CN1393653A - Device and method for modularization mounting of LED - Google Patents

Abstract

A modular light emitting diode (LED) assembly is provided, including a light source module with a plurality of prepackaged LEDs arranged in a series array. The module includes a thermally conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. Thermally conductive adhesive tape sticks the LED module to the mounting surface. As a result, LEDs can be operated at higher currents than normally allowed. As a result, the brightness and performance of the LEDs are enhanced without reducing the lifetime of the LEDs. Multiple LED modules can be wired together in a substantially continuous fashion and loaded into a feeder, such as a reel or box. Therefore, to install multiple such LED modules, the worker simply pulls the modules from the feeder as needed, fixes the appropriate number of modules in place, and connects the assembled modules to a power source.

Description

Modular mounting device and method for light emitting diodes

technical field

The present invention relates generally to light emitting diode (LED) lighting devices, and more particularly to LED lighting modules having thermal conductivity that improves the efficiency and performance of the LEDs.

Background technique

Most lighting applications use either incandescent bulbs or gas-filled bulbs, especially in lighting applications where higher than low levels of lighting are required. Such light bulbs generally do not have a long working life and therefore need to be replaced frequently. Gas-filled bulbs, such as fluorescent or neon tubes, may have a long life, but operate on dangerously high voltages and are relatively expensive. Also, both light bulbs and gas-filled bulbs are relatively power hungry.

In contrast, light emitting diodes (LEDs) are less expensive, operate at low voltages, and have a long operating life. In addition, LEDs consume less power and are more compact. These characteristics make LEDs particularly desirable and suitable for many applications. However, one disadvantage of LEDs is that they generally do not provide sufficient brightness for applications that require more than low levels of illumination.

As we all know, although the luminous brightness of the LED can be increased by increasing the supply current of the LED, the increased current also increases the junction temperature of the LED. The increased junction temperature may reduce the efficiency and lifetime of the LED. For example, it has been noted that the operating lifetime of silicone and gallium arsenide decreases by a factor of 2.5 to 3 for every 10°C increase in temperature above a certain temperature. LEDs are often fabricated from semiconductor materials, and these have many properties similar to those of silicone and gallium arsenide.

Another factor in the use of LEDs is that, in most systems, a series of LEDs must be connected together and mounted to a surface. This connection and installation is usually a time-consuming and labor-intensive process.

Accordingly, there is a need in the art for a convenient and efficient means for attaching LEDs to surfaces. There is also a need in the art for lighting systems using LEDs that provide lighting levels comparable to those of incandescent and gas-filled tube lights.

Contents of the invention

The lighting system of the present invention is directed to an LED installation wherein, in a preferred embodiment, the device is adapted to provide increased LED brightness.

According to a preferred embodiment there is provided a lighting system comprising a plurality of lighting modules adapted to be mounted on a surface of a heat conducting element. Each module includes a plurality of light emitting diodes (LEDs) and a plurality of conductive contacts. Each of said LEDs is electrically connected to at least one of said contacts in such a manner that the LEDs form a series array between opposing first and second sides of said module. An insulating layer is provided having a first side and a second side. The contacts are connected to the first side of the insulating layer. Each module further includes a layer of adhesive adapted to secure the module to a surface of a heat conducting element such that heat is conducted from the module through the adhesive into the heat conducting element.

According to another preferred embodiment, a lighting system has a plurality of lighting modules adapted to be mounted on a surface of a heat conducting element. Each module includes a plurality of light emitting diodes (LEDs), a plurality of conductive contacts, and an insulating layer supporting the contacts. Each of said LEDs is electrically connected to at least one of said contacts in such a manner that the LEDs form a series array on said module. The modules are electrically connected to each other such that the series array of each module is in parallel with the series array of other modules. Additionally, wherein the interconnected modules are placed in a hopper such that selected portions of the interconnected modules can be continuously dispensed from, and cut off from, the hopper.

According to yet another preferred embodiment, the present invention provides a method of mounting a plurality of lighting modules on a heat conducting surface such that heat is absorbed from the modules into the heat conducting surface. A plurality of lighting modules are electrically connected to each other in succession. Each module includes a plurality of LEDs, a plurality of conductive contacts, and an insulating layer having a first side and a second side. Each of the LEDs is electrically connected to at least one of the contacts in such a way that these LEDs form a series array. The contacts are connected to the first side of the insulating layer. The series array of each module is connected in parallel with the series array of other modules. A feeder is provided and constructed to include a plurality of interconnected modules. Modules are continuously drawn from the feeder and mounted continuously onto the thermally conductive surface using thermally conductive tape.

According to yet another preferred embodiment, a method of producing a lighting system is provided. A plurality of LED modules are provided, each module having a plurality of LEDs arranged in a series array. One layer of tape was applied to one side of each LED module such that the tape stretched outward across the opposite side of the module. A linear chain of LED modules is formed by using flexible conductors to electrically connect adjacent modules. The linear chain of modules is tightly packed by winding the modules in a circle or folding the modules in a spiral pattern.

In order to briefly describe the purpose of the assembly structure of the present invention, and the advantages achieved over the prior art, some advantages have been described above. It should of course be understood that not all such advantages may be achieved in accordance with any particular embodiment. Thus, for example, those skilled in the art will recognize that the present invention may be practiced in a manner in which one of the advantages or groups of advantages described herein may be obtained or optimized without achieving what is described or suggested herein. other purposes or advantages.

All such embodiments are intended to be included within the scope of the present invention. These and other embodiments will become apparent to those of ordinary skill in the art from the following detailed description of the preferred embodiment, taken in conjunction with the accompanying drawings. The invention is not limited to a particular embodiment.

Description of drawings

Figure 1 is a perspective view of an LED module having the features described in one embodiment;

Figure 2 is a side view of a typical prepackaged LED lamp;

Fig. 3 is a top view of the LED module of Fig. 1;

Fig. 4 is the side view of Fig. 3 device;

Figure 5 is a close-up side view of the device of Figure 3 mounted on a thermally conductive element;

Figure 6 is another side cross-sectional view of the device of Figure 3 mounted on a thermally conductive flat surface;

Figure 7 is a side view of an LED module having the features described in another embodiment;

Figure 8 is a side view of an LED module having the features described in yet another embodiment;

9 is a plan view of an LED module in yet another embodiment;

Figure 10 shows the LED module of Figure 9, including a shielding layer;

Figure 11 is a cross-sectional view of the resulting LED module along line 11-11 in Figure 10;

Figure 12 is a perspective view of the LED module of Figure 10, showing a reflective strip incorporated thereon;

13 is a side view of the LED module of FIG. 9 mounted on a flat surface;

14 is a close-up side view of the LED module of FIG. 9 mounted on a curved surface;

15 is a perspective view of a pipeline lighting device equipped with LED modules;

Figure 16 is a side sectional view taken along line 16-16 in Figure 14;

Figure 17 is a partial view of the side wall of the device of Figure 15, taken along line 17-17 in Figure 15;

Fig. 18 is a top view of the LED module installed on the side wall of the device in Fig. 15;

Figure 19 shows a plurality of modules, such as the LED module of Figure 9, connected together with wires;

Figure 20 is a circuit diagram showing the structure of Figure 19 connected to a power supply;

Fig. 21 is a side view of a plurality of LED modules connected together by wires, such as the LED module of Fig. 9, placed on the feeding reel;

Figure 22 shows the modules wired together, from the feed reel of Figure 21 installed into the pipeline lighting device;

Fig. 23 shows a plurality of LED modules connected together with wires, such as the LED module of Fig. 9, placed in a plan view of a box feeder;

Figure 24 is a plan view of an LED module with module wire connectors.

Detailed ways

First, referring to FIG. 1 , one embodiment of a light emitting diode (LED) lighting module 30 is disclosed. In the illustrated embodiment, the LED module 30 includes five prepackaged LEDs 32 positioned along the front edge of the module 30 . However, it will be appreciated that LED modules can be made with any number of LEDs 32 assembled in any desired configuration.

Referring now to FIG. 2 , a typical LED assembly 32 includes a diode chip 34 encapsulated in a resin matrix 36 . The LED assembly 32 generally has a focusing lens portion 38 on a base 36, and a pair of leads 40, 44, one of which is negative and the other is positive. A negative lead 40 is connected to the anode side 42 of the diode chip 34 and a positive lead 44 is connected to the cathode side 46 of the diode chip 34 . Positive lead 44 preferably includes reflector portion 48 to help direct light from diode 34 to focus mirror portion 38 .

Referring now to FIGS. 1-5 , the LED module 30 preferably includes five prepackaged LED lamps 32 mounted in a linear array on a circuit board 50 and electrically connected in series. The LED lamp 32 may comprise a Hewlett Packard model HLMT-PL00 lamp which uses a pre-packaged aluminum indium gallium phosphide (ALInGaP) chip 34 . In the illustrated embodiment, each prepackaged LED is substantially identical so they emit the same color of light. It should be understood, however, that different LEDs may be used to achieve certain desired lighting effects.

The illustrated circuit board 50 is preferably approximately 0.05 inches thick, 1 inch long, and 0.5 inches wide. It consists of three layers: copper contact layer 52 , epoxy insulating layer 54 , and aluminum body layer 56 . The copper contact layer 54 consists of a series of six elongated and generally parallel flat copper sheets 60 adapted to be connected to the leads 40 , 44 of the LED 32 . Each copper contact 60 is electrically insulated from the other copper contacts 60 by insulating layer 54 . It is preferred to have the copper contacts 60 substantially on the same plane.

The prepackaged LEDs 32 are secured to one side of the circuit board 50 such that the base portion 36 of each LED is substantially against the side of the circuit board 50 . The LED focuser portion 38 is thus oriented outwardly so as to direct light in a direction substantially in the same plane as the circuit board 50 . LED leads 40, 44 are soldered to contacts 60, creating a series array of LEDs. The excess of the individual prepackaged LED lamp leads can be stripped off if desired. Each contact 60, except the first and last contacts 62, 64, has a negative lead 40 and a positive lead 44 attached thereto. Of the first and last contacts 62, 64, one has only a negative lead 40 attached thereto; and the other has only a positive lead 44 attached thereto.

The soldering areas 66 of the contacts accept the leads 40, 44, which are preferably soldered to the contacts 60 with solder 68; however, each contact 60 preferably has a surface area much larger than that required for soldering in the soldering areas 66 . The increased contact surface area allows each contact 60 to act as a heat sink, effectively absorbing heat from the LED leads 40,44. To maximize this effect, the contacts 60 are preferably shaped as large as possible while still fitting the circuit board 50 .

The insulating layer 54 preferably has strong insulating properties and high thermal conductivity, and is preferably as thin as possible. For example, in the illustrated embodiment, the insulating layer 54 is comprised of a layer of Thermagon(R) epoxy resin about 0.002 inches thick.

It should be understood that various materials and thicknesses may be used for insulating layer 54 . In general, the lower the thermal conductivity of the material used for the insulating layer 54, the thinner the insulating layer should be to achieve maximum thermal conductivity of the module. However, even if a material such as Thermagon(R) epoxy is used (which has high thermal conductivity), the insulating layer is preferably as thin as possible to minimize thermal resistance. Certain ceramic materials, such as beryllium oxide and aluminum nitride, do not conduct electricity but conduct heat well. These materials, as well as others, are also acceptable materials for the insulating layer.

In the illustrated embodiment, the main body 56 occupies the majority of the thickness of the circuit board 50, and is preferably constructed from a flat sheet of aluminum. For each individual contact 60 , the body 56 acts as a heat pipe, drawing heat from the contact 60 through the insulating layer 54 , thereby conducting the heat away from the LED 32 . However, the body 56 acts as a common heat pipe, drawing heat from all of the contacts 60 rather than just the individual LED 32 . Likewise, in the illustrated embodiment, the surface area of body 56 is approximately equal to the sum of the surface areas of all individual contacts 60 . The main body 56 can be significantly larger than that shown in the illustrated embodiment, but its relatively compact shape is preferred for increased versatility in mounting the lighting module 30 . Additionally, the body 56 is relatively rigid and provides structural support for the lighting module 30 .

In the illustrated embodiment, the body 56 is fabricated from aluminum, which has high thermal conductivity properties and is easily machined during manufacture. It should be understood, however, that any material having favorable thermal conductivity properties (eg, a thermal conductivity greater than 100 Watts per meter per Kelvin (W/m ^* K)) is acceptable.

In the illustrated embodiment, there is a pair of holes 70 formed through the circuit board 50, and the pair of holes are adapted to receive a pair of aluminum pop rivets 72. The pair of pop rivets 72 firmly holds the circuit board 50 on the thermally conductive mounting member 76 . The thermally conductive mounting member 76 acts as a heat sink, or is connected to a heat sink. In this way, heat is conducted from the LED 32 through the module 30 to the additional heat sink 76 with low thermal resistance, so that the junction temperature of the diode chip 34 in the LED 32 does not exceed the maximum desired value.

Referring again to FIGS. 3 and 5 , a power lead 78 is connected across the first and last contacts 62 , 64 of the circuit board 50 to provide current to the series connected LEDs 32 . The power supply is preferably a 12V system and may be AC, DC or any other suitable power supply. 12V AC systems can be fully rectified.

The small LED module 30 has versatility, so that multiple modules can be installed in different places and in different structures. For example, some applications include only a single module for a particular lighting application, while other lighting applications use multiple modules electrically connected in parallel with each other.

It should also be understood that any number of LEDs may be included in a module. For example, some modules may use 2 LEDs, while other modules may use 10 or more LEDs. One of the ways to determine the number of LEDs to include in a single module is to first determine the desired operating voltage and supply voltage for the individual LEDs in the module. Thus, the desired number of LEDs for a module is roughly equal to the supply voltage divided by the individual LED operating voltage.

The LED module of the present invention can quickly conduct heat away from the diode chip 34 of each LED 32 , so that the LED 32 can work in a state exceeding the normal operating parameters of the prepackaged LED 32 . In particular, the heat sink enables the LED circuit to be driven in a continuous, pulse-free manner at higher long-term currents than is possible with typical LED assembly configurations. This operating current is significantly greater than the manufacturer's recommended maximum. The LEDs also emit significantly more light than the manufacturer's recommended maximum at these higher currents.

The heat transfer arrangement of the LED module 30 is particularly advantageous for packaging smaller pre-packaged LEDs 32 and single diode LED lamps. For example, the HLMT-PL00 type LED lamp used in the illustrated embodiment uses only a single diode, but because the heat energy from the single diode is efficiently drawn into the heat sink through the wire and circuit board, the diode can operate at a higher temperature than the LED usually Operate under a larger current when working. At this current, a single diode LED emits light brighter than many LED lights that use two or more diodes, and brighter than a single diode light in conventional operation. Of course, pre-packaged LED lamps having multiple diodes are also advantageously used with the mounting structure of the present invention. It can be appreciated that the smaller package of the HLMT-PL00 lamp helps conduct heat by having the heat sink attached to the wire closer to the diode chip.

Referring now to FIG. 5 , the first reflective layer 80 is preferably attached directly on top of the contacts 60 of the circuit board 50 and held in place by the rivets 72 . First reflective layer 80 preferably extends outward beyond LED 32 . The reflective material preferably comprises a non-conductive film layer, such as Visible Reflective Film supplied by 3M. The second reflective layer 82 is preferably attached to the mounting member 76 directly adjacent the LED lamp 32 . The second reflective layer 82 is preferably adhered to the mounting surface 76 using an adhesive in a manner known in the art.

Referring again to FIG. 6 , the first reflective layer 80 is preferably curved to form a raised reflective guide relative to the LEDs 32 . This raised guide is adapted to direct light from the LED 32 outward with minimal reflection between the reflector layers 80,82. In addition, the light emitted from the LED passes through the reflective layers 80 and 82 and is guided in a substantially specific direction. FIG. 6 also shows that the circuit board 50 can be mounted directly to any mounting surface 76 .

In another embodiment, the aluminum body portion 56 can be reduced in thickness, or can be made of some softer metal to allow the user to deform the module 30 at least partially. In this way, the module 30 can be adjusted to fit on a variety of surfaces whether flat or curved. Thanks to the ability to adjust the fit of the module with respect to the surface, the shared contact surface between the main body and the adjacent heat sink can be maximized, thus improving the thermal conductivity. Other embodiments may use fasteners instead of rivets to hold the module in place on the mounting surface/sink. These other fasteners may include any known fastening means, such as welding, thermally conductive thread adhesive, or other similar means.

As mentioned above, different materials can be used for the circuit board portion of the LED module. Referring now specifically to FIG. 7 , another embodiment of an LED module 86 includes a series of elongated flat contacts 88 , similar to those described in connection with FIG. 3 . Contacts 88 are mounted directly on body portion 89 . The main body 89 is formed from a substantially flat ceramic plate. The ceramic plate makes up the majority of the circuit board and provides structural support for the contacts 88 . Likewise, the ceramic plate has a surface area approximately equivalent to the combined surface area of the contacts. In this way, the plate is large enough to provide structural support for the contacts 88 and conduct heat away from each contact 88, yet small enough so that the module 86 can be small and convenient. The ceramic plate 89 is preferably non-conductive, but has a high thermal conductivity. Accordingly, the contacts 88 are electrically insulated from each other, but readily conduct heat from the contacts 88 to the ceramic plate 89 and into adjacent heat sinks.

Referring now to FIG. 8, another embodiment of an LED lighting module 90 is shown. LED module 90 includes a circuit board 92 having substantially similar characteristics to circuit board 50 described above in connection with FIG. 3 . The diode portion 94 of the LED 96 is mounted substantially directly on the contact 60 of the lighting module 90 . Thus, by conducting heat directly from diode 94 to each heat sink contact 60, from which heat is conducted to body 56 and out of module 90, any thermal resistance created by the pre-packaged LED wires is eliminated. In this structure, thermal conductivity characteristics are further improved.

Referring to Figures 9-12, another embodiment of an LED module 100 is shown. Like the LED module 30 described above, the LED module 100 preferably includes a circuit board 50 with a contact layer 52 , an insulating layer 54 , and a body layer 56 . The contact layer 52 includes a series of electrical connections and contacts, which will be described in further detail below. The insulating layer 54 electrically insulates the wires and contacts from each other. Body layer 56 provides support and helps guide heat away from contact layer 52 and insulating layer 54 .

As shown in the plan view of the contact layer 52 shown in FIG. 9, the contact layer 52 includes six contacts 60 formed of elongated and generally parallel conductive plates. The leads 40, 44 of five LEDs 32 are attached to contacts 60 to form a linear array of five prepackaged LEDs 32 configured to be connected in series with each other.

The first and second elongate power connections 102, 104 extend generally in the transverse direction of the parallel boards 60, but parallel to the series array described above. Like the contacts 60, the power connections 102, 104 are constructed of a conductive material and are insulated from each other and from the contacts by the insulating layer 54. A second connecting portion 106 is also provided adjacent to the first and second sides 110 and 112 of the circuit board 50 . The second connection portion 106 is also insulated from the contacts 60 and the power connections 102 , 104 by the insulating layer 54 .

The first connector wire 118 extends between the first contact 62 and the first end of the first power wire 102 . The second connector wire 122 extends between the final contact 64 and the second end of the second power wire 104 . Connector wires 118 , 122 have their respective contacts 62 , 64 electrically connected to corresponding power wires 102 , 104 .

FIG. 10 shows a diagram similar to FIG. 9 except that a thin masking layer 126 is used on selected portions of the top surface 130 of the circuit board 50 . FIG. 11 is a cross-sectional view showing the layers of the module 100 . The shielding layer 126 covers certain portions of the contacts 60 and the connections 102 , 104 , 118 , 122 . These covered portions are indicated by dotted lines in FIG. 10 . The contacts and other portions of the wiring are left uncovered to function as solder joints to facilitate electrical connection to other components. The masking layer 126 has an aesthetic effect and also protects contact areas not used for electrical connection from environmental factors.

With continued reference now to FIGS. 10 and 11 , the masking layer 126 partially covers each contact 60 . However, each contact 60 has an uncovered connection area 66 and receives the leads 40 , 44 of the associated LED 32 . The connecting portion 132 of the first and last contact 62 , 64 is also not covered by the masking layer 126 . The shielding layer 126 partially covers each power connection 102 , 104 . The first end connection portion 134 of each power connection line 102 , 104 is disposed at an end closest to the first side 110 of the circuit board 50 . Similarly, the second end connection portion 134 of each power connection 102 , 104 is disposed at an end closest to the second side 122 of the circuit board 50 . The shielding layer 126 does not cover the power connections on the connection portions 134 , 136 . First and second flexible conductors, such as wires 114, 116 (see FIG. 19), may be connected to connection portions 134, 136 to provide power to the LED array.

Referring again to FIG. 12 , a tape layer 140 is applied to the bottom surface 142 of the LED module 100 . As shown, the tape 140 preferably extends across the bottom surface 142 and outwardly from the opposing first and second sides 110, 112 of the circuit board 50 to form first and second wings or ears 144 of the tape 140. , 146. Tape 140 is preferably malleable and easily bendable. Tape 140 has a backing 148 on it. The backing 148 can be peeled off to reveal the tape layer and the tape/module attached to the desired surface in such a way that the module 100 is held securely in place on the surface.

Reflective layer 80 is also preferably attached to circuit board 50 . The reflective layer 80 is preferably retained on the circuit board 50 by an adhesive tape acting between the masking layer 126 and the reflective plate 80 . Reflective layer 80 preferably extends over LED 32 in the manner described above.

Referring again to FIGS. 13 and 14 , adhesive tape 140 secures 100 the module to the flat or curved surface 76 . In the case of a curved surface, the wings or ears of the tape will still allow the module to be securely attached to the curved surface if the module cannot flex effectively to continue to maintain contact of the module with the curved surface. It will of course be understood that the tape layer 140 may or may not be provided with the ears 144, 146 and that the ears may be of any desired size and shape.

As mentioned above, the LED module 100 has good thermal conductivity. The tape 140 preferably has properties that complement the thermal conductivity of the module. In one embodiment, tape 140 comprises an aluminum strip with a thermally conductive adhesive coated thereon. The aluminum tape conforms to curved or corrugated surfaces and is also effective in conducting heat from the module to the surface to which it is attached. This is of particular value when the module 100 is mounted on a curved heat sink surface 76 (as shown in FIG. 14 ), or when the majority of the module circuit board 50 does not directly contact the curved surface. In this case, heat is conducted from the circuit board 50 to the heat sink 76 via the ears 144 , 146 .

In another embodiment, the body of the LED module is made of a bendable material, which allows the module to fit more tightly and easily to the surface of a curved wall.

As mentioned above, LED modules having the characteristics of the above embodiments can be used in many practical applications, such as indoor and outdoor decorative lighting, commercial lighting, local lighting, and even room lighting. Such LED modules can also be used in practical applications where multiples of such modules are used to properly light lighting devices such as duct lighting 160 (see FIG. 15 ). Pipe lighting fixtures are often used for marking including boundaries and text. In these arrangements, the wall member describes the shape desired to be illuminated with one or more conduits in the wall. The light source is housed in said conduit and, typically, a flat transparent diffuser is placed on the top edge of the wall to close the conduit. In this way, desired shapes can be illuminated with desired colors defined by the colors of the lenses and/or LEDs.

Referring now to FIG. 15 , an embodiment of a duct lighting device 160 comprising a "P" shaped housing 162 is disclosed. The housing 162 includes a plurality of walls 164 and a bottom 166 that together define at least one conduit. The surfaces of the walls 164 and bottom 166 are diffuse reflective, preferably coated with a flat white coating. Wall 164 is preferably made of a strong, durable metal with high thermal conductivity. In the illustrated embodiment, a plurality of LED lighting modules 30 are mounted on wall 164 of housing 162 in a spaced manner. A transparent light diffusing mirror (not shown) is preferably placed on the top edge 168 of the wall 164 and closes off the conduit.

Referring now again to FIG. 16, the LED module 30 is securely held to the wall 164 of the conduit fitting with pop rivets 72 (or any other fastening method). The connection of the module 30 to the wall 164 preferably facilitates the conduction of heat from the module 30 to the wall 164 . The large surface area of the conduit walls facilitates efficient heat transfer to the environment and allows the conduit walls 164 to function as heat sinks.

Continuing to refer now to FIGS. 15 to 17 , in the illustrated device 160 , the LED modules 30 are preferably electrically connected in parallel with other modules 30 to each other. The power cord 170 preferably enters through one wall 164 or bottom surface 166 of the housing 162 and preferably includes two 18 AWG main wires 172 . Stub wires 174 are attached to the first and last contacts 62, 64 of each module 30 and are preferably connected to respective main wires 172 using insulation displacement connectors (IDC) 176, as shown in FIG.

Although the LEDs 32 in the module 30 are operated at higher currents than typical prepackaged LEDs, the power efficiency characteristics of the LEDs are retained. For example, a duct lighting fixture 160 using multiple LED modules can be expected to use approximately 4.5 watts.

Still referring to FIG. 17 , the LED module 30 is preferably positioned with the LED 32 facing generally downward, directing light away from the diffuser. Light is preferably directed to the diffuse reflective walls and bottom surfaces 164 , 166 of the housing 162 . By directing the light away from the diffuser, the "hot spots" associated with more direct forms of lighting, such as typical incandescent and gas-filled fixtures, are avoided.

The reflectors 80, 82 of the LED module 30 help direct light from the LEDs towards the diffuse reflective surface. It is understood, however, that an LED module 30 that does not utilize a reflector, or that utilizes only the first reflector 80 may also be suitably used.

The relatively low profile of each LED module facilitates indirect method lighting because, when the module is placed on the wall 164, substantially no shadows are created. Higher profile lighting modules may cast shadows onto the lenses, creating undesired, visible dark areas. To minimize potential shadowing, it is desirable to space the module 30 and attached wires 172 , 174 from the top edge 168 of the wall 164 by a distance of at least about 1/2 inch. It is more desirable to have the module 30 spaced from the top 168 of the wall 164 by more than 1 inch.

The small size and low profile of the LED module 30 enables the module to be mounted in various locations along the conduit wall 164 . For example, referring to FIGS. 15 and 18 , the lighting module 30 must sometimes be mounted on the curved portion 178 of the wall 164 . The illustrated module 30 is approximately 1 inch long to inches, and thus accommodate installation on curved wall 178.

In the embodiment shown in Figure 15, the housing walls 164 are about 3 to 4 inches deep and the conduits between the walls are about 3 to 4 inches wide. In an installation of this size, the modules 30 are preferably spaced about 5 to 6 inches apart. As can be foreseen, larger plumbing fixtures will likely require slightly different LED module solutions, including the use of more LED modules. For example, duct lighting with ducts 1 to 2 feet wide can use LED modules on both walls, or even multiple rows of LED modules. Additionally, in such large duct lighting installations, the orientation of the modules can vary. For example, it may be desirable to tilt certain LED modules to direct light at different angles relative to the diffuse reflective surface.

To avoid hot spots, it is best to avoid a direct light path from the LED 32 to the diffuser. It should be understood, however, that it may be convenient to direct a prepackaged LED lamp with a diffuse reflector towards a channel letter lens.

A single LED typically emits monochromatic light. Therefore, it is best to select the LED type with respect to the desired lighting color of the lighting device. In addition, if a diffuser is used, it is best to choose the diffuser to be substantially the same color as the LED. Such a scheme contributes to the desired brightness and color results. It should also be understood that the diffusely reflective walls and floor can be coated to match the desired lighting color.

Using the LED modules 30 to illuminate the duct lighting device 160 provides significant savings in the manufacturing process. For example, several LED modules can be included in one assembly with corresponding wiring and hardware, allowing a technician to easily assemble the lighting by simply holding the modules in place along the housing wall and connecting the wiring using an IDC or similar as appropriate device. No conventional shaping of the light source is required as is required for gas-filled bulbs. Therefore, manufacturing difficulty and cost are significantly reduced.

It will of course be understood that an LED module having the characteristics of any of the LED module embodiments described above or below can be used in such a duct lighting arrangement, or the like.

Referring now to FIGS. 19 and 20, the electrical connections 102, 104 of the LED modules 100 described above with reference to FIGS. Between the electrical wiring 102, 104 of the electrical wiring), and soldering the wires 114, 116 in place on the electrical wiring connection parts 134, 136, a plurality of modules 100 can be easily connected to each other. In this way, a plurality of LED modules 100 are connected together with wires to form corresponding LED series arrays in an electrically parallel structure.

With continued reference now to FIG. 19, the wires 114, 116 are preferably of the same length. Thus, multiple modules 100 can be wired together to form a string or chain of modules. Because the wires 114, 116 are the same length, a long series of modules facilitates continuous mass production of products. The wires are preferably connected to the module 100 at connection portions 134 , 136 generally on opposite sides of the circuit board 50 . In this manner, the module 100 and associated flexible leads 114, 116 are substantially longitudinally aligned. This arrangement provides a secure connection of the wires to the circuit board 50 .

Referring now to FIGS. 21 to 23, a plurality of modules 100 connected together by wires as shown in the embodiment of FIGS. 19 and 20 can be placed into a feeder 180 so that the The module 100 is loaded into a light fixture, such as a channel letter 160 .

Referring specifically to FIGS. 21 and 22 , a feed reel 182 may be provided with a plurality of such prepackaged LED modules 100 wound on a reel 184 . To load LED modules 100 into piping text 160 or other devices, the worker simply places the piping text next to the LED module reel 182, pulls out the first LED module 100, and inserts it through its adhesive backing. The module is fixed in place on the wall 164 of the piping lettering. As the module is pulled from the hopper, adjacent connected modules are also pulled from the hopper. Thus, once one module 100 is installed, the other module 100 pre-wired to this first module is also ready to go, waiting to be mounted on the pipe wall, as shown in FIG. 22 . In this way, workers sequentially install these prepackaged LED modules 100 while the feed reel 182 dispenses the modules as needed.

When the appropriate number of LED modules 100 are installed, the worker simply cuts the wires 114 , 116 to disconnect the installed LED modules from the LED modules still on the feed reel 182 . The wires 114, 116 of the installed modules are then connected to a power source 186, as shown in FIG. This method of installation is very fast. There is no need for workers to solder, and there is very little wiring.

Figure 23 illustrates another method and apparatus for distributing multiple LED modules. In this embodiment, a box feeder 190 or other type of feeder is provided into which a plurality of LED modules 100 wired together are placed in an overlapping zigzag pattern. The LED module 100 is pulled out from the dispenser as needed, and unfolded within the cassette dispenser 190 as it is pulled out.

It can be appreciated that for the embodiments of FIGS. 21 and 23 , a feeder 180 manufactured according to size can be configured to maintain enough LED modules 100 to provide and meet the requirements of many pipeline characters 160 (or other forms of lighting devices). lighting needs, thus making the production of such devices efficient and simple. This feeder can accommodate any desired number of modules. For example, a reel can be sized to hold 50, 100, 1000 or more modules in such a way that the interconnected modules do not get tangled.

While the feeder 180 is shown as a reel 182 or a cassette 190, it should be understood that any shape or form of feeder can be used. In another embodiment, the series of wire-connected modules can be self-winding, rather than being wound on a spool.

While the preferred module 100 uses tape to secure the module to a surface, it should be understood that the above distribution scheme can be used for modules that are secured by other means (eg, rivets, screws, glue, epoxy, etc.) than tape.

In the embodiment shown in FIG. 18, the power supply wires 114,116 are soldered directly to the electrical wiring connection portions 134,136. It should be understood that in other embodiments, connectors may be provided on the wires, and the wires themselves may have connectors to match the connectors provided on the LED modules. For example, FIG. 23 shows an LED module with a module connector 192 disposed thereon. The leads 194 of the connector 192 are soldered to the first and second electrical connections 102,104. In this way, connector 192 is electrically connected to contact 60 . The mounting portion 196 of the connector 192 engages and solders on the contact connection portion 132 and the auxiliary connection portion 106 to secure the connector 192 to the LED module 100 more firmly. The module connector 192 is adapted to engage a mating wire connector 198 . The wire connector 198 is attached to the power supply wires 114,116. Thus, with the connectors 192, 198 engaged, the desired electrical paralleling scheme is employed. In embodiments using connectors, line writing or other lighting can be assembled by assembling the modules and wire components as needed and simply connecting these components through the connectors.

Although the invention has been described in conjunction with certain preferred embodiments and examples, those skilled in the art will appreciate that the invention extends beyond the specifically described embodiments to other alternative embodiments and/or uses of the invention , and obvious improvements and equivalents thereof. In addition, while several variations have been shown and described in detail, other modifications within the scope of the invention will become apparent to those skilled in the art based on this disclosure. Various combinations or sub-combinations of specific features and aspects of the described embodiments may also be made while remaining within the scope of the invention. In addition, it should be understood that various features and aspects of the above-described embodiments may be combined with or substituted for each other to form different forms of the disclosed modular structures and methods. Accordingly, the scope of the present invention should not be limited by the particular disclosed embodiments described above, but should be determined only by the appended claims.

Claims (34)

1. A lighting system comprising: A plurality of lighting modules adapted to be mounted on the surface of the heat conducting element, each lighting module comprising: a plurality of light emitting diodes (LEDs); a plurality of conductive contacts, each of said LEDs being electrically connected to at least one of said contacts in such a manner that said LEDs form a series array between opposing first and second sides of said module; an insulating layer having a first side and a second side, the contact being connected to the first side; Wherein, each of the modules further includes an adhesive tape layer, which is suitable for fastening the module on the surface of a heat conduction element, so that heat from the module is guided into the heat conduction element through the adhesive tape. 2. The lighting system of claim 1, wherein the module body includes the contacts and insulating layer and a pair of flexible adhesive members extending from first and second sides of the module body for The module body is secured to a surface. 3. The lighting system of claim 2, wherein said flexible adhesive is comprised of thermally conductive tape. 4. The lighting system of claim 2, wherein said flexible bond is comprised of a thermally conductive adhesive such that heat is conducted from said module through the flexible bond to said thermally conductive element. 5. The lighting system of claim 1, further comprising a layer of thermally conductive tape in thermally conductive connection to the second side of the insulating layer, the layer of thermally conductive tape adapted to secure the module to a surface of the thermally conductive element. 6. The lighting system of claim 5, wherein each module includes a body layer disposed between said tape layer and said insulating layer. 7. The lighting system of claim 5, wherein said tape layer comprises said adhesive layer. 8. The lighting system of claim 7, wherein said tape layer comprises a thin metal layer. 9. The lighting system of claim 8, wherein said thin metal layer is comprised of aluminum. 10. The lighting system of claim 1, wherein said plurality of modules are electrically interconnected such that series arrays of LEDs thereof are arranged in parallel. 11. The lighting system of claim 10, further comprising a hopper, wherein a plurality of interconnected modules are disposed in said hopper. 12. The lighting system of claim 11, wherein said feeder includes a reel, and said plurality of interconnected modules are wound about said reel in such a manner that said interconnected modules can be unwound from said reel. 13. The lighting system of claim 11, wherein said plurality of interconnect modules are placed in said hopper in a curved stack such that said interconnect modules can be sequentially removed from said hopper. 14. The lighting system of claim 1, wherein a first conductive power connection and a second conductive power connection are disposed on a first side of said insulating layer, a first of said contacts being electrically connected to said first a wire and the second said contact is electrically connected to said second wire, the first contact is electrically connected to the positive lead of said LED series array, and the second contact is electrically connected to said on the negative lead of the LED series array. 15. The lighting system of claim 14, wherein said first and second power connections are elongate and are positioned generally parallel to said series array of LEDs. 16. The lighting system of claim 15, wherein flexible conductors are attached to generally opposite ends of elongate first and second power supply wires of said modules such that said first and second power supplies of said modules The connecting wires are respectively electrically connected to the first and second power supply connecting wires of other modules. 17. The lighting system of claim 14, wherein the plurality of modules are electrically connected to each other in such a manner that the first and second power connections of a first module are electrically connected to the first and second power connections of a second module. 18. The lighting system of claim 17, wherein said first and second modules are connected by a first wire (extending between said first wires of said modules) and a second wire (extending between said second wires of said modules). between the lines) to connect. 19. The lighting system of claim 17, wherein a connector is disposed on each of said first and second modules, electrically connected to the first and second wires on the respective modules; A wire connector is provided on the end of the pair of wires, the wire connector being adapted to matingly engage with the module connector. 20. The lighting system of claim 1, wherein said insulating layer is comprised of Thermagon(R) epoxy. 21. A lighting system comprising: A plurality of lighting modules adapted to be mounted on the surface of the heat conducting element, each lighting module comprising: a plurality of light emitting diodes (LEDs); a plurality of conductive contacts, each of said LEDs is electrically connected to at least one of said contacts in such a way that said LEDs form a series array on said module; an insulating layer supporting the module; wherein the modules are electrically interconnected such that each series array of modules is electrically connected in parallel to the series array of other modules; wherein the interconnected modules are placed in a hopper such that selected portions of the interconnected modules can be continuously dispensed and removed from the hopper. 22. The lighting system of claim 21 , wherein each of said modules includes a layer of adhesive tape adapted to fasten said modules to a surface of a thermally conductive element such that heat is conducted from said modules through the adhesive tape into said thermally conductive element . 23. The lighting system of claim 21, wherein said feeder comprises a coil and said interconnected modules are wound around the coil. 24. The lighting system of claim 21, wherein said dispenser includes a housing, and wherein said interconnected modules are placed on top of each other in said housing, thereby forming a curved stack of modules in said housing. 25. The lighting system of claim 21, wherein said insulating layer is comprised of Thermagon(R) epoxy resin. 26. A method of mounting a plurality of lighting modules on a thermally conductive surface such that heat is directed from said modules to said thermally conductive surface, comprising: A plurality of lighting modules are provided that are electrically connected in series to each other, each module comprising: a plurality of light emitting diodes (LEDs); a plurality of conductive contacts, each of said LEDs is electrically connected to at least one of said contacts in such a way that said LEDs form a series array; an insulating layer having a first side and a second side, the contact being connected to the first side; Wherein, each module series array is electrically connected in parallel with other module series arrays; providing a feeder configured to accommodate a plurality of interconnected modules; pulling successive modules from said feeder; The modules are continuously mounted to the thermally conductive surface with thermally conductive tape. 27. The method of claim 26, wherein each of said modules includes an adhesive layer, and further comprising engaging said adhesive layer of each module with said thermally conductive surface such that heat passes from said module through said An adhesive layer is introduced into the thermally conductive surface. 28. The method of claim 26, wherein each module includes a layer of thermally conductive tape, and the layer of tape includes a pair of flexible tape members (the flexible tape members extending from opposite sides of the module), and further comprising The flexible tape member is engaged with the thermally conductive surface. 29. The method of claim 28, wherein said layer of thermally conductive tape comprises a thin, flexible layer of aluminum. 30. The method of claim 29, wherein said thermally conductive tape layer comprises a thermally conductive adhesive layer. 31. A method of producing a lighting system comprising: providing a plurality of light emitting diode (LED) modules, each LED module having a plurality of LEDs configured in a series array; applying a layer of tape to one side of each LED module and extending the tape outwardly across the opposite side of the module; Form a linear series of LED modules by electrically connecting adjacent modules using flexible conductors; The linear series of modules is compactly packed by winding the modules into a roll or folding the modules in a curved fashion. 32. The method of claim 31, wherein the adhesive tape includes an adhesive layer. 33. The method of claim 31, wherein said adhesive tape is comprised of a thermally conductive material. 34. The method of claim 31, wherein said adhesive tape comprises a thin, flexible metal layer.

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