CN1387246A - Voltage measurement method, electrical test method and device, semiconductor device manufacturing method, and device substrate manufacturing method - Google Patents

Abstract

The present invention provides a simple test method without using a probe at an interconnection point, and a test apparatus using the test method. A primary coil possessed by a test substrate and a secondary coil possessed by an OLED panel are overlapped together with a fixed interval. An alternating current signal is input to the primary coil, and an electromotive force is generated on the secondary coil by utilizing electromagnetic induction. This electromotive force is used to operate the pixels possessed by the OLED panel. A pixel electrode and a test electrode are overlapped with a fixed interval. The fault point is detected by monitoring the alternating voltage generated on the test electrode. It is also possible to confirm the operation state of each pixel by monitoring the alternating voltage generated on the test electrode while changing the position of the test electrode.

Description

Voltage measurement method, electrical test method and apparatus, semiconductor device manufacturing method, and device substrate manufacturing method

technical field

The present invention relates to a voltage measuring method for reading the voltage value applied to a pixel electrode by operating each pixel possessed by a semiconductor device, and also relates to a method for testing whether a pixel area works normally by using the voltage measuring method method. The invention particularly relates to a non-contact voltage measuring method and an electrical testing method, and a non-contact electrical testing device using the method. The present invention also relates to a method for manufacturing a semiconductor device, including a test program using the test method, and to a semiconductor device manufactured by the method for manufacturing a semiconductor device. The invention also relates to a method of manufacturing a device substrate, which includes a test program using the test method.

The invention also relates to a method of measuring voltage in an OLED panel having an organic light-emitting device (OLED) sealed between a substrate and a cover member, the pixels being manipulated prior to forming the OLED, which can be used to read out applied The voltage value on the pixel electrode also relates to the method of testing whether the pixel area works normally by using the voltage measurement method. The invention particularly relates to a non-contact electrical testing method and a non-contact electrical testing device using the method.

An OLED panel mounted with ICs and the like and including a controller is referred to as an OLED module in the specification. At the same time, the OLED panel and the OLED module are collectively referred to as a light emitting device.

current technology

In recent years, the technology of forming TFTs on one substrate has made great progress. Developments have progressed to the point where they can be applied to active matrix electronic displays. In particular, a TFT using a polysilicon thin film has higher field effect mobility (also called mobility) than a TFT using an amorphous silicon thin film, and thus can operate at a high speed. Therefore, the control of the pixels, which is usually performed by a driver circuit provided outside the substrate, can be performed by a control circuit formed on the same substrate as the pixels.

Such active-matrix electronic displays have many advantages and values, including the fabrication of various circuits and components on the same substrate to reduce manufacturing costs, reduce the size of electronic displays, increase yields, and save production capacity.

Among electronic displays, research on active matrix light emitting devices having OLED light emitting elements has been actively advanced.

Naturally emitting OLEDs are high-definition, ideally thin because they don't require the backlight required in liquid crystal displays (LCDs), and have unlimited viewing angles. Therefore, the use of OLED light-emitting devices as display devices to replace CRTs and LCDs has attracted people's attention.

An OLED has a layer containing an organic compound (organic light-emitting material) (hereinafter referred to as an organic light-emitting layer), and electroluminescence can be obtained by applying a cell, an anode layer, and a cathode layer. In the specification, each layer provided between an anode and a cathode of an OLED is defined as an organic light-emitting layer. The organic light-emitting layer specifically includes a light-emitting layer, a hole injection layer, an electron injection layer, a hole transport layer, and an electron transport layer. The electroluminescence of organic compounds includes luminescence (fluorescence) when returning from a single-level excited state to a grounded state and luminescence (phosphorescence) when returning from a tertiary excited state to a grounded state.

The organic light-emitting layer deteriorates at an accelerated rate due to heat, light, moisture and oxygen, etc. According to the manufacturing process, when manufacturing an active matrix light-emitting device, OLEDs are often formed after interconnections and TFTs are formed at a relatively high processing temperature in a pixel region.

After forming the OLED, a substrate having the OLED (OLED panel) and a cover member is bonded together in such a way that the OLED is not exposed to the outside air, and then can be sealed (encapsulated) with a sealing member.

After strengthening the sealing from the outside world through packaging and other processes, a connector (FPC, TAB, etc.) is connected to connect between the terminal protruding from the component or circuit formed on the substrate and an external signal terminal. . Thus, an active matrix light emitting device was fabricated.

In this active matrix light emitting device, voltage applied from a pair of electrodes of an OLED to an organic light emitting layer is controlled by a TFT provided on each pixel. Therefore, if some kind of problem (failure point) occurs at one point, the TFT possessed by the pixel area will not function as a switching element to cut off or short-circuit the mutual connection, and a predetermined voltage cannot be applied to the TFT possessed by the OLED. on the organic light-emitting layer. In this case, the pixels cannot be displayed with the desired tone level.

In the active matrix liquid crystal display that has been put into mass production before this active matrix light-emitting device, the interconnection and TFT are formed in a pixel area before completing a liquid crystal display, and the liquid crystal is filled in the area with a pixel area. Between the panel (liquid crystal panel) and the substrate with a counter electrode. Charge is then stored on a capacitor owned by each pixel. Testing is performed by measuring the amount of charge on a pixel-by-pixel basis to determine the presence or absence of defects in that pixel area.

However, in many cases, such a light emitting device has more than two TFTs on each pixel. Sometimes an electrode (pixel electrode) of an OLED and a capacitor are connected together through a TFT. In this case, even by measuring the amount of charge stored on the capacitor, it is difficult to test the interconnection between the capacitor and the pixel electrode and all TFTs for defects.

Meanwhile, if the electrical operation is tested before the OLED panel is connected to the connector, a kind of precision plug (probe) is required on the terminals or interconnection points of the OLED panel to allow current to flow or apply voltage. However, using a probe directly on an interconnection point or terminal may cause cracks on the interconnection point or terminal to generate fine dust. Dust generated during the testing step adversely causes a reduction in the yield of subsequent processing.

It is possible to determine the absence of defects in actual displays manufactured from completed light emitting devices. However, even for an OLED panel that has not actually been formed into a product, in order to distinguish it from ordinary products, it is still necessary to complete a light emitting device by forming an OLED, packaging, and connecting a connector. In the case of defective OLED panels, it is impossible to save time and cost because waste has been created in OLED forming steps, packaging steps and connector connecting steps. At the same time, if a substrate that can be divided multiple times is used to form an OLED panel, the steps of packaging and connecting connectors are a waste, and it is also impossible to save time and cost.

At the problems referred to above, the task of the present invention is to provide a kind of electrical testing method (hereinafter only referred to as testing method), it can confirm whether there is defect on the interconnection point of a pixel area or TFT before completing a light-emitting device, is conducive to Mass production of active matrix light-emitting devices, and an electrical testing device using the testing method (hereinafter simply referred to as testing device). A further task is to provide a simple testing method in the manufacturing process of a light-emitting device, which does not require the use of probes on interconnection points or terminals, and to provide a testing device using the testing method. A further task is to provide a method of manufacturing a semiconductor device with this electrical testing method, and a semiconductor device manufactured with this manufacturing method.

The present inventors considered using electromagnetic induction to apply a voltage to an interconnection point possessed by a pixel region of a substrate (hereinafter referred to as a device substrate) forming a TFT and a pixel electrode without contact, without using probes thereon. . Each pixel is operated by applying a voltage to the interconnection point to apply a voltage to the pixel electrode.

In the specification, to operate a pixel means to apply a voltage to the elements or interconnections possessed by the pixel, that is, to control the voltage on the electrode of the pixel.

The voltage value applied to the pixel electrode is read out without contact by electrostatic induction. The operation state and normal/abnormality of each pixel can be determined based on the read value, in other words, whether each pixel operates normally or not. In the specification, a pixel whose pixel electrode can be normally supplied with a voltage is determined to be normal. Conversely, a pixel whose pixel electrode cannot be normally supplied with a voltage is determined to be abnormal.

Specifically, it includes the following two schemes, one of which can be adopted.

According to the first solution, a test substrate is separately prepared for testing the device substrate. The test substrate has a primary coil, and the device substrate as a test object has a secondary coil.

Each of the primary and secondary coils can be formed by patterning a conductive thin film formed on a substrate. According to the present invention, a magnetic circuit is provided by using a coil without a magnetic member at the center of the primary and secondary coils instead of a coil with a magnetic member at the center.

The primary coil possessed by the test substrate and the secondary coil possessed by the device substrate are overlapped at a fixed interval. Applying an AC voltage across the two terminals of the primary coil creates an electromagnetic force between the two terminals of the secondary coil.

Ideally the interval should be small. As long as the spacing is controllable, the primary and secondary coils should be as close as possible.

In the specification, voltage is applied to a coil means that voltage is applied between two terminals of the coil. In the specification, a signal is applied to a coil means that the signal is applied between two terminals possessed by the coil.

The AC voltage caused by the electromagnetic force on the secondary coil is rectified on the device substrate and then smoothed. It is used as a DC voltage to operate a driving circuit or a pixel possessed by a device substrate (hereinafter referred to as a power supply voltage). At the same time, the waveform of the AC voltage generated by the electromotive force on the secondary coil is shaped into an ideal waveform by a waveform shaping circuit. This signal voltage is used to operate a driving circuit or a pixel possessed by the device substrate (hereinafter referred to as a driving signal). The AC voltage generated on the secondary coil can be used as a drive signal whose waveform has not been shaped in the waveform shaping circuit.

The generated driving signal voltage or power supply voltage is supplied to a driving circuit or a pixel formed on a device substrate. The supplied drive signal voltage or power supply voltage causes the drive circuit or pixel to perform certain actions.

The value of the driving signal voltage or the power supply voltage is determined. When the driving circuit or the pixel is normal, the voltage applied to the pixel electrode owned by the pixel is a given AC voltage.

As long as a driving signal voltage or power supply voltage is provided, the voltage value applied to the pixel electrode will be affected, depending on the working state of the driving circuit or pixel.

A driving signal voltage or a power supply voltage may be supplied only to pixels formed on a device substrate. In this case, as long as a driving signal voltage or a power supply voltage is provided, the voltage value applied to the pixel electrode will be affected, depending on the working state of the pixel.

The electrode (test electrode) for non-contact reading of the voltage generated on the pixel electrode is superimposed on the pixel electrode with a fixed interval. This interval should be small. As long as the spacing can be controlled, the pixel electrode and the test electrode should be as close as possible. The test substrate can have a test electrode.

The voltage generated by electrostatic induction on the test electrode is affected by the voltage value applied to the pixel electrode. In this way, the voltage applied to the pixel electrode can be calculated from the voltage generated on the test electrode. Therefore, the value of the voltage applied to the pixel electrode can be read without contact. In addition, the working state of a pixel can also be grasped by using the voltage generated on the test electrode. This makes it possible to confirm its operating status and determine normal/abnormal.

According to the second scheme, a test substrate (the first test substrate) is prepared separately, a voltage is applied to the interconnection points owned by the pixel region of the device substrate without contact, and a test substrate (the second test substrate) is also provided. Test substrate), which uses electrostatic induction to read out the voltage value applied to the pixel electrode without contact.

The first test substrate has a primary coil, and the device substrate to be tested has a secondary coil.

The respective primary and secondary coils can be formed by patterning a conductive film formed on an insulating film. According to the present invention, a magnetic circuit is provided by using a coil without a magnetic member in the center of the primary and secondary coils instead of a coil with a magnetic member in the center.

The primary coils possessed by the first test substrate and the secondary coils possessed by the device substrate are overlapped at a fixed interval. Applying an AC voltage to the two terminals of the primary coil generates an electromotive force between the two terminals of the secondary coil.

The interval should be small. As long as the spacing is controllable, the primary and secondary coils should be as close as possible.

In the specification, voltage is applied to a coil means that voltage is applied between two terminals of the coil. In the specification, a signal is applied to a coil means that the signal is applied between two terminals possessed by the coil.

The AC voltage caused by the electromagnetic force on the secondary coil is rectified on the device substrate and then smoothed. It is used as a DC voltage to operate the drive circuits or pixels possessed by the device substrate. At the same time, the waveform of the AC voltage generated by the electromotive force on the secondary coil is shaped into an ideal waveform by a waveform shaping circuit. It is used as a driving signal with a certain voltage to operate the driving circuit or pixel possessed by the device substrate. The AC voltage generated on the secondary coil can be used as a drive signal whose waveform has not been shaped in the waveform shaping circuit.

The generated driving signal voltage or power supply voltage is supplied to a driving circuit or a pixel formed on a device substrate. The supplied drive signal voltage or power supply voltage causes the drive circuit or pixel to perform certain actions.

The value of the driving signal voltage or the power supply voltage is determined. When the driving circuit or the pixel is normal, the voltage applied to the pixel electrode owned by the pixel is a given AC voltage.

As long as a driving signal voltage or power supply voltage is provided, the voltage value applied to the pixel electrode will be affected, depending on the working state of the driving circuit or pixel.

A driving signal voltage or a power supply voltage may be supplied only to pixels possessed by the device substrate. In this case, as long as a driving signal voltage or a power supply voltage is provided, the voltage value applied to the pixel electrode will be affected, depending on the working state of the pixel.

On the other hand, the second test substrate has an electrode (test electrode) for reading out the voltage generated on the pixel electrode without contact. The test electrodes overlap the pixel electrodes with a fixed interval. This interval should be small. As long as the spacing can be controlled, the pixel electrode and the test electrode should be as close as possible.

This active matrix semiconductor device has a plurality of pixel electrodes arranged in a matrix in a pixel region. According to the present invention, by changing the position of the second test substrate relative to the device substrate, the position of one or more pixel electrodes overlapping a test electrode can be changed multiple times. Specifically, if the test electrode is rotated in a plane parallel to the device substrate, the position of the pixel electrode overlapping the test electrode can be changed. One voltage value generated on the test electrode is monitored at a time.

The voltage generated by electrostatic induction on the test electrode can be used as the information of the respective states of the pixels, and will be affected by the voltage value applied to the pixel electrode overlapping with the test electrode.

The voltage value generated on the test electrode obtained through multiple monitoring, and the position data of one or more pixel electrodes overlapping with the test electrode during monitoring are stored. If a two-dimensional distribution is recovered from the one-dimensional data by using a recovery algorithm (for example, Fourier transform method) using CT (computed tomography), the relative value of the voltage applied to the pixel can be obtained according to the stored data. That is, it is naturally considered that it is possible to read out the voltage value applied to the pixel electrode without contact. From the relative values of the voltages applied to the pixels it is possible to determine the operating state of each pixel. Normal/abnormal can be determined according to the working status.

Representative restoration algorithms include a Fourier transform method using continuous approximation and projection section rules, and an overlap-integration method. The present invention can also use recovery algorithms other than those described above.

It should be noted that, in the first or second solution, the working status of the pixels can be screened into multiple levels according to the working status, instead of always selecting according to normal and abnormal.

Meanwhile, according to the first or second scheme, if the driving circuit is defective but the pixel is not defective, the voltage value applied to the pixel electrode is changed. This also makes it possible to determine the normality/abnormality of the drive circuit.

In the semiconductor device employing the test method of the present invention, the transistors used in the pixels may be transistors formed using single crystal silicon, or thin film transistors using polycrystalline silicon or amorphous silicon. Alternatively, a transistor using an organic semiconductor may be used.

It is possible for a developer to correctly determine the criteria for a pixel to be considered malfunctioning based on the degree to which the pixel's operating state differs from normal pixel operating state.

The present invention can determine defect points and determine the normal/abnormality of a pixel by adopting the above structure, without directly using probes on interconnection points. This avoids a reduction in throughput due to fine dust caused by the use of probes in subsequent processing. In addition, since normality/abnormality can be determined with one test step in each pattern forming step, the test step can be simplified.

The present invention can be applied not only to light-emitting devices, but also to liquid crystal displays or other semiconductor devices.

The structure of the present invention will be explained below.

The present invention relates to a method of measuring voltage comprising:

applying a voltage without contact to an interconnect or circuit element possessed by a pixel, thereby applying a voltage to a pixel electrode possessed by the pixel; and

The voltage applied to the pixel electrode is read out without contact.

The present invention relates to a method of measuring voltage comprising:

applying a voltage to respective interconnection points or circuit elements of the plurality of pixels without contact, thereby applying the voltage to respective pixel electrodes of the pixels; and

The sum of the voltages applied to the pixel electrodes owned by each pixel is read without contact.

The present invention relates to a method of measuring voltage comprising:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil with a fixed interval;

applying a third alternating voltage to a pixel electrode owned by a pixel by using a second alternating voltage generated between two terminals owned by the second coil;

overlapping the pixel electrode and the test electrode by a fixed interval; and

The voltage applied to the pixel electrode is calculated based on the fourth AC voltage generated on the test electrode.

The present invention relates to a method of measuring voltage comprising:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil with a fixed interval;

performing rectification or wave shaping on a second alternating voltage generated between two terminals possessed by the second coil and applying it to an interconnection point or circuit element possessed by a pixel such that the pixel possesses Applying a third AC voltage to the pixel electrode;

overlapping the pixel electrode and the test electrode by a fixed interval; and

The voltage applied to the pixel electrode is calculated based on the fourth AC voltage generated on the test electrode.

The present invention relates to a method of measuring voltage comprising:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil with a fixed interval;

applying a third alternating voltage to pixel electrodes each of the plurality of pixels possesses by using a second alternating voltage generated between two terminals possessed by the second coil;

overlapping the pixel electrodes and test electrodes possessed by these pixels by a fixed interval; and

The sum of the voltages applied to the respective pixel electrodes of each pixel is calculated according to the fourth AC voltage generated on the test electrodes.

The present invention relates to a method of measuring voltage comprising:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil with a fixed interval;

rectifying or wave-shaping a second alternating voltage generated between two terminals possessed by the second coil, and applying it to an interconnection point or a circuit element respectively possessed by a plurality of pixels, thereby individually Applying a third AC voltage to the pixel electrode possessed;

Overlapping the pixel electrode and the test electrode respectively owned by each pixel by a fixed interval; and

The sum of the voltages applied to the respective pixel electrodes of each pixel is calculated based on the fourth AC voltage generated on the test electrode.

According to the present invention, the first coil and the second coil may have interconnection points formed on the same plane, and each interconnection point takes a spiral shape.

According to the present invention, the first coil and the test electrode may be formed on the first insulating surface.

The second coil and the pixel electrodes are formed on the second insulating surface.

According to the present invention, the space between the first insulating surface and the second insulating surface can be controlled by the fluid flowing between the first insulating surface and the second insulating surface.

According to the present invention, normality/abnormality of a pixel can be determined using the voltage applied to the pixel electrode or the sum of the voltages obtained by this voltage measuring method.

The present invention relates to an apparatus for performing electrical testing on pixels possessed by semiconductor devices, the electrical testing apparatus comprising:

Primary coil;

A device that overlaps a primary coil and a secondary coil possessed by a semiconductor device at a fixed interval;

A device for overlapping a pixel electrode owned by a pixel with a test electrode at a fixed interval;

means for applying an alternating voltage between two terminals possessed by the primary coil; and

A device for confirming the working state of the pixel based on the alternating voltage generated on the test electrode.

The present invention relates to an apparatus for performing electrical testing on pixels possessed by semiconductor devices, the electrical testing apparatus comprising:

Primary coil;

A device that overlaps a primary coil and a secondary coil possessed by a semiconductor device at a fixed interval;

A device for overlapping a pixel electrode owned by a pixel with a test electrode at a fixed interval;

means for applying an alternating voltage between two terminals possessed by the primary coil; and

A device for confirming the working state of the pixel according to the alternating voltage generated on the test electrode;

The alternating voltage generated on the test electrode has information on the operating state of the pixel.

According to the present invention, the spacing between the first coil and the second coil can be controlled by the fluid flowing between the first coil and the second coil.

According to the present invention, the first coil may have interconnection points formed on the same plane, and the interconnection points take a spiral shape.

The present invention relates to a kind of manufacturing method of semiconductor device, this method comprises:

forming a pixel electrode and an interconnect or circuit element;

applying a voltage to the interconnection point or circuit element without contact, thereby applying the voltage to the pixel electrode; and

The voltage applied to the pixel electrodes is read out without contact.

The present invention relates to a kind of manufacturing method of semiconductor device, this method comprises:

forming a pixel electrode, an interconnect or circuit element, the first coil, and the second coil;

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil with a fixed interval;

applying a third alternating voltage to the pixel electrode by using a second alternating voltage generated between two terminals owned by the second coil;

overlapping the pixel electrode and a test electrode by a fixed interval; and

The voltage applied to the pixel electrode is calculated based on the fourth AC voltage generated on the test electrode.

The present invention relates to a kind of manufacturing method of semiconductor device, this method comprises:

forming a pixel electrode, an interconnect or circuit element, the first coil, and the second coil;

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil with a fixed interval;

rectifying or wave-shaping a second alternating voltage generated between two terminals possessed by the second coil, and applying it to an interconnection point or circuit element, thereby applying a third alternating voltage to the pixel electrode;

overlapping the pixel electrode and a test electrode by a fixed interval; and

The voltage applied to the pixel electrode is calculated based on the fourth AC voltage generated on the test electrode.

The invention relates to a method of measuring voltage, the method comprising:

Applying a voltage to an interconnect or circuit element controls the voltage applied to multiple pixel electrodes;

moving a test electrode in a state overlapping any part or all of the pixel electrodes by a fixed interval; and

The voltage applied to each pixel electrode is calculated according to the voltage on the test electrode and the position of the test electrode relative to the pixel electrode.

The invention relates to a method of measuring voltage, the method comprising:

Applying a voltage to an interconnection point or circuit element without contact to control the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state overlapping any part or all of the pixel electrodes by a fixed interval; and

The voltage applied to each pixel electrode is calculated according to the voltage on the test electrode and the position of the test electrode relative to the pixel electrode.

The invention relates to a method of measuring voltage, the method comprising:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil with a fixed interval;

applying a second alternating voltage generated between two terminals of the second coil to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state overlapping any part or all of the pixel electrodes by a fixed interval; and

The voltage applied to each pixel electrode is calculated according to the third AC voltage generated on the test electrode and the position of the test electrode relative to the pixel electrode.

The invention relates to a method of measuring voltage, the method comprising:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil by a gap;

rectifying or wave-shaping an alternating voltage generated between two terminals possessed by the second coil and applying it to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

The voltage applied to each pixel electrode is calculated according to the third AC voltage generated on the test electrode and the position of the test electrode relative to the pixel electrode.

According to the present invention, the first coil and the second coil may have interconnection points formed on the same plane, and the interconnection points take a spiral shape.

According to the present invention, the spacing between the first coil and the second coil can be controlled by a fluid flowing between the first coil and the second coil.

According to the present invention, the Fourier transform method can be used to calculate the voltage on each pixel electrode by continuous approximation and projection segmentation rule or an overlapping integral method.

The present invention relates to a kind of electric testing method, this method comprises:

Applying a voltage to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

The operational status of interconnect points or circuit elements is confirmed based on the voltage on the test electrode and the position of the test electrode relative to the pixel electrode.

The present invention relates to a kind of electric testing method, this method comprises:

Applying a voltage without contact to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

The operational status of interconnect points or circuit elements is confirmed based on the voltage on the test electrode and the position of the test electrode relative to the pixel electrode.

The present invention relates to a kind of electric testing method, this method comprises:

Applying a voltage to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

The distribution of the voltage applied to the pixel electrode is determined based on the voltage on the test electrode and the position of the test electrode relative to the pixel electrode.

The present invention relates to a kind of electric testing method, this method comprises:

Applying a voltage without contact to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

The distribution of the voltage applied to the pixel electrode is determined based on the voltage on the test electrode and the position of the test electrode relative to the pixel electrode.

The present invention relates to a kind of electric testing method, this method comprises:

Applying a voltage to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state overlapping with any part or all of the pixel electrodes through a gap;

determining the distribution of the voltage applied to the pixel electrode based on the voltage on the test electrode and the position of the test electrode relative to the pixel electrode; and

Determine the operating state of interconnect points or circuit elements based on voltage distributions.

The present invention relates to a kind of electric testing method, this method comprises:

Applying a voltage without contact to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state overlapping with any part or all of the pixel electrodes through a gap;

determining the distribution of the voltage applied to the pixel electrode based on the voltage on the test electrode and the position of the test electrode relative to the pixel electrode; and

Determine the operating state of interconnect points or circuit elements based on voltage distributions.

The present invention relates to a kind of electric testing method, this method comprises:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil by a gap;

applying a second alternating voltage generated between two terminals possessed by the second coil to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

The operation state of the interconnection points or circuit elements is confirmed based on the third AC voltage generated on the test electrode and the position of the test electrode relative to the pixel electrode.

The present invention relates to a kind of electric testing method, this method comprises:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil by a gap;

applying a second alternating voltage generated between two terminals possessed by the second coil to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes;

moving a test electrode in a state overlapping with any part or all of the pixel electrodes through a gap;

determining the distribution of the voltage applied to the pixel electrode based on the third alternating voltage generated on the test electrode and the position of the test electrode relative to the pixel electrode; and

Confirm the operation of interconnection points or circuit elements based on voltage distribution.

The present invention relates to a kind of electric testing method, this method comprises:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil by a gap;

Rectifying or wave-shaping the second AC voltage generated between the two terminals owned by the second coil and applying it to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes Voltage;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

The operation state of the interconnection points or circuit elements is confirmed based on the third AC voltage generated on the test electrode and the position of the test electrode relative to the pixel electrode.

The present invention relates to a kind of electric testing method, this method comprises:

applying a first alternating voltage between two terminals possessed by the first coil;

overlapping the first coil and the second coil by a gap;

Rectifying or wave-shaping the second AC voltage generated between the two terminals owned by the second coil and applying it to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes Voltage;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

determining the distribution of the voltage applied to the pixel electrode based on the third alternating voltage generated on the test electrode and the position of the test electrode relative to the pixel electrode; and

Confirm the operation of interconnection points or circuit elements based on voltage distribution.

According to the present invention, the first coil and the second coil may have interconnection points formed on the same plane, and the interconnection points take a spiral shape.

According to the present invention, the spacing between the first coil and the second coil can be controlled by a fluid flowing between the primary coil and the secondary coil.

The present invention relates to a kind of device that carries out electric test to a plurality of pixels that a device substrate has, and this electric test device comprises:

Primary coil;

A device that overlaps the primary coil and the secondary coil possessed by the device substrate through a gap;

A device for overlapping any part or all of the pixel electrodes owned by each pixel with a test electrode through a gap;

means for changing the position of the test electrode relative to the pixel electrode possessed by each pixel;

means for applying an alternating voltage between two terminals possessed by the primary coil; and

A device for confirming the working status of each pixel based on the AC voltage generated on the test electrode.

The present invention relates to a kind of device that carries out electric test to a plurality of pixels that a device substrate has, and this electric test device comprises:

Primary coil;

Means for overlapping the primary coil and the secondary coil possessed by the device substrate through a gap;

A device for changing the position of the test electrode relative to the pixel electrode owned by each pixel in a state where any part or all of the pixel electrodes owned by each pixel overlap with a test electrode through a gap;

means for applying an alternating voltage between two terminals possessed by the primary coil; and

A device for confirming the working status of each pixel based on the AC voltage generated on the test electrode.

According to the present invention, the spacing between the first coil and the second coil can be controlled by a fluid flowing between the primary coil and the secondary coil.

According to the present invention, the first coil may have interconnection points formed on the same plane, and the interconnection points take a spiral shape.

The present invention relates to a method of manufacturing a semiconductor device, the method comprising:

forming an interconnection point or circuit element, and a pixel electrode capable of supplying a voltage through the interconnection point or circuit element;

Apply a voltage to an interconnection point or circuit element;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

According to the voltage on the test electrode and the position of the test electrode relative to the pixel electrode, the voltage applied to the pixel electrode owned by each pixel due to the voltage applied to each pixel electrode is calculated.

The present invention relates to a method of manufacturing a semiconductor device, the method comprising:

forming an interconnection point or circuit element, and a pixel electrode capable of supplying a voltage through the interconnection point or circuit element;

apply a voltage to interconnection points or circuit elements without contact;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

According to the voltage on the test electrode and the position of the test electrode relative to the pixel electrode, the voltage applied to the pixel electrode owned by each pixel due to the voltage applied to each pixel electrode is calculated.

The present invention relates to a method of manufacturing a device substrate, the method comprising:

forming an interconnection point or circuit element, and a pixel electrode capable of supplying a voltage through the interconnection point or circuit element;

Apply a voltage to an interconnection point or circuit element;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

According to the voltage on the test electrode and the position of the test electrode relative to the pixel electrode, the voltage applied to the pixel electrode owned by each pixel due to the voltage applied to each pixel electrode is calculated.

The present invention relates to a method of manufacturing a device substrate, the method comprising:

forming an interconnection point or circuit element, and a pixel electrode capable of supplying a voltage through the interconnection point or circuit element;

apply a voltage to interconnection points or circuit elements without contact;

moving a test electrode in a state of overlapping any part or all of the pixel electrodes through a gap; and

According to the voltage on the test electrode and the position of the test electrode relative to the pixel electrode, the voltage applied to the pixel electrode owned by each pixel due to the voltage applied to each pixel electrode is calculated.

Brief introduction to the drawings

Figure 1 is a top view of a test substrate of the present invention;

Figure 2 is a top view of a device substrate of the present invention;

Figure 3 is a block diagram of a test substrate and a device substrate of the present invention;

4A and 4B are enlarged views of coils of the present invention;

Figure 5 is a perspective view of a test substrate and a device substrate of the present invention during testing;

6A and 6B are enlarged views of overlapping coils and overlapping pixel electrodes and test electrodes respectively in the present invention;

7 is a circuit diagram of a test substrate and a substrate of the present invention during testing;

8A and 8B are top views of test substrates of the present invention;

Figure 9 is a block diagram of the test substrate and device substrate of the present invention;

Figure 10 is a perspective view of the test substrate and device substrate of the present invention during testing;

The schematic diagrams of Fig. 11A and 11B represent the overlap mode when rotating the test electrode between the test electrode and the pixel electrode of the present invention;

The schematic diagram of Fig. 12 shows the overlap mode between the pixel electrode owned by a faulty pixel and the test electrode of the present invention;

The block diagram of Fig. 13 represents the structure of the testing device of embodiment 1;

The block diagram of Fig. 14 represents the structure of the testing device of embodiment 2;

Fig. 15 is the circuit diagram of the signal processing circuit of embodiment 3;

Fig. 16 is the circuit diagram of the signal processing circuit of embodiment 4;

Fig. 17 is the circuit diagram of the waveform shaping circuit of embodiment 5;

Fig. 18 is the circuit diagram of a rectification circuit of embodiment 6;

19A and 19B represent the pulse signal obtained by the rectification of the alternating current of embodiment 6 over time;

Figures 20A and 21B represent the variation with time of the DC signal generated by the increased pulses together with Example 6;

21A-21C are circuit diagrams of the rectifier circuit of Embodiment 6;

22 is a block diagram of an OLED panel of the light emitting device of Embodiment 7;

Fig. 23 is the top view of a kind of large-scale substrate of embodiment 8;

Fig. 24 is the top view of a kind of large-scale substrate of embodiment 8;

The flow chart of Fig. 25 represents the flow process of the test step of embodiment 9;

26A-26D are top and cross-sectional views, respectively, of the coil of Example 10; and

Fig. 27 shows an operation state of the pixel based on the eleventh embodiment.

Description of the preferred embodiment

[Implementation Mode 1]

Fig. 1 shows a top view of a test substrate on which a test is performed according to the invention with a first structure. Figure 2 shows a top view of a device under test substrate.

As shown in FIG. 1, the test substrate has a primary coil forming region 101, an external input buffer 102, a connector connection portion 103, and a test electrode 104 on a substrate 100. The test substrate described herein includes a substrate 100 , a primary coil forming region 101 , and other circuits or all circuit elements formed on the substrate 100 .

The number and layout of the primary coil forming regions 101 possessed by the test substrate are not limited to those shown in FIG. 1 . Designers can freely determine the number and layout of the primary coil forming regions 101 .

Although the test substrate shown in FIG. 1 has the test electrodes 104 and the primary coil formation region 101, the present invention is not limited to such a structure. The test electrodes may be prepared separately from the test substrate having the primary coil forming region. By separately providing the test substrate and the test electrode having the primary coil formation region, the distance between the test substrate and the test electrode can be determined independently of the distance between the primary coil and the secondary coil. At the same time, during the test, the layout of the test electrodes can be changed at will relative to the device substrate.

The device substrate shown in FIG. 2 has a signal line driver circuit 111 on a substrate 110, a scan line driver circuit 112, a pixel region 113, an extended interconnect point 114, a connector connection portion 115, a waveform shaping circuit or a rectifier circuit 116, and a secondary coil forming area 117. The device substrate described herein includes the substrate 110 and all circuits or circuit elements formed on the substrate 110 . Extended interconnection points 114 are interconnection points that provide driving signals and power supply voltages for pixel regions and driving circuits possessed by the device substrate.

The secondary coil formation region 117 of the device substrate is not limited to the number and layout of the structure shown in FIG. 2 . Designers can freely determine the number and layout of the secondary coil forming regions 117 .

An FPC, TAB, etc. are connected to the connector connecting portion 115 in a step after the testing step. The device substrate is cut along the line A-A' after the test step is completed to physically and electrically separate the secondary coil formed in the secondary coil forming region 117 from the connector connection portion 115.

Next, the operation of the device substrate and the test substrate in the test step will be explained. In order to facilitate the understanding of the signal flow in the test step, the block diagram shown in FIG. 3 is used to represent the configuration of the device substrate and the test substrate shown in FIGS. 1 and 2, while explaining with reference to FIGS. 1 and 2.

On a test substrate 203, a test AC signal is input from a signal source 201 or an AC power source 202 to the external input buffer 102 through a connector connected to the connector connecting portion 103. The test AC signal is buffered-amplified in the external input buffer 102 and input to the primary coil formation area 101 .

In FIGS. 1, 2 and 3, although the input AC signal buffered-amplified in the external input buffer 102 is input to the primary side coil forming section 101, the present invention is not limited to this structure. The AC signal can be directly input to the primary coil formation area 101 without providing the external input buffer 102 .

A plurality of primary coils are formed in the primary coil forming area 101 . AC signals are input to the two terminals of the primary coil.

Meanwhile, in the secondary coil forming region 117 possessed by the device substrate 204 , a plurality of secondary coils are formed corresponding to the primary coils possessed in the primary coil forming region 101 . When an AC signal is input to the primary coil, an AC voltage in the form of electromotive force is generated due to the electromagnetic induction between the two terminals of the secondary coil.

The AC voltage generated on the secondary coil is supplied to the waveform shaping circuit 116a or the rectification circuit 116b. The waveform shaping circuit 116a or the rectifying circuit 116b shapes or rectifies the AC voltage to generate a driving signal or a power supply voltage.

The resulting drive signal or supply voltage is provided to the extended interconnect point 114 . The supplied driving signal or power supply voltage is supplied to the signal line driving circuit 111, the scanning line driving circuit 112 and the pixel area 113 through the extended interconnection point 114.

The AC voltage generated on the secondary coil can be directly input to the pixel area 113 as a driving signal without passing through the waveform shaping circuit 116a or the rectifying circuit 116b.

A plurality of pixels are provided in the pixel area 113, and each pixel is provided with a pixel electrode. The signal line driver circuits and the scan line driver circuits are not limited to the numbers shown in FIGS. 1 and 2 .

The operation of the signal line driving circuit 111, the scanning line driving circuit 112 and the pixel area 113 applies a voltage to the pixel electrode of each pixel.

A device substrate as a test object does not require driving circuits like the signal line driving circuit 111 and the scanning line driving circuit 112 . A driving signal voltage or a power supply voltage may be applied only to the pixel region 113 .

However, it is necessary to set the value of the driving signal voltage or the power supply voltage so that the voltage applied to the pixel electrode is an AC voltage.

The pixel electrodes of the pixels overlap the test electrodes 104 by a fixed interval. When the pixel works normally and an AC voltage is applied to the pixel electrode, an electromotive force will be generated on the test electrode 104 . The AC voltage or electromotive force generated on the test electrode 104 can provide information on the operation status of the pixel. According to the AC voltage generated on the test electrode 104, the working state of the pixel owned by the pixel area can be confirmed, so as to determine whether it is normal or abnormal, or a specific fault point.

The specific structures of the primary coil and the secondary coil (hereinafter collectively referred to as coils) will be explained below.

Fig. 4 shows an enlarged view of the coil. The coil shown in Figure 4A takes the form of a helical curve. The coil shown in Figure 4B takes the form of a square helix.

Regarding the coil employed in the present invention, the entire wire possessed by the coil is completely formed on the same plane, and the wire possessed by the coil takes a spiral form. Therefore, the line possessed by the coil is described as a curve or a square when viewed from a direction perpendicular to the plane in which the coil is formed.

Designers can properly determine the number of turns of the coil, line width, and its area on the substrate. However, the number of turns and the structure of the coil need to be set correctly according to semiconductor device standards. It is also necessary to correctly set the waveform, frequency, and amplitude of the AC signal for testing input to the primary coil formation area in accordance with semiconductor device standards.

FIG. 5 shows a perspective view of a device overlay 204 overlaying a test substrate 203 . The situation shown in the figure is that the test substrate 203 shown in Figure 1 has a primary coil, that is, the coil shown in Figure 4A, and the device substrate shown in Figure 2 has a secondary coil, that is, the coil shown in Figure 4A coil shown. A connector 205 is connected to the connector connection portion 103 .

As shown in FIG. 5 , the primary coil forming region 101 possessed by the test substrate 203 overlaps the secondary coil forming region 117 possessed by the device substrate 204 at a fixed interval. The ideal interval is small. As long as the distance is controllable, the closer the primary coil forming area 101 and the secondary coil forming area 117 of the device substrate 204, the better.

Meanwhile, the test electrode 104 and the pixel electrodes owned by the pixel area 113 are overlapped with a fixed interval. The ideal interval is small. As long as the distance is controllable, the closer the test electrode 104 and the pixel electrode of the pixel region 113 are, the better.

The separation between the test substrate 203 and the device substrate 204 can be maintained by fixing the two substrates. Alternatively, the separation can be maintained by fixing one of the device substrate 204 or the test substrate 203 with a constant flow rate or pressure of fluid between the test substrate 203 and the device substrate 204 . Representative fluids are gases or liquids. In addition to this, viscose fluids can also be used.

FIG. 6A shows a partially enlarged view of the overlapping primary coil forming area 101 and the secondary coil forming area 117 . 206 represents the primary coil, and 207 represents the secondary coil.

Although the helixes of the primary coil 206 and the secondary coil 207 in FIG. 6A rotate in the same direction, the present invention is not limited to this structure. The helical directions of the primary coil and the secondary coil may be opposite. At the same time, designers can properly set the interval (Lgap) between the primary coil and the secondary coil.

FIG. 6B shows a partially enlarged view of the pixel electrode 208 and the test electrode 104 of the pixel overlapping together. In FIG. 6B, one test electrode 104 overlaps a plurality of pixel electrodes at the same time. The test electrodes can be formed with one conductive film or a plurality of conductive films connected on a circuit.

The overlapping test electrode 104 and pixel electrode 208 form a capacitor. If an AC voltage is applied to the pixel electrode 208 in the state shown in FIG. 6B , an electromotive force is generated on the test electrode 104 .

FIG. 7 shows a circuit diagram of the pixel electrode 208 of the device substrate and the test electrode 104 of the test substrate 104 superposed together. The structure shown in FIG. 7 is only an example, and the number and kind of interconnection points and elements possessed by pixels and their connection points are not limited to the structure shown in FIG. 7 . Meanwhile, although FIG. 7 shows the pixel configuration of a light emitting device, the present invention can also be applied to other semiconductor devices. Specifically, the test method of the present invention can be applied to a semiconductor device as long as an AC voltage can be applied to the pixel electrode by controlling the AC voltage applied to the interconnection point or element.

The light emitting device shown in FIG. 7 has x number of signal lines S1 to Sx, x number of power supply lines V1 to Vx, and y number of scan lines. Each pixel 102 has a signal line, a power supply line, and a scanning line. In addition, the pixel 802 has a switching TFT 803 , a driving TFT 804 and a storage capacitor 805 .

806 is a capacitor formed by overlapping the test electrode 104 and the pixel electrode 208 .

The gate electrode of the switching TFT 803 is connected to any one of the scanning lines G1 to Gy. One of the source and drain regions of the switching TFT 803 is connected to any one of the signal lines S1 to Sx, and the other is connected to the gate electrode of the driving TFT 804 . One of the source and drain regions of the driving TFT 804 is connected to any one of the power supply lines V1 to Vx, while the other is connected to the pixel electrode.

Two electrodes of the storage capacitor 805 are respectively connected to the gate electrode of the driving TFT 804 and the power supply line.

In the pixel shown in FIG. 7, an AC drive signal voltage is applied to the power supply lines V1 to Vx. Therefore, when the pixel is normal, the switching TFT 803 can be turned on by controlling the voltage applied to the scanning line, and the driving TFT 804 can be turned on by controlling the voltage applied to the signal line. This enables an AC drive signal voltage to be applied to the pixel electrodes.

By applying an AC driving signal voltage to the pixel electrode, an AC voltage can be generated on the test electrode 104 overlapping the pixel electrode. The generated AC voltage is supplied as an output 807 to a subsequent stage circuit.

Among the pixels shown in Fig. 7, the pixel electrodes of those pixels having the same scanning line overlap with the same test electrode. However, the test electrodes are not limited to the layout shown in FIG. 7 . A pixel having a pixel electrode overlapping a test electrode can be selected arbitrarily. Taking the pixels shown in FIG. 7 as an example, the pixel electrodes of those pixels having the same signal line can be connected to the same test electrode.

The subsequent stage circuit receiving this output 807 determines the normal/abnormality of the pixel based on the AC voltage generated on the test electrode.

Depending on the driving method of the semiconductor device or the layout of the test electrodes, there may be cases where voltages are simultaneously applied to a plurality of pixel electrodes overlapping one test electrode, either sequentially or randomly.

If an AC voltage is applied to a plurality of pixel electrodes at the same time, the waveform of the AC voltage generated on the test electrode will be differentiated between when all the pixels work normally and when at least one pixel does not work normally. That is, the AC voltages generated on the test electrodes can be used as information on the working status of all pixels having these pixel electrodes.

At the same time, if an AC voltage is applied to a plurality of pixel electrodes in sequence, the test electrode has an AC voltage that increases in sequence, and each level can be used as information on the working status of each pixel. Therefore, if all the pixels are normal, operating the pixels in sequence will provide a monotonically varying AC voltage on the test electrode. Therefore, if any one pixel is abnormal, sequentially operating pixels will have a non-monotonic variation in the AC voltage developed on the test electrode. Therefore, the waveform of the AC voltage generated on the test electrode is different between normal operation of all pixels and abnormal operation of at least one pixel.

Sometimes, if the AC voltage actually generated on the test electrode is compared with the AC voltage generated on the test electrode for which the pixel has been confirmed to be normal, the operation status of the pixel can be confirmed and normal/abnormal can be determined. However, the AC voltage used as a reference for comparison need not be based on a pixel that has been confirmed to be normal. If a comparison is made between the AC voltages respectively generated on the test electrodes, the normal/abnormal operation state of a pixel can be determined. In addition, if compared with an AC voltage value calculated by simulation, it is also possible to confirm the operation state of the pixel and determine its normality/abnormality.

Although in FIG. 7 the test electrode and the pixel electrode are overlapped according to each pixel owned by the pixel area, the present invention is not limited thereto. The test electrodes and pixel electrodes may only overlap randomly selected pixels, and the working state test is only performed on randomly selected pixels.

Although the implementation mode explained in this example is that the device substrate has driving circuits such as a signal line driving circuit and a scanning line driving circuit, the device substrate under test of the present invention is not limited thereto. Even if there is only one pixel area on the device substrate, testing can be performed by the testing method of the present invention. Meanwhile, for a single device constituted by a single device called TEG or evaluation circuit, the test method or device of the present invention can be used to confirm its working state.

The present invention can determine normality/abnormality with the above structure without using probes that directly contact interconnection points. Thus, it is possible to prevent a reduction in yield due to fine dust from the use of the probe in subsequent steps. In addition, since normality/abnormality in all patterning steps can be determined with one test step, the test process can be simplified.

[Implementation Mode 2]

Fig. 8 shows a top view of first and second test substrates tested according to the present invention with a second configuration. Refer to FIG. 2 in Embodiment Mode 1 for the device substrate used in this embodiment.

The first test substrate shown in FIG. 8A has a primary coil forming region 6101, an external input buffer 6102, and a connector connection portion 6103 for the first test substrate on a substrate 6100. In the specification, the first test substrate includes the substrate 6100 , the primary coil formation region 6101 and all other circuits or circuit elements formed on the substrate 6100 . There may be no need to provide an external input buffer 6102 therein.

The primary coil forming regions 6101 possessed by the first test substrate are not limited to the number and layout of the structure shown in FIG. 8A. It is possible for the designer to freely determine the number and layout of the primary coil forming regions 6101 .

The second test substrate shown in FIG. 8B has a plurality of test electrodes 6121 and a connector connection portion 6122 for the second test substrate on one substrate 6120 . In the specification, the second test substrate includes the substrate 6120 , the connector connection portion 6122 for the second test substrate, and all other circuits or circuit elements formed on the substrate 6100 .

The number and layout of the test electrodes 6121 possessed by the second test substrate are not limited to those shown in FIG. 8B . It is possible for the designer to determine the number and layout of the test electrodes 6121 at will.

Next, the operation of the device substrate and the test substrate in the test step will be explained. In order to facilitate the understanding of the signal flow in the test step, the block diagram shown in Figure 9 is used to represent the structure of the device substrate shown in Figures 8 and 2 and the first and second test substrates, while referring to Figures 8 and 2 to explain .

On the first test substrate 6203, a test AC signal is input from a signal source 201 or an AC power source 202 to the external input buffer 6102 through a connector connected to the connector connection portion 6103. The test AC signal is buffered-amplified in the external input buffer 6102 and input to the primary coil formation area 6101 .

In FIGS. 2 , 8 and 9 , sometimes, the input AC signal buffered-amplified in the external input buffer 6102 is input to the primary side coil forming area 6101 . However, the present invention is not limited to this structure. The AC signal can be directly input to the primary coil formation area 6101 without providing an external input buffer 6102 .

A plurality of primary coils are formed in the primary coil forming area 6101 . AC signals are input to the two terminals of the primary coil.

At the same time, in the secondary coil forming region 117 of the device substrate 204 , a plurality of secondary coils are formed corresponding to the primary coils of the primary coil forming region 6101 . When an AC signal is input to the primary coil, an AC voltage in the form of electromotive force is generated due to the electromagnetic induction between the two terminals of the secondary coil.

The AC voltage generated on the secondary coil is supplied to the waveform shaping circuit 116a or the rectification circuit 116b. The waveform shaping circuit 116a or the rectifying circuit 116b shapes or rectifies the AC voltage to generate a driving signal or a power supply voltage.

The resulting drive signal or supply voltage is provided to the extended interconnect point 114 . The supplied driving signal or power supply voltage is supplied to the signal line driving circuit 111, the scanning line driving circuit 112 and the pixel area 113 through the extended interconnection point 114.

The AC voltage generated on the secondary coil can be directly input to the pixel area 113 as a driving signal without passing through the waveform shaping circuit 116a or the rectifying circuit 116b.

A plurality of pixels are provided in the pixel area 113, and each pixel is provided with a pixel electrode. The signal line driver circuits and the scan line driver circuits are not limited to the numbers shown in FIGS. 2 and 9 .

The operation of the signal line driving circuit 111, the scanning line driving circuit 112 and the pixel area 113 applies a voltage to the pixel electrode of each pixel.

A device substrate as a test object does not require driving circuits like the signal line driving circuit 111 and the scanning line driving circuit 112 . A driving signal voltage or a power supply voltage may be applied only to the pixel region 113 .

However, it is necessary to set the value of the driving signal voltage or the power supply voltage so that the voltage applied to the pixel electrode is an AC voltage.

The pixel electrodes of the pixels overlap the test electrodes 6121 by a fixed interval. When the pixel works normally and an AC voltage is applied to the pixel electrode, an electromotive force will be generated on the test electrode 6121 . The AC voltage or electromotive force generated on the test electrode 6121 can provide information on the working state of the pixel. According to the AC voltage generated on the test electrode 6121, the working status of the pixels in the pixel area can be confirmed, so as to determine its normality/abnormality, or a specific fault point.

Sometimes, the first and second coils used in this embodiment are the same as those in Embodiment 1, and the coils shown in FIGS. 4A and 4B may be used.

FIG. 10 shows a perspective view in which the device substrate 204 overlaps the first test substrate 6203 and the second test substrate 6205 . The situation shown in the figure is that the first test substrate 6203 in FIG. 8A has a primary coil, that is, the coil shown in FIG. 4A, and the device substrate shown in FIG. 2 has a secondary coil, that is, The coil shown in Figure 4A. A connector 6209 is connected to the connector connection portion 6103 of the first test substrate. At the same time, the connector 6210 is connected to the connector connection portion 6122 of the second test substrate.

As shown in FIG. 10 , the primary coil formation region 6101 possessed by the first test substrate 6203 overlaps the secondary coil formation region 117 possessed by the device substrate 204 at a fixed interval. The ideal interval is small. As long as the distance is controllable, the closer the primary coil forming area 6101 and the secondary coil forming area 117 of the device substrate 204, the better.

Meanwhile, the test electrodes 6121 possessed by the second test substrate 6205 and the pixel electrodes possessed by the pixels of the pixel region 113 are overlapped at a fixed interval. The ideal interval is small. As long as the distance is controllable, the closer the test electrode 6121 and the pixel electrodes of the pixels in the pixel area 113 are, the better.

The space between the test substrate 6203 and the device substrate 204 can be maintained by fixing the two substrates. Alternatively, the spacing can be maintained by fixing one of the device substrates 204 or the first test substrate 6203 , with a fluid at a constant flow rate or pressure between the first test substrate 6203 and the device substrate 204 . Representative fluids are gases or liquids. In addition to this, viscose fluids can also be used.

Similar to Embodiment 1, the helixes of the primary coil and the secondary coil can be in the same or opposite directions. At the same time, designers can properly set the interval (Lgap) between the primary coil and the secondary coil. For the overlapping manner between the primary coil and the secondary coil, please refer to FIG. 6A in Embodiment Mode 1.

Also, similarly to Embodiment Mode 1, one test electrode 6121 overlaps a plurality of pixel electrodes at the same time. The test electrodes can be formed with one conductive film or a plurality of conductive films connected on a circuit. For the overlapping manner of the test electrodes and the pixel electrodes, refer to FIG. 6B in Embodiment Mode 1. FIG. A capacitance is formed by overlapping the test electrode 6121 and the pixel electrode 208 . If an AC voltage is applied to the pixel electrode 208, an electromotive force will be generated due to the electrostatic induction on the test electrode 6121.

Sometimes, in this mode of implementation, the location of the pixel electrode 208 overlapping the test electrode 6121 is arbitrary. In addition, the positional relationship between the test electrode 6121 and the pixel electrode 208 varies with different monitors.

For the circuit diagram of the overlapping pixel electrodes 208 of the device substrate and the test electrodes 6121 of the second test substrate, refer to FIG. 7 of Embodiment Mode 1. Referring to FIG. It should be noted that, among the pixels shown in FIG. 7 , the pixel electrodes of the pixels with the same scan line overlap with the same test electrode. However, the test electrodes are not limited to the configuration shown in FIG. 7 . It is possible to arbitrarily select those pixels whose pixel electrodes overlap the test electrodes.

The positional relationship between the test electrode 6121 and the pixel electrode 208 during monitoring will be explained below.

Designers can freely set the number of times to monitor the AC voltage generated on the test electrode 6121 . Designers can also freely set the positional relationship between the test electrode 6121 and the pixel electrode 208 during each monitoring process. However, in order to monitor, the positional relationship between the test electrode 6121 and the pixel electrode 208 must be fixed, and the number of times of monitoring must be set, so that the working state of each pixel can be determined by the AC voltage values on the test electrode 6121 obtained by all monitoring .

11A and 11B show the positional relationship between the pixel electrode 208 and the test electrode 6121 when the test electrode 6121 is rotated on a plane parallel to the plane on which the pixel electrode 208 is formed around the center of the pixel area as the central axis. For ease of explanation, the example described here uses a number of 5*5 pixel electrodes in the pixel area.

FIG. 11A shows the state before rotation (0°), in which every fifth pixel electrode 208 overlaps with the test electrode 6121.

FIG. 11B shows a state where the test electrode 6121 is rotated 45 degrees counterclockwise from the state of FIG. 11A around the center of the pixel area. In this case, the test electrode 6121 overlaps with a different one of the pixel electrodes 208 in FIG. 11A.

The amplitude and the waveform of the AC voltage generated on each test electrode 6121 are different, depending on the number of pixel electrodes overlapping with the test electrode 6121, the area overlapped with the pixel electrodes, and the voltage applied to the pixel electrodes. AC voltage value.

It is possible to calculate in advance the number of pixel electrodes overlapping the test electrode 6121 and the area overlapping the pixel electrodes. In the case that all the pixels are operating normally, the amplitude and waveform of the AC voltage to be applied to the pixel electrodes can also be obtained in advance by calculation or actual measurement.

For example, in the situation shown in FIG. 12, the pixel electrode 208a of a poor-quality pixel is included in the pixel electrode 208 overlapping with the test electrode 6121, and the amplitude and waveform of the AC voltage generated on the test electrode 6121 are consistent with those of all pixels. The cases where both work fine are different.

Among the pixel electrodes overlapping with the test electrode 6121, as the pixel electrode occupancy rate of inferior pixels increases, the amplitude and waveform of the AC voltage generated on the test electrode 6121 will be far away from the normal operation of all pixels. . Therefore, the occupancy ratio of normally operating pixels among those pixel electrodes overlapping with a test electrode 6121 can be calculated.

In addition, since the position of the test electrode 6121 relative to the pixel electrode 208 is changed multiple times, it is possible to obtain the occupancy ratio of normally operating pixels among those pixel electrodes overlapping with one test electrode 6121. According to the occupancy rate of normal working pixels obtained at each position of the test electrode 6121, its working state can be determined pixel by pixel. Normal/abnormal can be determined according to the working status.

Sometimes, the simultaneous application of voltages to a plurality of pixel electrodes overlapping with one test electrode includes sequential and random application, depending on the driving method of the semiconductor device and the layout of the test electrodes.

In the case of selecting and operating a plurality of pixels at the same time, the AC voltage waveform generated on the test electrode is different between the cases where all the pixels work normally and the cases where at least one pixel does not work normally. That is to say, the AC voltage generated on the test electrode has information on the working status of all pixels.

At the same time, if multiple pixels are selected and operated in sequence, the test electrodes will generate alternating voltages that increase in sequence, and each level can be used as information on the working status of each pixel. Therefore, relative to the overlapping area between the pixel electrode and the test electrode of the working pixel, if all of the plurality of pixels operated in sequence are normal, the resulting AC voltage on the test electrode will have a monotonic rate of change.

Otherwise, if an abnormal pixel is included among the plurality of pixels operated in sequence, the AC voltage generated on the test electrode will not have a monotonic variation with respect to the overlapping area between the pixel electrode and the test electrode of the working pixel. rate of change. Therefore, the waveform of the AC voltage generated on the test electrode is different between the cases where all the pixels are operating normally and at least one pixel is abnormally operating.

Sometimes, it is possible to confirm the working state of a pixel by comparing the AC voltage generated on the test electrode with the AC voltage actually generated on the test electrode when the pixel used has been confirmed to be normal, and to determine its normal/abnormal. However, the AC voltage used as a reference for comparison must not be on a pixel that has been confirmed to be normal. By comparing the AC voltages generated on a plurality of test electrodes, it is possible to confirm the operation state of a pixel and determine its normal/abnormality. In this case the comparison must take into account the area of the pixel electrode which overlaps the test electrode. At the same time, by comparing with an AC voltage value calculated by simulation, it is possible to confirm the operation state of a pixel and determine its normality/abnormality.

Sometimes, although the test electrodes and the pixel electrodes of all the pixels owned by the pixel segment are overlapped in Figs. 7, 11A and 11B, the present invention is not limited to this case. The test electrodes and pixel electrodes may overlap only on randomly selected pixels, and the test for the working state is performed only on randomly selected pixels.

Although this embodiment mode is explained as an example that a device substrate has a signal line driver circuit and a scan line driver circuit as driver circuits, the device substrate to be tested in the present invention is not limited thereto. If the device substrate has only one pixel, testing can also be performed with the method of the present invention. Meanwhile, the test method or device of the present invention can also be used to confirm the working state of a single device constituted by a single device called TEG or evaluation circuit.

Notably, the test electrodes can be directly controlled and moved without fixing the test electrodes to the substrate.

The present invention can determine the normality/abnormality of the device substrate with the above-mentioned structure, without the probe directly touching the interconnection point. Thus, it is possible to prevent a reduction in yield due to fine dust from the use of the probe in subsequent steps. In addition, since normality/abnormality in all patterning steps can be determined with one test step, the test process can be simplified.

Embodiments of the present invention will be explained below.

[Example 1]

This embodiment illustrates the construction of a test device for confirming the operation state of a pixel and determining its normality/abnormality by comparison between alternating voltages generated on a plurality of test electrodes of the embodiment 1.

Fig. 13 is a block diagram showing the configuration of the test apparatus of this embodiment.

A measurement start command is input as information from the host I/F 305 to the measurement controller 306 . In order to start the measurement, an instruction for controlling the positions of the device substrate 302 and the test substrate 301 as the test object is input to the processor I/F 307 from the measurement controller 306 . The processor I/F 307 overlaps a pixel electrode (not shown) possessed by the device substrate 302 and a test electrode 303 possessed by the test substrate 301 at a fixed interval.

The measurement controller 306 inputs a measurement start command as information to the measurement sequencer 308 . A panel display sequencer 309 is controlled by the measurement sequencer 308 to select the position of the pixel of the test object, and this position is input from the panel display sequencer 309 to the coil driver 310 as information. An RF carrier with a signal source and an AC power supply can provide an AC voltage to the subsequent circuit. The measurement sequencer 308 controls the RF carrier 311 to input an AC voltage to the coil driver 310 .

The coil driver 310 supplies the external input buffer 311 with the input AC voltage for operating the pixel under test. The external input buffer 311 buffers-amplifies the supplied AC voltage, and supplies it to the primary coil formation area 304 .

By supplying an AC voltage to the primary coil forming region 304, the test subject pixels possessed by the device substrate 302 can be operated. An AC voltage is applied to the pixel electrode of the pixel. Incidentally, the operation of the device substrate at the time of supplying the AC voltage to the primary coil formation region has already been explained in detail in the embodiment mode, and thus need not be further explained here.

When an AC voltage is applied to the pixel electrode, an AC voltage is generated on the test electrode 303 overlapping the pixel electrode. The AC voltage generated on the test electrode 303 includes the working state information of the same pixel.

The AC voltage generated on the test electrode 303 is supplied to a signal processing circuit 312 . The AC voltage value generated on each pixel electrode is processed by the signal processing circuit 312 . Specifically, the difference between the AC voltages on the various test electrodes is calculated. The waveform of the AC voltage generated on the test electrode 303 is different depending on the operation state of the pixel. Therefore, the calculated AC voltage difference includes the information of the working state of the pixel. Therefore, the signal with information, that is, the calculated AC voltage difference (operation information signal) includes the information of the operation state of the pixel. This operation information signal is input to the selector circuit 313 .

The AC voltage generated on the test electrodes often includes various noises. This noise with relatively close frequencies and voltages generated on the test electrodes can be eliminated to a certain extent by calculating the difference between the AC voltage values generated on the test electrodes. The closer the test electrodes are to each other, the closer the frequency and voltage of the noise will be. Therefore, it is best to calculate the difference in AC voltage between those test electrodes that are located relatively close to each other.

The position information of one pixel selected by the panel display sequencer 309 is supplied to the selector circuit 313 through the measurement sequencer 308 . The selector circuit 313 inputs to a signal analyzer 314 an operation information signal corresponding to a selected pixel among a plurality of input operation information signals.

The signal analyzer 314 amplifies the input work information signal, A/D converts it into a digital form, and then processes it. A/D conversion is not necessary, and processing operations may be performed in analog form. Processing operations are performed to analyze the operational status of the pixel. Therefore, the designer can correctly choose what to handle the operation.

The job information signal after the processing operation is input to the measurement controller 306 . The measurement controller 306 further processes the operational work information signal to determine a pixel state, and further determines the normal/abnormality of the pixel.

Incidentally, the light emitting device of the present invention is not limited to the configuration shown in FIG. 13 . It is only required that the light-emitting device has a device for generating an alternating voltage, a device for supplying voltage to the interconnection points and circuit elements of the device substrate without contact, and a device for reading the voltage applied to the pixel electrode of the device substrate without contact, And means for controlling the position of the device substrate. In addition, it is necessary to contactlessly determine the status of a pixel based on the AC voltage reading, and determine the normal/abnormal condition of the pixel.

[Example 2]

This embodiment illustrates the construction of a test device for confirming the operation state of a pixel and determining its normality/abnormality by using AC voltages generated on a plurality of test electrodes of the embodiment 2.

Fig. 14 is a block diagram showing the configuration of the test apparatus of this embodiment.

A measurement start command is input as information from the host I/F 6305 to the measurement controller 6306 . To start the measurement, an instruction for controlling the positions of the device substrate 6302, the first test substrate 6301 and the second test substrate 6315 serving as test objects is input from the measurement controller 6306 to the processor I/F 6307 as information.

The processor I/F 6307 overlaps the secondary coil canceling area (not shown) owned by the device substrate 6302 and the primary coil canceling area 6304 owned by the first test substrate 6301 at a fixed interval. At the same time, the processor I/F 6307 overlaps a pixel electrode (not shown) owned by the device substrate 6302 and a test electrode 6303 owned by the second test substrate 6315 at a fixed interval.

The measurement controller 6306 inputs a measurement start instruction as information to the measurement sequencer 6308 . A panel display sequencer 6309 is controlled by the measurement sequencer 6308 to select the position of the test object pixel, and this position is input from the panel display sequencer 6309 to the coil driver 6310 as information. An RF carrier 6311 with a signal source and an AC power supply can provide AC voltage to subsequent circuits. The measurement sequencer 6308 controls the RF carrier 6311 to input an AC voltage to the coil driver 6310 .

The coil driver 6310 supplies the external input buffer 6311 with the input AC voltage for operating the pixel under test. The external input buffer 6311 buffers-amplifies the supplied AC voltage, and supplies it to the primary-side coil forming section 6304 .

By supplying an AC voltage to the primary coil formation region 6304, the pixels to be tested possessed by the device substrate 6302 can be operated. An AC voltage is applied to the pixel electrode of the pixel.

When an AC voltage is applied to the pixel electrode, an AC voltage is generated on the test electrode 6303 overlapping the pixel electrode. The AC voltage generated on the test electrode 6303 includes the working state information of the same pixel.

The AC voltage generated on the test electrode 6303 is supplied to a signal processing circuit 6312 . The AC voltage values generated on the respective test electrodes are processed by the signal processing circuit 6312 . Specifically, the difference in the AC voltage generated between the test electrodes is calculated. The AC voltage generated on the test electrodes often includes various noises. This noise with relatively close frequencies and voltages generated on the test electrodes can be eliminated to a certain extent by calculating the difference between the AC voltage values generated on the test electrodes. The closer the test electrodes are to each other, the closer the frequency and voltage of the noise will be. Therefore, it is best to calculate the difference in AC voltage between those test electrodes that are located relatively close to each other.

Incidentally, the waveform of the AC voltage generated on the test electrode 6303 is different depending on the operation state of the pixel. Therefore, the calculated AC voltage difference includes the information of the working state of the pixel. Therefore, the signal with information, that is, the calculated AC voltage difference (operation information signal) includes the information of the operation state of the pixel. This work information signal is input to the selector circuit 6313.

The position information of one pixel selected by the panel display sequencer 6309, the position of one pixel electrode overlapping with each test electrode 6303, and the ratio of the overlapping area are supplied to the selector circuit 6313 through the measurement sequencer 6308. The selector circuit 6313 inputs to a signal analyzer 6314 an operation information signal corresponding to a selected pixel among a plurality of input operation information signals.

The signal analyzer 6314 amplifies the input work information signal, A/D converts it into a digital form, and then processes it. Incidentally, A/D conversion is not necessary, and processing operations may be performed in analog form. Processing operations are performed to analyze the behavior of the pixel that overlaps the test electrode during monitoring. Therefore, the designer can correctly choose what to handle the operation.

The job information signal after the processing operation is input to the measurement controller 6306 .

Then, the processor I/F 6307 changes the position of the second test electrode 6315 relative to the device substrate 6302 . The above operation is repeated many times, and a plurality of processed work information signals are input to the measurement controller 6308 . The measurement controller 6308 determines the state of each pixel according to the position and area ratio of a pixel electrode overlapping with each test electrode during the monitoring period and the input processed operation information signal, and determines whether the pixel is normal/abnormal .

It is worth noting that the testing device of the present invention is not limited to the configuration shown in FIG. 14 . As long as the testing device of the present invention has a device for generating an AC voltage, a device for supplying a voltage to the interconnection points and circuit elements of the device substrate without contact, and a device for reading the voltage applied to the pixel electrode of the device substrate without contact means, and means for controlling the position of the device substrate. In addition, it is necessary to contactlessly determine the state of a pixel based on the AC voltage reading, and to determine the normal/abnormal condition of the pixel.

[Example 3]

This embodiment will explain the specific configuration of the signal processing circuit of the test device shown in FIG. 13 . It should be noted that the test device shown in FIG. 14 can also adopt the configuration of this embodiment.

FIG. 15 shows a circuit diagram of the signal processing circuit of this embodiment. The signal processing circuit shown in FIG. 15 has a plurality of differential amplifiers 350_1 to 350_y−1 corresponding to y number of test electrodes 303 (E1 to Ey).

The AC voltages generated on the test electrodes are respectively input to the non-inverting input (+) of the differential amplifier. The inverting input (-) of each differential amplifier is supplied with an alternating voltage developed on a test electrode different from the test electrode corresponding to the non-inverting input (+).

In this embodiment, the voltage of the AC voltage generated on the test electrode Ei (i is any one of 1 to y−1) is supplied to the non-inverting input (+) of the differential amplifier 350_i. The voltage of the AC voltage generated on the test electrode Ei+1 (i is any one of 1 to y−1) is supplied to the second terminal of the differential amplifier 350_i+1.

The output of each differential amplifier inputs an operation information signal to the selector circuit 313 of the subsequent stage. The operation state of a pixel overlapping with each test electrode can be confirmed based on the operation information signal output from the differential amplifier. Specifically, the operation state of a pixel can be confirmed according to the value or waveform of the voltage possessed by the operation information signal. However, the operation state of the pixel overlapping with the test electrode Ey can be confirmed according to the operation information signal output from the differential amplifier 350_y-1. It is also possible to prepare a dummy test electrode, provide the AC voltage generated on the test electrode Ey to the non-inverting input (+) of a separately provided differential amplifier, and provide the voltage of the dummy test electrode to the second terminal. In addition, a dummy pixel that is not actually used for display but for testing purposes can be provided in the pixel area, so that the dummy pixel can overlap with the dummy test electrode.

The operation state information of a pixel overlapping with the test electrode E1 is included in the operation information signal output from the differential amplifier 350_1. The operation state information of one pixel overlapping with the test electrode E1j (j=2 to y-1) is included in the operation information signal output by the differential amplifier 350_j-1 and the differential amplifier 350_j. The operation state information of a pixel overlapping with the test electrode Ey is included in the operation information signal output from the differential amplifier 350_y-1.

By the way, the designer can also correctly set a standard to determine whether a pixel is working normally according to the degree of difference between the working state of a pixel and the normal pixel working state.

The signal processing circuit used in the present invention is not limited to the configuration shown in FIG. 15 .

The implementation of this embodiment can be freely combined with Embodiment 1 or 2.

[Example 4]

This embodiment will explain the specific configuration of the signal processing circuit of the test device shown in FIG. 13 . It should be noted that the test device shown in FIG. 14 can also adopt the configuration of this embodiment.

FIG. 16 shows a circuit diagram of the signal processing circuit of this embodiment. The signal processing circuit shown in FIG. 16 has a plurality of primary side induction coils 360_1 to 360_y-1 corresponding to a number of test electrodes 303 (E1 to Ey) of y, a plurality of secondary side induction coils 361_1 to 361_y-1 and a plurality of Capacitors 362_1 to 362_y-1.

In this embodiment, the center of each primary and secondary induction coils (hereinafter referred to as induction coils) may or may not be provided with a magnetic component. Meanwhile, the interconnection points of these induction coils may or may not be on the same plane.

The AC voltages generated on the test electrodes are respectively input to the first terminals of the primary induction coils. The second terminal of each primary induction coil is supplied with an AC voltage generated on a test electrode different from the test electrode corresponding to the first terminal.

In this embodiment, the voltage of the AC voltage generated on the test electrode Ei (i is any one from 1 to y−1) is supplied to the first terminal of the primary induction coil 360_i. The voltage of the AC voltage generated on the test electrode Ei+1 (i is any one from 1 to y−1) is supplied to the second terminal of the primary induction coil 360_i+1.

The primary induction coils 360_1 to 360_y-1 and the secondary induction coils 361_1 to 361_y-1 are respectively overlapped. Capacitors 362_1 to 362_y−1 are respectively formed between the first and second terminals of the secondary induction coils 361_1 to 361_y−1.

The voltages generated at the first terminals of the secondary induction coils 361_1 to 361_y−1 are all supplied to the selector circuit 313 as the operation information signal voltage. A constant voltage (ground voltage in FIG. 16 ) is applied to all the second terminals of the secondary induction coils 361_1 to 361_y-1.

The operation state of a pixel overlapping with each test electrode can be confirmed based on the operation information signal generated at the first terminal of the secondary induction coil. However, the operation state of the pixel overlapping with the test electrode Ey can be confirmed according to the operation information signal generated on the first terminal of the secondary induction coil 360_y-1.

It is also possible to prepare a dummy test electrode, supply the AC voltage generated on the test electrode Ey to the first terminal of a separately provided primary induction coil, and provide the voltage of the dummy test electrode to the second terminal of the primary induction coil. The operating state can also be confirmed based on an operating information signal generated at the first terminal of a separately provided secondary induction coil. In addition, a dummy pixel that is not actually used for display but for testing purposes can be provided in the pixel area, so that the dummy pixel can overlap with the dummy test electrode.

The operation status information of a pixel overlapping with the test electrode E1 is included in the operation information signal generated on the first terminal of the secondary induction coil 361_1. The working status information of a pixel overlapping with the test electrode Ej (j=2 to y-1) is included in the first terminal of the secondary induction coil 361_j-1 and the work generated on the first terminal of the secondary induction coil 361_j. information signal. The operation status information of a pixel overlapping with the test electrode Ey is included in the operation information signal generated on the first terminal of the secondary induction coil 361_y-1.

Designers can also correctly set a standard to determine whether a pixel is working normally according to the degree of difference between the working state of a pixel and the working state of a normal pixel.

The signal processing circuit used in the present invention is not limited to the configuration shown in FIG. 16 .

The implementation of this embodiment can be freely combined with Embodiment 1 or 2.

[Example 5]

This embodiment will use FIG. 17 to explain the specific configuration of the waveform shaping circuit in Embodiment Mode 1. FIG. It should be noted that the waveform shaping circuit of Embodiment Mode 2 can also adopt the configuration of this embodiment.

FIG. 17 shows a connection form among the signal source 201 shown in FIG. 3, the primary coil forming section 101, the secondary coil forming section 117 and the waveform shaping circuit 116a. A plurality of primary coils 206 are provided in the primary coil formation area 101 . A plurality of secondary coils 207 are disposed in the secondary coil forming area 117 .

A test AC signal is input from the signal source 201 to each primary coil 206 . Specifically, a test AC signal voltage is applied between the two terminals of the primary coil 206 from the signal source 201 . When an AC signal is input to the primary coil 206 , an AC voltage or electromotive force will be generated on the corresponding secondary coil 207 . This AC voltage is supplied to the waveform shaping circuit 116a.

The waveform shaping circuit 116a is an electronic circuit for shaping a voltage or current waveform that varies over a certain amount of time. Fig. 17 has resistors 501, 502 and capacitors 503, 504, and a combination of circuit elements constitutes an integral type waveform shaping circuit 116a. Of course, the waveform shaping circuit is not limited to the configuration shown in FIG. 17 . Similarly, similar to the power supply circuit, a waveform detection circuit using a diode can also be used for waveform shaping.

The waveform shaping circuit 116a employed in the present invention specifically generates and outputs a clock signal (CLK), a start pulse signal (SP) or a video signal according to the input AC electromotive force.

The waveform shaping circuit 116a generates signals in arbitrary forms, not limited to the above-mentioned signals. The signal generated by the waveform shaping circuit 116a can be used to confirm the operation status of the pixel.

The signal output from the waveform shaping circuit 116a is input to subsequent circuits such as the signal line driver circuit 111, the scanning line driver circuit 112, and the pixel area 113.

The implementation of this embodiment can be freely combined with Embodiments 1 to 4.

[Example 6]

In this embodiment, FIG. 18 is used to explain the specific structure of the rectification circuit 116b in Embodiment Mode 2. FIG. The rectification circuit of Embodiment Mode 2 can adopt the configuration shown in this embodiment.

FIG. 18 shows a connection form between the AC power source 202 shown in FIG. 3, the primary coil forming area 101, the secondary coil forming area 117 and the rectifying circuit 116b. A plurality of primary coils 206 are provided in the primary coil formation area 101 . A plurality of secondary coils 207 are disposed in the secondary coil forming area 117 .

A test AC signal is input to each primary coil 206 from the AC power source 202 . When an AC signal is input to the primary coil 206 , an AC voltage or electromotive force will be generated on the corresponding secondary coil 207 . This AC voltage is supplied to the rectification circuit 116b.

The rectifying circuit 116b of the present invention is a circuit for generating a DC power supply voltage from a supplied AC voltage. DC power supply voltage means that the voltage supplied to the circuit, circuit element or pixel is maintained at a constant level.

The rectification circuit 116b shown in FIG. 18 has a diode 601, a capacitor 602 and a resistor 603. The input AC voltage is rectified by diode 601 and converted into DC voltage.

FIG. 19A shows the change with time of the AC voltage before it is rectified in the diode 601. FIG. Fig. 19B shows the variation of the rectified voltage with time. A comparison between Figs. 19A and 19B shows that the rectified voltage has a zero or unipolar value, ie, a pulsed voltage, in half cycle intervals.

The pulse voltage shown in FIG. 19B is difficult to be used as a power supply voltage. Therefore, it is often necessary to use the storage effect of the capacitor to smooth the pulse and convert it into a DC voltage. However, in order to form a capacitor with a capacity sufficient to smooth such pulses using a thin-film semiconductor, it is necessary to increase the area of the capacitor unrealistically. Therefore, the present invention combines (adds) pulse voltages having different phases after rectification to smooth the voltage. Even if the capacity of the capacitor is small, the above configuration is sufficient to smooth such pulses. Also, it is not necessary to actually place a capacitor to smooth out such pulses.

In FIG. 18 , AC signals with different phases are respectively input to four primary coils, and four pulse voltages with different phases are output from four diodes 601 . These four pulse voltages are added together to form a DC power supply voltage whose height is maintained approximately constant, which can be output to the subsequent circuit.

Although in FIG. 18 four pulse signals with different phases output by four diodes 601 are added together to form a power supply voltage, the present invention is not limited to this configuration. The number of phase divisions is not limited to this. There is no limit to the number of phase divisions as long as the output of the rectifier circuit can be smoothed to the extent that it can be used as a power supply.

20A-20C show the variation with time of the supply voltage obtained by summing together a plurality of rectified signals. The example shown in FIG. 20A is a power supply voltage generated by adding together four pulse voltages with different phases.

Since the rectifier circuit of the present invention generates voltage by adding multiple pulses together, there are fluctuation components in the voltage besides direct current. The fluctuation corresponds to the difference between the highest voltage and the lowest voltage. The smaller the fluctuation, the closer the voltage produced by the DC circuit is to DC which is suitable as a supply voltage.

FIG. 20B shows the change with time of the power supply voltage obtained by adding together eight pulse voltages with different phases. It can be seen that the fluctuation is smaller than the time variation of the power supply voltage shown in Fig. 20A.

FIG. 20C shows the change with time of the power supply voltage obtained by adding together sixteen pulse voltages with different phases. It can be seen that the fluctuation is smaller than the time variation of the power supply voltage shown in Fig. 20B.

In this way it can be seen that the addition of many pulses out of phase can reduce fluctuations in the supply voltage to direct current. Therefore, as the number of phase divisions increases, the power supply voltage output from the rectification circuit becomes smoother. Similarly, as the capacity of the capacitor 602 increases, the power supply voltage output from the rectifier circuit becomes smoother.

The power supply voltage generated by the rectification circuit 116b is output through terminals 610 and 611 . Specifically, a voltage close to the ground potential is output through the terminal 610 , and a power supply voltage having positive polarity is output through the terminal 611 . If the anode and cathode of the diode are reversed, the polarity of the output supply voltage can be changed. The anode and cathode of diode 602 connected to terminals 610 and 611 are reversely connected to diode 601 connected to terminals 612 and 613 . This makes it possible to output a voltage close to the ground potential through the terminal 612 and to output a power supply voltage having a negative polarity through the terminal 613 .

Incidentally, various circuits or circuit elements are provided on the device substrate. The power supply voltage supplied to a circuit or circuit element varies in height depending on the type and use of the circuit or circuit element. In the rectifier circuit shown in FIG. 18, the voltage height input to each terminal can be adjusted by adjusting the amplitude of the input AC signal. In addition, the height of the power supply voltage can also be changed by changing the terminal connection.

The rectification circuit used in the present invention is not limited to the half-wave rectification circuit shown in FIG. 18 . The rectification circuit used in the present invention is a circuit capable of generating a DC power supply voltage from an input AC signal.

21A-21B show circuit diagrams of other rectifier circuits having configurations different from those shown in FIG. The rectification circuit shown in FIG. 21A is a voltage doubler full-wave rectification circuit 901 with two diodes 902 and 903 . And the voltage doubler full-wave rectification circuit shown in FIG. 21A has capacitors 904 and 905 . The position and number of capacitors are not limited to those shown in FIG. 21A.

Both the cathode of diode 902 and the anode of diode 903 are connected to one terminal of the secondary coil. If multiple voltage doubler full-wave rectifier circuits 901 are provided and their outputs are added together, the obtained DC voltage can reach twice that of the half-wave rectifier circuit shown in FIG. 18 .

The rectification circuit shown in FIG. 21B is a bridge rectification circuit 911 having four diodes 912, 913, 914 and 915. Four diodes 912, 913, 914 and 915 form a bridge. The bridge rectifier circuit shown in FIG. 21B also has a capacitor 916 . The position and number of capacitors are not limited to those shown in FIG. 21B.

The implementation of this embodiment can be freely combined with Embodiments 1 to 5.

[Example 7]

In this embodiment, a common light-emitting device is taken as an example to explain the test driving signal and power supply voltage in detail.

Fig. 22 shows the construction of an OLED panel for general light emitting devices. Fig. 22 is a diagram illustrating an example of a driving circuit for displaying an image using a light emitting device using a digital video signal. The OLED panel shown in FIG. 22 has a signal line driving circuit 700 , a scanning line driving circuit 701 and a pixel area 702 .

The pixel area 702 is provided with many signal lines, many scanning lines, and many power supply lines. The area surrounded by signal lines, scan lines and power lines corresponds to one pixel. FIG. 22 schematically shows only one pixel having one signal line 707, one scanning line 709 and one power supply line 708 among pixels. Each pixel has a switching TFT 703 as a switching element, a driving TFT 704, a storage capacitor 705, and an OLED pixel electrode 706.

The gate electrode of the switching TFT 703 is connected to the scanning line 709 . One of the source and drain regions of the switching TFT 703 is connected to the signal line 707 , while the other is connected to the gate electrode of the driving TFT 704 .

One of the source and drain regions of the driving TFT 704 is connected to the power supply line 708 and the other is connected to the pixel electrode 706 . The gate electrode of the driving TFT 704 and the power supply line 704 form a storage capacitor 705 . Sometimes it is not necessary to form storage voltage 705 .

The signal line driver circuit 700 has a shift register 710 , a first latch 711 and a second latch 712 . The shift register 710, the first latch 711 and the second latch 712 each have a power supply. At the same time, the clock signal (S-CLK) and the start pulse signal (S-SP) for the signal line driving circuit are supplied to the shift register 710 . A latch signal is provided to the first latch 711 to determine the timing of the latch and video signals.

When the clock signal (S-CLK) and the start pulse signal (S-SP) are input to the shift register 710, a sampling signal used to determine the timing of the sampling video signal is generated and input to the first latch 711 .

The sampling signal from the shift register 710 may be input to the first latch 711 after being buffered-amplified by a buffer or the like. The interconnection point where the sampling signal is input is connected to many circuits or circuit elements, so its load capacitance (parasitic capacitance) is large. The buffer is effective in preventing the leading or trailing edge of the timing signal from being "rolled off" by large load capacitances.

The first latch 711 is a multi-stage latch. The first latch 711 samples the input video signal synchronously with the input sampling signal, and sequentially stores in the latches of each stage.

The reference of the line period is the time required to write a video signal into all stages of latches of the first latch 711 . In practice, this line period in some cases also includes the line period plus the time of one horizontal retrace period.

After finishing one line period, a latch signal is input to the second latch 712 . In this example, the video signal written and held on the first latch 711 is immediately transferred to the second latch 712, and is written and held on all subsequent latches of the second latch 712. device.

A video signal is sequentially written in the first latch 711 having transferred the video signal to the second latch 712 in accordance with the sampling signal from the shift register 710 .

During the second line period, the video signal written and held on the second latch 712 is input to the source signal line.

On the other hand, the scanning line driving circuit 701 has a shift register 721 and a buffer 722 . Power is supplied to the shift register 721 and the buffer 722 . At the same time, the clock signal (G-CLK) and the start pulse signal (G-SP) for the scanning line driving circuit are provided to the shift register 721 .

An AC voltage is applied to the power line 708 .

When the clock signal (G-CLK) and the start pulse signal (G-SP) are input to the shift register 721 , a selection signal for determining the scanning line selection timing is generated and input to the buffer 722 . The selection signal input to the buffer 722 is buffer-amplified and input to the scan line 709 .

The selected scanning line 709 turns on the switching TFT 703 whose gate electrode is connected to the selected scanning line 709 . The video signal input to the signal line is input to the gate electrode of the driving TFT 704 through the turned-on switching TFT 703 .

The switch of the driving TFT 704 is controlled according to information 1 or 0 possessed by the video signal input to the gate electrode. When the driving TFT 704 is turned on, the AC voltage on the power supply line is supplied to the pixel electrode. When the driving TFT 704 is turned off, the AC voltage on the power supply line is not supplied to the pixel electrodes.

In this way, when the signal line driver circuit 700, the scan line driver circuit 701 and the pixel region 702 operate, an AC voltage is applied to the pixel electrode, so that a test electrode 730 including the image will be generated. The AC voltage of prime working information. The pixel operation information is confirmed according to the AC voltage generated on the test electrode 730, and normal/abnormality of the pixel is determined.

In addition, even if a malfunction occurs in the driving circuit and the pixel itself is not defective, the voltage value applied to the pixel electrode changes. This makes it possible to determine the normality/abnormality of the drive circuit.

For the OLED panel shown in FIG. 22, S-CLK, S-SP, G-CLK, G-SP, latch signal and video signal are input to each circuit as test driving signals. However, the test drive signal is not limited to the above-mentioned signals. Any drive-related signal can be used as a test drive signal. For example, in addition to the above-mentioned signals, an input signal may also be used to determine the switching timing of one direction on the scanning line, or a signal for switching the input direction of the scanning line selection signal. However, it is important that the input signal can confirm the working status of the pixel under test, or can determine its normal/abnormality.

In the case of testing a part of the pixels owned by the OLED instead of testing all the pixels, it is sufficient to input only a driving signal for driving only a part of the pixels. It is not necessary to input all of the above-mentioned drive signals.

It is worth noting that if pulse signals of different phases are added together to generate a power supply voltage, the number of primary coils varies with the number of pulse signals to be added.

The testing apparatus and method of the present invention are not limited to OLED panels having the configuration shown in FIG. 22 .

The implementation of this embodiment can be freely combined with Embodiments 1 to 6.

[Example 8]

This embodiment is to explain the formation of a plurality of display substrates using one large-sized substrate by cutting the substrate after testing.

Fig. 23 shows a top view of a large-sized substrate before dicing in this embodiment. 1001 is a pixel area, 1002 is a scanning line driving circuit, and 1003 is a signal line driving circuit. In the area indicated by 1004 there are also circuits or circuit elements that are only used in the test step and are not used after the test is completed, that is, multiple secondary coils, waveform shaping circuits, rectification circuits, special test circuits and so on.

In FIG. 23, the substrate is cut along the lines indicated by dotted lines, and nine display substrates are formed from one substrate. Incidentally, although this embodiment shows an example in which nine display substrates are formed from one substrate, this embodiment is not limited to this number.

Cutting means physically and electrically disconnecting the secondary coils and connectors during the cutting process. In FIG. 23, a region 1004 is provided on the side of the substrate that is not used for a display after dicing.

How to cut a large-sized substrate is explained below using an embodiment different from FIG. 23 . In FIG. 24, 1101 is a pixel area, 1102 is a scanning line driver circuit, and 1103 is a signal line driver circuit. In the area indicated by 1104 there are also circuits or circuit components that are only used in the test step and are not used after the test is completed, that is, multiple secondary coils, waveform shaping circuits, rectification circuits, special test circuits and so on.

In FIG. 24, the substrate is cut along the lines indicated by dashed lines, and nine display substrates are formed from one substrate. Incidentally, although this embodiment shows an example in which nine display substrates are formed from one substrate, this embodiment is not limited to this number.

Note that cutting and disconnecting physically and electrically disconnect the secondary coil and connector during the cutting process. In FIG. 24, a region 1104 is provided on a dicing line of the substrate, and is severed after testing. Since the circuits or circuit elements formed in the region 1194 are no longer needed after testing, the resulting semiconductor device will operate without failure.

After dicing, the waveform shaping circuit or the rectifying circuit can be left on the substrate to be used as a semiconductor device, or left on the substrate not to be used as a semiconductor device. Otherwise, the cut circuit will break.

The implementation of this embodiment can be freely combined with Embodiments 1 to 7.

[Example 9]

This embodiment uses a flowchart to explain the operation sequence in the test steps of the present invention.

Fig. 25 shows a flowchart of the testing procedure of the present invention. First, after the pre-test manufacturing steps are completed, a test power supply voltage or a drive signal voltage is applied to circuits or circuit elements on a device substrate without contact.

As a result, the pixel as the test object is made to perform some operation, and an AC voltage having information on the operation state of the pixel is generated on the test electrode overlapping the pixel. This AC voltage is monitored multiple times while changing the position of the test electrodes.

The working state of the pixel is confirmed based on the AC voltage generated on the test electrode, and the normal/abnormality of the pixel is determined. The working status of the pixels does not have to be screened into normal and abnormal, but can also be screened into multiple levels according to the working status.

At the same time, professionals can also correctly set the determination standard of normal/abnormal pixels. In the case that some pixels are determined to be abnormal, professionals can also correctly set how to determine whether the device substrate can be used. An abnormality can be determined even if there is one abnormal pixel, or an abnormality can be determined when the abnormal pixel reaches a certain number.

In the case that it is determined to be normal, it is considered to end the test and start the assembly step after the test step.

If it is determined that there is an abnormality, it is selected to remove (abandon) from the unfinished step of the product, or to determine the cause of the abnormality. If you are making multiple products from a large substrate, you can cut the substrate before discarding it.

If it is determined that there is an abnormality and it is possible to repair, the above-mentioned operations can be repeated after the repair to perform the testing steps of the present invention again. Conversely, if it is determined that maintenance is impossible, give up at this time.

The implementation of this embodiment can be freely combined with Embodiments 1 to 8.

[Example 10]

This embodiment is to explain the specific connection manner between the coil used in the present invention, the terminals possessed by the coil, and an interconnection point (coil interconnection point).

In FIG. 26A, a coil 1601 is formed on an insulating surface, and an interlayer insulating film 1603 is formed to cover the coil 1601 on the insulating surface. A contact hole is formed in the interlayer insulating film, and a coil interconnection point 1602 connected to the coil 1601 is formed on the interlayer insulating film through the contact hole.

Fig. 26B shows a cross-sectional view along the chain line C-C' in Fig. 26A.

In FIG. 26C, coil interconnection points 1612 are formed on one insulating surface. An interlayer insulating film 1613 is formed to cover the coil interconnection point 1612 on the insulating surface. A contact hole is formed in the interlayer insulating film, and a coil 1611 connected to a coil interconnection point 1612 is formed on the interlayer insulating film through the contact hole.

Fig. 26D shows a cross-sectional view along the dashed-dotted line D-D' in Fig. 26C.

The manufacturing method of the coil employed in the present invention is not limited to the above-mentioned method. A kind of swirl groove can be formed by patterning an insulating film. A conductive film is formed to cover the groove on the insulating film. The conductive film is then ground by etching or CMP until the insulating film is exposed, leaving only the conductive film in the groove. The conductive film left in the groove can be used as a coil.

The implementation of this embodiment can be freely combined with Embodiments 1 to 8.

[Example 11]

This embodiment will explain how to use the Walsh function in Embodiment Mode 1 to perform a test to determine whether each pixel works normally.

The case described in this embodiment is a light emitting device having 4*4 pixels. Sixteen function sets W ₀₀ (4,4) to W ₃₃ (4,4) (hereinafter abbreviated as W ₀₀ and W ₃₃ ) are determined for a light emitting device having 4×4 pixels.

Fig. 27 specifically shows the position of each pixel operated by these function groups _W00 and _W33 . The voltage values applied to the test electrodes are different between the pixels shown blank and the pixels shown shaded.

If these pixels are sequentially manipulated with the function groups W ₀₀ and W ₃₃ , the number of 4x4 pixels are different from each other in operation. Therefore, even if the test electrodes are overlapped with the pixels having the same scanning line, it can be determined by testing whether each pixel operates normally.

For example, take the pixel on the first line as an example, in the pixel (1, 1), assuming that 0 is used to represent a blank pixel, and X is used to represent a shaded pixel, all cases are 0. Taking the pixel (2, 1) as an example, it can be represented as 00XX00XX00XX00XX in sequence. Pixel (3, 1) can be represented as 0XX00XX00XX00XX0 in sequence. Pixel (4, 1) can be represented as 0X0X0X0X0X0X0X in sequence.

If all pixels are working properly, the number of 0s in the pixels on the first line can be expressed in order as 4, 2, 2, 2, 4, 2, 2, 2, 4, 2, 2 according to the respective functions , 2, 4, 2, 2, 2. If the pixel (2, 1) does not work properly, so that it always shows a shadow, the number of 0s in the pixel on the first line can be expressed in order as 3, 1, 2, 2, 3 according to the respective functions, 1, 2, 2, 3, 1, 2, 2, 3, 1, 2, 2. Thus, by comparing the cases where all the pixels are operating normally, it can be determined that the pixel (2, 1) is not operating normally.

Although the present embodiment uses a two-dimensional Walsh function, it is also possible to use a one-dimensional Walsh function to operate each pixel. In this case, four function groups can be used to test the operation state of the above-mentioned light emitting device having 4*4 pixels.

The implementation of this embodiment can be freely combined with Embodiments 1 to 9.

The present invention can determine normality/abnormality of a pixel as a test object by adopting the above structure without directly using probes on interconnection points or probe terminals. This prevents the yield of subsequent processing from being reduced by fine dust caused by the use of the probe. In addition, since normality/abnormality in each pattern forming step can be determined with one test step, the test step can be simplified.

Claims (41)

1. A method of measuring voltage comprising: Applying a voltage without contact to interconnect points or circuit elements possessed by a pixel, thereby applying a voltage to the pixel electrode of the pixel; and The voltage applied to the pixel electrode is read out without contact. 2. A method of measuring voltage comprising: applying a voltage to respective interconnection points or circuit elements of the plurality of pixels without contact, thereby applying the voltage to respective pixel electrodes of the pixels; and The sum of the voltages applied to the respective pixel electrodes of each pixel is read without contact. 3. A method of measuring voltage comprising: applying a first alternating voltage between two terminals of the first coil; overlapping the first coil and the second coil with a fixed interval; applying a third alternating voltage to a pixel electrode of a pixel using a second alternating voltage generated between two terminals of the second coil; overlapping the pixel electrode and the test electrode by a fixed interval; and The voltage applied to the pixel electrode is calculated based on the fourth AC voltage generated on the test electrode. 4. A method according to claim 3, characterized in that rectification or waveform shaping is performed on the second AC voltage and applied to interconnect points or circuit elements in the pixel, whereby a third AC voltage is applied to the pixel electrodes . 5. A method of measuring voltage comprising: applying a first alternating voltage between two terminals of the first coil; overlapping the first coil and the second coil with a fixed interval; applying a third alternating voltage to respective pixel electrodes of the plurality of pixels by using a second alternating voltage generated between two terminals of the second coil; overlapping the pixel electrodes of the pixels with a test electrode at a fixed interval; and The sum of the voltages applied to the respective pixel electrodes of each pixel is calculated based on the fourth AC voltage generated on the test electrode. 6. The method according to claim 5, characterized in that rectification or waveform shaping is performed on the second AC voltage, and applied to respective interconnection points or circuit elements of a plurality of pixels, whereby a third AC voltage is applied to the plurality of pixels. on the respective pixel electrodes of the pixels. 7. A method according to claim 3 or 5, characterized in that the first coil and the second coil have interconnection points formed on the same plane, and The interconnected points therein form a spiral shape. 8. according to the method for claim 3 or 5, it is characterized in that the first coil and test electrode are formed on the first insulating surface, And the second coil and the pixel electrode are formed on the second insulating surface. 9. A method according to claim 8, characterized in that the spacing between the first insulating surface and the second insulating surface is controlled by a fluid flowing between the first insulating surface and the second insulating surface. 10. A method according to claim 3 or 5, characterized in that the normal/abnormality of the or each pixel is determined using the voltage or the sum of the voltages applied to the pixel electrodes obtained by the voltage measurement method. 11. An apparatus for performing electrical testing on pixels of a semiconductor device, the electrical testing apparatus comprising: Primary coil; A device that overlaps a primary coil and a secondary coil in a semiconductor device at a fixed interval; means for overlapping the pixel electrode of a pixel with a test electrode at a fixed interval; means for applying an alternating voltage between the two terminals of the primary coil; and A device for confirming the working state of the pixel based on the alternating voltage generated on the test electrode. 12. A device according to claim 11, characterized in that the alternating voltage generated on the test electrodes includes information on the operating state of the pixels. 13. Apparatus according to claim 11, characterized in that the spacing between the primary coil and the secondary coil is controlled by a fluid flowing between the primary coil and the secondary coil. 14. The device according to claim 11, characterized in that the first coils have interconnection points formed on the same plane, and The interconnected points therein form a spiral shape. 15. A method of manufacturing a semiconductor device, the method comprising: forming a pixel electrode and an interconnect or circuit element; applying a voltage to the interconnection point or circuit element without contact, thereby applying the voltage to the pixel electrode; and The voltage applied to the pixel electrodes is read out without contact. 16. A method of manufacturing a semiconductor device, the method comprising: forming a pixel electrode, an interconnect or circuit element, the first coil, and the second coil; applying a first alternating voltage between two terminals of the first coil; overlapping the first coil and the second coil with a fixed interval; applying a third alternating voltage to the pixel electrode using a second alternating voltage generated between two terminals of the second coil; overlapping the pixel electrode and a test electrode by a fixed interval; and The voltage applied to the pixel electrode is calculated based on the fourth AC voltage generated on the test electrode. 17. A method according to claim 16, characterized in that rectification or waveform shaping is carried out on the second alternating voltage and applied to interconnection points or circuit elements so that the third alternating voltage is applied to the pixel electrodes. 18. A method of measuring voltage, the method comprising: Applying a voltage to an interconnect or circuit element controls the voltage applied to multiple pixel electrodes; moving a test electrode in a state of overlapping with at least a part of the pixel electrode through a gap; and The voltage applied to each pixel electrode is calculated according to the voltage on the test electrode and the position of the test electrode relative to the pixel electrode. 19. A method according to claim 18, characterized in that the voltage is applied to the interconnection points or circuit elements without contact. 20. A method of measuring voltage, the method comprising: applying a first alternating voltage between two terminals of the first coil; overlapping the first coil and the second coil by a gap; applying a second alternating voltage generated between two terminals of the second coil to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes; moving a test electrode in a state of overlapping with at least a part of the pixel electrode through a gap; and The voltage applied to each pixel electrode is calculated according to the third AC voltage generated on the test electrode and the position of the test electrode relative to the pixel electrode. 21. A method according to claim 20, characterized by performing rectification or waveform shaping on the second alternating voltage and applying it to the interconnection point or circuit element, whereby the second alternating voltage voltage is applied to the interconnection point or circuit element. 22. The method according to claim 20, characterized in that the first coil and the second coil have interconnection points formed on the same plane, and The interconnected points therein form a spiral shape. 23. The method of claim 20, wherein the spacing between the first coil and the second coil is controlled by a fluid flowing between the first coil and the second coil. 24. A method according to claim 18 or 20, characterized in that the voltages on the individual pixel electrodes are calculated using the Fourier transform method with continuous approximation and the projective segmentation rule or an overlapping integral method. 25. A method of electrical testing comprising: Applying a voltage to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes; moving a test electrode in a state of overlapping with at least a part of the pixel electrode through a gap; and The operational status of interconnect points or circuit elements is confirmed based on the voltage on the test electrode and the position of the test electrode relative to the pixel electrode. 26. A method according to claim 25, characterized in that the voltage is applied to interconnection points or circuit elements without contact. 27. A method of electrical testing comprising: Applying a voltage to an interconnection point or circuit element for controlling the voltage applied to a plurality of pixel electrodes; moving a test electrode in a state of overlapping with at least a part of the pixel electrode through a gap; and The distribution of the voltage applied to the pixel electrode is determined based on the voltage on the test electrode and the position of the test electrode relative to the pixel electrode. 28. A method according to claim 27, characterized in that the voltage is applied to the interconnection points or circuit elements without contact. 29. The method of claim 27, further comprising determining the operating state of the interconnection point or circuit element based on the voltage distribution. 30. A method of electrical testing comprising: applying a first alternating voltage between two terminals of the first coil; overlapping the first coil and the second coil by a gap; applying a second alternating voltage generated between two terminals of the second coil to an interconnection point or circuit element for controlling the voltage applied to the plurality of pixel electrodes; moving a test electrode in a state of overlapping with at least a part of the pixel electrode through a gap; and The operation state of the interconnection points or circuit elements is confirmed based on the third AC voltage generated on the test electrode and the position of the test electrode relative to the pixel electrode. 31. The method according to claim 30, further comprising: determining the distribution of voltages applied to the pixel electrodes according to the third AC voltage, In it, the operating state of interconnection points or circuit elements is confirmed based on the voltage distribution. 32. A method according to claim 30, characterized in that rectification or wave shaping is performed on the second alternating voltage and applied to the interconnection point or circuit element, thereby being applied to the interconnection point or circuit element. 33. The method according to claim 30, wherein the first coil and the second coil have interconnection points formed on the same plane, and Each interconnection point therein takes the shape of a swirl. 34. The method of claim 30, wherein the spacing between the first coil and the second coil is controlled by fluid flowing between the primary coil and the secondary coil. 35. An apparatus for electrically testing a plurality of pixels in a device substrate, the electrical testing apparatus comprising: Primary coil; means for overlapping the primary coil and the secondary coil in the device substrate through a gap; means for overlapping at least a portion of the pixel electrodes of the pixels with a test electrode via a spacer; means for changing the position of the test electrodes relative to the pixel electrodes of the pixels; means for applying an alternating voltage between the two terminals of the primary coil; and A device for confirming the working status of each pixel based on the AC voltage generated on the test electrode. 36. The device according to claim 35, characterized in that The position of the test electrode relative to the pixel electrode is changed in a state where a part of the pixel electrode of each pixel overlaps the test electrode through a gap. 37. Apparatus according to claim 35, characterized in that the spacing between the primary coil and the secondary coil is controlled by a fluid flowing between the primary coil and the secondary coil. 38. The device according to claim 35, wherein the first coils have interconnection points formed on the same plane, and The interconnected points therein form a spiral shape. 39. A method of manufacturing a semiconductor device comprising: forming an interconnection point or circuit element, and a pixel electrode capable of supplying a voltage through the interconnection point or circuit element; Apply a voltage to an interconnection point or circuit element; moving a test electrode in a state of overlapping with at least a part of the pixel electrode through a gap; and The voltage applied to the respective pixel electrode of each pixel due to the voltage applied to each pixel electrode is calculated according to the voltage on the test electrode and the position of the test electrode relative to the pixel electrode. 40. A method according to claim 39, characterized in that the voltage is applied to interconnection points or circuit elements without contact. 41. The method of claim 39, wherein the semiconductor device comprises a device substrate.

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