CN1225338C - Process and apparatus for producing highly wear resistant diamond cutting wires - Google Patents
Process and apparatus for producing highly wear resistant diamond cutting wires Download PDFInfo
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- CN1225338C CN1225338C CN 03133434 CN03133434A CN1225338C CN 1225338 C CN1225338 C CN 1225338C CN 03133434 CN03133434 CN 03133434 CN 03133434 A CN03133434 A CN 03133434A CN 1225338 C CN1225338 C CN 1225338C
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Abstract
The present invention relates to a crystal cutting technology and a device, particularly to a technology and a device for producing composite micro high wear resistance diamond cutting wires. The present invention adopts a radial extrusion or punching way to cause diamond grains to be firmly inlaid into sub surfaces layers of steel wires to form continuous diamond cutting wires with high strength. The technology and the device of the present invention can form an automatic production line to prepare continuous diamond wires with the advantages of uniform diameter with the length of more than 60 km, good wear resistance and good tensile strength. Compared with the diamond wires which are produced by an electroplating or rolling way, the diamond wires and the steel wires which are produced by the technology of the present invention, the composite cutting cost is low, and the quality is high. The diamond wires prepared by the present invention can be used for cutting semiconductors, light pressure crystals, ceramics, etc. through any wire cutting machine.
Description
Technical field:
The present invention relates to a kind of technology and equipment of sliced crystal, the technology and the equipment of the little line of particularly a kind of production high-wearing feature diamond compound cuts.
Background technology:
Along with the continuous development of factory's industry, semiconductor crystal is as silicon single crystal, monocrystalline germanium, gallium arsenide and photoelectric crystal, as Lithium niobium trioxide, quartz, growth diameter continues to increase, and how efficient low-consume ground cuts these crisp and valuable crystal, becomes a vital problem in the crystal processing.
Traditional sliced crystal method is to adopt the diamond inner circle saw blade.This method can only the monolithic cutting diameter less than 6 inches crystal, and saw blade is thicker, the big efficient of crystal loss is low.Development abroad goes out the multitool wire cutting machine in recent years, adopts the level and smooth high-strength steel silk thread of reciprocating 0.15～0.3mm diameter to add abrasive materials such as S:C, with the crystal grinding and cutting.Though this kind method can be cut the wafer more than 6 inches, equipment cost is higher, and the wafer face type instability after the cutting, and a large amount of waste liq abrasive materials also cause environmental pollution.
The line of cut that has diamond coatings with 0.15～0.3mm replaces level and smooth light, and avoid using the liquid abrasive material further to improve cutting efficiency, reduce cutting cost is the research and development target of crystal processing industry always.This requirement has the wire of diamond coatings, and continuous length reaches at least 20 meters long, and it is long generally should to reach 6 myriametres.And coating is firm, and the fine wire rod that the line footpath evenly forms a kind of diamond and metal composite has higher wear resistance and corrosion stability, and line of cut generally has higher stretching and flexural strength.
Human electroplated diamond technology is all arranged both at home and abroad, make the line that diameter＜0.5mm has diamond coatings.But adopt this kind technology cost higher, and still can't make and be longer than 20 meters line of cut.United States Patent (USP) 4485757 once proposed a kind of technology for preparing continuous diamond wire with the roll extrusion mode.But the diamond coatings diameter uniform thickness of this kind prepared and line footpath is inhomogeneous, is difficult to produce greater than 120 meters long diamond wires, can't cutting diameter greater than 6 " crystal.
Summary of the invention:
The object of the present invention is to provide the technology and the equipment of the little line of a kind of production high-wearing feature diamond compound cuts.The mode that the present invention adopts radial extrusion or punching press firmly is bumped into the sub-surface layer of wire with diamond particles, forms high-intensity successive diamond cutting line.
The objective of the invention is to be achieved through the following technical solutions:
A kind of technology of production high-wearing feature diamond compound cuts line, its complete processing is:
At first, choose the diamond particles of size between 10～100 μ m, on diamond particles, plate the thick metallic coating of one deck 1～10 μ m then, again diamond particles is bonded at the surface that diameter is the wire between 0.1～1mm, by the impact extrusion pressure head mould more than the bidimensional, the diamond particles extruding is entered below the surface of wire, then on the surface of pushing the diamond wire that forms, the metal that coating one deck 1～10 μ m is thick, nonmetal micron and nano material.
The equipment of the little line of a kind of production high-wearing feature diamond compound cuts is made up of extrusion head device, guide wheel, diamond particles applying device, strengthening layer coating device, electronic circle winding apparatus.Described extrusion head device is made up of multidimensional pressure head mould, drive unit, motor, tensimeter, wire is wrapped on the guide wheel at extrusion head device two ends, is respectively arranged with diamond particles applying device, extrusion head device and strengthening layer coating device and electronic circle winding apparatus along the wire direction of feed through guide wheel.
Advantage of the present invention and positively effect are:
Technology of the present invention and equipment can form automatic production line, and the diameter that preparation length can reach more than 60 kilometers is even, and resistance to abrasion is good, the continuous diamond wire that tensile strength is high.Diamond wire that this explained hereafter goes out and steel wire compound cutting cost are low, the diamond wire that quality is better than electroplating or the roll extrusion mode is produced.The diamond wire that uses the present invention to prepare can pass through materials such as any wire cutting machine cutting semiconductor, optical pressure crystal, pottery.
Description of drawings:
Fig. 1 is the work synoptic diagram of pressure head mould of the present invention;
Fig. 2 is the work synoptic diagram of extrusion head device of the present invention;
Fig. 3 is a production unit structure iron of the present invention.
Embodiment:
Below in conjunction with accompanying drawing the present invention is further described:
As shown in Figure 1, be the principle of work of pressure head mould (3).
At first select the wire (1) of diameter between 0.1～1mm according to split requirement, the material of wire (1) can adopt carbon steel or stainless steel.For improving diamond insert intensity, preferably adopt the wire of copper coating or nickel plating.Secondly select the suitable diamond particles (2) of mean diameter according to the diameter of wire (1).The diameter of general diamond particles (2) should be greater than 1/2nd of wire footpath.If when choosing the wire of 0.1mm, can choose the diamond particles that particle size is 10 μ m, on diamond particles, apply the metallic coating of one deck 1 μ m simultaneously, this metallic coating can be a nickel, also can be copper etc.Press the surface of the diamond wire that forms then in impact extrusion, apply the thick metal of one deck 1 μ m, nonmetal micron and nano material again, further improve the abrasive wear resistance and the cutting life-span of diamond wire.If when choosing the wire of 1mm, can choose the diamond particles that particle size is 100 μ m, simultaneously the metallic coating of coating one deck 10 μ m on diamond particles.Press the surface of the diamond wire that forms then in impact extrusion, apply the thick metal of one deck 10 μ m, nonmetal micron and nano material again.Diamond particles (2) is the surface that is coated in wire (1) with viscose glue, and viscose glue can be used glycerine, Resin adhesive, silica gel and glue, also can be with diamond particles and the surface that is applied to wire (1) after glue mixes.Can control the density that diamond is bumped into the wire surface by the ratio of adjusting particle and glue, density is high more, and cutting property is good more.Because the material hardness of pressure head mould (3) should be greater than the intensity of wire, so pressure head mould (3) can adopt materials such as tool steel after the hardening treatment and rapid steel, Wimet, diamond.The hardness of pressure head mould (3) material is high more, and the effect of extruding is good more.
As shown in Figure 2, be extrusion head device (4), form by drive unit (5), motor (6), tensimeter (7).
Extrusion head device shown in Figure 2 (4) adopts four pressure head mould extruding preparation diamond cutting lines, the diameter of the diamond cutting line after mold center's bore dia that can open and close motion should equal to push.The longitudinal length of pressure head mould (3) should be greater than 5mm, to reduce the machining damage to line.The motivating force of extruding can adopt wind-force, hydraulic pressure and electric motor driving, but each reciprocal squeezing pressure must be evenly.Squeezing pressure can be according to the diameter of wire to be processed and the line length adjustment of each extruding, and for the diameter of extruding 0.28mm, the stainless steel steel wire pressure of 5mm line length can be at 12kg.
The extrusion process of diamond wire can adopt repeatedly fixed point to repeat to push continuously, also can adopt once extruding, can adopt manually, also can adopt automatically, and is best with a squeezing effect of automatic control.
The diamond wire of colding pressing and being bumped into has had goodish cutting property.For further improving adamantine work-ing life, can be on the surface of diamond wire coated one deck strengthening layer again, can utilize the method for plating or electroless plating to plate thick nickel or the copper of corresponding ratio 1～10 μ m of one deck on the wire surface of 0.1～1mm, also can be coated with one deck epoxy resin glue.Best result is with epoxy resin glue and suitable nano level metal, non-metal powder, as NI, Cu, Al, C, TiC, SiC, Al
2O
3Powder etc. mix the surface that is coated in diamond wire, like this, can improve the intensity that is bumped into of diamond particles greatly, improve the cutting intensity and the life-span of diamond wire.
When wire (1) process extrusion head device (4), motor (6) drives drive unit (5) work, drive unit (5) makes four pressure head moulds (3) to-and-fro movement, can control the squeeze of pressure head mould (3) by tensimeter (7), pressure head mould (3) pushes wire (1) from four direction, diamond particles (2) extruding is entered the surface of wire (1).
As shown in Figure 3, be the automatic production process of diamond wire.
Producing the equipment of diamond wire is made up of extrusion head device (4), guide wheel (8), diamond particles applying device (9), strengthening layer coating device (10), electronic circle winding apparatus (11).At first, wire (1) is wrapped on the guide wheel (8), guide wheel (8) uniform rotation, drive wire (1) along at the uniform velocity feeding of direction of feed, earlier through diamond particles applying device (9), diamond particles applying device (9) is bonded at the surface of wire (1) with diamond particles (2), and wire (1) continues feeding then, passes through extrusion head device (4) again.The longitudinal length of pressure head mould (3) is 5mm, and every 5mm extrusion head device (4) enters diamond particles (2) extruding below the surface of wire (1) wire (1) extruding 1 time.From wire (1) the process strengthening layer coating device (10) that extrusion head device (4) comes out, wire (1) is gone up coated layer of metal, nonmetal micron and nano material.At last, by the rotation of guide wheel (8), wire (1) is wrapped on the electronic circle winding apparatus (11) again.
Product of the present invention also can be produced by the method manufacturing of punching press.
Claims (2)
1. technology of producing high-wearing feature diamond compound cuts line, it is characterized in that: its complete processing is:
At first, choose the diamond particles of size between 10～100 μ m, on diamond particles, plate the thick metallic coating of one deck 1～10 μ m then, again diamond particles is bonded at the surface that diameter is the wire between 0.1～1mm, by the impact extrusion pressure head mould more than the bidimensional, the diamond particles extruding is entered below the surface of wire, then on the surface of pushing the diamond wire that forms, the metal that coating one deck 1～10 μ m is thick, nonmetal micron and nano material.
2. equipment of producing the little line of high-wearing feature diamond compound cuts, be made up of extrusion head device, guide wheel, diamond particles applying device, strengthening layer coating device, electronic circle winding apparatus, it is characterized in that: described extrusion head device (4) is made up of multidimensional pressure head mould (3), drive unit (5), motor (6), tensimeter (7); Wire (1) is wrapped on the guide wheel (8) at extrusion head device (4) two ends, is respectively arranged with diamond particles applying device (9), extrusion head device (4) and strengthening layer coating device (10) and electronic circle winding apparatus (11) along the wire direction of feed through guide wheel (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03133434 CN1225338C (en) | 2003-06-12 | 2003-06-12 | Process and apparatus for producing highly wear resistant diamond cutting wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03133434 CN1225338C (en) | 2003-06-12 | 2003-06-12 | Process and apparatus for producing highly wear resistant diamond cutting wires |
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| CN1456410A CN1456410A (en) | 2003-11-19 |
| CN1225338C true CN1225338C (en) | 2005-11-02 |
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| CN 03133434 Expired - Fee Related CN1225338C (en) | 2003-06-12 | 2003-06-12 | Process and apparatus for producing highly wear resistant diamond cutting wires |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101417478A (en) * | 2008-11-21 | 2009-04-29 | 青岛高校测控技术有限公司 | Cutting wire production method and cutting wire and tyre cutting device |
| CN102581383A (en) * | 2012-03-12 | 2012-07-18 | 中国有色桂林矿产地质研究院有限公司 | Superhard abrasive fret saw and manufacturing method and manufacturing device thereof |
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| KR101433750B1 (en) | 2009-08-14 | 2014-08-27 | 생-고뱅 어브레이시브즈, 인코포레이티드 | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
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| CN101829964A (en) * | 2010-04-28 | 2010-09-15 | 江西赛维Ldk太阳能高科技有限公司 | Diamond wire and preparation method thereof |
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| EP2760638A4 (en) | 2011-09-29 | 2015-05-27 | Saint Gobain Abrasives Inc | ABRASIVE ARTICLES COMPRISING ABRASIVE PARTICLES ATTACHED TO AN ELONGATED SUBSTRATE BODY HAVING A BARRIER LAYER AND METHODS OF MAKING THE SAME |
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2003
- 2003-06-12 CN CN 03133434 patent/CN1225338C/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101417478A (en) * | 2008-11-21 | 2009-04-29 | 青岛高校测控技术有限公司 | Cutting wire production method and cutting wire and tyre cutting device |
| CN102581383A (en) * | 2012-03-12 | 2012-07-18 | 中国有色桂林矿产地质研究院有限公司 | Superhard abrasive fret saw and manufacturing method and manufacturing device thereof |
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| Publication number | Publication date |
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| CN1456410A (en) | 2003-11-19 |
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