CN1209663C

CN1209663C - Method for producing miro display

Info

Publication number: CN1209663C
Application number: CN 02106623
Authority: CN
Inventors: 曾令远; 郑浩民
Original assignee: SINGAPORE UNITED PROJECTION CO Ltd
Current assignee: SINGAPORE UNITED PROJECTION CO Ltd
Priority date: 2002-02-28
Filing date: 2002-02-28
Publication date: 2005-07-06
Anticipated expiration: 2022-02-28
Also published as: CN1441290A

Abstract

The present invention relates to a fabrication method for a micro display, which comprises: individual chips are tested in advance on base wafers which form the micro display; the chips which are tested to be ineffective are marked so as to input test data into a point gluing machine and a laser drilling machine; gluing frames are arranged on the peripheries of qualified chips firstly by the point gluing machine, and injection holes are drilled on ITO glass sheets corresponding to the qualified chips by the laser drilling machine; space granules are spread in chip squares of the arranged gluing frames, and the ITO glass sheets are correspondingly combined on the wafers according to the test data; liquid crystal is injected from the injection holes on the ITO glass sheets of the upper layers of the qualified chips, and the liquid crystal can disperse between the chips and the ITO glass sheets; then, through sealing and cutting processing, a micro display product with a qualified chip circuit is accurately fabricated. Thus, superior products can be accurately selected and separated, and product processing quantities and fabrication processes of the micro display can be simplified.

Description

The manufacture method of miniscope

(1) technical field

The manufacture method of the relevant a kind of miniscope of the present invention refers to a kind of manufacturing technology of screening basic unit's chip and simplifying the miniscope of the invalid chip manufacture quantity of deletion especially.

(2) background technology

Miniscope (MICRO-DISPLAY) is general to be used for as electric projection display apparatus such as liquid crystal projector, graphoscope, projection TV sets, its significant feature is the raw video that produces optical projection, and by the reflection function between each pixel (PIXEL) of mirror surface open (ON) or close (OFF) control, the optical projection mechanism that cooperates optic projection source and lens set to form can be exaggerated this raw video and is projeced on screen or the display screen.Therefore, the having wide range of applications of miniscope, and its quantity that is used in electrical equipment or apparatus for optical projection also increases day by day, so its mass production processes relatively becomes a ring important in the product.

In the manufacturing process of existing miniscope, in order to as the envelope of each chip periphery on the wafer of basic unit with the glue frame, and in the chip grid that each is enclosed by the glue frame to cover, sprinkle grain at interval, to punch on the position as each corresponding each the chip grid on the ito glass sheet of levying the miniscope top layer again, again the ito glass sheet is combined on the wafer of sealing frame, again each chip grid is imposed one by one and vacuumize, the perfusion liquid crystal, and seal one by one again and cut to form the preliminary finished product of miniscope, and must be again through circuit check and test, to test the preliminary finished product of each miniscope of being made, but whether its chip circuit regular event, to filter out final miniscope finished product.

Therefore; by the above existing miniscope manufacturing process obviously as can be known; in this existing processes; for all chips on the wafer; no matter qualified or invalid; all it is imposed sealing one by one; spread grain at interval; combination ito glass sheet; vacuumize; inject liquid crystal; seal; the processing step of cutting and test; so will expend and drop into more material; man-hour and manpower; increase the degree of difficulty of the making of miniscope relatively; simultaneously; for the follow-up test after product is tentatively made and check manpower and cost, also be a big test and an obstruction, make this miniscope cause the puzzlement that man-hour is long and cost of products is higher in batch process manufacturing process; and; increase probability unnecessary and that defective products that have highly polluted thing (liquid crystal) is discarded on foot, for environmental protection, real is another big threat and destruction.

(3) summary of the invention

Fundamental purpose of the present invention is to provide a kind of manufacture method of miniscope, can be by the test data of wafer, screening qualified wafer process, and then significantly save material processed, manpower and cost.

Another object of the present invention is to provide a kind of manufacture method of miniscope, can simplify the electric test process of this wafer chips, with the subsequent survey that significantly reduces product and the manpower and the cost of test.

Another purpose of the present invention is to provide a kind of manufacture method of miniscope, can significantly reduce the generation probability that comprises high pollution thing (liquid crystal) defective products and waste material.

For realizing above-mentioned each purpose, the manufacture method of miniscope of the present invention, be on the basic wafer wafer that constitutes miniscope, test its each other chip in advance, and marking on the invalid chip after tested, so that this test data is imported in a point gum machine and the laser-beam drilling machine, outside qualified wafer, place first gluing frame by point gum machine, and on the ito glass sheet, stamp a filling orifice by laser-beam drilling machine again with respect to described qualified chip position, and will in the chip grid of gluing frame, remove cloth grain at interval again, and the ito glass sheet is combined on the wafer according to the contraposition of wafer sort data, and the filling orifice on the ito glass sheet on qualified chip upper strata injects liquid crystal, to diffuse between chip and ito glass, again through sealing and cutting process, accurately making miniscope product, and then simplify the integral manufacturing process of miniscope with qualified chip circuit.

For further specifying the object of the invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.

(4) description of drawings

Fig. 1 is a manufacturing flow chart of the present invention;

Fig. 2 is the synoptic diagram of wafer sort mark among the present invention;

Fig. 3 is the synoptic diagram that seals around the qualified chip in the wafer among the present invention with the processing step of glue frame;

Fig. 4 be among the present invention in the ito glass sheet with respect to the synoptic diagram of handling with laser boring around the qualified chip position;

Fig. 5 is a cut-open view, shows to spread the processing step of grain at interval among the present invention in this chip grid;

Fig. 6 is a cut-open view, shows among the present invention between this chip and ito glass sheet the state to bit pattern;

Fig. 7 is a cut-open view, injects the processing step of liquid crystal among demonstration the present invention between this chip and ito glass sheet through the filling orifice of ito glass sheet;

Fig. 8 is the miniscope finished product appearing diagram that completes.

(5) embodiment

At first, see also shown in Figure 1, Figure 1 and Figure 2 is the manufacturing process of miniscope of the present invention, wherein, be to obtain the wafer sort data shown in the step 10, promptly as each chip 200 in the wafer 100 (as shown in Figure 2) of basic unit's circuit and 200 ' test result data, this Data Source can be by the wafer manufacturing plant that entrusts generation processing, testing factory or record with wafer testing apparatus voluntarily, and its test mode all is to carry out on pin scaffold tower (PROB STATION) (not shown), and the pin location no matter to put be to test with mobile test head or moving chip mode, the X-axis at this chip 200 and 200 ' place and Y-axis coordinate data and test result, will be by one by one at length with tape, disk or other any data kenel record, and the wafer 100 that is disclosed in the present invention is 6 inches, the specification of 8 inches or 12 inches, and then be to be test result " qualified " person in the present invention with chip 200, and chip 200 ' is that test result engineering noise person is as a means of difference, wherein, on chip 200 ', underlined (MARK) is punched in the surface, normally adopts the red ink seal.

Please cooperate shown in Figure 3 again, step 20 is for importing data to point gum machine and laser-beam drilling machine, promptly import described wafer sort data to point gum machine (SEALANT/GLU) and laser-beam drilling machine (LASERPUNCHER), this point gum machine and laser-beam drilling machine are by microcomputerized control and have X, the device of Y planimetric coordinates automatic shift control, so can control its activated position according to these wafer sort data, as then being the sealing treatment step of step display 30 at Fig. 3, promptly this point gum machine is handled through the sealing of carrying out one by one on every side of electing qualified chip 200 as in described wafer 100, form a glue frame 210 around making each chip 200, the material of its formation is that epoxy resin and thickness do not limit, usually this thickness is the height of product, this is denoted as invalid chip 200 ' and does not then carry out any sealing processing on every side, and each glue frame 210 is in the process of sealing, reserve a breach 211 in an edge, its practice can be set this point gum machine detour electrical path length by the grid range size of chip 200.

See also shown in Figure 4, described when carrying out step 30 sealing treatment step, this laser-beam drilling machine is the punching treatment scheme of execution in step 30 ' simultaneously, be about to ito glass sheet 300 as the upper strata, correspond on the edge of the square frame 310 of each chip 200 position in the described wafer 100, stamp a filling orifice 320 with laser-beam drilling machine, the position of this filling orifice 320 just breach 211 with described chip 200 glue frame 210 on every side is corresponding mutually, displaced position because of this laser-beam drilling machine, also be according in addition converted after the input of described wafer sort data, so its position can be quite accurate, and the ito glass sheet 300 in the intact hole of this dozen, the alignment layer of execution in step 30A is handled (ALIGNMENT LAYER) step again, promptly be with the processing mode of sputter (SPUTERING) or evaporation (EVAPORATING), glass material deflection one angle of monox series (SiOx) is plated on the ito glass sheet 300.

Please consult shown in Figure 5 again, step 40 is an interval grain spreading treatment process steps, promptly be by distributor (SPACER DISPENSOR) at interval the glass bead 220 of usefulness in non-fixed point spreading mode at random, be spread in described in chip 200 grids of glue frame 210 glue envelope, promptly as shown in Figure 5, this glass bead 220 is spread in the grid of qualified after tested chip 200.

Please consult shown in Figure 6 again, step 50 is a contraposition combined treatment process step, being about to described ito glass sheet 300 correspondences of having done step 30 punching processing is incorporated on the wafer 100 of sealing, this ito glass sheet 300 is pressed on this wafer 100, and make each that the square frame 310 of stamping filling orifice 320 be arranged, respectively on should each chip 200 of wafer 100, and again with ultraviolet radiation modality, make this glue frame 210 sclerosis, and reach the effect of this wafer 100 and the subsides of ito glass sheet 300 complete driving fit portions.

Please cooperate shown in Figure 7 again, step 60 is for vacuumizing treatment step, being about to described step 50 has finished to the wafer 100 of bit pattern and the assembly of ito glass sheet 300, putting into vacuum chamber vacuumizes, and carry out the liquid crystal filling processing step of step 70 again, promptly use liquid crystal filling machine (LIQUID CRYSTALFILLER) liquid crystal 330 to be dropped on each filling orifice 320 of described ito glass sheet 300, and in decontroling at this moment vacuum, make it be returned to the environment of atmospheric pressure, this liquid crystal 330 then is infused in respectively in the grid of each chip 200 through filling orifice 320 gradually, and again after liquid crystal 330 injects these chip 220 grids fully, carry out the treatment process steps of sealing of step 80, promptly again by point gum machine should the ito glass sheet 300 of correspondence chip 200 on breach 211 on each filling orifice 320 and the glue frame 210 give the sealing of glue envelope, and make its sclerosis complete closed with the ultraviolet ray irradiation again.

And finish described step 80 seal treatment process steps after, then carry out the cutting process step of step 90 again, it promptly is the practice above, the lower leaf cutting process, at first adopt laser cutting machine (LASER CUTTER) to cut because of quality is comparatively fragile by the ito glass sheet 300 that is positioned at the upper strata in advance, the wafer 100 of lower floor then is scraping cutting mill (SCRIBER) or machine for sawing (SAW) comes cutting process, and then obtains the product of miniscope shown in Figure 8 400.

Please consult shown in Figure 8 again; for in the prepared miniscope 400 of the above-mentioned step 10 of the present invention～step 90 is on whole manufacturing process, getting rid of the processing and fabricating that this is denoted as invalid chip 200 ' effectively; man-hour in the time of can significantly saving its manufacturing; manpower and cost; and; on the other hand; because made miniscope 400; in follow-up test or checkout procedure; can significantly save effectively chip 200 is done loaded down with trivial details test one by one; the manpower and the man-hour of check; and further improve the acceptance rate and the stay in grade degree of its product; simultaneously; by prepared miniscope 400 products of the inventive method; can not contain the waste material of high pollution thing (as liquid crystal 330) or the disappearance and the environmental issue of defective products in a large number, can promote and safeguard the industry environmental protection quality further as producing in the existing miniscope manufacturing process.

Advantage of the present invention is that manufacture craft makes the manufacturing production of miniscope product have more the product competitiveness of low man-hour, manpower and cost to simplify, to reach fast cheaply the most; simultaneously, also can significantly reduce generation and the raising environmental protection benefit that contains high pollution thing waste product.

The manufacture method of above Fig. 1～miniscope of the present invention shown in Figure 8, each related description that is wherein disclosed and accompanying drawing only for the present invention for further illustrating cited preferable of its technology contents and technological means

Embodiment.

Certainly, those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, and be not to be used as limitation of the invention, as long as in connotation scope of the present invention, all will drop in the scope of claims of the present invention variation, the modification of the above embodiment.

Claims

1. the manufacture method of a miniscope obtains earlier in the test data of the wafer that constitutes miniscope basic unit, it is characterized in that, may further comprise the steps:

(A) the wafer sort data are inputed to a point gum machine and laser-beam drilling machine;

(B) sealing is handled, and the wafer that indicates test passes by point gum machine in wafer is distinguished gluing on every side, to form a glue frame respectively; This glue frame one edge forms the filling orifice of a breach with corresponding ito glass sheet;

(C) punching is handled, and is respectively stamped a filling orifice on the qualified chip position with laser-beam drilling machine in the ito glass sheet that constitutes the miniscope upper strata carries out with respect to wafer;

(D) spreading interval grain, spreading interval grain in the chip grid that this each glue frame surrounds;

(E) to bit pattern, with described wafer and the corresponding combination of ito glass sheet, each filling orifice that makes this ito glass sheet is to being denoted as on the qualified chip in the wafer;

(F) perfusion liquid crystal is denoted as the inner perfusion of qualified chip grid liquid crystal through the filling orifice of this ito glass sheet to this;

(G) seal processing, each filling orifice on this ito glass sheet is sealed with point gum machine;

(H) cutting process is cut the chip on this wafer and ito glass sheet one by one and is isolated and is denoted as qualified chip partly, and obtains the qualified miniscope product of chip.

2. the manufacture method of miniscope as claimed in claim 1 is characterized in that, this point gum machine and laser-beam drilling machine all are subjected to the device of microcomputerized control and tool X, the control of Y-axis coordinate displacement.

3. the manufacture method of miniscope as claimed in claim 1 is characterized in that, it is epoxy resin that employed sizing material is handled in the sealing of this step (B).

4. the manufacture method of miniscope as claimed in claim 1 is characterized in that, the punching treatment step of this step (C) is again through an oriented layer treatment step, to handle ito glass sheet surface.

5. the manufacture method of miniscope as claimed in claim 4 is characterized in that, this oriented layer treatment step is the processing mode with sputter, and glass material deflection one angle of monox series SiOx is plated on the ito glass sheet.

6. the manufacture method of miniscope as claimed in claim 4 is characterized in that, this oriented layer treatment step is the processing mode with evaporation, and glass material deflection one angle of monox series SiOx is plated on the ITD glass sheet.

7. the manufacture method of miniscope as claimed in claim 1 is characterized in that, the spreading in this step (D) is grain at interval, is with distributor spreading mode spreading at random.

8. the manufacture method of miniscope as claimed in claim 1 is characterized in that, step (E) in the bit pattern, be to shine each glue frame on this wafer with ultraviolet ray to make it sclerosis and make wafer and 1TO glass sheet produce to link to make up.

9. the manufacture method of miniscope as claimed in claim 1 is characterized in that, the liquid crystal filling in this step (F) is to pour into the liquid crystal filling machine.

10. the manufacture method of miniscope as claimed in claim 1 is characterized in that, the liquid crystal filling in this step (F), and before liquid crystal was splashed into filling orifice, then elder generation vacuumized processing to the assembly of wafer and ito glass sheet.

11. the manufacture method of miniscope as claimed in claim 1 is characterized in that, this step (G) seal processing, this glue that is encapsulated in filling orifice is to make it the sclerosis sealing by the ultraviolet ray irradiation.

12. the manufacture method of miniscope as claimed in claim 1 is characterized in that, the cutting process of this step (H), and the ito glass sheet on its upper strata is to cut with laser cutting machine.

13. the manufacture method of miniscope as claimed in claim 1 is characterized in that, the cutting process of this step (H), and the wafer of its lower floor is to scrape the cutting mill cutting.

14. the manufacture method of miniscope as claimed in claim 1 is characterized in that, the cutting process of this step (H), and the wafer of its lower floor is to cut with machine for sawing.