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CN1385359A - Carbon nano tube film micromechanical infrared detector - Google Patents

Carbon nano tube film micromechanical infrared detector Download PDF

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CN1385359A
CN1385359A CN 02114434 CN02114434A CN1385359A CN 1385359 A CN1385359 A CN 1385359A CN 02114434 CN02114434 CN 02114434 CN 02114434 A CN02114434 A CN 02114434A CN 1385359 A CN1385359 A CN 1385359A
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carbon nanotube
silicon
pick
nanotube film
infrared detector
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CN1186247C (en
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刘君华
梁晋涛
朱长纯
韩建强
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Xian Jiaotong University
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Abstract

本发明公开了一种结构简单,具有极高的分辨率和宽光谱响应范围,灵敏度高,成本低,工艺简单的碳纳米管薄膜微机械红外探测器,包括一定基底材料的微机械,拾取电路,微机械谐振器上生长一层碳纳米管薄膜,作为光辐射吸收材料,由于碳纳米管薄膜对红外辐射的吸收系数η可达0.98,从而使其具有高的灵敏度和小的噪声等效功率,以提高该类探测器的探测能力。微谐振器通过MEMS加工工艺制成,可进行批量生产,从而降低器件的成本。The invention discloses a carbon nanotube thin-film micromechanical infrared detector with simple structure, high resolution, wide spectral response range, high sensitivity, low cost and simple process, including micromechanics of a certain base material, and a pick-up circuit. , a layer of carbon nanotube film is grown on the micromechanical resonator. As a light radiation absorbing material, the absorption coefficient η of the carbon nanotube film to infrared radiation can reach 0.98, so that it has high sensitivity and small noise equivalent power. , in order to improve the detection ability of this kind of detector. The microresonator is made by MEMS processing technology, which can be mass-produced, thereby reducing the cost of the device.

Description

碳纳米管薄膜微机械红外探测器Carbon Nanotube Thin Film Micromachined Infrared Detector

一、所属领域1. Field

本发明涉及一种红外探测器,特别涉及一种在一定材料的基底上制作微机械,并在其上生长碳纳米管薄膜的碳纳米管薄膜微机械红外探测器。The invention relates to an infrared detector, in particular to a carbon nanotube film micromechanical infrared detector on which a micromachine is made on a substrate of a certain material and a carbon nanotube film is grown on it.

二、背景技术2. Background technology

红外探测在现代科学中起着重要作用,各种红外探测器广泛应用于成像、跟踪、制导、侦察、预警、遥感、弱信号探测、辐射测量、自动控制和激光探测等许多方面。Infrared detection plays an important role in modern science. Various infrared detectors are widely used in many aspects such as imaging, tracking, guidance, reconnaissance, early warning, remote sensing, weak signal detection, radiation measurement, automatic control and laser detection.

由于探测机理的不同,红外探测器目前主要有两大类:光子探测器和热探测器。常见的光子探测器有光电子发射探测器、光电导探测器、光伏探测器、光磁电探测器等。常见的热探测器有热敏电阻测辐射热器、测辐射热电偶和热电堆、气动探测器、热释电探测器等。热释电探测器是根据热释电效应工作的一类新型红外探测器。与光子探测器相比,热释电探测器光谱响应宽;与热电阻、热电偶和热电堆等构成的热探测器相比其频响快,具有可从十几赫兹低频到上千赫兹高频的很宽频率响应特性,甚至可以制成响应时间小于微秒级的快速热释电探测器。通常它与场效应晶体管阻抗变换器组装在一起,其结构如图1所示。其中101为探测器,102为场效应晶体管,103为源极电阻,输出信号由源极电阻103两端引出。104和105分别为场效应晶体管阻抗变换器的输入电阻和输入电容。Due to the different detection mechanisms, there are two main types of infrared detectors: photon detectors and thermal detectors. Common photon detectors include photoelectron emission detectors, photoconductive detectors, photovoltaic detectors, and photomagnetoelectric detectors. Common thermal detectors include thermistor bolometers, radiance thermocouples and thermopiles, pneumatic detectors, pyroelectric detectors, etc. Pyroelectric detectors are a new type of infrared detectors that work according to the pyroelectric effect. Compared with photon detectors, pyroelectric detectors have a wider spectral response; compared with thermal detectors composed of thermal resistors, thermocouples, and thermopiles, their frequency response is faster, and they can range from low frequencies of more than ten Hz to thousands of Hz. The wide frequency response characteristics of the frequency can even be made into a fast pyroelectric detector with a response time of less than microseconds. Usually it is assembled together with field effect transistor impedance converter, and its structure is shown in Fig. 1. 101 is a detector, 102 is a field effect transistor, 103 is a source resistor, and the output signal is drawn from both ends of the source resistor 103 . 104 and 105 are the input resistance and input capacitance of the field effect transistor impedance converter respectively.

热释电探测器的缺点在于:1、由于受材料限制灵敏度较低。2、体积较大。3、在较高频率下,由于介电损耗随频率上升而增加,远不能达到理想的性能。4、成本较高。The disadvantages of pyroelectric detectors are: 1. The sensitivity is low due to material limitations. 2. Large volume. 3. At higher frequencies, due to the increase in dielectric loss as the frequency rises, the ideal performance is far from being achieved. 4. Higher cost.

三、发明内容3. Contents of the invention

根据上述现有技术部分存在的缺陷或不足,本发明的目的是提供一种结构简单,具有极高的分辨率和宽光谱响应范围,灵敏度高,成本低,工艺简单的碳纳米管薄膜微机械红外探测器。According to the partial defects or deficiencies in the prior art, the purpose of the present invention is to provide a carbon nanotube thin film micromachine with simple structure, high resolution and wide spectral response range, high sensitivity, low cost and simple process. Infrared Detectors.

为了实现上述目的,本发明的设计机理是:微机械谐振器在光辐射照射时出现热挠曲,其力学结构固有振荡频率fo(或角频率wo=2πfo)发生变化,通过测量热挠曲(静态)或测量fo(动态)实现对辐射光强的探测。In order to achieve the above object, the design mechanism of the present invention is: thermal deflection occurs when the micromechanical resonator is irradiated by light radiation, and the natural oscillation frequency f o (or angular frequency w o =2πf o ) of its mechanical structure changes. By measuring the thermal Deflection (static) or measurement of f o (dynamic) enables the detection of radiant light intensity.

所采用的技术方案是:碳纳米管薄膜微机械红外探测器,包括一定基底材料的微机械1,拾取电路3,在微机械1上生长有碳纳米管薄膜2;The technical solution adopted is: a carbon nanotube film micromachine infrared detector, including a micromachine 1 of a certain base material, a pick-up circuit 3, and a carbon nanotube film 2 grown on the micromachine 1;

微机械1是指微谐振器件,可以是微悬臂梁、微桥和微膜(方膜或圆膜)等;Micromachinery 1 refers to microresonant devices, which can be microcantilever beams, microbridges, and micromembranes (square or round membranes);

微机械谐振器包括基座4、辐射窗口5、电源6、电源连线7和电源连线8以及输出信号连线9和输出信号连线10;The micromechanical resonator includes a base 4, a radiation window 5, a power supply 6, a power supply connection 7 and a power supply connection 8, and an output signal connection 9 and an output signal connection 10;

拾取方法可以是电拾取,也可以是光拾取,电拾取一般是利用硅的压阻效应,在微机械谐振器上制作压敏电阻,与设计的检测电路相连,通过器件谐振时压敏电阻的阻值变化来测试器件的谐振特性;光拾取通常是利用光纤传感器技术实现微机械谐振器的振动测量。The pick-up method can be electrical pick-up or optical pick-up. Electric pick-up generally uses the piezoresistive effect of silicon to make a piezoresistor on a micromechanical resonator and connect it to the designed detection circuit. When the device resonates, the piezoresistor The resistance value change is used to test the resonance characteristics of the device; the optical pickup is usually used to realize the vibration measurement of the micromechanical resonator by using the fiber optic sensor technology.

本发明的其他一些特点是,所述基底材料选用一般的半导体材料,如硅、二氧化硅、氮化硅。Some other features of the present invention are that the base material is selected from common semiconductor materials, such as silicon, silicon dioxide, and silicon nitride.

所述碳纳米管薄膜2,既可以通过催化热解法、CVD法直接生长于基底上,也可以通过电泳、涂敷、印刷等移植法成形于基底上。The carbon nanotube film 2 can be directly grown on the substrate by catalytic pyrolysis or CVD, or can be formed on the substrate by implantation methods such as electrophoresis, coating, and printing.

所述拾取电路3是利用硅的压阻效应,将四个压敏电阻连接成惠斯通电桥形式。The pick-up circuit 3 utilizes the piezoresistive effect of silicon and connects four piezoresistors in the form of a Wheatstone bridge.

微机械谐振器上生长一层碳纳米管薄膜,作为光辐射吸收材料,由于碳纳米管薄膜对红外辐射的吸收系数η可达0.98,从而使其具有高的灵敏度和小的噪声等效功率,以提高该类探测器的探测能力。A carbon nanotube film is grown on the micromechanical resonator as an optical radiation absorbing material. Since the absorption coefficient η of the carbon nanotube film to infrared radiation can reach 0.98, it has high sensitivity and small noise equivalent power. In order to improve the detection ability of this type of detector.

微机械谐振器通过MEMS加工工艺制成,可进行批量生产,从而降低器件的成本。Micromechanical resonators are manufactured through MEMS processing technology, which can be mass-produced, thereby reducing the cost of the device.

四、附图说明4. Description of drawings

图1热释电探测器原理示意图;Fig. 1 schematic diagram of pyroelectric detector principle;

图2本发明一个实施例的碳纳米管薄膜硅微悬臂梁谐振器结构图;Fig. 2 structure diagram of the carbon nanotube thin film silicon micro-cantilever resonator of one embodiment of the present invention;

图3本发明一个实施例的碳纳米管薄膜硅微悬臂梁红外探测器整体结构示意图。Fig. 3 is a schematic diagram of the overall structure of a carbon nanotube film silicon micro-cantilever infrared detector according to an embodiment of the present invention.

五、具体实施方式5. Specific implementation

下面结合附图和实施例对本发明作进一步详细说明,但并不限于该实施例。The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments, but is not limited to the embodiments.

实施例:参见图2、图3,图2是碳纳米管薄膜硅微悬臂梁谐振器结构图,包括半导体基底材料1和生长于其上的碳纳米管薄膜2,以及拾取电路3。图3是碳纳米管薄膜硅微悬臂梁红外探测器整体结构示意图,包括基座4、辐射窗口5、电源6、电源连线7、电源连线8以及输出信号连线9、输出信号连线10。Embodiment: Refer to Fig. 2 and Fig. 3, Fig. 2 is a structural diagram of a carbon nanotube thin film silicon micro-cantilever beam resonator, including a semiconductor base material 1 and a carbon nanotube thin film 2 grown thereon, and a pick-up circuit 3 . Figure 3 is a schematic diagram of the overall structure of a carbon nanotube thin-film silicon micro-cantilever infrared detector, including a base 4, a radiation window 5, a power supply 6, a power supply connection 7, a power supply connection 8, and an output signal connection 9 and an output signal connection 10.

微机械1是指微机械谐振器件,可以是微悬臂梁、微桥和微膜(方膜或圆膜)等。Micromachine 1 refers to micromechanical resonant devices, which can be microcantilever beams, microbridges, and micromembranes (square membranes or circular membranes), etc.

拾取方法可以是电拾取,也可以是光拾取。电拾取一般是利用硅的压阻效应,在硅微机械谐振器上制作压敏电阻,与设计的检测电路相连,通过器件谐振时压敏电阻的阻值变化来测试器件的谐振特性。光拾取通常是利用光纤传感器技术实现硅微机械谐振器的振动测量。The pickup method can be electrical pickup or optical pickup. Electric pick-up generally uses the piezoresistive effect of silicon to make a piezoresistor on a silicon micromechanical resonator, connect it to the designed detection circuit, and test the resonance characteristics of the device by changing the resistance of the piezoresistor when the device resonates. Optical pickup is typically implemented using fiber optic sensor technology for vibration measurement of silicon micromechanical resonators.

本发明按照下述常规工艺制备The present invention is prepared according to the following conventional processes

1、微悬臂梁1的制作1. Fabrication of micro-cantilever beam 1

微悬臂梁是将半导体材料如硅、二氧化硅、氮化硅等为基底材料,加工成微悬臂梁谐振器的微悬臂梁结构,本实施例中基底材料选用硅。当然,二氧化硅、氮化硅等都能作为基底材料实现微悬臂梁结构或微桥和微膜(方膜或圆膜)结构。The micro-cantilever is a micro-cantilever structure in which semiconductor materials such as silicon, silicon dioxide, and silicon nitride are used as base materials to form a micro-cantilever resonator. In this embodiment, the base material is silicon. Of course, silicon dioxide, silicon nitride, etc. can be used as base materials to realize micro-cantilever beam structure, micro-bridge and micro-membrane (square or round membrane) structure.

2、拾取电路3的制作2. Fabrication of pickup circuit 3

拾取电路是利用硅的压阻效应,将四个压敏电阻连接成惠斯通电桥形式。本实施例用半导体材料硅正面扩硼形成压敏电阻,利用铝连线版反刻铝,形成金属连线,利用金丝球型压焊的方法引出连线。The pick-up circuit uses the piezoresistive effect of silicon to connect four piezoresistors into a Wheatstone bridge. In this embodiment, the varistor is formed by expanding boron on the front side of the semiconductor material silicon, and the aluminum connection plate is used to reverse-engrave the aluminum to form the metal connection, and the connection is led out by the method of gold wire ball pressure welding.

3、碳纳米管薄膜2的制备3. Preparation of carbon nanotube film 2

对前述步骤中的硅基底材料的背面进行清洗处理,分别用丙酮、酒精、去离子水进行超声波清洗,然后,可以利用许多方法生长碳纳米管。如催化热解法、CVD法直接生长于基底材料上,也可以通过电泳、涂敷、印刷等移植法成形于基底材料上。The backside of the silicon base material in the preceding steps is cleaned by ultrasonic cleaning with acetone, alcohol, and deionized water, and then carbon nanotubes can be grown by many methods. Such as catalytic pyrolysis method, CVD method directly grow on the base material, and can also be formed on the base material by electrophoresis, coating, printing and other transplantation methods.

4、仪器装配4. Instrument assembly

在完成上述步骤后,就获得了碳纳米管薄膜硅微悬臂梁红外探测器,并将其固定于基座上,如图3所示,便可进行红外探测。After the above steps are completed, the carbon nanotube thin film silicon micro-cantilever infrared detector is obtained, and fixed on the base, as shown in Figure 3, the infrared detection can be performed.

Claims (4)

1、一种碳纳米管薄膜微机械红外探测器,其特征在于:包括一定基底材料的微机械[1],拾取电路[3],在微机械[1]上生长有碳纳米管薄膜[2];1. A carbon nanotube film micromechanical infrared detector, characterized in that: a micromachine [1] comprising a certain substrate material, a pick-up circuit [3], and a carbon nanotube film [2] grown on the micromachine [1] ]; 微机械[1]是指微谐振器件,可以是微悬臂梁、微桥和微膜等;Micromachinery [1] refers to microresonant devices, which can be microcantilever beams, microbridges, and micromembranes, etc.; 微机械谐振器包括基座[4]、辐射窗口[5]、电源[6]、电源连线[7]和电源连线[8]以及输出信号连线[9]和输出信号连线[10];The micromechanical resonator includes a base [4], a radiation window [5], a power supply [6], a power connection [7] and a power connection [8], and an output signal connection [9] and an output signal connection [10 ]; 拾取方法可以是电拾取,也可以是光拾取,电拾取一般是利用硅的压阻效应,在硅微谐振器上制作压敏电阻,与设计的检测电路相连,通过器件谐振时压敏电阻的阻值变化来测试器件的谐振特性;光拾取通常是利用光纤传感器技术实现硅微谐振器的振动测量。The pick-up method can be electrical pick-up or optical pick-up. Electric pick-up generally uses the piezoresistive effect of silicon to make a piezoresistor on a silicon microresonator and connect it to the designed detection circuit. When the device resonates, the piezoresistor The resistance value change is used to test the resonance characteristics of the device; the optical pickup is usually used to realize the vibration measurement of the silicon microresonator by using the fiber optic sensor technology. 2、根据权利要求1所述碳纳米管薄膜微机械红外探测器,其特征在于:所述基底材料选用一般的半导体材料,如硅、二氧化硅、氮化硅。2. The carbon nanotube film micromechanical infrared detector according to claim 1, characterized in that: the base material is selected from common semiconductor materials, such as silicon, silicon dioxide, and silicon nitride. 3、根据权利要求1所述碳纳米管薄膜微机械红外探测器,其特征在于:所述碳纳米管薄膜[2],既可以通过催化热解法、CVD法直接生长于基底上,也可以通过电泳、涂敷、印刷等移植法成形于基底上。3. The carbon nanotube film micromechanical infrared detector according to claim 1, characterized in that: the carbon nanotube film [2] can be directly grown on the substrate by catalytic pyrolysis or CVD, or can be Formed on the substrate by electrophoresis, coating, printing and other implantation methods. 4.根据权利要求1所述碳纳米管薄膜微机械红外探测器,其特征在于:所述拾取电路[3]是利用硅的压阻效应,将四个压敏电阻连接成惠斯通电桥形式。4. according to the described carbon nanotube film micromachine infrared detector of claim 1, it is characterized in that: described pick-up circuit [3] utilizes the piezoresistive effect of silicon, and four piezoresistors are connected into Wheatstone bridge form .
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100411969C (en) * 2003-08-20 2008-08-20 台达电子工业股份有限公司 Detection method of micro-mechanical structure, micro-electromechanical component and micro-detection structure thereof
CN100425524C (en) * 2006-01-13 2008-10-15 中国科学院上海微系统与信息技术研究所 Silicon micromachined cantilever drive structure, fabrication method and application
CN100448771C (en) * 2005-11-02 2009-01-07 北京大学 A Method for Predicting the Mechanical Properties of Microstructures
CN101439841B (en) * 2008-12-25 2011-07-27 中国传媒大学 Non-refrigeration infrared image sensor chip and preparation thereof
CN101656298B (en) * 2008-08-19 2012-06-13 鸿富锦精密工业(深圳)有限公司 Infrared detector
TWI427277B (en) * 2008-08-29 2014-02-21 Hon Hai Prec Ind Co Ltd Infrared detector
CN109052306A (en) * 2017-07-12 2018-12-21 迈瑞迪创新科技有限公司 Expansible thermoelectric (al) type infrared detector
CN111157149A (en) * 2020-01-03 2020-05-15 天津大学 Device and method for measuring optical pressure value based on resonance excitation of micro-cantilever beam

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100411969C (en) * 2003-08-20 2008-08-20 台达电子工业股份有限公司 Detection method of micro-mechanical structure, micro-electromechanical component and micro-detection structure thereof
CN100448771C (en) * 2005-11-02 2009-01-07 北京大学 A Method for Predicting the Mechanical Properties of Microstructures
CN100425524C (en) * 2006-01-13 2008-10-15 中国科学院上海微系统与信息技术研究所 Silicon micromachined cantilever drive structure, fabrication method and application
CN101656298B (en) * 2008-08-19 2012-06-13 鸿富锦精密工业(深圳)有限公司 Infrared detector
TWI427277B (en) * 2008-08-29 2014-02-21 Hon Hai Prec Ind Co Ltd Infrared detector
CN101439841B (en) * 2008-12-25 2011-07-27 中国传媒大学 Non-refrigeration infrared image sensor chip and preparation thereof
CN109052306A (en) * 2017-07-12 2018-12-21 迈瑞迪创新科技有限公司 Expansible thermoelectric (al) type infrared detector
CN109052306B (en) * 2017-07-12 2023-07-04 迈瑞迪创新科技有限公司 Expandable thermoelectric infrared detector
CN111157149A (en) * 2020-01-03 2020-05-15 天津大学 Device and method for measuring optical pressure value based on resonance excitation of micro-cantilever beam

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