CN1236372C

CN1236372C - key structure

Info

Publication number: CN1236372C
Application number: CN 02147970
Authority: CN
Inventors: 赵世宏
Original assignee: Darfon Electronics Corp
Current assignee: Darfon Electronics Corp
Priority date: 2002-10-31
Filing date: 2002-10-31
Publication date: 2006-01-11
Anticipated expiration: 2022-10-31
Also published as: CN1493960A

Abstract

A key structure comprises a key cap, an elastic body, a film component and a substrate. The elastic body is arranged below the keycap. The film assembly is disposed under the elastic body and has a first film, a second film and a spacer. The spacing element is arranged between the first film and the second film. The substrate is disposed under the thin film assembly and has a foreign material removing portion. The foreign matter removing part is completely covered by the film assembly and removes the foreign matters on the substrate through the foreign matter removing part.

Description

Press-key structure

Technical field

The present invention relates to a kind of press-key structure, particularly relate to a kind of foreign matter on the substrate can the eliminating, and the press-key structure of the signal that can not make the mistake input.

Background technology

Fig. 1 is an existing press-key structure 1.Fig. 2 is for showing the A-A cross-sectional schematic of existing press-key structure 1.In general, existing press-key structure 1 is arranged on the keyboard of a notebook, with as a signal input apparatus.Simultaneously, press-key structure 1 mainly is made up of a keycap 10, an elastic body 11, a film assembly 12, a substrate 13 and a bindiny mechanism 21.Elastic body 11 is connected in keycap 10, and is arranged under the keycap 10.Film assembly 12 is arranged under the elastic body 11, and has a first film 14, one second film 15 and a spacer element 16.Spacer element 16 is arranged between the first film 14 and second film 15.Simultaneously, film assembly 12 is arranged on the substrate 13.One end of bindiny mechanism 21 is connected in substrate 13, and the other end of bindiny mechanism 21 is connected in keycap 10.Keycap 10 is connected on the substrate 13 in mode moving up and down by bindiny mechanism 21.In addition, on the apparent surface of the first film 14 and second film 15, also be respectively arranged with one first conducting portion 17 and one second conducting portion 18, and first conducting portion 17 is with an atomic little distance (0.05～0.1mm) and be interval in second conducting portion 18.In addition, first conducting portion 17 and second conducting portion 18 are electrically connected to the microprocessor of keyboard again.

When a user will import a signal to notebook by this press-key structure 1, only need push keycap 10 so that the central elastic cylinder 19 of elastic body 11 presses the first film 14 of film assembly 12.At this moment, just can contact and form electrical connection, so just this signal can be inputed in the notebook, as shown in Figure 3 with second conducting portion 18 on second film 15 at first conducting portion 17 on the first film 14.

Yet, because the assembling of press-key structure 1 is not to carry out in dust free room, so foreign matters such as the dust or the grains of sand may drop on substrate 13.In addition, substrate 13 also can be plastic injection-moulded and moulding, therefore has the existence of burr or residual plastic bits on substrate 13.Moreover, because the base of notebook can be with the processing of spraying paint, so may make foreign matter attached on the substrate 13 in the process of spraying paint.Therefore, as shown in Figure 4, when being arranged at film assembly 12 on the substrate 13, second film 15 of film assembly 12 can be because of above-mentioned foreign matter 20 projections, simultaneously, owing to first conducting portion 17 is interval in second conducting portion 18 with an atomic little distance, so under press-key structure 1 and intact situation, improper contact second conducting portion 18 of first conducting portion, 17 meetings, thereby the signal that makes the mistake input.

Summary of the invention

The object of the present invention is to provide a kind of improved press-key structure,, the foreign matter on the substrate can be got rid of, and can not make press-key structure under intact situation, the signal input that makes the mistake by a foreign matter eliminating portion is set on the substrate of press-key structure.

The present invention adopts as detailed below feature to solve the above problems basically.That is to say, the present invention includes a keycap; One elastic body is arranged under this keycap; One film assembly is arranged under this elastic body, and has a first film, one second film and a spacer element, and wherein, this spacer element is arranged between this first film and this second film; An and substrate, be arranged under this film assembly, and has a foreign matter eliminating portion, be located among this substrate and and be connected with the upper surface of this substrate, this foreign matter eliminating portion is entirely this film assembly and covers, after the foreign matter on this substrate was got rid of by this foreign matter eliminating portion, this film assembly was on being arranged at this substrate the time, and this second film can be because of the foreign matter projection.

Simultaneously,, be respectively arranged with one first conducting portion and one second conducting portion on the apparent surface of this first film and this second film, and this first conducting portion is with a both set a distance and be interval in this second conducting portion according to press-key structure of the present invention.

Again in the present invention, this foreign matter eliminating portion of this substrate is positioned under this first conducting portion and this second conducting portion.

Again in the present invention, this film assembly contacts in this elastic body.

Again in the present invention, this foreign matter eliminating portion of this substrate is a through hole.

Again in the present invention, this foreign matter eliminating portion of this substrate is a recess.

Again in the present invention, this spacer element is a ring-type element, and this first conducting portion and this second conducting portion are positioned among this ring-type element.

Again in the present invention, this first film and this second film are plastic sheeting.

Again in the present invention, this spacer element is made with plastic material.

Again in the present invention, this substrate is a sheet metal.

Again in the present invention, this substrate is a plastic plate.

Again in the present invention, also comprise a bindiny mechanism, an end of this bindiny mechanism is connected in this substrate, and the other end of this bindiny mechanism is connected in this keycap, and wherein, this keycap is connected on this substrate in mode moving up and down by this bindiny mechanism.

In addition, another object of the present invention is that a kind of thin film switch structure will be provided.This thin film switch structure comprises a film assembly, have a first film, one second film and a spacer element, this spacer element is arranged between this first film and this second film, be respectively arranged with one first conducting portion and one second conducting portion on the apparent surface of this first film and this second film, wherein, this first conducting portion is with a both set a distance and be interval in this second conducting portion; An and substrate, be arranged under this film assembly, and has a foreign matter eliminating portion, be located among this substrate and with the upper surface of this substrate and be connected, wherein, this foreign matter eliminating portion is positioned under this first conducting portion and this second conducting portion, this foreign matter eliminating portion is entirely this film assembly and covers, after the foreign matter on this substrate was got rid of by this foreign matter eliminating portion, this film assembly was on being arranged at this substrate the time, and this second film can be because of the foreign matter projection.

Description of drawings

Fig. 1 is an existing press-key structure;

Fig. 2 is the A-A cut-open view of Fig. 1, and wherein, first conducting portion and second conducting portion are in released state;

Fig. 3 is the A-A cut-open view of Fig. 1, and wherein, first conducting portion and second conducting portion are in connection status;

Fig. 4 is the A-A cut-open view of Fig. 1, and wherein, first conducting portion and second conducting portion are in connection status because of the foreign matter on the substrate;

Fig. 5 is the diagrammatic cross-section of the press-key structure of the first embodiment of the present invention;

Fig. 6 is the diagrammatic cross-section of the press-key structure of the second embodiment of the present invention;

Fig. 7 is the diagrammatic cross-section of the press-key structure of the third embodiment of the present invention.

Concrete implementation content

First embodiment

See also Fig. 5, press-key structure 100 of the present invention mainly includes a keycap 110, an elastic body 120, a film assembly 130, a substrate 140 and a bindiny mechanism 145.Elastic body 120 is connected in keycap 110, and is arranged under the keycap 110.Film assembly 130 is arranged under the elastic body 120.Substrate 140 is arranged under the film assembly 130.One end of bindiny mechanism 145 is connected in substrate 140, and the other end of bindiny mechanism 145 is connected in keycap 110.Keycap 110 is connected on the substrate 140 in mode moving up and down by bindiny mechanism 145.

Film assembly 130 has a first film 150, one second film 160 and a spacer element 170.On the apparent surface of the first film 150 and second film 160, be respectively arranged with one first conducting portion 180 and one second conducting portion 190, and first conducting portion 180 is interval in second conducting portion 190 with an atomic little distance.Spacer element 170 is a plastic annular element, and is arranged between the first film 150 and second film 160.Simultaneously, first conducting portion 180 and second conducting portion 190 are positioned among this ring-type element.

Substrate 140 has a foreign matter eliminating portion 200.Foreign matter eliminating portion 200 is entirely film assembly 130 and covers, and is positioned at the below of first conducting portion 180 and second conducting portion 190.In the present embodiment, the foreign matter eliminating portion 200 of substrate 140 is a through hole.

Therefore, when having foreign matters such as the dust or the grains of sand on the substrate 140, this each foreign matter just can be discharged by through hole.So in the time of on film assembly 130 is arranged at substrate 140, second film 160 just can be because of have foreign matter and projection on substrate 140, and then more can under press-key structure 100 intact situations, not make first conducting portion 180 of the first film 150 take place to be electrically connected improperly with second conducting portion 190 of second film 160.

Second embodiment

See also Fig. 6, the difference of the present embodiment and first embodiment only is that the foreign matter eliminating portion 210 of substrate 140 is a recess, and the assembly structure of remaining press-key structure 100 is all identical with first embodiment with configuration mode, does not therefore give unnecessary details in addition.

Similarly, when having foreign matters such as the dust or the grains of sand on the substrate 140, these foreign matters just can drop among recess 210.So in the time of on film assembly 130 is arranged at substrate 140, second film 160 just can be because of have foreign matter and projection on substrate 140, and then under the situation that more can not be touched at press-key structure 100 ends, make first conducting portion 180 of the first film 150 take place to be electrically connected improperly with second conducting portion 190 of second film 160.

The 3rd embodiment

See also Fig. 7, the press-key structure 300 of present embodiment is a kind of press-key structure of mobile phone.Present embodiment and the difference of first, second embodiment are that the structure of keycap 110 of the structure of keycap 110 ' of press-key structure 300 and press-key structure 100 is different.Simultaneously, press-key structure 300 does not have a bindiny mechanism, that is to say, keycap 110 ' is not to be connected on the substrate 140 in mode moving up and down by bindiny mechanism, and therefore, moving up and down of keycap 110 ' is directly to carry out.In addition, the assembly structure of remaining press-key structure 300 is all identical with first embodiment with configuration mode, does not therefore give unnecessary details in addition.

Similarly, when having foreign matters such as the dust or the grains of sand on the substrate 140, these foreign matters just can be discharged by through hole.So in the time of on film assembly 130 is arranged at substrate 140, second film 160 just can be because of have foreign matter and projection on substrate 140, and then more can under press-key structure 100 intact situations, not make first conducting portion 180 of the first film 150 take place to be electrically connected improperly with second conducting portion 190 of second film 160.

In addition, the press-key structure 300 of present embodiment also can adopt recess 210 as described in the second embodiment, so when having foreign matters such as the dust or the grains of sand on the substrate 140, these foreign matters just can drop among recess 210, so it equally has identical effect.

Though in conjunction with having disclosed the present invention with preferred embodiment; yet it is not in order to limit the present invention; any skilled personnel change and retouching when doing some, so protection scope of the present invention should be with being as the criterion that claim was defined without departing from the spirit and scope of the present invention.

Claims

1. A button structure, comprising:

One key cap;

An elastic body is arranged under the keycap;

A film component is disposed under the elastic body and has a first film, a second film and a spacer element, wherein the spacer element is disposed between the first film and the second film; and

a substrate, arranged under the thin film assembly, and has a foreign object removal part, which is arranged in the substrate and communicates with the upper surface of the substrate, the foreign object removal part is completely covered by the thin film assembly,

After the foreign matter on the substrate is removed by the foreign matter removing part, the second film will not protrude due to the foreign matter when the film assembly is placed on the substrate.

2. The button structure according to claim 1, wherein a first conduction portion and a second conduction portion are respectively provided on opposite surfaces of the first film and the second film, and the first conduction portion spaced apart from the second conducting portion with a predetermined distance.

3 . The button structure according to claim 2 , wherein the foreign object removing portion of the substrate is located under the first conducting portion and the second conducting portion. 4 .

4. The button structure as claimed in claim 1, wherein the film component is in contact with the elastic body.

5. The button structure as claimed in claim 1, wherein the foreign object removing part of the substrate is a through hole.

6. The button structure as claimed in claim 1, wherein the foreign object removing portion of the substrate is a concave portion.

7. The button structure according to claim 2, wherein the spacer component is a ring component, and the first conducting portion and the second conducting portion are located in the ring component.

8. The button structure as claimed in claim 1, wherein the first film and the second film are plastic films.

9. The button structure as claimed in claim 1, wherein the spacing element is made of plastic material.

10. The button structure as claimed in claim 1, wherein the substrate is a metal plate.

11. The button structure as claimed in claim 1, wherein the substrate is a plastic plate.

12. The button structure according to claim 1, further comprising a connection mechanism, one end of the connection mechanism is connected to the substrate, and the other end of the connection mechanism is connected to the keycap, wherein the keycap passes through the connection mechanism It is connected to the substrate in a manner that can move up and down.

13. A membrane switch structure, comprising:

A film component has a first film, a second film and a spacer element, the spacer element is arranged between the first film and the second film, and the opposite surfaces of the first film and the second film are respectively A first conducting portion and a second conducting portion are provided, wherein the first conducting portion is spaced apart from the second conducting portion by a predetermined distance; and

A substrate is arranged under the thin film assembly, and has a foreign object removal part arranged in the substrate and communicated with the upper surface of the substrate, wherein the foreign matter removal part is located at the first conducting part and the second conductive part. Under the conduction part, the foreign matter removal part is completely covered by the film component,

14. The membrane switch structure as claimed in claim 13, wherein the foreign object removing part of the substrate is a through hole.

15. The membrane switch structure as claimed in claim 13, wherein the foreign object removing portion of the substrate is a concave portion.

16. The membrane switch structure as claimed in claim 13, wherein the spacer element is a ring element, and the first conducting portion and the second conducting portion are located in the ring element.

17. The membrane switch structure as claimed in claim 13, wherein the first membrane and the second membrane are plastic membranes.

18. The membrane switch structure as claimed in claim 13, wherein the spacing element is made of plastic material.

19. The membrane switch structure as claimed in claim 13, wherein the substrate is a metal plate.

20. The membrane switch structure as claimed in claim 13, wherein the substrate is a plastic plate.