CN1217358C - Silk-screen printing board, ceramic laminated electronic equipment and its producing method - Google Patents
Silk-screen printing board, ceramic laminated electronic equipment and its producing method Download PDFInfo
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- CN1217358C CN1217358C CN011218010A CN01121801A CN1217358C CN 1217358 C CN1217358 C CN 1217358C CN 011218010 A CN011218010 A CN 011218010A CN 01121801 A CN01121801 A CN 01121801A CN 1217358 C CN1217358 C CN 1217358C
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- 238000007650 screen-printing Methods 0.000 title claims abstract description 51
- 239000000919 ceramic Substances 0.000 title claims description 43
- 238000000034 method Methods 0.000 title claims description 21
- 238000007639 printing Methods 0.000 claims abstract description 21
- 239000002003 electrode paste Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract description 11
- 238000013461 design Methods 0.000 abstract description 4
- 239000011247 coating layer Substances 0.000 description 46
- 238000013459 approach Methods 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/247—Meshes, gauzes, woven or similar screen materials; Preparation thereof, e.g. by plasma treatment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Pest Control & Pesticides (AREA)
- Textile Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Capacitors (AREA)
- Screen Printers (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Methods (AREA)
Abstract
丝网印刷板提供有多个安排在单一的板框架中的印刷图样，每个印刷图样形成有多个网孔，按照在丝网印刷板上安排印刷图样的区位置，提供至少两个不同的网孔的孔径比形成该印刷图样，形成位于接近于板框架周围区的印刷图样的网孔的孔径比设置得高于形成位于板框架中央区的印刷图样的网孔的孔径比。
A screen printing plate provided with a plurality of printing patterns arranged in a single plate frame, each printing pattern formed with a plurality of mesh holes, providing at least two different The aperture ratio of the mesh forming the printing design is set higher for the mesh forming the printing design located near the peripheral area of the plate frame than the aperture ratio of the mesh forming the printing design located in the central area of the plate frame.
Description
The present invention relates to plates for screen printing, provide the ceramic laminated electronic equipment that is used to make the method for ceramic laminated electronic equipment and passes through this method manufacturing in the undressed thin plate of laminated pottery of the electrode pattern that forms by the use plates for screen printing in processing.
Usually make ceramic laminated electronic equipment with following process, it is a plurality of by printing or adopt the ceramic undressed thin plates of the internal electrode pattern that electrode paste forms that laminated and bonding predetermined quantity provides, ceramic laminated thin plate is cut into independently unit, and toast these unit.
According to the development in electronic device miniaturization recently, ceramic laminated electronic equipment reduces dimensionally and improves on performance.Especially, ceramic laminated capacitor develops towards the direction of a lot of laminations, and wherein the laminated increase of internal electrode and insulator is to realize miniaturization and big capacity.
But, when attempting to increase the layered structure of internal electrode and insulator and when the ceramic undressed thin plate that provides the internal electrode pattern of predetermined quantity is adhered to one another, the district that provides the district of internal electrode pattern therein and do not provide internal electrode finds a problem, promptly, on level or height, differ from one another, therefore produce the shortcoming of internal structure probably, such as layering.
Above-mentioned level error produces by the laminated ceramic undressed thin plate that provides the internal electrode pattern, and still, level error is not only caused by the internal electrode pattern that provides, and is also produced by the variation of the coating layer thickness between each internal electrode pattern sometimes.
Therefore, in order to reduce the quantity of level error and increase layered structure, the variation that reduces the coating layer thickness between the internal electrode pattern also is very important task.
Up to now, method for printing screen has been used for the paste that prints electrode on the undressed thin plate of pottery.Shown in Fig. 7 and 8, in method for printing screen, the plates for screen printing 51 that is arranged on the ceramic undressed thin plate 52 provides a plurality of mesh 62 so that form a plurality of print patterns 61, electrode paste 53 is provided on the plates for screen printing 51, at squeegee 54 when pressing to plates for screen printing 51, squeegee 54 moves with predetermined direction, for example, direction with Fig. 7 arrow Y, therefore electrode paste 53 forms the print pattern 61 of plates for screen printing 51 by mesh 62, electrode paste 53 is printed on the ceramic undressed plate 52, forms predetermined electrode pattern 55.
But in above-mentioned method for printing screen, when squeegee 54 moves when depressing simultaneously, pressure is not applicable to whole plates for screen printing 51 equably.In the district R1 that is arranged in around approaching, efficient pressure is used for print pattern 61, approaches framework 56 and attempts to become greater than being applicable at the pressure of arranging away from the central area print pattern 61 of framework 56, as shown in Figure 8.Therefore, plates for screen printing 51 is attempted to approach district R1 on every side than central area R2 expansion.Therefore, become thinner than central area R2 among the district R1 of the coating of electrode pattern 55 around approaching, a problem occurs, produce the variation of the coating layer thickness of a plurality of electrode patterns 55 that print by use plates for screen printing 51.This problem is that for the substandard generation of the undressed thin plate of pottery, the variation of coating layer thickness has opposite result after laminated and bonding.
Known a kind of relevant technology, it be a kind of method wherein in single print pattern the size of mesh be (reference example such as the Japanese laid-open patent application that differs from one another, publication number No.6-349663), this print pattern forms by mesh is provided in plates for screen printing.But, the fact is the variation that still untapped any effective method is used in particular for avoiding the coating layer thickness between a plurality of electrode patterns 55, as mentioned above, electrode pattern 55 is by using the plates for screen printing 51 that provides a plurality of print patterns in the plate framework of plates for screen printing 51 to print.
Therefore, the purpose of this invention is to provide a kind of plates for screen printing, it prints a plurality of electrode patterns, wherein can avoid the variation of the coating layer thickness between a plurality of electrode patterns, with a kind of ceramic laminated electronic equipment by using this plates for screen printing to make is provided, wherein reduced the shortcoming of internal structure.
For this reason, according to one aspect of the present invention, plates for screen printing comprises the plates for screen printing that provides a plurality of print patterns in the single plate framework that is arranged in silk screen plate, each print pattern is formed with a plurality of mesh, according to the zone position of arranging print pattern on plates for screen printing, the aperture that at least two different mesh are provided is than forming this print pattern.
With this arrangement, wherein according to the zone position of arranging print pattern, the aperture that at least two different mesh are provided can be suppressed at the variation of the coating layer thickness between a plurality of electrode patterns than forming a plurality of print patterns by the electrode pattern that uses this plates for screen printing printing.
For example, when squeegee presses given plates for screen printing district when enlarging the given area and surpass other district such as central area near the peripheral region (peripheral region) of plates for screen printing with by squeegee silk pressing wire mark brush board, it is very little or very thin that the coating layer thickness of electrode pattern becomes, (around in the district) is than the district's (central area) at other in given district, when the ratio of the aperture area of mesh (aperture than) and unit are when being identical, the aperture ratio of mesh is arranged so that around to be increased in the district, and be provided with to such an extent that in central area, reduce, promptly, therefore the aperture can suppress and avoid the variation of the coating layer thickness between electrode pattern than changing according to the district that provides print pattern.
In according to plates for screen printing of the present invention, form and to be arranged in the aperture of approaching the print pattern mesh around the plate framework than being provided with to such an extent that be higher than the aperture ratio that formation is arranged in the print pattern mesh that approaches the plate framework inboard.
When sticking with paste when printing electrode by pressure squeegee on plates for screen printing, plates for screen printing is distinguished around than central area and is more tended to enlarge.Mesh by being arranged on the mesh that approaches the print pattern arranged around the plate framework is than the mesh ratio that is higher than at the mesh of the print pattern that approaches the inboard arrangement around the plate framework, can provide more conduction bonding by being arranged in the print pattern that approaches around the plate framework, therefore suppress and avoid the variation of the coating layer thickness between electrode pattern.
According to another aspect of the present invention, a kind of method that is used to make ceramic laminated electronic equipment, comprise step: prepare the undressed thin plate of a plurality of potteries, the plates for screen printing that wherein includes the silk screen plate of the print pattern in a plurality of separate board frameworks that are arranged in silk screen plate by use, reduced the variation of the coating layer thickness between print pattern, each print pattern is formed by a plurality of mesh.According to the zone position that print pattern forms, the aperture that at least two different mesh are provided is than forming print pattern.This method also comprises step: the undressed plate of stacking and bonding a plurality of potteries, and each provides a plurality of electrode patterns, and the product that cuts this stacking and bonding layering is an independent parts; Part with this cutting of baking.
Independent parts is repeatedly pressed, is bondd, is cut into to the ceramic undressed thin plate of predetermined quantity, and toasted, the undressed thin plate of this pottery provides a plurality of electrode patterns by forming according to plates for screen printing of the present invention, wherein the variation of the coating layer thickness between electrode pattern is reduced, therefore can make ceramic laminated electronic equipment effectively, especially ceramic laminated capacitor, ceramic laminated capacitor has size of simplifying and very big capacity, wherein the quantity of laminate patch can increase, and structural shortcoming can not occur.
According to another aspect of the present invention, a kind of ceramic laminated electronic equipment is provided, it comprise structure wherein internal electrode repeatedly press each other with ceramic layer, comprise that by method step prepares the undressed thin plate of a plurality of potteries and make, the plates for screen printing that includes the silk screen plate of the print pattern in a plurality of single plate frameworks that are arranged in silk screen plate by use, reduced the variation of the coating layer thickness between print pattern, each print pattern is formed by a plurality of mesh.According to the zone position that print pattern forms, the aperture that at least two different mesh are provided is than forming print pattern.This method also comprises step: the undressed thin plate of stacking and bonding a plurality of potteries, and each provides a plurality of electrode patterns, and the product that cuts this stacking and bonding layering is an independent parts; Part with this cutting of baking.
Because ceramic laminated equipment is made by this method, wherein the ceramic undressed thin plate of predetermined quantity provides a plurality of electrode patterns, under predetermined condition, electrode pattern is repeatedly pressed, is bondd, is cut and baking, the variation of the coating layer thickness between it is reduced, even when the quantity of layered structure increases, can guarantee high reliability with the shortcoming that reduces internal structure.
Fig. 1 is a plane graph according to the plates for screen printing of embodiments of the invention;
Fig. 2 A and 2B be respectively plates for screen printing shown in Figure 1 near around the cutaway view and the bottom view of mode configuration of local print pattern;
Fig. 3 A and 3B are respectively the cutaway view and the bottom views of the mode configuration of the local print pattern of the central authorities of plates for screen printing shown in Figure 1;
Fig. 4 is a view, and wherein by using according to plates for screen printing of the present invention, pattern (print pattern) prints electrode on the undressed thin slice of pottery;
Fig. 5 is one to be passed through to use according to plates for screen printing of the present invention, is printed with the ceramic undressed thin slice schematic diagram of electrode pattern (print pattern);
Fig. 6 be one by using according to plates for screen printing of the present invention, provide the cutaway view of ceramic capacitor of lamination of the ceramic undressed thin slice manufacturing of electrode pattern through laminated processing;
Fig. 7 is a representational view, and the process of known method for printing screen is shown;
Fig. 8 is a longitudinal sectional view, and the process of known method for printing screen is shown.
The description of first-selected embodiment
Illustrate below according to embodiments of the invention, therefore characteristics of the present invention are described in further detail.
By using plates for screen printing to describe this embodiment as an example, form electrode pattern (print pattern) as internal electrode being used to make on the ceramic undressed thin plate of ceramic laminated electric capacity.
Fig. 1 is a plane graph according to the plates for screen printing of embodiments of the invention, Fig. 2 A be plates for screen printing A shown in Figure 1 near around the cutaway view of mode configuration of the print pattern 11 (11a) that forms of the peripheral region R1 at (edge), Fig. 2 B is the bottom view of the mode configuration shown in Fig. 2 A; Fig. 3 A is the cutaway view of mode configuration of print pattern 11 (11b) of the central local R2 of plates for screen printing shown in Figure 1, and Fig. 3 B is the bottom view of the mode configuration shown in Fig. 3 A.
Shown in Figure 4 and 5, plates for screen printing A comprises the stainless steel wire web plate 12 that for example comprises plate framework 14, wherein a plurality of print patterns 11 are arranged in the sheet frame 14, make a plurality of electrode patterns (print pattern) 22 to be printed on the ceramic undressed thin plate 21 with the shape of expectation, silk screen plate 12 is by the peripheral support of framework 15 at silk screen plate 12.
Shown in Fig. 1,2 and 3, the print pattern 11 of silk screen plate 12 is formed by the mesh 13 that the precalculated position at silk screen plate 12 forms.
In silk screen plate A according to embodiments of the invention, be positioned at the aperture that the peripheral region R1 at (edge) around the approaching of plate framework 14 forms the mesh 13 of print pattern 11 (11a) and be positioned at the aperture ratio that central area R2 forms the mesh 13 of print pattern 11 (11b), shown in Fig. 2 and 3 than being higher than of being provided with.
Particularly, according to embodiments of the invention, a print pattern 11 (11a) of distinguishing R1 around is formed with 9 mesh 13, print pattern 11 (11b) at central area R2 is formed with 6 mesh 13, shown in Fig. 2 and 3, therefore the aperture ratio of distinguishing the mesh 13 of the print pattern 11 (11a) that R1 forms around becomes 30%, and the aperture ratio of the mesh 13 of the print pattern 11 (11b) that forms at central area R2 becomes 20%.
The silk screen plate A that provides a plurality of print patterns 11 is arranged on the ceramic undressed plate 21, electrode paste 23 is provided on the silk screen plate A, when pressing to silk screen plate A, squeegee 24 moves with predetermined direction, for example, with the direction of Fig. 4 arrow Y, so electrode paste 23 forms the print pattern 11 of silk screen plate A by mesh 13, electrode paste 23 is printed on the ceramic undressed thin plate 21, forms predetermined electrode pattern 22 (see figure 5)s.Measure the coating layer thickness of each electrode pattern (print pattern) 22, and check the intensity of variation of thickness.
In order to compare, prepared a plates for screen printing of example as a comparison, it provide according to embodiments of the invention with those at the identical print pattern of central area R2, promptly, print pattern has the aperture ratio of identical 20% mesh, as each other at the peripheral region R1 and the central area R2 of example relatively.By using the comparative example of plates for screen printing, a plurality of electrode patterns (print pattern) are printed on the undressed thin plate, measure the coating layer thickness of each electrode pattern (print pattern), and check the intensity of variation of thickness.
The results are shown in the table 1.
Table 1
| Example relatively | Example according to embodiments of the invention | |
| Average coating layer thickness (mm) | 0.70 | 0.70 |
| Maximum coating layer thickness (mm) | 0.95 | 0.80 |
| Minimum cover thickness (mm) | 0.55 | 0.65 |
| Variable quantity (CV) (%) | 15.1 | 7.5 |
| The peripheral region | Central area | The peripheral region | Central area | |
| Average coating layer thickness (mm) | 0.62 | 0.81 | 0.70 | 0.72 |
| Maximum coating layer thickness (mm) | 0.71 | 0.95 | 0.78 | 0.82 |
| Minimum cover thickness (mm) | 0.55 | 0.62 | 0.65 | 0.69 |
| The boring ratio rate of shielding | 20 | 20 | 30 | 30 |
As shown in table 1, when using the comparative example of plates for screen printing, the average coating layer thickness of electrode pattern (print pattern) is 0.70mm, and wherein maximum coating layer thickness is 0.95mm, and wherein minimum cover thickness is 0.55mm, and variable quantity (CV value) is 15.1%.
When the plates for screen printing A that uses according to embodiments of the invention, the average coating layer thickness of electrode pattern (print pattern) is 0.70mm, and wherein maximum coating layer thickness is 0.80mm, and wherein minimum cover thickness is 0.65mm, and variable quantity (CV value) is 7.5%.From shown in compare with the situation of the comparative example of using plates for screen printing, the variable quantity of the coating layer thickness between each electrode pattern (print pattern) (CV value) has reduced significantly.
Coating layer thickness as for the electrode pattern (print pattern) of distinguishing R1 and central area R2 around, when the example of the comparison of using plates for screen printing, distinguish among the R1 around, the average coating layer thickness of electrode pattern (print pattern) is 0.62mm, maximum coating layer thickness is that 0.71mm and minimum cover thickness are 0.55mm; In central area R2, the average coating layer thickness of electrode pattern (print pattern) is 0.81mm, and maximum coating layer thickness is that 0.95mm and minimum cover thickness are 0.62mm.Average coating layer thickness, maximum coating layer thickness and the minimum cover thickness of distinguishing the electrode pattern (print pattern) among the R1 around are littler than the average coating layer thickness of the electrode pattern in central area R2 (print pattern), maximum coating layer thickness and minimum cover thickness respectively.
Coating layer thickness as for the electrode pattern (print pattern) of distinguishing R1 and central area R2 around, when the example that uses according to the plates for screen printing of embodiments of the invention, distinguish among the R1 around, the average coating layer thickness of electrode pattern (print pattern) is 0.70mm, maximum coating layer thickness is that 0.78mm and minimum cover thickness are 0.65mm; In central area R2, the average coating layer thickness of electrode pattern (print pattern) is 0.72mm, and maximum coating layer thickness is that 0.80mm and minimum cover thickness are 0.69mm.The average coating layer thickness, maximum coating layer thickness and the minimum cover thickness that therefrom are illustrated in the electrode pattern (print pattern) among the peripheral region R1 approach average coating layer thickness, maximum coating layer thickness and the minimum cover thickness of the electrode pattern (print pattern) in central area R2 respectively, and variable quantity is very little.
By using plates for screen printing, as mentioned above, can reduce effectively by the variable quantity that uses the coating layer thickness of a plates for screen printing between a plurality of electrode patterns of printing according to embodiments of the invention.
The ceramic undressed thin plate that provides the predetermined quantity of electrode pattern is repeatedly pressed each other, wherein the variable quantity of coating layer thickness has reduced, as mentioned above, do not provide the ceramic undressed thin plate (being used for outer field thin plate) of electrode pattern repeatedly to be pressed in the top and the bottom of the ceramic undressed plate that provides electrode pattern respectively, be bonded to each other together, and be cut into independent part.The part of cutting provides the outer electrode in the precalculated position that is formed on this part separately, therefore can obtain laminated ceramic condenser, as shown in Figure 6, each provides pair of external electrodes 34a and 34b, they are connected in internal electrode 32 individually, and wherein a plurality of internal electrodes 32 and ceramic layer 31 are repeatedly pressed each other on the terminal of part 33.
Laminated ceramic condenser is made by the laminated ceramic undressed thin plate that provides electrode pattern, and wherein the variable quantity of the coating layer thickness of electrode pattern reduces, and has therefore reduced the shortcoming of internal structure, such as layering, realizes high reliability.
Though in the above-described embodiments, mesh 13 in each print pattern 11 (11a) is compared be arranged among the peripheral region R1 more with central area R2, make and distinguish the aperture of the mesh 13 among the R1 around than the aperture ratio that is different from central area R2, the aperture of distinguishing among the R1 mesh 13 that forms print pattern 11 (11a) around than and the aperture of mesh 13 that in central area R2, forms print pattern 11 (11b) than differing from one another of can being provided with, so that the variation number of the mesh 13 replacement mesh 13 that size differs from one another to be arranged.
The invention is not restricted to the embodiments described, and about the material of silk screen plate, the special shape and the design of mesh, the relation of position between the district, wherein the ratio in aperture differs from one another, the quantity in district, wherein the ratio in aperture differs from one another, the type of printed material, such as electrode paste or the like, present embodiment can comprise various application and change within the spirit and scope of the present invention.
Claims (3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP180087/2000 | 2000-06-15 | ||
| JP2000180087A JP2001353837A (en) | 2000-06-15 | 2000-06-15 | Screen printing plate, method for manufacturing laminated ceramic electronic part, and laminated ceramic electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1329341A CN1329341A (en) | 2002-01-02 |
| CN1217358C true CN1217358C (en) | 2005-08-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN011218010A Expired - Lifetime CN1217358C (en) | 2000-06-15 | 2001-06-14 | Silk-screen printing board, ceramic laminated electronic equipment and its producing method |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6962111B2 (en) |
| JP (1) | JP2001353837A (en) |
| CN (1) | CN1217358C (en) |
| SG (1) | SG90247A1 (en) |
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| TWI648167B (en) * | 2018-06-12 | 2019-01-21 | 倉和股份有限公司 | Screen plate capable of adjusting ink permeability of mesh cloth and manufacturing method thereof |
| CN115534502B (en) * | 2021-06-30 | 2024-05-28 | 晶科能源(海宁)有限公司 | Screen printing stencil, method for forming solar cell electrode, and solar cell |
| CN114618755B (en) * | 2022-02-25 | 2025-02-25 | 谢雪云 | Golf club grip mounting device that fits smoothly |
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| US3225691A (en) * | 1961-03-10 | 1965-12-28 | Continental Can Co | Printing plate for gasket type closures |
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| JPH06938A (en) | 1992-06-19 | 1994-01-11 | Shinwa:Kk | Metal mask and manufacturing method thereof |
| JPH06349663A (en) * | 1993-06-14 | 1994-12-22 | Matsushita Electric Ind Co Ltd | Screen printing plate, laminated electronic component and laminated ceramic capacitor |
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| JP2000147781A (en) * | 1998-11-06 | 2000-05-26 | Ngk Insulators Ltd | Screen mask, its production and wiring base board |
| US6095041A (en) * | 1999-07-22 | 2000-08-01 | International Business Corporation | Stencil mask with channels including depressions |
-
2000
- 2000-06-15 JP JP2000180087A patent/JP2001353837A/en active Pending
-
2001
- 2001-05-03 SG SG200102627A patent/SG90247A1/en unknown
- 2001-06-05 US US09/873,375 patent/US6962111B2/en not_active Expired - Lifetime
- 2001-06-14 CN CN011218010A patent/CN1217358C/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101354948B (en) * | 2008-05-28 | 2011-03-09 | 广东风华高新科技股份有限公司 | Method for manufacturing chip inductor and inductor thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| US20020020310A1 (en) | 2002-02-21 |
| CN1329341A (en) | 2002-01-02 |
| US6962111B2 (en) | 2005-11-08 |
| JP2001353837A (en) | 2001-12-25 |
| SG90247A1 (en) | 2002-07-23 |
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