CN1200464C - Encapsulation method of electroluminescence element - Google Patents

Abstract

The invention relates to a packaging method of an electroluminescent element, which comprises the steps of providing a glass substrate with the electroluminescent element and a corresponding glass cover plate under the water and oxygen control environment, coating frame glue on the cover plate corresponding to the frame position of each light-emitting element of the substrate, and reserving an opening at one side without a circuit at the periphery of the light-emitting element; secondly, pressing the cover plate and the substrate and curing the frame glue; cutting and separating the light-emitting elements to form individual packages; then, placing the packaging piece into the vacuum cavity for air suction, and immersing the packaging piece into a glue groove at the bottom of the vacuum cavity when the pressure in the vacuum cavity reaches a set value, so that the opening of the packaging piece is in contact with a packaging material; and then raising the pressure of the vacuum cavity, filling the cavity with the packaging material due to the difference between the internal pressure and the external pressure of the packaging part, and curing the packaging material in the cavity to finish the packaging of the light-emitting element.

Description

Encapsulation method of electroluminescence element

technical field

The present invention relates to a packaging method for electro-luminescent (Electro-Luminescent, EL) components, and in particular to a packaging method for organic electro-luminescent (Organic Electro-Luminescent, OEL) components.

Background technique

The research and development of organic electroluminescence began in the 1960s. Organic electroluminescence elements use organic compounds as materials for the light-emitting layer, which are sandwiched between the upper metal electrode and the lower transparent anode. According to the types of organic materials, they can be divided into small molecule light-emitting diodes (Organic Light-Emitting Diode, OLED) and polymer light-emitting diodes (Polymer Light-Emitting Diode, PLED). In the early 1980s, Kodak Corporation of the United States used Tri-(8-Hydroxyquinoline) Aluminum (Alq ₃ ) as the organic light-emitting layer, and inserted a hole injection layer between the light-emitting layer and the anode. (Hole Injecting Layer) to improve recombination efficiency and establish the practicality of organic light-emitting devices. In 1990, the University of Cambridge used Poly (p-Phenylene Vinylene), PPV (Conjugated Polymer) to manufacture polymer organic light-emitting diodes. The materials have semiconductor-like characteristics and the process of polymer light-emitting diodes (PLEDs) is simple, thus triggering the second wave of research on organic light-emitting diodes. Organic electroluminescence has the characteristics of self-illumination, wide viewing angle (up to 160 degrees), high response speed, low driving voltage, and full color. Kanban, computer and TV screens, etc.

The technical development of organic light-emitting diodes can be roughly divided into two categories: small molecule and polymer light-emitting diodes according to the organic materials used. The working efficiency and life of the components depend on the characteristics of organic materials, process parameters and process In addition to environmental control, good packaging is an important key to maintaining component performance. From a technical point of view, material synthesis and process research and development have reached the level of commercialization; however, due to the lack of fast and effective packaging technology, organic light-emitting diodes can only reach the scale of experiment or trial production , so it cannot be mass-produced.

The organic membrane material in the organic electroluminescent element is very sensitive to moisture and oxygen, because moisture and oxygen will cause deterioration of the organic membrane material, thereby affecting the service life of the organic electroluminescent element. In order to effectively eliminate the influence of moisture, oxygen and other factors on the organic electroluminescent element and prolong the service life of the element, the organic electroluminescent element must be packaged.

Please refer to FIG. 1A to FIG. 1B , which are schematic cross-sectional views of a conventional packaging method of an organic electroluminescent diode and its manufacturing process. As shown in FIG. 1A, a glass substrate 100 containing an organic electroluminescent diode 102 is first provided, and then an ultraviolet glue (ie, UV glue) 104 is coated on the glass substrate 100 and the frame of the organic electroluminescent diode 102 by a glue dispenser. Location. Referring to FIG. 1B again, the organic electroluminescent diode 102 is covered with a glass cover plate 106, and the ultraviolet glue 104 is pressed against the glass substrate 100, and then the package is irradiated with ultraviolet light (UV) to cure the ultraviolet glue 104, and the process is completed. Encapsulation of the organic electroluminescence diode 102 .

Next, please refer to FIG. 2A to FIG. 2B , which are schematic cross-sectional views of another known packaging method of organic light-emitting diodes and its manufacturing process. As shown in FIG. 2A , first place the stamped metal cover 206 on a jig (not shown in the figure), use a dispenser to apply UV glue 204 to the edge of the metal cover 206, and apply the moisture-absorbing layer ( Moisture Absorption Sheet) 208 is disposed in the metal cover 206. The position of the metal cover 206 in the jig corresponds to the position of the components to be packaged on the glass substrate. Referring to FIG. 2B again, the glass substrate 200 containing the organic electroluminescent diode 202 is covered on the metal cover 206, and the edge of the metal cover 206 is pressed by the ultraviolet glue 204, and then the package is irradiated with ultraviolet light to make the ultraviolet glue 204 is cured to complete the packaging of the organic electroluminescent diode 202 .

The aforementioned two packaging methods are not difficult to apply to mass production. However, only the ultraviolet glue on the frame position of the element cannot effectively block the external moisture and oxygen, so the influence of moisture and oxygen on the quality and performance of the light-emitting element cannot be reduced. Moreover, in order to use the UV glue located on the frame of the component to isolate the moisture and oxygen from the outside and achieve a good packaging effect, the component must be under positive pressure (that is, greater than atmospheric pressure), such as filling high-purity nitrogen inside the component. But this is not easy to realize for the process, and it will increase the process steps, reduce the production efficiency, lead to poor product qualification rate and increase the production cost.

Please refer again to FIG. 3A to FIG. 3B , which are schematic cross-sectional views of yet another known packaging method of an organic electroluminescent diode and its manufacturing process. As shown in FIG. 3A , a glass substrate 300 containing organic electroluminescent diodes 302 is first provided, and then epoxy resin (Epoxy Resin) 304, commonly known as AB glue, is coated on each organic electroluminescent diode 300 on the glass substrate 300 by a dispenser. the entire surface of the diode 302. Referring again to FIG. 3B , the OLED 302 is covered with a glass cover 306 , and the epoxy resin 304 is bonded to the glass substrate 300 , and then the epoxy resin 304 is naturally hardened to complete the packaging of the OLED 302 .

However, the above-mentioned encapsulation method has a relatively good encapsulation effect on the entire surface of the organic electroluminescent diode coated with epoxy resin, but the uniformity of the epoxy resin is difficult to control when the entire surface is coated with epoxy resin. It is difficult to carry out mass production. In addition, when the glass substrate and the glass cover or the metal cover are pressed together, it is easy to cause glue overflow on the entire surface of the component, causing the circuit connecting the light-emitting component and other external components to be covered by the glue, resulting in the light-emitting component being unable to work normally after packaging , resulting in reduced production efficiency, poor product pass rate, and increased production costs. Moreover, when the glass cover is covered, air bubbles are likely to be generated between the epoxy resin and the glass cover, which will still cause adverse effects on the light-emitting element.

Contents of the invention

Therefore, the present invention provides a method for encapsulating an electroluminescent element, which can effectively block moisture and oxygen from the outside and prevent negative effects such as quality deterioration and performance degradation of the light-emitting element. Furthermore, this method can quickly and effectively package the light-emitting elements, improve production efficiency and product qualification rate, and reduce production costs, so that it can reach the scale of mass production, and can prevent the occurrence of glue overflow between the cover plate and the substrate and Bubbles and the like generated between the cover plate and the encapsulation material will adversely affect the light-emitting element. Moreover, this packaging method can be applied to the packaging of organic electroluminescent elements such as organic light emitting diodes, and is a packaging technology that can mass produce organic electroluminescent diodes.

According to the above and other purposes of the present invention, a method for encapsulating electroluminescent elements is proposed. In an environment where the concentration of water and oxygen is controlled, a glass substrate with an electroluminescent element and a corresponding glass cover plate are first provided. Apply frame glue on the board corresponding to the frame position of each light-emitting element on the substrate, and reserve an opening on the side without the circuit around the light-emitting element; then press the cover plate and the substrate to cure the frame glue; then cut the substrate , to separate the light-emitting elements to form individual packages; then put the package into the vacuum chamber to pump air, when the pressure in the vacuum chamber reaches the set value, immerse the package in the glue groove at the bottom of the vacuum chamber, let The opening of the package is in contact with the packaging material; then the pressure in the vacuum cavity is increased to fill the cavity with the packaging material due to the pressure difference between the inside and outside of the package, and then the packaging material in the cavity is cured to complete the packaging of the light-emitting element.

Description of drawings

1A to 1B are schematic cross-sectional views of a known organic electroluminescent diode packaging process;

2A to 2B are schematic cross-sectional views of another known organic electroluminescent diode packaging process;

3A to 3B are schematic cross-sectional views of yet another known organic electroluminescent diode packaging process;

4 is a flow chart of a packaging method for an electroluminescent element according to the first embodiment of the present invention;

5A to 5H are schematic diagrams of a packaging process of an electroluminescent element according to the first embodiment of the present invention;

6 is a schematic cross-sectional view of a glass substrate containing an organic electroluminescent diode;

7 is a flow chart of a packaging method for a large-area electroluminescent element according to the second embodiment of the present invention;

8A to 8F are schematic diagrams of a packaging process of a large-area electroluminescent device according to the second embodiment of the present invention.

Explanation of reference signs:

100, 200, 300, 500, 500a, 600, 800: glass substrate

102, 202, 302: organic electroluminescent diodes

104, 204: UV glue

106, 306, 504, 504a, 804: glass cover

206: metal cover

208: Hygroscopic layer

304: epoxy resin

400~414: Encapsulation steps of electroluminescent components

502, 802: electroluminescence element

506, 806: frame position

508, 808: frame glue

510, 810: spacers

512, 812: opening

514, 814: circuit

516, 816: packages

518, 818: cavity

520, 820: vacuum chamber

522, 822: glue groove

524, 524a, 824, 824a: Packaging material

530, 830: water and oxygen control environment

602: Indium tin oxide layer

604: organic membrane material

606: metal electrode layer

610: Hole injection layer

612: Hole transport layer

614: Luminescent layer

616: Electron transport layer

700~710: Encapsulation steps of large-area electroluminescent elements

Detailed ways

Please refer to FIG. 4 , which is a flow chart of a packaging method for electroluminescent elements according to the first embodiment of the present invention. 5A to 5H are schematic diagrams of the manufacturing process of a packaging method for electroluminescent elements according to the first embodiment of the present invention. Steps 400-414 in FIG. 4 correspond to FIG. 5A-FIG. 5H respectively.

As shown in step 400 in FIG. 4 , and please refer to FIG. 5A , first in an environment 530 in which the concentration of water and oxygen is controlled, for example, in an environment where the concentration of water and oxygen is less than one part per million (1ppm), This kind of control environment includes a glove box (Dry Box) etc., then provide a glass substrate 500 with an electroluminescent element 502 and a glass cover plate 504 corresponding to the glass substrate 500, and coat the frame position 506 on the glass cover plate 504 Frame glue 508 , and an opening 512 is reserved on the side corresponding to each electroluminescent element 502 without a circuit, that is, no frame glue is applied at the position of the opening 512 .

5A includes a top view of a glass cover 504 and a glass substrate 500 and a schematic cross-sectional view of a part of the area, wherein each frame position 506 on the glass cover 504 corresponds to each electroluminescent element 502 on the glass substrate 500, and the frame glue 508 There is a spacer (Spacer) 510 in it, and the material of the frame glue 508 includes heat-curable glue (such as AB glue), ultraviolet light-curable glue (such as UV glue), and the like.

The electroluminescent element 502 in FIG. 5A includes an organic electroluminescent element, such as an organic electroluminescent diode or the like. As shown in FIG. 6 , it is a schematic cross-sectional view of a glass substrate containing an organic electroluminescent diode. There is a patterned indium tin oxide layer (Indium TinOxide, ITO) 602 on the surface of the glass substrate 600, and an organic film material 604 is covered on the The surface of the indium tin oxide layer 602 and the surface of the organic film material 604 are covered with a metal electrode 606 layer. The organic film material 604 includes a hole injection layer 610, a hole transport layer (Hole Transport Layer) 612, a light emitting layer (Light Emitting Layer) 614, an electron transport layer (Electron Transport Layer) 616 and the like.

Next, please refer to step 402 in FIG. 4 and FIG. 5B (the schematic cross-sectional view of a part of the area after the cover plate and the substrate are pressed together). 504 is pressed against the glass substrate 500 with the electroluminescent element 502 , so that the electroluminescent element 502 is located between the sealant 508 , the glass substrate 500 and the glass cover 504 . The sealant 508 is used to bond the glass substrate 500 and the glass cover 504 to seal the light-emitting element 502 , and the spacer 510 contained therein is used to control the gap between the glass substrate 500 and the glass cover 504 . When coating the sealant 508 , a spacer 510 is added to the sealant 508 to make the distance between the glass substrate 500 and the glass cover 504 a fixed value.

Next, please refer to step 404 of FIG. 4 and FIG. 5C (the schematic cross-sectional view of some areas after the sealant is cured). 508 curing. If the material of the frame glue 508 is a UV-curable glue, then irradiate with ultraviolet light to cure the frame glue 508; if the material of the frame glue 508 is a heat-curable glue, it must be combined with a UV-curable glue and irradiated with ultraviolet light. First, position the relative positions of the glass substrate 500 and the glass cover plate 504, and then cure the frame glue 508 made of thermosetting adhesive, for example, perform curing to cure the thermosetting adhesive or allow the thermosetting adhesive to naturally hardening.

Then, perform step 406 in FIG. 4 and refer to FIG. 5D (the top view of the cover plate and the substrate after pressing), in the environment 530 where the concentration of water and oxygen is controlled, the glass after the pressing and the sealant 508 for bonding has cured The substrate 500 and the glass cover 504 are cut according to the distribution of the electroluminescent elements 502 and their corresponding frame positions 506 on the glass substrate 500 , and the dotted line in FIG. 5D is one of the cutting methods.

Then proceed to step 408 in FIG. 4 and refer to FIG. 5E (the top view and cross-sectional view of the package), in an environment where the concentration of water vapor and oxygen is controlled, after the glass substrate 500 and the glass cover 504 are cut, press each electrode The distribution state of the light-emitting elements 502 and their corresponding frame positions 506 separates them individually, for example, using a splitter to separate each light-emitting element, and reserves the circuit 514 required for the external electrical connection of each electroluminescent element 502 to form an independent package 516 . Each package 516 includes an element glass substrate 500 a having an electroluminescence element 502 , a sealant 508 , an element glass cover 504 a, and a cavity 518 formed therefrom.

Please refer to step 410 and FIG. 5F in FIG. 4, a vacuum chamber 520 is provided, and a glue tank 522 is disposed at the bottom thereof, and a packaging material 524 is housed in the glue tank 522, and the packaging material 524 includes UV-curable glue or heat Curing glue, etc. In a water and oxygen controlled environment, the cut packages 516 are put into a vacuum chamber 520 . Therefore, when the vacuum chamber 520 is evacuated, the package 516 and the packaging material 524 etc. located in the vacuum chamber 520 are simultaneously evacuated. The encapsulation material 524 within the groove 522 is in contact.

Referring to step 412 and FIG. 5G in FIG. 4 at the same time, when the vacuum degree in the vacuum chamber 520 reaches the set pressure, for example, less than 1 atmosphere, the height of the package 516 is lowered so that the opening 512 is immersed in the glue groove 522. , and contact with the surface of the encapsulation material 524 for potting. Due to the capillary phenomenon, the encapsulation material 524 in the glue groove 522 will be sucked into the cavity 518 of the encapsulation 516 through the opening 512 . Then, dry gas (for example: high-purity nitrogen) is introduced into the vacuum chamber 520 to increase the pressure, for example, the pressure is increased to normal pressure or about 1 atmosphere, so that the packaging material 524 is continuously injected due to the pressure difference between the inside and outside of the package 516 And fill the cavity 518 in the package 516 to completely cover the electroluminescent element 502 therein, so no air bubbles will be generated in the element packaging material 524a in the cavity 518, preventing the air bubbles from affecting the quality and life of the light-emitting element.

Then, as shown in step 414 in FIG. 4 and referring to FIG. 5H , after the cavity 518 of the package 516 is filled with the element encapsulation material 524a, the element encapsulation material 524a is cured to complete the encapsulation of the electroluminescent element. If the material used in the component encapsulation material 524a is a UV-curable glue, it can be cured by irradiating ultraviolet light; Natural hardening.

The packaging method of the electroluminescent element proposed by the present invention can also be applied to the packaging of large-area electroluminescent elements. Please refer to FIG. 7 , which is a flow chart of a packaging method for large-area electroluminescent elements according to the second embodiment of the present invention. 8A to 8F are schematic diagrams of the manufacturing process of a packaging method for large-area electroluminescent elements according to the second embodiment of the present invention. Similar to the first embodiment, steps 700 to 710 in FIG. 7 correspond to FIG. 8A to FIG. 8F respectively.

As shown in step 700 in FIG. 7 , and please refer to FIG. 8A , as in the first embodiment, a glass substrate 800 and a corresponding glass cover 804 are provided in an environment 830 in which moisture and oxygen concentrations are controlled, and the glass There is a single large-area electroluminescent element 802 on the substrate 800, and a circuit 814 required for external connection is provided around it. Then, on the glass cover 804 , corresponding to the frame position 806 of the electroluminescent element 802 , coat a frame glue 808 containing spacers 810 , and reserve an opening 812 on the side corresponding to the electroluminescent element 802 without a circuit. , that is, no frame glue is applied at the position of the opening 812 . The electroluminescent element 802 includes an organic electroluminescent element, such as an organic electroluminescent diode shown in FIG. 6 .

Next, please refer to step 702 in FIG. 7 and FIG. 8B (the cross-sectional schematic diagram after the cover plate and the substrate are pressed together), in the environment 830 where the concentration of water and oxygen is controlled, the glass cover plate 804 and the glass substrate 800 are pressed together, The electroluminescent element 802 is located between the sealant 808 , the glass substrate 800 and the glass cover 804 . The sealant 808 is used to bond the glass substrate 800 and the glass cover 804 to seal the light-emitting element 802 , and the spacer 810 contained therein is used to control the distance between the glass substrate 800 and the glass cover 804 to a fixed value.

Next, please refer to step 704 of FIG. 7 and FIG. 8C (the cross-sectional schematic view of the cured sealant), the sealant 808 located between the glass cover 804 and the glass substrate 800 is cured in the water and oxygen controlled environment 830 . If the frame glue is UV-curable glue, irradiate it with ultraviolet light to cure it; if the frame glue is heat-curable glue, it must be combined with UV-curable glue and irradiated with ultraviolet light. The relative position is positioned, and then the frame glue is cured by hot baking or natural hardening. Since only a single electroluminescent element 802 is sealed between the glass substrate 800 and the glass cover 804 , the independent package 816 can be completed without cutting and splitting steps.

Referring again to step 706 in FIG. 7 and FIG. 8D , similar to step 410 in the first embodiment, a vacuum chamber 820 with a glue groove 822 at the bottom is provided, and a packaging material 824 is installed in the glue groove 822 . In a water and oxygen controlled environment, one or several packages 816 are placed in the vacuum chamber 820 with their openings 812 facing the glue groove 822 but not in contact with the package material 824 therein.

Then, please refer to step 708 and FIG. 8E in FIG. 7, when the set pressure is reached in the vacuum chamber 820, the package 816 is immersed in the glue tank 822, so that the opening 812 is in contact with the packaging material 824 for filling, and the packaging material 824 is Capillarity is sucked into cavity 818 . Then dry gas is introduced into the vacuum chamber 820 , so that the encapsulation material 824 is continuously injected due to the pressure difference between the interior and exterior of the encapsulation 816 to fill the cavity 818 and completely cover the electroluminescence element 802 .

As shown in step 710 in FIG. 7 , and referring to FIG. 8F , after the cavity 818 is filled with the element encapsulation material 824a, it is cured to complete the encapsulation of the electroluminescent element. Similar to step 704, if the component encapsulation material 824a is an ultraviolet light-curable glue, then irradiate it with ultraviolet light to cure it; if the element encapsulation material 824a is a heat-curable glue, then it can be cured by hot baking, or it can be naturally hardening.

It can be seen from the above examples that the packaging method of the electroluminescent element proposed by the present invention can be applied to electroluminescent elements of different areas, and it is carried out in an environment where the concentration of water vapor and oxygen is controlled, so it can effectively block Moisture and oxygen to prevent them from affecting the quality and performance of light-emitting components. Adding spacers and controlling the amount of glue in the frame glue can increase the uniformity of glue application, make the distance between the glass cover plate and the glass substrate fixed, and prevent the glue from overflowing when the glass substrate and the glass cover plate are pressed together, avoiding light. The lines connecting the components to the outside are covered with glue.

Secondly, the present invention uses a vacuum cavity and packaging material to generate a pressure difference inside and outside the package of the light-emitting element, and introduces the packaging material into the cavity of the package to completely cover the light-emitting element, which has a good packaging effect and can prevent the generation of air bubbles in the packaging material. , avoiding its influence on the quality and life of the light-emitting element, and improving the reliability of the product. Furthermore, packages of multiple light-emitting elements can be placed in the vacuum chamber at the same time, and these packages can be filled with glue, so the application of the present invention can quickly and effectively package the light-emitting elements, improving production efficiency and product qualification rate , and reduce production costs, so that components such as organic light-emitting diodes can reach mass production scale.

Although the present invention has been described above with embodiments, it is not intended to limit the present invention. Any person familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention shall be determined by the claims.

Claims (12)

1. A method for encapsulating an electroluminescent element, characterized in that it comprises at least the following steps: In a water and oxygen controlled environment, a glass substrate and a glass cover are provided, the glass cover corresponds to the glass substrate, and the glass substrate has a plurality of electroluminescent elements; In the water and oxygen control environment, a frame glue is coated on a plurality of frame positions on the glass cover plate, and the frame positions correspond to the electroluminescent elements one by one, and each frame glue has an opening; In the water and oxygen controlled environment, the sealant is positioned between the glass cover and the glass substrate, the glass cover and the glass substrate are pressed together, and the electroluminescent element is positioned between the glass cover and the glass substrate between the glass substrates; Curing the sealant in the water and oxygen controlled environment; In the water and oxygen controlled environment, according to the distribution of the electroluminescent elements, the glass cover plate and the glass substrate are cut; In the water and oxygen controlled environment, the glass cover and the glass substrate are cut to separate each of the electroluminescent elements to form a plurality of independent packages, and each of the packages includes an element glass a substrate, one of the electroluminescent elements, one of the sealant, and an element glass cover, and a cavity is formed by one of the element glass cover, the element glass substrate, and the sealant; A vacuum chamber is provided, a glue groove is arranged at the bottom of the vacuum chamber, and a packaging material is installed in the glue groove, and the package is placed in the vacuum chamber, so that the opening of the sealant of each of the packages is facing the glue groove, and the package is not in contact with the packaging material; Carrying out vacuum pumping to the vacuum cavity, so that the package and the package material are vacuum exhausted; When the vacuum chamber reaches a set vacuum degree, immerse the package in the glue groove, make the opening of the frame glue of each of the packages contact with the packaging material for filling; Raise the pressure of the vacuum chamber to a set pressure, inject the encapsulation material from the opening of the sealant of each of the encapsulations and fill the cavity, forming an element encapsulation material to completely cover the electroluminescent element ;as well as Each of the element encapsulating materials is cured. 2. The packaging method of the electroluminescent element according to claim 1, characterized in that: the concentration of water and oxygen in the water and oxygen control environment is less than one millionth. 3 . The packaging method of the electroluminescent element according to claim 1 , wherein when the sealant is coated, a plurality of spacers are mixed in the sealant. 4 . 4 . The packaging method of the electroluminescent element as claimed in claim 1 , wherein the set vacuum degree of the vacuum chamber is less than 1 atmosphere when glue filling is performed. 5 . 5. The packaging method of the electroluminescent element as claimed in claim 1, wherein the method of increasing the pressure of the vacuum chamber comprises introducing dry gas into the vacuum chamber. 6. The packaging method of the electroluminescent element as claimed in claim 1, wherein the set pressure is 1 atmosphere. 7. A packaging method for an electroluminescent element, characterized in that: at least comprising the following steps: In a water and oxygen controlled environment, a glass substrate and a glass cover are provided, the glass cover corresponds to the glass substrate, and the glass substrate has an electroluminescent element; In the water and oxygen control environment, a frame glue is coated on a frame position on the glass cover plate, the frame position corresponds to the electroluminescent element, and the frame glue has an opening; In the water and oxygen controlled environment, the sealant is positioned between the glass cover and the glass substrate, the glass cover and the glass substrate are pressed together, and the electroluminescent element is positioned between the glass cover and the glass substrate between the glass substrates; In the water and oxygen controlled environment, the sealant is cured to form a package, and a cavity is formed by the glass cover plate, the glass substrate and the sealant; A vacuum chamber is provided, a glue groove is arranged at the bottom of the vacuum chamber, a packaging material is installed in the glue groove, and at least one package is placed in the vacuum chamber, so that the opening of the sealant in the package facing the glue groove, and the package is not in contact with the packaging material; Carrying out vacuum pumping to the vacuum cavity, so that the package and the package material are vacuum exhausted; When the vacuum chamber reaches a set vacuum degree, the package is immersed in the glue tank, so that the opening of the frame glue in the package is in contact with the packaging material for filling; Raise the pressure of the vacuum chamber to a set pressure, inject the packaging material from the opening of the sealant in the package, and fill the cavity of the package, forming an element packaging material to completely cover the cavity the electroluminescent element in; and The element encapsulating material is cured. 8. The packaging method of the electroluminescent element as claimed in claim 7, characterized in that: the concentration of water and oxygen in the water and oxygen control environment is less than one millionth. 9 . The packaging method of the electroluminescent element as claimed in claim 7 , wherein when coating the sealant, a plurality of spacers are mixed in the sealant. 10 . 10 . The packaging method of the electroluminescent element as claimed in claim 7 , wherein the set vacuum degree of the vacuum cavity is less than 1 atmosphere when glue filling is performed. 11 . 11. The method for packaging electroluminescent elements as claimed in claim 7, wherein the method of increasing the pressure of the vacuum chamber comprises introducing dry gas into the vacuum chamber. 12. The method for packaging electroluminescent elements as claimed in claim 7, wherein the set pressure is 1 atmosphere.

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