CN1306061C - Planar magnetic sputtering-multi-station film coating apparatus - Google Patents

Abstract

The object of the present invention is to provide a kind of planar magnetron sputtering-multi-station film coating device, it is made up of planar magnetron sputtering target 14, workpiece holder 15, heater 28, gas filling hole 29, vacuum chamber 30, vacuum pumping Group 32 is characterized in that it also includes: turntable 16, connecting rod 17, pinion 18, pinion 19, connecting rod 20, rotation motor 21, revolution motor 22, connecting rod 23, middle gear 24, connecting rod 25, large Gear 26, connecting rod 27 etc. are formed. It has the characteristics of large workpiece loading (that is, multi-station), good coating uniformity, and easy popularization and application.

Description

A planar magnetron sputtering-multi-station coating device

Technical field:

The invention belongs to the technical field of electronic machinery, in particular to a magnetron sputtering thin film preparation device in the electronic thin film preparation technology.

Background technique:

As we all know, the magnetron sputtering thin film preparation device in the existing electronic thin film preparation technology can realize the coating of metal, non-metal simple substance and compound, etc. However, the film area sputtered by the existing planar magnetron sputtering device is small, and the uniformity and consistency are poor, as shown in:

(1) The uniform area of the film sputtered by the existing magnetron sputtering equipment is relatively small;

(2) In order to sputter a film with a large uniform area, it is usually necessary to make the size of the target large;

(3) Existing equipment also has revolution and rotation, such as z195224085.8 (as shown in Figure 1), although the uniformity of the film has been improved to a certain extent, their ratio of revolution and rotation speed cannot be adjusted;

(4) The current planar magnetron sputtering equipment has a small workpiece loading capacity and only one workpiece holder, but this equipment can be loaded with multiple workpiece holders, and each workpiece is symmetrical, thereby greatly improving the batch consistency of the film.

Invention content:

The task of the present invention is to propose a planar magnetron sputtering coating device with large workpiece loading capacity, multi-station, good coating uniformity, and easy popularization and application in view of the shortcomings of existing planar coating equipment.

A kind of planar magnetron sputtering-multi-station coating device provided by the present invention (as shown in Figure 2), it comprises: M (M is a natural number) planar magnetron sputtering target 14, N (N is a natural number) Workpiece holder 15, heater 28, gas filling hole 29, vacuum coating chamber 30, vacuum pumping group 32, it is characterized in that it also includes: rotary table 16, connecting rod 17, pinion 18, pinion 19, connecting rod 20, rotation Motor 21, revolution motor 22, connecting rod 23, middle gear 24, connecting rod 25, large gear 26, connecting rod 27; M planar magnetron sputtering targets 14 are located at the bottom 31 of the vacuum coating chamber; heater 28 is located in the vacuum coating chamber The bottom 31; the air filling hole 29 is located on the bottom 31 of the vacuum coating chamber; the bottom 31 of the vacuum coating chamber has a vacuum pumping group 32; the turntable 16 is connected with the external motor 22 by a connecting rod 27; N workpiece holders 15 are evenly distributed under the turntable 16 , through the connecting rod 17 through the turntable 16 and connected with the gear 18, the gear 18 is installed on the turntable 16; the pinion 19 is connected with the external motor 21 of the vacuum coating chamber 30 through the connecting rod 20; the middle gear 24 is connected through the connecting rod 23 Fixed in the vacuum coating chamber 30 , the middle gear 24 is engaged with the pinion 19 ; the big gear 26 is fixed with the middle gear 24 through the connecting rod 25 .

The working principle of the present invention is:

(1) The principle of rotation: the external motor 21 drives the connecting rod 20, the connecting rod 20 drives the pinion 19 to rotate, the middle gear 24 and the pinion 19 mesh, the pinion drives the middle gear 24 to rotate, then the middle gear 24 drives the large gear 26 to rotate, The bull gear 26 is engaged with the N pinion gears 18, and the bull gear 26 drives the N pinion gears 18 to rotate, and the N pinion gears drive the N workpiece holders 15 to rotate, thereby completing the process of rotation;

(2) Revolution principle: the external motor 22 drives the turntable 16 to rotate through the connecting rod 27, and N workpiece holders 15 and N pinion gears 18 are fixed on the turntable 16, so the workpiece holder 15 and the pinion gear 18 revolve, thus completing the revolution process .

(3) The device of the present invention is that the N groups of substrates of N workpiece holders 15 are made public and rotated at the same time, so that the substrates on the N workpiece holders can be sputtered, so the planar magnetron sputtering provided by the present invention -The multi-station coating device has the characteristics of large workpiece loading (that is, multi-station). The position and rotation process of the workpiece holder 15 and the target are shown in FIG. 3 .

The working process of the present invention is: N groups are packed into workpiece holder 15 by sputtering substrate, after vacuum coating chamber 30 is sealed, by vacuum pumping group, coating chamber 30 is evacuated; Simultaneously, start heater 28, to N A sputtered substrate is heated; the air filling hole 29 inputs gas into the vacuum coating chamber 30; and the rotation and revolution of N groups of sputtered substrates are respectively driven by adjusting the rotating speed of the motors 21 and 22; the planar magnetron sputtering power supply is started , to achieve coating.

It should be noted that the present invention is a planar magnetron sputtering device, and by adjusting the rotation speeds of the rotation motor 21 and the revolution motor 22, the rotation speed and rotation speed of the substrate to be sputtered can be adjusted.

The features of the present invention are:

(1) The device of the present invention can realize revolution and rotation of N groups of sputtered substrates;

(2) The difference with the existing magnetron sputtering device with public and rotation is that the present invention is a planar magnetron sputtering device, and its public and self-rotation speed and public rotation speed ratio are adjustable, so that the substrate can be basically Realize surface scanning and prepare uniform thin film;

(3) It has rotation, rotation and adjustable speed. At the same time, the center of the substrate does not coincide with the target, so for the same large target, the area of the sputtering film is greatly increased;

(4) The number of workpiece holders of the device of the present invention is N, and multiple groups (N groups) of substrates can be sputtered into films at one time, and the consistency of the film thickness is good.

Description of drawings

Fig. 1 is a schematic diagram of the structure of the magnetron sputtering thin film preparation device in the existing electronic material preparation technology

Among them: 1-flange, 2-evaporation source, 3-heater, 4-rotation and revolution mechanism, 5-transmission wheel, 6-vacuum coating chamber top, 7-vacuum coating chamber wall, 8-plated workpiece clamp , 9-plane magnetron sputtering target, 10-bottom of vacuum coating chamber, 11-lining, 12-gas filling hole, 13-vacuum coating chamber;

Fig. 2 is a schematic structural view of the planar magnetron sputtering-multi-station coating device of the present invention

Among them, 14-planar magnetron sputtering target, 15-workpiece clamp, 16-turntable, 17-connecting rod, 18-pinion, 19-pinion, 20-connecting rod, 21-rotation motor, 22-revolving motor, 23-connecting rod, 24-middle gear, 25-connecting rod, 26-big gear, 27-connecting rod, 28-heater, 29-inflatable hole, 30-vacuum coating chamber, 31-bottom of vacuum coating chamber, 32 - Vacuum pumping group;

Fig. 3 is a schematic diagram of the substrate rotation of the planar magnetron sputtering-multi-station coating device of the present invention

Among them, 14-planar magnetron sputtering target, 15-work clamp, 18-pinion, 26-big gear.

Detailed ways:

Preparation of BST (barium strontium titanate) thin film:

In the planar magnetron sputtering-multi-station coating device of the present invention, the number of workpiece clamps used is N=6, the target position is M=3, the diameter of the target is 120mm, and the center of the target is 30mm away from the center of the substrate. The selected rotation-to-revolution ratio is 5.3, and the coating time is 30 hours. Six groups of BST (barium strontium titanate) films are prepared at one time by using the device of the present invention. The thickness of the prepared BST (barium strontium titanate) films is 1 μm, and the relative deviation of the film thickness within and between sheets is less than 3%.

Claims (2)

1. A planar magnetron sputtering-multi-station coating device, which comprises: M planar magnetron sputtering targets (14), N workpiece clamps (15), heater (28), gas filling holes (29) , vacuum coating chamber (30), vacuum pumping group (32), wherein M, N are natural numbers, it is characterized in that it also includes: rotating disk (16), connecting rod (17), pinion (18), pinion ( 19), connecting rod (20), rotation motor (21), revolution motor (22), connecting rod (23), middle gear (24), connecting rod (25), large gear (26), connecting rod (27) ; M planar magnetron sputtering targets (14) are located at the bottom of the vacuum coating chamber (31); the heater (28) is located at the bottom of the vacuum coating chamber (31); the gas filling hole (29) is located at the bottom of the vacuum coating chamber (31); There is a vacuum pumping group (32) at the bottom (31) of the vacuum coating chamber; the turntable (16) is connected with the external motor (22) by a connecting rod (27); N workpiece holders (15) are evenly distributed under the turntable (16) , through the connecting rod (17) through the turntable (16) and connected with the gear (18), the gear (18) is installed on the turntable (16); the pinion (19) is connected with the vacuum coating chamber ( 30) The external motor (21) is connected together; the middle gear (24) is fixed in the vacuum coating chamber (30) through the connecting rod (23), and the middle gear (24) is engaged with the pinion (19); the big gear (26) Be fixed together with middle gear (24) by connecting rod (25). 2. A planar magnetron sputtering-multi-station coating device according to claim 1, characterized in that by adjusting the rotation speed of the rotation motor (21) and the rotation speed of the revolution motor (22), the rotation and rotation of the sputtered substrate are realized. speed regulation.

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