutter sweep synoptic diagram;
Fig. 2-femtosecond laser cutting process flow diagram;
Fig. 3-first kind of cutting mode synoptic diagram;
Fig. 4-second kind of cutting mode synoptic diagram.
Wherein:
J-laser beam;
1-femtosecond laser cutter;
1.1-computerized control system;
1.2-femtosecond laser transmitter;
1.3-combination of lenses;
2-pedestal;
3-platform, but a kind of platform of three-dimensional regulation;
4-cutting sample;
The setting of 5-parameter;
6-laser positioning;
7-specimen preparation;
8-pedestal location;
The cutting of 9-sample;
10-laser facula;
11-spot center trajectory.
Embodiment
Further specify below in conjunction with drawings and Examples:
By the characteristic of above-mentioned femtosecond laser as can be known, the intensity of femtosecond laser concentrates on the hot spot of μ m level.When medium is cut, also only the medium of hot spot active position is cut, can not injure peripheral medium.Therefore, when femtosecond laser cuts medium, can not block the laser beam J of incident.When cutting, the outer tangent line that need remain the point in the line of cut track is vertical with laser beam J, could guarantee laser focusing like this.
When 1, on the platform 3 that only simple parallel moves, cutting, make platform 3 all around moving, even the spot center trajectory 11 that hot spot 10 stays in sample 4 is one group of parallel lines, as shown in Figure 3 perpendicular to the direction of laser beam J is parallel.Both can also can from left to right cut sample 4 to left serpentine direction again according to from left to right or direction from right to left cutting.
2, when platform 3 carries out translation according to given curve, with sample 4 cutting successively from outside to inside, the spot center trajectory 11 after the cutting is a helix, as shown in Figure 4.
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100181900A CN1307413C (en) | 2005-01-25 | 2005-01-25 | Method of Femtosecond Laser Cold Cutting of Rock and Soil Porous Media |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100181900A CN1307413C (en) | 2005-01-25 | 2005-01-25 | Method of Femtosecond Laser Cold Cutting of Rock and Soil Porous Media |
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| Publication Number | Publication Date |
|---|---|
| CN1661354A CN1661354A (en) | 2005-08-31 |
| CN1307413C true CN1307413C (en) | 2007-03-28 |
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| CNB2005100181900A Expired - Fee Related CN1307413C (en) | 2005-01-25 | 2005-01-25 | Method of Femtosecond Laser Cold Cutting of Rock and Soil Porous Media |
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| CN106441990B (en) * | 2016-12-21 | 2024-01-30 | 吉林大学 | Soil body mercury-pressing test sample sampler |
| CN109668765B (en) * | 2019-01-18 | 2021-11-09 | 南京理工大学 | Method for preparing multi-orientation mesoscopic stretching sample based on femtosecond laser processing |
| CN112014240B (en) * | 2020-09-01 | 2023-11-24 | 山东科技大学 | A method for evaluating rock mass shear parameters based on in-situ surface single cracks |
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|---|---|---|---|---|
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2005
- 2005-01-25 CN CNB2005100181900A patent/CN1307413C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918309A (en) * | 1987-06-22 | 1990-04-17 | International Business Machines Corporation | Method for investigating surfaces at nanometer and picosecond resolution and laser-sampled scanning tunneling microscope for performing said method |
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Non-Patent Citations (1)
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