CN1209210A - Method for producing a contactless working chip card - Google Patents

Abstract

In the chip card to be produced, at least one label (1) forming the outer surface of the card is to be included in addition to the integrated circuit components (chip 2 and/or electronic module 12), the couplers (coil 6, capacitor layer 8) for the contactless transmission of electrical energy and/or data. A coupler (6,8) is arranged to the inside of the label. The thus prepared label (1) is then inserted into an injection template. The separately disposed integrated circuit components (12) are then positioned within the injection mold plate to precisely fit over and contact the contact ends of the couplers (6, 8). Finally, the card body is molded and connected to the label by an injection molding process, while the integrated circuit element is embedded in the card body. The electrical connection between the coupler (6,8) and the integrated circuit element (12) is formed in the template itself by various methods.

Description

Make the method for the chip card of contactless

Some chip cards that people know have an external contact region and read (with writing) unit with one by it and communicate, and except these chip cards, so-called noncontact chip card also has been suggested.This class chip card does not need a kind ofly to electrically contact between the reader unit of card and card, at least data transfer is not needed.And transmission or communication are to realize with the coupling element of the inside, reader unit that is integrated in card by being integrated in the card the inside.Based on application, this technology has just constituted the difference between tight coupling and the remote coupling, tight coupling requires card is inserted in the reader of card, and remote coupling allows to carry out communication by the medium distance that also " process " is bigger, promptly need not be inserted into card in the reader of card.Outside dominant inductive couplings mode (it is considered to not only make data transfer become possibility, and the Circuits System that can be card provides non-contact power supply), yet proposed capacitive couplings, but it is considered to only be suitable for data transfer.At last, the class card that noncontact is used is additional again the so-called hybrid card of common external contact region-be or composite card-also carried and (seen: Sickert, K., and Weinerth, H. show " gordian technique microelectronics ", branch 24: " snapping into contactless chip card " from the contact chip; 66 pages to 78 pages of " electronics " 1989 the 25th phases).

Extensive application to contactless chip card has been suggested, and has developed the transmission system and the Circuits System of relevant high mature, chip, and software for this reason.But, does not almost disclose till now and severally be used for the manufacturing of this class card and the scheme of formation, and this card is a characteristic of having considered non-contact data transmission and power transfer specially.

It is a kind of by the tight card of the layer structure that constitutes of some layers of welding each other that such scheme provides, as be printed seal diaphragm and/or label, it has the inside diaphragm or the paillon foil substrate that have strip conductor, and two are used for tightly coupled little transmission coil, and some chips.In this card, a ring is round chip, obviously is to play mechanical protection effect (see mentioned publication, 75 pages to 76 pages, Fig. 8 the right and Figure 10).Except in the stack of these membrane layers or foil layer, requiring accurately to coincide, make big area like this weld together as if can embedding chip and diaphragm or paillon foil printed outer aspect produce some problem.

Another scheme provides the chip of a single 4mm * 4mm, is equipped with a hybrid circuit and a high frequency antenna coil at chip back.Be similar to top mentioned scheme, card is made up of some membrane layers that pile up or foil layer, and Jurisch (is seen, the article of R. " microwave integrated circuit 3, new noncontact chip card technology " in the groove the inside that chip must be placed in inner diaphragm or the paillon foil; 82 pages to 84 pages of " card forum " the 3rd phases of nineteen ninety-five).The above-mentioned rights reserved about sandwich construction also is applicable to this, still, the most important thing is, chip only provides a very limited zone for aerial coil, and this fact may make all that under any circumstance remote coupling application is impossible.

The present invention relates to a kind of method of making chip card, it must contain earlier the non-contact transmission that is useful on electric energy and/or data, inductive and/or capacitive coupler, with (providing with at least one chip and/or the electronic module form) integrated circuit component that is connected to coupling mechanism, and wherein at least one outside surface of card is formed by label.

According to method of the present invention should make effectively, cheaply and reliably the produced in series of noncontact chip card becomes possibility, wherein must consider specific (special) requirements, and also must avoid the expensive special chip of harm in the production run as far as possible the coupling mechanism that is used for Touchless manipulation.

According to method of the present invention, this task is achieved in that-and above-mentioned coupling mechanism is installed to a side of a label, and this side is back to printing or the outside to be printed; The label of-preparation is like this imbedded an injection template the inside; The contact point that provides for this coupling mechanism is provided the-integrated circuit component separately prepared, is imbedded injection template the inside, and these contact points and contact with these terminals on this is accurately positioned terminals at coupling mechanism;-be adhered on the label by injection molding technique card body subsequently, and integrated circuit component is embedded in the card body simultaneously;-thus, the conduction between above-mentioned coupling mechanism and the said integrated circuit element on the electricity connects, and by Mechanical Contact pressure, conductive adhesive and/or low melting point soft solder are formed on injection template the inside.

The outside surface of used label preferably has been printed, but blank label also can use, and then prints the finished product card as required.Coil and capacitor layer both are suitably used as coupling element, and are used for inductive couplings and capacitively coupled element can be contained in the single card.For present purposes, term " electronic module " is applicable to a unit of making in advance that places card, and this unit is to have at least one to have protection and seal and is connected the chip that contacts with some.If each outside surface to card all provides a label, one or two of two labels can be prepared to imbed in the template in top mentioned mode so.

The method according to this invention is given and a kind of favourable dual-use function of label, in any case and label all needs usually.Coupling element can insert template such as piling up, dismantle, reaching in the multiple mode that does not hinder operation, designs and is arranged on the label.In fact the whole area of label or card all is can be for coupling mechanism utilizes, and therefore just may provide the necessary area coil of remote coupling and the number of turns or capacitively coupled capacitor layer is provided.For module or chip accurately are positioned in the template, all as if the such instrument of operating means is utilizable, they are verified their effect in the manufacturing of common chip card.In addition, injection moulding is a kind of effective technology to producing chip card, and guarantees chip and module protection ground but still be embedded in securely inside the card body.

In dependent claims, relate to some special schemes according to the method for claim 1 definition of the present invention.Below with reference to also in conjunction with the accompanying drawings exemplary embodiments more of the present invention being described in detail.

Fig. 1 to Fig. 4 has provided the various exemplary embodiments that have the label that is installed in the coupling mechanism on the label inboard, in being inserted into the injection template after, they merge contact with the integrated circuit component kissing in a different manner; And

Fig. 5 has provided the part sectioned view of injection template, and label and integrated circuit component have been inserted in the template, for injection molding technique is got ready.

Fig. 1 to Fig. 4 has provided the inboard of label 1 respectively, and label 1 is used for forming the outside surface of card in chip card production.This is that typical thickness is about 0.1mm by the plastic film or the paillon foil of the specification of card, and it is usually as a substrate that is printed literal and/or image.Common two such labels constitute two outside surfaces of a chip card.The outside surface of label-in these figure be is invisible-preferably printed.But the printing then of finished product card also is possible.

In all four embodiment, a shown side is the side of label back to its outside surface.The noncontact that is used to card is used and the coupling mechanism 3,6,8 operated is placed in this side.As only pointed on Fig. 1 left side, the label of being prepared so far 1 is imbedded in the bottom 20 of injecting template (also seeing Fig. 5).Equally also demonstrate, integrated circuit component is to occur with the form of semi-conductor chip 2,2 ＇ or electronic module 12,12 ＇.And for example only shown in Fig. 1 the right like that, these elements are separated to place, and will be imbedded injection template acceptance of the bid board 1 above.Their contact point (4 ＇ among Fig. 1) is not illustrated operating means accurately be positioned the top of the contact jaw that is assemblied in coupling mechanism and contact with it by one.Above-mentioned steps also is applicable to described other various embodiment below in conjunction with Fig. 2 to Fig. 4.

Under the situation of Fig. 1, the coil that is used for inductive couplings is become a flat wire coil 3 by coiling.The shape of this coil is being bonded on the label 1 with the specification that is suitable for card and along the edge of label of rectangle.Dividing comes, and there be the contact point of welded gasket 4 ＇ as coil 3 " following " of being illustrated in the chip 2 on the right.Chip can for example be a single chip, and the repertoire of its integrated circuit execute card comprises the supply of electrical energy by the data transmission and the Circuits System of coil 3.Coil end is connected with the electricity of chip 2 and can as illustratedly forms by link 4, and if necessary, across a lead bridge 5, wherein link 4 is on the label and be touched on welded gasket 4 ＇ that are welded to above-mentioned chip 2.In addition, chip 2 can be fixed on the label 1 by cementing agent.

In the embodiment shown in Figure 2, the pickup coil 6 with desired coil number has been fabricated on the label 1 as a P.e.c..Known technology also can be used simultaneously so that the end of coil 7 is suitable for the direct contact welding of chip 2.As illustrated, across the coiling of coil 6 place chip with exempt coil end of guiding across particular component be that people can wish.If the surface towards the chip 2 of coil is provided with one deck insulating passivation layer, be not required with regard to there being other operation; But if necessary, before placing chip 2, an insulation is sealed and can be used to coil 6.

In the embodiment shown in fig. 3, pickup coil 6 is applied to label 1 as a P.e.c. once more, and it has more or less adopted the specification of whole card.Simultaneously, same technology also can be used to set up two conductive regions 8 in coil, as capacitively coupled condenser plate.In this case, integrated circuit (chip 2) is comprised in the flat electronic module 12.It has the contact point with the form of module link 13, and be used for resistance welding and receive two coil ends and capacitor layer 8, and the less preferred again cross-over connection coil-winding 6 that is placed.

The integrated circuit component of card does not need to be concentrated on the single chip or module, but can be separated in the mode of knowing in two or more such parts.If like this, have and help printed circuit application on label, provide between the above-mentioned parts each other connection and/or to the connection of coupling mechanism.Fig. 4 has provided typical such embodiment, and is the embodiment that is designed to a chip card that not only is used for Touchless manipulation but also is suitable for directly electrically contacting in this case.Therefore, Fig. 4 has provided module 12 ＇ and the chip that separates 2 ＇ that contact 15 is arranged, and they are placed on the intra-zone of the printed coil 6 on the label 1.

Chip 2 ＇ can for example be so-called communication chips, its carry out non-contact data transmission function and, if necessary, provide the function of electric energy for the Circuits System of chip.As shown in the figure, this chip can be directly connected to an end of coil and stride across lead bridge 5 and be connected to another end.Electronic module 12 ＇ are a kind of special flat design, and the subregion that its contact area 15 has formed an outside surface of card is used for and being electrically connected of the reader that blocks (for example being similar to the module described in the EP-A-0599194).Outside contact 15 has " pin " 16 that curves dihedral, and it is pressed on the label 1.In addition, module 12 ＇ have the other contact that does not reach from the outside 17.These are touched on the P.e.c. 14 that is welded on the label, and be connected (also the seeing Fig. 5) between module 12 ＇ and chip 2 ＇ is provided, and perhaps across them, perhaps, if communication chip separately is not provided, directly connect with coupling mechanism.Obviously, if necessary, strip conductor 14 can provide the further connection between communication chip 2 ＇ and module 12 ＇.

Coupling mechanism on the label obviously can be designed as the requirement that is fit to the card system; Particularly, for example, two pickup coils also can be each other by placing.Though relate to a single label 1 in the exemplary embodiments shown in Fig. 1 to Fig. 4, if each label of a pair of label constitutes an outside surface in two outside surfaces that block, it also is possible providing two labels all to have coupling element so.For example, one or more coils can be applied on the label of one of them card, and capacitor layer is provided on another label of card, and a capacitor layer perhaps can be arranged on each of two labels, or the like.Under the sort of situation, to receive for resistance welding on the coupling mechanism of two labels, the integrated circuit component on both sides all must provide essential contact point or module link.

As described, (two) label (each card has only a label in some cases) that is prepared and integrated circuit component are inserted in the injection template successively.Fig. 5 has provided a kind of like this template with graphics mode, is made up of two and half- template 20 and 21, and an injection port 22 is arranged in interphase.Illustrated embodiment is based on the label as preparing described in Fig. 4.In template 20,21, put into down label 1a and lain in the second label 1b in first template 21.As known, it is occupied by the contact area 15 of module 12 ＇ that label 1b has (known as reality) rectangle opening 18 on this.On the other hand, other contact 17 of module is not exposed on the outside surface of card but is covered by label 1a down.

When (two) label and integrated circuit component is assembled and template when being closed (for example shown in Figure 5), go to space 23 in the filling template by injection molding technique with injected plastic, make the card body at last.The inside surface of the material of being injected in this technology and (two) label combines, and seals integrated circuit component simultaneously and they are embedded in the card body.Now chip card contains noncontact is used needed whole element and can be taken out from template.

Integrated circuit component and the conduction on the electricity between coupling mechanism and/or the strip conductor that various in essence already known processes all can be used for being formed in the injection template connect.A kind of possibility is that the topical application by conductive adhesive forms these connections.But adopt Mechanical Contact pressure simply, the help by ultrasonic bonding if necessary also can form direct metal-metal connection.As embodiment showed among Fig. 5, if module 12 ＇ are utilized, in fact it occupied the thickness of whole card, and its contact jaw 17 is forced on the strip conductor 14 in the template 20,21 of sealing, and this contact of having promoted in the template connects.In this sense, in order to form connection, people can utilize the strong pressure of in process of injection molding the element that imbeds being executed, and this pressure is to provide by the high pressure in the plastic forming material.In order to electrically contact connection, people also can utilize the high temperature that occurs in injection moulding, for example by a kind of cementing agent, it plays thermal response, has been placed in the template also to solidify, perhaps by while working pressure and high temperature, be so-called hot bonding, carry out the welding of metal-metal.At last, by utilizing the preformed soft solder section (biscuit) that in the injection template, melts to guarantee that the conduction connection on the electricity also is possible.

Claims (10)

1. A method for producing a chip card containing inductive and/or capacitive couplers (3, 6, 8) for contactless transmission of electrical energy and/or data, comprising a An integrated circuit element (2, 12) given in the form of at least one chip and/or electronic module, and here at least one outer surface of the chip card is formed by a label (1), characterized in that - the aforementioned coupling The device (3, 6, 8) is mounted on the side of the sign (1) that faces away from the outside that has been printed or is to be printed - the sign (1) thus prepared is inserted into an injection template ( 20, 21), - separately prepared integrated circuit components (2, 12), with contact points (4', 13) provided for the coupler (3, 6, 8), placed above the label (1) Embedded in the injection mold (20, 21), these contact points (4', 13) are precisely positioned on the terminals (4, 7) of the coupler here and make contact with these terminals (4, 7) ,—then the card body is connected to the label (1) through the injection molding process, and at the same time the integrated circuit components (2, 12) are embedded in the card body,—wherein the coupler (3,6,8) and the integrated Electrically conductive connections between circuit elements (2, 12) are formed within injection molds (20, 21) by mechanical contact pressure, conductive adhesive and/or low-melting soft solder. 2. The method according to claim 1, characterized in that at least one coil for inductive coupling is arranged on the label (1) in the form of a flat wound coil (3). 3. A method according to claim 1, characterized in that the couplers (6, 8) are formed on the label (1) in the form of printed circuits. 4. The method according to claim 3, characterized in that a chip (2) or an electronic module (12) is placed at a position across the winding of the printed coil (6) and the outer and inner ends of the coil contact with it at the same time. 5. The method according to one of the preceding claims, characterized in that printed strip conductors (4, 14) are mounted on the label (1) for the coupling of the couplers (3, 6, 8) to the integrated circuit components (2 , 12) connections and/or connections between integrated circuit components. 6. Method according to one of claims 1 to 5, characterized in that a heat-reactive (thermosetting) conductive adhesive is used to obtain the electrically conductive connection. 7. The method as claimed in one of claims 1 to 5, characterized in that the contact welding in the injection mold is carried out with the aid of ultrasonic welding. 8. Method according to one of claims 1 to 5, characterized in that the contact welding in the injection formwork is obtained by thermocompression, ie by simultaneous application of elevated temperature and pressure. 9. Method according to one of claims 1 to 5, characterized in that the contact soldering in the injection mold is obtained by using preformed soft solder segments (discs). 10. The method according to one of the preceding claims, characterized in that an electronic module (12') is used which has an externally conductively contactable contact area (15) and other contact terminals (17) for coupling with Component connections.

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