CN120394303A - Wafer coating equipment, wafer double-sided coating method and wafer coating system - Google Patents
Wafer coating equipment, wafer double-sided coating method and wafer coating systemInfo
- Publication number
- CN120394303A CN120394303A CN202510344139.6A CN202510344139A CN120394303A CN 120394303 A CN120394303 A CN 120394303A CN 202510344139 A CN202510344139 A CN 202510344139A CN 120394303 A CN120394303 A CN 120394303A
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- China
- Prior art keywords
- wafer
- glue
- spin
- coating
- spin coating
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
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- H10P72/0448—
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- H10P72/3202—
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- H10P72/70—
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- H10P72/7626—
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- H10P72/78—
Landscapes
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the application provides wafer spin coating equipment, a wafer double-sided spin coating method and a wafer spin coating system, wherein the wafer spin coating equipment comprises a spin coating sucker, a vacuum adsorption pipeline, an air supply pipeline and a carrier, the spin coating sucker is provided with a plurality of air holes and used for bearing a wafer to be spin coated, the vacuum adsorption pipeline is connected with the spin coating sucker, when the first surface of the wafer is spin coated, the vacuum adsorption pipeline is used for carrying the second surface of the wafer through the air holes, and releasing the second surface after the spin coating of the first surface is finished, so that the wafer can be turned over to the second surface to deviate from the spin coating sucker, the air supply pipeline is connected with the spin coating sucker, when the second surface is spin coated, the air supply pipeline is used for providing air flow for the first surface through the air holes so as to form an air layer between the spin coating sucker and the first surface, the air layer can support the wafer in a suspension state so that the first surface and the spin coating sucker keep a non-contact state, and the carrier is used for bearing the spin coating sucker, and the spin coating sucker is configured to be capable of rotating relative to the carrier.
Description
Technical Field
The embodiment of the application relates to the technical field of semiconductor manufacturing, in particular to wafer spin coating equipment, a wafer double-sided spin coating method and a wafer spin coating system.
Background
Wafer spin is a critical step in the semiconductor manufacturing process, which directly affects the quality and stability of subsequent processes. Conventional wafer spin coating equipment typically only performs spin coating on one side of the wafer, and in certain applications, spin coating on both sides of the wafer is required. However, the existing double-sided spin coating technology has the problems of complex operation, unstable spin coating quality and the like, so that an apparatus and a method capable of efficiently and stably performing double-sided spin coating on a wafer are needed.
Disclosure of Invention
The application aims to provide wafer spin coating equipment, a wafer double-sided spin coating method and a novel technical scheme of a wafer spin coating system.
In a first aspect, an embodiment of the present application provides a wafer spin coating apparatus. The wafer spin coating equipment comprises:
the spin chuck is provided with a plurality of air holes and is used for bearing wafers to be spin-coated;
The vacuum adsorption pipeline is connected with the spin chuck, and is used for vacuum adsorption of the second surface of the wafer through the air holes when the first surface of the wafer is spin-coated, and releasing the second surface after the spin coating of the first surface is finished, so that the wafer can be turned over to the second surface to deviate from the spin chuck;
the air supply pipeline is connected with the spin chuck and is used for providing air flow for the first surface through the air holes when the second surface is spin-coated so as to form an air layer between the spin chuck and the first surface, and the air layer can support the wafer in a suspension state so as to keep the first surface and the spin chuck in a non-contact state;
And the carrier is used for bearing the spin chuck, and the spin chuck is configured to be rotatable relative to the carrier.
Optionally, the wafer spin coating device further includes a plurality of clamping portions, and each clamping portion is connected to the spin coating chuck through a driving bracket;
The driving bracket includes:
A first rod part with one end connected with the side part of the spin chuck and capable of moving in the horizontal direction to adjust the position of the clamping part in the horizontal direction so as to adapt to wafers with different sizes, and
And one end of the second rod part is connected with the other end of the first rod part, and the other end of the second rod part is connected with the clamping part and can move in the vertical direction so as to adjust the height of the clamping part in the vertical direction.
Optionally, when the second surface of the wafer is subjected to spin coating, the second rod portion is used for driving the clamping portion to move in a vertical direction to be close to the wafer, and the first rod portion is used for driving the clamping portion to move in a horizontal direction to be close to the wafer, so that the clamping portion can clamp the wafer from the peripheral side of the wafer.
Optionally, after the second surface of the wafer is uniformly coated, the first rod portion and the second rod portion respectively drive the clamping portion to be away from the wafer in a horizontal direction and a vertical direction, so that the clamping portion releases the wafer.
Optionally, the plurality of air holes extend from the surface of the spin chuck to the interior thereof for providing air flow during spin.
Optionally, the plurality of air holes comprise a plurality of fixed air holes fixedly arranged on the spin chuck and a plurality of movable air holes arranged around the periphery of the fixed air holes;
The air outlet angle of the movable air hole can be adjusted relative to the spin chuck or the fixed air hole, and the air outlet direction of the movable air hole can be controlled by adjusting the air outlet angle, so that the wafer is ensured to have no position offset when suspended above the spin chuck.
Optionally, one end of the air supply pipeline is connected with a plurality of air holes on the spin chuck, the other end of the air supply pipeline is connected with a nitrogen source, and the air supply pipeline is provided with a flow control valve for regulating and controlling the supply flow of nitrogen.
Optionally, a vacuum pump is arranged on the vacuum adsorption pipeline, and the vacuum adsorption pipeline is communicated with a plurality of air holes on the spin chuck.
Optionally, the wafer spin coating device further includes a glue dropping pipeline, where the glue dropping pipeline is located above the spin coating chuck and is configured to provide glue to the center position of the first surface or the second surface turned over after the spin coating of the first surface is completed when the wafer is spin coated.
Optionally, the carrier is provided with a rotation driving device, and the rotation driving device is connected with the spin chuck to drive the spin chuck to rotate;
After the wafer is placed on the spin chuck and glue is dripped, the spin chuck is driven to rotate by the rotary driving device, and the generated centrifugal force is utilized to enable the glue to be uniformly coated on the first surface or the second surface of the wafer.
In a second aspect, an embodiment of the application provides a wafer double-sided spin coating method. The wafer double-sided spin coating method comprises the following steps:
Placing a wafer to be spin-coated on the surface of a spin-coating chuck in a way that the first surface of the wafer faces upwards, and vacuum-adsorbing and fixing the second surface of the wafer through a vacuum adsorption pipeline and a plurality of air holes on the spin-coating chuck;
Dispensing glue on the first surface of the wafer, and uniformly distributing the glue on the first surface through rotation of the glue homogenizing suction disc to finish glue homogenizing of the first surface;
releasing the wafer adsorbed by vacuum, and turning over the wafer to enable the second surface of the wafer to face upwards;
Providing air flow for the spin chuck through an air supply pipeline, and injecting the air flow from air holes of the spin chuck, so that the wafer is suspended above the surface of the spin chuck under the action of the air flow, and the first surface of the spin chuck and the spin chuck keep a non-contact state;
And (3) glue is dripped on the second surface, and the glue is uniformly distributed on the second surface through the rotation of the glue homogenizing sucker, so that the double-sided glue homogenizing of the wafer is completed.
Optionally, the double-sided spin coating method of the wafer further includes:
After the wafer is turned over to enable the second surface to face upwards, the air outlet angle of the movable air hole on the spin chuck is adjusted, so that the wafer can stably suspend above the surface of the spin chuck under the action of air flow, the center of the wafer is ensured to be aligned with the center of the spin chuck, and therefore position deviation cannot occur in the spin process on the second surface.
Optionally, the double-sided spin coating method of the wafer further includes:
in the process of carrying out spin coating on the second surface of the wafer, the clamping part connected with the spin coating chuck is driven to move by the driving support so as to clamp the wafer suspended above the surface of the spin coating chuck.
Optionally, the double-sided spin coating method of the wafer further includes:
and after the spin on the second surface is completed, driving the clamping part to release the wafer through the driving bracket.
In a third aspect, an embodiment of the present application provides a wafer spin coating system. The wafer spin coating system comprises:
The wafer spin apparatus of the first aspect;
the first manipulator is used for placing the wafer on the spin chuck in a way that the first surface faces upwards;
The second manipulator is used for overturning the wafer after the first surface of the wafer is subjected to glue homogenizing, so that the second surface of the wafer faces upwards, and glue homogenizing of the second surface is performed;
the third manipulator is used for taking the wafer clamped or released by the clamping part from the position of the wafer after the second surface glue homogenizing is completed;
and the control system is used for controlling the vacuum adsorption pipeline, the air supply pipeline, the spin chuck and the driving support in the wafer spin equipment.
Optionally, the wafer spin coating system further comprises a sensor, wherein the sensor is used for detecting the position information of the wafer when the wafer is turned over to the second surface upwards and is suspended above the spin coating surface, and the control system controls the adjusting mechanism to adjust the air hole angle of the movable air hole on the spin coating sucker according to the position information fed back by the sensor.
The beneficial effects of the application are as follows:
The wafer spin coating equipment provided by the embodiment of the application aims to optimize the process of wafer double-sided spin coating. The wafer spin coater realizes non-contact operation of double-sided spin coating of the wafer by designing the spin chuck and the matched vacuum adsorption pipeline and air supply pipeline. The core of the design is that the device avoids pollution and structural damage possibly generated in the traditional double-sided spin coating process. In the conventional double-sided spin coating process, since the wafer needs to be coated on both sides, when the wafer is turned over, one side of the coated wafer may contact with the spin chuck, resulting in glue contamination or wafer structural damage. The equipment of the application effectively solves the problem through non-contact operation, and remarkably improves the production efficiency and yield of products.
In addition, the wafer spin coating equipment not only supports single-sided spin coating of the wafer, but also is compatible with double-sided spin coating, and has extremely high flexibility and adaptability. This means that the equipment can meet the requirements of single-sided spin coating or double-sided spin coating, thereby improving the utilization rate and application range of the equipment.
Other features of the present specification and its advantages will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the specification and together with the description, serve to explain the principles of the specification.
Fig. 1 is a side view of a wafer spin coater according to an embodiment of the present application;
fig. 2 is a top view of a wafer spin coater according to an embodiment of the present application;
FIG. 3 is a flow chart of a single-sided spin coating of a wafer according to an embodiment of the present application;
Fig. 4 and fig. 5 are flowcharts of a wafer double-sided adhesive tape according to an embodiment of the present application.
Reference numerals illustrate:
1. the device comprises a spin chuck, 2, an air hole, 21, a fixed air hole, 22, a movable air hole, 3, a vacuum adsorption pipeline, 4, an air supply pipeline, 5, a carrying platform, 6, a clamping part, 7, a driving bracket, 71, a first rod part, 72, a second rod part, 8, a glue dropping pipeline, 01, a wafer, a first surface, a second surface and a second surface.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application, its application, or uses.
Techniques and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
The wafer spin coating apparatus, the wafer double-sided spin coating method and the wafer spin coating system according to the embodiments of the present application are described in detail below with reference to the accompanying drawings.
According to one embodiment of the application, referring to fig. 1 and 2, a wafer spin coater is provided, the wafer spin coater comprises a spin chuck 1, a vacuum adsorption pipeline 3, an air supply pipeline 4 and a carrier 5, wherein the spin chuck 1 is provided with a plurality of air holes 2 for carrying a wafer 01 to be spin-coated, the vacuum adsorption pipeline 3 is connected with the spin chuck 1, when a first surface A of the wafer 01 is spin-coated, the vacuum adsorption pipeline is used for vacuum adsorption of a second surface B of the wafer 01 through the air holes 2, and after the spin coating of the first surface A is finished, the second surface B is released, so that the wafer 01 can be turned over to the second surface B to deviate from the spin chuck 1, the air supply pipeline 4 is connected with the spin chuck 1, when the second surface B is spin-coated, the air holes 2 are used for providing air flow to the first surface A so as to form a gas layer between the spin chuck 1 and the first surface A, the gas layer can support the wafer 01 in a suspended state, and the carrier 5 can be kept in a non-spin-coated state relative to the spin chuck 1.
The wafer spin coating device provided by the embodiment of the application can be applied to the field of semiconductor manufacturing, and is particularly used for realizing the uniform spin coating of one side or two sides of a wafer in the wafer processing process.
The wafer spin coating equipment provided by the embodiment of the application has the following description of main components.
The wafer spin coating equipment provided by the embodiment of the application comprises a spin coating chuck 1, and referring to fig. 1 and 2, the spin coating chuck 1 is provided with a plurality of air holes 2, and the air holes 2 play a key role in the process of spin coating the wafer 01 to be spin coated. Specifically:
Firstly, the plurality of air holes 2 on the spin chuck 1 can be used for carrying the wafer 01 to be spin-coated, and ensuring the stability and position accuracy of the wafer 01 in the spin-coating process.
Furthermore, by the design of the air holes 2, the non-contact operation between the wafer 01 to be homogenized and the homogenizing suction cup 1 is realized. For example, referring to fig. 4 (h) to (j) and fig. 5, when the second surface B of the wafer 01 to be spin-coated is spin-coated, the air supply line 4 supplies air flow to the spin-coated first surface a through the plurality of air holes 2 on the spin chuck 1, so that an air layer is formed to support the wafer 01 in a suspended state without contacting the spin chuck 1. The design not only effectively protects the cleanliness of the spin-coating environment and avoids the pollution possibly brought by the direct contact of the first surface A of the wafer 01 subjected to spin coating and the spin coating suction cup 1, but also reduces the abrasion of the spin coating suction cup 1 and prolongs the service life of equipment. In short, the design of the application avoids the pollution and structural damage possibly caused by the direct contact between the wafer 01 to be spin-coated and the spin chuck 1 in the traditional spin coating process.
In the wafer spin coating apparatus provided in the embodiment of the present application, the spin chuck 1 is configured to rotate relative to the carrier 5, so that the spin coating process is more uniform, and the spin coating quality of the wafer is improved.
When the spin chuck 1 rotates relative to the carrier 5, the wafer 01 rotates together with the spin chuck 1. This rotational movement causes the glue dripping on the surface of the wafer 01 to be more uniformly distributed on the surface (i.e. the first surface a or the second surface B) of the wafer 01 under the action of centrifugal force.
During the rotation of the spin chuck 1 with the wafer 01, referring to fig. 3 (c), the glue in the center of the first surface a of the wafer 01 is continuously subjected to the airflow shearing force from the edge of the spin chuck 1, which helps to further refine the glue particles to make the distribution more uniform, so that a glue layer can be formed on the first surface a of the wafer 01, referring to fig. 3 (d). This achieves a spin coating operation on one side of the wafer. The rotary design in the application ensures that the glue can be uniformly coated on the surface of the wafer in an optimal manner so as to meet specific process requirements.
In addition, by controlling the rotation parameters, glue layers with different thicknesses and uniformity can be realized, so that the specific requirements of the subsequent process steps are met.
The wafer spin coating equipment provided by the embodiment of the application comprises a vacuum adsorption pipeline 3, and referring to fig. 1 and 3-5, the vacuum adsorption pipeline 3 is connected with the spin coating chuck 1, and is used for carrying out vacuum adsorption fixation on the second surface B of the wafer 01 through a plurality of air holes 2 on the spin coating chuck 1 when the first surface A of the wafer 01 to be spin coated is spin coated. In this way, the wafer 01 to be spin-coated can be fixed on the surface of the spin chuck 1 with the first surface a facing up and the second surface B facing down, see fig. 3 (B) or fig. 4 (B).
After the spin of the first surface a of the wafer 01 to be spin-coated is completed, the vacuum adsorption pipeline 3 releases the vacuum adsorption effect on the second surface B, so that the wafer 01 can be turned over to a state that the second surface B faces upward and the first surface a faces downward, that is, the second surface B of the wafer 01 to be spin-coated faces away from the spin chuck 1, please refer to (h) in fig. 4, so that the subsequent glue coating operation on the second surface B is facilitated.
The vacuum adsorption effect of the vacuum adsorption pipeline 3 ensures the position stability of the wafer 01 to be homogenized in the homogenizing process, and prevents the wafer 01 from falling off or shifting in the rotating or overturning process.
In addition, in the design of the wafer spin coater provided by the application, the wafer 01 to be spin coated can be fixed and turned over by controlling the opening state and the closing state of the vacuum adsorption pipeline 3. The design greatly promotes the convenience of the double-sided spin coating operation of the wafer.
Specifically, after the first surface a of the wafer 01 to be spin-coated is spin-coated, the vacuum adsorption pipeline 3 releases the vacuum adsorption force to the second surface B of the wafer 01 in time, so that the spin-coated wafer 01 can be stably turned over, and spin-coating treatment of the second surface B is facilitated.
In the process of double-sided spin coating, various flexible implementation modes are provided for the overturning operation of the wafer. One way is to use manual flipping, i.e., an operator can physically flip the wafer directly. Another more efficient way is to use automated mechanical structures, such as precision robots, to perform the wafer flipping operation. The manipulator can accurately grasp, overturn and reposition the wafer, so that the overturning precision and stability are improved, and the overall production efficiency prospect of double-sided glue homogenizing is remarkably improved. The design ensures high-quality completion of the wafer double-sided spin coating, and meets the requirements of different production scales and automation degrees.
The wafer spin coating device provided by the embodiment of the application comprises the vacuum adsorption pipeline 3 and the air supply pipeline 4. Referring to fig. 1, the air supply pipeline 4 is connected with the spin chuck 1.
In the wafer spin coater provided by the embodiment of the application, the design of the air supply pipeline 4 realizes non-contact operation between the wafer 01 to be spin-coated and the spin chuck 1. The design not only improves the cleanliness of the spin coating process, but also effectively avoids pollution and structural damage possibly caused by direct contact between the wafer 01 to be spin coated and the spin coating chuck 1.
The air supply pipeline 4 is connected with the spin chuck 1, and has the function of providing stable air flow (such as nitrogen) for the first surface A of the wafer 01 through a plurality of air holes 2 on the spin chuck 1 when the second surface B of the wafer 01 is spin-coated. This air flow forms a very thin air layer between the wafer 01 to be spin-coated and the spin chuck 1, which plays a key supporting role, so that the wafer 01 to be spin-coated can be kept in a suspended state without contacting the surface of the spin chuck 1, see (h) in fig. 4, and thus the first surface a of the spin-coated is not damaged or damaged.
In the conventional spin coating process, the direct contact between the wafer 01 to be spin coated and the chuck may cause problems such as glue residue and particle contamination. The design of the air supply pipeline 4 completely isolates the physical contact between the wafer and the sucker through the sprayed air flow, thereby effectively avoiding the pollution problems.
In addition, the wafer needs to bear certain centrifugal force and friction force in the spin coating process. These forces may cause damage to the wafer surface such as micro scratches, structural deformations, etc. if the wafer is in direct contact with the chuck. The non-contact operation provided by the gas supply line 4 of the present application avoids these potential risks of damage, protecting the integrity of the wafer.
By adopting the design of the application, as the wafer 01 to be homogenized is not in physical contact with the homogenizing suction cup 1, the glue can be more uniformly distributed, the defect formation is reduced, and a flatter and uniform glue layer can be obtained on the surface of the wafer.
The wafer spin coating device provided by the embodiment of the application further comprises a carrier 5, and referring to fig. 1, the carrier 5 is used for carrying the spin coating chuck 1 and providing stable support for the spin coating chuck.
The carrier 5 is designed such that the spin chuck 1 can rotate relative to the spin chuck, thereby meeting the rotation requirement of the wafer during spin.
The wafer spin coating equipment provided by the embodiment of the application has the following technical effects:
First, realized the high efficiency and the accurate of the two-sided even glue of wafer:
According to the wafer spin coating equipment, through the design of the spin coating sucker 1 and the cooperation of the vacuum adsorption pipeline 3 and the air supply pipeline 4, non-contact operation in the wafer double-sided spin coating process is realized. When the first surface a of the wafer 01 to be spin-coated is spin-coated, the vacuum adsorption pipeline 3 performs vacuum adsorption on the second surface B of the wafer through the air holes 2, so as to ensure that the wafer 01 is stably fixed on the spin-coating chuck 1. And when the spin coating of the first surface A is completed, vacuum adsorption is released, and the wafer 01 can be turned over and then the spin coating of the second surface B is performed. Meanwhile, the non-contact operation avoids direct contact between the first surface A of the wafer subjected to spin coating and the spin coating suction disc in the traditional double-sided spin coating process, reduces the possibility of pollution and structural damage, and improves the precision of spin coating.
Secondly, the compatibility and flexibility of the equipment are enhanced;
The wafer spin coating equipment not only supports single-sided spin coating of the wafer, but also is compatible with double-sided spin coating of the wafer. This feature allows the wafer spin coating apparatus to exhibit extremely high flexibility and adaptability in coping with diverse production tasks.
Thirdly, the spin coating environment is protected, and the service life of equipment is prolonged;
When the second surface B of the wafer 01 to be spin-coated is spin-coated, the air supply pipeline 4 supplies air flow to the first surface a of the wafer 01 through the plurality of air holes 2, and the formed air layer can support the wafer 01 in a suspended state. The design not only effectively avoids the direct contact between the wafer 01 and the spin chuck 1, protects the cleanliness of the spin environment, but also reduces the abrasion of the spin chuck. In the long term, this helps to extend the service life of the equipment and reduce maintenance costs.
The wafer spin coating equipment provided by the embodiment of the application provides a new solution for the field of wafer manufacturing through the cooperative work of the main components.
In some examples of the present application, referring to fig. 1 and 2, the wafer spin coating apparatus further includes a plurality of clamping parts 6, each of the clamping parts 6 is connected to the spin chuck 1 through a driving bracket 7, the driving bracket 7 includes a first rod part 71 and a second rod part 72, wherein one end of the first rod part 71 is connected to a side of the spin chuck 1 and is movable in a horizontal direction to adjust positions of the clamping parts 6 in the horizontal direction to adapt to wafers 01 of different sizes, one end of the second rod part 72 is connected to the other end of the first rod part 71, and the other end of the second rod part 72 is connected to the clamping part 6 and is movable in a vertical direction to adjust heights of the clamping parts 6 in the vertical direction.
In this example of the application, the wafer spin machine incorporates a design of the clamping portion 6 and its drive support 7, which is aimed at improving the flexibility and adaptability of the wafer double-sided spin.
Referring to fig. 1, fig. 4 (j) and fig. 5 (k) - (l), the main function of the clamping portion 6 is to clamp the wafer 01, so as to ensure that the wafer 01 can be stably and accurately positioned above the spin chuck 1 during the spin process on the second surface B of the wafer 01, and the first surface a (the spin surface) of the wafer 01 and the spin chuck 1 remain in a non-contact state.
Referring to fig. 1, the driving bracket 7 is mainly composed of a first rod portion 71 and a second rod portion 72, which cooperate to realize movement of the attached clamping portion 6 in the horizontal and vertical directions.
The first and second rod portions 71 and 72 are described below, respectively.
Referring to fig. 1, one end of the first rod portion 71 is connected to a side portion of the spin chuck 1, which is capable of moving in a horizontal direction. This mobility allows the distance or the clamping range between the clamping portions 6 to be adjusted, so that wafers 01 to be spin-coated with different sizes can be adaptively clamped. The design increases the universality and the flexibility of the whole wafer spin coating equipment.
The first lever portion 71 is movable in the horizontal direction, for example, meaning that the first lever portion 71 can be elongated or shortened in the horizontal direction.
Referring to fig. 1, one end of the second rod 72 is connected to the other end of the first rod 71, the other end of the second rod 72 is connected to the clamping portion 6, and the second rod 72 is movable in a vertical direction. This vertical mobility enables the clamping portion 6 to clamp the wafer 01 in a suspended state (e.g., a wafer floating under the action of nitrogen buoyancy), see (j) in fig. 4, to ensure that the wafer 01 and the spin chuck 1 remain in a non-contact state during the spin process, so as to avoid contamination of the spin surface and structural damage.
The second rod 72 is movable in a vertical direction, for example, meaning that the second rod 72 can be lengthened or shortened in the vertical direction.
In the present application, the driving bracket 7 drives the clamping part 6 to clamp the periphery of the wafer 01 in a floating state, see (j) in fig. 4. Thus, the wafer 01 is prevented from being in direct contact with the spin chuck 1, and the surface of the wafer 01 is prevented from being directly clamped.
In one example, for example, the number of the clamping portions 6 is eight, and the number of the clamping portions 6 and the driving brackets 7 are arranged in a one-to-one correspondence, so that the number of the driving brackets 7 is also eight. When the number of the clamping portions 6 is eight, the stability and accuracy of clamping the wafer 01 can be improved.
In some examples of the present application, referring to (h) to (j) of fig. 4, when the second surface B of the wafer 01 is subjected to spin coating, the second lever portion 72 is used to drive the clamping portion 6 to move in a vertical direction to approach the wafer 01, and the first lever portion 71 is used to drive the clamping portion 6 to move in a horizontal direction to approach the wafer 01, so that the clamping portion 6 can clamp the wafer 01 from the peripheral side of the wafer 01.
In the process of spin coating the second surface B of the wafer 01, two key components, namely a drive bracket 7 and a clamping part 6, are involved. The drive bracket 7 comprises a first lever portion 71 and a second lever portion 72 which cooperate with the clamping portion 6 for effecting the clamping of the wafer 01.
Referring to fig. 4 (i), the second lever portion 72 is used to drive the holding portion 6 to move close to the wafer 01 in the vertical direction. This ensures that the clamping portion 6 can be moved from below to above and brought into proximity with the wafer 01 without interfering with the first surface a (the homogenized surface) of the wafer 01. The first lever portion 71 is for driving the holding portion 6 to move in the horizontal direction closer to the wafer 01, see (j) in fig. 4. Eventually, a plurality of clamping portions 6 can clamp the side portion of the wafer 01 together.
Further, after the second lever portion 72 has lifted the clamping portion 6 to an appropriate height, the first lever portion 71 further pushes the clamping portion 6 to approach from the peripheral side of the wafer 01 until the clamping portion 6 can clamp the side of the wafer 01.
In the wafer spin coater according to the present application, for example, eight clamping portions 6 may be provided, so that the wafer 01 may be stably clamped from the peripheral side of the wafer 01.
The design of the clamping part 6 provided by the application allows it to clamp the wafer 01 from the peripheral side of the wafer 01 instead of being pressed directly against the surface of the wafer 01. The clamping mode avoids polluting or damaging the first surface A of the homogenized glue, and simultaneously ensures the stability and accuracy of the second surface B of the homogenized glue when the homogenized glue is to be homogenized.
In some examples of the present application, referring to fig. 5, after the second surface B of the wafer 01 is homogenized, the first rod portion 71 and the second rod portion 72 respectively drive the clamping portion 6 away from the wafer 01 in the horizontal direction and the vertical direction, so that the clamping portion 6 releases the wafer 01.
That is, in the process of double-sided spin coating of the wafer, particularly after the second side B of the wafer 01 is coated, the clamping portion 6 can be driven to be away from the wafer 01 smoothly by the coordinated action of the first rod portion 71 and the second rod portion 72 of the driving bracket 7, so that the wafer after double-sided spin coating can be taken out in time, and the wafer after double-sided spin coating is shown in (n) in fig. 5.
In some examples of the application, referring to fig. 1 and 2, the plurality of air holes 2 extend from the surface of the spin chuck 1 to the inside thereof for providing air flow during spin.
Referring to (B) of fig. 3, when a wafer 01 to be spin-coated is placed on the surface of the spin chuck 1 with the first surface a facing up and the second surface B facing down, the plurality of air holes 2 on the spin chuck 1 can ensure that the second surface B of the wafer 01 is stably and firmly adsorbed on the surface of the spin chuck 1 by providing a vacuum adsorption function. The design is helpful for preventing the wafer from moving or falling off in the spin coating process, thereby ensuring the precision and consistency of the spin coating.
The design of the air hole 2 not only meets the requirements of direct contact and adsorption fixation of the wafer 01 and the spin chuck 1 during single-sided spin coating, but also provides possibility for non-contact spin coating during double-sided spin coating. In the double-sided spin coating process, the wafer 01 to be spin coated can be spin coated on the second surface B without directly contacting the spin coating chuck 1 by adjusting the gas flow and pressure of the gas hole 2 and matching with other mechanical components such as the clamping part 6 and the driving bracket 7.
Referring to fig. 1, since the openings of the air holes 2 are only exposed on the surface of the spin chuck 1, when the wafer 01 to be spin-coated is spin-coated on one side (for example, the first side a is spin-coated), the other side (for example, the second side B) of the wafer 01 can be directly contacted with the surface of the spin chuck 1, which is beneficial to stably vacuum-adsorbing and fixing the wafer 01 on the surface of the spin chuck 1.
In some examples of the present application, referring to fig. 2, 4 and 5, the plurality of air holes 2 includes a plurality of fixed air holes 21 fixedly disposed on the spin chuck 1 and a plurality of movable air holes 22 disposed around a periphery thereof, wherein an air outlet angle of the movable air holes 22 may be adjusted relative to the spin chuck 1 or the fixed air holes 21, and by adjusting the air outlet angle, an air outlet direction of the movable air holes 22 may be controlled, so as to ensure that the wafer 01 has no positional deviation when being suspended above the spin chuck 1.
Referring to fig. 4 and 5, by providing a plurality of movable air holes 22 on the surface of the spin chuck 1 and allowing the adjustment of the air outlet angle, the suspension position of the wafer 01 above the spin chuck 1 can be better controlled. This design helps to ensure that the wafer 01 remains stable in suspension and does not shift in position due to uneven or unstable air flow.
During the wafer processing, referring to fig. 4 (B), when the second surface B of the wafer 01 needs to be vacuum-adsorbed, the fixed air holes 21 and the movable air holes 22 on the spin chuck 1 are configured to provide vacuum-adsorbed gas vertically to the second surface B of the wafer 01. In this way, the wafer 01 can be stably adsorbed on the spin chuck 1, and the stability in the subsequent processing process is ensured.
Subsequently, during spin coating of the second side B of the wafer, as shown in fig. 4 (h), the wafer 01 is flipped over such that the originally downward facing second side B is now upward and the originally upward facing first side a is now downward. At this time, the wafer 01 no longer needs to be vacuum-adsorbed on the spin chuck, but needs to be suspended above the spin chuck 1 by air flow so as to perform subsequent operations such as spin.
In order to prevent the wafer 01 in the suspended state from being shifted, the quality of the spin coating is affected, and the movable air holes 22 on the spin coating chuck 1 play a key role. The air outlet angles of the movable air holes 22 can be adjusted according to actual needs, and the stability of the wafer 01 in a suspension state is ensured by precisely controlling the direction and the intensity of air flow, so that the position deviation is avoided. Therefore, powerful support can be provided for the subsequent spin coating and other treatment processes, and the quality and performance of the product are ensured.
In some examples of the present application, one end of the air supply pipeline 4 is connected to the plurality of air holes 2 on the spin chuck 1, and the other end is connected to a nitrogen source, and a flow control valve is disposed on the air supply pipeline 4, so as to regulate and control the supply flow of nitrogen.
By connecting the air supply pipeline 4 with the air holes 2 on the spin chuck 1, nitrogen can be ensured to be reasonably distributed to all parts of the spin chuck 1. This helps to keep the air pressure on the surface of the spin chuck 1 consistent during spin process, thereby improving uniformity and quality of spin.
The introduction of the flow control valve enables the supply flow of the nitrogen to be regulated and controlled according to actual requirements. By controlling the flow of nitrogen, the fluctuation of uniform colloid quality caused by unstable gas flow can be reduced. This helps to improve the stability of the overall spin process, thereby ensuring product consistency and reliability.
It should be noted that, instead of nitrogen, dry compressed air may be used, but cleanliness is ensured, otherwise the glue on the first surface a of the wafer 01 may be contaminated. N 2 is preferred because of its relatively high cleanliness.
In some examples of the present application, a vacuum pump is disposed on the vacuum adsorption pipeline 3, and the vacuum adsorption pipeline 3 is communicated with the plurality of air holes 2 on the spin chuck 1.
The vacuum adsorption pipeline 3 is communicated with the air holes 2 on the spin chuck 1, so that the vacuum adsorption force can be transmitted to the surface of the spin chuck 1, and then the wafer is adsorbed.
For example, after the vacuum pump is started, the gas inside the spin chuck 1 is pumped through the vacuum adsorption pipeline 3 to form a negative pressure environment. And a plurality of air holes 2 on the spin chuck 1 are in contact with the surface of the wafer, and negative pressure is transmitted to the wafer, so that the vacuum adsorption of the wafer is realized.
The vacuum adsorption pipeline 3 cooperates a plurality of air holes 2 on the spin chuck 1 can generate stronger adsorption force, ensure that the wafer is firmly adsorbed on the spin chuck 1 in the spin process, and avoid displacement or falling. The vacuum adsorption force improves the stability of the wafer in the spin coating process.
In some examples of the present application, referring to fig. 3 to 5, the wafer spin coating apparatus further includes a glue dropping pipe 8, where the glue dropping pipe 8 is located above the spin chuck 1 and configured to provide glue to a center position of the first surface a or the second surface B turned over after the spin coating of the first surface a is completed when the wafer 01 is spin coated.
The glue dropping pipeline 8 is located above the glue homogenizing suction cup 1, and is configured to provide glue to the center position of the first surface A of the wafer 01 or the second surface B turned over after the glue homogenizing of the first surface A is completed when the wafer 01 is homogenized.
When the first surface a of the wafer 01 is subjected to spin coating, the dispensing line 8 moves directly above the wafer 01, and drops the glue on the center of the first surface a of the wafer 01, see (c) in fig. 4.
After the spin coating on the first surface a is completed, the wafer 01 is turned over, so that the second surface B faces upward. At this time, the glue dropping pipe 8 moves to the position just above the wafer 01 again, but this time drops the glue on the center of the turned second surface B, see (k) in fig. 5.
The automatic configuration and control of the glue dripping pipeline 8 can shorten the time of the glue homogenizing process, thereby improving the production efficiency.
In some examples of the present application, the carrier 5 has a rotation driving device, which is connected to the spin chuck 1 to drive the spin chuck 1 to rotate, and after the wafer 01 is placed on the spin chuck 1 and glue is dropped, the spin chuck 1 is driven to rotate by the rotation driving device, and the generated centrifugal force is used to uniformly coat the glue on the first surface a or the second surface B of the wafer 01.
The carrier 5 is provided with a rotary driving device which is in transmission connection with the spin chuck 1. The rotary driving device is used as a power source, and Chinese is used for driving the spin chuck 1 to perform rotary motion.
When the wafer 01 is placed on the spin chuck 1, and a proper amount of glue is dripped into the center of the wafer through the glue dripping pipeline 8, the rotary driving device starts to start. Under the action of the rotary driving device, the spin chuck 1 drives the wafer 01 to rotate together. In the rotation process, the glue is acted by centrifugal force and starts to uniformly spread from the center to the periphery of the wafer 01 until a uniform glue layer is formed to cover the first surface A or the second surface B of the wafer 01.
The spin chuck 1 is driven to rotate by the rotation driving device, and the generated centrifugal force is utilized to enable the glue to be coated on the surface of the wafer very uniformly. The glue homogenizing mode avoids the problem that glue is unevenly distributed or accumulated at the edge of the wafer, and remarkably improves the uniformity and consistency of glue homogenizing. The automatic operation of the rotary driving device greatly shortens the time required by the spin coating process. Compared with the traditional manual spin mode, the automatic spin mode can finish spin operation more quickly, thereby improving production efficiency.
By ensuring uniform distribution of glue on the wafer surface, the problems of process defects and product reject ratio increase caused by uneven glue distribution can be avoided.
According to another embodiment of the present application, a method for double-sided photoresist on a wafer is provided, referring to fig. 4 and 5, the method for double-sided photoresist on a wafer includes the following steps 100 to 500:
step 100, referring to fig. 4 (a) and (B), placing a wafer 01 to be spin-coated on the surface of the spin chuck 1 with its first surface a facing up and its second surface B facing down, and vacuum-adsorbing and fixing the second surface B of the wafer 01 through a vacuum adsorption pipeline 3 and a plurality of air holes 2 on the spin chuck 1;
Referring to fig. 4 (B), the second surface B of the wafer 01 is shown to be vacuum-sucked and fixed by the spin chuck 1.
Step 200, referring to fig. 4 (c) and (d), dispensing glue on the first surface a of the wafer 01, and uniformly distributing the glue on the first surface a by rotating the glue homogenizing suction cup 1 to complete glue homogenizing of the first surface a;
wherein, as shown in (d) of fig. 4, a glue layer is formed on the first surface a.
Step 300, releasing the vacuum adsorbed wafer 01, and turning over the wafer 01 to enable the second surface B to face upwards;
it should be noted that, in step 300, the process of turning over the wafer 01 is not shown in the flowchart shown in fig. 4, which may be performed by an external robot or manually, and releasing the vacuum from the wafer 01 may be performed by referring to (e) in fig. 4, the vacuum suction line 3 stops working, and a gas such as nitrogen flows into the gas supply line 4.
Step 400, referring to fig. 4 (f) to (j), providing an air flow to the spin chuck 1 through an air supply pipeline 4, wherein the air flow is ejected from a plurality of air holes 2 of the spin chuck 1, so that the wafer 01 is suspended above the surface of the spin chuck 1 under the action of the air flow, and the spin chuck 1 and a first surface a after spin are kept in a non-contact state, wherein the air flow is, for example, a nitrogen air flow;
In fig. 4, (f) and (g) show the state of supplying air to the fixed air hole 21 and the movable air hole 22, and in particular, the air hole direction of the movable air hole 22 is adjusted;
In fig. 4 (h), the turned wafer 01 is suspended above the surface of the spin chuck 1, where the first surface a of the wafer 01 faces downward and a glue layer is formed, and the second surface B faces upward, so that the glue application operation is performed.
Step 500, referring to fig. 5, glue is dropped on the second surface B, and the glue is uniformly distributed on the second surface B by the rotation of the glue homogenizing suction cup 1, so as to complete double-sided glue homogenizing of the wafer;
Wherein (k) in fig. 5 shows that glue is dripped to the central position of the second surface B by means of the glue dripping line 8, and (l) in fig. 5 shows that a glue layer is formed on the second surface B.
According to the wafer double-sided spin coating method provided by the embodiment of the application, through the control of the steps 100-500, the first surface A of the wafer 01 to be spin coated is spin coated, then the wafer 01 is turned over without damaging the glue layer on the first surface A, and the second surface B is spin coated. The step-by-step operation ensures the precision and consistency of double-sided spin coating, and is beneficial to improving the quality and performance of the final product.
In particular, in the process of spin coating the second surface B of the wafer 01, the air supply pipeline 4 provides air flow to the spin chuck 1, so that the wafer 01 is suspended above the surface of the spin chuck 1, and direct contact between the spin coated first surface a and the spin chuck 1 is avoided. The non-contact type spin coating method effectively prevents pollution and damage.
The method provided by the embodiment of the application aims at optimizing the process of wafer double-sided spin coating. In addition, the wafer spin coating method also supports single-sided spin coating of the wafer.
In some examples of the present application, the double-sided spin coating method of the wafer further includes the steps of:
referring to fig. 4 (f) and (g), after the wafer 01 is turned over so that the second surface B faces upward, the air outlet angle of the movable air hole 22 on the spin chuck 1 is adjusted, so that the wafer 01 can be stably suspended above the surface of the spin chuck 1 under the action of air flow, and the center of the wafer 01 is aligned with the center of the spin chuck 1, so that no positional deviation occurs in the process of spin-coating the second surface B.
By adjusting the air outlet angle of the movable air hole 22, the direction and intensity of the air flow can be controlled, so that the wafer 01 can be stably suspended above the surface of the spin chuck 1 under the action of the air flow. The stability plays a key role in the smooth proceeding of the subsequent spin coating process, and avoids the uneven spin coating or failure caused by the shaking or offset of the wafer.
The position of the wafer in the spin coating process can be controlled by ensuring the alignment of the center of the wafer and the center of the spin chuck 1 while adjusting the air outlet angle of the movable air hole 22. The position accuracy is very important to ensure uniformity and consistency of spin coating, and improves quality and performance of products.
The design of the movable air holes 22 increases the controllability of the spin process. Through adjusting the position and the angle of giving vent to anger of gas pocket, can adapt to the wafer of different sizes and types in a flexible way to and different even glue demands. This controllability makes the spin process more flexible and efficient.
Wherein, the adjustable air outlet angle of the movable air hole 22 can be in the range of 30-45 degrees.
By ensuring that the wafer cannot generate position offset in the spin coating process, the problems of uneven spin coating or inconsistent thickness of the adhesive layer and the like caused by position errors can be reduced.
In some examples of the present application, the double-sided spin coating method of the wafer further includes the steps of:
Referring to fig. 4 (i) and (j), during the spin-coating process of the second surface B of the wafer 01, the clamping portion 6 connected to the second surface B is driven to move by the driving bracket 7, so as to clamp the wafer 01 suspended above the surface of the spin chuck 1.
In the process of spin coating the second surface B of the wafer 01, the wafer 01 needs to maintain extremely high stability to ensure uniform glue coating. Referring to fig. 4 (j), the driving bracket 7 drives the clamping portion 6 to move and clamp the wafer 01 suspended above the spin chuck 1, so as to effectively prevent the wafer from shaking or shifting during the spin process, thereby enhancing the stability of the wafer.
The clamping action of the clamping portion 6 ensures a fixed position of the wafer 01 during the spin coating process, which enables a more uniform application of glue on the wafer surface.
In some examples of the present application, the double-sided spin coating method of the wafer further includes, as shown in (m) of fig. 5, driving the clamping part 6 to release the wafer by the driving bracket 7 after finishing spin coating of the second side B.
After the spin on the second surface B is completed, the wafer 01 is released in time, so that the subsequent processing steps are facilitated.
In addition, the long-time clamping may cause pressure damage or residual clamping marks to the wafer, and the wafer is released immediately after spin coating is completed, so that the risk of such damage can be reduced, and the integrity and surface quality of the wafer are maintained.
In the application, the precise control of the driving bracket 7 and the clamping part 6 enables the release process of the wafer 01 to be more controllable. This helps to ensure stability and accuracy of the wafer during release, and to avoid dropping or damage to the wafer due to improper release.
The embodiment of the application also provides a wafer single-sided spin coating method, which is shown in fig. 3 and comprises the following steps 001 and 002:
In step 001, referring to fig. 3 (a) and (B), a wafer 01 to be spin-coated is placed on the surface of the spin chuck 1 with its first surface a facing up and its second surface B facing down, and the second surface B of the wafer 01 is vacuum-adsorbed and fixed by a vacuum adsorption pipeline 3 and a plurality of air holes 2 on the spin chuck 1, wherein, referring to fig. 3 (B), the vacuum adsorption of the spin chuck 1 is shown to fix the second surface B of the wafer 01.
Step 002, referring to fig. 3 (c) and (d), dispensing on the first surface a of the wafer 01, and uniformly distributing glue on the first surface a by rotating the glue homogenizing suction cup 1 to complete glue homogenizing of the first surface a, wherein, referring to fig. 3 (d), a glue layer is formed on the first surface a.
Of course, after the glue layer is formed on the first surface a of the wafer 01, the fixation of the vacuum suction pipe 3 to the second surface B of the wafer 01 may be released, so that the wafer may be removed.
According to yet another embodiment of the present application, there is provided a wafer spin coating system including:
The wafer spin coating device;
The first manipulator is used for placing the wafer 01 on the spin chuck 1 in a way that the first surface A faces upwards;
the second manipulator is used for turning over the wafer 01 after the first surface A of the wafer 01 is subjected to spin coating, so that the second surface B of the wafer is upward, and spin coating of the second surface B is performed;
the third manipulator is used for taking the wafer 01 clamped or released by the clamping part 6 away from the position after the second surface B is subjected to spin coating;
The control system is used for controlling the vacuum adsorption pipeline 3, the air supply pipeline 4, the spin chuck 1 and the driving bracket 7 in the wafer spin equipment.
In some examples of the present application, the wafer spin coating system further includes a sensor, wherein the sensor is used for detecting position information of the wafer 01 when the wafer 01 is turned over to the second surface B and is suspended above the surface of the spin chuck 1, and the control system controls the adjusting mechanism to adjust the air hole angle of the movable air hole on the spin chuck 1 according to the position information fed back by the sensor.
The position information of the wafer 01 includes, but is not limited to, alignment between the center position of the wafer and the center of the spin chuck.
According to the wafer spin coating system provided by the embodiment of the application, through integrating the first manipulator, the second manipulator and the third manipulator, an automatic process from placing, overturning to taking the wafer is realized, and the production efficiency is improved. Meanwhile, the control system accurately controls each component in the wafer spin coating equipment, so that the stability of the spin coating process is ensured.
In particular, the addition of the sensor enables the whole system to detect the position information of the wafer after overturning in real time. The control system timely adjusts the angle of the movable air hole on the spin chuck according to the feedback, thereby ensuring the accurate position and suspension stability of the wafer in the spin process and further improving the uniformity and the product quality of the spin.
The specific implementation of the wafer double-sided spin coating method and the wafer spin coating system according to the embodiments of the present application can refer to each embodiment of the wafer spin coating apparatus, so that the method and the system have at least all the beneficial effects brought by the technical solutions of the embodiments, and are not described in detail herein.
The foregoing embodiments mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in consideration of brevity of line text, no further description is given here.
While certain specific embodiments of the application have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.
Claims (16)
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