CN1203312C - Capacitance type relative humidity sensor - Google Patents
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- CN1203312C CN1203312C CN 03131858 CN03131858A CN1203312C CN 1203312 C CN1203312 C CN 1203312C CN 03131858 CN03131858 CN 03131858 CN 03131858 A CN03131858 A CN 03131858A CN 1203312 C CN1203312 C CN 1203312C
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Abstract
Description
一、技术领域1. Technical field
本发明涉及一种微机械传感器,尤其涉及一种电容式相对湿度传感器。The invention relates to a micromechanical sensor, in particular to a capacitive relative humidity sensor.
二、背景技术2. Background technology
目前环境检测中实际应用的大都是传统的湿度传感器,如干球湿度计、露点湿度计等。这些湿度传感器存在以下几种缺点:(1)相同产品的一致性差;(2)价格昂贵;(3)体积大;(4)线性度、滞回特性差,测量中有时需要查表。与CMOS(CMOS为本领域熟知的技术名词)技术相兼容的电容相对湿度传感器是一种的微湿度传感器,具有体积小、价格低、产品一致性好的优点。1990年,H.Baltes(人名)最早提出了利用CMOS工艺制造湿度传感器。该湿度传感器利用空气作为感湿介质,由于表面吸附的影响,线性度和滞回特性都非常差,精度很低。并且由于铝电极暴露在空气中容易受到水气的腐蚀,可靠性也比较差。1991年,Boltshauser(人名)采用CMOS技术加上后序工艺,利用聚酰亚胺为感湿介质制作了相对电容湿度传感器,这种湿度传感器的电极和聚酰亚胺直接接触聚酰亚胺吸附水汽之后会腐蚀铝电极,可靠性低,长期使用使得表面附的杂质很难去除。2000年,Uksong Kang(人名)给出了一种高速的湿度传感器,该结构中用作加热的多晶硅上有两层作为绝缘的二氧化硅以及一层敏感电极隔热,加热效果差;该结构比较复杂,无法通过标准的CMOS工艺完成。且电极暴露在空气中,为防止空气中水汽的腐蚀,电极的选择就有限制,长期可靠性差。以上的一些湿度传感器不能满足长期可靠性和脱附时间短的要求,易受外界环境影响。At present, most of the practical applications in environmental testing are traditional humidity sensors, such as dry bulb hygrometers and dew point hygrometers. These humidity sensors have the following disadvantages: (1) poor consistency of the same product; (2) expensive; (3) large in size; (4) poor linearity and hysteresis characteristics, and sometimes need to look up the table during measurement. The capacitive relative humidity sensor compatible with CMOS (CMOS is a well-known technical term in the art) technology is a kind of micro humidity sensor, which has the advantages of small size, low price and good product consistency. In 1990, H.Baltes (person's name) first proposed the use of CMOS technology to manufacture humidity sensors. The humidity sensor uses air as the humidity-sensing medium. Due to the influence of surface adsorption, the linearity and hysteresis characteristics are very poor, and the accuracy is very low. And because the aluminum electrode is exposed to the air and is easily corroded by water vapor, the reliability is relatively poor. In 1991, Boltshauser (personal name) used CMOS technology and post-processing technology to make a relative capacitive humidity sensor using polyimide as a moisture-sensing medium. The electrodes of this humidity sensor and polyimide directly contact polyimide for adsorption After water vapor will corrode the aluminum electrode, the reliability is low, and the impurities attached to the surface are difficult to remove after long-term use. In 2000, Uksong Kang (personal name) gave a high-speed humidity sensor. In this structure, there are two layers of insulating silicon dioxide and a layer of sensitive electrode heat insulation on the polysilicon used for heating, and the heating effect is poor; the structure It is more complicated and cannot be completed by a standard CMOS process. And the electrode is exposed in the air, in order to prevent the corrosion of water vapor in the air, the selection of the electrode is limited, and the long-term reliability is poor. Some of the above humidity sensors cannot meet the requirements of long-term reliability and short desorption time, and are easily affected by the external environment.
三、发明内容3. Contents of the invention
技术问题:本发明提供一种能够提高其可靠性的高精度电容式相对湿度传感器。Technical problem: The present invention provides a high-precision capacitive relative humidity sensor that can improve its reliability.
技术方案:本发明是一种用于湿度信号传感的电容式相对湿度传感器,由衬底,氧化层、电容电极组成,氧化层设在衬底上,电容电极设在氧化层上方,在电容电极上设有电极引线,该电容电极为其材质适于标准CMOS加工工艺的电极,在电容电极上设有钝化层。Technical solution: The present invention is a capacitive relative humidity sensor for humidity signal sensing, which is composed of a substrate, an oxide layer, and a capacitor electrode. The oxide layer is arranged on the substrate, and the capacitor electrode is arranged above the oxide layer. Electrode leads are arranged on the electrodes, and the capacitor electrodes are electrodes whose material is suitable for standard CMOS processing technology, and a passivation layer is arranged on the capacitor electrodes.
技术效果:本发明工艺步骤简单,可利用标准的CMOS工艺制造,精度高,长期可靠性好。采用铝电极梳状并联结构可以增加敏感电容值,将衬底可靠接地消除了外界的干扰,提高湿度传感器的精度。淀积钝化层能够有效防止环境中的水汽尤其是聚酰亚胺吸水后,聚酰亚胺中的水汽腐蚀铝电极,提高可靠性。利用梳状并联多晶硅作为加热电路,加热均匀,有效去除湿度传感器表面可挥发性杂质,使湿度传感器的脱附时间更短,同样提高了可靠性。在电容电极之间设置聚酰亚胺,且氧化条的上表面高于多晶条的上表面,减少铝电极与二氧化硅层间的边缘效用,提高线性度,减少寄生电容,从而提高精度。利用聚酰亚胺作为感湿介质,它具有灵敏度高,线性度、滞回特性好,长期可靠等优点,而本发明的结构设置,则使其与标准CMOS加工工艺相兼容。Technical effect: the process steps of the present invention are simple, can be manufactured by standard CMOS process, has high precision and good long-term reliability. The aluminum electrode comb-like parallel structure can increase the sensitive capacitance value, reliably ground the substrate to eliminate external interference, and improve the accuracy of the humidity sensor. Depositing the passivation layer can effectively prevent water vapor in the environment, especially after the polyimide absorbs water, the water vapor in the polyimide corrodes the aluminum electrode, thereby improving reliability. Comb-shaped parallel polysilicon is used as a heating circuit to heat evenly, effectively remove volatile impurities on the surface of the humidity sensor, shorten the desorption time of the humidity sensor, and also improve reliability. Polyimide is set between the capacitor electrodes, and the upper surface of the oxide strip is higher than the upper surface of the polycrystalline strip, which reduces the edge effect between the aluminum electrode and the silicon dioxide layer, improves linearity, reduces parasitic capacitance, and thus improves accuracy . Utilizing polyimide as the humidity-sensitive medium has the advantages of high sensitivity, good linearity and hysteresis characteristics, long-term reliability, etc., and the structural setting of the invention makes it compatible with standard CMOS processing technology.
四、附图说明4. Description of drawings
图1是本发明的结构示意图。Fig. 1 is a schematic structural view of the present invention.
图2是本发明的俯视图。Figure 2 is a top view of the present invention.
图3是本发明梳形电极结构示意图。Fig. 3 is a schematic diagram of the comb-shaped electrode structure of the present invention.
图4是本发明梳形式并联多晶硅层结构示意图。Fig. 4 is a schematic diagram of the structure of a comb-shaped parallel polysilicon layer according to the present invention.
五、具体实施方式5. Specific implementation
本发明是一种用于湿度信号传感的电容式相对湿度传感器,由衬底106,氧化层104、电容电极101和102组成,氧化层104设在衬底106上,电容电极101和102设在氧化层104上方,在电容电极101和102上设有电极引线1011和1021,该电容电极101和102为其材质适于标准CMOS加工工艺的电极,在电容电极101和102上设有钝化层108,在电容电极101和102之间及其上方设有感湿介质层107,钝化层108位于电容电极101和102与感湿介质层107之间,在电容电极101和102与氧化层104之间设有二氧化硅条105且二氧化硅条105的上表面高于感湿介质层1071的下表面1071,在感湿介质层107与氧化层104之间设有加热条103,具体来说,既可以将加热条103设在感湿介质层107的下表面1071与氧化层104之间,也可以将加热条103设在二氧化硅条105与氧化层104之间,在加热条103上设有加热条引线1031和1032,在感湿介质层107与加热条103之间设有氮化硅层1081,本实施例的钝化层108为氮化硅层,该钝化层108也可采用由二氧化硅层和氮化硅层组成,氮化硅层设在二氧化硅层的上方的技术措施,电容电极101和102为梳形电极且交错设置,感湿介质层107为聚酰亚胺层,加热条103为梳形并联多晶硅层,衬底106接地,电容电极101和102为铝电极,电容电极101和102还可以是金电极或多晶硅电极,本发明的感湿介质由于外界环境的相对湿度变化,吸附/脱附空气中的水气分子,使得感湿介质的介电常数发生变化,引起湿度传感器的电容值改变,相对湿度与敏感电容之间存在确定关系。环境相对湿度升高时湿度传感器电容值增加,环境相对湿度降低时湿度传感器电容值相应减少,湿度传感器输出端连接外围电路,敏感电容值经过接口电路The present invention is a capacitive relative humidity sensor for humidity signal sensing, which consists of a
将其转化为可测电信号(如电压、电流),本发明可采用以下工艺来制作:在硅衬底上生长薄氧化层104,淀积多晶硅103,并光刻成梳状并联的S型,CVD法淀积二氧化硅105,光刻露出多晶硅103,淀积1微米铝,并光刻成梳状电极101,102(刻除多晶硅上的铝)。接着淀积氮化硅108作为钝化层,利用旋转涂敷法涂1.5微米厚度左右的聚酰亚胺(107),光刻、亚胺化后聚酰亚胺(107)的厚度约为1微米。湿度传感器的两极板(以铝电极为例),铝电极板分别由21根宽3微米、长400微米的条形铝电极组成的梳状结构,相邻的极板间距为4微米。加热多晶硅结构如图4,多晶硅103采用梳状并联S型结构,利于均匀加热,每根多晶硅条(103)长度为450微米、宽3微米,厚度为3500埃,14根多晶硅条分别并联在一起,然后串联,总电阻为1.5KΩ左右,作为钝化层108的氮化硅厚度为3000埃,用以防止铝电极101,102被聚酰亚胺107吸附的水气腐蚀,聚酰亚胺107的厚度约为1微米。图2中铝电极109接地,用来消除外界对敏感电容的影响,多晶硅条为加热电路,铝电极101、102输出电容信号。环境相对湿度测量范围为0%RH~100%RH,温度范围为-40℃~60℃。To convert it into a measurable electrical signal (such as voltage, current), the present invention can be produced by using the following processes: growing a thin oxide layer 104 on a silicon substrate, depositing polysilicon 103, and photoetching into a comb-shaped parallel S-type , CVD deposits silicon dioxide 105, exposes polysilicon 103 by photolithography, deposits 1 micron aluminum, and forms
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| JP4341506B2 (en) * | 2004-08-20 | 2009-10-07 | 株式会社デンソー | Hybrid sensor with humidity sensor and humidity detection function |
| CN1327215C (en) * | 2005-03-08 | 2007-07-18 | 东南大学 | Relative humidity sensor compatible of CMOS process |
| WO2009016594A2 (en) | 2007-08-02 | 2009-02-05 | Nxp B.V. | Humidity sensor based on progressive corrosion of exposed material |
| US7683636B2 (en) * | 2007-10-26 | 2010-03-23 | Honeywell International Inc. | Structure for capacitive balancing of integrated relative humidity sensor |
| CN101308110B (en) * | 2008-07-11 | 2011-02-02 | 中国电子科技集团公司第四十九研究所 | Low-power consumption double module integrated humidity sensitive chip with heating function and its manufacture method |
| CN101620197B (en) * | 2009-07-23 | 2012-09-05 | 东南大学 | Rapid response CMOS relative humidity sensor |
| WO2011065507A1 (en) * | 2009-11-30 | 2011-06-03 | アルプス電気株式会社 | Humidity detection sensor |
| CN101738422B (en) | 2009-12-23 | 2012-09-05 | 北京宝力马传感技术有限公司 | Humidity measuring device and method |
| CN101949878B (en) * | 2010-09-03 | 2013-05-01 | 兰州交通大学 | Polyimide film miniature quick-response humidity sensing element and manufacturing method thereof |
| CN102253091A (en) * | 2011-04-19 | 2011-11-23 | 东南大学 | Capacitive relative humidity sensor based on graphene oxide |
| CN102243199A (en) * | 2011-04-20 | 2011-11-16 | 东南大学 | Relative humidity sensor of fast-response microelectronic mechanical system |
| GB201110550D0 (en) * | 2011-06-22 | 2011-08-03 | Delta T Devices Ltd | Matric potential sensor and related methods |
| US9027400B2 (en) * | 2011-12-02 | 2015-05-12 | Stmicroelectronics Pte Ltd. | Tunable humidity sensor with integrated heater |
| CN102495113A (en) * | 2011-12-30 | 2012-06-13 | 湖南科技学院 | Detection probe for water content of fresh meat |
| ITMI20130484A1 (en) | 2013-03-29 | 2014-09-30 | St Microelectronics Srl | INTEGRATED ELECTRONIC DEVICE FOR MONITORING OF HUMIDITY AND / OR ACIDITY / ENVIRONMENTAL BASIS AND / OR CORROSION |
| CN103434999B (en) * | 2013-09-02 | 2016-01-20 | 东南大学 | The integrated manufacturing method of a kind of temperature, humidity, air pressure and acceleration transducer |
| CN103471740B (en) * | 2013-09-30 | 2015-11-11 | 东南大学 | A kind of capacitive temperature sensor |
| CN107533027B (en) | 2015-02-17 | 2020-05-12 | 霍尼韦尔国际公司 | Humidity sensor |
| CN105366626B (en) * | 2015-10-21 | 2017-12-12 | 苏州工业园区纳米产业技术研究院有限公司 | MEMS capacitive humidity sensor and preparation method thereof |
| EP3214434B1 (en) | 2016-03-03 | 2019-12-04 | Sensirion AG | Method for fabrication of a sensor device |
| EP3244201B1 (en) | 2016-05-13 | 2021-10-27 | Honeywell International Inc. | Fet based humidity sensor with barrier layer protecting gate dielectric |
| CN106680333A (en) * | 2017-02-13 | 2017-05-17 | 广州奥松电子有限公司 | Humidity sensitive capacitor and manufacturing method thereof |
| CN106841331B (en) * | 2017-04-05 | 2023-07-18 | 成都信息工程大学 | A kind of flexible capacitive humidity sensor and preparation method thereof |
| CN110057876A (en) * | 2019-05-07 | 2019-07-26 | 济南大学 | A kind of method of capacitance type sensor measurement moisture content |
| CN112578003A (en) * | 2019-09-30 | 2021-03-30 | 浙江三花智能控制股份有限公司 | Sensor element |
| CN116698926B (en) * | 2023-06-08 | 2024-07-09 | 大连理工大学 | Measuring device and method for monitoring coating damage degree and corrosion rate at damaged parts |
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