CN1346993A - Locating module for optical fibre array - Google Patents
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Abstract
光纤阵列定位组件,属于光通信技术中的无源器件,特别涉及各种一维、二维阵列器件输入或者输出并行耦合接口的光纤阵列组件。本发明解决光纤阵列在低成本、高精度要求的条件下准确定位问题,本发明由上、下基片及位于其间的光纤构成,上、下基片中的一片或者两片表面有凹形刻蚀槽,其表面两侧线之间宽度小于光纤芯径的直径,刻蚀深度大于光纤芯径位于刻蚀槽内部分的圆弧段高度。本发明消除了用凹形槽内表面定位光纤时凹形槽成形过程中各种不均匀因素的影响,定位精度可达0.1μm,还可与同样结构的折变透镜定位组件以及垂直腔面发射激光器集成在一片底基片上,大大提高光电子器件在封装技术中的成品率、效率和高质量的光学性能。
An optical fiber array positioning component belongs to passive devices in optical communication technology, and particularly relates to an optical fiber array component for input or output parallel coupling interfaces of various one-dimensional and two-dimensional array devices. The present invention solves the problem of accurate positioning of the optical fiber array under the condition of low cost and high precision requirements. The present invention is composed of upper and lower substrates and optical fibers located therebetween. In the etching groove, the width between the lines on both sides of the surface is smaller than the diameter of the fiber core diameter, and the etching depth is greater than the height of the arc section of the fiber core diameter located in the etching groove. The invention eliminates the influence of various uneven factors in the forming process of the concave groove when the inner surface of the concave groove is used to position the optical fiber, the positioning accuracy can reach 0.1 μm, and it can also be used with the folding lens positioning assembly of the same structure and the vertical cavity surface emission Lasers are integrated on a base substrate, which greatly improves the yield, efficiency and high-quality optical performance of optoelectronic devices in packaging technology.
Description
技术领域technical field
本发明属于光通信技术中的无源器件,特别涉及光通信中各种一维或二维阵列器件输入或者输出并行耦合接口的光纤阵列组件。The invention belongs to passive devices in the optical communication technology, in particular to an optical fiber array assembly for input or output parallel coupling interfaces of various one-dimensional or two-dimensional array devices in the optical communication.
背景技术Background technique
近几年来,由于光通信的迅猛发展,用于DWDM光通信网中的新型有源器件和无源器件大量涌现。各种用途的平面波导芯片、微光机电开关MEMS芯片、面发射激光阵列VCSEL芯片等器件相继研制成功。上述芯片要制作成实用器件,必须要有高精度的光纤阵列组件作为器件的输入或输出耦合接口,采用封装技术,将上述芯片中的每一条光路和光纤阵列组件中相应的光纤严格准确的对准、固定、制作成长期稳定实用器件,确保器件的优良光学特性。同时,上述器件的封装技术是最耗费人力的工序,它是器件成本中最高部分之一。所以提供高精度的光纤阵列组件是保证光电子器件高质量的光学特性,提高封装工艺效率,降低器件成本的最为关键的技术之一。同时在许多器件中,需要高效率的平行准直光束列阵,将来自光纤阵列的光变成平行的准直光束列阵,除了高准确的光纤阵列之外,还需要高精度定位的折变透镜阵列。In recent years, due to the rapid development of optical communication, a large number of new active devices and passive devices used in DWDM optical communication networks have emerged. Various devices such as planar waveguide chips, micro-opto-electromechanical switch MEMS chips, and surface-emitting laser array VCSEL chips have been successfully developed. To make the above chip into a practical device, it is necessary to have a high-precision fiber array component as the input or output coupling interface of the device. Packaging technology is used to strictly and accurately align each optical path in the above chip with the corresponding optical fiber in the fiber array component. Accurate, fixed, and make stable and practical devices during the growth period to ensure the excellent optical characteristics of the device. Meanwhile, the packaging technology of the above-mentioned devices is the most labor-intensive process, which is one of the highest parts in the device cost. Therefore, providing high-precision optical fiber array components is one of the most critical technologies to ensure high-quality optical characteristics of optoelectronic devices, improve packaging process efficiency, and reduce device costs. At the same time, in many devices, a high-efficiency parallel collimated beam array is required to convert the light from the fiber array into a parallel collimated beam array. In addition to the high-precision fiber array, a high-precision positioning deflection lens array.
目前光纤阵列是在特定晶向硅片片上,腐蚀一些平行的V形槽,将光纤嵌入V形槽内,用V形槽内表面作为定位每一条光纤的表面,制作成光纤阵列组件,见图1,(A)和(B)为美国专利5,656,120,(C)中国专利00101007.7。也有的在基片上刻成凹形槽内,用凹形槽内表面作为定位每一条光纤的表面,制作成光纤阵列组件,见图1(D),美国专利6,706,371。基片表面刻蚀V形槽,可以保证光纤阵列定位有足够精度,但由于基片采用特定晶向硅片,成本昂贵。光纤嵌入基片表面凹形槽定位,光纤的定位精度与凹形槽的深度和内表面成形的精度有关,凹形槽越深,则基片表面凹形槽两侧线之间的宽度成形的均匀较差,因此,用凹形槽内表面定位光纤的精度难以保证,而且凹形槽越深,则越难以保证光纤的精确定位。At present, the optical fiber array is made by etching some parallel V-shaped grooves on the silicon wafer with a specific crystal orientation, inserting the optical fibers into the V-shaped grooves, and using the inner surface of the V-shaped grooves as the surface for positioning each optical fiber to make an optical fiber array component, as shown in the figure 1. (A) and (B) are US patent 5,656,120, (C) Chinese patent 00101007.7. There are also concave grooves engraved on the substrate, and the inner surface of the concave groove is used as the surface for positioning each optical fiber to make an optical fiber array assembly, see FIG. 1(D), US Patent 6,706,371. Etching V-shaped grooves on the surface of the substrate can ensure sufficient precision in the positioning of the fiber array, but because the substrate uses a silicon wafer with a specific crystal orientation, the cost is expensive. The optical fiber is embedded in the concave groove on the surface of the substrate for positioning. The positioning accuracy of the optical fiber is related to the depth of the concave groove and the precision of the inner surface forming. The deeper the concave groove, the uniform the width between the lines on both sides of the concave groove on the substrate surface. Therefore, it is difficult to ensure the accuracy of positioning the optical fiber with the inner surface of the concave groove, and the deeper the concave groove is, the more difficult it is to ensure the precise positioning of the optical fiber.
发明内容Contents of the invention
本发明光纤阵列定位组件,解决一维或二维光纤阵列在低成本、高精度要求的条件下准确定位问题,也可解决折变透镜阵列的准确定位问题。The optical fiber array positioning component of the present invention solves the problem of accurate positioning of a one-dimensional or two-dimensional optical fiber array under the condition of low cost and high precision requirements, and can also solve the problem of accurate positioning of a folding lens array.
本发明的光纤阵列定位组件,由上、下基片及位于上、下基片之间的光纤构成,上、下基片中的一片或者两片表面有刻蚀槽,用于光纤定位,其特征在于所述刻蚀槽为凹形槽,基片表面刻蚀槽两侧线之间宽度小于光纤芯径的直径,刻蚀槽刻蚀深度大于光纤芯径位于刻蚀槽内部分的圆弧段高度。The optical fiber array positioning assembly of the present invention is composed of upper and lower substrates and optical fibers between the upper and lower substrates. One or both of the upper and lower substrates have etched grooves on the surface for optical fiber positioning. It is characterized in that the etching groove is a concave groove, the width between the lines on both sides of the etching groove on the substrate surface is smaller than the diameter of the fiber core diameter, and the etching depth of the etching groove is greater than the arc section of the fiber core diameter located in the etching groove high.
所述的光纤阵列定位组件,其进一步的特征在于上、下基片的一端均加工成楔角,以容纳光纤微带剥离包层的光纤接口处。The optical fiber array positioning assembly is further characterized in that one end of the upper and lower substrates is processed into a wedge angle to accommodate the optical fiber interface where the optical fiber microstrip strips the cladding.
所述的光纤阵列定位组件,刻蚀槽在上、下基片中的一片或者两片表面可以平行排列,相邻刻蚀槽间距可以相等,也可以不相等。In the optical fiber array positioning assembly, the etched grooves can be arranged in parallel on one or both surfaces of the upper and lower substrates, and the distance between adjacent etched grooves can be equal or unequal.
所述的光纤阵列定位组件,刻蚀槽在上、下基片中的一片或者两片表面也可以呈放射状排列。In the optical fiber array positioning component, the etched grooves can also be arranged radially on one or both surfaces of the upper and lower substrates.
所述的光纤阵列定位组件,上、下基片中的一片可以双面带凹形刻蚀槽,构成二维光纤阵列定位组件。In the optical fiber array positioning assembly, one of the upper and lower substrates may have concave etching grooves on both sides to form a two-dimensional optical fiber array positioning assembly.
所述的光纤阵列定位组件,该光纤阵列定位组件可以与折变透镜阵列定位组件置于同一底基片上,折变透镜阵列定位组件由上、下基片及位于上、下基片之间的圆柱形折变透镜构成,上、下基片中的一片或者两片表面有凹形刻蚀槽,也可以上、下基片中的一片双面有凹形刻蚀槽,其表面两侧线之间宽度小于折变透镜的直径,刻蚀槽刻蚀深度大于折变透镜位于刻蚀槽内部分的圆弧高度,光纤阵列定位组件中每一条光纤芯径和折变透镜阵列定位组件中每一个折变透镜同轴对接,形成并行准直光束阵列组件。The optical fiber array positioning assembly, the optical fiber array positioning assembly and the folding lens array positioning assembly can be placed on the same base substrate, and the folding lens array positioning assembly consists of upper and lower substrates and a Composed of a cylindrical refractive lens, one or both of the upper and lower substrates have concave etched grooves on the surface, and one of the upper and lower substrates can also have concave etched grooves on both sides, and the line between the two sides of the surface The width between the gaps is smaller than the diameter of the refraction lens, the etching depth of the etching groove is greater than the arc height of the part of the refraction lens located in the etching groove, and the core diameter of each optical fiber in the optical fiber array positioning component and each fiber core diameter in the refraction lens array positioning component The folding lenses are coaxially connected to form a parallel collimated beam array assembly.
所述的光纤阵列定位组件,该光纤阵列定位组件还可以与垂直腔面发射激光器置于同一底基片上,垂直腔面发射激光器象元为一维或者二维阵列排列,每一个象元对准光纤阵列定位组件中的每一条光纤芯径直接耦合或者每一个象元发出的激光束经过全反射镜再耦合到光纤阵列定位组件中的每一条光纤芯径中。The optical fiber array positioning assembly, the optical fiber array positioning assembly can also be placed on the same base substrate as the vertical cavity surface emitting laser, the vertical cavity surface emitting laser pixels are arranged in a one-dimensional or two-dimensional array, and each pixel is aligned Each fiber core in the fiber array positioning component is directly coupled or the laser beam emitted by each pixel is coupled to each fiber core in the fiber array positioning component through a total reflection mirror.
本发明采用基片表面刻蚀槽两侧线定位每一条光纤或折变透镜,形成光纤阵列或折变透镜阵列。因为基片如各种玻璃、硅片、铌酸锂等表面的加工精度都很高,光刻掩模板线条宽度的精度一般都小于0.1μm,采用刻蚀槽两侧线定位光纤,需要刻蚀槽的深度远小于用凹形槽内表面定位光纤时凹形槽的深度。所以,基片表面光刻成图后,用反应离子垂直轰击成凹形槽,其两侧线的宽度与掩摸板线条的宽度精度基本保持一致。用基片表面刻蚀槽两侧线定位光纤或折变透镜,消除了传统的用凹形槽内表面定位光纤或折变透镜时,凹形槽成形过程中,引入的各种不均匀因素的影响。故本发明提出的光纤阵列和折变透镜定位组件,基片成本低廉,每一条光纤或折变透镜的定位精度可达0.1μm。可以大大提高有关光电子器件在封装技术中的成品率、效率和高质量的光学性能。The invention adopts the lines on both sides of the etched groove on the surface of the substrate to position each optical fiber or folding lens to form an optical fiber array or a folding lens array. Because the surface processing precision of substrates such as various glasses, silicon wafers, and lithium niobate is very high, the accuracy of the line width of the photolithography mask is generally less than 0.1 μm. Using the lines on both sides of the etching groove to position the optical fiber requires etching grooves. The depth is much smaller than the depth of the concave groove when the optical fiber is positioned on the inner surface of the concave groove. Therefore, after the surface of the substrate is photolithographically patterned, the reactive ions are vertically bombarded to form concave grooves, and the width of the lines on both sides of the grooves is basically consistent with the width precision of the mask plate lines. Use the lines on both sides of the etched groove on the surface of the substrate to position the optical fiber or the folding lens, eliminating the influence of various uneven factors introduced during the forming process of the concave groove when positioning the optical fiber or the folding lens on the inner surface of the concave groove . Therefore, the positioning assembly of the optical fiber array and the refraction lens proposed by the present invention has a low substrate cost, and the positioning accuracy of each optical fiber or refraction lens can reach 0.1 μm. The yield, efficiency and high-quality optical performance of related optoelectronic devices in packaging technology can be greatly improved.
附图说明Description of drawings
图1(A)~(D)为光纤阵列定位组件现有技术示意图,其中(A)、(B)为美国专利5,656120;(C)为中国专利00101007.7;(D)为美国专利6,706371。Figure 1 (A) ~ (D) is a schematic diagram of the prior art of fiber array positioning components, where (A) and (B) are US
图2(A)~(C)为本发明横截面示意图。2(A)-(C) are schematic cross-sectional views of the present invention.
图3(a)为本发明光纤阵列组件纵截面示意图。Fig. 3(a) is a schematic longitudinal sectional view of the optical fiber array assembly of the present invention.
图3(b)为折变透镜阵列组件纵截面示意图。Fig. 3(b) is a schematic longitudinal sectional view of the folding lens array assembly.
图4为本发明光纤阵列定位组件示意图。Fig. 4 is a schematic diagram of an optical fiber array positioning assembly of the present invention.
图5(a)~(f)表示在基片上刻蚀凹形槽的工艺流程。5(a)-(f) show the process flow of etching concave grooves on the substrate.
图6为二维光纤阵列和折变透镜阵列定位组件示意图。Fig. 6 is a schematic diagram of positioning components of a two-dimensional optical fiber array and a folding lens array.
图7为光纤阵列定位组件与折变透镜定位组件形成并行准直光束阵列组件示意图。7 is a schematic diagram of a parallel collimated beam array assembly formed by an optical fiber array positioning assembly and a folding lens positioning assembly.
图8(A)~(B)表示本发明用于垂直腔面发射激光一维线列阵输出耦合组件的情况。8(A)-(B) show the situation that the present invention is used in the output coupling component of the vertical cavity surface emitting laser one-dimensional line array.
图8(C)为光纤阵列定位组件与垂直腔面发射激光器集成在同一底基片上的示意图。Fig. 8(C) is a schematic diagram of the integration of the fiber array positioning component and the vertical cavity surface emitting laser on the same base substrate.
图9(A)~(B)表示本发明用于垂直腔面发射激光二维线列阵输出耦合组件中的情况。9(A)-(B) show the situation that the present invention is used in the output coupling component of the vertical cavity surface emitting laser two-dimensional line array.
具体实施方式Detailed ways
以下结合附图具体说明本发明的实施方式。Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
本发明的组件可以采用各种玻璃加工成高精度的基片,加工方便,成本低。图2表示本发明组件各种形式的横截面,其中(A)为下基片表面刻蚀有凹形槽;(B)为上基片表面刻蚀有凹形槽;(C)是上、下基片表面均刻蚀有凹形槽。槽面两侧线的宽度应小于光纤芯径或折变透镜的直径。刻蚀深度与槽的宽度有关,当光纤或折变透镜放置在表面槽两侧线上,光纤或折变透镜的表面不能接触槽的内表面为宜。每一条光纤或折变透镜放置的位置,就是说每一条凹形槽的位置,可根据光电子器件的需要而定。有的是等距离平行槽,有的是非均匀间距的平行槽,有的是各凹形槽成扇形分布或其他形状分布。The components of the invention can be processed into high-precision substrates by using various glasses, and the processing is convenient and the cost is low. Fig. 2 represents the cross section of various forms of assembly of the present invention, and wherein (A) is that lower substrate surface is etched with concave groove; (B) is that upper substrate surface is etched with concave groove; (C) is upper, Concave grooves are etched on the surface of the lower substrate. The width of the lines on both sides of the groove surface should be smaller than the core diameter of the optical fiber or the diameter of the folding lens. The etching depth is related to the width of the groove. When the optical fiber or the folding lens is placed on the two sides of the surface groove, it is better that the surface of the optical fiber or the folding lens cannot contact the inner surface of the groove. The position of each optical fiber or folding lens, that is to say, the position of each concave groove, can be determined according to the needs of the optoelectronic device. Some are equidistant parallel grooves, some are parallel grooves with non-uniform spacing, and some are distributed in a fan shape or other shapes.
图3(a)所示为本发明的光纤阵列定位组件纵截面,基片的一端加工成楔角,楔角的角度和长度,能够将裸露的光纤后面带包层的光纤部分嵌入其内,张角空间注胶后对裸露的光纤尾部起保护作用,图中1为光纤纤芯,2为刻有凹形槽的下基片,3为上基片,4为注胶层,充满上下两基片和光纤之间的间隙,将基片光纤固化成一整体,5为光纤的包层。图3(b)为本发明折变透镜阵列纵截面图,6为折变透镜,注胶层充满上、下两基片和折变透镜之间的间隙,将它们固化成一整体。Fig. 3 (a) shows the longitudinal section of the optical fiber array positioning assembly of the present invention, and one end of the substrate is processed into a wedge angle, and the angle and length of the wedge angle can embed the cladding fiber part behind the exposed optical fiber in it, After glue injection in the opening angle space, it can protect the exposed fiber tail. In the figure, 1 is the fiber core, 2 is the lower substrate with concave grooves, 3 is the upper substrate, and 4 is the glue injection layer, which is filled with the upper and lower sides. The gap between the substrate and the optical fiber solidifies the substrate optical fiber into a whole, and 5 is the cladding of the optical fiber. Fig. 3 (b) is a vertical cross-sectional view of the folding lens array of the present invention, 6 is the folding lens, and the glue injection layer fills the gap between the upper and lower substrates and the folding lens, and solidifies them into a whole.
图4表示本发明的一种光纤阵列定位组件,其制作工艺如下,首先将每一条光纤的前面一段包层剥离,光纤芯1裸露,清洗备用。带有刻蚀槽的基片2置于一片大基片之上和显微镜之下,可清晰观察刻蚀槽的表面。将一条一条的光纤的裸露部分准确排放在基片表面刻蚀槽两侧或之中。注意,带包层5的光纤,其纤芯和包层剥离,接口置于基片层尾部光楔内。在排放每一条光纤时,下基片的前后,在大基片上,可放置厚度相对于基片2稍薄一点的两块基片。其上铺上双面胶。在排放每一条光纤时,暂起固定作用。排列完全部光纤之后盖上上基片3压紧,上下基片之间的空间由注胶层4固化,光纤阵列组件端口表面进行抛光。也可以先排放左右两条光纤,盖上上基片压紧,从两侧注入一点胶固化,以使上下基片固定,其它中间光纤,一条一条插入相应的刻蚀槽位置,然后,在上下基片之间的空间注胶固化,再将光纤阵列组件端口表面进行抛光。如果光纤端部已经带有熔融球形的光纤或光纤端部已加工成其他形状,上下两基片的前端也象后端一样加工成楔角。裸露熔融球形或其他已加工成形的光纤头部置于基片前端光楔空间加以保护。Fig. 4 shows a kind of optical fiber array positioning assembly of the present invention, and its manufacturing process is as follows, firstly strip off the cladding of the front section of each optical fiber, the
选用紫外玻璃或具有膨胀系数很小的特性的材料作为基片具有稳定好的优点。此类基片可采用制作好掩膜板图形,在加工好的基片上镀一层金属膜作掩蔽层,其厚度由刻蚀槽的深度而定,然后再采用光刻一反应离子刻蚀的方法,刻蚀形成凹形槽,其具体工艺流程如图5所示。图5(a)表示基片,首先根据器件排放光纤分布位置的需要,制作好掩膜板图形,根据光刻一反应离子刻蚀的工艺流程,在基片上表面制作一层较厚的掩蔽层,见图5(b),光刻腐蚀,将需要刻蚀凹形槽的表面暴露出来,见图5(c)。在反应离子刻蚀工艺中,用离子垂直轰击见图5(d)。使基片表面形成所需要的一定深度的凹形槽,见图5(e)。除去掩蔽层,形成了所需要的表面带凹形槽分布的基片,见图5(f)。在基片上制作凹形槽工艺,不同材料可以采用不同工艺,但一定要保持基片表面上刻蚀槽两侧线之间宽度,与掩膜板图形精度一致为宜,槽面两侧线的宽度b1b2、b3b4、b5b6、……bn-1bn、均应小于光纤芯径或折变透镜直径。Selecting ultraviolet glass or a material with a small expansion coefficient as the substrate has the advantage of good stability. This kind of substrate can be prepared with a mask pattern, and a metal film is coated on the processed substrate as a masking layer. The thickness is determined by the depth of the etching groove, and then photolithography-reactive ion etching is used. method, etching to form concave grooves, and its specific process flow is shown in FIG. 5 . Figure 5(a) shows the substrate. Firstly, according to the needs of the distribution position of the optical fiber emitted by the device, the mask pattern is made, and according to the process flow of photolithography-reactive ion etching, a thicker masking layer is made on the upper surface of the substrate. , see Fig. 5(b), photoetching etch exposes the surface to be etched with concave grooves, see Fig. 5(c). In the reactive ion etching process, vertical bombardment with ions is shown in Figure 5(d). A concave groove of a certain depth required is formed on the surface of the substrate, as shown in FIG. 5( e ). After removing the masking layer, the desired substrate with concave groove distribution on the surface is formed, as shown in Fig. 5(f). The process of making concave grooves on the substrate, different materials can adopt different processes, but the width between the lines on both sides of the etching groove on the substrate surface must be kept, and it is appropriate to be consistent with the pattern accuracy of the mask plate. The width of the lines on both sides of the groove surface b 1 b 2 , b 3 b 4 , b 5 b 6 , ... b n-1 b n , all should be smaller than the core diameter of the optical fiber or the diameter of the refraction lens.
基片表面刻蚀槽两侧线定位光纤或折变透镜,可研制成二维的光纤阵列或折变透镜定位组件,见图6。它是由中间基片9和上下两侧基片7、8组成。双面带凹形刻蚀槽的基片工艺如下,基片厚度、表面尺寸按照需要加工,基片两表面凹形槽的刻蚀,可用一块掩摸板,用红外双面对准曝光机,分别在两表面光刻图形,然后按照图5的工艺流程,用反应离子刻蚀方法,在基片两表面分别刻蚀凹形槽,再按照图4工艺将光纤或折变透镜装配一侧,注胶固化,再将光纤或折变透镜装配基片的另一侧,注胶固化,制成二维光纤阵列。The lines on both sides of the etching groove on the surface of the substrate position the optical fiber or the folding lens, which can be developed into a two-dimensional optical fiber array or a folding lens positioning assembly, as shown in FIG. 6 . It is made up of the middle substrate 9 and the
图7为由光纤阵列和折变透镜阵列同置于一片底基片10上,并且使每一条光纤和每一个折变透镜完全同轴放置,形成的并行准直光束阵列组件。因为光纤阵列和折变透镜阵列定位精度可达0.1μm,,故两者之间每一条光纤和每一个折变透镜可以完全同轴设置,而形成并行准直光束阵列组件。FIG. 7 is a parallel collimated beam array assembly formed by placing the optical fiber array and the refraction lens array on a bottom substrate 10, and placing each optical fiber and each refraction lens completely coaxially. Because the positioning accuracy of the optical fiber array and the refraction lens array can reach 0.1 μm, each optical fiber and each refraction lens between the two can be completely coaxially arranged to form a parallel collimated beam array assembly.
用基片表面刻蚀槽两侧线定位光纤的各种均匀等间距,非均匀间距和其他分布的高精度一维和二维多模光纤阵列组件,可用于垂直腔面发射激光器(VCSEL)一维线列阵和二维列阵的输出耦合组件。竖直腔面发射激光器(VCSEL)是一种完整的平面生长工艺,一片VCSEL芯片上,排列着成千上万个VCSEL象元。一般的边发射半导体激光器,其光束点从平行于表面的面边发射出激光,激光发射输出时,由于上、下两表面的限制,激光束光斑呈长椭园形,很难耦合到光纤芯径中去,而VCSEL激光束是从垂直于表面发射,激光束光斑呈园对称形状,很容易耦合到光纤芯径中去。如果将VCSEL芯片切割成条状,VCSEL象元为一维阵列排列,标准的间距为250μm,如果一维多模光纤阵列组件中的光纤之间的间距同样是250μm的话,由于它们都是采用掩模板光刻工艺,其间距的误差都为0.1μm,很容易将每一个VCSEL象元严格对准一条光纤,如果它们之间能放置很近,则每一个VCSEL象元发出的激光直接耦合到每一条多模光纤的效率可达90%以上。如果它们有一定的距离,则在它们之间需要放置1片微透镜列阵,需要将VCSEL激光束准直后,再耦合到每一条光纤中去。图8(A)为一维线列阵VCSEL激光直接耦合到多模光纤芯径1的原理图。11为VCSEL芯片中的激光象元,12为驱动激光象元的IC芯片,13为放置VCSEL芯片和IC芯片的基片,14为放置整个耦合组件的底基片。图8(B)为一维线列阵VCSEL激光束经过全反射镜15全反射,再分别耦合到多模光纤带中每一条多模光纤中。图8(C)为光纤阵列定位组件与VCSEL芯片集成的示意图。图9(A)和(B)分别是二维VCSEL激光列阵16直接耦合到二维光纤列阵,和二维VCSEL激光列阵16经全反射镜15全反射再分别耦合到二维光纤列阵之中的原理图。本发明的高精度光纤列阵组件还可应用于各种类型的平面光学波导芯片和微光机电MEMS芯片输入、输出接口耦合组件,研制成各种密集波分复用/解复用器件、光交换开关和光交叉连接器件。Use the lines on both sides of the etched groove on the surface of the substrate to locate various uniform and equal spacing, non-uniform spacing and other distributions of high-precision one-dimensional and two-dimensional multimode fiber array components, which can be used for one-dimensional lines of vertical cavity surface emitting lasers (VCSEL) output coupling components for arrays and 2D arrays. Vertical Cavity Surface Emitting Laser (VCSEL) is a complete planar growth process. Thousands of VCSEL pixels are arranged on a VCSEL chip. In general edge-emitting semiconductor lasers, the beam spot emits laser light from the side parallel to the surface. When the laser is emitted and output, due to the limitation of the upper and lower surfaces, the laser beam spot is in the shape of a long ellipse, which is difficult to couple to the fiber core. The VCSEL laser beam is emitted perpendicular to the surface, and the laser beam spot is in a circular symmetrical shape, which is easy to couple into the fiber core. If the VCSEL chip is cut into strips, the VCSEL pixels are arranged in a one-dimensional array, and the standard spacing is 250 μm. If the spacing between the fibers in the one-dimensional multimode fiber Template lithography process, the error of the pitch is 0.1μm, it is easy to strictly align each VCSEL pixel with an optical fiber, if they can be placed very close, the laser emitted by each VCSEL pixel is directly coupled to each The efficiency of a multimode fiber can reach more than 90%. If there is a certain distance between them, a microlens array needs to be placed between them, and the VCSEL laser beam needs to be collimated before being coupled into each optical fiber. FIG. 8(A) is a schematic diagram of a one-dimensional linear array VCSEL laser directly coupled to the
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US7266282B2 (en) | 2002-07-23 | 2007-09-04 | Kohoku Kogyo Co., Ltd. | Fiber array for optical communication and method of manufacturing the fiber array |
| CN100356220C (en) * | 2005-09-21 | 2007-12-19 | 武汉海博光技术有限公司 | Optical fibre array positioning assembly |
| CN100437180C (en) * | 2006-10-25 | 2008-11-26 | 武汉海博光技术有限公司 | Optical fiber positioning substrate in optical fiber array module and producing method |
| CN102096148A (en) * | 2010-11-19 | 2011-06-15 | 四川天邑康和光电子有限公司 | Fiber array and manufacturing method thereof |
| CN102520495A (en) * | 2011-11-23 | 2012-06-27 | 深圳市易飞扬通信技术有限公司 | Optical fiber array for directly coupling with array VSCEL (vertical cavity surface emitting laser) or PD (photoelectric detector) chip and manufacturing method thereof |
| CN103543498A (en) * | 2012-07-13 | 2014-01-29 | 建毅科技股份有限公司 | Optical fiber arranging device |
| CN107422426A (en) * | 2017-08-03 | 2017-12-01 | 昂纳信息技术(深圳)有限公司 | A kind of fiber array |
| WO2017220001A1 (en) * | 2016-06-24 | 2017-12-28 | 扇港元器件(香港)有限公司 | Parallel optical transceiver module |
| CN107561638A (en) * | 2017-09-25 | 2018-01-09 | 中山市美速光电技术有限公司 | A double-layer optical fiber array |
| CN108983361A (en) * | 2018-09-29 | 2018-12-11 | 上海福聚生实业有限公司 | A kind of double fiber array and production method for optical signal input and output coupling |
| CN109407231A (en) * | 2018-12-07 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| ES2927787A1 (en) * | 2021-05-04 | 2022-11-10 | Carbon Composites S L | Procedure for making pieces of carbon fiber or similar and composites with light transmission capacity, as well as a sandwich piece formed through said procedure (Machine-translation by Google Translate, not legally binding) |
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| CN100356221C (en) * | 2005-12-30 | 2007-12-19 | 武汉海博光技术有限公司 | Optical fiber arranging and packing equipment in optical fiber array component element |
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| US7266282B2 (en) | 2002-07-23 | 2007-09-04 | Kohoku Kogyo Co., Ltd. | Fiber array for optical communication and method of manufacturing the fiber array |
| CN100356220C (en) * | 2005-09-21 | 2007-12-19 | 武汉海博光技术有限公司 | Optical fibre array positioning assembly |
| CN100437180C (en) * | 2006-10-25 | 2008-11-26 | 武汉海博光技术有限公司 | Optical fiber positioning substrate in optical fiber array module and producing method |
| CN102096148A (en) * | 2010-11-19 | 2011-06-15 | 四川天邑康和光电子有限公司 | Fiber array and manufacturing method thereof |
| CN102520495B (en) * | 2011-11-23 | 2014-11-05 | 深圳市易飞扬通信技术有限公司 | Optical fiber array for directly coupling with array VSCEL (vertical cavity surface emitting laser) or PD (photoelectric detector) chip and manufacturing method thereof |
| CN102520495A (en) * | 2011-11-23 | 2012-06-27 | 深圳市易飞扬通信技术有限公司 | Optical fiber array for directly coupling with array VSCEL (vertical cavity surface emitting laser) or PD (photoelectric detector) chip and manufacturing method thereof |
| CN103543498A (en) * | 2012-07-13 | 2014-01-29 | 建毅科技股份有限公司 | Optical fiber arranging device |
| CN103543498B (en) * | 2012-07-13 | 2015-06-17 | 建毅科技股份有限公司 | Optical fiber arranging device |
| WO2017220001A1 (en) * | 2016-06-24 | 2017-12-28 | 扇港元器件(香港)有限公司 | Parallel optical transceiver module |
| CN107422426A (en) * | 2017-08-03 | 2017-12-01 | 昂纳信息技术(深圳)有限公司 | A kind of fiber array |
| CN107561638A (en) * | 2017-09-25 | 2018-01-09 | 中山市美速光电技术有限公司 | A double-layer optical fiber array |
| CN108983361A (en) * | 2018-09-29 | 2018-12-11 | 上海福聚生实业有限公司 | A kind of double fiber array and production method for optical signal input and output coupling |
| CN109407231A (en) * | 2018-12-07 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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