CN120813820A - Sensor device - Google Patents
Sensor deviceInfo
- Publication number
- CN120813820A CN120813820A CN202480015066.XA CN202480015066A CN120813820A CN 120813820 A CN120813820 A CN 120813820A CN 202480015066 A CN202480015066 A CN 202480015066A CN 120813820 A CN120813820 A CN 120813820A
- Authority
- CN
- China
- Prior art keywords
- sensor device
- base body
- housing
- outer housing
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
- G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
- G01K1/146—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations arrangements for moving thermometers to or from a measuring position
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
- G01K1/18—Special arrangements for conducting heat from the object to the sensitive element for reducing thermal inertia
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
描述了一种用于对表面(9A)的温度进行测量的传感器装置(1)，传感器装置(1)包括：‑至少一个传感器元件(2)；‑陶瓷壳体(3)，其中，传感器元件(2)至少部分地布置在陶瓷壳体(3)中；‑基础本体(5)，基础本体至少部分地环绕陶瓷壳体(3)；‑外壳体(8)，外壳体连接至基础本体(5)，其中，外壳体(8)至少部分地包围基础本体(5)和陶瓷壳体(3)；‑至少一个安装元件(7)，安装元件适于并布置成用于将传感器装置(1)安装至目标应用(9)，其中，陶瓷壳体(3)适于并布置成与待测量温度的表面(9A)直接机械接触。此外，描述了传感器装置(1)的用途。
A sensor device (1) for measuring the temperature of a surface (9A) is described, the sensor device (1) comprising: at least one sensor element (2); a ceramic housing (3), wherein the sensor element (2) is at least partially arranged in the ceramic housing (3); a base body (5), which at least partially surrounds the ceramic housing (3); an outer housing (8), which is connected to the base body (5), wherein the outer housing (8) at least partially surrounds the base body (5) and the ceramic housing (3); and at least one mounting element (7), which is suitable and arranged for mounting the sensor device (1) to a target application (9), wherein the ceramic housing (3) is suitable and arranged for direct mechanical contact with the surface (9A) whose temperature is to be measured. Furthermore, a use of the sensor device (1) is described.
Description
Technical Field
The present invention relates to a sensor device for measuring the temperature of a surface. Furthermore, the invention relates to the use of the sensor device.
Background
The current trend of electric automobiles requires electronic parts to have High Voltage (HV) strength. High voltage insulation may be ensured by lengthening the creepage distance, the gap distance between conductors or sealing the conductors with a solid insulating material.
However, this results in sensors designed to be large and long to meet HV requirements, or to have a slower response time due to the thick insulating material impeding heat transfer.
Disclosure of Invention
It is an object of the present disclosure to describe a sensor device that solves the above mentioned problems. This object is solved by a sensor device and a use of a sensor device according to the independent claims.
According to a first aspect of the present disclosure, a sensor device is described. The sensor device is configured for measuring a temperature of the surface. The sensor means comprises temperature sensor means. The operating temperature range of the sensor device may be-40 ℃ and 180 ℃ for a short period of up to 200 ℃.
The sensor device is suitable for use in high voltage applications, such as HV bus bars. The sensor device is particularly suitable for use in automotive applications, in particular in electric automotive applications.
The sensor device comprises at least one sensor element, preferably exactly one sensor element. The sensor element may comprise an NTC (negative temperature coefficient) thermistor. In particular, the sensor element may comprise a glass NTC thermistor.
The sensor device further includes a ceramic housing. The term "ceramic shell" is understood to mean that the material of the ceramic shell comprises ceramic. The sensor element is at least partially arranged in the inner region of the ceramic housing. The sensor element is firmly fixed inside the ceramic housing, for example by means of a potting material.
The sensor device further includes a base body. The ceramic housing is connected to the base body. The ceramic shell may be clamped into the base body. The base body is adapted and arranged to at least partially surround the ceramic housing. For example, the top surface of the ceramic shell and at least a portion of the side surface and at least a portion of the bottom surface of the ceramic shell may be surrounded by the base body. Preferably, the base body comprises plastic. The base body may be an insulating part of the sensor device.
The sensor device further includes an outer housing. The outer housing may constitute the outer housing of the sensor device. Preferably, the outer housing comprises plastic. The outer housing may be an insulating part (i.e. another insulating part) of the sensor device.
It will be appreciated that the outer housing and the base body are different/separate components of the sensor device, the outer housing and the base body each performing very specific functions, such as an insulating function. The outer housing is connected to the base body, preferably in a non-releasable manner. The outer shell at least partially encloses the base body and the ceramic shell. The base body, the ceramic housing and thus the sensor element may be at least partially overmolded (overmoulded) by the outer housing. This means that the sensor device may be an overmolded component, i.e. it may be at least partially overmolded by the material of the outer housing. Thus, a very stable and compact sensor device is provided.
The sensor device further comprises at least one mounting element. The mounting element comprises metal. The mounting element is adapted and arranged to mount the sensor device to a target application (i.e. an application where the sensor device is to be used), for example
HV applications.
The mounting element is adapted and arranged to fix the downward thrust to a surface at the temperature to be measured. In other words, the mounting element pushes the sensor device with a defined force onto the surface. Furthermore, the mounting element is adapted to provide mechanical strength at the mounting location such that the sensor device can withstand e.g. vibrations required for a gearbox (the highest acceleration may be 10.5 g). Thus, a very robust and reliable sensor device is provided.
The mounting element may be designed to releasably mount the sensor device to a target application. In other words, the mounting element may ensure that the sensor device may be removed from one target application and moved into and incorporated in another target application. The sensor device can thus be used very flexibly.
The sensor device is designed such that the ceramic housing has an open/exposed surface. In particular, the components of the sensor device are interrelated to each other, and the ceramic housing is specifically designed such that the surface of the ceramic housing is exposed.
This means that the ceramic housing comprises a surface that is in direct mechanical contact with the surface of the temperature to be measured. In other words, the ceramic housing rests at least partially directly on the surface at which the temperature is to be measured, in particular on the measuring point of this surface. In this way, the sensor device can directly measure the temperature of the surface quickly and completely insulated. The sensor device thus has a very fast response time t63<10s (on the surface).
The sensor device may be incorporated within the application being monitored to better make thermal contact with the HV surface while reducing the thermal influence of the surrounding environment.
According to one embodiment, the ceramic housing includes a sensing region. The sensing region is understood to be the region of the ceramic housing through which the surface temperature to be measured is directly transmitted to the sensor element. The sensor element may be positioned directly adjacent to the sensing region. The sensing region may be disposed on a bottom surface of the ceramic housing. The sensing region may form part of the bottom surface of the ceramic housing. The bottom surface may be the surface of the ceramic housing that faces the surface at which the temperature is to be measured once the sensor device is mounted to the target application.
The sensing region at least partially protrudes from the outer housing. This means that the outer shell completely surrounds the base body and the ceramic shell except for the sensing area. Thus, the sensing region may be in direct mechanical contact with the surface when the sensor device is mounted to the target application. In this way, a very efficient sensor device with a fast response time is provided.
According to one embodiment, the base body and the outer housing constitute a dual or reinforced HV insulator of the sensor arrangement. This means that instead of only one insulating housing part, the sensor device comprises two separate parts (base body and outer housing) to ensure a sufficient HV resistance.
Preferably, the sensor device comprises a high voltage resistance of 4300V for DC (direct current). In this way, the sensor device is particularly suitable for use in HV applications such as electric vehicles.
According to one embodiment, the sensor device comprises at least two connection elements, preferably exactly two connection elements, for electrically connecting the sensor device. The corresponding connection element may comprise a terminal and a metal wire. Corresponding connection elements protrude from the outer housing for electrical connection of the sensor device.
The respective connecting element, in particular the wire, may be at least partially covered with an insulating material. The wires of the connecting element may be interwoven.
According to an embodiment, the mounting element is clamped to an outer surface of the outer housing. In this way, the mounting element can be quickly and easily connected to the outer surface of the sensor device.
According to an embodiment, the design of the mounting element can be adapted to the shape of the target application. In other words, the shape of the mounting element may be adapted to the desired location/target application where the sensor device is to be mounted. The mounting element may comprise, for example, a clip, a spring clip or a screw. In this way, a sensor device is provided which can be used very flexibly.
According to another aspect, use of a sensor device is described. The sensor device may be the sensor device described above. Thus, all features described in connection with the sensor device are applicable to the use of the sensor device, and all features described in connection with the use of the sensor device are applicable to the sensor device.
Sensor devices are used to measure surface temperatures in high voltage target applications, such as electric vehicle applications. Preferably, the sensor device is clamped to the target application.
Due to the introduction of the ceramic housing, the sensor device can be produced with glass NTC with all plastic overmolding (double insulation) but maintaining a fast response time while maintaining HV strength. The sensor device includes a very high HV resistance up to 4300V for DC. Furthermore, the sensor device comprises a very small overall size.
Furthermore, due to the introduction of the flexible mounting element (e.g. spring clip) and the exposed ceramic housing surface, the sensor device can directly measure temperature from the bottom contact surface quickly and completely insulated. Thus, the sensor device provides a very fast response time.
Drawings
Other features, improvements and convenience will become apparent from the following description of exemplary embodiments taken in conjunction with the accompanying drawings.
Figure 1 schematically shows a perspective view of a sensor device,
Figure 2 schematically shows a bottom perspective view of the sensor device according to figure 1,
Figure 3 schematically shows a perspective side view of parts of the sensor device according to figure 1,
Figure 4 schematically shows a perspective view of parts of the sensor device according to figure 1,
Figure 5 schematically shows a cross-sectional side view of a sensor device mounted on a target application,
Figure 6 schematically shows a cross-sectional side view of the sensor device,
Figure 7 schematically shows a perspective view of the sensor device,
Fig. 8 schematically shows a cross-sectional view of a part of a sensor device.
Detailed Description
In the drawings, elements having the same structure and/or function may be denoted by the same reference numerals. It should be understood that the embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.
Fig. 1 to 8 show a sensor device 1 or a part thereof. The sensor device 1 is a temperature sensor device. In particular, the sensor device 1 is configured for measuring a temperature of a surface, for example a plastic surface.
The sensor device 1 is suitable for use in HV applications. The sensor device 1 has a very high HV resistance, as will be described in detail later. The HV resistance of the sensor arrangement is preferably 4300V for DC.
The sensor device 1 is particularly suitable for use in automotive applications, in particular in electric automotive applications. For example, the sensor device 1 may be used for temperature measurement on a bus bar surface for HV applications in the field of electric automobiles. The operating temperature of the sensor device 1 ranges between-40 ℃ and 180 ℃ for a short period of time up to 200 ℃.
The sensor device 1 comprises a sensor element 2 (see in particular fig. 4). The sensor element 2 comprises an NTC thermistor, preferably a glass NTC thermistor. The sensor element 2 is connected to two connecting elements 4. The respective connecting elements 4 may comprise terminals and metal wires. The wires may be twisted together (see fig. 6 and 7). The wire is at least partially surrounded by an insulating material 4A.
The connection element 4 is adapted to electrically connect the sensor device 1. In particular, the connection element 4 electrically connects the sensor device 1 with the connector 10, as can be gathered from fig. 6 and 7. The connector 10 is adapted and arranged to electrically connect the sensor device 1 with an external supply unit (not explicitly shown).
The sensor device 1 further comprises a ceramic housing 3. The ceramic housing 3 comprises a top surface 3A, a bottom surface 3B and a hollow interior/hollow interior region 12 (fig. 8). The bottom surface 3B may be the surface of the ceramic housing 3 that faces the surface to be measured for temperature once the sensor device 1 is mounted to the target application 9 (see fig. 5 in the context).
The ceramic housing 3 has an open end 15 and a closed end 16. In the inner region 12, the closed end 16 comprises an inverted circular shape. The sensor element 2 is arranged in the inner region 12 close to the rounded closed end 16 (see for example fig. 4 and 5). The sensor element 2 is firmly fixed in the inner region 12 of the ceramic housing 3 by means of a potting material 17 (fig. 5). The connection element 4 protrudes partially from the open end 15 of the ceramic housing 3 for making an electrical connection of the sensor device 1 as described above (see fig. 4).
The sensor device 1 and in particular the ceramic housing 3 comprises a sensing region 6. The sensing region 6 is understood to be the region of the ceramic housing 3 through which the surface temperature to be measured is directly transmitted to the sensor element 2. The sensing region 6 is arranged at the bottom surface 3B of the ceramic housing 3. The sensing region 6 is part of the bottom surface 3B.
The bottom surface 3B includes a protrusion. Therefore, the bottom surface 3A is not smooth. In particular, the bottom surface 3A comprises an edge 11 (fig. 8). In other words, the bottom surface 3A comprises two portions having different heights, i.e. extending perpendicular to the main longitudinal axis X of the ceramic housing 3/sensor device 1 with respect to each other. The sensing region 6 comprises a portion of the bottom surface 3B having a greater height than another/second portion of the bottom surface 3B. In other words, the sensing region 6 is thicker than the rest of the bottom surface 3B, such that the sensing region 6 protrudes from the final sensor device 1.
Once the sensor element 2 is arranged within the ceramic housing 3, the sensing region 6 is located directly below the sensor element 2. Furthermore, once the sensor device 1 is mounted to the target application, the sensing area 6 is directly seated on the surface 9A of the temperature to be measured (see fig. 5). This will be described in detail later.
The bottom surface 3A and thus the overall length l1 of the ceramic housing 3 may be between 6mm and 8mm, for example 7.2mm, 7.0mm or 6.8mm (fig. 8). In this context, the term length refers to the extension of the ceramic housing 3 along the main longitudinal axis X. The length l3 of the portion of the bottom surface 3A having the smaller height may be between 2mm and 3mm, for example 2.5mm or 2.8mm. The length l2 of the inner region 12 of the ceramic housing 3 may be between 6mm and 7mm, for example 6.5mm or 6.2mm.
The sensor device 1 further comprises a base body 5. The base body 5 comprises plastic. The basic body constitutes a first HV insulator of the sensor arrangement 1. The base body 5 is connected to the ceramic housing 3. In particular, the ceramic housing 3 is clamped into the base body 5.
For example, as can be seen from fig. 1 to 3 and 5, the base body 5 partially surrounds the ceramic housing 3 and the connecting element 4. The connection element 4 protrudes from a side surface of the base body 5 to enable electrical connection of the sensor device 1. Furthermore, the sensing region 6 (i.e. a portion of the bottom surface 3A of the ceramic housing 3) is free of material of the base body 5.
The base body 5 comprises a plurality of alignment features 13 arranged at an outer surface of the base body 5. The alignment features 13 may each include a protrusion. The alignment feature 13 is adapted and arranged to align the base body 5 with the outer housing 8 of the sensor device.
The outer housing 8 of the sensor device 1 constitutes a further/second HV insulator of the sensor device 1. The outer housing 8 comprises plastic. The length L of the outer housing 8 may be between 20mm and 25mm, for example 22mm or 23mm (fig. 6). Furthermore, the height H1 of the outer housing 8 may be between 5mm and 6mm, for example 5.5mm. The total height H2 of the sensor device 1 comprising the mounting element 7 described later may be between 8mm and 9mm, for example 8.5mm or 8.8mm (fig. 6).
The outer shell 8 at least partly encloses the base body 5, the connecting element 4 and the ceramic shell 3. The base body 5, the ceramic housing 3 and the connecting element 4 are at least partially over-molded by the material of the outer housing 8. However, a portion of the bottom surface 3B of the ceramic housing 3, i.e. the sensing region 6, remains free of the material of the housing 8. In other words, the sensing region 6 is exposed.
In this way, the sensing area 6 may be placed directly onto the surface 9A when the sensor device 1 is mounted to the target application 9A. Thus, no other components, in particular no insulating material, are arranged between the surface 9A and the sensing region 6. Thus, the sensor device 1 has a very fast response time. In particular, the response time t63<10s (on the surface).
Furthermore, the sensor device 1 has a very high HV resistance by the double insulation provided by the outer housing 8 and the base body 5. In particular, the HV resistance was 4300V for DC.
Finally, the sensor device 1 comprises a mounting element 7. The mounting element 7 comprises metal. The mounting element 7 is adapted and arranged for mounting the sensor device 1 to a target application 9. In the embodiment shown, the mounting element 9 comprises a spring clip. However, different embodiments of the mounting element 7 are conceivable, such as screws or clips. In particular, the design of the mounting element 7 can be adapted to the shape of the target application.
In this embodiment, the mounting element 7 is clamped to the outer surface of the outer housing 8. For this purpose, the mounting element 7 comprises two resilient arms 7A, the resilient arms 7A having radially inwardly directed protrusions 18, the protrusions 18 engaging with mating recesses of the outer housing 8 (fig. 1 and 2).
The mounting element 7 is also designed to be clamped to a target application 9. For this purpose, the mounting element 7 further comprises a spring arm 7B with a projection 14. The spring arm 7B and in particular the projection 14 is adapted and arranged to mechanically cooperate with a cooperating structure of the target application 9, such as a cutout, to firmly and easily connect the sensor device 1 to the target application 9.
Once the sensor device 1 is mounted to the target application 9, the mounting element 7 and in particular the spring arm 7B provides a certain downward thrust towards the bottom, i.e. towards the surface 9A where the measuring point is located (fig. 5). Furthermore, the mounting element 7 ensures mechanical strength at the mounting location to withstand, for example, vibrations required for the gearbox (the highest acceleration may be 10.5 g).
In addition to this, once the sensor device 1 is mounted to the target application 9, the sensing region 6 of the ceramic housing 3 is in direct mechanical contact with the surface 9A, and the temperature of the surface 9A will be measured as can be appreciated in fig. 5. In addition to ensuring HV strength, the bottom surface 3B of the exposed ceramic housing (i.e. the direct contact with the measurement point) also ensures a fast response time.
The invention is not limited to the embodiments based on the description thereof. Rather, the invention includes any novel feature and any combination of features, which in particular includes any combination of features in the claims, even if this feature or combination itself is not explicitly stated in the claims or in the embodiments.
Reference numerals
1. Sensor device
2. Sensor element
3. Ceramic shell
3A Top surface
3B bottom surface
4. Connecting element
4A insulating material
5. Base body
6. Sensing region
7. Mounting element
7A elastic arm
7B spring arm
8. Outer casing
9. Target application
10. Connector with a plurality of connectors
11. Edge of the sheet
12. Inner region
13. Alignment features
14. Projection part
15. Open end portion
16. Closed end
17. Potting material
18. Protruding part
H1 Height of (1)
H2 Height of (1)
Length of L-shaped casing
L1 total length of ceramic housing
L2 internal length of ceramic shell
L3 part length of ceramic shell
X major longitudinal axis
Claims (15)
1. A sensor device (1) for measuring a temperature of a surface (9A), the sensor device (1) comprising:
At least one sensor element (2),
A ceramic housing (3), wherein the sensor element (2) is arranged at least partially in the ceramic housing (3),
-A base body (5), said base body (5) at least partially surrounding said ceramic housing (3),
-An outer housing (8), the outer housing (8) being connected to the base body (5), wherein the outer housing (8) at least partially encloses the base body (5) and the ceramic housing (3),
At least one mounting element (7), said at least one mounting element (7) being adapted and arranged for mounting the sensor device (1) to a target application (9),
Wherein the ceramic housing (3) is adapted and arranged to be in direct mechanical contact with the surface (9A) of the temperature to be measured.
2. Sensor device (1) according to claim 1,
Wherein the ceramic housing (3) comprises a sensing region (6), wherein the sensing region (6) protrudes at least partially from the outer housing (8).
3. Sensor device (1) according to claim 2,
Wherein the outer housing (8) completely surrounds the base body (5) and the ceramic housing (3) except for the sensing region (6).
4. Sensor device (1) according to any of the preceding claims,
Wherein the sensor device (1) is at least partially overmolded by the material of the outer housing (8).
5. Sensor device (1) according to any of the preceding claims,
Wherein the sensor element (2) comprises a glass NTC thermistor.
6. Sensor device (1) according to any of the preceding claims,
Wherein the base body (5) and the outer housing (8) form a dual high voltage insulator of the sensor device (1).
7. Sensor device (1) according to any of the preceding claims,
Wherein the base body (5) and the outer housing (8) comprise plastic.
8. Sensor device (1) according to any of the preceding claims,
Further comprising at least two connection elements (4) for electrically connecting the sensor device (1), wherein the connection elements (4) are at least partially covered by an insulating material (4A).
9. Sensor device (1) according to any of the preceding claims,
Wherein the mounting element (7) is clamped to the outer surface of the outer housing (8).
10. Sensor device (1) according to any of the preceding claims,
Wherein the design of the mounting element (7) can be adapted to the shape of the target application.
11. Sensor device (1) according to any of the preceding claims,
Wherein the mounting element (7) comprises a clip, a spring clip or a screw.
12. Sensor device (1) according to any of the preceding claims,
Wherein the sensor device (1) comprises a high voltage resistor of no more than 4300V of direct current.
13. Use of a sensor device (1) according to any of the preceding claims, the sensor device (1) for measuring a surface temperature in a high voltage target application (9).
14. The use according to claim 13,
Wherein the sensor device (1) is clamped to the target application (9).
15. The use according to claim 13 or 14,
Wherein the sensor device (1) is used in an electric vehicle application.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102023109189.1 | 2023-04-12 | ||
| DE102023109189.1A DE102023109189A1 (en) | 2023-04-12 | 2023-04-12 | sensor arrangement |
| PCT/EP2024/059931 WO2024213686A1 (en) | 2023-04-12 | 2024-04-12 | Sensor arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120813820A true CN120813820A (en) | 2025-10-17 |
Family
ID=90735004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202480015066.XA Pending CN120813820A (en) | 2023-04-12 | 2024-04-12 | Sensor device |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN120813820A (en) |
| DE (1) | DE102023109189A1 (en) |
| WO (1) | WO2024213686A1 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012110822A1 (en) * | 2012-11-12 | 2014-05-15 | Epcos Ag | Temperature sensor system and method of manufacturing a temperature sensor system |
| JP6558311B2 (en) * | 2016-06-23 | 2019-08-14 | 株式会社オートネットワーク技術研究所 | Temperature detection module |
| JP2019002893A (en) * | 2017-06-20 | 2019-01-10 | 矢崎総業株式会社 | Temperature sensor |
| JP6983579B2 (en) * | 2017-08-25 | 2021-12-17 | 矢崎総業株式会社 | Temperature sensor |
| DE202020101413U1 (en) * | 2019-12-19 | 2020-04-06 | Tdk Electronics Ag | Sensor device, electrical device with sensor device and vehicle with sensor device |
| DE102020115856A1 (en) * | 2020-06-16 | 2021-12-16 | Tdk Electronics Ag | Sensor arrangement |
-
2023
- 2023-04-12 DE DE102023109189.1A patent/DE102023109189A1/en active Pending
-
2024
- 2024-04-12 CN CN202480015066.XA patent/CN120813820A/en active Pending
- 2024-04-12 WO PCT/EP2024/059931 patent/WO2024213686A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| DE102023109189A1 (en) | 2024-10-17 |
| WO2024213686A1 (en) | 2024-10-17 |
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