CN1201649C - Improved package structure of image sensor - Google Patents

Abstract

The invention relates to an improved packaging structure of an image sensor, which comprises an image sensing chip, a plurality of electronic circuits and a plurality of lead wires, wherein each electronic circuit is provided with a welding pad; a flexible circuit board with an upper surface and a lower surface, a signal input terminal formed on the lower surface corresponding to each bonding pad of the image sensing chip and electrically connected to a signal output terminal, and a light transmission layer covering the upper surface of the flexible circuit board and having a signal input terminal and a signal output terminal, wherein the signal output terminal is electrically connected to the printed circuit board. Therefore, the manufacturing is more convenient, and the production cost can be greatly reduced.

Description

Improved package structure of image sensor

technical field

The invention relates to an improved packaging structure of an image sensor, in particular to a packaging structure of an image sensor made in the form of a flip chip, which can simplify the production process and reduce the manufacturing cost.

Background technique

Press, a general sensor is used to measure a signal, which can be a light signal or a sound signal, and the sensor of the present invention is used to receive an image signal, convert the image signal into an electrical signal and transmit it to the printed circuit board superior.

Please refer to FIG. 1 for a cross-sectional view of a conventional image sensor, which includes:

There is a substrate 10 , which is made of ceramic material. A signal input terminal 12 and a signal output terminal 14 are arranged around the substrate. The signal output terminal 14 is used to electrically connect to a printed circuit board 16 .

A spacer 18 is arranged on the substrate 10, so that the substrate 10 forms an accommodating chamber 20;

An image sensing chip 22 is arranged on the substrate 10 and located in the accommodation chamber 20 formed by the substrate 10 and the spacer 18 , and is electrically connected to the bonding pad 26 of the image sensing chip 22 and the substrate 10 by a plurality of wires 24 The signal input terminal 12 of the substrate 10 is electrically connected to the image sensor chip 22 .

A light-transmitting glass 28 is fixed on the spacer 18, so that the image sensor chip 22 can receive image signals through the light-transmitting glass 28, and convert the image signals into electrical signals and transmit them to the signal input terminal 12 of the substrate 10. The electrical signal is transmitted to the signal output terminal 14 through the signal input terminal 12 of the substrate 10 , and then transmitted to the printed circuit board 16 through the signal output terminal 14 .

The packaging structure of the above-mentioned image sensor has many components and the production process is relatively complicated. Furthermore, the substrate 10 is made of ceramic material, which is quite expensive, and the ceramic material is not easy to cut during manufacture, so It must be manufactured in a single piece, and its manufacturing cost is relatively high.

Contents of the invention

The object of the present invention is to provide an improved package structure of an image sensor, which directly packages the image sensor chip on a flexible circuit board in a flip-chip manner, without using the substrate as a signal transmission medium, and reduces the number of package components. The efficacy, so that the package cost is reduced.

The object of the present invention is achieved in this way: an improved packaging structure of an image sensor, which is used to electrically connect to a printed circuit board, is characterized in that it includes an image sensor chip on which a plurality of electronic circuits are formed , each electronic circuit is provided with a welding pad; a flexible circuit board is provided with an upper surface and a lower surface, and the lower surface forms a signal input terminal relative to each welding pad position of the image sensing chip, and the The signal input terminal is electrically connected to the bonding pad of the image sensor chip, and each signal input terminal is electrically connected to a signal output terminal, so that the image sensor chip is electrically connected to the printed circuit board; and a light-transmitting layer, which covers the upper surface of the flexible circuit board, and is provided with a signal input terminal and a signal output terminal, and the signal output terminal is electrically connected to the printed circuit board.

The transparent layer is a transparent glass.

The flexible circuit board has a hollow slot, and the signal input end is formed on the periphery of the hollow slot.

Each welding pad position of the image sensing chip is formed with a metal contact for electrical connection with the signal input end of the flexible printed circuit board.

A sealant layer is formed between the image sensing chip and the transparent layer.

Due to the adoption of the above solution: the manufacturing is more convenient, and the production cost can be greatly reduced.

Description of drawings

FIG. 1 is a cross-sectional view of a package structure of a conventional image detector.

FIG. 2 is a cross-sectional view of an improved packaging structure of the image detector of the present invention.

FIG. 3 is an exploded view of the improved packaging structure of the image detector of the present invention.

FIG. 4 is an implementation diagram of the improved packaging structure of the inventive image detector.

Detailed ways

The present invention can be understood more deeply by the following drawings and detailed description:

Please refer to FIG. 2, which is a cross-sectional view of an improved package structure of the image sensor of the present invention, which includes:

An image sensor chip 30 is provided with an upper surface 32 and a lower surface 34, the upper surface 32 is formed with many electronic circuits (not shown), each electronic circuit is provided with a welding pad 36, each welding pad Metal contact 38 (Gold Bump) is formed on 36 .

A flexible circuit board 40, which is provided with an upper surface 42 and a lower surface 44, a signal input terminal 46 is formed on the lower surface 44 relative to each solder pad 36 of the image sensor chip 30, for electrically connecting to the image sensor The metal contact 38 on the pad 36 of the test chip 30, each signal input end 46 is electrically connected to a signal output end 48 formed on the lower surface 44 of the flexible circuit board 40; the central part of the flexible circuit board 40 has a Compared with the image sensor chip 30, it is a smaller hollow groove 50, and the signal input terminal 46 is located around the hollow groove 50, so that when the metal contact 38 of the image sensor chip 30 is electrically connected to the signal input terminal 46 of the flexible circuit board 40 , the image sensing chip 30 is exposed from the hollow groove 50 .

A light-transmitting layer 52, which is light-transmitting glass, is bonded to the upper surface 42 of the flexible circuit board 40 to cover the hollow groove 50 of the flexible circuit board 40, and the image sensing chip 30 can pass through the light-transmitting layer 52 receives the video signal and converts the video signal into an electrical signal.

Please refer to FIG. 3 , when the present invention is packaged, firstly, the image sensing chip 30 is electrically connected to the flexible circuit board 40 in a flip-chip manner, so that the metal contact 38 on the flexible circuit board 40 is connected to the signal input terminal 46 of the flexible circuit board 40. They are electrically connected to each other and can be bonded and fixed with glue. Then the light-transmitting layer 52 is bonded on the flexible circuit board 40 with glue 54, and then an encapsulation layer 56 is used to fill the periphery of the image sensor chip 30 and the light-transmitting layer 52, and the flexible circuit board 40 and the image sensor The sensing chip 30 is sealed to protect the electrical connection between the flexible circuit board 40 and the image sensing chip 30 . Therefore, the image sensing chip 30 can receive the image signal through the light-transmitting layer 52, convert the image signal into an electrical signal and transmit it to the signal input terminal 46 of the flexible circuit board 40, and then transmit the signal input terminal 46 to the signal output terminal. 48.

Referring to Fig. 4, the completed image sensor is placed in the gap 60 formed by the printed circuit board 58, and the signal output terminal 48 of the flexible circuit board 40 is then electrically connected to the printed circuit board 58, so that the image sensor The test chip 30 receives the image signal through the light-transmitting layer 52, converts the image signal into an electrical signal, and transmits the electrical signal to the signal input terminal 36 of the flexible circuit board 40, and then the signal output terminal 48 of the flexible circuit board 40 to the printed circuit board 58.

With the combination of the above structures, the improved packaging structure of the image sensor of the present invention has the following advantages:

1. Using the flexible circuit board 40 as the signal transmission medium of the image sensing chip 30 can save the conventional components of the substrate 10 and reduce the production cost.

2. Since the components of the conventional substrate 10 are omitted, the package volume of the image sensor can be light, thin and short.

3. Since the flexible circuit board 40 can be easily cut, a plurality of image sensors can be packaged at the same time, and then cut into a single package, so the mass production cost is low.

The specific embodiments proposed in the detailed description of the preferred embodiments, in order to easily illustrate the technical content of the present invention, are not to limit the invention to the embodiments in a narrow sense. Altered implementations are within the scope of the invention.

Claims (5)

1, a kind of improvement packaging structure of image sensor, it is characterized in that in order to be electrically connected on the printed circuit board (PCB): include an image sensing wafer, be formed with most electronic circuits on it, each electronic circuit all is provided with a weld pad; One flexible circuit board, it is provided with a upper surface and a lower surface, this lower surface is formed with a signal input end with respect to each bond pad locations of this image sensing wafer, and this signal input end is with on the weld pad that is electrically connected on this image sensing wafer, reach this each signal input end and be electrically connected on a signal output end, and make image sensing wafer to be electrically connected on this printed circuit board (PCB); And a photic zone, it is covered in the upper surface of this flexible circuit board, and which is provided with signal input end and signal output end, and this signal output end is to be electrically connected this printed circuit board (PCB).

2, the improvement packaging structure of image sensor as claimed in claim 1 is characterized in that: described photic zone is a transparent glass.

3, the improvement packaging structure of image sensor as claimed in claim 1, it is characterized in that: described flexible circuit board has a hollow slots, and this signal input end is formed at this hollow slots periphery.

4, the improvement packaging structure of image sensor as claimed in claim 1; It is characterized in that: each bond pad locations of described image sensing wafer is formed with metallic contact, in order to be electrically connected with the signal input end of this flexible circuit board.

5, the improvement packaging structure of image sensor as claimed in claim 1 is characterized in that: be formed with adhesive layer between described image sensing wafer and this photic zone.

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