CN120176900B - Method and equipment for detecting the operating status of a bottom embossing device - Google Patents
Method and equipment for detecting the operating status of a bottom embossing deviceInfo
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- CN120176900B CN120176900B CN202510287779.8A CN202510287779A CN120176900B CN 120176900 B CN120176900 B CN 120176900B CN 202510287779 A CN202510287779 A CN 202510287779A CN 120176900 B CN120176900 B CN 120176900B
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- value
- embossing
- pressure
- side wall
- pan
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
- B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
- B44B5/0095—Machines or apparatus for embossing decorations or marks, e.g. embossing coins using computer control means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
- B44B5/00—Machines or apparatus for embossing decorations or marks, e.g. embossing coins
- B44B5/0052—Machines or apparatus for embossing decorations or marks, e.g. embossing coins by pressing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/02—Measuring force or stress, in general by hydraulic or pneumatic means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0028—Force sensors associated with force applying means
- G01L5/0038—Force sensors associated with force applying means applying a pushing force
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
本申请涉及设备状态检测领域，公开了一种用于检测锅底压花设备运行状态的方法和设备，方法包括：获取对锅底水平区域进行压花的第一压力值、对锅底侧壁区域进行压花的第二压力值；确定第一压力值和第二压力值的差值，作为压力差值；当第二压力值小于预设第二压力值时，对第二压力值增大第二压力调整值；当压力差值小于预设压力差值时，对第一压力值增大第一压力调整值；当第一压力值大于预设第一压力阈值时，对第一压力值按照第一比例值减小压力值，并对第二压力值按照第二比例值减小压力值；其中，第一比例值大于第二比例值。本申请能够对锅体侧壁、锅体底部的压花过程进行检测，提高压花质量。
This application relates to the field of equipment condition monitoring, and discloses a method and equipment for detecting the operating status of a pot bottom embossing device. The method includes: acquiring a first pressure value for embossing a horizontal area of the pot bottom and a second pressure value for embossing a sidewall area of the pot bottom; determining the difference between the first pressure value and the second pressure value as a pressure difference value; increasing the second pressure value by a second pressure adjustment value when the second pressure value is less than a preset second pressure value; increasing the first pressure value by a first pressure adjustment value when the pressure difference value is less than a preset pressure difference value; and decreasing the first pressure value by a first proportional value and decreasing the second pressure value by a second proportional value when the first pressure value is greater than a preset first pressure threshold value; wherein the first proportional value is greater than the second proportional value. This application can detect the embossing process of the pot body sidewall and pot body bottom, thereby improving the embossing quality.
Description
Technical Field
The application relates to the technical field of equipment state detection, in particular to a method and equipment for detecting the running state of bottom of a pot embossing equipment.
Background
In the production process of the paint-free anti-sticking pot, anti-sticking paint is not required to be sprayed on the inner side of the pot bottom, and an embossing structure is required to be adopted on the inner side of the pot bottom to achieve the anti-sticking effect. The bottom of the existing paint-free anti-sticking pot is generally formed by one-step lamination of multiple layers of materials, the pressing parameters of the embossing patterns formed on the inner side of the bottom of the anti-sticking pot are required to be controlled in the lamination process, the protrusion height of the embossing patterns cannot be too low (for example, 1 mm), and if the protrusion height is lower than 1mm, the anti-sticking effect cannot be achieved. Because the embossing process of the pan bottom needs to control the height of the embossing pattern formed by the pan bottom, the pressing force and the pressing related parameters are monitored and controlled in the pressing process of the pan bottom.
In the process of bottom embossing, the existing bottom embossing detection technology has certain limitations. Currently, such detection techniques are mainly focused on pressure detection of the horizontal area of the bottom of the pan, ensuring the integrity and consistency of the embossed pattern by applying a uniform pressure to the bottom of the pan. However, this method of detection does not cover the entire embossing process of the pot, especially for the side wall of the pot, and it does not allow an effective pressure detection and control. This results in the problem of uneven pressure, pattern deformation or depth variation during the embossing process of the side wall of the pot body, thereby affecting the overall aesthetic appearance and the usability of the pot.
Disclosure of Invention
The application aims to provide a method and equipment for detecting the running state of a bottom embossing device, solves the technical problem that the embossing process of the side wall of a pot body cannot be detected, and achieves the technical effects of detecting the embossing process of the side wall of the pot body and the bottom of the pot body and improving the embossing quality.
The method for detecting the operating state of the bottom embossing equipment comprises the steps of obtaining a first pressure value for embossing a bottom horizontal area and a second pressure value for embossing a bottom side wall area, determining a difference value between the first pressure value and the second pressure value as a pressure difference value, increasing a second pressure adjustment value for the second pressure value when the second pressure value is smaller than a preset second pressure value, increasing the first pressure adjustment value for the first pressure value when the pressure difference value is smaller than the preset pressure difference value, decreasing the pressure value for the first pressure value according to a first proportion value when the first pressure value is larger than a preset first pressure threshold value, and decreasing the pressure value for the second pressure value according to a second proportion value, wherein the first proportion value is larger than the second proportion value.
In one possible implementation mode, the method further comprises the steps of obtaining embossing depths of the side wall area of the bottom of the pan at different heights, determining depth variance values of the embossing depths at different heights, sending prompt information for prompting adjustment of the pressure head of the side wall area of the bottom of the pan when the depth variance values of the embossing depths at different heights are larger than or equal to preset depth variance values, and sending no prompt information for prompting adjustment of the pressure head of the side wall area of the bottom of the pan and embossing the horizontal area of the bottom of the pan and the side wall area of the bottom of the pan when the depth variance values of the embossing depths at different heights are smaller than the preset depth variance values.
In another possible implementation, reducing the pressure value for the first pressure value by a first ratio and reducing the pressure value for the second pressure value by a second ratio includes determining a maximum sidewall embossing depth for the bottom sidewall area at different heights and determining a ratio of the maximum sidewall embossing depth to the second pressure value as a first ratio when the depth variance value of the embossing depth at the different heights is less than the preset depth variance value, determining a ratio of the maximum horizontal embossing depth for the bottom sidewall area and the first pressure value as a second ratio, determining a ratio of the first ratio to the second ratio as a pressure adjustment ratio, and determining a ratio of the maximum first pressure value to the first pressure value as a first ratio. The product of the first ratio and the pressure adjustment ratio is determined as a second ratio.
In another possible implementation mode, the method further comprises the steps of obtaining material information of the pot body, detecting a pot body temperature value through infrared rays, obtaining pot body extrusion correction parameters corresponding to the material information of the pot body and the pot body temperature value, and determining the product of the first proportion value, the pressure adjustment proportion value and the pot body extrusion correction parameters as a second proportion value.
In another possible implementation manner, the method further comprises the steps of obtaining a bottom thickness value corresponding to a bottom horizontal area and a side wall thickness value corresponding to a bottom side wall area, obtaining a first mold temperature value of a mold area corresponding to the bottom horizontal area and a second mold temperature value of a mold area corresponding to the bottom side wall area through infrared detection, determining a first correction factor corresponding to the bottom thickness value and the first mold temperature value, determining a second correction factor corresponding to the side wall thickness value and the second mold temperature value, multiplying the first correction factor by the first ratio value to adjust the first ratio value, and multiplying the second correction factor by the second ratio value to adjust the second ratio value.
In another possible implementation mode, the method further comprises the steps of obtaining an inclination angle value corresponding to the bottom side wall area and obtaining a side wall extrusion correction coefficient corresponding to the inclination angle value when the bottom side wall area is of a planar structure, obtaining a maximum curvature value corresponding to the bottom side wall area and obtaining a side wall extrusion correction coefficient corresponding to the maximum curvature value when the bottom side wall area is of a curved structure, and multiplying the side wall extrusion correction coefficient by a second proportion value to adjust the second proportion value.
In another possible implementation mode, the method further comprises the steps of obtaining the embossing depth of a transition area between the horizontal area of the bottom of the pan and the side wall area of the bottom of the pan, determining a depth variance value of the embossing depth of the transition area as a transition embossing depth variance value, obtaining a transition adjustment coefficient corresponding to the bottom material of the pan, determining a product of the transition adjustment coefficient and the pressure difference value as a transition pressure adjustment value, reducing the transition pressure adjustment value for a first pressure value when the transition embossing depth variance value is greater than or equal to a preset transition embossing depth variance value, increasing the transition pressure adjustment value for a second pressure value, and not adjusting the first pressure value and the second pressure value when the transition embossing depth variance value is smaller than the preset transition embossing depth variance value.
In another possible implementation, the method further includes determining a maximum embossing depth and a minimum embossing depth of the transition region, determining an embossing depth difference between the maximum embossing depth and the minimum embossing depth of the transition region, determining a minimum embossing depth of the bottom side wall region at different heights, increasing the transition pressure adjustment value for the second pressure value when the minimum embossing depth of the transition region and the minimum embossing depth of the bottom side wall region at different heights are both less than a preset minimum embossing depth, and decreasing the transition pressure adjustment value for the second pressure value when the minimum embossing depth of the transition region and the minimum embossing depth of the bottom side wall region at different heights are both greater than or equal to a preset minimum embossing depth.
In another possible implementation mode, the method further comprises the step of sending out prompt information for prompting to improve the concentricity of the bottom horizontal area and the bottom side wall area when the embossing depth difference value is larger than or equal to a preset embossing depth difference value, and not sending out prompt information for prompting to improve the concentricity of the bottom horizontal area and the bottom side wall area when the embossing depth difference value is larger than or equal to the preset embossing depth difference value.
The embodiment of the application also provides equipment for detecting the operation state of the bottom of the pan embossing equipment, which comprises a unit for executing the method.
Compared with the prior art, the embodiment of the application has the beneficial effects that:
The embodiment of the application provides a method for detecting the running state of bottom embossing equipment, which comprises the steps of obtaining a first pressure value for embossing a bottom horizontal area and a second pressure value for embossing a bottom side wall area, determining the difference value between the first pressure value and the second pressure value as a pressure difference value, increasing a second pressure adjustment value for the second pressure value when the second pressure value is smaller than a preset second pressure value, increasing a first pressure adjustment value for the first pressure value when the pressure difference value is larger than the preset pressure difference value, decreasing the pressure value for the first pressure value according to a first proportion value and decreasing the pressure value for the second pressure value according to a second proportion value when the first pressure value is larger than a preset first pressure threshold value, wherein the first proportion value is larger than the second proportion value. According to the embodiment of the application, the whole embossing process of the pot body can be covered on the whole surface, the pressure in the embossing process of the pot bottom can be detected and controlled in real time, the control effect of the embossing process of the pot bottom is improved, and the embossing control effect of the pot bottom is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a first method for detecting an operation state of a bottom of a pan embossing device according to an embodiment of the present application;
fig. 2 is a schematic diagram of an embossing process of a first method for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application;
FIG. 3 is a schematic diagram of an embossing process of a second method for detecting an operational status of a bottom of a pan embossing apparatus according to an embodiment of the present application;
FIG. 4 is a flow chart of a second method for detecting an operational status of a bottom of a pan embossing apparatus according to an embodiment of the present application;
FIG. 5 is a flow chart of a third method for detecting an operational status of a bottom of a pan embossing apparatus according to an embodiment of the present application;
FIG. 6 is a flow chart of a fourth method for detecting an operational status of a bottom of a pan embossing apparatus according to an embodiment of the present application;
FIG. 7 is a flow chart of a fourth method for detecting an operational status of a bottom of a pan embossing apparatus according to an embodiment of the present application;
FIG. 8 is a flow chart of a fourth method for detecting an operational status of a bottom of a pan embossing apparatus according to an embodiment of the present application;
Fig. 9 is a flowchart of a fourth method for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application;
fig. 10 is a schematic logic structure diagram of an apparatus for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application.
Detailed Description
It should be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It should also be understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
As used in the present description and the appended claims, the term "if" may be interpreted as "when..once" or "in response to a determination" or "in response to detection" depending on the context. Similarly, the phrase "if a determination" or "if a [ described condition or event ] is detected" may be interpreted in the context of meaning "upon determination" or "in response to determination" or "upon detection of a [ described condition or event ]" or "in response to detection of a [ described condition or event ]".
Furthermore, the terms "first," "second," "third," and the like in the description of the present specification and in the appended claims, are used for distinguishing between descriptions and not necessarily for indicating or implying a relative importance.
Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.
The existing pan bottom embossing detection method cannot cover the whole embossing process of the pan body in a whole, particularly cannot perform effective pressure detection and control on the embossing process of the side wall of the pan body, so that the problems of uneven pressure, deformation of patterns or different depths can occur in the embossing process of the side wall of the pan body, and the overall attractiveness and the usability of the pan are affected.
Based on the above, the embodiment of the application provides a method for detecting the operation state of bottom-of-a-pan embossing equipment, which comprises the steps of obtaining a first pressure value for embossing a bottom-of-a-pan horizontal area and a second pressure value for embossing a bottom-of-a-pan side wall area, determining the difference between the first pressure value and the second pressure value as a pressure difference, increasing the second pressure value by a second pressure adjustment value when the second pressure value is smaller than a preset second pressure value, increasing the first pressure value by the first pressure adjustment value when the pressure difference is larger than the preset pressure difference, decreasing the first pressure value by the first proportion value and decreasing the second pressure value by the second proportion value when the first pressure value is larger than a preset first pressure threshold, wherein the first proportion value is larger than the second proportion value. According to the embodiment of the application, the whole embossing process of the pot body can be covered on the whole surface, the pressure in the embossing process of the pot bottom can be detected and controlled in real time, the control effect of the embossing process of the pot bottom is improved, and the embossing control effect of the pot bottom is improved.
In some scenes, the method and the device for detecting the running state of the bottom embossing device can be applied to the embossing process of the horizontal area and the side wall area of the bottom, and can improve the embossing control effect of the bottom.
The following describes a method for detecting the operation state of the bottom embossing device according to the embodiment of the present application with reference to specific examples.
Fig. 1 is a flow chart of a first method for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application, and as shown in fig. 1, the method includes S110 to S120, and S110 to S120 are specifically described below.
S110, obtaining a first pressure value for embossing the horizontal area of the bottom of the pot and a second pressure value for embossing the side wall area of the bottom of the pot. A difference between the first pressure value and the second pressure value is determined as a pressure difference.
Fig. 2 is a schematic diagram of an embossing process of a first method for detecting an operation state of a bottom embossing apparatus according to an embodiment of the present application, and fig. 3 is a schematic diagram of an embossing process of a second method for detecting an operation state of a bottom embossing apparatus according to an embodiment of the present application, as shown in fig. 2 and 3, in which a bottom 3 is embossed by a mold 1 and a press head 2, the mold 1 includes a recess 11 for positioning the bottom 3, the bottom 3 has a bottom horizontal area 31 and a bottom side wall area 32, the press head 2 includes a center press head 21 and a circumferential press head 22, the center press head 21 is used for embossing the bottom horizontal area 31 of the bottom 3, and the circumferential press head 22 is used for embossing the bottom side wall area 32.
When the central pressure head 21 is used for embossing the bottom horizontal area 31, the first pressure detection component can be used for detecting the embossing pressure of the bottom horizontal area 31, and when the circumferential pressure head 22 is used for embossing the bottom side wall area 32, the second pressure detection component can be used for detecting the embossing pressure of the circumferential pressure head 22 on the bottom side wall area 32.
The first pressure detecting assembly and the second pressure detecting assembly may be piezo resistors provided on the ram transmission, and the first pressure detecting assembly and the second pressure detecting assembly may be hydraulic pressure sensors.
In the embodiment of the application, when the pressure detection is carried out, the first pressure value for embossing the horizontal area of the bottom and the second pressure value for embossing the side wall area of the bottom can be obtained, and the embossing process of the bottom can be controlled according to the first pressure value and the second pressure value.
After the first pressure value and the second pressure value are detected, the difference value between the first pressure value and the second pressure value can be determined and used as a pressure difference value, and then the embossing process of the horizontal area of the bottom and the side wall area of the bottom can be controlled according to the pressure difference value.
And S120, when the second pressure value is smaller than a preset second pressure value, increasing the second pressure value by a second pressure adjustment value. And when the pressure difference is smaller than the preset pressure difference, increasing the first pressure value by a first pressure adjustment value. When the first pressure value is larger than a preset first pressure threshold value, the pressure value is reduced according to a first proportion value for the first pressure value, and the pressure value is reduced according to a second proportion value for the second pressure value. Wherein the first ratio is greater than the second ratio.
When the pressure control is carried out, the embossing process of the side wall area of the bottom of the pot is mainly shearing pressure, so that the extrusion force is required to be controlled preferentially when the side wall area of the bottom of the pot is extruded, when the second pressure value is smaller than a preset second pressure value, the embossing pressure of the side wall area of the bottom of the pot is too small, and at the moment, the second pressure value can be increased by a second pressure adjustment value to ensure the accurate control of the second pressure value.
When the bottom of the pan is extruded, because the area of the bottom of the pan horizontal region is bigger, plastic deformation is required to be produced through positive pressure extrusion during extrusion, the extrusion force of the bottom of the pan horizontal region is required to be ensured to be larger than that of the bottom of the pan side wall region, when the pressure difference value is smaller than a preset pressure difference value during pressure control, the first pressure adjustment value can be increased to the first pressure value, so that the extrusion force of the bottom of the pan horizontal region is ensured to be larger than that of the bottom of the pan side wall region, and the extrusion effect of the bottom of the pan horizontal region is ensured.
When the bottom of the pan is extruded, when the first pressure value is larger than a preset first pressure threshold value, the extrusion pressure of the horizontal region of the bottom of the pan is excessively large, the pressure value can be reduced according to a first proportion value at the moment, and the pressure value can be reduced according to a second proportion value to a second pressure value, so that the extrusion pressure of the horizontal region of the bottom of the pan is ensured to be larger than that of the side wall region of the bottom of the pan, the pressure distribution can be optimized by adjusting the proportion of the first pressure value and the second pressure value, the embossing effect of the horizontal region of the bottom of the pan and the side wall region of the bottom of the pan is more uniform, and the quality of products is improved.
When the embossing pressure of the bottom horizontal area and the bottom side wall area is controlled, the extrusion force of the bottom horizontal area is larger than that of the bottom side wall area, and the first proportion value is larger than the second proportion value, so that the embossing uniformity of the bottom horizontal area and the bottom side wall area can be ensured by adjusting the proportion of the first pressure value and the second pressure value.
Illustratively, the first ratio may be 10% and the second ratio may be 5%.
It should be noted that, in the embodiment of the present application, the embossing pattern is not limited, and the embossing pattern may be a diamond pattern, a polygonal pattern, or the like.
The beneficial effect of the realization mode is that the whole embossing process of the pot body can be covered on the whole surface, the pressure in the embossing process of the pot bottom can be detected and controlled in real time, the control effect of the embossing process of the pot bottom is improved, and the embossing control effect of the pot bottom is improved.
The beneficial effect of the realization mode is that the embossing effect of the horizontal area of the bottom and the side wall area of the bottom is more uniform and the quality of the product is improved by adjusting the proportion of the first pressure value and the second pressure value and optimizing the pressure distribution.
The beneficial effects of the implementation mode are that the second pressure value is monitored, whether the first pressure value is larger than the preset first pressure threshold value is monitored, the accuracy of pressure control on the extrusion process of the horizontal area of the bottom and the side wall area of the bottom is guaranteed, and the effect of embossing control on the bottom is improved.
Fig. 4 is a flowchart of a second method for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application, as shown in fig. 4, the method further includes S210 to S220, and the following details of S210 to S220 are described below
S210, obtaining embossing depths of the side wall areas of the pot bottom at different heights, and determining depth variance values of the embossing depths at different heights.
During operation, because the extrusion amplitude of the bottom side wall area at different heights possibly fluctuates greatly due to the extrusion heads, the embossing depth of the bottom side wall area at different heights can be detected and obtained, so that the embossing depth of the bottom side wall area at different heights can be monitored, the embossing effect of the bottom side wall area at different heights can be detected, after the embossing depth of the bottom side wall area at different heights is obtained, the depth variance value of the embossing depth at different heights can be determined, and whether the embossing depth at different heights meets the requirements can be determined according to the depth variance value of the embossing depth at different heights.
Illustratively, the bottom sidewall areas may be embossed areas at heights of 10mm, 30mm, 50mm, respectively, from the bottom sidewall areas at different heights.
For example, the detection of the embossing depth of the bottom side wall area at different heights can be automatically performed by a laser detection head.
S220, when the depth variance value of the embossing depth at different heights is larger than or equal to the preset depth variance value, prompting information for prompting adjustment of the pressure head of the side wall area of the pot bottom is sent. When the depth variance value of the embossing depth at different heights is smaller than the preset depth variance value, no prompting information for prompting the adjustment of the pressure head of the side wall area of the pan bottom is sent out, and embossing is carried out on the horizontal area of the pan bottom and the side wall area of the pan bottom.
After the depth variance value of the embossing depth at different heights is obtained, when the depth variance value of the embossing depth at different heights is greater than or equal to the preset depth variance value, the defect of uniformity of the embossing depth at different heights is indicated, and at the moment, prompt information for prompting adjustment of the pressure head of the side wall area of the pan bottom can be sent out so as to improve the extrusion effect of the circumferential pressure head 22 for embossing the side wall area of the pan bottom.
After the depth variance value of the embossing depth at different heights is obtained, when the depth variance value of the embossing depth at different heights is smaller than the preset depth variance value, the uniformity of the embossing depth at different heights meets the requirement, the prompting information prompting the adjustment of the pressure head of the side wall area of the bottom of the pot can not be sent out, and the horizontal area of the bottom of the pot and the side wall area of the bottom of the pot are continuously embossed so as to continuously perform the embossing of the bottom of the pot.
For example, the depth variance value of the embossing depth at different heights may be determined by empirical values.
The beneficial effects of the implementation mode are that the embossing depth of the side wall area of the pan bottom at different heights can be monitored, the side wall area of the pan bottom can be prompted to be optimally adjusted, and the embossing uniformity of the side wall area of the pan bottom at different heights is improved.
In some implementations, in S120, the first pressure value is reduced by a first ratio value, and the second pressure value is reduced by a second ratio value, including S121 to S122, and S121 to S122 are specifically described below.
And S121, when the depth variance value of the embossing depth at different heights is smaller than the preset depth variance value, determining the maximum sidewall embossing depth of the side wall area of the pot bottom at different heights, and determining the ratio of the maximum sidewall embossing depth to the second pressure value as a first ratio. A maximum horizontal embossing depth of the horizontal area of the bottom of the pan is determined and a ratio of the maximum horizontal embossing depth to the first pressure value is determined as a second ratio. A ratio of the first ratio and the second ratio is determined as a pressure adjustment ratio.
After the depth variance value of the embossing depth at different heights is obtained, when the depth variance value of the embossing depth at different heights is smaller than a preset depth variance value, the embossing uniformity of the side wall area of the pot bottom is higher, the maximum side wall embossing depth of the side wall area of the pot bottom at different heights can be further determined, the ratio of the maximum side wall embossing depth to the second pressure value is determined, and the first ratio is used as a first ratio, and represents the relation between the maximum side wall embossing depth and the second pressure value.
Meanwhile, the maximum horizontal embossing depth of the horizontal area of the bottom of the pot can be determined, and the ratio of the maximum horizontal embossing depth to the first pressure value is determined as a second ratio, wherein the second ratio represents the relationship between the maximum horizontal embossing depth and the first pressure value.
After the first and second ratios are obtained, the ratio of the first and second ratios may be determined as a pressure adjustment ratio that characterizes the relationship of the maximum horizontal embossing depth to the first pressure value, the maximum sidewall embossing depth, and the second pressure value.
S122, determining the ratio of the maximum first pressure value to the first pressure value as a first ratio value. The product of the first ratio and the pressure adjustment ratio is determined as a second ratio.
When the first pressure value is larger than the maximum first pressure value, the first pressure value needs to be adjusted at the moment, the ratio of the maximum first pressure value to the first pressure value can be determined, and the first pressure value can be adjusted and reduced to the maximum first pressure value through the first ratio value as the first ratio value, so that the first pressure value is ensured not to exceed the threshold value, and the accuracy of the first pressure value is ensured.
For example, the maximum first pressure value may be an empirical value determined from different materials, sizes of pans.
After the first ratio is obtained, the product of the first ratio and the pressure adjustment ratio can be determined and used as a second ratio, so that the second pressure value can be reduced according to the second ratio, and reasonable adjustment of the second pressure value is ensured.
The realization mode has the beneficial effects that the pressure adjustment ratio represents the relation between the maximum horizontal embossing depth and the first pressure value, and between the maximum side wall embossing depth and the second pressure value, and the product of the first ratio and the pressure adjustment ratio is determined to be used as the second ratio, so that the reasonable adjustment of the second pressure value is ensured, and the effect of overall embossing control on the bottom of the pot is improved.
Fig. 5 is a flowchart of a third method for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application, and as shown in fig. 5, the method further includes S310 to S320, and S310 to S320 are specifically described below.
S310, acquiring material information of the pot body, detecting a pot body temperature value through infrared rays, and acquiring material information of the pot body and pot body extrusion correction parameters corresponding to the pot body temperature value.
In order to improve the embossing effect of the pot body, material information of the pot body can be further obtained, the pot body temperature value is detected through infrared rays, pot body extrusion correction parameters corresponding to the material information of the pot body and the pot body temperature value are obtained, and then the pot body extrusion process is controlled according to the pot body extrusion correction parameters.
The pot body extrusion correction parameter table corresponding to the pot body material information and the pot body temperature value can be determined through experience values, and further the pot body extrusion correction parameter corresponding to the pot body material information and the pot body temperature value can be determined through table lookup.
Illustratively, the pan body extrusion correction parameter may be 0.95, 0.9, or 0.85.
S320, determining the product of the first proportion value, the pressure adjustment ratio and the pot body extrusion correction parameter as a second proportion value.
After the pot body extrusion correction parameter is obtained, the product of the first ratio value, the pressure adjustment ratio value and the pot body extrusion correction parameter can be further determined and used as a second ratio value, the second ratio value characterizes the adjustment amplitude of the second pressure value by combining the pot body extrusion correction parameter, and the second pressure value can be adjusted according to the second ratio value.
The realization mode has the beneficial effects that the control effect on the pot body embossing process is improved by combining the adjustment amplitude of the pot body extrusion correction parameter to the second pressure value and the influence of the pot body extrusion correction parameter to the pot body extrusion process, wherein the pot body extrusion correction parameter represents the material information of the pot body and the pot body temperature value.
Fig. 6 is a flowchart of a fourth method for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application, and as shown in fig. 6, the method further includes S410 to S420, and S410 to S420 are specifically described below.
S410, acquiring a pan bottom thickness value corresponding to a pan bottom horizontal region and a side wall thickness value corresponding to a pan bottom side wall region, and acquiring a first mold temperature value of a mold region corresponding to the pan bottom horizontal region and a second mold temperature value of a mold region corresponding to the pan bottom side wall region through infrared detection.
In order to further improve the effect of the bottom of the pan embossing, the bottom thickness value corresponding to the bottom of the pan horizontal region and the side wall thickness value corresponding to the bottom of the pan side wall region can be obtained, and then the embossing process can be controlled through the bottom thickness value corresponding to the bottom of the pan horizontal region and the side wall thickness value corresponding to the bottom of the pan side wall region.
In order to further improve the effect of embossing the bottom of the pan, the first die temperature value of the die area corresponding to the horizontal area of the bottom of the pan and the second die temperature value of the die area corresponding to the side wall area of the bottom of the pan can be obtained through infrared detection, and then the embossing process of the bottom of the pan is controlled through the die temperature in the embossing process of the bottom of the pan.
S420, determining a first correction factor corresponding to the bottom thickness value and the first mold temperature value, and determining a second correction factor corresponding to the side wall thickness value and the second mold temperature value. The first scale value is multiplied by a first correction factor to adjust the first scale value. And multiplying the second proportion value by a second correction factor to adjust the second proportion value.
When the bottom of the pan embossing process is adjusted, a first correction factor corresponding to the bottom of the pan thickness value and the first die temperature value can be further determined, and a second correction factor corresponding to the side wall thickness value and the second die temperature value can be determined, so that the bottom of the pan embossing process can be adjusted according to the first correction factor and the second correction factor, and the optimization control of the bottom of the pan horizontal region embossing process according to the bottom of the pan thickness value and the first die temperature value is realized.
For example, when determining the first correction factor corresponding to the pan bottom thickness value and the first mold temperature value, it may be determined through an empirical value table.
For example, when determining the second correction factor corresponding to the sidewall thickness value and the second mold temperature value, it may be determined by an empirical value table.
When the bottom of the pan embossing process is adjusted according to the first correction factor and the second correction factor, the first correction factor can be multiplied by the first proportion value to adjust the first proportion value, and the second correction factor can be multiplied by the second proportion value to adjust the second proportion value, so that the optimization control of the bottom of the pan side wall area embossing process according to the side wall thickness value and the second mould temperature value is realized.
The realization mode has the beneficial effects that the optimization control of the embossing process of the horizontal region of the pan bottom can be realized according to the thickness value of the pan bottom and the temperature value of the first die, the optimization control of the embossing process of the side wall region of the pan bottom can be realized according to the thickness value of the side wall and the temperature value of the second die, and the embossing control effect of the horizontal region of the pan bottom and the side wall region of the pan bottom is improved.
Fig. 7 is a flowchart of a fourth method for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application, and as shown in fig. 7, the method further includes S510 to S520, and S510 to S520 are specifically described below.
S510, when the side wall area of the pan bottom is of a planar structure, acquiring an inclination angle value corresponding to the side wall area of the pan bottom, and acquiring a side wall extrusion correction coefficient corresponding to the inclination angle value. When the side wall area of the pan bottom is of a curved surface structure, a maximum curvature value corresponding to the side wall area of the pan bottom is obtained, and a side wall extrusion correction coefficient corresponding to the maximum curvature value is obtained.
When the bottom of a pan knurling control is performed, as shown in fig. 2, when the bottom of a pan lateral wall area is in a plane structure, the inclination angle value corresponding to the bottom of a pan lateral wall area can be obtained, the extrusion influence degree of different inclination angles of the bottom of a pan lateral wall area on the lateral wall is different, and then the lateral wall extrusion correction coefficient corresponding to the inclination angle value can be obtained, and the bottom of a pan lateral wall extrusion process is corrected according to the lateral wall extrusion correction coefficient corresponding to the inclination angle value.
For example, the sidewall crush correction coefficient corresponding to the inclination angle value may be determined by an empirical value table corresponding to the inclination angle value and the sidewall crush correction coefficient.
As shown in fig. 3, when the bottom side wall region is in a curved surface structure, the maximum curvature value corresponding to the bottom side wall region is obtained, and different maximum curvature values corresponding to the bottom side wall region have different extrusion influence degrees on the side wall, so that the side wall extrusion correction coefficient corresponding to the maximum curvature value can be obtained, further, the bottom side wall extrusion process can be corrected according to the side wall extrusion correction coefficient corresponding to the maximum curvature value, and the bottom side wall extrusion process can be corrected according to the side wall extrusion correction coefficient corresponding to the maximum curvature value.
The sidewall crush correction coefficients corresponding to the maximum curvature values may be determined, for example, by an empirical value table of sidewall crush correction coefficients corresponding to the maximum curvature values.
S510, multiplying the second proportion value by a side wall extrusion correction coefficient to adjust the second proportion value.
After the sidewall extrusion correction coefficient is obtained, the sidewall extrusion correction coefficient may be multiplied by a second ratio value to adjust the second ratio value so that the sidewall embossing process can be controlled in combination with the sidewall extrusion correction coefficient.
The beneficial effects of the realization mode are that the extrusion influence degree of different inclination angles of the side wall area of the pan bottom to the side wall is different, and the extrusion influence degree of different maximum curvature values corresponding to the side wall area of the pan bottom to the side wall is different, the extrusion process of the pan bottom can be controlled according to the extrusion influence degree of different inclination angles to the side wall and the extrusion influence degree of different maximum curvature values to the side wall, and the optimization effect of the extrusion process of the pan bottom is improved.
Fig. 8 is a flowchart of a fourth method for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application, and as shown in fig. 8, the method further includes S610 to S620, and S610 to S620 are specifically described below.
S610, obtaining the embossing depth of a transition area between the horizontal area of the pot bottom and the side wall area of the pot bottom, and determining the depth variance value of the embossing depth of the transition area as the transition embossing depth variance value. And obtaining a transition adjustment coefficient corresponding to the material on the pot bottom, and determining the product of the transition adjustment coefficient and the pressure difference value to be used as a transition pressure adjustment value.
When the pan bottom is extruded, the transition area between the pan bottom horizontal area and the pan bottom side wall area can influence the embossing quality due to the bending of the pan bottom, so that the embossing depth of the transition area between the pan bottom horizontal area and the pan bottom side wall area can be obtained, and the embossing quality can be further monitored through the embossing depth of the transition area.
When the embossing process is monitored, the depth variance value of the embossing depth of the transition area can be determined and used as the transition embossing depth variance value, and the embossing quality detection is carried out on the transition area between the pan bottom horizontal area and the pan bottom side wall area according to the transition embossing depth variance value.
Illustratively, the transition region between the bottom horizontal region and the bottom side wall region may be a transition region in the range of 5mm to 20mm on both sides of the boundary line of the bottom horizontal region and the bottom side wall region.
When embossing control is carried out on the transition area between the pan bottom horizontal area and the pan bottom side wall area, different pan bottom materials have different bending characteristics, at the moment, the transition adjustment coefficient corresponding to the pan bottom materials can be further obtained, meanwhile, the pressure difference value between the first pressure value and the second pressure value can influence the bending state and material slippage of the transition area between the pan bottom horizontal area and the pan bottom side wall area, at the moment, the product of the transition adjustment coefficient and the pressure difference value can be determined and used as a transition pressure adjustment value, and then the transition area between the pan bottom horizontal area and the pan bottom side wall area can be controlled according to the transition pressure adjustment value.
S620, when the transition embossing depth variance value is larger than or equal to the preset transition embossing depth variance value, reducing the transition pressure adjustment value for the first pressure value and increasing the transition pressure adjustment value for the second pressure value. When the transition embossing depth variance value is smaller than the preset transition embossing depth variance value, the first pressure value and the second pressure value are not adjusted.
After the transition pressure adjustment value is obtained, when the transition embossing depth variance value is larger than or equal to the preset transition embossing depth variance value, the embossing quality of the transition area is poor, at the moment, the transition pressure adjustment value can be reduced for the first pressure value, so that the extrusion force of the horizontal area of the bottom of the pan is properly reduced to avoid influencing the embossing process of the transition area, and meanwhile, the transition pressure adjustment value can be increased for the second pressure value, so that the extrusion force of the side wall area of the bottom of the pan is properly improved, and the poor extrusion effect of the side wall area of the bottom of the pan caused by too small pressure of the side wall area of the bottom of the pan is avoided, so that the embossing quality of the transition area is improved.
When the transition embossing depth variance value is smaller than the preset transition embossing depth variance value, the embossing quality of the transition area is better, and the first pressure value and the second pressure value can not be adjusted at the moment.
The beneficial effects of the realization mode are that, through monitoring the knurling quality of the transition region between bottom of a boiler horizontal region and bottom of a boiler lateral wall region, when the transition region knurling quality between bottom of a boiler horizontal region and bottom of a boiler lateral wall region is not good, reduce transition pressure adjustment value to first pressure value, can avoid suitably reducing the extrusion force to bottom of a boiler horizontal region and avoid producing the influence to the knurling process of transition region, can increase transition pressure adjustment value to the second pressure value simultaneously, with suitably improving the extrusion force to bottom of a boiler lateral wall region, avoid bottom of a boiler lateral wall region's pressure to be too little and cause bottom of a boiler lateral wall region's extrusion effect not good, improved the knurling quality to transition region.
Fig. 9 is a flowchart of a fourth method for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application, and as shown in fig. 9, the method further includes S710 to S720, and S710 to S720 are specifically described below.
S710, determining the maximum embossing depth and the minimum embossing depth of the transition area, and determining an embossing depth difference value of the maximum embossing depth and the minimum embossing depth of the transition area. And determining the minimum embossing depth of the bottom sidewall area at different heights.
When the embossing control is performed on the transition region, the maximum embossing depth and the minimum embossing depth of the transition region can be further determined, and an embossing depth difference value of the maximum embossing depth and the minimum embossing depth of the transition region is determined, wherein the embossing depth difference value represents the variation range of the embossing depth of the transition region.
For further detection of the transition region, the minimum embossing depth of the bottom side wall region at different heights can be determined, the minimum embossing depth of the bottom side wall region at different heights is the minimum embossing depth in the whole range of the bottom side wall region, and further the embossing quality can be evaluated according to the minimum embossing depth of the bottom side wall region at different heights.
S720, increasing a transition pressure adjustment value for the second pressure value when the minimum embossing depth of the transition area and the minimum embossing depth of the side wall area of the pan bottom at different heights are smaller than the preset minimum embossing depth. And when the minimum embossing depth of the transition area and the minimum embossing depth of the side wall area of the pot bottom at different heights are larger than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition area is larger than or equal to the preset maximum embossing depth, reducing the transition pressure adjusting value for the second pressure value.
When the embossing quality of the transition area and the embossing quality of the bottom side wall area are evaluated, when the minimum embossing depth of the transition area and the minimum embossing depth of the bottom side wall area at different heights are smaller than the preset minimum embossing depth, the embossing depths of the bottom side wall area and the transition area are too small, and at the moment, the transition pressure adjusting value can be increased for the second pressure value so as to ensure that the minimum embossing depth of the transition area and the minimum embossing depth of the bottom side wall area reach the embossing depth requirement.
When the embossing quality of the transition area and the bottom side wall area is evaluated, the minimum embossing depth of the transition area and the minimum embossing depth of the bottom side wall area at different heights are larger than or equal to the preset minimum embossing depth, and the maximum embossing depth of the transition area is larger than or equal to the preset maximum embossing depth, the fact that the embossing depth of the transition area is overlarge is indicated, and possibly, the second pressure value is overlarge is possibly caused, at the moment, the transition pressure adjusting value can be reduced for the second pressure value, so that the embossing depth of the transition area is reduced, and the embossing quality of the transition area is improved.
The implementation mode has the beneficial effects that the embossing quality of the transition area and the bottom side wall area can be comprehensively evaluated, the embossing quality of the bottom side wall area is prevented from being adversely affected when the single embossing quality is monitored, and the embossing quality of the bottom side wall area and the whole transition area is improved.
In some implementations, the method further includes sending a prompt message for prompting to increase concentricity of embossing the bottom horizontal area and the bottom side wall area when the embossing depth difference is greater than or equal to a preset embossing depth difference. When the embossing depth difference value is larger than or equal to the preset embossing depth difference value, no prompt information for prompting to improve the concentricity of embossing the horizontal area of the bottom and the side wall area of the bottom is sent out.
When the embossing depth difference is monitored, when the embossing depth difference is larger than or equal to the preset embossing depth difference, the embossing depth difference between the maximum embossing depth and the minimum embossing depth of the transition area is too large, which may be caused by poor concentricity of a die pressing head for pressing the pan bottom horizontal area and the pan bottom side wall area, so that prompt information for prompting to improve the concentricity of embossing the pan bottom horizontal area and the pan bottom side wall area can be sent out, and the embossing quality of the transition area is improved.
When the embossing depth difference is monitored, when the embossing depth difference is larger than or equal to the preset embossing depth difference, the concentricity of the die pressing head for pressing the bottom horizontal area and the bottom side wall area is better, and at the moment, no prompt information for prompting to improve the concentricity of embossing the bottom horizontal area and the bottom side wall area is sent out.
The beneficial effect of the implementation manner is that when the embossing depth difference value is larger than or equal to the preset embossing depth difference value, the embossing depth difference value between the maximum embossing depth and the minimum embossing depth of the transition area is too large, and the embossing quality of the transition area can be improved by prompting the prompting information of the concentricity of embossing in the horizontal area of the pot bottom and the side wall area of the pot bottom.
The beneficial effect of the realization mode is that the concentricity of the embossing is monitored through the transition area to the bottom horizontal area and the bottom side wall area, and compared with the integral monitoring to the bottom horizontal area and the bottom side wall area, the range of monitoring to the bottom horizontal area and the bottom side wall area is reduced, and the accuracy of monitoring to the concentricity of the embossing of the bottom horizontal area and the bottom side wall area is improved.
The embodiment of the application also provides equipment for detecting the operation state of the bottom of the pan embossing equipment, which comprises a unit for executing the method.
Fig. 10 is a schematic logic structure diagram of an apparatus for detecting an operation state of a bottom of a pan embossing apparatus according to an embodiment of the present application, as shown in fig. 10, the apparatus 4 of this embodiment includes a processing unit 41, a storage unit 42, and a transceiver unit 43, where the processing unit 41 is configured to process data, the storage unit 42 is configured to store data, the transceiver unit 43 is configured to transmit and receive data, and the processing unit 41, the storage unit 42, and the transceiver unit 43 are mutually matched to implement the above method. The beneficial effects of the embodiments of the present application have been described in the above-mentioned methods, and are not described here again.
It should be noted that, because the content of information interaction and execution process between the above devices/units is based on the same concept as the method embodiment of the present application, specific functions and technical effects thereof may be referred to in the method embodiment section, and will not be described herein.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions. The functional units and modules in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, the specific names of the functional units and modules are only for distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the above system may refer to the corresponding process in the foregoing method embodiment, which is not described herein again.
The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the present application may implement all or part of the flow of the method of the above embodiments, and may be implemented by a computer program to instruct related hardware, where the computer program may be stored in a computer readable storage medium, and when the computer program is executed by a processor, the computer program may implement the steps of each of the method embodiments described above. Wherein the computer program comprises computer program code which may be in source code form, object code form, executable file or some intermediate form etc. The computer readable medium may include at least any entity or device capable of carrying computer program code to a camera device/terminal equipment, a recording medium, a computer Memory, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), an electrical carrier signal, a telecommunications signal, and a software distribution medium. Such as a U-disk, removable hard disk, magnetic or optical disk, etc. In some jurisdictions, computer readable media may not be electrical carrier signals and telecommunications signals in accordance with legislation and patent practice.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the modules or units is merely a logical functional division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection via interfaces, devices or units, which may be in electrical, mechanical or other forms.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
The foregoing embodiments are merely illustrative of the technical solutions of the present application, and not restrictive, and although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that modifications may still be made to the technical solutions described in the foregoing embodiments or equivalent substitutions of some technical features thereof, and that such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims (9)
1. A method for detecting an operational status of a bottom of a pan embossing apparatus, the method comprising:
The method comprises the steps of obtaining a first pressure value for embossing a horizontal area of a bottom of a pan and a second pressure value for embossing a side wall area of the bottom of the pan, determining a difference value between the first pressure value and the second pressure value as a pressure difference value;
when the first pressure value is larger than a preset first pressure threshold value, the pressure value is reduced according to a first proportion value, and the pressure value is reduced according to a second proportion value, wherein the first proportion value is larger than the second proportion value;
The method further comprises the steps of:
Obtaining embossing depths of side wall areas of the pan bottom at different heights, and determining depth variance values of the embossing depths at different heights;
When the depth variance value of the embossing depth at different heights is smaller than the preset depth variance value, no prompt message for prompting the adjustment of the pressure head of the side wall area of the pan bottom is sent out, and the horizontal area of the pan bottom and the side wall area of the pan bottom are embossed.
2. The method of claim 1, wherein reducing the pressure value by a first ratio for the first pressure value and by a second ratio for the second pressure value comprises:
When the depth variance value of the embossing depth at different heights is smaller than the preset depth variance value, determining the maximum sidewall embossing depth of the side wall area of the pot bottom at different heights, and determining the ratio of the maximum sidewall embossing depth to the second pressure value as a first ratio;
the ratio of the maximum first pressure value to the first pressure value is determined as a first ratio value, and the product of the first ratio value and the pressure adjustment ratio value is determined as a second ratio value.
3. The method of claim 2, wherein the method further comprises:
Acquiring material information of a pot body, detecting a pot body temperature value through infrared rays, and acquiring pot body extrusion correction parameters corresponding to the material information of the pot body and the pot body temperature value;
and determining the product of the first proportion value, the pressure adjustment proportion value and the pot body extrusion correction parameter as a second proportion value.
4. A method as claimed in claim 3, wherein the method further comprises:
acquiring a pan bottom thickness value corresponding to a pan bottom horizontal region and a side wall thickness value corresponding to a pan bottom side wall region, and acquiring a first mold temperature value of a mold region corresponding to the pan bottom horizontal region and a second mold temperature value of a mold region corresponding to the pan bottom side wall region through infrared detection;
Determining a first correction factor corresponding to the bottom thickness value and the first mold temperature value, determining a second correction factor corresponding to the side wall thickness value and the second mold temperature value, multiplying the first correction factor by the first ratio value to adjust the first ratio value, and multiplying the second correction factor by the second ratio value to adjust the second ratio value.
5. The method of claim 4, wherein the method further comprises:
when the bottom side wall area is of a curved surface structure, obtaining a maximum curvature value corresponding to the bottom side wall area and obtaining a side wall extrusion correction coefficient corresponding to the maximum curvature value;
And multiplying the second proportion value by a side wall extrusion correction coefficient to adjust the second proportion value.
6. The method of claim 5, wherein the method further comprises:
Obtaining a transition adjustment coefficient corresponding to the pan bottom material, and determining the product of the transition adjustment coefficient and the pressure difference value as a transition pressure adjustment value;
When the transition embossing depth variance value is larger than or equal to the preset transition embossing depth variance value, the transition pressure adjustment value is reduced for the first pressure value, the transition pressure adjustment value is increased for the second pressure value, and when the transition embossing depth variance value is smaller than the preset transition embossing depth variance value, the first pressure value and the second pressure value are not adjusted.
7. The method of claim 6, wherein the method further comprises:
Determining the maximum embossing depth and the minimum embossing depth of the transition area, determining the embossing depth difference value of the maximum embossing depth and the minimum embossing depth of the transition area, and determining the minimum embossing depth of the side wall area of the pan bottom at different heights;
And increasing the transition pressure adjustment value for the second pressure value when the minimum embossing depth of the transition area and the minimum embossing depth of the bottom side wall area at different heights are smaller than the preset minimum embossing depth, and decreasing the transition pressure adjustment value for the second pressure value when the minimum embossing depth of the transition area and the minimum embossing depth of the bottom side wall area at different heights are larger than or equal to the preset minimum embossing depth and the maximum embossing depth of the transition area is larger than or equal to the preset maximum embossing depth.
8. The method of claim 7, wherein the method further comprises:
When the embossing depth difference is greater than or equal to the preset embossing depth difference, a prompt message for prompting the improvement of the concentricity of the embossing of the bottom horizontal area and the bottom side wall area is sent out, and when the embossing depth difference is greater than or equal to the preset embossing depth difference, a prompt message for prompting the improvement of the concentricity of the embossing of the bottom horizontal area and the bottom side wall area is not sent out.
9. An apparatus for detecting the operating state of a bottom of a pan embossing apparatus, characterized in that it comprises means for performing the method of any one of claims 1 to 8.
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| JP6061524B2 (en) * | 2011-08-11 | 2017-01-18 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
| CN207412016U (en) * | 2017-05-26 | 2018-05-29 | 佛山市顺德区美的电热电器制造有限公司 | Cookware and cooking equipment |
| US10895806B2 (en) * | 2017-09-29 | 2021-01-19 | Canon Kabushiki Kaisha | Imprinting method and apparatus |
| KR20250078587A (en) * | 2019-12-25 | 2025-06-02 | 싸이백스 가부시키가이샤 | Imprinting device and imprinting method |
| CN118425464A (en) * | 2023-02-01 | 2024-08-02 | 金卡智能集团股份有限公司 | Method and device for acquiring gas pressure state, electronic equipment and storage medium |
| CN115810815B (en) * | 2023-02-06 | 2023-05-05 | 江苏南极星新能源技术股份有限公司 | Processing method and system suitable for battery protection |
| CN117316831B (en) * | 2023-11-28 | 2024-02-02 | 南昌中微半导体设备有限公司 | Pressure controller, semiconductor processing apparatus, and air pressure control method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115743507A (en) * | 2022-12-01 | 2023-03-07 | 上海船舶研究设计院 | Ballast tank pressure regulating method and device, electronic equipment, storage medium and ship |
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