CN1292476C - Processing method of heat sink - Google Patents
Processing method of heat sink Download PDFInfo
- Publication number
- CN1292476C CN1292476C CN 03105151 CN03105151A CN1292476C CN 1292476 C CN1292476 C CN 1292476C CN 03105151 CN03105151 CN 03105151 CN 03105151 A CN03105151 A CN 03105151A CN 1292476 C CN1292476 C CN 1292476C
- Authority
- CN
- China
- Prior art keywords
- radiator
- heat
- groove
- heat pipe
- conducting strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- 239000006071 cream Substances 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明是关于一种散热装置的加工方法，将导热管、散热器与导热片组合而形成一种散热装置，其中导热管置放于散热器凹槽中，导热片安置于散热器嵌设槽上；当平板台以高温加热加压于导热片时，导热片进入散热器的嵌设槽且施压于导热管，使导热管受压变形而增加与散热器的接触面积，并同时使锡膏受热软化，以使导热管、散热器与导热片经由锡膏黏着性质作用，而彼此固定，形成一体化的散热装置。
The present invention relates to a processing method for a heat dissipation device, wherein a heat pipe, a heat sink and a heat conductive sheet are combined to form a heat dissipation device, wherein the heat pipe is placed in a groove of the heat sink, and the heat conductive sheet is placed on an embedding groove of the heat sink; when a flat table is heated and pressurized at a high temperature on the heat conductive sheet, the heat conductive sheet enters the embedding groove of the heat sink and applies pressure to the heat pipe, so that the heat pipe is deformed by pressure to increase the contact area with the heat sink, and at the same time, the solder paste is heated and softened, so that the heat pipe, the heat sink and the heat conductive sheet are fixed to each other through the adhesive property of the solder paste to form an integrated heat dissipation device.
Description
Technical field
The invention relates to a kind of processing method of heat abstractor, via dull and stereotyped platform pressurization and heating, make heat pipe distortion and increase contact area with radiator, and heat tin cream simultaneously and make radiator, heat pipe and conducting strip via the sticking together character of tin cream the incorporate heat abstractor of fixing formation.
Background technology
It on the general industry the too much problem of parts heat of effectively handling, how can apply fan or radiator on the heating parts, to reduce too much heat, and for quickening radiating efficiency effectively, also on radiator, install heat pipe additional, the conductive coefficient of heat pipe can reach tens of times of good heat conductive metal heat-conducting coefficient, so can more effectively solve heat dissipation problem.And the mode of heat pipe in radiator is installed generally, be to make the pipeline of radiating end than the high competence exertion effect of heating end, in other words, when heat pipe is bent upwards, when making heating end and radiating end present the angle of 90 degree, just can bring into play the most effective heat sinking function.
Because it is cylindric that heat pipe is generally, so the heat pipe heating end need cooperate the shape of radiator usually, and with its pressing, the radiator so that heat pipe can be fitted more, thereby increase the contact area of heat pipe and radiator, and between heat pipe and radiator contact-making surface, add tin cream, to reduce the space between heat pipe and radiator contact-making surface, increase integral heat sink efficient; But heat pipe is done the pressing processing and added normally two different disposal steps of tin cream, thereby increase the heat abstractor procedure of processing, reduction production heat abstractor efficient.
Because every shortcoming of above-mentioned prior art, the inventor is innovated improvement to be engaged in the sector experience for many years, to concentrate on studies, and completes successfully the processing method of heat abstractor of the present invention finally.
Summary of the invention
The present invention's main purpose provides a kind of heat pipe and conducting strip of making and is fixed in processing method on the radiator simultaneously.
Particularly, the processing method of this heat abstractor comprises following step:
(1) puts tin cream without heat fused in the groove of radiator;
(2) heating end of heat pipe is placed the groove of radiator;
(3) conducting strip is placed being embedded on the groove of radiator;
(4) when the drive rod of dull and stereotyped platform drives dull and stereotyped platform and moves on the radiator, dull and stereotyped platform makes the conducting strip pressurized and enters being embedded in the groove of radiator, the heating end of circular heat pipe is because of being subjected to the conducting strip pressurization, and in groove compressive deformation, increase thus and the contact area of radiator; Meanwhile, this flat board platform still continues heating, and institute adds tin cream and is heated and softens, make between heat pipe and radiator, heat pipe and conducting strip and be able to effective the contact, and because of the function of sticking together of tin cream, and heat pipe is fixedly arranged in the groove of radiator, conducting strip is fixedly arranged on being embedded on the groove of radiator.
Characteristic on said method of the present invention and this construction for heat radiating device and the function will be illustrated according to the mode of accompanying drawing with preferred embodiment below.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention;
Fig. 2 is placed in the end view of fixed station for radiator of the present invention;
Fig. 3 applies the front view of tin cream for the groove of radiator of the present invention;
Fig. 4 is fixedly arranged on the three-dimensional combination figure of radiator for the radiating end of heat pipe of the present invention;
Fig. 5 is placed in the end view of fixed station for radiator of the present invention;
Fig. 6 is placed in the front view of radiator for the heating end of heat pipe of the present invention;
Fig. 7 is placed in the front view on the groove of being embedded of radiator for conducting strip of the present invention;
Fig. 8 stresses on the front view of conducting strip for the dull and stereotyped platform of the present invention;
Fig. 9 is the three-dimensional combination figure of the heat abstractor of the present invention after machining.
Number description is as follows:
11 ... dull and stereotyped platform 111 ... drive rod
12 ... heat pipe 121 ... heating end
122 ... radiating end 13 ... radiator
131 ... be embedded groove 131a ... groove
14 ... radiator 141 ... open-work
15 ... conducting strip 16 ... tin cream
17 ... fixed station
Embodiment
The invention provides a kind of processing method of heat abstractor, see also shown in Figure 1ly, its middle plateform platform 11 is a planar structure, form with good thermal conductance material, as copper, the one side of this flat board platform 11 is provided with drive rod 111, with the control assembly that moves and pressurize as the dull and stereotyped platform 11 of driving; Wherein heat pipe 12 is 122 one-tenth an angle of 90 degrees of heating end 121 and radiating end of cylindrical conformation and heat pipe 12; Wherein radiator 13 bottoms have and are embedded groove 131, are embedded fluted 131a in the groove 131; Wherein radiator 14 has the open-work 141 that connects this body; Wherein conducting strip 15 constitutes for the good heat conductive material, and as copper, the shape of this conducting strip 15 designs according to being embedded groove 131; Wherein but tin cream 16 is the heating softener material, and is the good heat conductive material, with heat-conducting medium and the adhesive agent as 15 of heat pipe 12, radiator 13 and conducting strips; Wherein fixed station 17 is used to carry radiator 13 and radiator 14.
See also Fig. 2 and shown in Figure 3, radiator 13 is placed on the fixed station 17, apply tin cream 16 without heat fused in radiator 13 groove 131a.
See also Fig. 4, Fig. 5 and shown in Figure 6, the radiating end 122 of heat pipe 12 is passed the open-work 141 of radiator 14, so that the radiating end 122 of heat pipe 12 is fixedly arranged in the radiator 14; The heating end 121 of heat pipe 12 is placed among the groove 131a of radiator 13, so that heating end 121 places tin cream 16.
See also Fig. 7 and shown in Figure 8, conducting strip 15 is placed in being embedded on the groove 131 of radiator 13, when driving dull and stereotyped platform 11, the drive rod 111 of dull and stereotyped platform 11 moves on the radiator 13, and when stressing on conducting strip 15, dull and stereotyped platform 11 makes conducting strip 15 pressurizeds and enters being embedded in the groove 131 of radiator 13, the heating end 121 of circular heat pipe 12 is because of being subjected to conducting strip 15 pressurizations, and in groove 131a compressive deformation, to increase and the contact area of radiator 13; At the same time, dull and stereotyped platform 11 continuous high temperatures heating, tin cream 16 is heated and softens, make heat pipe 12 be able to effective the contact with 15 of conducting strips with radiator 13, heat pipe 12, and because of the function of sticking together of tin cream 16, heat pipe 12 is fixedly arranged among the groove 131a of radiator 13, and conducting strip 15 is fixedly arranged on being embedded in the groove 131 of radiator 13.
See also shown in Figure 9ly, after dull and stereotyped platform 11 was executed heat and stressed on conducting strip 15, conducting strip 15, heat pipe 12, radiator 13 were with radiator 14 thereby combine and form incorporate heat abstractor.
In sum, the processing method flow process of this heat abstractor is:
(1) puts tin cream 16 without heat fused in the groove 131a of radiator 13;
(2) radiating end 122 of heat pipe 12 is placed the open-work 141 of radiator 14;
(3) heating end 121 with heat pipe 12 is placed among the groove 131a of radiator 13;
(4) conducting strip 15 is placed being embedded on the groove 131 of radiator 13;
(5) when the dull and stereotyped platform 11 of drive rod 111 drivings of dull and stereotyped platform 11 moves on the radiator 13, dull and stereotyped platform 11 makes conducting strip 15 pressurizeds and enters being embedded in the groove 131 of radiator 13, the heating end 121 of circular heat pipe 12 is because of being subjected to conducting strip 15 pressurizations, and in groove 131a compressive deformation, to increase the contact area with radiator 13; At the same time, this flat board platform 11 still continues heating, tin cream 16 is heated and softens, make heat pipe 12 be able to effective the contact with 15 of conducting strips with radiator 13, heat pipe 12, and because of the function of sticking together of tin cream 16, and heat pipe 12 is fixedly arranged among the groove 131a of radiator 13, conducting strip 15 is fixedly arranged on being embedded in the groove 131 of radiator 13.
In sum, the processing method of a kind of heat abstractor provided by the present invention really meets the key element of granted patent.
The above only is the preferable feasible embodiment of the present invention, and the change that utilizes said method of the present invention, shape, structure, device to carry out all should be contained in the claim scope of the present invention in every case.
Claims (5)
1, a kind of processing method of heat abstractor, it comprises following step:
(1) puts tin cream without heat fused in the groove of radiator;
(2) heating end of heat pipe is placed the groove of radiator;
(3) conducting strip is placed being embedded on the groove of radiator;
(4) when the drive rod of dull and stereotyped platform drives dull and stereotyped platform and moves on the radiator, dull and stereotyped platform makes the conducting strip pressurized and enters being embedded in the groove of radiator, the heating end of circular heat pipe is because of being subjected to the conducting strip pressurization, and in groove compressive deformation, increase thus and the contact area of radiator; Meanwhile, this flat board platform still continues heating, and institute adds tin cream and is heated and softens, make between heat pipe and radiator, heat pipe and conducting strip and be able to effective the contact, and because of the function of sticking together of tin cream, and heat pipe is fixedly arranged in the groove of radiator, conducting strip is fixedly arranged on being embedded on the groove of radiator.
2, the processing method of heat abstractor according to claim 1, wherein conducting strip is the good heat conductive material.
3, as the processing method of heat abstractor as described in the claim 2, wherein conducting strip is a copper.
4, the processing method of heat abstractor according to claim 1, its middle plateform platform is the good heat conductive material.
5, as the processing method of heat abstractor as described in the claim 4, its middle plateform platform is a copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03105151 CN1292476C (en) | 2003-03-04 | 2003-03-04 | Processing method of heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03105151 CN1292476C (en) | 2003-03-04 | 2003-03-04 | Processing method of heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1526504A CN1526504A (en) | 2004-09-08 |
| CN1292476C true CN1292476C (en) | 2006-12-27 |
Family
ID=34282533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03105151 Expired - Fee Related CN1292476C (en) | 2003-03-04 | 2003-03-04 | Processing method of heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1292476C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100461386C (en) * | 2005-03-14 | 2009-02-11 | 奇鋐科技股份有限公司 | radiator fixing mechanism |
| CN101334150B (en) * | 2007-06-29 | 2010-12-29 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN102012183B (en) * | 2009-09-04 | 2013-02-13 | 技嘉科技股份有限公司 | Radiator and method of making the same |
| CN104375602B (en) * | 2013-08-15 | 2019-01-15 | 联想(北京)有限公司 | The manufacturing method of radiator |
| CN103528408A (en) * | 2013-10-10 | 2014-01-22 | 昆山纯柏精密五金有限公司 | Platform machining method of heat radiator |
| CN103501584A (en) * | 2013-10-10 | 2014-01-08 | 昆山纯柏精密五金有限公司 | Processing method of power component radiator |
| CN113432096A (en) * | 2021-05-21 | 2021-09-24 | 苏智国 | Radiator for semiconductor luminous plate |
-
2003
- 2003-03-04 CN CN 03105151 patent/CN1292476C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1526504A (en) | 2004-09-08 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061227 Termination date: 20180304 |