CN1224513C - Method for making main structure of piezoelectric inkjet chip - Google Patents

Abstract

The invention relates to a method for manufacturing a main structure body of a piezoelectric ink-jet chip, which can be made of the same material, and mainly comprises the steps of obtaining a lead zirconate titanate (PZT) thin strip by a scraper forming method, stacking the thin strip in a multi-layer mode in a precise alignment mode after patterning, and then applying hot pressing or water pressure to complete a PZT raw blank; hot pressing the green body of PZT material, screen printing to add a lower electrode layer, drying, screen printing a layer of PZT as a vibration sheet layer, drying, screen printing to add an upper electrode layer, and finally sintering together, thus obtaining a main structure body of which the substrate and the actuating sheet are PZT material at the same sintering temperature; if the structural body is attached with a jet hole sheet, a piezoelectric ink jet chip can be completed.

Description

Method for making main structure of piezoelectric inkjet chip

technical field

The present invention relates to a method for manufacturing a piezoelectric inkjet chip, in particular to a method for manufacturing a main structure of a piezoelectric inkjet chip, especially a method for making the substrate and vibrating sheet of the main structure both The method for making the main structure body of the piezoelectric inkjet chip whose sintering conditions are close to or the same as the material and which are co-sintered.

Background technique

At present, the main structure of the piezoelectric inkjet chip is to set the piezoelectric thick film on the zirconium or silicon substrate. In the case of different materials for the piezoelectric actuator sheet, the substrate and the ink chamber, it is extremely difficult to find a solution that can take into account the differences. The co-firing temperature is the ideal sintering temperature of the material, so it is difficult to produce a chip that is really dense and has good PZT characteristics. For this type of known piezoelectric inkjet chip structure, you can refer to the announcement of US Patent No. 6,142,616. In order to accommodate the processability of the three-dimensional space, the new structure proposed in this case is still produced for silicon substrate materials. chip.

For the problem of co-firing temperature, if the main structure of the zirconium substrate is taken as an example, the ideal sintering temperature of zirconium dioxide is about 1700°C, but the sintering temperature of the PZT material layer that constitutes the actuator plate is about 1200°C. The optimal sintering temperature of materials varies widely. Although in general, the high-temperature sintered material layer has better vibration characteristics, but the co-firing temperature of the structure of the zirconium substrate is limited by the PZT material layer needs to be sintered at a lower temperature, so the sintering cannot be promoted to the zirconium substrate. 1700°C required.

Taking the main structure of the silicon substrate as an example, the optimum sintering temperature of silicon dioxide is about 900° C., which is significantly lower than the sintering temperature (1200° C.) of the PZT material layer constituting the actuator plate. Therefore, the co-firing temperature of the silicon substrate structure is instead limited by the sintering temperature of the silicon dioxide substrate, so the co-firing temperature cannot be increased to 1200° C. required for the sintering of the PZT material layer.

To solve the temperature problem of co-firing of heterogeneous materials that is difficult to overcome for the main structure of the known chip, the most direct way is to create a manufacturing method that makes the main structure substrate, ink cavity material layer and vibration layer of the piezoelectric inkjet chip They are all made of the same material, so that the above-mentioned co-firing temperature problem can be solved.

Contents of the invention

The main purpose of the present invention is to provide a kind of manufacture method of the main structural body of piezoelectric ink-jet chip, make the substrate that forms chip, ink cavity layer material and vibrating component all be that sintering condition is close to or identical material constitutes, thus Solve the problem of the co-firing temperature of the piezoelectric inkjet chip during sintering.

The manufacturing method provided by the present invention is mainly to obtain a thin strip by scraper forming method, then perform patterning processing and then carry out multi-layer stacking by precise alignment, and then apply heat or water pressure to the stacked finished product, thereby completing The green embryo of the same material; the green embryo is applied to screen printing to add the lower electrode layer after hot pressing, and then screen prints a layer of vibrating sheet after drying, and then applies screen printing to add the upper electrode layer after drying. Finally, after drying and cutting, the substrate and the actuator sheet can be obtained through precise degreasing and sintering to obtain the main structure of the same material; after that, a piezoelectric inkjet chip can be completed if a nozzle holder is attached. . The aforesaid thin strip and vibrating plate layer can be made of lead zirconate titanate (PZT) material, but not limited to this material.

Specifically, the present invention provides a method for manufacturing the main structure of a piezoelectric inkjet chip, at least comprising:

1. The step of preparing individual structural layers: taking a lead zirconate titanate thin strip, and patterning the thin strip one by one to form several thin layers that can be stacked into one or more main structural bodies of piezoelectric inkjet chips;

1. The step of preparing the green body of the main structure: use the precise alignment to make the patterned thin layer stacked in multiple layers, and then press them together to complete the green embryo. The inside of the green embryo contains ink flow channels and ink cavity;

A step of adding a vibrating component to the green body: add an electrode layer to the green body, add a vibrating plate layer after drying, and then add an upper electrode layer after drying; and

1. Cutting and sintering step: After drying and cutting the green body completed in the previous step, the main structure of the piezoelectric inkjet chip is completed through precise degreasing and sintering.

The vibrating plate layer is a thin layer of lead zirconate titanate.

Lamination of the laminated layers of the stack is performed using a hydraulic process.

The lamination of the laminated layers of the stack is performed using a heat press process.

The step of adding the lower electrode layer and the structural layer of the vibrating piece is added by screen printing.

The present invention also provides a method for manufacturing the main structure of the piezoelectric inkjet chip, which at least includes:

A thin strip of lead zirconate titanate (PZT) is prepared, and the step of mechanically patterning the thin strip becomes a thin layer that can be stacked together to form a structure containing ink flow channels and ink chambers;

A step of manufacturing the green body of the main structure: using precise alignment to perform multi-layer alignment stacking of the thin layer, and then applying heat or water pressure treatment to complete a green body composed of multi-layer stacks of PZT materials;

A step of adding vibrating components: adding an electrode layer on the garment, adding a vibrating plate layer after drying, and then giving a heat press, water pressure or drying treatment; and

A step of degreasing and sintering: adding an upper electrode layer after sintering, and then applying polarization treatment, so as to complete the main structure of a piezoelectric inkjet chip.

It also includes a pre-step: the pre-step may include a step of preparing PZT powder, a step of mixing slurry and a step of forming lead zirconate titanate (PZT) thin strips by scraping.

The lower electrode layer is added on the green body by screen printing.

The vibrating sheet layer is added on the lower electrode layer by screen printing.

The invention makes the main structure substrate, ink cavity material layer and vibrating layer of the piezoelectric inkjet chip all of the same material, solves the problem of co-firing temperature, and has remarkable effect.

Description of drawings

Figure 1. Schematic diagram of a structural cross-section of a general piezoelectric inkjet chip.

Fig. 2, the flowchart of the first embodiment of the present invention.

Fig. 3, the flowchart of the second embodiment of the present invention.

Detailed ways

The structural section of a general piezoelectric inkjet chip is shown in Figure 1, which mainly includes bonding other PZT material layers with a silicon or zirconium substrate 10, forming shapes such as ink flow channels 11 and ink chambers 12 in the main structure, and then Attach the orifice plate 20 and the vibrating component 30; the characteristic is that the vibrating component 30 includes a lower electrode layer 33, a PZT vibrating plate layer 32, an upper electrode layer 31 and several electrode contacts.

First embodiment:

Please refer to the structural schematic diagram of Fig. 1 and the flow chart shown in Fig. 2, the production method may include:

1. Preparation of individual structural layers (A1): Take a thin strip and pattern the thin strip one by one into several sections that can be stacked into one or more thin layers with the cross-sectional shape of the main structure of the piezoelectric inkjet chip, including ink flow Important structures such as the channel 11 and the ink chamber 12; preferably, the thin strip can be made of a material close to or the same as the sintering condition of the vibrating plate layer 32, such as lead zirconate titanate (PZT) material.

2. Preparation of the green body of the main structure (A2): use precise alignment to make the aforementioned patterned thin layers stacked in multiple layers, and then press them together to complete a green body formed by stacking multiple layers of the same material. Embryo; Preferably, the above-mentioned pressing can be treated by hot pressing or hydraulic pressure;

3. Add vibration components (A3) to the green body: add the lower electrode layer 33 by screen printing on the green body, and then screen print a vibrating sheet layer after drying, and then add the upper electrode layer 31 after drying ; The vibrating plate layer can be selected from a material with a sintering temperature close to or the same as that of the aforementioned thin strip, such as the aforementioned lead zirconate titanate (PZT) material; and

4. Cutting and sintering (A4): After drying and cutting the above-mentioned green body, the main structure of a piezoelectric inkjet chip is completed through precise degreasing and sintering.

Finally, an orifice sheet 20 is added to the main structure to complete a piezoelectric inkjet chip.

The second embodiment: Please refer to the flow chart shown in Figure 3, which includes:

1. Preparation of lead zirconate titanate (PZT) thin strip (B1) with a specific pattern: it can be subdivided into the steps of preparing PZT powder, mixing slurry, and manufacturing lead zirconate titanate (PZT) thin strip by scraper molding. After completion, through the step of mechanical patterning, the thin strip becomes a thin layer of the cross-sectional shape of the main structure of the piezoelectric inkjet chip, including important structures such as the ink flow channel 11 and the ink chamber 12;

2. Manufacture the green body of the main structure (B2): the step of using precise alignment to perform multi-layer alignment stacking of the aforementioned thin layers, and then apply heat or water pressure treatment to complete a multi-layer stack of PZT materials. the embryo;

3. Add vibration components (B3): Apply screen printing step on the green body, add a layer of lower electrode layer 33 made of silver-palladium alloy (Ag-Pd), and then perform another screen printing process after drying. In the printing step, a vibrating sheet layer 32 composed of a layer of PZT is added, and then processed by hot pressing, water pressure or drying; and

4. Degrease, sinter and add the upper electrode layer (B4): Then use the sputtering (Sputtering) step to add the electrode layer of gold (Au) as the upper electrode layer 31, and complete a piezoelectric inkjet after applying the polarization treatment The main structure of the chip.

After the above-mentioned main structure can be cut, as long as an orifice sheet 20 is pasted, the assembly of a piezoelectric inkjet chip can be completed.

The present invention utilizes stacks of thin-layer materials with similar or identical sintering conditions to make the co-sintering conditions of the main structure tend to be consistent. In this way, during sintering, a more ideal sintering temperature can be adopted according to the material properties of the main structure for sintering. The production difficulty of the piezoelectric inkjet chip is greatly reduced, so that the finished product has better vibration characteristics.

Although the present invention has been disclosed as above with preferred embodiments, its purpose is not to limit the present invention. Anyone skilled in the art should be able to make some equivalents without departing from the spirit and scope of the present invention. The design and modification of these equivalent designs should still be included in the scope of the claims of the present invention.

Claims (9)

1, a kind of manufacture method of main structure body of piezoelectric ink jet chip comprises at least:

One preparation discrete structure layer step: get a lead zirconate titanate strip, and make this strip patterning one by one, become the thin layer that plurality of sections can be overlapped into the main structure body of one or more piezoelectric ink jet chip;

One preparation main structure body is given birth to the embryo step; Utilize accurate contraposition to make the thin layer behind this process patterning make multilayer contraposition storehouse, and then in addition pressing, thereby finish the embryo in all one's life, ink runner and black chamber are contained in the inside of described living embryo;

One adds the vibration component step on this living embryo: give birth at this and add a lower electrode layer on embryo, add a vibration lamella after the drying, add a upper electrode layer after the drying again; And

One cutting and sintering step: after the living embryo that previous step is finished is dried, cut,, finish the main structure body of this piezoelectric ink jet chip again via accurate degrease and sintering.

2, the manufacture method of the main structure body of piezoelectric ink jet chip according to claim 1 is characterized in that described vibration lamella is the lead zirconate titanate thin layer.

3, the manufacture method of the main structure body of piezoelectric ink jet chip according to claim 1 is characterized in that, the pressing of the thin layer of described storehouse is to utilize a hydraulic pressure to handle.

4, the manufacture method of the main structure body of piezoelectric ink jet chip according to claim 1 is characterized in that the pressing of the thin layer of described storehouse is to utilize a hot-pressing processing.

5, the manufacture method of the main structure body of piezoelectric ink jet chip according to claim 1 is characterized in that, the step of the structure sheaf of described interpolation lower electrode layer and vibrating reed adopts the mode of wire mark to add.

6, a kind of manufacture method of main structure body of piezoelectric ink jet chip comprises at least:

One preparation lead zirconate titanate strip, and via the machinery step of patterning in addition becomes this strip can be stacked into jointly a thin layer that includes the structure in ink runner and black chamber;

One makes the step that the main structure body is given birth to embryo: utilize accurate contraposition that this thin layer is carried out multilayer contraposition storehouse, bestow hot pressing or hydraulic pressure then and handle, thereby finish a living embryo that utilizes lead zirconate titanate multilayer storehouse to be constituted;

One adds the step of vibration component: add a lower electrode layer on this life embryo, increase by a vibration lamella after the drying step again, give a hot pressing, hydraulic pressure or oven dry again and handle; And

The step of one degrease and sintering: add a upper electrode layer behind the sintering again, and then bestow with polarization and handle, thereby finish the main structure body of a piezoelectric ink jet chip.

7, as the manufacture method of the main structure body of piezoelectric ink jet chip as described in the claim 6, wherein also comprise a preposition step: this preposition step can comprise that size mixing step and a scraper moulding of a preparation lead zirconate titanate powder step, make lead zirconate titanate strip step.

8, as the manufacture method of the main structure body of piezoelectric ink jet chip as described in the claim 6, it is characterized in that described lower electrode layer is to utilize the mode of wire mark to make an addition on this life embryo.

9, as the manufacture method of the main structure body of piezoelectric ink jet chip as described in the claim 6, it is characterized in that described vibration lamella is to utilize the mode of wire mark to make an addition on this lower electrode layer.

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