CN1392418A - Detection method of circuit board line leakage - Google Patents
Detection method of circuit board line leakage Download PDFInfo
- Publication number
- CN1392418A CN1392418A CN01129268A CN01129268A CN1392418A CN 1392418 A CN1392418 A CN 1392418A CN 01129268 A CN01129268 A CN 01129268A CN 01129268 A CN01129268 A CN 01129268A CN 1392418 A CN1392418 A CN 1392418A
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- Prior art keywords
- circuit board
- circuit
- detection zone
- weld pad
- probe
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- 238000001514 detection method Methods 0.000 title claims abstract description 58
- 239000000523 sample Substances 0.000 claims abstract description 47
- 238000012360 testing method Methods 0.000 claims abstract description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000011229 interlayer Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract 2
- 238000005755 formation reaction Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000009660 micro-sectioning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
A method for detecting circuit missing connection of a circuit board. In order to provide a method for detecting a circuit board, which simplifies the manufacturing process, has high precision and reduces the cost, the invention is provided, and the method comprises the steps of forming a detection area and detecting the electrical property of the detection area; the detection area comprises a common line respectively positioned on the bottom surface of the circuit board, a plurality of welding pads positioned on the top surface of the circuit board and a plurality of probes which are correspondingly positioned on the bottoms of the welding pads and penetrate through the circuit board; a plurality of windows with different inner diameters and aligned to the probes are formed on the common line; the detection of the electrical property of the detection area is to test the electrical property detection between the pads so as to determine the offset of the circuit area, which is whether the circuit area is missed or not.
Description
The invention belongs to the detection method of the method for circuit board detecting, particularly a kind of missing curcuit board wire.
Edges of boards sample (Test Coupon) is the method that the dealer is used for testing and understanding the circuit board quality of finished, main system is used for understanding the thin portion quality of circuit board, especially multiple-plate through-hole structure, because can not only outer sight inspection and testing electrical property, so need be made further little section (Microsectioning) micrography to its structure.As shown in figure 10, circuit board 70 center sections are the line unit 71 of plural number, and each the line unit 71 peripheral place around the circuit board 70 are reserved with edges of boards 701 of proper width, again each line unit 71 around also be reserved with edges of boards 711.Edges of boards 701 are to make various actions such as clamping for manufacturer in processing procedure around the circuit board 70, as for 70 of line unit 71 and circuit boards is to adopt the form that can disconnect (Break-awaypanel) to be connected, during use, can make line unit 71 and circuit board 70 be broken into independently wiring board, to encapsulate or other successive process.The edges of boards of reserving around the line unit 71 711 then use for aforementioned processing procedure.
Edges of boards 701 areas of reserving around the circuit board 70 are bigger, and the edges of boards 711 around the line unit 71 are because of blocking, so area is very limited, because of the edges of boards sample of commonly using must take suitable space, can't utilize the edges of boards 711 of line unit 71 to make the edges of boards sample, so generally tying up on circuit board 70 edges of boards 701 on every side, the edges of boards sample carries out, with test and understanding circuit board quality of finished.
From the above, the edges of boards sample commonly used exists and is subjected to the restriction of position when implementing, and in fact its restriction must take relevant than large space with present embodiment.
In addition, also there is accuracy problem in the edges of boards sample of commonly using.As shown in figure 11, the scope that the edges of boards sample of commonly using ties up to the place, diagonal angle of circuit board 70 and is positioned at edges of boards 701 forms measurement circuit district 72 respectively, and the circuit system in the measurement circuit district 72 makes formation simultaneously with line unit 71, so have identical circuit quality.And carry out edges of boards when test, system utilizes little dicing method that the circuit in the measurement circuit district 72 is cut along its via place, subsequently the place of cutting is ground, center until via, whether be connected really with microscopic via upper and lower side again, whether miss phenomenon to judge it with circuit.
Can find out by above-mentioned embodiment explanation, it is very complicated time-consuming that the edges of boards sample system of commonly using cuts the mode of grinding again earlier, and cut when test because of via, can only judge on the axis that cut direction whether circuit is offset to be same as, yet the direction that circuit may be offset also not only terminates in and cuts direction, so its sentence read result guarantees accurately that from difficulty therefore, its degree of accuracy also remains to be discussed.
The edges of boards sample of commonly using carries out the edges of boards sample with the diagonal position of circuit board 70 mostly, but in fact the stitch seam leans out line amount in circuit board 70 1 corners is also exactly so identical with the side-play amount at place, diagonal angle, the side-play amount in a corner is still in permissible range probably, and the side-play amount in another corner at place, diagonal angle may exceed permissible range.Under this kind situation, because of the stitch seam leans out line amount that can't confirm that line unit 71 still in permissible range, and entire circuit plate 70 must be cancelled, cause its cost high.As can be known above-mentioned, the edges of boards sample of commonly using is big because of working space, and is restricted on the enforcing location, thereby reduces the accuracy of detecting, and improved manufacturing cost.
The detection method that the purpose of this invention is to provide a kind of missing curcuit board wire of simplifying processing procedure, degree of accuracy height, reducing cost.
The present invention includes when making circuit board thereon that the appropriate location forms at least one detection zone simultaneously with line unit and the detection detection zone is electrical; The detection zone that is formed on the circuit board comprises the common circuit that is positioned at circuit board bottom surface, weld pad and most corresponding respectively each weld pad bottom probe to constitute electric connection and to run through circuit board that is positioned at that majority is positioned at board top surface at least; Being formed with plural number on the common circuit has different inner diameters and is aligned with each probe respectively so that common circuit and each probe are the window of the shape of opening a way; Detect detection zone electrically for using the side-play amount of judging the line areas of whether missing between line areas and weld pad to test electrically to detect between each weld pad.
Wherein:
Detection zone can be arranged to be reserved on circuit board edges of boards or line areas edges of boards around circuit board or the plural line areas.
The weld pad place is through the corresponding probe and the electric connection of this weld pad that runs through circuit board one of in corresponding each weld pad of the common circuit of detection zone.
Be formed at each window on the common circuit and have that to be the internal diameter that increases progressively shape wide.
Form the detection zone probe and lie in the scope internal drilling of circuit board detecting district; And then perforation plating or filling conductive material formation to being drilled with.
Circuit board is a layer circuit board; On the interlayer circuit, be formed with a plurality of isodiametric windows that correspond respectively to the window of each probe and common circuit when forming detection zone.
Owing to the present invention includes the formation detection zone and detect detection zone electrical; Detection zone comprises the common circuit that is positioned at circuit board bottom surface, weld pad and most corresponding respectively each weld pad bottom probe to constitute electric connection and to run through circuit board that is positioned at that majority is positioned at board top surface at least; Being formed with plural number on the common circuit has different inner diameters and is aligned with each probe respectively so that common circuit and each probe are the window of the shape of opening a way; Detect detection zone electrically for using the side-play amount of judging the line areas of whether missing between line areas and weld pad to test electrically to detect between each weld pad.When skew appearred in the circuit of line areas, the common circuit of detection zone also can be offset.Therefore, whether the common circuit that only must detect detection zone is offset, and can understand the skew situation of each line areas circuit; Common stitch seam leans out line amount surpasses setting, make probe because of with common circuit on corresponding window offset and common line conduction, thereby make the corresponding corresponding weld pad short circuit of detection zone, can understand circuit board and surpass corresponding side-play amount, specifically to judge the side-play amount of circuit at the circuit of detection zone and relevant range thereof; So, the present invention can detect the side-play amount in circuit connection district accurately; Take up room very little by detection zone of the present invention, so thereby the edges of boards that detection zone can be arranged at around circuit board or the line areas can be deeply to each line areas, so accurately meet the requirements and undesirable line areas on the discrimination circuit plate, and then can effectively reduce cost, not only simplify processing procedure, degree of accuracy height, and reduce cost, thereby reach the purpose of this utility model.
Fig. 1, be the invention process position view.
Fig. 2, be the invention process position cut-open view.
Fig. 3, be the invention process position vertical view.
Fig. 4, be the invention process position upward view.
Fig. 5, for user mode synoptic diagram of the present invention.
Fig. 6, for the invention process position cut-open view (being used for multilayer circuit board).
Fig. 7, for the invention process position vertical view (being used for multilayer circuit board).
Fig. 8, for the invention process position upward view (being used for multilayer circuit board).
Fig. 9, for the invention process position Mezzanine Map (being used for multilayer circuit board).
Figure 10, be the circuit board plane synoptic diagram.
Figure 11, be known edges of boards sample enforcing location synoptic diagram.
Below in conjunction with accompanying drawing the present invention is further elaborated.
As shown in Figure 1, making on the circuit board of finishing 10 is the line areas 11 that is formed with plural number with matrix form.Be reserved with the edges of boards 101 of proper width around the circuit board 10, also be reserved with edges of boards 111 around each line areas 11.
The present invention lies in that the appropriate location is formed with at least one detection zone 20 on circuit board 10 and line areas 11 edges of boards 101,111, by whether the circuit that forms on each line areas 11 of detection zone 20 test is had shift phenomenon, and then judge that its side-play amount is whether in permissible range or occurred missing phenomenon.
As shown in Figure 2, detection zone 20 its comprise that at least the common circuit 26, the majority that are positioned at circuit board 10 bottom surfaces are positioned at the weld pad 21,22,23,24,25 of circuit board 10 end faces and most corresponding respectively each weld pad 21,22,23,24,25 bottom that are positioned to constitute the probe 201,202,203,204,205 that electrically connects and run through circuit board 10.
As shown in Figure 3, first weld pad 21 is rectangular, and it is to electrically connect by common circuit 26 formations of corresponding probe 201 with circuit board 10 bottom surfaces.All the other weld pads 22,23,24,25 are rounded.
As shown in Figure 4, be positioned at and be formed with plural number on the common circuit 26 of circuit board 10 bottom surfaces and be aligned with each probe 201 respectively, 202,203,204,205 and rounded window 262,263,264,265, rounded each window 262,263,264,265 and have a diameter that different being increases progressively shape, as each window 262,263,264,265 numerical value can be 14mm in regular turn, 16mm, 18mm and 20mm, it is to be aligned with each probe 202 with the concentric form respectively, 203,204,205, thereby except that probe 201, under normal conditions, common circuit 26 and probe 202,203,204,205 is to be the open circuit shape.
As shown in Figure 2, the generation type that runs through each probe 202,203,204,205 of circuit board 10 lies on the circuit board 10 and holes respectively on each appropriate location in detection zone 20 scopes; And then perforation plating or filling conductive material to being drilled with, to constitute each probe 201,202,203,204,205; Subsequently, form weld pad 21,22,23,24,25 and common circuit 26 respectively in circuit board 10 tops, bottom surface again.Detection zone 20 is to carry out synchronously with All other routes district 11 on the circuit board 10.
Class is moved according to this, when each line areas 11 side-play amount during respectively greater than 6mm, 7mm and 8mm, will be respectively constitutes short circuit at weld pad 21 and 23 of weld pads, weld pad 21 and 24 of weld pads and weld pad 21 and 25 of weld pads.As shown in Figure 5, when the stitch seam leans out line amount surpassed 6mm above 5mm, weld pad 22 constituted short circuits through probe 202, common circuit 26 and probe 201 and weld pad 21, but 23,24 of weld pads do not constitute short circuits with weld pad 21, so can specifically judge the side-play amount of circuit.
As described above, can find out that the present invention can detect the side-play amount of line areas 11 on the circuit board 10 accurately; Very little by taking up room for the detection zone 20 of detecting usefulness among the present invention, thus on the position of implementing, be not limited to circuit board 10 edges of boards 101 on every side, and can extend to the edges of boards 111 around each line areas 11; Because the detecting point no longer is confined to the diagonal position of circuit board 10, and can be deeply to each line areas 11, so can judge circuit side-play amount on the circuit board 10 accurately in permissible range or exceed zone beyond the permissible range, so that keep still spendable line areas 11, and then can effectively reduce cost.
As Fig. 6, Fig. 7, Fig. 8, shown in Figure 9, the present invention also can apply to the edges of boards sample of multilayer circuit board, circuit board 10a is a multilayer circuit board, its inside is formed with interlayer circuit 12 in the position of corresponding detection zone 20a, interlayer circuit 12 is the common circuit 26a corresponding to circuit board 10a bottom surface, be formed with a plurality of isodiametric windows 120 on the interlayer circuit 12, each window 120 is window 262a, 263a, 264a, the 265a that corresponds respectively to each probe 201a, 202a, 203a, 204a, 205a and common circuit 26a.
Found out that by above-mentioned concrete technological means of the present invention, principle features and design possess following advantage at least:
1, implementation method is simplified: the method for detecting of missing of the present invention lies in simultaneously formation inspection in the circuit board process Survey district's circuit, utilize detection zone circuit and line areas to have the characteristic of same quality, be able to need not cut and The detecting of completing circuit plate under the prerequisite of the complicated steps such as grinding.
2, the detecting result is more accurate: because the present invention is little at the detection zone area that circuit board forms, so Can be formed on circuit board and the upper line areas edges of boards on every side thereof, owing to detect the position deeply to line areas, so Meet the requirements on the discrimination circuit plate and undesirable line areas in detail, can use and avoid eliminating still Line areas.
3, reduce cost: because the present invention can avoid the discarded circuit board that still can use, so can effectively reduce system Cause this.
Claims (6)
1, a kind of detection method of missing curcuit board wire, it comprises when making circuit board that thereon the appropriate location forms at least one detection zone simultaneously with line unit and the detection detection zone is electrical; It is characterized in that the described detection zone that is formed on the circuit board comprises the common circuit that is positioned at circuit board bottom surface, weld pad and most corresponding respectively each weld pad bottom probe to constitute electric connection and to run through circuit board that is positioned at that majority is positioned at board top surface at least; Being formed with plural number on the common circuit has different inner diameters and is aligned with each probe respectively so that common circuit and each probe are the window of the shape of opening a way; Detect detection zone electrically for using the side-play amount of judging the line areas of whether missing between line areas and weld pad to test electrically to detect between each weld pad.
2, the detection method of missing curcuit board wire according to claim 1 is characterized in that described detection zone can be arranged to reserve on circuit board edges of boards or line areas edges of boards around circuit board or the plural line areas.
3, the detection method of missing curcuit board wire according to claim 1 and 2 one of is characterized in that in corresponding each weld pad of the common circuit of described detection zone that the weld pad place is through the corresponding probe and the electric connection of this weld pad that runs through circuit board.
4, the detection method of missing curcuit board wire according to claim 1 and 2 is characterized in that described each window that is formed on the common circuit has that to be the internal diameter that increases progressively shape wide.
5, the detection method of missing curcuit board wire according to claim 3 is characterized in that described formation detection zone probe lies in the scope internal drilling of circuit board detecting district; And then perforation plating or filling conductive material formation to being drilled with.
6, the detection method of missing curcuit board wire according to claim 1 is characterized in that described circuit board is a layer circuit board; On the interlayer circuit, be formed with a plurality of isodiametric windows that correspond respectively to the window of each probe and common circuit when forming detection zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01129268A CN1392418A (en) | 2001-06-19 | 2001-06-19 | Detection method of circuit board line leakage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN01129268A CN1392418A (en) | 2001-06-19 | 2001-06-19 | Detection method of circuit board line leakage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1392418A true CN1392418A (en) | 2003-01-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN01129268A Pending CN1392418A (en) | 2001-06-19 | 2001-06-19 | Detection method of circuit board line leakage |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1392418A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8106946B2 (en) | 2006-06-23 | 2012-01-31 | Chimei Innolux Corporation | Circuitry testing method and circuitry testing device |
| CN102480852A (en) * | 2010-11-22 | 2012-05-30 | 富葵精密组件(深圳)有限公司 | How to make a circuit board |
| CN103533748A (en) * | 2013-10-17 | 2014-01-22 | 东莞市五株电子科技有限公司 | Laser alignment testing structure and method for high-density interconnected printed circuit board |
| CN103841763A (en) * | 2013-04-08 | 2014-06-04 | 胜宏科技（惠州）股份有限公司 | Method for testing PCB carbon oil skipping |
| CN105675223A (en) * | 2016-01-18 | 2016-06-15 | 伟创力制造（珠海）有限公司 | Fluorescence leak detection method |
| CN108572307A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of multi-layer H DI printed circuits board blind hole inspection method |
-
2001
- 2001-06-19 CN CN01129268A patent/CN1392418A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8106946B2 (en) | 2006-06-23 | 2012-01-31 | Chimei Innolux Corporation | Circuitry testing method and circuitry testing device |
| CN102480852A (en) * | 2010-11-22 | 2012-05-30 | 富葵精密组件(深圳)有限公司 | How to make a circuit board |
| CN102480852B (en) * | 2010-11-22 | 2014-02-05 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit boards |
| CN103841763A (en) * | 2013-04-08 | 2014-06-04 | 胜宏科技（惠州）股份有限公司 | Method for testing PCB carbon oil skipping |
| CN103841763B (en) * | 2013-04-08 | 2017-02-01 | 胜宏科技（惠州）股份有限公司 | Method for testing PCB carbon oil skipping |
| CN103533748A (en) * | 2013-10-17 | 2014-01-22 | 东莞市五株电子科技有限公司 | Laser alignment testing structure and method for high-density interconnected printed circuit board |
| CN105675223A (en) * | 2016-01-18 | 2016-06-15 | 伟创力制造（珠海）有限公司 | Fluorescence leak detection method |
| CN105675223B (en) * | 2016-01-18 | 2019-02-26 | 伟创力制造（珠海）有限公司 | A kind of fluoroscopic leak test method |
| CN108572307A (en) * | 2017-03-07 | 2018-09-25 | 惠州中京电子科技有限公司 | A kind of multi-layer H DI printed circuits board blind hole inspection method |
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