CN1381904A - Package of LED chip and its light-gathering lens - Google Patents

Abstract

The invention discloses a package of light-emitting diode chips, which comprises a printed circuit board base material with a conductor layer and an electrode, both located on one side of the printed circuit board base material; a light-emitting diode chip arranged on the conductor layer, It also has a wire connected to the electrode; a condenser lens, approximately in the shape of a short column, which is connected to the base material of the printed circuit board at the position corresponding to the light emitting diode chip. The opposite ends of the condenser lens have a concave curved surface and a convex curved surface respectively, the concave curved surface is close to and faces the light-emitting diode chip, and the convex curved surface is away from the light-emitting diode chip and approximately parallel to the concave curved surface. A distance is maintained between the concave curved surface and the LED chip.

Description

Encapsulation of light-emitting diode chip and its condenser lens

The invention relates to a package of light-emitting diode chips, and in particular to a package method in which a condenser lens is arranged on the light-emitting diode chip.

Because light emitting diodes (Light Emitting Diode, LED) have a long service life and low power consumption characteristics. Therefore, the application of light-emitting diodes is becoming more and more popular, such as large electronic display screens, traffic lights and direction lights. The current light-emitting diode industry is moving towards the goal of high brightness and low light loss, so that light-emitting diodes can replace traditional lighting appliances. However, in order to increase the brightness of LEDs and reduce their light loss, in addition to improving the structure of LEDs, the uniformity and light-gathering ability of the colloid coated outside after packaging are also to increase the brightness of LEDs and reduce their light loss. key. At present, advanced countries in the world have actively developed the optoelectronic material industry, especially the upstream high-level chip manufacturing technology is changing with each passing day, but the colloid uniformity and light-gathering ability after packaging still need to be improved.

Please refer to FIG. 1 , which is a cross-sectional view of a known LED chip package. The conductive support 100 has a main support 102 and a sub-support 104. In addition, an LED chip 106 is disposed on the chip holder 108 of the main support 102, and is electrically connected to the light-emitting diode chip 106 and the sub-support 104 through a wire 110. At the top, put the above-mentioned conductive support 100, light-emitting diode chip 106 and wire 110 into a mold with the shape of colloid 112, and expose part of the conductive support 100, and then pour glue into the mold, and after cooling and forming , pull out the conductive bracket 100 to obtain a known package of light emitting diode chips.

To illustrate the light traveling route of the package body of the LED chip, please refer to FIG. 2 , which is a simplified schematic diagram of FIG. 1 . Only the LED chip 106 and the colloid 112 are shown in the figure. The LED chip 106 can be regarded as a point light source and emits light 116 , 120 . The light 116 is refracted by the spherical surface 114 and passes through the focal point 118 ; while the light 120 is also refracted by the spherical surface 114 and passes through the focal point 118 . In this way, the light rays 116 and 118 emitted by the LED chip 106 are all collected at the focal point 118 and then diverged, so as to increase the brightness. In addition, if the distance between the LED chip 106 and the spherical surface 114 is changed, the position of the focal point 118 will be correspondingly changed. Since the LED chip 106 emits light in a radial manner, part of the light will be scattered through the side of the colloid 112 and will not be refracted from the spherical surface 114 , thereby reducing its brightness.

Please also refer to FIG. 2 , because in the known LED chip package, when glue is poured to form the colloid 112 , the filled material colloid is easily affected by the wire support 100 , so that the material density of the colloid 112 is uneven. When light passes through the same medium, if the density of the medium is not uniform, the phenomenon of light refraction will occur. Therefore, when the density of the material of the colloid 112 is uneven, the light 122 emitted from the LED chip 106 will undergo light refraction when passing through the interior of the colloid 112 with different densities, so that the light 122 will pass through the spherical surface 114. After refraction, it is out of focus 118 .

According to the above, when the internal density of the above-mentioned colloid 112 is not uniform, causing light refraction, part of the light (such as light 122) will not pass through the original focal point 118 after being refracted by the spherical surface 114, thus reducing the colloid 112. light-gathering ability. If the light beam formed by the above-mentioned light rays is vertically projected onto a plane, since the light converges at different focal points, the light beam vertically projected on the plane will present a multi-level concentric halo, resulting in uneven brightness distribution. average phenomenon. It is worth noting that such a light source with uneven brightness distribution can only be used as an indicator light, not as a general lighting device.

To sum up, the disadvantages of the known packages of light-emitting diode chips are:

1. Since the light-emitting diode chip emits light in a radial manner, part of the light will be scattered through the side of the colloid and not refracted from the spherical surface, thus reducing its brightness.

2. When the colloidal mold flow of the material forming the colloid is not uniform, the density uniformity of the colloid will be poor, so that the direction of travel of the light emitted by the light-emitting diode chip will shift in the colloid, and then after refraction by the spherical surface, it will converge at a different focus, thus reducing its brightness.

3. When the light beam emitted by this known light-emitting diode chip is projected vertically onto a plane, since the light rays are respectively converged at different focal points, when the light beam is projected on the plane, it presents a multi-level concentric halo, thus producing The phenomenon of uneven brightness distribution.

In order to solve the problems of the above-mentioned known technologies, the object of the present invention is to provide a package of light emitting diode chips. A light-emitting diode chip is arranged on the bottom surface of a flat-bottomed concave cup, and a condensing lens is arranged on the light-emitting diode chip, which is used to improve the refraction of the known light-emitting diode chip package due to the inhomogeneity of the colloidal material. The problem of uneven rates.

Another object of the present invention is to provide a package for LED chips. Arranging a light emitting diode chip on a plane, and disposing a condensing lens on the light emitting diode chip, and keeping a distance, is also used to improve the known light emitting diode chip package due to the inhomogeneity of the colloidal material. Affects the problem of uneven refractive index.

In order to achieve the above object and other objects of the present invention, the present invention proposes a package of light-emitting diode chips, including: a printed circuit board substrate with a conductor layer and an electrode, wherein the conductor layer and the electrodes are located on the printed circuit board One side of the base material; a light emitting diode chip configured on the conductor layer, and the light emitting diode chip has a wire connected to the electrode; Position, and bonded with the printed circuit board base material, in addition, the opposite ends of the condenser lens have a concave curved surface and a convex curved surface respectively, wherein, the concave curved surface is close to and faces the light-emitting diode chip, and the convex curved surface is away from the light-emitting diode chip , and approximately parallel to the concave surface, and a distance is maintained between the concave surface and the LED chip.

In order to achieve the above object and other objects of the present invention, the present invention proposes a package of light-emitting diode chips, including: a printed circuit board substrate with a flat-bottomed concave cup and an electrode, wherein the flat-bottomed concave cup and the electrodes are located on the printed circuit board. The same surface of the circuit board substrate, in addition, the surface of the flat-bottomed concave cup has a conductor layer, and an opening is formed on the same surface of the printed circuit board substrate; a light-emitting diode chip is arranged at the bottom of the flat-bottomed concave cup, and the light emitting The diode chip is connected to the electrode by a wire; and a condensing lens is roughly in the shape of a short column. The condensing lens corresponds to the opening position of the flat-bottomed concave cup, and is bonded to the substrate of the printed circuit board. In addition, the opposite of the condensing lens The two ends respectively have a concave curved surface and a convex curved surface, wherein the concave curved surface is close to and faces the light-emitting diode chip, and the convex curved surface is away from the light-emitting diode chip and approximately parallel to the concave curved surface.

The packaging of the LED chip of the present invention has the following advantages:

(1) In the packaging of the LED chip of the present invention, the condenser lens is formed by injection molding, and the density of the internal material after molding is uniform. Therefore, when the known colloid is formed, the colloid flow of the material is disturbed by the structure of the conductive support, and the uneven density of the material does not occur, thereby causing inappropriate refraction of light.

(2) In the packaging of the light-emitting diode chip of the present invention, because the density of the condensing lens is uniform, it can accurately converge the light on the set focal point. Because the accuracy of the focal point is better, the light beam produced by it is projected vertically on the When it is flat, it will present a circular smooth surface with uniform brightness distribution.

(3) The light beam generated by the LED chip package of the present invention is vertically projected on a plane and presents a uniformly distributed light surface, so it can be applied to lighting equipment. And multiple packages can be arranged in strips or planes to enhance brightness.

(4) In the packaging of the light-emitting diode chip of the present invention, adjusting the distance between the focal point outside the condenser lens and the convex surface can increase the density of light, which can be used for long-distance irradiation; or reduce the density of light, which can be used for short distance lighting.

(5) When the package body of the light emitting diode chip of the present invention emits light, it has the advantages of high brightness and low power consumption at the same time, and can greatly reduce energy consumption. Compared with the light-gathering efficiency of the known light-emitting diode chip package, if the same amount of electric energy is used, the light beam generated by the package of the present invention has higher brightness.

In order to make the above-mentioned purposes, features and advantages of the present invention clearly understandable, the preferred embodiments will be described in detail below in conjunction with the accompanying drawings:

Graphic description:

Fig. 1 is a sectional view of a known package body of a light emitting diode chip;

Figure 2 is a simplified schematic diagram of Figure 1;

3 is a schematic cross-sectional view of a package body of a light-emitting diode chip according to Embodiment 1 of the present invention;

Figure 4 is a simplified schematic diagram of Figure 3;

FIG. 5 is a schematic cross-sectional view of a package of LED chips according to Embodiment 2 of the present invention.

Explanation of reference signs:

100: Conductive bracket

102: main bracket

104: sub-bracket

106: chip

108: chip seat

110: wire

112: colloid

114: spherical

116, 120, 122: light

118: focus

200: printed circuit board substrate

202: plane

204: conductive layer

206: electrode

208: LED chip

210: wire

212: Concentrating lens

216: Latch

218: jack

220: end part

222: Concave surface

224: Convex surface

226: Flat concave cup

300: lens structure

302: point light source

304: light

306: Concave surface

308: Focus

310: Convex surface

312: focus

314: axis

Embodiment one:

Please refer to FIG. 3 , which is a schematic cross-sectional view of the LED chip package according to Embodiment 1 of the present invention. First, a printed circuit board substrate 200 is provided, which has a conductive layer 204 and an electrode 206 , and an LED chip 208 is disposed on the conductive layer 204 and connected with wires 210 . In addition, a condensing lens 212 is bonded on the printed circuit board base material 200, wherein the bonding method includes bonding and fitting, and the bonding method is that the bottom surface 214 of the condensing lens 212 and the printed circuit board The plane 202 of the board base material is attached; and the way of its embedding is that the pin 216 protruding from the bottom surface 214 of the condenser lens 212 is fitted with the socket 218 in the printed circuit board base material 200, and the The end portion 220 of the pin 216 is fused and solidified to form a rivet-like structure for positioning the condenser lens 212 on the LED chip 208 .

According to the above, the shape of the condensing lens 212 is about a short column, and has a concave curved surface 222 and a convex curved surface 224 at its opposite ends, wherein the concave curved surface 222 is closer to the LED chip 208, and the convex curved surface 222 is far away from it. LED chips 208 . The concave curved surface 222 and the convex curved surface 224 can be one of a spherical surface, a paraboloid and a hyperboloid. In addition, the condensing lens 212 is manufactured by injection molding. Compared with the known colloid formed by injection molding, the inner material of the lens assembly produced by injection molding has a relatively uniform density distribution, so that the light passes through When inside the lens assembly, refraction phenomenon is not easy to occur. The part of the pin 216 can be molded together during injection molding.

In order to describe the working principle of the condensing lens of the preferred embodiment of the present invention in detail, please refer to FIG. 4 , which is a simplified schematic diagram of FIG. 3 . In the figure, only part of the structure of the condensing lens 212 is shown, and it is the lens structure 300 , and a point light source 302 is used to simulate the light emitting phenomenon of the LED chip 208 . The point light source 302 emits many light rays 304 , which are respectively incident on the concave surface 306 at different angles, and all the light rays 304 converge at the focal point 308 through the refraction phenomenon of the concave surface 306 . After that, the light 304 starts from the focal point 308 and enters the convex surface 310 at different angles respectively, and the light 304 converges on the focal point 312 through the refraction phenomenon of the convex surface 310 .

The present invention uses the concave curved surface and the convex curved surface of the condensing lens to condense light twice. Compared with the conventional colloid spherical surface that only condenses light once, the light condensing effect produced by the condensing lens in the present invention is better. Because the density of the material of the condensing lens of the present invention is uniform, the light is less likely to be refracted when passing through, so as to ensure that the original incident angle of the light on the refracting curved surface does not change. Therefore, after the light is refracted by the curved surface, the light can all converge on the same focal point, so that when the light beam composed of light is projected vertically on a plane, it will not produce a multi-level concentric halo, but a uniform distribution of brightness round glossy surface.

It is worth noting that the light produced by the present invention is light with uniform distribution of brightness. , will produce a circular light surface with high brightness and uniform distribution, so it can be applied to lighting equipment, and has the advantages of high brightness and low power consumption at the same time, greatly reducing energy consumption.

In order to illustrate how to change the structure of the condenser lens in the present invention to obtain different beam sizes and light intensities, please also refer to Fig. 4. There are two ways to adjust the position of the focal point 308 on the axis 314: one is to fix The radius of curvature of the concave curved surface 306 adjusts the left and right positions of the point light source 302 on the axis 314 ; In addition, to adjust the position of the focal point 312 on the axis 314, there are two methods: one is to fix the curvature radius of the convex surface 310 and the lens length 316, and adjust the left and right positions of the focal point 308 on the axis 314, wherein the adjustment method includes adjusting the lens length 316; the second is to fix the position of the focal point 308 on the axis 314 and the lens length 316, and change the radius of curvature of the convex surface 310.

As mentioned above, when the focal point 312 is adjusted away from the convex surface 310 and the light beam generated by the light 304 is projected vertically on a plane, a smaller circular light surface will appear on the plane, but with higher brightness. On the contrary, when the focal point 312 is adjusted to be close to the convex surface 310, and the light beam generated by the light 304 is vertically projected on a plane, a larger circular light surface will appear on the plane, but with lower brightness. Therefore, by adjusting the distance between the focal point 312 and the convex surface 310, the light density can be increased for long-distance illumination; or the light density can be reduced for short-distance illumination.

Embodiment two:

Please refer to FIG. 5 , which is a schematic cross-sectional view of a light emitting diode chip package according to a second embodiment of the present invention. Wherein, the difference between FIG. 5 and FIG. 3 is that: the printed circuit board substrate 200 corresponds to the position of the LED chip 208, forming a flat-bottomed concave cup 226, and the conductive layer 204 is arranged on the surface of the flat-bottomed concave cup 226, and An electrode is disposed on the plane 202 of the printed circuit board substrate 200 . In addition, the LED chip 208 is pasted on the bottom of the flat-bottomed concave cup 226 , and a wire 210 is also used to connect the LED 208 and the electrode 206 . And corresponding to the position of the LED chip 208 , a condenser lens 212 is disposed on the printed circuit board substrate 100 .

As mentioned above, the light from the LED chip 208 is reflected by the side of the flat-bottomed concave cup 226 to increase the brightness. In addition, the side surface of the flat-bottomed concave cup 226 can be formed into a circular curved surface, which can be one of a spherical surface, a paraboloid, and a hyperboloid, so as to serve as a reflective curved surface. The light emitted from the light-emitting diode chip 204 can be incident on the concave surface 222 in parallel, so it can be regarded as a surface light source. When the surface light source is incident, its light is diverged after being refracted by the concave curved surface 222 and the convex curved surface 224 .

The above-mentioned embodiment only uses the packaging of a single LED chip as an illustration. However, the packaging structure of the LED chip of the present invention is not limited to the packaging of a single LED chip, and can also be applied to the packaging of multiple LED chips.

Although the present invention has been described above with preferred embodiments, it is not intended to limit the present invention. Any person familiar with the art may make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the invention shall be defined by the claims.

Claims (12)

1. the encapsulation of a light-emitting diode chip for backlight unit is characterized in that: comprising:

One substrate for printed circuit board has a conductor layer, an electrode, and wherein this conductor layer and this electrode all are positioned at the one side of this substrate for printed circuit board;

At least one light-emitting diode chip for backlight unit is disposed on this conductor layer, and this light-emitting diode chip for backlight unit is connected with described electrode with a lead;

One collector lens, be short cylinder approximately, this collector lens is corresponding to the position of described light-emitting diode chip for backlight unit, and engage with described substrate for printed circuit board, the opposite end of this collector lens has a concave curved surface and a convex surface respectively, wherein, this concave curved surface is near also facing described light-emitting diode chip for backlight unit, this convex surface is away from this light-emitting diode chip for backlight unit, and is parallel approximately with this concave curved surface, keeps a distance between this concave curved surface and the described light-emitting diode chip for backlight unit.

2. the encapsulation of light-emitting diode chip for backlight unit according to claim 1 is characterized in that: the mode that this collector lens engages with this substrate for printed circuit board comprises fits or chimeric mode.

3. collector lens, be applicable to converging ray, it is characterized in that: this light emission is from a point-source of light, in addition, this collector lens is short cylinder approximately, and has a concave curved surface and a convex surface, and wherein this concave curved surface is formed at an end of this collector lens, this convex-shaped surface is formed in the relative other end of this collector lens, and is parallel approximately with this concave curved surface.

4. collector lens according to claim 3 is characterized in that: this concave curved surface and this convex surface are respectively sphere, parabola and hyperboloid thrin.

5. collector lens according to claim 3 is characterized in that: the manufacture method of this collector lens comprises injection molding.

6. the encapsulation of a light-emitting diode chip for backlight unit is characterized in that: comprising:

One substrate for printed circuit board has a flat bottom surface and concave cups, an electrode, and wherein, this flat bottom surface and concave cups and this electrode all are positioned at the one side of this substrate for printed circuit board, and the surface of this flat bottom surface and concave cups has a conductor layer, and forms an opening at this face of this substrate for printed circuit board;

At least one light-emitting diode chip for backlight unit be disposed at the bottom of this flat bottom surface and concave cups, and this light-emitting diode chip for backlight unit is connected with this electrode with a lead;

One collector lens, be short cylinder approximately, this collector lens is corresponding to the position of this opening of this flat bottom surface and concave cups, engage with this substrate for printed circuit board, the opposite end of this collector lens has a concave curved surface and a convex surface respectively, and wherein, this concave curved surface is near also facing this light-emitting diode chip for backlight unit, this convex surface is away from this light-emitting diode chip for backlight unit, and is parallel approximately with this concave curved surface.

7. the encapsulation of light-emitting diode chip for backlight unit according to claim 6 is characterized in that: the mode that this collector lens engages with this substrate for printed circuit board comprises fits and chimeric mode.

8. collector lens, be applicable to converging ray, it is characterized in that: this light is that emission is from an area source, this collector lens is short cylinder approximately, and have a concave curved surface and a convex surface, wherein this concave curved surface is formed at an end of this collector lens, and this convex surface is the relative other end that is formed at this collector lens, and is parallel approximately with this concave curved surface.

9. collector lens according to claim 8 is characterized in that: the light that this area source system is sent by a point-source of light is formed via the surface reflection of a reflecting curved surface, and wherein, this point-source of light is approximately near the focus of this reflecting curved surface.

10. collector lens according to claim 9 is characterized in that: this reflecting curved surface is that the ring-type curved surface by a flat bottom surface and concave cups is formed, and wherein this flat bottom surface and concave cups is formed at the one side of a substrate for printed circuit board.

11. collector lens according to claim 8 is characterized in that: this concave curved surface and this convex surface are respectively sphere, parabola and hyperboloid thrin.

12. collector lens according to claim 8 is characterized in that: the manufacture method of this collector lens comprises injection molding.

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