CN120457800A

CN120457800A - Functional back panel and light-emitting device

Info

Publication number: CN120457800A
Application number: CN202380012201.0A
Authority: CN
Inventors: 王莉莉; 冯杉杉; 刘超; 王静; 贾明明; 王淮民; 刘梦晴; 赵景平; 翟明; 齐琪
Original assignee: BOE Technology Group Co Ltd; BOE MLED Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; BOE MLED Technology Co Ltd
Priority date: 2023-12-07
Filing date: 2023-12-07
Publication date: 2025-08-08
Also published as: WO2025118234A1

Abstract

The present application discloses a functional backplane and a light-emitting device, which relate to the field of display technology. The functional backplane includes a substrate, a plurality of electronic components, a plurality of connecting traces and a bridge circuit structure. The bridge circuit structure includes a substrate, an adhesive layer located on the third surface of the substrate, and a circuit layer and a protective layer located on the fourth surface of the substrate. Each bridge trace in the circuit layer is connected to a corresponding connecting trace, and then the driving signal provided by the external circuit structure connected to the bridge trace is transmitted to the electronic component through the connecting trace. The solution of the embodiment of the present application can concentrate the width occupied by the ends of all bridge traces into a smaller size range, and there is no need to bind a large number of flexible circuit boards to connect with the external circuit structure, which has higher flexibility.

Description

Functional backboard and light-emitting device

Technical Field

The present application relates to the field of display technologies, and in particular, to a functional back plate and a light emitting device.

Background

Light emitting devices are currently being developed towards ultra-narrow frames and even no frames to increase the screen duty cycle.

Disclosure of Invention

The application provides a functional backboard and a light-emitting device, and the technical scheme is as follows:

in one aspect, a functional back-plate is provided, the functional back-plate comprising:

a substrate comprising opposing first and second surfaces;

A plurality of electronic components located on the first surface of the substrate;

A plurality of connecting wires, wherein a first end of each connecting wire is positioned on the first surface of the substrate and is connected with the electronic element, and a second end of each connecting wire is positioned on the second surface of the substrate;

The bridge circuit structure comprises a substrate, an adhesive layer, a circuit layer and a protective layer, wherein the substrate comprises a third surface and a fourth surface which are opposite, the adhesive layer is positioned on the third surface of the substrate and is used for adhering the substrate to the second surface of the substrate, the circuit layer is positioned on the fourth surface of the substrate and comprises a plurality of bridge wires corresponding to the plurality of connecting wires, the first end of each bridge wire is connected with the second end of a corresponding connecting wire, the second end of each bridge wire is used for being connected with an external circuit structure and is used for transmitting driving signals provided by the external circuit structure to the electronic element through the connecting wires, and the protective layer is positioned on one side, far away from the substrate, of the circuit layer.

Optionally, the second surface of the substrate has at least one first alignment mark, and the first alignment mark is used for structural alignment;

The substrate is provided with at least one first alignment opening corresponding to the at least one first alignment mark, the first alignment mark is exposed by orthographic projection of the first alignment opening on the substrate, and orthographic projection of the first alignment opening on the substrate and orthographic projection of the plurality of bridging wires on the substrate are not overlapped.

Optionally, a distance h1 between an edge of the first alignment mark and an edge of the orthographic projection of the first alignment opening on the substrate ranges from 20 micrometers to 1 millimeter;

the center of the first alignment mark is positioned in the middle area of the orthographic projection of the first alignment opening on the substrate.

Optionally, the orthographic projection of the first alignment opening on the substrate has a square, an ellipse, a circle and a regular polygon.

Optionally, the second surface of the substrate has at least one second alignment mark, and the second alignment mark is used for structural alignment;

The bonding layer is provided with at least one second alignment opening corresponding to the at least one second alignment mark, and the orthographic projection of the second alignment mark on the substrate is positioned in the orthographic projection of the second alignment opening on the substrate.

Optionally, the adhesive layer has a plurality of strip-shaped exhaust grooves, where the plurality of exhaust grooves at least includes a first groove extending along a first direction, and a second groove extending along a second direction, where the first direction is an extending direction of a portion of the connection trace located on the second surface, and the second direction intersects the first direction;

The orthographic projections of the first groove and the second groove on the substrate are positioned at one side of the second end of the bridging wire away from the first end of the bridging wire.

Optionally, the plurality of exhaust slots includes a plurality of the first slots and one of the second slots, the second direction being perpendicular to the first direction;

The plurality of first grooves are further away from the bridging trace relative to the second grooves, the plurality of first grooves are arranged at intervals in the second direction, and the first end of each first groove is communicated with the second groove.

Optionally, the distance between the first side of the substrate and the second side of the substrate ranges from 0.5 mm to 5 mm;

The first side of the substrate is the side of the substrate closest to the connecting part between the first end of the connecting wire and the second end of the connecting wire, and the second side of the substrate is the side closest to the first side of the substrate.

Optionally, an included angle between the second side surface and the third surface of the substrate is an acute angle, and an orthographic projection of the fourth surface of the substrate on the third surface of the substrate is located in the third surface of the substrate.

Optionally, the included angle between the second side surface and the third surface ranges from 30 degrees to 75 degrees.

Optionally, the functional backboard further comprises a cushion layer structure positioned on one side of the second side surface of the substrate, which is close to the first side surface of the substrate;

The included angle between the surface of the cushion layer structure, which is close to the first side surface of the substrate, and the third surface of the substrate is smaller than the included angle between the second side surface of the substrate and the third surface of the substrate.

Optionally, the functional backboard further comprises a first connecting pad and a second connecting pad;

the first connecting pad is positioned on the first surface of the substrate and is used for connecting the first end of the connecting wire and the electronic element;

The second connecting pad is positioned on the fourth surface of the substrate and is used for connecting the second end of the connecting wire and the first end of the bridging wire;

Wherein a distance h3 between the second connection pad and the second side of the substrate ranges from 100 micrometers to 0.5 millimeters.

Optionally, a bridging portion is disposed between the first end and the second end of the bridging wire;

The protective layer is made of insulating material, and is of a whole layer structure, and the orthographic projection of the protective layer on the substrate covers the orthographic projection of the bridging part on the substrate and exposes the orthographic projection of the first end and the second end of the bridging wire on the substrate, or

The protective layer is made of conductive materials, and comprises a plurality of protective patterns which are arranged at intervals and correspond to the bridging wires, and orthographic projection of each protective pattern on the substrate covers orthographic projection of a corresponding bridging wire on the substrate plate.

Optionally, the substrate comprises a flexible film layer, or

The substrate comprises a first flexible film layer, a buffer layer and a second flexible film layer which are sequentially laminated.

In another aspect, there is provided a light emitting device including a power supply assembly and the functional back plate as described in the above aspects;

The power supply assembly is used for supplying power to the functional backboard.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic structural diagram of a functional back plate according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a bridge circuit structure according to an embodiment of the present application;

FIG. 3 is a schematic structural diagram of another functional back plate according to an embodiment of the present application;

FIG. 4 is a top view of a base plate and substrate provided by an embodiment of the present application;

FIG. 5 is a top view of a bridge circuit structure according to an embodiment of the present application;

FIG. 6 is a top view of an adhesive layer according to an embodiment of the present application;

FIG. 7 is a top view of another bridge circuit configuration provided by an embodiment of the present application;

FIG. 8 is a top view of another adhesive layer provided in an embodiment of the present application;

Fig. 9 is a schematic diagram of a bridge circuit structure, a first protection film and a second protection film according to an embodiment of the present application;

FIG. 10 is a schematic diagram of a bridge circuit structure, a first protective film and a second protective film according to an embodiment of the present application;

FIG. 11 is a schematic diagram of a bridge circuit structure, a first protective film and a second protective film according to an embodiment of the present application;

fig. 12 is a schematic view of a climbing of a connection trace on a flexible circuit board without a pad layer structure according to an embodiment of the present application;

fig. 13 is a schematic view of climbing a connection trace on a flexible circuit board with a pad layer structure according to an embodiment of the present application;

FIG. 14 is a schematic view of a climbing of a connection trace on a substrate without a pad layer structure according to an embodiment of the present application;

FIG. 15 is a schematic view of a climbing of a connection trace on a substrate without a pad layer structure according to an embodiment of the present application;

FIG. 16 is a top view of a connection trace climbing a substrate without a pad layer structure according to an embodiment of the present application;

FIG. 17 is a top view of a connection trace climbing a substrate with a pad layer structure according to an embodiment of the present application;

FIG. 18 is a top view of a functional back plate provided by an embodiment of the present application;

FIG. 19 is a cross-sectional view taken along the direction AA of FIG. 18;

FIG. 20 is a top view of another functional back plate provided by an embodiment of the present application;

Fig. 21 is a sectional view of fig. 20 along the BB direction.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings.

Some embodiments of the application provide a light emitting device that includes a functional backplate, but may also include other components, such as circuitry for providing electrical signals to the functional backplate to drive the functional backplate to emit light, which may be referred to as control circuitry, may include a circuit board and/or an integrated circuit (INTEGRATE CIRCUIT, IC) electrically connected to the functional backplate.

Optionally, the light emitting device may further comprise a power supply assembly, which may be used to power the functional back plate.

In some embodiments, the light emitting device may be a lighting device, in which case the light emitting device functions as a light source to perform a lighting function. For example, the light emitting device may be a backlight module in a liquid crystal display device, a lamp for internal or external illumination, or various signal lamps, etc.

In other embodiments, the light emitting device may be a display device, where the functional back plate is a display substrate for implementing an image (i.e. picture) display function. The light emitting device may comprise a display or a product comprising a display. The display may be a flat panel display (FLAT PANEL DISPLAY, FPD), a micro display, or the like. The display may be a transparent display or an opaque display, depending on whether the user can see the scene division on the back of the display. The display may be a flexible display or a general display (which may be referred to as a rigid display) if the display is capable of being bent or rolled. By way of example, products containing a display may include a computer display, a television, a billboard, a laser printer with display capability, a telephone, a cell phone, a Personal digital assistant (Personal DIGITAL ASSISTANT, PDA), a laptop computer, a digital camera, a camcorder, a viewfinder, a vehicle, a large-area wall, a theatre screen or stadium sign, and the like.

Some embodiments of the present disclosure provide a functional back plate, as shown in fig. 1, including a substrate, and at least one electronic component disposed on the substrate, where the electronic component may be a micro light emitting diode, a micro integrated circuit chip, a micro sensor, a micro driver, and the like, and is not limited herein.

In some embodiments, taking electronic components as micro leds as examples, the functional back-plate may be used as a backlight or a display device. In the case of the functional back plate as a backlight, a passive display panel, such as a Liquid crystal display panel (Liquid CRYSTAL DISPLAY PANEL, LCD), can be used to display full-color images. At this time, the whole functional backboard can emit monochromatic light or polychromatic light (such as white light), and finer brightness control and higher color contrast can be realized by arranging a plurality of micro light emitting diodes in matrix and combining the regional dimming technology. In the case of the functional back plate as the display device, the functional back plate may be provided with micro light emitting diodes capable of emitting light of different colors, which are matched with each other to realize display of full-color pictures, which may have higher brightness and contrast.

At present, considering the process yield and the manufacturing cost, when preparing large-size products, a plurality of functional back plates can be realized through splicing, so that the user experience is influenced in order to avoid the possible cracking sense generated by splicing between adjacent functional back plates, the functional back plates are designed to be ultra-narrow frames or even have no frames, the seamless splicing effect is presented, and the method is a development direction in the field.

Micro light emitting diode display technology is recognized as a very promising third generation display technology, and it is easier to implement a small-size stitching technology to assemble a larger infinite size display. The Micro light emitting Diode display may be, for example, a Micro LED (Micro LIGHT EMITTING Diode) or a mini LED (MINI LIGHT EMITTING Diode).

In order to realize ultra-narrow frame display, the external circuit structure may be disposed on the back surface of the substrate, and the electronic element disposed on the front surface of the substrate and the external circuit structure disposed on the back surface of the substrate may be connected by the connection trace (disposed on the side surface of the substrate).

Fig. 1 is a schematic structural diagram of a functional back plate according to an embodiment of the present application. Referring to fig. 1, the functional back-plate 10 includes a substrate 101, a plurality of electronic components 102, a plurality of connection traces 103, and a bridge circuit structure 104. The substrate 101 includes a first surface 101a and a second surface 101b opposite to each other, and the plurality of electronic components 102 are located on the first surface 101a of the substrate 101. The first end of each connection trace 103 is located on the first surface 101a of the substrate 101 and is connected to the electronic component 102, and the second end of each connection trace 103 is located on the second surface 101b of the substrate 101.

Fig. 2 is a schematic structural diagram of a bridge circuit structure according to an embodiment of the present application. Referring to fig. 2, the bridge circuit structure 104 includes a substrate 1041, an adhesive layer 1042, a circuit layer 1043 and a protective layer 1044. The substrate 1041 includes opposed third and fourth surfaces 1041a, 1041b. The adhesive layer 1042 is located on the third surface 1041a of the substrate 1041, and the adhesive layer 1042 is used for adhering the substrate 1041 to the second surface 101b of the substrate 101. The circuit layer 1043 is located on the fourth surface 1041b of the substrate 1041, where the circuit layer 1043 includes a plurality of bridging wires (not shown in the figure) corresponding to the plurality of connecting wires 103, and a first end of each bridging wire is connected to a second end of a corresponding one of the connecting wires 103, and the second end of the bridging wire is used for being connected to an external circuit structure, and for transmitting a driving signal provided by the external circuit structure to the electronic component 102 through the connecting wire 103. The protective layer 1044 is located on a side of the circuit layer 1043 away from the substrate 1041, and an orthographic projection of the protective layer 1044 on the substrate 1041 covers at least a portion of the circuit layer 1043, so as to protect at least a portion of the circuit layer 1043.

In the embodiment of the present application, the substrate 1041 is mainly used for carrying the bridging wires, and after the substrate 1041 is attached to the second surface 101b of the substrate 101 through the adhesive layer 1042, the connecting wires 103 may be formed by a film plating or printing manner, so as to effectively connect the electronic component 102 and the bridging wires.

Referring to fig. 1, the connection trace 103 includes portions sequentially disposed on the first surface 101a, the first side 101c, and the second surface 101b, or referring to fig. 3, a via hole is provided on the substrate 101, and the connection trace 103 extends from the first surface 101a to the second surface 101b via the via hole. In the embodiment shown in fig. 1 or fig. 3, the second surface 102b may be provided with a bridge circuit structure 104, and the connection trace 103 is connected to the bridge trace in the bridge circuit structure 104.

Referring to fig. 1 and 2, the fourth surface 1041b of the substrate 1041 is further away from the substrate 101 than the third surface 1041a, and the wiring layer 1043 is located on a side of the substrate 1041 away from the substrate 101. Thus, in order to connect the connection trace 103 and the bridge trace in the line layer 1043, it is necessary to make the connection trace 103 climb to the surface of the substrate 1041 away from the substrate 101 via the side surface of the substrate 1041, and further make the second end of the connection trace 103 and the bridge trace located on the fourth surface 1041b of the substrate 1041 connect, so as to realize signal transmission.

In an embodiment of the present application, the bridge traces in the bridge circuit structure 104 may be prepared by an exposure process. The exposure process is high and stable in precision, so that bridging wires with smaller line width and line distance can be prepared, and the widths occupied by the end parts of all bridging wires can be concentrated into a smaller size range. Further, under the condition of utilizing the flexible circuit board (Flexible Printed Circuit, FPC) to be connected with an external circuit structure, the flexible circuit board with smaller width can be adopted, so that the design flexibility is improved, and meanwhile, the cost is reduced.

In summary, the embodiment of the application provides a functional back plate, which includes a substrate, a plurality of electronic components, a plurality of connection wires and a bridge circuit structure. The bridge circuit structure comprises a substrate, an adhesive layer positioned on the third surface of the substrate, and a circuit layer and a protective layer positioned on the fourth surface of the substrate. Each bridging wire in the circuit layer is connected with a corresponding connecting wire, so that driving signals provided by an external circuit structure connected with the bridging wires are transmitted to the electronic element through the connecting wires. The scheme of the embodiment of the application can concentrate the widths occupied by the end parts of all bridging wires into a smaller size range, can be used for connecting with an external circuit structure without binding a plurality of flexible circuit boards, and has higher flexibility.

In the embodiment of the present application, the connection trace 103 and the bridge trace may be metal traces. The material of the metal wire can be Ti (titanium), al (aluminum) and Ti three-layer structure, which is named as Ti/Al/Ti. Or the material of the metal wire can be Mo (molybdenum), al and a three-layer structure of Mo, which is marked as Mo/Al/Mo. Or the material of the metal wire can be Ti, cu (copper) and a three-layer structure of Ti, which is named as Ti/Cu/Ti. The material of the metal wiring can be Mo, cu and Mo three-layer structure, which is marked as Mo/Cu/Mo. Still alternatively, the material of the metal trace may be a three-layer structure of Monb (molybdenum niobium alloy), al and Monb, denoted as Monb/Al/Monb. Or the material of the metal wire can be a three-layer structure of MoNb, cu and MoNb, which is named as MoNb/Cu/MoNb. Of course, the material of the metal wire may be other materials, which is not limited in the embodiment of the present application.

Optionally, the thickness of the metal trace needs to be measured and designed according to the product performance or the user's needs, and the thickness of the metal trace is usually in the range of 0.5 μm (micrometers) to 2 μm.

Fig. 4 is a top view of a base plate and a substrate according to an embodiment of the present application. Referring to fig. 4, the second surface 101b of the substrate 101 has at least one first alignment mark J1 (two first alignment marks J1 are shown in fig. 4), which first alignment marks J1 can be used for structural alignment. For example, the first alignment mark J1 may be used for alignment when the substrate 101 and the bridge substrate 104 are bonded.

The first alignment mark J1 needs to be identified to function, and if the substrate 1041 covers the first alignment mark J1, the first alignment mark J1 cannot be identified. Therefore, alignment openings need to be provided in the substrate 1041 of the bridge substrate 104 and the adhesive layer 1042 at positions corresponding to the first alignment marks J1. As shown in fig. 4, the bridge substrate 104 has at least one first alignment opening K1 corresponding to the at least one first alignment mark J1. The front projection of the first alignment opening K1 on the substrate 101 exposes the first alignment mark J1. In addition, the front projection of the first alignment opening K1 on the substrate 101 and the front projection of the plurality of bridge traces on the substrate 101 do not overlap, so that the normal wiring of the bridge traces on the substrate 1041 can be ensured.

Alternatively, the distance h1 between the edge of the first alignment mark J1 and the edge of the orthographic projection of the first alignment opening K1 on the substrate 101 may range from 20 μm to 1mm. Therefore, the first alignment opening K1 can be ensured to be completely exposed out of the first alignment mark J1, and the identification effect of the first alignment mark J1 is ensured. Wherein a distance h1 in the range of 20 μm to 1mm may mean that the distance h1 is greater than or equal to 20 μm and less than or equal to 1mm. Namely, the granularity is less than or equal to 20 mu m h1 is less than or equal to 1mm.

For example, referring to fig. 4, the first alignment mark J1 may have a cross structure, and an edge of the first alignment mark J1 may be an end of a leg of the cross structure. The distance h1 between the edge of the first alignment mark J1 and the edge of the orthographic projection of the first alignment opening K1 on the substrate 101 may refer to the distance between the end of the branch and the edge of the orthographic projection of the first alignment opening K1 on the substrate 101. Of course, the first alignment mark J1 may have other shapes.

Alternatively, the cross structure may include two branches perpendicular to each other, where a distance h11 between a first branch of the two branches and a first edge of the first alignment opening K1 is equal to a distance h12 between a second branch and a second edge of the first alignment opening K1. The extending direction of the first branch part is vertical to the first edge, and the extending direction of the second branch part is vertical to the second edge.

Of course, the distance h11 between the first branch and the first edge of the first alignment opening K1 may be different from the distance h12 between the second branch and the second edge of the first alignment opening K1, which is not limited by the embodiment of the present application.

For example, in the case where the distance h1 between the end of any one of the branches and the edge of the orthographic projection of the first alignment opening K1 on the substrate 101 is greater than or equal to 0.5mm, the distance h11 between the first branch and the first edge of the first alignment opening K1 may be unequal to the distance h12 between the second branch and the second edge of the first alignment opening K1.

In an embodiment of the present application, the center of the first alignment mark J1 may be located in a middle area of the orthographic projection of the first alignment opening K1 on the substrate 101. Therefore, on the premise that the first alignment mark J1 is completely exposed, the size of the first alignment opening K1 can be reduced as much as possible, and the influence on the wiring of the bridging wiring is avoided.

Alternatively, the shape of the orthographic projection of the first alignment opening K1 on the substrate 101 may be a regular polygon, an ellipse, a circle, or the like. Wherein, regular polygon can be square, regular pentagon, regular hexagon, etc. For example, referring to fig. 4, the shape of the orthographic projection of the first alignment opening K1 on the substrate 101 may be square. Of course, the shape of the orthographic projection of the first alignment opening K1 on the substrate 101 may be other shapes, which is not limited in the embodiment of the present application.

Fig. 5 is a partial top view of a bridge circuit structure according to an embodiment of the present application. Referring to fig. 5, the second surface 101b of the substrate 1041 has at least one second alignment mark J2 (two second alignment marks J2 are shown in fig. 5), and the second alignment marks J2 may be used for structural alignment. For example, the second alignment mark J2 may be used for alignment at the time of bonding the substrate 101 and the bridge substrate 104.

In general, since bubbles and textures of the adhesive layer 1042 on the side of the substrate 1041 near the substrate 101 affect the recognition of the second alignment mark J2, the second alignment opening K2 can be designed in the adhesive layer 1042 and at the position corresponding to the second alignment mark J2, so as to ensure the recognition effect of the second alignment mark J2. Referring to fig. 6, the adhesive layer 1042 has at least one second alignment opening K2 corresponding to the at least one second alignment mark J2, and an orthographic projection of the second alignment mark J2 on the substrate 101 is located in an orthographic projection of the second alignment opening K2 on the substrate 101.

Alternatively, the distance h2 between the edge of the second alignment mark J2 and the edge of the orthographic projection of the second alignment opening K2 on the substrate 101 may range from 20 μm to 1mm. This ensures that no material is present in the adhesive layer 1042 below the second alignment mark J2, which prevents air bubbles from occurring during the adhesion of the adhesive layer 1042 or the identification of the second alignment mark J2 from being affected by the texture present on the surface of the adhesive layer 1042. Wherein a distance h2 in the range of 20 μm to 1mm may mean that the distance h2 is greater than or equal to 20 μm and less than or equal to 1mm. Namely, the granularity is less than or equal to 20 mu m h2 is less than or equal to 1mm.

For example, referring to fig. 6, the second alignment mark J2 may have a cross structure, and an edge of the second alignment mark J2 may be an end of a zigzag branch of the cross structure. The distance h2 between the edge of the second alignment mark J2 and the edge of the orthographic projection of the second alignment opening K2 on the substrate 101 may refer to the distance between the end of the branch and the edge of the orthographic projection of the second alignment opening K2 on the substrate 101. Of course, the second alignment mark J2 may have other shapes.

Alternatively, the cross structure may include two branches perpendicular to each other, where a distance h21 between a first branch of the two branches and a third edge of the second alignment opening K2 is equal to a distance h22 between the second branch and a fourth edge of the second alignment opening K2. The extending direction of the first branch part is vertical to the third edge, and the extending direction of the second branch part is vertical to the fourth edge.

Of course, the distance h21 between the first branch and the third edge of the second alignment opening K2 may be different from the distance h22 between the second branch and the fourth edge of the second alignment opening K2, which is not limited by the embodiment of the present application.

For example, in the case where the distance h2 between the end of any one of the branches and the edge of the orthographic projection of the second alignment opening K2 on the substrate 101 is greater than or equal to 0.5mm, the distance h21 between the first branch and the third edge of the second alignment opening K2 may be unequal to the distance h22 between the second branch and the fourth edge of the second alignment opening K2.

In an embodiment of the present application, the center of the second alignment mark J2 may be located in a middle area of the orthographic projection of the second alignment opening K2 on the substrate 101. Therefore, the size of the second alignment opening K2 can be reduced as much as possible on the premise of ensuring that the material of the adhesive layer 1042 is not present under the second alignment mark J2, and the adhesive effect of the adhesive layer 1042 is prevented from being influenced.

Referring to fig. 6, the shape of the orthographic projection of the second alignment opening K2 on the substrate 101 may be square. Of course, the shape of the orthographic projection of the second alignment opening K2 on the substrate 101 may be other shapes, for example, elliptical, circular, regular polygon, etc., which is not limited in the embodiment of the present application.

In general, the functional back-plate 10 needs to undergo multiple high-temperature treatments after bonding the bridge circuit structure 104 and the substrate 101 in the manufacturing process. However, in the process of subjecting the functional back plate 10 to high temperature treatment, the functional back plate may be warped due to a large difference between the thermal expansion coefficient of the adhesive layer 1042 and the thermal expansion coefficient of the substrate 1041.

Alternatively, after the bridge circuit structure 104 and the substrate 101 are bonded, the bonding layer 1042 needs to be cured at a temperature of 150 ℃, after the connection trace 103 is formed, the material forming the connection trace 103 needs to be cured at a temperature of 200 ℃ or less (a temperature of 200 ℃ or less is convenient for achieving stable production), for example, assuming that the material of the connection trace 103 is a mixed material of silver powder and resin, the material may be cured at a temperature of 150 ℃ for 30 minutes, after the connection trace 103 is formed, the trace protection layer 105 needs to be cured at a temperature of 200 ℃ or less (a temperature of 200 ℃ or less is convenient for achieving stable production), for example, assuming that the material of the trace protection layer 105 is epoxy, the material may be cured at a temperature of 150 ℃ for 30 minutes, and the fixed connection of the electronic component 102 and the substrate 101 needs to be achieved by a die bonding process at a temperature of 270 ℃.

In order to solve the problem of warpage of the functional back plate 10, a material having a good temperature resistance may be selected as the material of the adhesive layer 1042. Better temperature resistance may mean less expansion at high temperatures (e.g., 270 ℃). Or further, a plurality of air discharge grooves W in the shape of a bar as shown in fig. 7 and 8 may be provided on the adhesive layer 1042. In the subsequent high temperature treatment process, the exhaust slot W can provide an expansion space for the expansion of the adhesive layer 1042, and the expansion space can accommodate a part of the accommodation amount of the adhesive layer 1042, so that the functional backboard warpage caused by too large difference of the expansion amounts of the adhesive layer 1042 and the substrate 1041 can be avoided, and the yield of the functional backboard is ensured.

Referring to fig. 8, the plurality of exhaust grooves W includes at least a first groove W1 extending in the first direction X and a second groove W2 extending in the second direction Y. The first direction X is an extending direction of a portion of the connection trace 103 located on the second surface 101b, and the second direction Y intersects the first direction X, for example, the second direction Y may be perpendicular to the first direction X. The orthographic projections of the first and second grooves W1 and W2 on the substrate 101 are located at a side of the second end of the bridging trace away from the first end of the bridging trace.

Further, referring to fig. 8, the plurality of exhaust grooves W includes a plurality of first grooves W1 and a second groove W2. The plurality of first slots W1 are further from the bridging trace than the second slots W2. The plurality of first grooves W1 are arranged at intervals in the second direction Y, and the first end of each first groove W1 communicates with the second groove W2.

In general, the functional back-plate 10 is more likely to warp in the second direction Y, so by designing the plurality of first grooves W1 extending in the first direction X and arranged in the second direction Y, it is possible to provide expansion space for expansion of the adhesive layer 1042 in the second direction Y to a large extent, reducing the total expansion amount of the adhesive layer 1042 in the second direction Y. Thereby the possibility of warping of the functional back-plate in the second direction Y can be reduced.

Alternatively, the length of the second groove W2 (the length of the second groove W2 in the second direction Y) may be equal to the length of the bridge circuit structure 104 in the second direction Y. The width d1 of the second groove W2 (the length of the second groove W2 in the first direction X) may range from 1mm to 3mm. The distance d2 of the second groove W2 and the bridge circuit structure 104 away from the edge of the connection trace 103 ranges from 5mm to 15mm.

Alternatively, the first groove W1 may extend from the position of the second groove W2 to the edge of the bridge circuit structure 104 in a direction away from the connection trace 103, i.e., the length d2 of the first groove W1 (the length of the first groove W1 in the first direction X) is equal to the distance between the second groove W2 and the edge of the bridge circuit structure 104 away from the connection trace 103. The width d3 of the first groove W1 (the length of the first groove W1 in the second direction Y) may be in the range of 1mm to 3mm. The distance d4 between adjacent first grooves W1 may range from 2mm to 6mm. In addition, the ratio d4/d3 of d4 and d3 is 1.5 or more and 3 or less, that is, 1.5≤d4/d 3≤3.

Further, the distance d5 between the side 1042a of the adhesive layer 1042 far from the air exhaust slot W and the first alignment opening K1 along the first direction X is greater than or equal to 2mm, so that the adhesive effect of the adhesive layer 1042 can be ensured.

Alternatively, the thickness of the adhesive layer 1042 may range from 20 μm to 100 μm, i.e., the thickness of the adhesive layer 1042 is greater than or equal to 20 μm and less than or equal to 100 μm. That is, the thickness of the adhesive layer 1042 cannot be too thin nor too thick. If too thin, the adhesion effect between the substrate 1041 and the substrate 101 cannot be ensured, and if too thick, the total thickness of the adhesion layer 1042 and the substrate 1041 is too thick, i.e. the climbing height of the connection trace 103 is too high, and the yield of the connection trace 103 is low.

In an embodiment of the present application, referring to fig. 4, a distance h3 between the first side 101c of the substrate 101 and the second side 1041c of the substrate 1041 ranges from 0.5mm to 5mm. The first side 101c of the substrate 101 is a side of the substrate 101 closest to a connection portion between the first end of the connection trace 103 and the second end of the connection trace 103. The second side 1041c of the substrate 1041 is one of the sides of the substrate 1041 closest to the first side 101c of the substrate 101. Wherein a distance h3 in the range of 0.5mm to 5mm may mean that the distance h3 is greater than or equal to 0.5mm and less than or equal to 5mm. I.e. 0.5mm less than or equal to h3 is less than or equal to 5mm.

In fig. 1, the first side 101c of the substrate 101 is a side around which the connection portion of the trace 103 is connected. In fig. 3, a first side 101c of the substrate 101 is the side closest to the through hole.

Since the second end of the connection trace 103 needs to be disposed on the second surface 101b of the substrate 101 and climb along the second side 1041c of the substrate 1041, the distance between the first side 101c of the substrate 101 and the second side 1041c of the substrate 1041 is designed to be greater than or equal to 0.5mm, which can provide a buffer area for wiring for the connection trace 103, avoid the connection trace 103 climbing in a short distance range, and ensure the yield of the connection trace 103. In addition, the distance between the first side 101c of the substrate 101 and the second side 1041c of the substrate 1041 is less than or equal to 5mm, so that the resistance of the connection trace 103 is prevented from being too large due to too large distance, and the signal transmission effect is improved.

In addition, since the distance h3 between the first side 101c of the substrate 101 and the second side 1041c of the substrate 1041 is not a fixed value, the position of the first alignment opening K1 on the substrate 1041 is not a fixed position. Thus, before the first alignment opening K1 is designed on the substrate 1041, the distance h3 between the first side 101c of the fixed substrate 101 and the second side 1041c of the substrate 1041 may be determined, and then the specific position of the first alignment opening K1 may be designed on the premise that the first alignment opening K1 exposes the first alignment mark J1. Alternatively, the center of the first alignment mark J1 may be located in a central region of the orthographic projection of the first alignment opening K1 on the substrate 101.

In an embodiment of the present application, referring to fig. 9, before the bridge circuit structure 104 and the substrate 101 are bonded, a side of the bonding layer 1042 of the bridge circuit structure 104 away from the substrate 1041 may have a first protective film. The first protection film can play a role in bearing and protecting the adhesive layer 1042, so that foreign matters are prevented from being present on the adhesive layer 1042 before the bridge circuit structure 104 is adhered to the substrate 101, and the adhesive effect of the adhesive layer 1042 is ensured.

Alternatively, the thickness of the first protective film may be greater than 50 μm, so that the first protective film has a certain supporting performance, and the bearing effect on the adhesive layer 1042 is ensured. In addition, in order to ensure that the first protective film does not separate from the adhesive layer 1042 before the bridge circuit structure 104 and the substrate 101 are bonded, it is necessary to satisfy a condition that the adhesive force of the first protective film is greater than 5gf/25mm (grams force per millimeter). Meanwhile, the first protective film may be flush with the adhesive layer 1042, further avoiding the separation of the first protective layer and the adhesive layer 1042.

Referring to fig. 9, a side of the protective layer 1044 of the bridge circuit structure 104 remote from the substrate 1041 may have a second protective film. The second protective film may increase the stiffness of the bridge circuit structure 104 and reduce deformation when the bridge circuit structure 104 and the substrate 101 are bonded.

In the embodiment of the present application, the side surface of the bridge circuit structure 104 near the first side surface 101c of the substrate 101, the side surface of the first protection film and the side surface of the second protection film may be cut by a single cutting process. The side of the bridge circuit structure 104 near the first side 101c of the substrate 101 includes a side of the adhesive layer 1042 in addition to the second side 1041c of the substrate 1041.

Alternatively, referring to fig. 9, the side of the bridge circuit structure 104 near the first side 101c of the substrate 101, the side of the first protective film and the side of the second protective film may be perpendicular to the carrying surface of the substrate 1041. Or referring to fig. 10 and 11, an included angle α between a side of the bridge circuit structure 104 near the first side 101c of the substrate 101 and the third surface 1041a of the substrate 1041 is an acute angle, and an orthographic projection of the fourth surface 1041b of the substrate 1041 on the third surface 1041a of the substrate 1041 is located in the third surface 1041a of the substrate 1041.

Referring to fig. 10, when cutting the side of the bridge circuit structure 104 near the first side 101c of the substrate 101, only the side of the bridge circuit structure 104 near the first side 101c of the substrate 101 may be cut into a bevel so that its included angle is an acute angle. Or referring to fig. 11, when the side surface of the bridge circuit structure 104 adjacent to the first side surface 101c of the substrate 101 is cut, the side surface of the bridge circuit structure 104 adjacent to the first side surface 101c of the substrate 101 and the side surface of the first protective film may be cut into inclined surfaces so that the included angle thereof is an acute angle. Optionally, the included angle between the second side 1041c and the third surface 1041a ranges from 30 degrees to 75 degrees.

In the embodiment of the present application, the side of the bridge circuit structure 104 close to the first side 101c of the substrate 101 is an inclined plane, so that the second end of the connection trace 103 can climb on the inclined plane, and the yield of the connection trace 103 can be improved.

In addition, the substrate 1041 includes a flexible film layer. For example, the substrate 1041 is a single Polyimide (PI) film layer. Alternatively, as in fig. 2, the substrate 1041 includes a first flexible film layer, a buffer layer (barrier), and a second flexible film layer laminated in this order. For example, the substrate 1041 is a sandwich structure of a polyimide film layer, a buffer layer and a polyimide film layer, which is denoted as PI/barrier/PI.

Regardless of whether the substrate 1041 is a single PI film or a PI/barrier/PI sandwich structure, the thickness of the substrate 1041 may range from 10 μm to 30 μm. That is, the thickness of the substrate 1041 may be greater than or equal to 10 μm and less than or equal to 30 μm. In addition, the substrate 1041-based material includes PI, and thus the bridge circuit structure 104 may also be referred to as PI bridge.

With reference to fig. 12 to 15, the thickness of the substrate 1041 of the bridge circuit structure 104 provided by the embodiment of the present application is thinner than that of a common flexible circuit board (FPC), so that the embodiment of the present application can make climbing of the connection trace 103 easier by providing the bridge circuit structure 104, and no failure of breaking the connection trace 103 will occur, and the production yield is high.

Referring to fig. 15, the functional backplate 10 may further include a spacer structure 106 on a side of the second side 1041c of the substrate 1041 adjacent to the first side 101c of the substrate 101. The angle between the surface of the pad structure 106 adjacent to the first side 101c of the substrate 101 and the third surface 1041a of the substrate 1041 is smaller than the angle between the second side 1041c of the substrate 1041 and the third surface 1041a of the substrate 1041. That is, after the bridge circuit structure 104 is attached to the second surface 101b of the substrate 101, the second end of the connection trace 103 needs to climb a slope to connect with the bridge trace on the substrate 1041.

In fig. 12, the thickness of the flexible circuit board is thicker, the break difference is larger in the case of no pad layer structure, the yield of the connection trace climbing is lower, the thickness of the substrate 1041 is thinner in fig. 14, and the break difference is smaller in the case of no pad layer structure, so that the yield of the connection trace climbing is higher. If the above-mentioned scheme is modified, as shown in fig. 13 and 15, pad structures 106 are added to the ends of the flexible circuit board and the substrate 1041, where the second connection pads 108 are disposed, respectively, so that the climbing yield of the connection trace 103 can be improved.

Further, referring to fig. 16, when the pad structure 106 is not provided, the uniformity of the lines of the connection traces 103 is poor, the connection traces 103 may be stacked (where the line width is significantly increased) at the end of the substrate 1041 near the first side 101c, and the adjacent two connection traces 103 may be easily shorted. Referring to fig. 17, in the case where the pad structure 106 is provided, the wiring uniformity of the connection wiring 103 is good, and only slight line width variation occurs in the end portion of the substrate 1041 near the first side 101c of the connection wiring 103.

That is, for the climbing design, the buffer degree can be increased by setting the cushion layer structure 106, so that the climbing of the second end of the connecting wire 103 is more gentle, and the yield of the connecting wire 103 is further improved.

In an embodiment of the present application, referring to fig. 1,3 and 4, the functional back-plate 10 further includes a first connection pad 107 and a second connection pad 108. The first connection pad 107 is located on the first surface 101a of the substrate 101 and is used for connecting the first end of the connection trace 103 and the electronic component 102. The second connection pad 108 is located on the fourth surface 1041b of the substrate 1041 and is used for connecting the second end of the connection trace 103 and the first end of the bridging trace.

Referring to fig. 15, the pad structure 106 may be located not only on the second side 1041c of the substrate 1041, so that the connection trace 103 climbs on the second side 1041c of the substrate 1041, but also on the side of the second connection pad 108, so that the connection trace 103 climbs on the side of the second connection pad 108, thereby realizing signal transmission with the second connection pad 108. That is, the starting position and the ending position of the pad structure 106 are respectively located at two sides of the second side 1041c of the substrate 1041, and the climbing effect of the connecting trace 103 can be improved by designing the pad structure 106.

Optionally, the functional back board 10 includes a plurality of first connection pads 107 disposed at intervals in the second direction Y, and each first connection pad 107 is connected to a corresponding one of the connection traces 103. And, the functional back board includes a plurality of second connection pads 108 disposed at intervals in the second direction Y, and each second connection pad 108 is connected to a corresponding one of the connection traces 103 and a corresponding one of the bridging traces.

Optionally, the distance a between the second connection pad 108 and the second side 1041c of the substrate 1041 ranges from 100 μm to 0.5mm. A distance A in the range of 100 μm to 0.5mm may mean that the distance A is greater than or equal to 100 μm and less than or equal to 0.5mm, i.e., 100 μm≤A≤0.5 mm.

If the distance a is less than 100 μm, bridging traces in the wiring layer 1043 may be cut when cutting the side of the bridge circuit structure 104, affecting signal transmission. If the distance a is greater than 0.5mm, the printing path of the connection trace 103 on the substrate 1041 may be too long, affecting the resistance of the connection trace 103.

In an embodiment of the present application, the distance B between the second end of the bridging wire and the third side 1041d of the substrate 1041 (the third side 1041d is the surface of the substrate 1041 furthest from the first side 101 c) may range from 0mm to 20mm. A distance B in the range of 0mm to 20mm may mean that the distance B is greater than or equal to 0mm and less than or equal to 20mm, i.e., 0 mm≤B≤20 mm. It is understood that the distance B equal to 0 means that the second end of the bridging trace is located at the intersection of the fourth surface 1041B and the third side 1041d of the substrate 1041.

Alternatively, the distance C between the side of the second protective film near the third side 1041d of the substrate 1041 and the third side 1041d of the substrate 1041 ranges from 3mm to 10mm. A distance C in the range of 3mm to 10mm may mean that the distance C is greater than or equal to 3mm and less than or equal to 10mm, i.e., 3 mm≤C≤10 mm. By providing the second protective film beyond the third side 1041d of the substrate 1041, subsequent tearing of the second protective film can be facilitated.

Alternatively, the length E of the substrate 1041 in the second direction Y may be related to the length of the product, and the length F of the substrate 1041 in the first direction X may be related to the width of the product. By way of example, the length E of the substrate 1041 in the second direction Y satisfies 60 mm≤E≤200 mm. The length F of the substrate 1041 in the first direction X satisfies that F is 15 mm≤F is 60mm.

In the embodiment of the present application, a bridge portion is disposed between the first end and the second end of the bridge trace, and the bridge portion may be a bridge circuit formed on the substrate 1041 and is used to transmit the driving signal received from the second end to the first end.

As an alternative implementation manner, the material of the protective layer 1044 is an insulating material, and the protective layer 1044 is used for isolating water and oxygen, so as to avoid corrosion of products caused by the water and oxygen. In this case, referring to fig. 18 and 19, the protective layer 1044 may be a whole layer structure, and the orthographic projection of the protective layer 1044 on the substrate 1041 covers the orthographic projection of the bridging portion on the substrate 1041, so that the protective layer 1044 may protect the bridging portion. In addition, since the first end of the bridging wire needs to be connected to the second end of the connecting wire 103 through the second connection pad 108, the second end of the bridging wire needs to be connected to an external circuit structure, and therefore the first end and the second end of the bridging wire cannot be covered by an insulating material, otherwise, signal conduction cannot be achieved. That is, the orthographic projection of the guard layer 1044 on the substrate 1041 exposes orthographic projections of the first and second ends of the bridging trace on the substrate 1041.

Alternatively, the insulating material may be SiNx (silicon nitride), siOx (silicon oxide), a mixed material of SiNx and SiOx.

As another alternative implementation, the material of the protective layer 1044 is a conductive material, for example, the material of the protective layer 1044 is Indium Tin Oxide (ITO). In this case, in order to avoid the plurality of bridge traces from being shorted by the conductive protective layer 1044, referring to fig. 20 and 21, the protective layer 1044 includes a plurality of protective patterns 10441 disposed at intervals and corresponding to the plurality of bridge traces, and an orthographic projection of each protective pattern 10441 on the substrate 1041 covers an orthographic projection of a corresponding one of the bridge traces 10431 on the substrate 1041. In addition, since the material of the protection layer 1044 is a conductive material, even if the protection layer 1044 covers the first end and the second end of the bridging wire 10431, signal conduction is not affected.

In addition, as can be seen with reference to fig. 19 and 21, the bridge circuit structure 104 may further include a buffer layer between the substrate 1041 and the wiring layer 1043.

Referring to fig. 1 and 3, the functional back-plate 10 further comprises an encapsulation layer 109. The encapsulation layer 109 is located on a side of the plurality of electronic components 102 away from the substrate 101, and the encapsulation layer 109 may be used to encapsulate the plurality of electronic components 102 to avoid erosion of the electronic components 102 by water and oxygen.

The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments of the application only and is not intended to be limiting of the application. Unless defined otherwise, technical or scientific terms used in the embodiments of the present application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present application belongs.

The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments of the application only and is not intended to be limiting of the application. Unless defined otherwise, technical or scientific terms used in the embodiments of the present application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present application belongs. The terms "first," "second," "third," and the like in the description and in the claims, are not used for any order, quantity, or importance, but are used for distinguishing between different elements. Likewise, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, is intended to mean that elements or items that are present in front of "comprising" or "comprising" are included in the word "comprising" or "comprising", and equivalents thereof, without excluding other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to denote relative positional relationships, which may also change accordingly when the absolute position of the object to be described changes.

The foregoing description of the preferred embodiments of the present application is not intended to limit the application, but rather, the application is to be construed as limited to the appended claims.

Claims

A functional backplane, characterized in that the functional backplane comprises:

a substrate comprising a first surface and a second surface that are opposite to each other;

a plurality of connecting traces, wherein a first end of each connecting trace is located on the first surface of the substrate and connected to the electronic component, and a second end of each connecting trace is located on the second surface of the substrate;

And a bridge circuit structure, the bridge circuit structure includes a substrate, an adhesive layer, a circuit layer and a protective layer; wherein the substrate includes a third surface and a fourth surface relative to each other, the adhesive layer is located on the third surface of the substrate, and the adhesive layer is used to bond the substrate and the second surface of the base plate; the circuit layer is located on the fourth surface of the substrate, and the circuit layer includes a plurality of bridge traces corresponding to the plurality of connecting traces, the first end of each bridge trace is connected to the second end of a corresponding connecting trace, and the second end of the bridge trace is used to connect to an external circuit structure, and is used to transmit the driving signal provided by the external circuit structure to the electronic component through the connecting trace; the protective layer is located on the side of the circuit layer away from the substrate.

The functional backplane according to claim 1, wherein the second surface of the substrate has at least one first alignment mark, and the first alignment mark is used for structural alignment;

The substrate has at least one first alignment opening corresponding to the at least one first alignment mark, the orthographic projection of the first alignment opening on the substrate exposes the first alignment mark, and the orthographic projection of the first alignment opening on the substrate does not overlap with the orthographic projections of the multiple bridge traces on the substrate.

The functional backplane according to claim 2, wherein a distance h1 between an edge of the first alignment mark and an edge of an orthographic projection of the first alignment opening on the substrate is in a range of 20 μm to 1 mm;

The center of the first alignment mark is located in a middle area of an orthographic projection of the first alignment opening on the substrate.

The functional backplane according to claim 3, wherein the orthographic projection of the first alignment opening on the substrate is in the shape of a square, an ellipse, a circle, or a regular polygon.

The functional backplane according to claim 1, wherein the second surface of the substrate has at least one second alignment mark, and the second alignment mark is used for structural alignment;

The adhesive layer has at least one second alignment opening corresponding to the at least one second alignment mark, and the orthographic projection of the second alignment mark on the substrate is located within the orthographic projection of the second alignment opening on the substrate.

The functional backplane according to claim 1, wherein the adhesive layer has a plurality of strip-shaped exhaust grooves, the plurality of exhaust grooves including at least a first groove extending along a first direction and a second groove extending along a second direction, the first direction being the extending direction of the portion of the connecting trace located on the second surface, and the second direction intersecting the first direction;

The orthographic projections of the first groove and the second groove on the substrate are located on a side of the second end of the bridge trace away from the first end of the bridge trace.

The functional backplane according to claim 6, wherein the plurality of exhaust slots include a plurality of the first slots and one second slot, and the second direction is perpendicular to the first direction;

The plurality of first slots are farther away from the bridge trace than the second slot, the plurality of first slots are arranged at intervals in the second direction, and the first end of each first slot is connected to the second slot.

The functional backplane according to any one of claims 1 to 7, wherein the distance between the first side surface of the base plate and the second side surface of the substrate is in a range of 0.5 mm to 5 mm;

The first side of the substrate is the side closest to the connection between the first end of the connecting trace and the second end of the connecting trace, and the second side of the substrate is the side closest to the first side of the substrate.

The functional backplane according to claim 8 is characterized in that the angle between the second side surface and the third surface of the substrate is an acute angle, and the orthographic projection of the fourth surface of the substrate on the third surface of the substrate is located within the third surface of the substrate.

The functional backplane according to claim 9, wherein the angle between the second side surface and the third surface is in a range of 30 degrees to 75 degrees.

The functional backplane according to claim 8, characterized in that the functional backplane further comprises: a pad structure located on a side of the second side of the substrate close to the first side of the base plate;

An angle between a surface of the pad structure close to the first side of the substrate and the third surface of the substrate is smaller than an angle between the second side of the substrate and the third surface of the substrate.

The functional backplane according to claim 8, characterized in that the functional backplane further comprises: a first connection pad and a second connection pad;

The first connection pad is located on the first surface of the substrate and is used to connect the first end of the connection line and the electronic component;

The second connection pad is located on the fourth surface of the substrate and is used to connect the second end of the connecting trace and the first end of the bridge trace;

The distance h3 between the second connection pad and the second side surface of the substrate ranges from 100 micrometers to 0.5 millimeters.

The functional backplane according to any one of claims 1 to 7, wherein a bridging portion is provided between the first end and the second end of the bridging trace;

The material of the protective layer is an insulating material, the protective layer is a whole layer structure, and the orthographic projection of the protective layer on the substrate covers the orthographic projection of the bridge portion on the substrate, and exposes the orthographic projections of the first end and the second end of the bridge trace on the substrate; or,

The material of the protective layer is a conductive material, and the protective layer includes a plurality of protective patterns arranged at intervals and corresponding to the plurality of bridging traces. The orthographic projection of each of the protective patterns on the substrate covers the orthographic projection of a corresponding bridging trace on the substrate board.

The functional backplane according to any one of claims 1 to 7, wherein the substrate comprises a flexible film layer; or

The substrate includes a first flexible film layer, a buffer layer and a second flexible film layer stacked in sequence.

A light-emitting device, characterized in that the light-emitting device comprises: a power supply component and a functional backplane according to any one of claims 1 to 14;

Wherein, the power supply component is used to supply power to the functional backplane.