CN1235067C - Processing machine for forming pattern on surface of optical element - Google Patents

Abstract

The invention discloses a processing machine capable of forming patterns on the surface of an optical element, which comprises: the machining device comprises a working platform, a linear tool apron, at least one tool, at least one counterweight sliding block and a machining main shaft; an optical element to be processed can be borne above the working platform and can be driven to move horizontally; the linear tool apron is arranged above the working platform, the upper surface of the linear tool apron is provided with an upper slide rail which can be used for a plurality of counterweight sliding blocks to move back and forth, and a proper downward pressure is provided for a tool below the linear tool apron; the lower surface of the optical element is provided with a lower slide rail for the cutter to move back and forth, and the cutter is adjusted to a proper position according to a pattern to be formed on the surface of the optical element. The processing main shaft is fixedly connected above the linear tool apron and can drive the linear tool apron to move in the direction vertical to the working platform. The invention can cut the surface of the optical element with uniform cutting force and obtain uniform patterns.

Description

Processing machine for forming patterns on the surface of optical elements

technical field

The invention relates to a processing machine capable of forming patterns on the surface of an optical element, in particular to a single-axis multi-tool processing machine which uses a counterweight slider to adjust the cutting force of a tool.

Background technique

With the rapid progress of thin-film transistor (TFT-LCD) production technology, and its advantages of thinness, lightness, power saving, and radiation-free, liquid crystal displays are widely used in personal digital assistants (PDAs), notebook computers, digital Cameras, camcorders, mobile phones and other electronic products. Coupled with the industry's active investment in research and development and the adoption of large-scale production equipment, the quality of liquid crystal displays has been continuously improved and the price has been continuously reduced, thus rapidly expanding the application field of liquid crystal displays. However, since the liquid crystal display is a non-luminescent display device, it must rely on a backlight module to provide a light source to produce a display function.

Referring to FIG. 1 , it is a sectional view of a known backlight module 10 . The composition of the backlight module 10 mainly includes a light guide plate 11 , a reflector 12 , a lamp tube 13 , a multilayer optical film 14 and a frame 15 . The light guide plate 11 and the film 14 are made of light-transmitting acrylic acid, and are manufactured by injection molding or extrusion. Appropriate patterns are provided, and these patterns are mainly used as diffusion points 16 for light scattering, the purpose of which is to make the backlight module 10 have the effect of increasing light and wide viewing angle. The reflective sheet 12 is arranged on the lower surface of the light guide plate 11, and it can reflect the light emitted from the lower surface of the light guide plate 11 back, and guide it back to the light guide plate 11 to increase the utilization rate of the light. The lamp tube 3 is disposed on one side of the light guide plate 11 , and is composed of a cold cathode tube and guides light into the light guide plate 11 by means of end surface illumination. The frame 15 is disposed on the lower surface and side of the backlight module 10 , and its function is to protect the backlight module 10 and its internal components.

Known technology In the content of U.S. Patent Application No. Appl.No 09/766,774 & No 09/766,914, two patents are disclosed about the method and device for forming patterns on the lower surface of the light guide plate. In the content disclosed in the known technology , mainly using a scraper (cutter) with multiple pins, inserting the pins below the scraper into the surface of the light guide plate to a certain depth, and using a driving device to drive the scraper to make it relative to the light guide plate in a specific direction Movement, and then the stitches cut out a pattern of multiple V-shaped grooves on the surface of the light guide plate. Wherein, the pattern density formed on the surface of the light guide plate usually gradually decreases from the end close to the light tube to the end away from the light tube, the purpose of which is to make the light source inside the light guide plate diffuse more uniformly.

However, since the known technology is to fix the light guide plate and drive the scraper, multiple V-shaped grooves are formed on the surface of the light guide plate. During the continuous scraping process, the scraper is easy to affect the quality of the pattern due to vibration. In addition, the known technology The pins are fixed under the scraper. When the scraper is designed, the shape, density and depth of the pattern it can form will also be fixed and cannot be changed, because for the light guide plate, sometimes the U-shaped groove The shape of the pattern may have a better effect than the V-shaped groove. In addition, the density and depth of the pattern may also be affected by the difference in the material of the light guide plate or the uneven brightness of the lamp tube, so appropriate adjustments must be made. However, the known technology The above-mentioned functions cannot be provided, which affects the quality of the backlight module.

In view of this, for relevant practitioners, they are all committed to improving the pattern processing machines for optical elements such as light guide plates and optical films, in order to improve the shortcomings of known technologies, and then propose a method that can form patterns on the surface of optical elements. The advanced processing machine makes the quality of the formed pattern better and the effect better.

Contents of the invention

The main purpose of the present invention is to provide a processing machine that can form patterns on the surface of optical elements. optical quality.

Another object of the present invention is to provide a processing machine that can form patterns on the surface of optical elements. The cutter of the processing machine is non-fixed and movable and adjustable, so the shape of the cutter or the density of the cutter can be changed according to actual needs And the depth, and then obtain the required pattern on the surface of the optical element.

The processing machine for forming patterns on the surface of the optical element of the present invention includes a working platform, a linear tool seat, at least one tool, at least one counterweight slide block and a processing spindle. An optical element to be processed can be carried on the top of the working platform, and the optical element can be an optical film such as a light guide plate or a diffuser. The working platform can drive the optical elements on it to move horizontally and linearly. The linear tool holder is set above the working platform, and its upper surface is provided with an upper slide rail for the counterweight slider to move back and forth in the upper slide rail, and its lower surface is provided with a lower rail for the tool to move back and forth in the lower rail . The counterweight slider has its specific weight, which is set relative to the specific position of the tool on the linear tool holder, so that the linear tool holder can generate a specific downforce. Therefore, the processing machine of the present invention can change the shape of the cutter or adjust the density and depth of the cutter according to the pattern to be formed by the optical element, so as to obtain the desired processing pattern. The machining spindle is fixed in the middle above the linear tool holder, which can drive the linear tool holder to move in a direction perpendicular to the working platform.

When processing the processing machine of the present invention, the cutter must be adjusted according to the pattern to be formed by the optical element, including changing the shape of the cutter or the density and depth of the cutter. Adjusting the counterweight slider to the proper position allows each tool under the linear tool block to generate equal downforce. Afterwards, the linear knife seat is driven to cut the optical element, so that the optical element can obtain a uniform pattern, thereby improving the optical quality of the display backlight module to which the optical element is applied.

In order to make sure that the purpose, features and effects of the present invention are understood, the detailed description is as follows below in conjunction with the accompanying drawings:

Description of drawings

1 is a cross-sectional view of a backlight module;

Fig. 2 is a processing machine capable of forming patterns on the surface of an optical element of the present invention;

Fig. 3A is the front view of the linear tool seat of the present invention;

Fig. 3B is a side view of the linear tool seat of the present invention;

Fig. 4 is the cutter schematic diagram of various shapes of the present invention;

Fig. 5 is a schematic diagram of adjusting the depth of the cutter using a shim in the present invention;

Fig. 6A is a schematic diagram of the downward force generated by the tool under the linear tool seat when the counterweight slider of the present invention has not been compensated;

FIG. 6B is a schematic diagram of the downward force generated by the tool under the linear tool seat when the present invention uses the counterweight slider for compensation.

Code description in the figure

10～Backlight module 11～Light guide plate

12～reflector 13～light tube

14～optical film 15～frame

16～diffusion point 20～processing machine

21～Processing Platform 22～Linear Tool Holder

221～upper rail 222～lower rail

23～Knife 24～Counterweight slider

25～Machining spindle 26～Light guide plate

27～locator

Detailed ways

The present invention discloses a processing machine capable of forming patterns on the surface of an optical element, wherein the optical element is a film such as a light guide plate or a diffuser, but for the sake of illustration, the present invention uses the light guide plate as the best embodiment of the optical element , its implementation will be described in detail through the following content.

Referring to Fig. 2, it is the processing machine schematic diagram that forms pattern on the surface of optical element of the present invention, and processing machine 20 comprises a working platform 21, a linear knife seat 22, a plurality of cutting tools 23, a plurality of counterweight slide blocks 24 and a processing Spindle 25. The top of the working platform 21 can carry an optical element to be processed, such as the light guide plate 26, and the bottom of the working platform 21 is provided with an X-direction drive shaft and a Y-direction drive shaft, which can respectively drive the working platform 21 and the optical elements above it to carry out X-direction. Direction or linear movement in the Y direction.

Referring to FIGS. 3A and 3B , the linear tool seat 22 is arranged above the working platform 21 and parallel to the surface of the working platform 21 . A slide rail 222 is provided on the lower surface of the linear tool seat 22 , where a plurality of tools 23 can move back and forth and be replaced. Each cutter 23 provides a first pressing force. An upper slide rail 221 is provided on the upper surface of the linear tool holder 22 for a plurality of counterweight sliders 24 to move back and forth therein. Wherein each counterweight slider 24 has its specific weight, each counterweight slider 24 is set corresponding to a cutter 23, and generates a certain degree of second pressing force according to its position and its weight. The processing machine utilizes the linear relative movement of the working platform 21 and the cutter to make the cutter 23 cut and form patterns on the surface of the light guide plate 26 . The second pressing force provided by the counterweight slider 24 can compensate the first pressing force of the knife 23 , so that the knife 23 can evenly cut the light guide plate 26 and obtain a uniform pattern.

In addition, the present invention can change the shape of the cutter 23 or adjust the density and depth of the cutter 23 according to the shape, density or depth of the pattern to be formed on the surface of the optical elements such as the light guide plate 26 . The shape of the cutter 23 may be V-shaped or U-shaped, as shown in FIG. 4 . The adjustment of the density of the cutter 23 is related to its arrangement in the lower rail 22, and each cutter 23 is fixed by a locator 27 after moving to an appropriate position, and the locator 27 used can be a bolt or It's clamps etc. The depth of the cutter 23 can be adjusted by using a shim 28, as shown in FIG. 5 . In addition, the machining spindle 25 is combined with the upper middle of the linear tool holder 22 , which can drive the linear tool holder 22 to move perpendicular to the direction of the working platform 21 (Z direction).

During processing, the present invention first drives the linear tool seat 22 downward with the processing spindle 25, so that the tool 23 below the linear tool seat 22 is inserted into an appropriate depth on the surface of the light guide plate 26, and the processing spindle 25 is positioned there. Afterwards, drive the working platform 21 with the drive shaft in the X direction (or the drive shaft in the Y direction) and drive the light guide plate 26 to move horizontally in the X direction (or Y direction), so that the cutter 23 can cut out the surface of the light guide plate 26 that is compatible with the cutter 23. Matching patterns.

As can be seen from the above description, the processing machine of the present invention has the following advantages:

1. The present invention adopts the method of fixing the linear knife seat and moving the processing platform during processing, so that the cutter under the linear knife seat cuts the pattern on the surface of the light guide plate, and the vibration generated in the cutting process is relatively small, while the known technology In the way that the light guide plate is fixed and the scraper is driven, the vibration generated is relatively large. In contrast, the present invention can reduce the vibration and obtain a pattern with better quality.

2. The linear tool seat of the present invention has the function of adjusting the position of the tool, and adjusts the position of the tool of the lower rail according to the density of the pattern, so the processing machine of the present invention can be applied to form various patterns of different densities, while the known technology The squeegee stitches are fixed, and the density of the patterns formed by them is fixed and cannot be changed arbitrarily.

3. The linear knife seat of the present invention has the function of changing the knife, so the shape of the knife can be changed according to the groove shape of the pattern, so that the surface of the light guide plate can obtain a pattern that matches the knife, while the bracket knife and the stitches of the known technology are fixed. This method cannot provide the function of changing the tool. Once the shape of the stitch is determined, the pattern formed by it will be fixed and cannot be changed.

4. The linear knife holder of the present invention can use spacers to adjust the depth of the knife, so that the surface of the light guide plate can obtain groove patterns of different depths, while the known technology cannot provide the above functions, and the depth of the formed pattern grooves is fixed.

5. The linear knife seat of the present invention can use the position adjustment of the counterweight slider to change the downward force generated under the linear knife seat, so that the knife under the linear knife seat can generate uniform cutting force and cut the light guide plate. The reason for obtaining a better quality pattern is as follows.

As shown in Figures 6A and 6B, since the processing spindle of the present invention is fixed in the middle of the linear tool seat, when the processing spindle is driving the linear tool seat so that the tool below it is inserted into the light guide plate, the closer the tool is to the processing spindle, the closer the tool is to the processing spindle. The greater the force it presses down. Conversely, the farther the tool is from the machining spindle, the lower its pressing force is, as shown in Figure 6A. Therefore, the present invention can utilize the change of the position of the counterweight slider above the linear tool seat to adjust the downforce generated under the linear tool seat, so as to compensate the difference in the downforce caused by the position of the tool. Furthermore, each cutter below the linear cutter seat generates an equal downward force (cutting force), so that it can produce uniform and high-quality patterns on the surface of the light guide plate. The oblique area in Figure 6B is the downforce generated by the counterweight slider under the linear tool seat. It can be seen from the figure that the present invention uses the downforce generated by the counterweight slider under the linear tool seat to compensate for the tool's downforce. The difference in downforce results in equal downforce (cutting force) for each cutter.

Of course, the above description is only a preferred embodiment of the processing method for forming patterns on the surface of the optical element of the present invention, and it is not intended to limit the scope of the present invention. All modifications made in the spirit shall belong to the scope of the present invention, so the protection scope of the present invention shall be based on the claims.

Claims (11)

1. processing machine that forms pattern on optical module surface comprises:

One workbench, an optical module to be processed can be carried in described workbench top, and driving this optical module, to carry out linearity mobile;

One linear tool rest, described linear tool rest are arranged on this workbench top;

One cutter, this cutter provide one first downforce;

One weight slide block; And

One machining spindle, described machining spindle are incorporated into this linearity tool rest top, can drive this linearity tool rest and carry out moving perpendicular to this workbench direction;

Wherein, this processing machine is to utilize the linearity of this workbench and this cutter to relatively move, and makes above-mentioned cutter cut and form a predetermined pattern on this optical module surface;

It is characterized in that: the upper surface of this linearity tool rest is provided with on one slide rail and lower surface is provided with a glidepath, described cutter can move around in this glidepath, and this cutter is adjusted to suitable position according to this predetermined pattern, described weight slide block can move around in the slide rail on this, and provide one second downforce to this cutter of this linearity tool rest below, compensate this first downforce of above-mentioned cutter, make above-mentioned cutter cut this optical module equably to obtain this predetermined pattern uniformly.

2. processing machine as claimed in claim 1 is characterized in that: this workbench has two driving shafts, and the linearity of utilizing above-mentioned two these workbenches of drive shaft to carry out two dimensional surface respectively moves.

3. processing machine as claimed in claim 1 is characterized in that: this optical module is a light guide plate.

4. processing machine as claimed in claim 1 is characterized in that: this optical module is an optical thin film.

5. processing machine as claimed in claim 1 is characterized in that: above-mentioned cutter be shaped as v-shaped structure.

6. processing machine as claimed in claim 1 is characterized in that: above-mentioned cutter be shaped as the U-shaped structure.

7. processing machine as claimed in claim 1 is characterized in that: above-mentioned cutter is to utilize a steady arm to be fixed in the glidepath of this linearity tool rest.

8. processing machine as claimed in claim 1 is characterized in that: above-mentioned cutter is to utilize a pad to adjust the weight of its cutting.

9. processing machine as claimed in claim 1 is characterized in that: above-mentioned this weight slide block has a specified weight, is arranged at an ad-hoc location of this linearity tool rest, and provides this second downforce to this cutter of this linearity tool rest below.

10. processing machine as claimed in claim 1, it is characterized in that: also comprise a plurality of cutters and a plurality of weight slide block, above-mentioned a plurality of cutter moves around in this glidepath to be adjusted to suitable position, and above-mentioned a plurality of weight slide block is to move around in the slide rail on this, corresponding above-mentioned a plurality of cutter configurations.

11. processing machine as claimed in claim 1 is characterized in that: this processing machine be adopt should the linearity tool rest be fixed and this processing platform moves mode, make the cutter of this linearity tool rest below cut out pattern on this optical module surface.

Images