CN121320903A - Solid lubricating film for copper pair and preparation method and application thereof - Google Patents
Solid lubricating film for copper pair and preparation method and application thereofInfo
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- CN121320903A CN121320903A CN202511695902.6A CN202511695902A CN121320903A CN 121320903 A CN121320903 A CN 121320903A CN 202511695902 A CN202511695902 A CN 202511695902A CN 121320903 A CN121320903 A CN 121320903A
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Abstract
The invention provides a solid lubricating film for a copper pair and a preparation method and application thereof, and belongs to the technical field of lubricating materials. The solid lubricating film for copper accessory comprises a metal bonding layer, a metal carbide gradient layer and a doped diamond-like carbon film layer which are sequentially stacked, wherein the carbon content in the metal carbide gradient layer is increased along the direction of the doped diamond-like carbon film layer, and the doping elements in the doped diamond-like carbon film layer are B, si, si+O mixed elements or Si+F mixed elements. When the solid lubricating film is in friction with the copper pair, the friction coefficient of a friction interface can be effectively reduced, the abrasion of the copper friction pair is obviously reduced, excellent tribological performance is shown, and compared with the traditional solid lubricating carbon film, the solid lubricating film has obviously lower friction coefficient and can obviously reduce the abrasion of the copper pair.
Description
Technical Field
The invention relates to the technical field of lubricating materials, in particular to a solid lubricating film for copper pairs and a preparation method and application thereof.
Background
Lubrication is the most effective technological approach for reducing friction and wear of mechanical moving parts, and various lubricating materials including liquid lubricants, solid lubricants and semisolid grease lubricants have been widely used for solving the problems of friction and wear in the fields of industrial machinery, advanced equipment and the like. The solid lubricant has excellent tribological performance under the working conditions of high vacuum, extreme temperature, irradiation, corrosion, oxidation, lean oil lubrication and the like due to the advantages of high bearing, good thermal and chemical stability, negligible vapor pressure and the like, and is widely applied to the lubrication protection of key moving parts in the fields of space machinery, aviation equipment, automobiles, ships and the like.
The metal copper has the advantages of low friction, seizure resistance, high thermal conductivity, corrosion resistance, easy processing, composite modification potential and the like, and is widely applied to the fields of gears, sliding bearings, braking systems, electrical contacts and the like. However, although metallic copper exhibits self-lubricating properties compared with other metallic materials, it still exhibits a high friction coefficient compared with typical solid lubricants, resulting in a copper friction member that is outstanding in wear problems during operation and high in friction power consumption. In recent years, with rapid development of robotics, many joints, bearings, and load members employ copper-based members in view of self-lubricating properties and workability of copper. In practical applications, these copper-based components still present significant problems of frictional wear despite the use of various grease lubrication techniques. There is an urgent need to develop solid lubrication technology to improve the tribological properties of such components to improve the performance of the motion system and the useful life of the components. At present, the traditional diamond-like carbon, molybdenum disulfide and other solid lubricating films cannot provide effective lubrication improvement for copper friction parts.
Disclosure of Invention
In view of the above, the invention aims to provide a solid lubricating film for copper pairs, and a preparation method and application thereof. When the solid lubricating film and the copper pair are matched, the interface friction coefficient and the abrasion rate can be obviously reduced, the reliability of the copper-based part is effectively improved, and the service life of the copper-based part is prolonged.
In order to achieve the above object, the present invention provides the following technical solutions:
The invention provides a solid lubricating film for copper matching, which comprises a metal bonding layer, a metal carbide gradient layer and a doped diamond-like carbon film layer which are sequentially laminated, wherein the carbon content in the metal carbide gradient layer is increased along the direction of the doped diamond-like carbon film layer;
when the doping element is B or Si, the atomic percentage of B or Si in the doped diamond-like carbon film layer is independently 1.5% -20%;
when the doping element is a Si+O mixed element or a Si+F mixed element, the atomic percentage of Si in the doped diamond-like carbon film layer is 1.5% -20%, and the atomic percentage of O or F is independently 1% -15%.
Preferably, the metal bonding layer is a Cr, ti, W or alloy layer, and the elements in the alloy layer include two or three of Cr, ti and W.
Preferably, the thickness of the metal bonding layer is 0.2-0.6 μm.
Preferably, the metal carbide gradient layer is CrWC x、TiWCx or WC x.
Preferably, the thickness of the metal carbide gradient layer is 0.5-1.0 μm.
Preferably, the doped diamond-like carbon film layer is a doped hydrogen-containing diamond-like carbon film, and the doping element in the doped hydrogen-containing diamond-like carbon film is a B, si, si+O mixed element or Si+F mixed element.
Preferably, when the doping element is B or Si, the atomic percentage of B or Si in the doped hydrogen-containing diamond-like carbon film is independently 1.5% -20%;
When the doping element is a Si+O mixed element or a Si+F mixed element, the atomic percentage of Si in the doped hydrogen-containing diamond-like carbon film is 1.5% -20%, and the atomic percentage of O or F is independently 1% -15%.
Preferably, the thickness of the doped diamond-like carbon film layer is 1.0-6.0 μm.
The invention also provides a preparation method of the solid lubricating film for the copper pair, which is characterized by comprising the following steps:
and (3) carrying out vacuum vapor deposition on the surface of the base material, and sequentially forming a metal bonding layer, a metal carbide gradient layer and a doped diamond-like carbon film layer to obtain the solid lubricating film for the copper pair.
The invention also provides the application of the solid lubricating film for the copper pair or the solid lubricating film for the copper pair prepared by the preparation method in the technical scheme in the lubricating field.
The invention provides a solid lubricating film for copper matching, which comprises a metal bonding layer, a metal carbide gradient layer and a doped diamond-like carbon film layer which are sequentially stacked, wherein the carbon content in the metal carbide gradient layer is increased along the direction of the doped diamond-like carbon film layer, the doped elements in the doped diamond-like carbon film layer are B, si, si+O mixed elements or Si+F mixed elements, when the doped elements are B or Si, the atomic percentage of B or Si in the doped diamond-like carbon film layer is independently 1.5% -20%, when the doped elements are Si+O mixed elements or Si+F mixed elements, the atomic percentage of Si in the doped diamond-like carbon film layer is 1.5% -20%, and the atomic percentage of O or F is independently 1% -15%.
Compared with the prior art, the invention has the following beneficial effects:
The invention utilizes the doped diamond-like carbon film layer to realize the effective regulation and control of the tribological performance of the solid lubricating film and the copper pair, combines the types and the atomic percent content of the doping elements, can obviously reduce the interface friction coefficient and the abrasion rate when being matched with the copper pair, effectively improves the reliability of copper-based parts and prolongs the service life of the copper-based parts, and the metal carbide gradient layer can better eliminate the stress, the chemical and the structural mismatch between the metal bonding layer and the doped diamond-like carbon film layer on one hand and improve the hardness on the other hand, and the high-hardness metal carbide gradient layer can lead the solid lubricating film to show better bearing performance. The solid lubricating film can be deposited on the surfaces of various metal and ceramic substrates, and the tribological performance of the friction interface between the solid lubricating film and copper is obviously improved.
The data of the examples show that the nano hardness of the solid lubricating film is not lower than 10 GPa, the dry friction coefficient is smaller than 0.15 when the solid lubricating film is matched with copper, and the abrasion rate is smaller than 8.0x -7mm3/Nm.
The invention also provides a preparation method of the solid lubricating film for the copper pair, which is characterized in that the prepared solid lubricating film has a significantly lower friction coefficient compared with the traditional solid lubricating carbon film by utilizing a vacuum vapor deposition method, can significantly reduce the abrasion of the copper pair, provides a new solution for solving the problem of the friction and abrasion of the copper friction part, and is simple to operate and suitable for realizing industrial application.
Drawings
FIG. 1 is a schematic structural view of a solid lubricating film for a copper pair according to the present invention;
FIG. 2 is a graph showing the friction coefficient between the solid lubricating film prepared in example 2 and copper pair;
FIG. 3 is a graph showing the coefficient of friction between the hydrogen-containing diamond-like carbon film prepared in comparative example 1 and copper pairs;
FIG. 4 is a graph showing the friction coefficient between the solid lubricating film prepared in comparative example 2 and copper pair.
Detailed Description
The invention provides a solid lubricating film for copper matching, which comprises a metal bonding layer, a metal carbide gradient layer and a doped diamond-like carbon film layer which are sequentially laminated, wherein the carbon content in the metal carbide gradient layer is increased along the direction of the doped diamond-like carbon film layer;
when the doping element is B or Si, the atomic percentage of B or Si in the doped diamond-like carbon film layer is independently 1.5% -20%;
when the doping element is a Si+O mixed element or a Si+F mixed element, the atomic percentage of Si in the doped diamond-like carbon film layer is 1.5% -20%, and the atomic percentage of O or F is independently 1% -15%.
Fig. 1 is a schematic structural view of a solid lubricating film for a copper pair according to the present invention.
In the present invention, the metal bonding layer is preferably a Cr, ti, W or alloy layer, and the elements in the alloy layer preferably include two or three of Cr, ti and W.
In the present invention, the thickness of the metal adhesive layer is preferably 0.2 to 0.6 μm, and may specifically be 0.2, 0.3, 0.4, 0.5 or 0.6 μm.
In the invention, the metal carbide gradient layer is preferably CrWC x、TiWCx or WC x, which can better eliminate stress, chemical and structural mismatch between the metal bonding layer and the doped diamond-like carbon film layer on one hand, and can improve the hardness on the other hand, and the high-hardness metal carbide gradient layer can enable the solid lubricating film to show better bearing performance.
In the present invention, the thickness of the metal carbide gradient layer is preferably 0.5 to 1.0 μm, and may specifically be 0.5, 0.6, 0.7, 0.8, 0.9 or 1.0 μm.
In the present invention, the doped diamond-like carbon film layer is preferably a doped hydrogen-containing diamond-like carbon film.
In the present invention, when the doping element is preferably B or Si, the atomic percentage of B or Si in the doped hydrogen-containing diamond-like carbon film is independently preferably 5% to 15%, and may specifically be 1.5%, 5.4%, 11.3%, 15% or 20%;
when the doping element is preferably a si+o mixed element or a si+f mixed element, the atomic percentage of Si in the doped hydrogen-containing diamond-like carbon film is preferably 5% -15%, specifically may be 1.5%, 5.0%, 10.0%, 11.3%, 14.3%, 15% or 20%, and the atomic percentage of O or F is independently preferably 3% -10%, specifically may be 1%, 3.4%, 5.4%, 10% or 15%.
In the present invention, the thickness of the doped diamond-like carbon film layer is preferably 1.0 to 6.0 μm, and may specifically be 1.0, 2.0, 3.0, 3.9, 4.3, 4.6, 4.8, 5.0 or 6.0 μm.
The nanometer hardness of the solid lubricating film is not lower than 10 GPa, when the solid lubricating film is matched with copper, the dry friction coefficient is smaller than 0.15, the abrasion rate is smaller than 8.0x -7mm3/Nm, the average friction coefficient is stable, and compared with the traditional solid lubricating film, the antifriction and abrasion resistance are obviously improved.
The solid lubricating film can be deposited on the surfaces of various metal and ceramic substrates, and the tribological performance of the friction interface between the solid lubricating film and copper is obviously improved. Also, the solid lubricating film can be used for copper friction interfaces in a lubricating state to improve the tribological performance of the interfaces. The invention provides a solid lubricating film with excellent performance, which has important application value in improving the performance of copper-based tribology parts.
The invention also provides a preparation method of the solid lubricating film for the copper pair, which is characterized by comprising the following steps:
and (3) carrying out vacuum vapor deposition on the surface of the base material (substrate) to sequentially form a metal bonding layer, a metal carbide gradient layer and a doped diamond-like carbon film layer, thereby obtaining the solid lubricating film for copper matching.
The invention preferably adopts a solvent to carry out ultrasonic cleaning on the substrate, then adopts plasma to carry out plasma etching on the surface of the substrate, and then carries out the vacuum vapor deposition.
The solvents and cleaning procedures employed in the ultrasonic cleaning of the present invention are reagents and procedures well known to practitioners in the art, and the present invention is not particularly limited, and, for example, acetone, alcohol and petroleum ether are used in sequence, or industrial cleaning agents are used.
The process adopted by the plasma etching is a related process well known to practitioners in the art, the invention is not particularly limited, and particularly, if a substrate is fixed on a sample frame, the sample frame is placed in a vapor deposition vacuum process chamber, the vacuum is pumped until the air pressure is less than 5.0 multiplied by 10 -3 Pa, high-purity Ar gas is introduced, the ion source is adopted to enhance plasma to carry out etching activation on the surface of the substrate, and the air pressure in the plasma etching is preferably 0.08-0.3 Pa, and particularly can be 0.12Pa.
The present invention preferably provides for the metal bond layer to be deposited by sputtering a metal target.
In the invention, the parameters of the sputtering metal target deposition comprise that the air pressure is preferably 0.08-0.3 Pa, particularly 0.08-0.12, 0.15-0.2 or 0.3Pa, the Ar flow is preferably 120-160 sccm, particularly 120-140-150 or 160sccm, the sputtering power density of Cr, ti or W targets is preferably 4.0-7.5W/cm 2, particularly 4.0, 4.5, 5.0, 5.5, 6.0, 6.5, 7 or 7.5W/cm 2, the substrate bias is preferably-100-30V, particularly-100, -70, -60, -50, -40 or-30V, and the time is 15-60 min, particularly 15, 20, 30, 45 or 60min. In the present invention, the sputtered metal target deposition is preferably pulsed direct current magnetron sputtering.
The present invention preferably provides the metal carbide gradient layer by co-sputtering metal and carbide deposition.
The metal carbide gradient layer is preferably prepared by a pulse direct current magnetron sputtering method.
In the invention, parameters of the co-sputtering metal and carbide deposition include that the air pressure is preferably 0.08-0.2 Pa, particularly 0.08-0.12-0.15-0.2-0.3 Pa, ar flow is preferably 120-160 sccm, particularly 120-140-150-160 sccm, cr, ti or W target power density is independently reduced in gradient from 6.5W/cm 2 to 0W/cm 2, tungsten carbide target power gradient is increased from 0W/cm 2 to 5.5W/cm 2, substrate bias is preferably-100-30V, particularly-100, -70, -60, -40-30V, time is 30-60 min, and time is 30-40, 45, 50 or 60min.
The metal carbide gradient layer is preferably deposited by passing a hydrocarbon process gas into a plasma.
In the invention, the gas pressure for forming plasma to deposit by introducing hydrocarbon process gas is preferably 0.8-1.6 Pa, specifically 0.8, 0.9, 1.2, 1.4 or 1.6Pa, the flow rate of the hydrocarbon process gas is preferably 250-400 sccm, specifically 250, 280, 300, 350 or 400sccm, the hydrocarbon process gas preferably comprises one or more of methane, acetylene and butane, the substrate bias is preferably-600 to-720V, specifically-600 to-690, -700 or-720V, and the time is preferably 30-150 min, specifically 30, 60, 90, 120 or 150min.
In the present invention, the precursor gases that are introduced into the hydrocarbon process gas to form a plasma for deposition preferably include B and Si doping, preferably by introduction of diborane and silane, respectively, the si+o mixed element doping preferably being achieved by introduction of hexamethyldisiloxane, the si+f mixed element doping preferably being achieved by introduction of silane and silane, the silane more preferably including carbon tetrafluoride.
In the invention, the ratio of the precursor gas preferably comprises that the flow ratio of diborane, silane or hexamethyldisiloxane to hydrocarbon gas is 1/100-40/100 (volume flow ratio) for B, si and Si+O mixed elements, and can be 1/100, 15/100, 20/100 or 40/100, and the flow ratio of silane to hydrocarbon is 1/100-40/100, and can be 1/100, 15/100, 20/100 or 40/100, and the flow ratio of fluorocarbon to silane is 1/5-1/1 (volume flow ratio), and can be 1/5, 1/4 or 1/1 for Si+F mixed elements.
In the invention, the pulse voltage used when the hydrocarbon process gas is introduced to form plasma for deposition is preferably 600-700V, specifically 600, 650 or 700V, and the deposition pressure is preferably 0.8-1.6 Pa, specifically 0.8, 1.0, 1.2, 1.4, 1.5 or 1.6Pa.
The invention also provides the application of the solid lubricating film for the copper pair or the solid lubricating film for the copper pair prepared by the preparation method in the technical scheme in the lubricating field.
The solid lubricating film is used for a copper friction interface in a lubricating state so as to improve the tribological performance of the interface.
The technical solutions of the present invention will be clearly and completely described in the following in connection with the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The preparation method of the solid lubricating film for the copper pair comprises the following steps:
The magnetron sputtering system is provided with 4 magnetron cathodes by adopting magnetron sputtering and plasma chemical vapor deposition composite equipment. Wherein, 1 cathode is provided with a metal Cr target, 1 cathode is provided with a WC target, and the Cr target and the WC target are oppositely arranged. The substrate is fixed on a sample frame after being cleaned by a solvent, and is placed in a vacuum process chamber of equipment, the vacuum is pumped until the air pressure is less than 5.0 multiplied by 10 -3 Pa, and corresponding process gases are sequentially introduced to prepare the solid lubricating film according to the following specific procedures:
(1) Ion etching, namely, ar flow is 50sccm, air pressure is 0.12Pa, hall ion source beam current is 40A, a base is applied with-200V bias voltage, and the formed plasma is utilized to etch a substrate for 60min;
(2) Depositing a metal bonding layer (Cr), wherein Ar flow is 150sccm, air pressure is 0.12Pa, a substrate is applied with-50V bias, sputtering power density of a Cr target is 6.5W/cm 2, and deposition time is 20 min;
(3) Depositing a metal carbide gradient layer, namely, carrying out Ar flow of 150sccm and air pressure of 0.12Pa, applying-70V bias to a substrate, gradually reducing the sputtering power density of a Cr target from 6.5W/cm 2 to 0W/cm 2, gradually increasing the sputtering power density of a WC target from 0W/cm 2 to 5.5W/cm 2, depositing a ceramic-based gradient layer, and depositing for 45min;
(4) And depositing the doped diamond-like carbon film layer, wherein the acetylene flow is 300sccm, the diborane flow is 20sccm, the air pressure is 0.9Pa, the substrate is applied with-690V bias, and the deposition time is 90min.
The thickness of the prepared solid lubricating film metal bonding layer is 0.4 mu m, the thickness of the metal carbide gradient layer is 0.8 mu m, and the thickness of the doped diamond-like carbon film layer is 4.3 mu m. The film hardness is 15.2GPa, and the B content in the surface layer doped diamond-like carbon film in the solid lubricating film is 5.4 percent in terms of atomic percent. The friction and wear properties of the film were tested under 5N load in air with a relative humidity of 30% using copper as a slip pair, with a steady-state average friction coefficient of 0.13 and a film wear rate of 3.6X10 -7mm3/Nm, with a copper pair plaque diameter of 256. Mu.m.
Example 2
The same as in example 1, the only difference is that:
The process is changed into a doped diamond-like carbon film layer deposition process, wherein the acetylene flow is 300sccm, the silane flow is 20sccm, the air pressure is 0.9Pa, the substrate is applied with-640V bias, and the deposition time is 90min.
The thickness of the prepared solid lubricating film metal bonding layer is 0.4 mu m, the thickness of the metal carbide gradient layer is 0.8 mu m, and the thickness of the doped diamond-like carbon film layer is 4.8 mu m. The film hardness is 14.3GPa, and the Si content in the surface layer doped diamond-like carbon film in the solid lubricating film is 11.3 percent in terms of atomic percent. The film friction and wear properties were tested under 5N load in air with a relative humidity of 30% using copper as the slip pair, with a steady-state average friction coefficient of 0.075 and a film wear rate of 2.7X10 -7mm3/Nm, with a copper pair plaque diameter of 243 μm.
Example 3
The same as in example 1, the only difference is that:
The process is changed into a doped diamond-like carbon film layer deposition process, wherein the acetylene flow is 300sccm, the hexamethyldisiloxane flow is 20sccm, the air pressure is 0.9Pa, the substrate is applied with-690V bias, and the deposition time is 90min.
The thickness of the prepared solid lubricating film metal bonding layer is 0.4 mu m, the thickness of the metal carbide gradient layer is 0.8 mu m, and the thickness of the doped diamond-like carbon film layer is 4.6 mu m. The film hardness is 12.3GPa, and the Si content in the surface layer doped diamond-like carbon film in the solid lubricating film is 14.3% and the O content is 5.4% in terms of atomic percent. The friction and wear properties of the film were tested under 5N load in air with a relative humidity of 30% using copper as a slip pair, with a steady-state average friction coefficient of 0.08 and a film wear rate of 2.4X10 - 7mm3/Nm, with a copper pair plaque diameter of 201. Mu.m.
Example 4
The same as in example 1, the only difference is that:
The process is changed into a doped diamond-like carbon film layer deposition process, wherein the acetylene flow is 300sccm, the silane flow is 20sccm, the carbon tetrafluoride flow is 20sccm, the air pressure is 0.9Pa, the substrate is applied with-700V bias, and the deposition time is 90min.
The thickness of the prepared solid lubricating film metal bonding layer is 0.4 mu m, the thickness of the metal carbide gradient layer is 0.8 mu m, and the thickness of the doped diamond-like carbon film layer is 3.9 mu m. The film hardness is 14.1GPa, the Si content in the surface layer doped diamond-like carbon film in the solid lubricating film is 11.3 percent and the F content is 3.4 percent in terms of atomic percent. The friction and wear properties of the film were tested under 5N load in air with a relative humidity of 30% using copper as a slip pair, with a steady-state average friction coefficient of 0.10, a film wear rate of 1.6X10 - 7mm3/Nm, and a copper pair plaque diameter of 198. Mu.m.
Comparative example 1
The same as in example 1, the only difference is that:
the process is changed into a doped diamond-like carbon film layer deposition process (namely an undoped diamond-like carbon film) only, wherein the acetylene flow is 300sccm, the air pressure is 0.8Pa, the substrate is applied with-700V bias, and the deposition time is 90min.
The thickness of the prepared solid lubricating film metal bonding layer is 0.4 mu m, the thickness of the metal carbide gradient layer is 0.8 mu m, and the thickness of the surface carbon-based film layer is 3.2 mu m. The film hardness is 18.2GPa, the Si content in the surface layer doped diamond-like carbon film in the solid lubricating film is 11.3 percent and the F content is 3.4 percent in terms of atomic percent. The film friction and wear properties were tested under 5N load in air with 30% relative humidity using copper as slip pair, with a steady state average friction coefficient of 0.42, film wear rate of 1.3X10 -6mm3/Nm, copper pair plaque diameter of 492 μm.
Comparative example 2
The same as in example 1, the only difference is that:
The process is changed into a doped diamond-like carbon film layer deposition process, wherein the acetylene flow is 300sccm, the silane flow is 80sccm, the air pressure is 1.2Pa, the substrate is applied with-700V bias, and the deposition time is 90min.
The thickness of the prepared solid lubricating film metal bonding layer is 0.4 mu m, the thickness of the metal carbide gradient layer is 0.8 mu m, and the thickness of the doped diamond-like carbon film layer is 5.2 mu m. The film hardness is 12.2GPa, and the Si content in the surface layer doped diamond-like carbon film in the solid lubricating film is 28.6 percent in terms of atomic percent. The film friction and wear properties were tested under 5N load in air with a relative humidity of 30% using copper as a slip pair, the friction coefficient became unstable, the film wear rate was 9.3X10 -7mm3/Nm, and the copper pair plaque diameter 387 μm.
Comparative example 3
The same as in example 1, the only difference is that:
the process is changed into a doped diamond-like carbon film layer deposition process, wherein the acetylene flow is 300sccm, the silane flow is 80sccm, the carbon tetrafluoride flow is 50sccm, the air pressure is 1.1Pa, the substrate is applied with-700V bias, and the deposition time is 90min.
The thickness of the prepared solid lubricating film metal bonding layer is 0.4 mu m, the thickness of the metal carbide gradient layer is 0.8 mu m, and the thickness of the doped diamond-like carbon film layer is 5.4 mu m. The film hardness is 11.8GPa, the Si content in the surface layer doped diamond-like carbon film in the solid lubricating film is 27.3 percent and the F content is 8.3 percent in terms of atomic percent. The friction and abrasion performance of the film is tested under the condition of 5N load and in air with relative humidity of 30 percent by taking copper as a sliding pair, the friction coefficient is quite unstable, the abrasion rate of the film is 8.5 multiplied by 10 -7mm3/Nm, and the diameter of a copper pair abrasion spot is 358 mu m.
Fig. 2 is a graph of friction coefficient between the solid lubricating film prepared in example 2 and copper pair, fig. 3 is a graph of friction coefficient between the hydrogen-containing diamond-like carbon film prepared in comparative example 1 and copper pair, and fig. 4 is a graph of friction coefficient between the solid lubricating film prepared in comparative example 2 and copper pair, and it is known that the friction coefficient between the solid lubricating film prepared in the invention and copper pair is low and the friction coefficient is high.
The foregoing is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be comprehended within the scope of the present invention.
Claims (10)
1. The solid lubricating film for copper accessory is characterized by comprising a metal bonding layer, a metal carbide gradient layer and a doped diamond-like carbon film layer which are sequentially laminated, wherein the carbon content in the metal carbide gradient layer is increased along the direction of the doped diamond-like carbon film layer;
when the doping element is B or Si, the atomic percentage of B or Si in the doped diamond-like carbon film layer is independently 1.5% -20%;
when the doping element is a Si+O mixed element or a Si+F mixed element, the atomic percentage of Si in the doped diamond-like carbon film layer is 1.5% -20%, and the atomic percentage of O or F is independently 1% -15%.
2. The solid lubricating film of claim 1, wherein the metallic bonding layer is a Cr, ti, W or alloy layer, and the elements in the alloy layer include two or three of Cr, ti and W.
3. The solid lubricating film according to claim 1 or 2, wherein the thickness of the metal adhesive layer is 0.2 to 0.6 μm.
4. The solid lubricating film of claim 1, wherein the metal carbide gradient layer is CrWC x、TiWCx or WC x.
5. The solid lubricating film according to claim 1 or 4, wherein the thickness of the metal carbide gradient layer is 0.5 to 1.0 μm.
6. The solid lubricant film of claim 1, wherein the doped diamond-like carbon film layer is a doped hydrogen-containing diamond-like carbon film.
7. The solid lubricating film according to claim 1, wherein when the doping element is B, or Si, the atomic percentage of B or Si in the doped hydrogen-containing diamond-like carbon film is independently 5% to 15%;
when the doping element is a Si+O mixed element or a Si+F mixed element, the atomic percentage of Si in the doped hydrogen-containing diamond-like carbon film is 5% -15%, and the atomic percentage of O or F is independently 3% -10%.
8. The solid lubricant film according to claim 1 or 6, wherein the thickness of the doped diamond-like carbon film layer is 1.0 to 6.0 μm.
9. The method for preparing the solid lubricating film for copper pairs according to any one of claims 1 to 8, which is characterized by comprising the following steps:
and (3) carrying out vacuum vapor deposition on the surface of the base material, and sequentially forming a metal bonding layer, a metal carbide gradient layer and a doped diamond-like carbon film layer to obtain the solid lubricating film for the copper pair.
10. The use of a solid lubricating film for copper fittings according to any one of claims 1 to 8 or a solid lubricating film for copper fittings produced by the production method of claim 9 in the lubrication field.
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