CN1355560A

CN1355560A - Coded tray for preserving packaged semiconductor device

Info

Publication number: CN1355560A
Application number: CN01137812A
Authority: CN
Inventors: 琼斯·朱; 怀尔德·王; 杨奎方
Original assignee: PEKER INTERNATIONAL CORP
Current assignee: PEKER INTERNATIONAL CORP
Priority date: 2000-12-01
Filing date: 2001-11-08
Publication date: 2002-06-26
Also published as: HK1045761A1; SG125059A1; US20020066693A1; TW538430B

Abstract

Tray for holding packaged semiconductor devices comprising a structure on at least one edge of the tray adapted to receive a marking block containing a unique identifier such as a color or combination of colors or alphanumeric identification to identify the type of packaged device contained in the tray.

Description

The coded tray of the semiconductor device that is used to remain potted

Technical field

The present invention relates in semi-conductor industry, be used to carry the pallet of packaged integrated circuits as " sphere grid matrix (BGA) " encapsulation, " plane (QFP) all around " encapsulation and " plane (TQFP) around thin " encapsulation and similar encapsulation.Specifically, the present invention relates to a kind of pallet with detachable home block (tab), this home block can be inserted into an edge of pallet, makes the particular content of user by utilizing mark relevant with home block or color to discern pallet.

Background technology

At present, become known for keeping the pallet of the semiconductor device of a plurality of assembled package, it is used in electronics such as PC, cellular phone and server.Multiple semiconductor device packages mode is arranged now, for example, " sphere grid matrix (BGA) " encapsulation, " planar package (QFP) all around " and " planar package (TQFP) around thin ".For example, promptly shown such pallet in the plane graph shown in Figure 1A, these pallets are used to carry the detected device of encapsulation afterwards that reaches before, and send the device of these encapsulation to user, the user handled the device of these encapsulation before the device that will encapsulate is assembled into as the circuit board of a part of finishing system, like this, the device of encapsulation just is utilized this and finishes in the system.Pallet 100 among Figure 1A comprises a support 103, and support 103 comprises a plurality of opening 101-1 to 101-10, and package semiconductor device just can be put into opening 101-1 to 101-10.Each opening 101-1 to 101-10 all comprises a shelf, as shelf 102-1 to 102-10, before the device of test package and after, or it is sent to application person's the process from the producer, these shelves are used to keep the device of described encapsulation.Two or more this pallets can be stacked together mutually, and also can be bundled together tightly from the producer is sent to user's process.Typically, each this pallet all can keep any in the assembled package semiconductor device of number of different types.The subsidiary inventory of these pallets can indicate the concrete device that is comprised in each pallet.But, in the actual identification pallet,, therefore, the user is applied in wrong pallet in the required system owing to the placement of package semiconductor device because the user has a plurality of different devices.Like this, just need a kind of method and structure to make the particular type of the packaged semiconductor devices that is comprised in each pallet of user's easy identification.

Summary of the invention

The invention provides the method and structure of the type of the packaged semiconductor devices that a kind of user's of making easy identification pallet carried.

In one embodiment of the invention, utilized a kind of dismountable home block (tab) that is inserted into an edge of pallet, but the user just comprises the particular type of device by the sign on this home block in the identification pallet.

In another embodiment, dismountable home block is indicated the type that comprises device in the pallet by its color, this home block can have any or varicolored combination of multiple color, and described color or color combinations are used for indicating the type of the contained device of pallet.

In another embodiment, home block comprises as signs such as letter or number or its combinations, with the concrete packaged semiconductor devices that is comprised in the identification pallet.

An advantage of the present invention is: the user passes through the color of home block or the sign on the home block, contrast with predetermined tabulation, just more easily comprise the type of device in the identification pallet in order to the relevant concrete device of identification and each color or sign.Utilize method and structure of the present invention,, be placed into the possibility on the printed circuit board (PCB) in the electronic system mistakenly even can not eliminate but also can obviously reduce semiconductor device with assembled package.

With reference to the accompanying drawings, can more clearly understand the present invention by following detailed.

Description of drawings

Figure 1A has shown the plane graph of the pallet of the used type of the present invention;

Figure 1B is depicted as the A-A of the pallet shown in Figure 1A to sectional view;

Fig. 1 C is depicted as the B-B of the pallet shown in Figure 1A to sectional view;

Fig. 1 D is depicted as the plane graph of the marginal texture of the pallet shown in Figure 1A, and this marginal texture can receive home block of the present invention;

Fig. 1 E shows the edge of the pallet that can keep home block of the present invention in greater detail;

Fig. 2 A, 2B, 2C and 2D have shown end view, sectional top view, rearview and the edge view of a kind of home block that is applicable to the pallet of the present invention shown in Figure 1A respectively;

Fig. 3 A-3C has shown a kind of plug that can use with home block of the present invention, can be according to principle of the present invention and different packaging part type of identification or the operation on the packaging part.

Embodiment

Following detailed will illustrate several embodiments of the present invention.This description just is used for illustrative purposes, but the present invention is not limited to this.By means of describing content, other embodiment of the present invention should be very clear and definite for a person skilled in the art.

According to the present invention, on an edge of the pallet shown in Figure 1A 100, has a kind of relevant structure 105.Shown in Figure 1A, structure 105 is positioned on the right side 104-2 of pallet 100, and with side 104-1 and 104-3 or 104-4 positioned opposite.Home block 200 (Fig. 2 A) is inserted into to detachability in the structure 105 on the 104-2 of side.Certainly, structure a kind of structure such as structure 105 on one of these sides if desired, home block 200 also can be installed on one of the two sides 104-1 of pallet and 104-3 or the other end 104-4.Another kind of mode is: home block can be installed on two or more sides of pallet 100, like this, and by on any of two or more sides of pallet 100, observing the type that just can determine to comprise in the pallet 100 device.

The A-A that Figure 1B and Fig. 1 C are respectively pallet 100 to B-B to sectional view.Shown in Figure 1B and Fig. 1 C, shelf 102-1,102-2,102-3 and 102-8 extend around opening 101-1,101-2,101-3 and 101-8 respectively, so just package semiconductor device can be placed among each opening 101-1,101-2,101-3 and the 101-8 on shelf 102-1,102-2,102-3 and the 102-8.Typically, these semiconductor devices remain on the shelf under action of gravity.But, if necessary, pallet transport or other processing procedures in, no matter which kind of orientation pallet 100 be in, the device that all can utilize home block or other structures to encapsulate remains in the pallet.This mechanism that the device that is used for encapsulating remains on pallet 100 is known.

Fig. 1 D has shown the part of the pallet 100 end 104-2 sectional views that are used to keep home block 200 of the present invention.Shown in Fig. 1 D, structure 105 comprises the edge 106-1 and the 106-2 of two inclinations.Fig. 1 E shows the characteristics of sloping edge 106-1 and 106-2 in greater detail.Shown in Fig. 1 E, sloping edge 106-1 is to extend from surperficial 107 with surperficial 107 angles that are about 60 ° (also can adopt other suitable angles if desired), like this, some 108-1 on the sloping edge 106-1, the distance of some 108-2 to the corresponding sloping edge 106-2 is less than the distance of the some 109-1 of the edge 106-1 point 109-2 to the edge 106-2.

In the one embodiment of the present of invention shown in Fig. 1 E, flat surfaces 110-1 and 110-2 are before the starting point 109-2 of the starting point 109-1 of inclined surface 106-1 and inclined surface 106-2, from the short segment distance of surperficial 107 vertical extent.Like this, the inclined surface 106-1 of design and 106-2 just can receive the home block 200 of a home block as having tapered end, and with this home block tightly on the abutment surface 107.

Fig. 2 A to 2D has shown an embodiment of home block 200.The parts that Fig. 2 A to 2D shows are rectangular block substantially, and it comprises a plurality of buttons, has shown three button 201-1,201-2 and 201-3 among the figure.This home block has beveled end 202-1 and 202-2.The inclined plane of these ends tilts with the back flat surfaces 204-2 (Fig. 2 B) of identical angle from home block 200,107 inclinations from the surface as edge 106-1 and 106-2.In one embodiment, the angle on the plane of surperficial 202-1 and 202-2 and rear surface 204-2 is about 60 °.

Home block 200 has three button 201-1, the 201-2 and the 201-3 that protrude from face 204-1.When in the structure 105 on the edge 104-2 that home block 200 is placed on pallet 100, face 204-1 from edge 104-2 towards outside.The rear surface 204-2 of home block 200 directly is pressed on the outer surface of edge 104-2 of pallet 100.As shown in the figure, button 201-1 to 201-3 is circular.If suitably and need, also can adopt the button of other shapes.

Fig. 2 C is depicted as the rearview of home block 200.The surperficial 204-2 of home block 200 has three opening 208-1,208-2 and the 208-3 that is formed at wherein, and described three opening portions extend among the button 201-1 to 201-3.These three openings are the part of manufacturing process and the weight that has reduced home block, still, also it can be removed if desired.

In the top of home block 200, form a groove 206.Groove 206 can make home block 200 correctly aim at appending between inclined surface 106-1 on the edge 104-2 of pallet 100 and the 106-2.Typically, groove 206 correctly is placed on home block in the groove of structure 105 with assurance towards last.

Fig. 2 D has shown the end view of home block 200, can clearly observe button 201-3 and end 202-2 in the figure.

Shown in Fig. 2 B, can see the planar edge 207-1 of formation and the perpendicular and direct neighbor of rear surface 204-2 of 207-2 and home block 200.With perpendicular flat surfaces 207-1 and the 207-2 of rear surface 204-2, with 107 plane 109-1 and the 109-2 (referring to Fig. 1 E) that extend match from the surface along inclined surface 106-1 and 106-2, define the groove in the structure 105 on the end 104-2 of pallet 100.

By plug 300 being placed into two tops among the round button 201-1 to 201-3, just dismountable plug 300 can be appended on the home block 200.Plug 300 has a button 301 that forms in cavity 302.A part of 302-1 of cavity 302 will receive as the button 201-2 on the home block 200, and a part of 302-2 of cavity 302 is used to receive the button 201-3 on the home block 200.Fig. 3 B has shown the end view of plug 300, and Fig. 3 C has shown the cross sectional side view of the plug of being done along the line F-F relevant with plug 300 300.

Plug 300 can have needed any color, and the special device that is comprised in selected special color and the pallet 100 is relevant.Another kind of mode is, home block 200 also can have a kind of color, to be used for indicating the type of the device that pallet 100 comprised.In addition, can be with sign, as the combination of a series of numerals or letter or alphanumeric notation, place on the outer surface 305 of the outer surface of home block 200 or plug 300, with the type of contained device in the indication pallet 100.But the device that the user utilizes the color of plug 300 or the sign on it just to be comprised in the identification pallet 100, thereby can more easily replace the plug of different colours or comprise the plug of different identification, dissimilar with device in the identification pallet 100.

Certainly, if necessary, pallet 100 can utilize a plurality of home blocks 200, thereby not only can indicate the type that comprises device in the pallet 100, and can indicate to the packaging system in the pallet 100 next step operation that will carry out, or the operation of the last time that the packaging system in the pallet 100 has been carried out.The a plurality of structures 105 that on one or more edges of pallet 100, form, can be used for carrying with pallet 100 in many relevant information of device of encapsulation.

Described several embodiments of the present invention above, by means of top description content, those skilled in the art can clearly understand other embodiment of the present invention.The present invention is by following limiting.

Claims

1. A tray for carrying packaged semiconductor devices, comprising:

a carrier including a plurality of openings each receiving a packaged integrated circuit device, the tray further having at least one edge;

a structure attached to said at least one edge for receiving an identification block;

An identifier block for inserting the structure.

2. The pallet of claim 1, wherein said structure for receiving a marker comprises a groove formed as part of said edge, the groove having side surfaces and a rear surface, said side surfaces Inclined from said groove, forming an angle of less than 90 degrees with said rear surface, the distance between the portion of each side furthest from said rear surface is less than the distance between the portion of each side closest to said rear surface distance between parts.

3. A pallet as claimed in claim 2, wherein each side includes a surface portion substantially perpendicular to and directly adjacent to said rear surface, the sloped portion of said side being affixed to the vertical portion of said side.

4. The tray according to claim 3, wherein the marker block for insertion into the groove includes at least one marker on one surface, the marker being selected from a plurality of markers.

5. The pallet of claim 4, wherein said marking comprises a color selected from a plurality of different colors.

6. The tray of claim 2, wherein the identification block includes a plurality of circular buttons formed on a surface facing away from an edge of the tray.

7. The tray of claim 6, including a plug for press fit over at least one button on said identification block, said plug having an identification thereon to indicate which button is placed in said tray. The type of device.

8. The pallet of claim 7, wherein said indicia comprises a selected color.

9. The tray of claim 7, wherein said indicia comprises an alphanumeric symbol.

10. The tray of claim 9, wherein said plug comprises a component block containing at least two cavities, each cavity being designed to press fit with a corresponding button on said identification block relatively accurate.

11. A tray for holding packaged semiconductor devices in combination with a marker block, the tray comprising a plurality of openings each adapted to hold a packaged semiconductor device, said tray further comprising at least one edge, said The edge has a groove for receiving a marking block; said marking block is formed to be inserted into said groove.

12. A pallet as claimed in claim 11, wherein said groove is adapted to retain said marker block pressed directly against the edge of the pallet.

13. The tray of claim 11, including a plug attached to one surface of said identification block, the plug having an identification indicating the type of device in said tray.

14. The tray of claim 13, wherein said plug includes a selected color corresponding to a selected type of device in the tray.

15. The tray of claim 13, wherein the plugs have alphanumeric symbols thereon, the symbols corresponding to selected types of semiconductor devices packaged in the tray.

16. The pallet of claim 11, wherein said marker block has a plurality of buttons formed on a surface, a selected number of buttons receiving a plug in a press fit such that said plug is in contact with said marker block directly adjacent to the surface.

17. The tray of claim 16, wherein said plug has one of a selected number of markings thereon to indicate the type of device in said tray.

18. The tray of claim 17, wherein the indicia comprises a selected number of colors.

19. The tray of claim 17, wherein the indicia comprises alphanumeric symbols.

20. A method for identifying a specific type of packaged semiconductor device in a tray, the method comprising:

forming a structure on an edge of the tray that receives a component indicative of the type of device in the tray; and

The parts are placed onto the structure to indicate the type of device in the tray.