Background of invention
The assembling of electronic system refers to many electronic components be placed in a case with electromechanical element and be connected, and this case can protect this system not affected by environment, and for keeping in repair the inlet of providing convenience.The assembling of Three Estate is arranged usually about the electronic system that adopts semiconductor device: (1) is repaired semiconductor chip and is shaped and it is encapsulated in the chip carrier from guiding frame; (2) element with this chip carrier and other dispersion is placed on the wiring board, and is connected by the wiring of wiring board being carried out photo etching formation; (3) wiring board is inserted contact on the rear panel, and can connect power supply and whole assembly parts are packed into a casing, housing or case before a wiring board is connected with another wiring board.See James W.Dally, the assembling of electronic system, (McGraw-Hill publishing company: 1990), chapter 1.
Now developed the system that the assembling that makes preceding two grades realizes automation.Simultaneously, for adapting to industrial requirement, also introduced flexible subsystem for dissimilar, the size and the pitch of chip carrier.For example, dissimilar guiding frames and interchangeable mould are packed into the automatic package system that is used for semiconductor device assembling procedure so that the output of these systems be multiplied.
Yet, because the effective processing or the transmission of the output of automatic package system and the output from a grade to another grade do not match, bottleneck will appear at once.4 to 8 times of the first estate stack-mounted output increases of semiconductor group assembling system are much.Generally on efficient, can increase by 2 times and be used for assembling the system that sheds output from the first estate.The buffer zone (additional space) that operation aspect this do not match and need coordinate this difference.Be used for electronic system a package system often must suspend some working cycle so that the assembly crewman is manual from buffer zone unloading output and change pallet.Those skilled in the art should be known in that this pallet system is used for chip carrier is stored and be transported to next assembling grade from this assembling grade.This pause has reduced the efficient that the automation of electronic system assembling process obtains.
Be used for that the electronic system stack-mounted is exported discharged legacy system and have following two kinds: what (1) was single selects and placement machine, and (2) row formula pallet emptier.One selects and placement machine is one to have the primary mover of three degree of freedom, is used for selecting and placing and control electronic component and chip carrier.Single select and placement machine ties up to and adopts a feed belt or a loading bin or an x/y bench board in the existing package system is to load input or the output unloading realizes automation.Select and the head grabs electronic component of placement machine and in the switching process from the crawl position to the placement location with its maintenance.Most of heads adopt one or two movable pawl to grasp.In addition, vacuum cup then is used to the element that keeps lighter.Prior art select and the programming of placement machine simple and easy.As previously mentioned, select and placement machine makes output too slow when package system unloads.
Row's formula pallet emptier can once be picked out a plurality of elements.One row's formula emptier has two row arms identical with the chip carrier pallet length at least.Just like a bicycle step, row's arm is picked out a row or a row element from this single device, and another row's arm then is placed on a row or a row element on one pallet simultaneously.The major defect of row's formula pallet emptier is all to require independent row's arm to having with every type chip carrier of the different pitch size of pallet.Therefore, row's formula emptier can make output unload from the semiconductor package system when the pallet same pitch that has when chip carrier and place these chip carriers effectively.Otherwise row's formula emptier needs often to interrupt to change pallet.In addition, it also is very difficult aiming at for accurate placing element.
Preferred embodiment is described
Describe and a kind ofly automatically effectively semiconductor device is being carried out discharged method and apparatus in the molding environment.Done many specifying for for example bit format and programming step etc. in the following description, to provide for thorough understanding of the present invention.For those skilled in the art person, obviously can under the situation that does not need these details, be put into practice.And in other cases, some are then not shown as the well-known part relevant with the small pieces loading bench with guiding frame, in order to avoid make the present invention fuzzy.
Symbol and term
About the belt of suction apparatus of the present invention and select and place function control be described in detail machinery ground according to the data bit in the computer storage with algorithm and symbolic representation.These arthmetic statements and expression are that the personnel of acquaint with data process field pass to the method that other personnel of this field are adopted most effectively with their action.
Algorithm is envisioned for the independent order of the step that causes a required result here usually.These steps are the steps that need the manipulation of physical of physical quantity.These physical quantitys are common, even be not necessary, be take to be stored, transmit, the electrical or magnetic signal form of combination and other operation.In this case, physical quantity is and the signal correspondent voltage signal of speaking.Mainly for the reason of general applications, usually show with these signal indications for position, numerical value, unit, symbol, letter, term, numeral or and so on easily always.But should remember that all the physical quantity with suitable is relevant for all these or similar term, and only is the symbol easily that is applicable to this tittle.
The enforcement manipulation then often is meant and for example adds or compare terms that some mentality operations of being implemented by the operator usually like this are correlated with.This operator's ability not necessarily or does not preferably have.In most of the cases, in any operation of a described here formation part of the present invention, operation means machine operation.The useful machine that is used to implement operation of the present invention comprises general purpose digital computer or similar device such as digital signal processor.Under all these situations, be different between the method for operation that should remember to operate a computing machine and the method for calculating itself.The present invention relate to handle physical signalling with the process that produces other required physical signalling in computer method step of operation.
The invention still further relates to a kind of device that is used to implement these operations.This device can be built for required purpose in addition specially can comprise that maybe one starts or selectively by the general computer that is stored in the computer program recombinant in the computing machine.Here Biao Shi algorithm is not peculiarly to relate to any specific computing machine or other device.Specifically, can adopt the written program of instructing according to here on various universal machines, perhaps provable is that design specialized device such as digital signal processor are implemented required method step more easily.From following description will the desired structure of various these machines appear being used for.
System global structure
Figure 1A is the front elevation that is used for arranging from the prior art that the semiconductor device is selected and placed the mono-chip carrier with package system formula pallet emptier 1.This row's formula pallet emptier 1 has guided bearing 2 and 3, is used to stretch out at least two respectively on guide 5 and 8 and perpendicular row's arm 4 and 7.Each row's arm all has length and the storage tank size (see Figure 1B) identical with pallet 15.Row's arm 4 usefulness jaws 6 are picked out a row or a row chip carrier, and another row's arm 7 usefulness jaws 9 are placed a row or a row chip carrier simultaneously.An additional center position 11 (shown in dotted line) is arranged in Figure 1A, be used for any row's arm and berth in any interrupt procedure of changing pallet or emptier 1.
When guide 5 and 8 when the z axis normal moves, guided bearing 2 and 3 moves as horizontal cross at the y axis direction along guide rail 12 and 13 respectively.Figure 1B is the birds-eye view of the formula of row shown in Figure 1A pallet emptier.As shown in the figure, row's arm 4 was picked out the one chip carrier from an independent instrument 10 before guide rail 13 parallel motions at this arm, and this chip carrier is put into a pallet 16 at buffer zone 15.From the output of independent instrument 10 be discharged into one on a feed belt 18 unloading pallet 16,17 and 19 system.
The major defect of row's formula pallet emptier is that it all needs independent row's arm for having with every kind of product of the different pitches of pallet.Therefore, row's formula emptier is effective to the output unloading from the semiconductor group assembling system when product has the pitch identical with the pallet of placing these products.Otherwise the operation of prior art row formula emptier will often be interrupted to change pallet.And, because guided bearing 2 and 3 distances of advancing along guide rail 12 and 13 are very big, be difficult to carry out the aligning that carries out for accurate placing element.The deviation of semiconductor chip being put into pallet can be very big.If to the given very little tolerance in storage tank zone of pallet, then these will hinder from the unloading of any package system output in the deviation aspect the placement semiconductor chip.In addition, the buffer area of row's formula emptier is very big, and the flexibility that unloading is flowed certainly will be restricted.Therefore, row's formula emptier of prior art does not overcome the mismatch aspect capacity rating between package system and the uninstalling system.
Preferred embodiment
Fig. 2 is the birds-eye view of the preferred embodiment of the present invention that combines with a package system that is used for semiconductor device.Of the present invention select and place system 30 comprises a sliding part 32, at least one selects actuating device 34 and at least one places actuating device 36, a plurality of rollers 38, and at least one belt 40.Belt 40 can be one to be suitable for chain or the belt around roller 38 circumference.Roller is the flywheel shape, and the toe joint on its circumference is subjected to and this belt of continuous drive or chain.Roller 38 also plays shock damping action to any vibration in the belt 40.Sliding part 32 has at its both ends and is used for the idling roller 42 and 44 that engages with belt 40.As roller 38, idling roller 42 and 44 is for being used to accept the flywheel with driving belt 40.Sliding part 32 further is configured in the guide 46, and this guide is used for sliding part moved along the longitudinal axis of this sliding part and leads.Adopt roller 38 so that the sensing of the belt 40 that moves at sliding part 32 opposite sides is parallel to each other.As shown in Figure 2, roller 38 not can be same size.
As shown in Figure 2, combine with a package system and a uninstalling system of the present invention select and spaces that place system 30 is shared for minimum.This package system is depicted as one and accepts an independent instrument 48 of guiding frame 50 with chip carrier 52 of a plurality of encapsulation.This uninstalling system by one on the feed belt (not shown) that moves along the direction of arrow shown in Figure 2 pallet 65 and 70 system diagram.The separate unit of one prior art is selected and placement machine 54 is used for to unloading to the output of selecting position 58 from independent instrument 48 by optional.As shown in Figure 5, the present invention can directly pick out one chip carrier 55 from independent instrument 48.
Still with reference to Fig. 2, a plurality of suction cups 60 are fixed on predetermined space on the belt 40, not only are used to select, and are used to place output 50 from any independent instrument 48. Actuating device 34 and 36 driving belts also make suction cup move to placement location 68 from selecting position 58.In preferred embodiment of the present invention, selecting the position is the belt position of accepting from the output of independent instrument 48.As shown in Figure 5.Among the figure, suction cup 60 is the system synchronization of selecting by by hydraulic pressure of exporting from independent instrument 48 or air pressure chip carrier.Placement location 68 is the belt part in the face of empty pallet 65.Actuating device 34 and 36 can be different mutually speed rotate: for example actuating device 34 can then rotate with a predetermined speed by static actuating device 36.The difference of the output of two actuating devices is compensated by the slip of sliding part 32 in sliding guide piece 46 certainly.
Obviously, being used for temporary transient the preservation from the buffer area of the next output of independent instrument has been eliminated.And belt 40 of the present invention has enough flexibilities to select and to place the different size shown in Fig. 6 A to 6C and the chip carrier of structure.For undersized chip carrier 55 and middle-sized chip carrier 75, each suction cup on the belt 40 all can be selected one and be placed on the appropriate position of system.Refer again to Fig. 6 C, the present invention can by the suction cup at the interval on the belt 40 select and place large-sized chip carrier 85 for example have more than 400 lead-in wires pin grid configuration (Pin Grid Arrays) (PGA) or net lattice configuration (Ball GridArrays) (BGA).When being centered around roller 38, idling roller 42 and 44 and when being installed in the circular circumference of the flywheel on actuating device 34 and 36, various chip carriers be selected and be placed to belt 40 and the suction cup of being adorned 60 can with the alignment error of minimum.For example, in Fig. 7, belt of the present invention and suction cup assembly at high speed and high precision are around the flywheel of roller and actuating device.Simultaneously, this suction cup is at a high speed by selecting position and placement location.
Though Fig. 2 has described preferred embodiment of the present invention, also can adopt other shown in Fig. 3 A, 3B and 3C respectively to select and the layout of place system.Fig. 3 A shows a kind of layout 80 of selecting and place, wherein, and the axis between two actuating devices 84 and 86 and the axis and the out of plumb of sliding part 82.But note, still keep being parallel to each other in the belt part of sliding part 82 each side shifting.Fig. 3 B illustrates and is used to select and another layout 110 of place system, and this layout adopts the principle identical with the present invention, but selects position and placement location and mis-aligned.At last, Fig. 3 C illustrates and is used for selecting and another layout 132 of place system according to the present invention, wherein, selects actuating device 134 and places actuating device 136 and be arranged to close mutually.
Fig. 4 A and 4B are used to implement the diagram of circuit of selecting a kind of possible logic control of driving of the present invention of Fig. 2 for expression.In step 140, logic control of the present invention begins, and the belt pitch is compared with the pallet pitch in the step 142.If the belt pitch greater than the pallet pitch, is then selected and put procedure finishes in step 144.Otherwise, this logic control enter step 146 with check the pallet pitch be greater than or equal the framework pitch.If be that then this process does not finish in step 144.If really more than or equal to the framework pitch, then meaning, the pallet pitch selects and place system can be worked in parameter area of the present invention.This process control checks that whether the sliding part bar arrives an extreme position is the end then.As for being that then this process finishes in step 144 equally.Otherwise this process enters step 152 to determine that whether guiding frame is more than a row.If guiding frame has many rows, then this process control enters to 216 from step 190.For the simple scenario of guiding frame that has only a row, this process continues in step 156, wherein select drive mobile belt and at a locational suction cup so that the output that comes from independent machine is selected.In step 158, first suction cup is selected a plug-in unit from the buffering storage tank subsequently, and next then suction cup is selected next element, and is processed until whole guiding frame.Then, select driving and in step 160, move a belt pitch.At this joint, buffer reservoir is filled in step 162.Process control checks in step 164 whether any gap is arranged in the plug-in unit then.If have, represent that then guiding frame uses up, process is suspended a circulation with another guiding frame of packing into.Otherwise just repeat respectively from the process of selecting plug-in unit of step 156 to 164.
Fig. 4 B illustrates the process control that is used to select the guiding frame with many sockets part.In step 168, select and drive 34 belt and suction cup moved to one first buffer reservoir.Then, in step 170, select the mobile belt pitch of driving and deduct a buffering pitch, supply actual selecting with the guiding suction cup.In step 172, whether the systems inspection buffer zone is unloaded then.If then process repeats to be used for the adjusting of buffer empty in step 170 self.Otherwise separate unit is selected and filling machine is filled buffer zone with the plug-in unit that need be selected in step 174.In case fill area is full of, then selects driving and in step 176, plug-in unit is selected by a particular order.This process checks in step 178 whether buffer zone is unloaded.In other words, whether this systems inspection first row is selected.As being to deny, then this process continues to select more plug-in unit.As for being, selecting then and drive mobile belt and suction cup is in a ratio of next row that opposite order begins to select with step 176.This process checks once more in step 182 whether row then selects.As for not, then select to drive and continue to select element.Otherwise separate unit is selected and filling machine is filled buffer zone with plug-in unit in step 184.Then, selecting driving moves a belt pitch with belt and suction cup and adds a buffering pitch in step 186.At last, this process checks in step 188 whether whole guiding frame is selected.As for being that then this process continues to select next guiding frame, shown in step 168.As being not, then process self repeats in step 186.
Fig. 4 C is used to implement the diagram of circuit of the placement of the present invention of Fig. 2 drives a possible logic control for expression.This process begins in step 190, and wherein whether this systems inspection pallet is filled.As for being, then placing to drive and stop a circulation and need the pallet that be located for the next one.As being not, check then whether the sliding part bar has arrived any extreme position in step 192.As for being, then this process stops to select in step 198 and drives and make the sliding part bar reverse.Otherwise, place driving and in step 200, belt and the suction cup that has plug-in unit moved to the first pallet storage tank.Then, the placement driving is moved a belt pitch with belt with the suction cup that has plug-in unit and is added a pallet pitch in step 202.This process checks in step 204 whether last storage tank reaches in the pallet row.As being to deny, then repeating step 202.Otherwise this process moves forward pallet a pitch in step 206.Then, place to drive with belt with the suction cup of plug-in unit and move past belt pitches of last storage tank of adjacent pallet row.In step 210, the placement driving is unclamped suction cup and interposer lies is gone in the storage tank of pallet then.This process moves a belt pitch in step 212, and checks in step 214 whether the end of pallet row arrives.As being to deny, then repeating step 210 to 212.Yet if the end of these row arrives, this process checks in step 216 whether the pallet end arrives.As for being, then this process is suspended a circulation to allow to change pallet.Otherwise repeating step 206 to 214.
Though made specific descriptions referring to figs. 1 through 7 couples of the present invention, and focused on and be used for carrying out discharged apparatus and method from the output of a finishing and the package system of shaping machine environment, should understand these accompanying drawings only should be as limitation of the invention for illustrating.In addition, apparatus and method of the present invention can be used for many general and effective discharged application scenarios that require.The general personnel that are familiar with this area can carry out many variations and modification, and these variations and modification do not break away from spirit and scope of the invention.