CN1358780A - 玻纤层合板用高玻璃转移温度的溴化环氧树脂 - Google Patents
玻纤层合板用高玻璃转移温度的溴化环氧树脂 Download PDFInfo
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- CN1358780A CN1358780A CN 01139771 CN01139771A CN1358780A CN 1358780 A CN1358780 A CN 1358780A CN 01139771 CN01139771 CN 01139771 CN 01139771 A CN01139771 A CN 01139771A CN 1358780 A CN1358780 A CN 1358780A
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- Prior art keywords
- epoxy resin
- weight
- epoxy
- brominated
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000009477 glass transition Effects 0.000 title claims abstract 9
- 239000011152 fibreglass Substances 0.000 title claims description 10
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims abstract description 97
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 97
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003365 glass fiber Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 75
- 239000011347 resin Substances 0.000 claims description 75
- 239000004593 Epoxy Substances 0.000 claims description 67
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 10
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052794 bromium Inorganic materials 0.000 claims description 10
- 125000000524 functional group Chemical group 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 230000001588 bifunctional effect Effects 0.000 claims 2
- 238000002156 mixing Methods 0.000 abstract description 6
- 230000009257 reactivity Effects 0.000 abstract description 5
- 239000012776 electronic material Substances 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract 1
- 239000005340 laminated glass Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000004033 plastic Substances 0.000 description 25
- 229920003023 plastic Polymers 0.000 description 25
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 22
- 239000007788 liquid Substances 0.000 description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 16
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 238000002844 melting Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 13
- 239000000243 solution Substances 0.000 description 12
- 229940106691 bisphenol a Drugs 0.000 description 10
- 238000003825 pressing Methods 0.000 description 10
- 239000002966 varnish Substances 0.000 description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 9
- -1 phenyl aldehyde Chemical class 0.000 description 9
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 8
- 238000005470 impregnation Methods 0.000 description 8
- KDVYCTOWXSLNNI-UHFFFAOYSA-N 4-t-Butylbenzoic acid Chemical compound CC(C)(C)C1=CC=C(C(O)=O)C=C1 KDVYCTOWXSLNNI-UHFFFAOYSA-N 0.000 description 7
- 239000004744 fabric Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000011120 plywood Substances 0.000 description 7
- 235000013824 polyphenols Nutrition 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- QKIUAMUSENSFQQ-UHFFFAOYSA-N dimethylazanide Chemical compound C[N-]C QKIUAMUSENSFQQ-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000003351 stiffener Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 150000002460 imidazoles Chemical class 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 229940015043 glyoxal Drugs 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000011112 process operation Methods 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical group C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000009172 bursting Effects 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Natural products O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- CUXQLKLUPGTTKL-UHFFFAOYSA-M microcosmic salt Chemical compound [NH4+].[Na+].OP([O-])([O-])=O CUXQLKLUPGTTKL-UHFFFAOYSA-M 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 150000008442 polyphenolic compounds Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009941 weaving Methods 0.000 description 2
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- WLOHKZPZHBMVBK-UHFFFAOYSA-N 2-(chloromethyl)oxirane Chemical compound ClCC1CO1.ClCC1CO1 WLOHKZPZHBMVBK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- FLBUMFXTSUZXHH-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1.C1=CNC(C=2C=CC=CC=2)=N1 FLBUMFXTSUZXHH-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 239000012761 high-performance material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
| 项目 | 实施例1 | 实施例2 | 实施例3 | 比较例1 | 比较例2 | 比较例3 | 比较例4 |
| EP-1(固态) | 100 | ||||||
| EP-2(固态) | 100 | ||||||
| EP-3(固态) | 100 | ||||||
| EP-4(固态) | 100 | ||||||
| EP-5(固态) | 100 | ||||||
| EP-6(固态) | 100 | ||||||
| EP-7(固态) | 100 | ||||||
| 丙酮 | 25 | 25 | 25 | 25 | 25 | 33.3 | 25 |
| 双氰胺 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 |
| 2-甲基咪唑 | - | - | - | - | - | - | 0.05 |
| 2-苯基咪唑 | 0.07 | 0.07 | 0.05 | 0.03 | 0.02 | 0.02 | - |
| N,N’二甲基甲醯胺 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 项目 | 实施例1 | 实施例2 | 实施例3 | 比较例1 | 比较例2 | 比较例3 | 比较例4 |
| 清漆胶化时间(170℃) | 292秒 | 310秒 | 315秒 | 304秒 | 285秒 | 170秒 | 286秒 |
| 预浸渍体胶化时间(170℃) | 133秒 | 130秒 | 134秒 | 100秒 | 95秒 | 80秒 | 136秒 |
| 预浸渍体最低熔融黏度(poise)*1 | 4200 | 6000 | 5200 | 5000 | 5300 | 5200 | 4800 |
| 玻璃转移温度(℃,DSC)*2 | 150 | 150 | 170 | 151 | 152 | 174 | 140 |
| 吸水率%(半小时压力锅处理后)*3 | 0.2% | 0.2% | 0.18% | 0.2% | 0.2% | 0.18% | 0.23% |
| 288℃耐焊锡耐热性(半小时压力锅处理后)*4 | 5分 | 5分 | 5分 | 5分 | 5分 | 5分 | 3分40秒 |
| 铜箔之剥离强度(lb/in) | 11.5 | 11.5 | 9 | 11 | 11 | 8 | 12 |
| 耐燃性(UL-94) | V0 | V0 | V0 | V0 | V0 | V0 | V0 |
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011397713A CN1159363C (zh) | 2001-11-30 | 2001-11-30 | 玻纤层合板用高玻璃转移温度的溴化环氧树脂 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011397713A CN1159363C (zh) | 2001-11-30 | 2001-11-30 | 玻纤层合板用高玻璃转移温度的溴化环氧树脂 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1358780A true CN1358780A (zh) | 2002-07-17 |
| CN1159363C CN1159363C (zh) | 2004-07-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011397713A Expired - Fee Related CN1159363C (zh) | 2001-11-30 | 2001-11-30 | 玻纤层合板用高玻璃转移温度的溴化环氧树脂 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1159363C (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101591465B (zh) * | 2008-05-27 | 2011-06-22 | 台燿科技股份有限公司 | 改善印刷电路基板材料的组合物 |
| CN103819655A (zh) * | 2006-06-07 | 2014-05-28 | 陶氏环球技术有限责任公司 | 用于制备环氧树脂的低聚卤化增链剂 |
| CN106279704A (zh) * | 2015-05-27 | 2017-01-04 | 南亚塑胶工业股份有限公司 | 聚苯醚改性的酚-苯甲醛多官能环氧树脂与用途 |
-
2001
- 2001-11-30 CN CNB011397713A patent/CN1159363C/zh not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103819655A (zh) * | 2006-06-07 | 2014-05-28 | 陶氏环球技术有限责任公司 | 用于制备环氧树脂的低聚卤化增链剂 |
| CN103819655B (zh) * | 2006-06-07 | 2016-09-28 | 兰科知识产权有限责任公司 | 用于制备环氧树脂的低聚卤化增链剂 |
| CN101591465B (zh) * | 2008-05-27 | 2011-06-22 | 台燿科技股份有限公司 | 改善印刷电路基板材料的组合物 |
| CN106279704A (zh) * | 2015-05-27 | 2017-01-04 | 南亚塑胶工业股份有限公司 | 聚苯醚改性的酚-苯甲醛多官能环氧树脂与用途 |
| CN106279704B (zh) * | 2015-05-27 | 2020-10-27 | 南亚塑胶工业股份有限公司 | 聚苯醚改性的酚-苯甲醛多官能环氧树脂与用途 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1159363C (zh) | 2004-07-28 |
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