CN1230482C - Stripping adhesive compositeon - Google Patents
Stripping adhesive compositeon Download PDFInfo
- Publication number
- CN1230482C CN1230482C CNB031543707A CN03154370A CN1230482C CN 1230482 C CN1230482 C CN 1230482C CN B031543707 A CNB031543707 A CN B031543707A CN 03154370 A CN03154370 A CN 03154370A CN 1230482 C CN1230482 C CN 1230482C
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- CN
- China
- Prior art keywords
- separability
- adhesive
- mentioned
- binder composition
- active energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 54
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 54
- 239000000203 mixture Substances 0.000 claims abstract description 61
- 150000001875 compounds Chemical class 0.000 claims abstract description 31
- 239000011230 binding agent Substances 0.000 claims description 37
- 229920002120 photoresistant polymer Polymers 0.000 claims description 27
- 239000002253 acid Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims description 11
- 150000002148 esters Chemical class 0.000 claims description 8
- 239000004840 adhesive resin Substances 0.000 abstract description 11
- 229920006223 adhesive resin Polymers 0.000 abstract description 11
- 230000005855 radiation Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 72
- 229920000642 polymer Polymers 0.000 description 32
- 238000000034 method Methods 0.000 description 29
- 239000002585 base Substances 0.000 description 24
- -1 vibrin Polymers 0.000 description 20
- 239000007789 gas Substances 0.000 description 19
- 239000002904 solvent Substances 0.000 description 17
- 239000004925 Acrylic resin Substances 0.000 description 15
- 229920000178 Acrylic resin Polymers 0.000 description 15
- 239000000975 dye Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 13
- 235000012431 wafers Nutrition 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 7
- NQBWNECTZUOWID-UHFFFAOYSA-N (E)-cinnamyl (E)-cinnamate Natural products C=1C=CC=CC=1C=CC(=O)OCC=CC1=CC=CC=C1 NQBWNECTZUOWID-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- NQBWNECTZUOWID-QSYVVUFSSA-N cinnamyl cinnamate Chemical class C=1C=CC=CC=1\C=C/C(=O)OC\C=C\C1=CC=CC=C1 NQBWNECTZUOWID-QSYVVUFSSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000005357 flat glass Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- 230000001235 sensitizing effect Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 230000036211 photosensitivity Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 150000000181 1,2-naphthoquinones Chemical class 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- WOAHJDHKFWSLKE-UHFFFAOYSA-N 1,2-benzoquinone Chemical class O=C1C=CC=CC1=O WOAHJDHKFWSLKE-UHFFFAOYSA-N 0.000 description 2
- 150000004055 1,2-benzoquinones Chemical class 0.000 description 2
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical class C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical class COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- 206010013786 Dry skin Diseases 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 230000001476 alcoholic effect Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- NKKMVIVFRUYPLQ-UHFFFAOYSA-N but-2-enenitrile Chemical compound CC=CC#N NKKMVIVFRUYPLQ-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- YPHQUSNPXDGUHL-UHFFFAOYSA-N n-methylprop-2-enamide Chemical compound CNC(=O)C=C YPHQUSNPXDGUHL-UHFFFAOYSA-N 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Chemical compound O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 2
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- ZRDYULMDEGRWRC-UHFFFAOYSA-N (4-hydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O ZRDYULMDEGRWRC-UHFFFAOYSA-N 0.000 description 1
- AFDXODALSZRGIH-QPJJXVBHSA-N (E)-3-(4-methoxyphenyl)prop-2-enoic acid Chemical compound COC1=CC=C(\C=C\C(O)=O)C=C1 AFDXODALSZRGIH-QPJJXVBHSA-N 0.000 description 1
- DXBHBZVCASKNBY-UHFFFAOYSA-N 1,2-Benz(a)anthracene Chemical compound C1=CC=C2C3=CC4=CC=CC=C4C=C3C=CC2=C1 DXBHBZVCASKNBY-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 description 1
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 1
- GUOKCLGPRJMRRF-UHFFFAOYSA-N 2-ethoxy-3-phenylprop-2-enoic acid Chemical compound CCOC(C(O)=O)=CC1=CC=CC=C1 GUOKCLGPRJMRRF-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- DGZIMLVEXGVYDW-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(O)COC(=O)C=C DGZIMLVEXGVYDW-UHFFFAOYSA-N 0.000 description 1
- YVLNDCLPPGIRCP-UHFFFAOYSA-N 2-nitro-3-phenylprop-2-enoic acid Chemical compound OC(=O)C([N+]([O-])=O)=CC1=CC=CC=C1 YVLNDCLPPGIRCP-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- AFPHTEQTJZKQAQ-UHFFFAOYSA-N 3-nitrobenzoic acid Chemical compound OC(=O)C1=CC=CC([N+]([O-])=O)=C1 AFPHTEQTJZKQAQ-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010010219 Compulsions Diseases 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical class COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- UAKWLVYMKBWHMX-UHFFFAOYSA-N SU4312 Chemical compound C1=CC(N(C)C)=CC=C1C=C1C2=CC=CC=C2NC1=O UAKWLVYMKBWHMX-UHFFFAOYSA-N 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical class CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001882 coronenes Chemical class 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- DZVCFNFOPIZQKX-LTHRDKTGSA-M merocyanine Chemical class [Na+].O=C1N(CCCC)C(=O)N(CCCC)C(=O)C1=C\C=C\C=C/1N(CCCS([O-])(=O)=O)C2=CC=CC=C2O\1 DZVCFNFOPIZQKX-LTHRDKTGSA-M 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- AFDXODALSZRGIH-UHFFFAOYSA-N p-coumaric acid methyl ether Natural products COC1=CC=C(C=CC(O)=O)C=C1 AFDXODALSZRGIH-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002990 phenothiazines Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- VVWRJUBEIPHGQF-UHFFFAOYSA-N propan-2-yl n-propan-2-yloxycarbonyliminocarbamate Chemical compound CC(C)OC(=O)N=NC(=O)OC(C)C VVWRJUBEIPHGQF-UHFFFAOYSA-N 0.000 description 1
- 150000003220 pyrenes Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
This invention provides a peelable adhesive composition containing an adhesive resin and a compound which can generate gas from active radiation irradiation.
Description
Technical field
The present invention relates to the separability binder composition.
Background technology
In the prior art, the add man-hour of the surperficial embodiment that causes distortion and damaged thin plate material in the power that applies from the outside easily as grinding etc. to for example wafer etc., be that thin plate material is processed on supporting with base material by adhesive, material after machining is peeled off with base material from tackiness agent and support, obtained finished thin plate material by this method.
To being used for the tackiness agent of this purposes, require it to have cementability, with thin plate material can be securely fixed in the operation in processing support with base material on, and excellent separability, with the material after will machining from tackiness agent with support with easily peeling off on the base material.
But, do not find when being used for this purposes the binder composition that cementability and separability are all excellent in the prior art.
Summary of the invention
The purpose of this invention is to provide all excellent binder composition of cementability and separability.
Inventor of the present invention specializes in for finishing above-mentioned problem, found that if binder composition contains when having adhesive resin and producing the compound of gas by active energy ray irradiation, find its have fixing as want material processed by the required cementability of adherend, and the processing back can easily be peeled off by adherend by producing gas with the active energy ray irradiation.
Inventor of the present invention has further carried out various researchs, until having finished the present invention repeatedly based on this discovery.
Promptly the invention provides separability binder composition as described below.
1. a separability binder composition is characterized in that containing the compound that has adhesive resin and produced gas by the active energy ray irradiation.
2. as above-mentioned the 1st the separability binder composition of being put down in writing, wherein having adhesive resin is photoresist.
3. as above-mentioned the 1st or the 2nd the separability binder composition of being put down in writing, wherein the compound by active energy ray irradiation generation gas is quinone diazosulfonic acid ester (a キ ノ Application ジ ァ ジ De ス Le ホ Application acid ェ ス テ Le).
As above-mentioned the 1st to the 3rd in each separability binder composition of putting down in writing, wherein have adhesive resin and be by the usage ratio that active energy ray irradiation produces the compound of gas, with respect to this resin of 100 weight parts, this compound is 1 to 100 weight part.
Below separability binder composition of the present invention is elaborated.
The separability binder composition
Separability binder composition of the present invention contains the compound that has adhesive resin and produced gas by the active energy ray irradiation.Therefore, for adopt this composition bonding by adherend, by active energy ray its adhesive linkage is shone generation gas with ultraviolet ray etc., can easily peel off by the gas of this generation with adhesive linkage with by adherend.
As having adhesive resin,, particularly-40～+ 120 has adhesive resin under ℃ the temperature preferably at-50～+ 150 ℃.In addition, this tackiness its bonding force (kgf/cm for example preferably
2) 5～40, particularly in 7～30 scope.
As having adhesive resin, can be thermoplastic resin, also can be curable resin.As thermoplastic resin, comprise for example acrylic resin, carbamate resins, vibrin, bakelite varnish and derivative thereof, polyvinylphenol and derivative thereof, silicone resin and derivative thereof.And comprise for example resin of importing polymerizability unsaturated group in above-mentioned any resin as curable resin.
As above-mentioned curable resin, also can be the effect curable of the active energy ray of ultraviolet ray of the following stated etc., have an adhesive photoresist that has that uses in the adhesive photosensitive polymer combination.At this moment, if desired, can add Photoepolymerizationinitiater initiater, light sensitizing dye etc. aptly.
Compound as produced gas by the active energy ray irradiation can be fit to use for example quinone diazosulfonic acid ester.
Quinone diazosulfonic acid ester is the photosensitive compounds that produces nitrogen under the active energy ray irradiation, and the nitrogen of its generation forms bubble, and adhesive linkage is peeled off.
As quinone diazosulfonic acid ester, can be fit to use polyhydroxybenzophenone and 1,2-benzoquinones diazosulfonic acid, 1,1 of 2-naphthoquinones diazosulfonic acid etc., the carboxylate of 2-quinone diazosulfonic acid class.
The polyhydroxybenzophenone that uses when forming this ester comprises the compound of following formula (I) expression.
In the formula, m and n represent 0 to 3 integer respectively, and the m+n sum is 1 to 6.
Specific examples as polyhydroxybenzophenone can enumerate 2,3,4-trihydroxybenzophenone, 2,3,4,4 '-tetrahydroxybenzophenone etc.
On the other hand, with 1 of polyhydroxybenzophenone generation esterification, 2-benzoquinones diazosulfonic acid comprises the compound of following formula (II) expression, and 1,2-naphthoquinones diazosulfonic acid comprises the compound of following formula (III) expression.
As 1, the specific examples of 2-benzoquinones diazosulfonic acid can enumerate 1,2-benzoquinones diazonium-4-sulfonic acid.As 1, the specific examples of 2-naphthoquinones diazosulfonic acid can enumerate 1,2-naphthoquinones diazonium-5-sulfonic acid, 1,2-naphthoquinones diazonium-4-sulfonic acid etc.
The esterification that above-mentioned polyhydroxybenzophenone and 1,2-quinone diazosulfonic acid class take place can be according to itself known method, polyhydroxybenzophenone and 1 for example, and 2-quinone diazosulfonic acid class or its halogenide (for example muriate) react and carry out.This moment, the reactive ratio of the two had no particular limits, generally preferably: the hydroxyl value q for polyhydroxybenzophenone, make 1,2-quinone diazosulfonic acid class is 1～q molecule, reacts with this ratio.Above-mentioned polyhydroxybenzophenone and 1,2-quinone diazosulfonic acid class or its halogenide may be used alone, can also be 2 or more kinds in combination.
In binder composition of the present invention, have adhesive resin and be generally by the usage ratio that active energy ray irradiation produces the compound of gas: for this resin of 100 weight parts, this compound is 1～100 weight part, is preferably 5～50 weight parts.
Binder composition of the present invention can be prepared by having adhesive resin and being produced the compound dissolution of gas or be dispersed in the medium by active energy ray irradiation.
As medium, one or more of all kinds of SOLVENTS of water, organic solvent etc. can be used in combination.Can use as organic solvent, for example all kinds of SOLVENTS of varsol, alcoholic solvent, ether solvent, ketones solvent, esters solvent, amide solvent etc.
The working method of material
Separability binder composition of the present invention is suitable as, on supporting with base material bonding conduct want material processed by adherend, and after processing, the caking agent that uses when peeling off this material with base material from supporting.
Use the working method of the material of above-mentioned binder composition to be preferably following method.
That is, by comprising (1) by separability adhesive composition layer of the present invention and have adhesive photosensitive polymer combination layer, the support that will want the non-finished surface of material processed to be fixed on to have the transparency is with the step on the base material,
(2) above-mentioned materials that fixes is carried out processing steps,
(3) subsequently, produce gas, peel off, take out the working method of the step of the material that processes thus, can process various materials suitably by shining active energy ray with the outside of base material from above-mentioned support.
Step (1)
In step (1), by in the separability adhesive composition layer of wanting to form on the non-finished surface of material processed of the present invention with have an adhesive photosensitive polymer combination layer, with this material be fixed on have the transparency support with on the base material.
Want material processed as above-mentioned, can use the various materials of the various processing that for example must grind etc., have no particular limits.
The material of above-mentioned materials can be for plastics, metal, glass, fiber, paper etc. any, its shape can be any shape of film like, tabular, wire, spherical, discoid, coniform, rectangular-shaped and shape that these combination of shapes form etc.Particularly the power that applies from the outside easily produces the material of distortion and damaged lamellar grade, can preferably use as the material processed that must grind etc.
Concrete material can be enumerated the electronic material of wafer for example etc.
That uses in above-mentioned steps (1) has an adhesive photosensitive polymer combination, be fit to use water-based or organic solvent type resin combination by the active energy line curing of ultraviolet ray etc., it contains and has adhesive photoresist, also contains Photoepolymerizationinitiater initiater, light sensitizing dye etc. as required.
Have adhesive photoresist and be preferably, particularly under-40～+ 120 ℃ temperature, have adhesive photoresist at-50～+ 150 ℃.This tackiness is its bonding force (Kgf/cm for example preferably
2) 5～40, particularly in 7～30 scope.
Above-mentioned specific examples with adhesive photoresist is exemplified below.
(i) have the photoresist of such as the polymerizable group of (methyl) acryl etc. as the photosensitivity group
Above-mentioned photoresist (i) can be by creating containing the method that addition on the acrylic resin of carboxyl contains the polymerizable unsaturated compound of glycidyl.
This moment employed carboxylic acrylic resin, α with for example vinylformic acid, methacrylic acid etc., β-ethene unsaturated acid can pass through with it and from for example (methyl) esters of acrylic acid of (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) 2-ethylhexyl acrylate, (methyl) Hydroxyethyl acrylate etc. as essential monomer component; Vinylbenzene, (methyl) vinyl cyanide, at least a unsaturated monomer copolymerization of choosing in (methyl) acrylamide etc. obtains.
In addition, as with the above-mentioned polymerizable unsaturated compound that contains glycidyl that contains the acrylic resin addition of carboxyl, can enumerate for example glycidyl acrylate, glycidyl methacrylate, glycidyl allyl ether etc.
Above-mentioned carboxylic acrylic resin and the addition reaction that contains the unsaturated compound of glycidyl, can be according to itself known method, for example, under 80～120 ℃ temperature, reacted 1～5 hour, can easily carry out by in the presence of the catalyzer of tetraethylammonium bromide etc.
In addition, above-mentioned photoresist (i) also can be by making the polymerizable unsaturated compound of hydroxyl and the reaction product addition of diisocyanate cpd on the acrylic resin of hydroxyl.
The polymerizable unsaturated compound of above-mentioned hydroxyl can be enumerated for example vinylformic acid 2-hydroxyl ethyl ester, (methyl) acrylic acid hydroxy alkyl ester of methacrylic acid 2-hydroxyl ethyl ester, vinylformic acid 2-hydroxypropyl acrylate etc.; N hydroxymethyl acrylamide etc.
In addition, can enumerate for example toluenediisocyanate, xylyl vulcabond, hexamethylene diisocyanate, lysinediisocyanate etc. as diisocyanate cpd.
In addition, acrylic resin as hydroxyl can use such resin, its with the polymerizable unsaturated compound of above-mentioned hydroxyl as essential monomer component, by with this monomer component with from for example (methyl) esters of acrylic acid of (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) 2-ethylhexyl acrylate, (methyl) Hydroxyethyl acrylate etc.; Vinylbenzene, (methyl) vinyl cyanide, at least a unsaturated monomer copolymerization of choosing in (methyl) acrylamide etc. obtains.
With the polymerizable unsaturated compound of above-mentioned hydroxyl and diisocyanate cpd basically with etc. mol ratio react.The addition reaction of the reaction product of gained and the acrylic resin of hydroxyl can in nitrogen atmosphere, be reacted under 50～100 ℃ temperature according to itself known method.
And, in above-mentioned photoresist (i), contain allyl group and can obtain by the reaction product of (methyl) allyl alcohol of addition on the acrylic resin of above-mentioned hydroxyl and diisocyanate compound as the photoresist of photosensitivity group.
(ii) contain the photoresist of cinnamoyl as the photosensitivity group
Can in the presence of alkali, for example in pyridine solution, react and make above-mentioned photoresist (ii) by with for example acrylic resin and the replacement or the unsubstituted styracin halogenide of hydroxyl.
The acrylic resin of above-mentioned hydroxyl can use the resin of narration in above-mentioned (i).
Replace or unsubstituted styracin halogenide comprises the substituent styracin halogenide that has 1～3 to choose on the phenyl ring from nitro, lower alkoxy etc., for example more specifically can enumerate the styracin muriate, to nitrocinnamic acid muriate, p-methoxycinnamic acid muriate, to the ethoxy-cinnamic acid muriate etc.
Replacement or the halid usage quantity scope of unsubstituted styracin generally can be the acrylic resin with respect to the above-mentioned hydroxyl of per 100 weight parts, are 6～180 weight parts, preferred 30～140 weight parts.The acrylic resin of above-mentioned hydroxyl and replacement or the halid reaction of unsubstituted styracin can for example in the presence of the alkali as pyridine solvent, be carried out under 30～70 ℃ temperature according to itself known method.
The (iii) photoresist of other type
As the photoresist of other type, the prepolymer that can also use polyethyleneglycol diacrylate, polypropyleneglycol diacrylate etc. is as photoresist.
In having adhesive photosensitive polymer combination; the Photoepolymerizationinitiater initiater of Cai Yonging can use initiator commonly known in the art as required; 2-methyl isophthalic acid-[4-(methylthio group) phenyl]-2-morpholino propane-1-ketone for example; 2-benzyl-2-dimethylin-1-(4-morpholino phenyl)-butanone-1; 2; 2-dimethoxy-1; 2-diphenylethane-1-ketone; two (2; 4; the 6-trimethylbenzoyl)-phenylphosphine oxide; two (2; 6-dimethoxy benzoyl)-2; 4; 4-tri-methyl-amyl phosphine oxide; 2-hydroxy-2-methyl-1-phenyl-propane-1-ketone; 1-hydroxy-cyclohexyl-phenyl ketone; to the dimethylin M-nitro benzoic acid; 2, the 4-diethyl thioxanthone; isopropyl thioxanthone etc.As the commercially available prod, for example can enumerate Lucirin TPO (BASF AG makes, trade(brand)name), Irg907, Irg369, Irg651, Irg819, Irg1700, Irg1800, Irg1850, DAROCURE 1173 (above for チ バ ス ペ シ ャ Le テ ィ ケ ミ カ Le ズ company makes, trade(brand)name), KAYACURE DMBI, KAYACURE DETX (above make, trade(brand)name), SPEED CURE ITX (manufacturing of Japanese シ ィ ベ Le ヘ グ Na one company, trade(brand)name) etc. for Japanese chemical drug corporate system.
What the usage ratio of Photoepolymerizationinitiater initiater was suitable is: for 100 weight part photoresists, be below 10 weight parts, preferably in the scope of 0.1～5 weight part.
In having adhesive photosensitive polymer combination, the light sensitizing dye of Cai Yonging can use dyestuff commonly known in the art as required.Particularly, can adopt for example light sensitizing dyes such as phenothiazines dyestuff, anthracene dye, coronene class dyestuff, benzo anthracene dye, perylene kinds dyestuff, pyrene class dyestuff, merocyanine class dyestuff, oxo tonka bean camphor (ケ ト Network マ リ Application) class dyestuff.What the usage ratio of these light sensitizing dyes was suitable is: for 100 weight part photoresists is below 10 weight parts, preferably in the scope of 0.1～5 weight part.
In having adhesive photosensitive polymer combination, also can suitably contain ethene unsaturated compound, tinting material, fluidizer, smooth agent etc. as required.As this ethene unsaturated compound, can use monomer that contains 1～4 ethene unsaturated group etc.
Can have adhesive photosensitive polymer combination by having dissolving such as adhesive photoresist and the Photoepolymerizationinitiater initiater that adopts as required, light sensitizing dye or be dispersed in the solvent, and preparing.
As solvent, one or more of all kinds of SOLVENTS of water, organic solvent etc. can be used in combination.As organic solvent, can use for example all kinds of SOLVENTS of varsol, alcoholic solvent, ether solvent, ketones solvent, esters solvent, amide solvent etc.
Above-mentioned support base material in step (i), by the separability adhesive composition layer with have adhesive photosensitive polymer combination layer and fixedly want material processed, in the man-hour that adds of for example grinding etc., applied force can not cause this material deformation and breakage thus.This support base material that is adopted can firmly fix this material, and has the transparency that the active energy ray of ultraviolet ray of making etc. sees through.
It is necessary supporting with transparent substrate material, because in step (3), see through from supporting the active energy ray that shines with the outside (opposite direction relative with the photosensitive composite layer) of base material with the separability adhesive composition layer, make be included in the separability adhesive composition layer, produce the compound decomposition of gas by active energy ray irradiation, produce gas.But also need not be water white, if the generation that is seen through caused gas by active energy ray is not had substantial obstruction, this base material can also contain tinting material and weighting agent etc.
Can obtain with following order by above-mentioned steps (1): want the adhesive photosensitive polymer combination layer of material processed/separability adhesive composition layer/have/support with base material stacked duplexer.
Can obtain this duplexer by following method a: at the non-finished surface coating separability binder composition of wanting material processed and dry, form this adhesive composition layer, coating has adhesive photosensitive polymer combination and dry on this adhesive composition layer, form this resin combination layer, on this resin combination layer, attach to support then and use base material.
In addition, also can obtain above-mentioned duplexer: will on the non-finished surface of above-mentioned materials, form the product of separability adhesive composition layer, and on supporting, form the formation that fits together of the product with adhesive photosensitive polymer combination film with base material by following method b.
In aforesaid method b, the generation type of separability adhesive composition layer can adopt the mode the same with method a to carry out.Generation type with adhesive photosensitive polymer combination film, also can adopt the mode the same to carry out with method a, also can adopt in such a way and carry out: on departing thin plate, be coated with this photosensitive polymer combination in advance, and make its drying, form this photosensitive polymer combination film, after this will support with the surface of base material and this resin combination film on the departing thin plate and be attached in contact together, push from the surface (opposite direction relative) of departing thin plate, peel off this departing thin plate subsequently with this photosensitive polymer combination film.
Obtain by above-mentioned steps (1), in order: want material processed/separability adhesive composition layer/have adhesive photosensitive polymer combination layer/support with base material in turn the making method of laminated duplexer be not subjected to the restriction of above-mentioned method a, method b etc., as long as can obtain this duplexer, can make by any order.
In above-mentioned steps (1), separability adhesive composition layer or the coating with adhesive photosensitive polymer combination layer for example can adopt known spreader such as roller, roller coating machine, spin coater, scraper type coating machine, atomizer, bristle to implement.Drying conditions after the coating can suitably be set according to the component of each used composition.
In above-mentioned duplexer, the thickness of separability adhesive composition layer is generally 1～50 μ m, and it is suitable being preferably 2～30 μ m.In addition, in above-mentioned duplexer, the thickness with adhesive photosensitive polymer combination layer is generally 1～200 μ m, and it is suitable being preferably 2～100 μ m.
Step (2)
Step (2) is that the material processed of wanting of having fixed in the step (1) is carried out processing steps.In this step, above-mentioned materials wanted the surperficial embodiment that the processes various processing as grinding etc.Implement this and add man-hour, material is by the separability adhesive composition layer and have adhesive photosensitive polymer combination layer and be securely fixed in support with on the base material, therefore can carry out required processing fully.
Step (3)
Step (3) is to shine active energy ray by the support of the above-mentioned duplexer after step (2) processing with the outside of base material to produce gas, peels off and take out the step of material processed thus.
In this step, from in order: the support of wanting the adhesive photosensitive polymer combination layer of material processed/separability adhesive composition layer/have/the have transparency is with the support of the duplexer of the base material lamination outside (with separability adhesive composition layer and the relative opposite direction of photosensitive polymer combination layer) the irradiation active energy ray with base material, the photosensitive polymer combination layer is solidified, reduce the tackiness on surface or make it not have tackiness, simultaneously by being present in this photosensitive polymer combination aspect of having solidified and the separability adhesive composition layer between the material face, produce the gas that compound decomposition produced of gas by the active energy ray irradiation, make the photosensitive polymer combination aspect of having solidified become uneven surface, thereby can peel off by easily that processing treatment is good material.
It is the ultraviolet ray and the visible rays of light source that above-mentioned active energy ray can adopt with the mercuryvapour lamp of for example ultra-high voltage, high pressure, middle pressure, low pressure, chemical lamp, carbon arc lamp, xenon lamp, metal halide lamp, tungsten lamp etc.And the irradiation dose of active energy ray is usually 500～10,000J/m
2Scope in be suitable.
According to the present invention, can obtain following unusual effect.
(a) separability binder composition of the present invention has for the required cementability that is fixed to wanting material processed to process, and after processing, can easily peel off by the active energy ray irradiation, has excellent separability.
(b) according to the working method of the material that adopts separability binder composition of the present invention, will want material processed by this separability adhesive composition layer and have adhesive photosensitive polymer combination layer be fixed on have the transparency support with base material on after process, after the processing only from this support with the outside of base material (with the separability adhesive composition layer and have the relative opposite direction of adhesive photosensitive polymer combination layer) irradiation active energy ray, just can make the curing of photosensitive polymer combination layer and produce gas, can easily the material after the processing be peeled off thus from the separability adhesive composition layer.
(c) therefore, in the add man-hour of embodiment on the surface that when the outside applies power, is easy to generate distortion and damaged thin plate material of for example wafer etc., can very suitably adopt the above-mentioned working method of using separability binder composition of the present invention as grinding etc.
Concrete form of implementation
Below the present invention will be described in more detail by Production Example, embodiment, test example and comparison test example.But the invention is not restricted to these embodiment.What " part " in each example and " % " represented is " weight part " and " % weight ".
Production Example 1: manufacturing has the photoresist of methacryloyl as the photosensitivity group
Under nitrogen atmosphere, with 3 hours will be by 40 parts of methyl methacrylates, 40 parts of butyl acrylates, the mixed solution that 20 parts of vinylformic acid and 2 parts of Diisopropyl azodicarboxylates constitute is added drop-wise in 90 parts of propylene glycol monomethyl ethers that remain under 110 ℃ of temperature.After dripping off, slaking 1 hour, by 1 part of Diisopropyl azodicarboxylate and 10 portions of mixed solutions that propylene glycol monomethyl ether constitutes, further slaking was 5 hours, obtains acrylic resin soln with dropping in 1 hour.
Subsequently; in this solution, add 24 parts of glycidyl methacrylate, 0.12 part of quinhydrones and 0.6 part of tetraethylammonium bromide; be blown into air on one side; under 110 ℃ of temperature, reacted 5 hours on one side; obtain second-order transition temperature and be 20 ℃, number-average molecular weight and be about 20,000 photoresist solution with methacryloyl.
Production Example 2: the manufacturing of photosensitive polymer combination
In 100 parts of photoresists that obtain by Production Example 1 (solid state component), add as light trigger, be dissolved in 2 parts of 2-methyl isophthalic acids-[4-(methylthio group) the phenyl]-1-morpholino propane-1-ketone (trade(brand)name " Irg907 " in 20 parts of propylene glycol monomethyl ether acetate, チ バ ス ペ シ ャ Le テ ィ one ケ ミ カ Le ズ company makes) and 0.5 part 2,4-diethyl thioxanthone (trade(brand)name " Kayacure DETX ", Nippon Kayaku K. K's manufacturing) solution, stir with mechanical stirrer, obtain photosensitive polymer combination 1.
Embodiment 1
In 100 parts of photoresists that obtain by Production Example 1 (solid state component), add as the photosensitive compounds of the quinone diazonium class that produces nitrogen by the active energy ray irradiation, be dissolved in 10 parts of 2-hydroxyls-3 in 50 parts of propylene glycol monomethyl ether acetate, the solution of 4-two (6-diazonium-5,6-dihydro-5-oxo-1-naphthalene sulfonyl oxygen base)-benzophenone.
Further to wherein add as Photoepolymerizationinitiater initiater, be dissolved in 2 parts of 2-methyl isophthalic acids-[4-(methylthio group) the phenyl]-2-morpholino propane-1-ketone (trade(brand)name " Irg907 " in 20 parts of propylene glycol monomethyl ether acetate, チ バ ス ペ シ ャ Le テ ィ one ケ ミ カ Le ズ society makes) and 0.5 part 2,4-diethyl thioxanthone (trade(brand)name " Kayacure DETX ", Nippon Kayaku K. K's manufacturing) solution, stir with mechanical stirrer, obtain separability binder composition 1 of the present invention.
Embodiment 2
Except with the 2-hydroxyl-3 among the embodiment 1, the usage quantity of 4-two (6-diazonium-5,6-dihydro-5-oxo-1-naphthalene sulfonyl oxygen base)-benzophenone changes into outside 30 parts, adopts and obtains separability binder composition 2 of the present invention with embodiment 1 the same method.
Embodiment 3
Except in embodiment 1, use equivalent to vinylphenol and cinnamic multipolymer (trade(brand)name " マ Le カ リ Application カ one CST15 ", the manufacturing of the kind petroleum chemistry company of ball) outside the photoresist that replacement Production Example 1 obtains, adopt the composition the same, obtain separability binder composition 3 of the present invention with embodiment 1.
Embodiment 4
Except in embodiment 1, using the Emulsion acrylic resin (trade(brand)name " PVC ニ プ ラ Application 7043 " of equivalent, day letter chemical industrial company manufacturing) outside the photoresist that replacement Production Example 1 obtains, adopt the composition the same, obtain separability binder composition 4 of the present invention with embodiment 1.
The binder composition of the present invention 1～4 that is obtained by embodiment 1～4 is carried out following test, examine or check its cementability and separability wafer.
Test example 1
On 8 inches wafer, the separability binder composition 1 that adopts the spin coater coating to be obtained by embodiment 1, and to make its dried thickness be 5 μ m is on hot plate, with 65 ℃ of heat dryings 2 minutes.
Further adopt spin coater on this film, to be coated with the photosensitive polymer combination 1 that obtains by Production Example 2, and to make its dried thickness be 15 μ m, on hot plate, with 65 ℃ of heat dryings 2 minutes.After this, with the pressure of 0.4MPa, crimping is as the sheet glass that supports with base material on it.
Can obtain in order thus: the duplexer of the layer of the layer/photosensitive polymer combination 1 of wafer/separability binder composition 1/sheet glass lamination.
The wafer surface of above-mentioned duplexer is fixed on the operation post with commercially available double sticky tape, and adopts sucker that the outside of sheet glass is combined on the spring balance, measure initial stage bonding force (kgf/cm
2) afterwards, with the outside irradiation 6 of extra-high-pressure mercury vapour lamp from sheet glass, 000J/m
2UV light.Adopt and measure postradiation bonding force in the same way.
The initial stage bonding force is 7kgf/cm
2, the operation that fixed wafer is ground is enough, cementability is good.When cementability is good, mean that bonding force is 5kgf/cm
2More than.
And the bonding force after the uviolizing is 1kgf/cm
2, from binder layer removed wafer easily, separability is good.When separability is good, mean that bonding force is 2kgf/cm
2Below.
Test example 2
Except the separability binder composition 2 with gained among the embodiment 2 replaces separability binder composition 1 in the test examples 1, adopt the bonding force after use the same method mensuration initial stage bonding force and the uviolizing.
Test example 3
Except the separability binder composition 3 with gained among the embodiment 3 replaces separability binder composition 1 in the test examples 1, adopt the bonding force after use the same method mensuration initial stage bonding force and the uviolizing.
Test example 4
Except the separability binder composition 4 with gained among the embodiment 4 replaces separability binder composition 1 in the test examples 1, adopt the bonding force after use the same method mensuration initial stage bonding force and the uviolizing.
Initial stage bonding force of measuring in the test example 1～4 and the bonding force after the uviolizing the results are shown in table 1.
Table 1
| The test example | 1 | 2 | 3 | 4 |
| Initial stage bonding force (Kgf/cm 2) | 8 | 8 | 7 | 9 |
| The initial stage cementability | Well | Well | Well | Well |
| Bonding force (kgf/cm after the uviolizing 2) | 1 | 0.9 | 1.2 | 1.5 |
| Separability after the uviolizing | Well | Well | Well | Well |
The comparison test example
8 inches wafers are fixed on as supporting with on the sheet glass of base material with commercially available double sticky tape.Then, after wafer is implemented grinding operation, implement to peel off difficulty when sheet glass is peeled off the operation of this wafer, peel off the wafer breakage if implement by compulsion.
Claims (2)
1. separability binder composition is characterized in that it contains and has adhesive photoresist and produce the compound of gas by the active energy ray irradiation, and the described compound that produces gas by the active energy ray irradiation is a quinone diazosulfonic acid ester.
2. separability binder composition as claimed in claim 1 wherein has adhesive photoresist and is that for this resin of 100 weight parts, this compound is 1 to 100 weight part by the usage ratio that active energy ray irradiation produces the compound of gas.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002248404 | 2002-08-28 | ||
| JP248404/2002 | 2002-08-28 |
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| CN1230482C true CN1230482C (en) | 2005-12-07 |
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| CNB031543707A Expired - Fee Related CN1230482C (en) | 2002-08-28 | 2003-08-20 | Stripping adhesive compositeon |
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| KR (1) | KR100528118B1 (en) |
| CN (1) | CN1230482C (en) |
| TW (1) | TWI237656B (en) |
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| KR20120104450A (en) * | 2011-03-08 | 2012-09-21 | (주)엘지하우시스 | Pressure-sensitive adhesive composition for a film used for processing wafer |
| MY197618A (en) * | 2017-11-06 | 2023-06-28 | Asahi Chemical Ind | Photosensitive resin laminate and method for producing resist pattern |
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2003
- 2003-08-07 TW TW092121677A patent/TWI237656B/en not_active IP Right Cessation
- 2003-08-20 CN CNB031543707A patent/CN1230482C/en not_active Expired - Fee Related
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| KR100528118B1 (en) | 2005-11-15 |
| TWI237656B (en) | 2005-08-11 |
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| CN1487039A (en) | 2004-04-07 |
| TW200404876A (en) | 2004-04-01 |
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