CN1221174A - Disk substrate in intermediate product and manufacturing process thereof - Google Patents
Disk substrate in intermediate product and manufacturing process thereof Download PDFInfo
- Publication number
- CN1221174A CN1221174A CN98126347A CN98126347A CN1221174A CN 1221174 A CN1221174 A CN 1221174A CN 98126347 A CN98126347 A CN 98126347A CN 98126347 A CN98126347 A CN 98126347A CN 1221174 A CN1221174 A CN 1221174A
- Authority
- CN
- China
- Prior art keywords
- disk substrate
- grinding
- mentioned
- intermediate product
- manufacturing process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73911—Inorganic substrates
- G11B5/73921—Glass or ceramic substrates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Magnetic Record Carriers (AREA)
Abstract
A surface plate for finishing is formed by solidifying abrasive grains having a specified grain size, and arranged so that the center of rotation of a work surface plate comes on the circumference of the surface plate for finishing. Then the surface plate for finishing and work surface plate are slid relatively with each other for grinding so that a locus of a contact area of the surface plate for finishing with a disk substrate on the work surface plate becomes a constant. The invention provides a disk substrate intermediate product and manufacturing process thereof, the disk substrate is made of inorganic material such as glass, having a highly accurate flatness and surface roughness, free from surface defect such as pit, and being low in cost.
Description
The present invention relates to a kind of non-aluminum intermediate product of disk substrate, this product forms texture by plating Ni-P (nickel-phosphorus) layer, relate more particularly to a kind of intermediate product and manufacturing process thereof of disk substrate, utilize this technology can be easy and produce a kind of inorganic material matrix that is used for hard disk at low cost, as glass ceramics matrix, glass basis etc.
The disk substrate that is used for hard disk at present comprises a kind of aluminum matrix, and this matrix is made by the aluminium dish that is coated with the Ni-P layer; Also comprise a kind of glass basis, this matrix is to be made by glass ceramics or glass (comprising tempered glass), and wherein glass ceramics is to use the method that directly sprays materials such as one deck magnetic material on simple glass to make.Above-mentioned aluminum matrix is the matrix of 5.25 or 3.5 inches major diameter hard disk as diameter, and glass basis then is the matrix of 2.5 inches or littler minor diameter hard disk as diameter.
Glass basis all is better than the aluminum matrix as impact resistance (hardness) or rigidity aspects such as (Young moduluss), and can reaches better surfaceness in the required performance of hard disk substrates.Yet,, thereby make its manufacturing cost higher because glass basis required manufacturing time in manufacture process is longer.In addition, because along with its manufacturing cost of increase of glass basis size can increase, thereby the use of glass basis is restricted, only as the matrix that is contained on the portable PC that requires to have certain impact resistance 2.5 inches or littler minor diameter hard disk.
To the character of surface of the glass basis that is used for hard disk, requiring has high flatness, good surfaceness, and surface imperfection such as pit can not be arranged.In order to produce the glass basis that satisfies the above-mentioned requirements characteristic, adopt the method that the glass basis material is carried out grinding at present.Because the flatness and the surfaceness of the glass basis intermediate product of grinding gained all are not enough to meet the demands, also need a procedure that these glass basis intermediate product are further polished.
Polishing process as the final step of making glass basis comprises the steps: glass basis intermediate product clamping up and down between the flat board; The abrasive material fabric envelope that polycarbamate or suede are made is on the polished surface (with the contacted surface of glass basis intermediate product) of flat board; Dull and stereotyped with opposite direction rotation about making then, injection contains useful tiny ceria (CeO in this process
2) the grinding particle comes the surface of polished glass matrix as the treating fluid of free grinding particle.
We can say that in view of the above this polishing step is exactly to proofread and correct the small surface irregularity that forms in the preorder grinding step, thereby obtain the step of a level and smooth and surface of good roughness.But polishing step has kept the flatness that obtains in the front grinding step, therefore in fact can not (on producing effectively) proofread and correct flatness in polishing step.
The matrix material of desire plating Ni-P layer needs the surface irregularity of appropriateness.Because the aluminum substrate material is metal, therefore when polishing, can not produce pit (abrasive particle impression) in the part with sponge shape grinding stone etc., and the aluminum matrix material of acquisition with required surfaceness thus.Yet because glass basis material and glass ceramics matrix material are hard brittle materials, therefore grind with spongy grinding stone or with graphitic carbon (GC) abrasive particle and can obtain required surfaceness, but can produce pit in the part, after polished surface plates Ni-P, still leave pit thus, thereby obtain the glass disk that can not meet the demands.Therefore, do not adopted this method now.
At present, a kind of technology that is used for making with inorganic material disk substrate intermediate product (comprising above-mentioned glass basis intermediate product), or a kind of method for grinding that is used for grinding disk substrate material include small destruction in a sub-region and a sub-region microdeformation.The former is used to increase grinding and grinds off actuating quantity, and grinding with free grinding particle is its a typical example.On the other hand, the latter is used for the pinpoint accuracy treatment surface, and an one typical method comprises with the solid solution grinding stone and carries out grinding.
Grinding is the typical method of grinding disk substrate material, and it usually is divided into elementary grinding (corase grind) and secondary subsequently grinds (correct grinding) two steps.In each step, a pallet (dish that normally is made of resin is used to lay the disk substrate material) with the disk substrate material fit is installed all between up and down grinding flat plate made of iron.The two sides of disk substrate material is overlayed two surfaces that disk substrate is ground in dull and stereotyped up and down rotation in the opposite direction, in rotary course, add free grinding particle such as graphitic carbon GC (SiC) and treating fluid between surface of contact, so that chip and sliver are washed away from the disk substrate material surface to grinding.The advantage of this method is the flatness that can provide high, high machining accuracy and high working (machining) efficiency.
In this method, owing to the impact between disk substrate material and the abrasive particle (slip) in the process of lapping causes the disk substrate material small brittle fracture takes place, thereby utilize this fracture to come the surface of grinding disk substrate.Like this, on the surface of the disk substrate intermediate product of gained because brittle fracture has produced machining deformation.
If the machining deformations of remaining different amounts on the surface of disk substrate intermediate product will cause curling of disk substrate intermediate product, thereby the flatness that can not obtain.But, if two faces of disk substrate material are processed simultaneously, just can produce consistent machining deformation so on the disk substrate intermediate product, and roughly the same at each lip-deep deflection.Therefore, because abrasive method can provide amount of warpage very little thereby have the disk substrate of high straightness, be widely used so grind the manufacturing process of the disk substrate intermediate product of using as a kind of hard disk.
Yet, owing to when grinding, may cause concentrated wear, may on lapped face, cause eccentric wear to decrease like this through the time interval of a prolongation, thereby no longer can obtain above-mentioned good flatness, unless the lapped face of grinding flat plate obtains meticulous maintenance.In addition, be a brittle fracture process owing to grind, so it can produce the pit that is called as the abrasive particle impression inevitably, this is a shortcoming of grinding.
These pits are some small following trapping spots, it has been generally acknowledged that they are to produce when big abrasive particle (secondary abrasive particle) rolls across disk substrate material surperficial in process of lapping.Its exemplary depth is 20～30 μ m.This just need remove these pits in polishing process subsequently, and this polishing process need carry out polishing in 40～60 minutes two surfaces of disk substrate intermediate product usually continuously.The duration of this polishing approximately is polishing 8～10 times of the duration in the aluminum matrix manufacturing process.The so long processing duration is a main cause that causes manufacturing cost to increase.This formation cost that just need provide a kind of intermediate product of disk substrate to make texture reduces, and this product also can solve the problem aspect cost and machining accuracy in the existing texture processing except polishing time has reduced.
It is dull and stereotyped to have developed a kind of adamas section, as a kind of method that suppresses the above-mentioned concentrated wear of grinding flat plate in process of lapping.But the problem that produces pit is still unresolved.Therefore, also need be in polishing process subsequently go 30～40 μ m to remove pit two surfacings of disk substrate intermediate product.Like this, the cost of the technology of its cost and employing grinding step is basic identical.
On the other hand, grinding is a kind of method by making solid solution grinding stone high speed rotating come grinding disk substrate material surface, and employed grinding stone is made by abrasive particle such as adamas, cubic boron nitride (CBN) or graphitic carbon (GC) are solid-solubilized in metal, resin or the glass.Corresponding with grinding, the pit of generation seldom, even and produced pit, therefore its degree of depth is also very little, removes in polishing process that the remaining required time of uneven defective greatly reduces on the disk substrate intermediate product surface.
But when this grinding was carried out continuously, the point of abrasive particle can be worn away and can not carry out grinding again, and this just need periodically polish.In addition, owing to need the surface of machining disk matrix material one by one, therefore the machining deformation that forms on each face of disk substrate material can not have consistent amount or consistent distribution, therefore make to produce irregular warpage or distortion on the disk substrate intermediate product, thereby flatness is reduced.
Owing to can not remove or proofread and correct above-mentioned warpage or distortion as mentioned above in polishing process, this grinding is not used as the technology of the disk substrate intermediate product that the manufacturing hard disk uses.It is a kind of by solidifying the processing flat board that abrasive particle is made that applicant of the present invention provides, and the rotation center of working plate is positioned on the dull and stereotyped excircle of processing, and by making the dull and stereotyped relative slip of processing realize grinding, so that the track unanimity of each contact point between disk substrate on the working plate and the processing flat board with working plate.Like this, applicant of the present invention finds that this method can obtain a kind of disk substrate intermediate product that are used for hard disk with required flatness, even its size also can obtain required flatness during greater than 2.5 inches, and has submitted Japanese patent application No.9-183681 on July 9th, 1997.Yet, the application of this method and existing sell pass through plating Ni-P, polishing, the matrix (Ra≤10 ) that texture forms, spraying magnetic film several steps is made had good surfaceness, thereby owing to sticking problem causes breaking of film.Show the intermediate product that do not obtain expection thus.
Under the situation that the film breaks phenomenon does not take place, can realize that carrying out texture with YAG laser is shaped by prior art.And the magnetic medium that the method by plating one deck magnetic film on the matrix that is coated with Ni-P coating obtains is surpassing on the magnetic property by the direct magnetic medium that obtains of the method for spraying plating one deck magnetic film on glass basis.
The present invention be directed to the problems referred to above of the prior art proposes.The inventor attempts to address the above problem, and, brittle fracture process and plastic history form the present invention by being combined into a process, this process is used for the surface that grinding needs the disk substrate material of grinding, at first make and be ground material generation brittle fracture, make it that plastic yield takes place then, next carry out spark-out (equating) and handle.
The object of the present invention is to provide a kind of technology of making the disk substrate intermediate product, this technology can prevent to be ground small pit and the irregular warpage of generation on the material in Grinding Process, remain unchanged by the track that makes grinding resistance on the disk substrate material surface and solid solution abrasive particle and to keep the good flatness of disk substrate material, and help to improve machining precision and efficient and reduce cost.
We can say that also according to the invention provides a kind of two-sided disk substrate intermediate product that all carry out grinding with grinding stone, it is characterized in that: the flatness on each plane is 10 μ m or littler, and the rough difference in height that is produced by grinding is 0.05～1.0 μ m.Preferably, the grinding track that forms on each face of disk substrate intermediate product is the outward extending diametral curve of the heart therefrom.
In addition, according to the present invention, a kind of manufacturing process of disk substrate intermediate product is provided, comprise the steps: two surfaces of the disk substrate of the processing of grinding desire successively, on each grinding skin, all to stay the machining deformation of same amount, the flatness of disk substrate intermediate product can maintain 10 μ m or littler after grinding thus, and the rough difference in height that above-mentioned grinding produced is between 0.05～1.0 μ m, will plate layer of Ni-P on disk substrate, such surfaceness is enough.
In manufacturing process according to disk substrate intermediate product of the present invention, when grinding is all carried out with the method for grindstone in each surface of disk substrate material, preferably can set a kind of processing conditions, make the abrasive particle that constitutes grinding stone broken and come off, thereby realize grinding off the elementary grinding step of most of grinding allowance from grinding stone.In addition, preferably elementary grinding step comprises the step that the disk substrate material is fixed on the step on the worktable and makes the rotation of worktable and grinding stone, and the rotational speed of worktable is 60%～80% or 20%～40% of a grinding stone rotational speed.
In addition, preferably secondary grinding step is carried out after elementary grinding step, and under the condition of work of carrying out this step, the abrasive particle of formation grinding stone fragmentation does not take place basically or do not come off basically.If each surperficial flatness of disk substrate material is 10 μ m or littler, manufacturing process of the present invention will be more effective.The disk substrate material is a kind of inorganic material matrix from it at processing mechanism, and more preferably is glass basis or glass ceramics matrix.
In addition, according to the present invention, a kind of each surperficial milling drum that is used for grinding disk substrate material is provided, its course of work is: the disk substrate material of desire processing is installed and is fixed on the working plate, making processing, cup-shaped grinding stone is relative with working plate slides, wherein cup-shaped grinding stone is made by the method for solidifying abrasive particle, the rotation center that it is characterized in that working plate is positioned on the excircle of the cup-shaped grinding stone of processing, this milling drum comprises a slip drive controlling mechanism, be used to make that cup-shaped grinding stone is relative with working plate slides, so that the track unanimity that is attached to the disk substrate material on the working plate and processes each contact point between the cup-shaped grinding stone.
According to the present invention, the disk substrate material that is used to make the disk substrate intermediate product is preferably glass or glass ceramics, and the abrasive particle that is used for making grinding stone is preferably adamas, cubic boron nitride (CBN) or has vitrifacation abrasive particle any of specific die label.Especially, with the adamas be optimal material.
Fig. 1 is the partial schematic diagram of an embodiment of the milling drum that is used to make the disk substrate intermediate product of the present invention.
Owing to the disk substrate intermediate product that obtain according to the present invention have good flatness, less surface irregularity difference in height, so to compare the load ratio that applies in polishing process less with the traditional glass matrix, the manufacturing cost of disk substrate has reduced.In addition, manufacturing process according to disk substrate intermediate product of the present invention, do not produce pit and irregular warpage on the disk substrate material in grinding process, can keep thus by the good flatness of mill material, this technology helps to improve machining precision and efficient and reduces cost simultaneously.
Embodiment of the present invention will describe in detail with reference to accompanying drawing below, but the present invention is not limited to this.
At first, disk substrate intermediate product manufacturing process of the present invention comprises the steps: that articles for use grain label is that the abrasive particle of 600#～3000# is made the cup-shaped grinding stone of processing by the method for solidifying, and preferably the crystal grain label is 800#～1200#; The rotation center of working plate is positioned to process on the excircle of cup-shaped grinding stone; Cup-shaped grinding stone of processing and working plate are slided relatively so that the track unanimity that is attached to the disk substrate material on the worktable and processes each contact point between the cup-shaped grinding stone; Make the upper and lower surface of disk substrate intermediate product that brittle fracture grinding process and plastic yield grinding process in turn and continuously take place then, to form roughly the same machining deformation amount.
Fig. 1 is the partial schematic diagram of the embodiment of a milling drum that is used for the machining disk matrix, and this milling drum is applicable to the intermediate product of processing disk substrate of the present invention.As shown in Figure 1, at the milling drum that is used for processing disk substrate material 30 of the present invention, the rotation center P of dish type working plate 6 is arranged on dish type and processes on the excircle of cup-shaped grinding stone 2.
The number of working plate 6 is not limited to a specific quantity.But, consider each working plate 6 interlocking necessity and desire the size of the disk substrate material 30 of grinding, preferably select two working plates 6 for use.In addition, disk substrate material 30 usefulness waxes are fixed on the working plate 6, or are fixed on the working plate 6 by methods such as vacuum suction, so that the rotation center P of working plate 6 is concentric with the rotation center Q of disk substrate material 30.
Process cup-shaped grinding stone 2 by turning axle 4 driven rotary that link with the motor (not shown).By the belt pulley (not shown) interlocking of the rotation on the motor is transmitted in the rotating shaft 8, drive working plate 6 rotations by rotating shaft 8, thereby control spacing between cup-shaped grinding stone 2 and the working plate 6 by slip drive controlling mechanism (not shown), and control cup-shaped grinding stone 2 of processing and working plate 6 rotational speed separately, so that process cup-shaped grinding stone 2 and working plate 6 relative slips, thereby grinding skin 20 serves as that axle forms some the therefrom diametral curves that extend of mind-set excircle consistently with the rotation center P of working plate 6, this grinding skin be on the disk substrate 30 that is attached on the working plate 6 with the cup-shaped grinding stone of processing 2 contacted zones.
Like this, when comparing with the traditional rotary-type rotary grinding method of using cup-shaped grinding stone, because this structure makes grinding mechanism of the present invention and be attached to the unified track that disk substrate material 30 on the working plate keeps the cup-shaped grinding stone grinding face of processing with respect to grinding resistance, even connect one on a surface outwardly during grinding disk substrate material, also can obtain consistent track, this grinding mechanism is mainly realized brittle fracture, therefore the same with above-mentioned grinding technics, the machining deformation amount that produces on each surface of disk substrate material 30 can reach equal substantially.Therefore, prevent the irregular warpage of the disk substrate intermediate product of gained, thereby kept good flatness.
In order to realize above-mentioned brittle fracture, certain condition of work need be set so that constitute grinding and with the abrasive particle of grinding stone fragmentation takes place or come off.For this reason, the present invention realizes grinding by rotating rotatable working plate 6 that is fixed with disk substrate material 30 and the cup-shaped grinding stone 2 of processing that is fixed with abrasive particle simultaneously.In this case, the rotational speed of working plate 6 be preferably processing cup-shaped grinding stone 2 rotational speeies 20%～40% or 60%～80% in.This makes a kind of grinding mechanism that mainly carries out brittle fracture of formation become possibility.
As the various conditions that realize this brittle fracture, also need consider to process the speed of cup-shaped grinding stone 2 to 30 feedings of disk substrate material.This speed of feed can be easily by the rotational velocity range decision of working plate 6.
In above-mentioned method for grinding, because the grinding skin of unit interval is less, grinding resistance can be reduced, thereby can suppress the generation of grinding heat, thereby can high-speed grinding disk substrate material 30.Mainly carrying out to obtain very high flatness in the method for grinding of brittle fracture, yet the rough difference in height that only produces is just up to about 8 μ m on the grinding plane in brittle fracture process.Preferably, after brittle fracture process, add a process, as the method for the rough difference in height of a kind of further minimizing with plastic yield.
When in the grinding step plastic yield taking place, machining deformation may significantly increase sometimes.In order to suppress the generation of this machining deformation, the grinding output controlling that plastic yield preferably will take place is at maximum 5 μ m or littler.Like this, as the method that a kind of flatness that prevents disk substrate material 30 reduces because of plastic yield, preferably make the grinding track that stays on the disk substrate intermediate product grinding skin depict the therefrom diametral curve that stretches of mind-set excircle.
The purpose of mainly carrying out plastic yield in the grinding step can realize by the speed of feed that reduces the cup-shaped grinding stone 2 of processing.By brittle fracture process and plastic history are combined, and with it as a continuous operation, this makes to improve flatness and rough difference in height is controlled at 0.05 μ m～1 μ m becomes possibility.That is to say,, at first guarantee to take place the grinding process of brittle fracture, process cup-shaped grinding stone 2 thus and be suppressed, thereby plastic yield subsequently can be carried out effectively owing to the obstruction of grinding stone according to disk substrate material processing technique of the present invention.
Slip drive controlling of the present invention mechanism (not shown) is preferably carried out closed-loop control, this control procedure detects the gap between cup-shaped grinding stone of processing and the working plate, process the rotational speed of cup-shaped grinding stone and working plate etc., then the result is fed back to slip driver element (not shown).
On the other hand, because remaining deflection depends on that it is secured to situation on the working plate on the disk substrate intermediate product, perhaps because grinding heat influences machining precision significantly, therefore be necessary control method and the enough attention of method afford that are used to take away grinding heat to the installation of disk substrate material, so that obtain having thickness and warpage degree, and the disk substrate intermediate product with high precision flatness.
Therefore, grinding is carried out under wet state usually, for this reason, is equipped with on the grinding mechanism as being used for and provides the nozzle of grinding fluid and recirculation pipe etc. to the zone that is ground.Grinding fluid is difference with the difference of the abrasive type that constitutes the cup-shaped grinding stone of processing.For example, preferably adopt water-soluble grinding fluid, then preferably adopt water-insoluble grinding fluid for cubic boron nitride (CBN) grinding stone with good cooling power for adamas or vitrifacation grinding stone.
Preferably, the cup-shaped grinding stone of the processing of using among the present invention has higher rigidity, thereby can have disk substrate material than the high considerable tangent line grinding resistance of plain grinding resistance with the pinpoint accuracy grinding.Therefore, the abrasive particle of the cup-shaped grinding stone of formation processing preferably can be any in adamas, cubic boron nitride (CBN) or the vitrifacation abrasive particle.In other material, use adamas preferably.In addition, the cup-shaped grinding stone of the processing of using among the present invention preferably can be any in porous, particle or the section grinding stone, so that chip removal and provide the grinding fluid ratio to be easier to being ground the zone.
Like this, because the disk substrate intermediate product are to make with technology of the present invention, thereby the grinding track that has diametral curve shape in its surface, this technology can prevent to produce pit on grinding skin, and therefore the rough difference in height of its gained can be that the two sides all is about 10 μ m with the grinding output controlling in the polishing step subsequently between 0.05～1.0 μ m.
Like this because stock removal can reduce in the polishing step, can be in the flatness that keeps the disk substrate intermediate product, do not cause slip away and abrasive situation under, polish more cheaply.Thereby, the disk substrate intermediate product made from the method for materials such as grinding glass or glass ceramics with regard to suitable be that the parent of 3 inches or bigger disk substrate is used as a kind of diameter that is used for hard disk.
Following the present invention is explained in more detail with reference to embodiment and comparing embodiment.These embodiments are directions of the present invention, but the present invention are not construed as limiting.
Use a kind of glass ceramics matrix as the disk substrate material of desiring grinding, in table 1, carry out grinding under the listed grinding condition, glass basis (the diameter: 65mm that this glass ceramics matrix material is an annular, thickness: 0.83mm) carried out crystallization in two hours, and use the abrasive particle of following size by heating at 750 ℃.Thereby can polish as abrasive particle by using ceria.
Table 1
| Process conditions | |||
| The abrasive particle diameter | 180φ | ||
| The grinding stone rotating speed | 2880 rev/mins | ||
| The working plate rotating speed | 2000 rev/mins | ||
| The abrasive particle label | #400#600 | #800#1000#1500 | #2000#3000 |
| Elementary grinding | 150 microns/minute | 70 microns/ | 30 microns/minute |
| The secondary grinding | 30 microns/minute | 12 microns/minute | 5 microns/minute |
| Spark-out | 5 seconds | 5 seconds | 5 seconds |
Next, after the surfaceness of carrying out the glass basis intermediate product of grinding gained by the abrasive particle with every kind of specification is detected, on this surface, plate layer of Ni-P coating with conventional method.After carrying out aftertreatment, carry out texture and form operation.At this moment, the adhesiveness of check Ni-P coating.Table 2 illustrates the assay that comprises the overall assessment of whole process.Table 2 also shows the measurement result of stock removal in the grinding process.In this evaluation result, it is no problem that o represents in the actual use; X represents a practical problems, promptly unsatisfied result; Δ represents that this possibility of result is acceptable, but is not to be entirely satisfactory.
Table 2
| Abrasive particle | Surfaceness | Adhesiveness | Polished amount | Estimate | |
| Example 1 | #400 | ?4.8μm | ?○ | × | ?× |
| Example 2 | #600 | ?1.2μm | ?○ | Δ | ?Δ |
| Example 3 | #800 | ?0.7μm | ?○ | ○ | ?○ |
| Example 4 | #1000 | ?0.4μm | ?○ | ○ | ?○ |
| Example 5 | #1500 | ?0.2μm | ?○ | ○ | ?○ |
| Example 6 | #2000 | ?0.1μm | ?○ | ○ | ?○ |
| Example 7 | #3000 | ?0.05μm | ?○ | ○ | ?○ |
| Example 8 | CeO 2Polishing | ?0.001μm | ?× | ○ | ?× |
Attention: example 1 and example 8 are used for contrast, and example 2～example 7 is embodiments of the invention.
From the result of table 2 as can be seen, clearly, when using any abrasive particle of label between #600～#3000 to carry out grinding, can make the glass crystal intermediate product have higher adhesiveness, and make the working height difference that in glass crystal intermediate product grinding process, produces less with the Ni-P coating that method of spray plating forms.Polish with ceria and can not produce high adhesiveness.
Therefore, consider and will make bigger and disk substrate that cost is lower that people wish to develop a kind of disk substrate intermediate product, this product is coated with Ni-P coating and has minimum polishing process redundancy.Can clearly be seen that from table 2 technology of the present invention is one and satisfies the fabulous grinding process that all list requirement.
As mentioned above, disk substrate intermediate product of the present invention can make the polishing process redundancy in the subsequent step reduce, and form the Ni-P coating with high adhesiveness.Therefore, the present invention can reduce the required time of polishing significantly, and saves the spending of texture forming process, thereby is showing extremely strong superiority aspect the spending of saving disk substrate.In addition, the diameter that adopts this technology also can produce at low cost herein not provide is greater than 2.5 inches big glass basis.And, manufacturing process according to disk substrate intermediate product of the present invention, owing in grinding process, make grinding resistance and solid solution abrasive particle at the disk substrate material or be ground on the material surface and the grinding track is consistent, pit and irregular warpage, therefore the disk substrate intermediate product that can obtain to have good flatness have been prevented to produce in the grinding process.
Claims (11)
1. disk substrate intermediate product, grinding is all carried out with grinding stone in its two surface, it is characterized in that:
Each surperficial flatness is 10 μ m or littler;
The rough difference in height that above-mentioned grinding produces is 0.05～1.0 μ m.
2. disk substrate intermediate product described in the claim 1 is characterized in that:
The grinding track that forms on each face of disk substrate intermediate product is the therefrom outer diametral curve that stretches of mind-set.
3. the manufacturing process of disk substrate intermediate product comprises the step on two surfaces of the disk substrate material of the processing of grinding desire continuously successively, so that stay roughly the same machining deformation amount on the surface of each grinding, it is characterized in that:
The disk substrate intermediate product are remaining on 10 μ m or littler through the flatness after the above-mentioned grinding.
4. the described disk substrate intermediate product of claim 3 manufacturing process is characterized in that:
When with each surface of the above-mentioned disk substrate material of method grinding of grindstone, the abrasive particle that constitutes this grinding stone in elementary grinding step is preferably broken or come off from this grinding stone, will grind off most predetermined processing capacity in above-mentioned elementary grinding step.
5. claim 3 or 4 described disk substrate intermediate product manufacturing process is characterized in that:
Above-mentioned elementary grinding step comprises the steps: above-mentioned disk substrate material is fixed on the worktable, rotate above-mentioned worktable and grinding stone simultaneously, each surface of the above-mentioned disk substrate material of grinding, the rotating speed of above-mentioned worktable are 60%～80% or 20%～40% of grinding stone rotations.
6. the disk substrate intermediate product manufacturing process of claim 3 to 5 described in any is characterized in that:
Carry out secondary grinding step after elementary grinding step, under the condition of work of carrying out the secondary grinding, fragmentation does not take place or comes off in abrasive particle basically that constitute above-mentioned grinding stone.
7. the disk substrate intermediate product manufacturing process of claim 3 to 6 described in any is characterized in that:
Each surperficial flatness of above-mentioned disk substrate material is 10 μ m or littler;
Surfaceness (Ry) is 0.05～1.0 μ m.
8. the disk substrate intermediate product manufacturing process of claim 3 to 7 described in any is characterized in that:
Above-mentioned disk substrate material is a kind of inorganic material matrix.
9. the described disk substrate intermediate product of claim 8 manufacturing process is characterized in that:
Above-mentioned inorganic material matrix is a kind of glass basis or a kind of glass ceramics matrix.
10. the described disk substrate intermediate product of claim 8 manufacturing process, wherein:
Above-mentioned disk substrate intermediate product are with a kind of disk substrate material milling drum, make by each surface of grinding disk substrate material, and this milling drum comprises:
A working plate;
Install and detent mechanism, be contained on the above-mentioned working plate, be used for above-mentioned working plate is installed and be fixed on to the disk substrate material of desire processing;
The cup-shaped grinding stone of processing is made with the method for solidifying abrasive particle;
Slide mechanism owing to make above-mentioned working plate and process that cup-shaped grinding stone is relative to slide, is characterized in that:
The rotation center of above-mentioned working plate is positioned on the excircle of the cup-shaped grinding stone of above-mentioned processing;
Above-mentioned working plate comprises a drive controlling mechanism with the slide mechanism of the relative slip of the cup-shaped grinding stone of processing, so that the track of the contact point between disk substrate material on the above-mentioned working plate and the cup-shaped grinding stone of processing is consistent;
The label of above-mentioned abrasive particle is #600～#3000.
11. the described disk substrate intermediate product of claim 10 manufacturing process is characterized in that:
Above-mentioned abrasive particle is adamas, cubic boron nitride (CBN) or vitrifacation abrasive particle.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9361397A JPH11188588A (en) | 1997-12-26 | 1997-12-26 | Disk substrate intermediate product and its manufacture |
| JP361397/97 | 1997-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1221174A true CN1221174A (en) | 1999-06-30 |
Family
ID=18473414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98126347A Pending CN1221174A (en) | 1997-12-26 | 1998-12-28 | Disk substrate in intermediate product and manufacturing process thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH11188588A (en) |
| KR (1) | KR19990063400A (en) |
| CN (1) | CN1221174A (en) |
| DE (1) | DE19860101A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315514A (en) * | 2017-11-03 | 2020-06-19 | 西门子股份公司 | Rotation of work on machine tools |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4795529B2 (en) * | 2000-12-07 | 2011-10-19 | 株式会社東芝 | Ceramic substrate, thin film circuit substrate, and method for manufacturing ceramic substrate |
| DE102004037454A1 (en) | 2004-08-02 | 2006-02-23 | Carl Zeiss Ag | Method for processing surfaces of workpieces |
-
1997
- 1997-12-26 JP JP9361397A patent/JPH11188588A/en active Pending
-
1998
- 1998-12-23 DE DE19860101A patent/DE19860101A1/en not_active Withdrawn
- 1998-12-24 KR KR1019980058052A patent/KR19990063400A/en not_active Ceased
- 1998-12-28 CN CN98126347A patent/CN1221174A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315514A (en) * | 2017-11-03 | 2020-06-19 | 西门子股份公司 | Rotation of work on machine tools |
| US11067962B2 (en) | 2017-11-03 | 2021-07-20 | Siemens Aktiengesellschaft | Rotation of workpieces on a machine tool |
| CN111315514B (en) * | 2017-11-03 | 2021-07-23 | 西门子股份公司 | Rotation of the workpiece on the machine |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19860101A1 (en) | 1999-07-22 |
| JPH11188588A (en) | 1999-07-13 |
| KR19990063400A (en) | 1999-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI429507B (en) | End face working method of plate glass | |
| EP0604395B1 (en) | Grinding wheel having high impact resistance, for grinding rolls as installed in place | |
| US7275311B2 (en) | Apparatus and system for precise lapping of recessed and protruding elements in a workpiece | |
| EP0544256B1 (en) | Method of chamfering semiconductor wafer | |
| CN103084957A (en) | Sheet glass, manufacturing method therefor, method and apparatus for polishing end edge portion of sheet glass | |
| JP4252093B2 (en) | Disc-shaped substrate grinding method and grinding apparatus | |
| CN1898039A (en) | Grinding wheel for roll grinding application and method of roll grinding thereof | |
| CN1364107A (en) | Polishing method and equipment for chamfering part of peripheral surface of wafer | |
| EP0945222A2 (en) | Ultra fine groove chip and ultra fine groove tool | |
| JP3006591B2 (en) | Porous grindstone for roll polishing and roll surface polishing method | |
| CN112959212A (en) | Chemical mechanical polishing pad with optimized grooves and application thereof | |
| CN117124228A (en) | A kind of superhard material grinding tool and grinding technology for difficult-to-machine materials | |
| CN1221174A (en) | Disk substrate in intermediate product and manufacturing process thereof | |
| US7121928B2 (en) | High smoothness grinding process and apparatus for metal material | |
| CN1254633A (en) | Method for grinding glass substrate | |
| CN1196993A (en) | Magnetic substrate semi-products, its making method and grinding processing appts. | |
| CN1263512A (en) | Polishing glass | |
| JP3497492B2 (en) | Hard foam resin grooved pad for semiconductor device processing and pad turning groove processing tool | |
| JP2001001241A (en) | Glass substrate grinding method | |
| JPH0732252A (en) | Work rotation type grinding method, work rotation type grinding machine, silicon wafer and ceramic substrate | |
| JP4746788B2 (en) | Super-abrasive wheel for surface honing, dressing method thereof, and grinding apparatus using the wheel | |
| TWI645940B (en) | Grinding tool | |
| JP2000288917A (en) | Wrapping device and polishing method using it | |
| JPH07164327A (en) | Cutting blade and electrolytic dressing, grinding and cutting device | |
| JP2000052209A (en) | Double-headed flat surface grinding device and grinding method using it |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |