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CN1291524C - Socket connector - Google Patents

Socket connector Download PDF

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Publication number
CN1291524C
CN1291524C CN 03152916 CN03152916A CN1291524C CN 1291524 C CN1291524 C CN 1291524C CN 03152916 CN03152916 CN 03152916 CN 03152916 A CN03152916 A CN 03152916A CN 1291524 C CN1291524 C CN 1291524C
Authority
CN
China
Prior art keywords
cover plate
stiffener
matrix
cover
socket connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 03152916
Other languages
Chinese (zh)
Other versions
CN1591991A (en
Inventor
陈阿禄
许修源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Kunshan Computer Connector Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Foxconn Kunshan Computer Connector Co Ltd
Priority to CN 03152916 priority Critical patent/CN1291524C/en
Publication of CN1591991A publication Critical patent/CN1591991A/en
Application granted granted Critical
Publication of CN1291524C publication Critical patent/CN1291524C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

本发明关于一种用于测试晶片模块的插座连接器,该插座连接器主要包括基体、多个导电端子、盖体、盖板、两个操作件、包围并固接于盖板的第一加强板、包围并固接于基体的第二加强板及收容于第一加强板与第二加强板之间的四个弹簧。基体设有端子孔以容置导电端子,盖板与操作件相组合以使操作件带动盖体在水平方向上移动。当盖板上未施加外力时,晶片模块的导电垫片以零插入力插入到基体的端子孔中,当施加外力于盖板的侧边时,操作件可以带动盖体相对于基体移动从而使导电端子与晶片模块的导电垫片形成电性导接。于外力施压于盖板过程中,弹簧抵接于第一加强板与第二加强板,可避免盖板直接受方向相反的作用力作用而产生扭曲变形。

The present invention relates to a socket connector for testing a chip module. The socket connector mainly includes a base body, a plurality of conductive terminals, a cover body, a cover plate, two operating parts, and a first reinforcement that surrounds and is affixed to the cover plate. The plate, the second reinforcement plate surrounding and fixed on the base body and four springs accommodated between the first reinforcement plate and the second reinforcement plate. The base body is provided with a terminal hole for accommodating the conductive terminal, and the cover plate is combined with the operating part so that the operating part drives the cover body to move in the horizontal direction. When no external force is applied on the cover, the conductive gasket of the chip module is inserted into the terminal hole of the base with zero insertion force. When an external force is applied to the side of the cover, the operating part can drive the cover to move relative to the base so that The conductive terminal forms an electrical connection with the conductive pad of the chip module. During the process of applying external force to the cover plate, the spring abuts against the first reinforcement plate and the second reinforcement plate, which can prevent the cover plate from being twisted and deformed by the force acting in the opposite direction.

Description

Socket connector
[technical field]
The present invention is about a kind of socket connector, refers to especially a kind ofly have stiffener to avoid the cover plate buckling deformation and to be used for the socket connector of testing wafer module.
[background technology]
Industry is known, and test connector is widely used in the testing wafer module, and existing test connector comprises matrix, with the combined removable plate of matrix and a plurality ofly drive the actuator that movable plate moves with respect to matrix.Movable plate can move between release position and make position, when movable plate moves to the release position, wafer module and being contained between conducting terminal in the matrix does not electrically conduct, and when movable plate moves to make position, forms between the wafer module conducting terminal interior with being contained in matrix and electrically conducts.Relevant patent see also on November 25th, 1997 bulletin No. the 5th, 186,642, United States Patent (USP) and on February 16th, 1993 bulletin No. the 5th, 690,281, United States Patent (USP).
Please join Fig. 1, a kind of existing socket connector 9 is in order to testing wafer module (not shown), the lid 91 that it mainly comprises rectangular base 90, be combined on the matrix 90 and can move with respect to matrix 90, cover plate 92, spring 96, a pair of insert 93 and a pair ofly drive the operating parts 95 that lid 91 moves in the horizontal direction.
Lid 91 has a main part 911 that is used to accommodate wafer module, and this main part 911 is provided with a plurality of perforates 9110, so that the conductive spacer of wafer module (not shown) extends through.Lid 91 is provided with the protuberance 914 of a pair of certain spacing arrangement of being separated by in the one end, and this protuberance 914 is provided with first accepting groove 916 in its bottom.This main part 911 has four sidewalls (not label), is respectively equipped with the clamping part 912 of certain spacing arrangement of being separated by on the two relative sidewalls, and this clamping part 912 is provided with hook part 9120 in its bottom.
Matrix 90 has an oblong-shaped board 901, has a determining deviation with two relative first sidepieces 902 of the adjacent setting of two opposite sides end of board 901 and with two relative second sidepiece, 903, the first sidepieces 902 and 903 of second sidepieces of the adjacent setting of another two opposite sides end of this board 901.Board 901 is provided with a plurality of terminal holes 9010 with ccontaining conducting terminal (not shown), and this terminal hole 9010 is corresponding with the perforate 9110 of lid 91, and board 901 is respectively equipped with the blind hole 9012 that is used to accommodate spring 96 in its four corners.Board 901 is in being respectively equipped with stria 9014 near first sidepiece 902 and second sidepiece, 903 positions, and this stria 9014 is used to accommodate the clamping part 912 of lid 91.Be respectively equipped with first trip 904 on first sidepiece 902 and second sidepiece 903, the top of this first trip 904 outwards convexes with the first protruding hook part 9040.Extend upward on first sidepiece 902 and be provided with projection 906, and wherein extend outward a cylinder 908 respectively on one first sidepiece 902 and one second sidepiece 903, this cylinder 908 is positioned matrix 90 on the circuit board.The end of two second sidepieces 903 is respectively equipped with second accepting groove 9020, and second accepting groove 9020 and a cylinder 908 adjacent settings.
Cover plate 92 is rectangle plastics structures, main part 911 positions corresponding to lid 91 on it are provided with a central opening 921, wafer module can pass on the main part 911 that this opening 921 is inserted into lid 91, four corners, the bottom of this cover plate 92 are respectively equipped with blind hole (not shown), and these blind holes are corresponding with the blind hole 9012 of matrix 90.Be respectively equipped with a pair of first docking groove 924 on the two opposite side walls of cover plate 92, these first docking grooves 924 are in order to be immobilizated in insert 93 below the cover plate 92, projection 906 positions corresponding to matrix 90 on the two opposite side walls of cover plate 92 are provided with groove 926, first trip, 904 positions corresponding to matrix 90 then are provided with second trip 922, the end of this second trip 922 is provided with the second protruding hook part 9220 corresponding to 9040 positions, the first protruding hook part on first trip 904, this second trip 922 is provided with interior guide channel 9222, to accommodate first trip 904 in wherein.
Insert 93 comprises that horizontal part 931 reaches from extended vertical portion 932, horizontal part 931 centre positions.Be respectively equipped with second docking groove 933 in 931 liang of opposite end portions of horizontal part, the centre position of vertical portion 932 is provided with rotation slot 935, and this rotation slot 935 is in order to be hinged with operating parts 95.
Operating parts 95 comprise first action bars 951, second action bars 952, respectively with combined first 953 and second 954 of first, second action bars 951,952.Rotation slot 935 positions corresponding to insert 93 on first action bars 951 and second action bars 952 are respectively equipped with first through hole 9510 and second through hole 9520, and operating parts 95 then rotates by a rotation axis 94 and is installed in the insert 93.
This electric connector 9 is when using, side in cover plate 92 applies external force, so that cover plate 92 drives operating parts 95 and orders about lid 91 relative matrix 90 motions, in this process, cover plate 92 is subjected to the elastic force that is in reverse to external force application of force direction of spring 96 in addition, and this elastic force acts on the place, end angle of cover plate 92, and therefore, cover plate 92 will buckling deformation take place because of these action directions opposite external force and elastic force effect.
Therefore, how to prevent effectively that the cover plate buckling deformation from being industry institute issue to be resolved always, so be badly in need of the socket connector that a kind of new tool is difficult for the cover plate of buckling deformation.
[summary of the invention]
The object of the present invention is to provide a kind of socket connector of avoiding the cover plate buckling deformation.
The object of the present invention is achieved like this: a kind of socket connector that is used for the testing wafer module, mainly comprise matrix, a plurality of conducting terminal, lid, cover plate, two operating parts, surround and be fixed in cover plate first stiffener, surround and be fixed in second stiffener of matrix and be contained in first stiffener and second stiffener between four springs.Matrix be provided with a plurality of terminal holes with ccontaining conducting terminal in wherein, cover plate and operating parts are combined so that operating parts drives lid moves in the horizontal direction.When not applying external force on the cover plate, the conductive spacer of wafer module can be inserted in the terminal hole of matrix by zero insertion force, when applying external force, move the conductive spacer that makes conducting terminal and wafer module with respect to matrix and form and be electrically conducted thereby operating parts can drive lid in the side of cover plate.In external force applied pressure to the cover plate process, spring was connected to first stiffener and second stiffener, can avoid the cover plate recipient to produce buckling deformation to the effect of opposite effect power.
Compared with prior art, the present invention has the following advantages: in external force applied pressure to the cover plate process, spring was connected to first stiffener and second stiffener, can avoid the cover plate recipient to produce buckling deformation to the effect of opposite effect power.
[description of drawings]
Fig. 1 is a kind of existing three-dimensional exploded view that is used for the socket connector of testing wafer module.
Fig. 2 is the three-dimensional exploded view of socket connector of the present invention.
Fig. 3 is the three-dimensional combination figure of socket connector of the present invention.
[embodiment]
See also Fig. 2 and Fig. 3, socket connector 1 of the present invention is in order to electrically connect wafer module (not shown) and testing circuit board (not shown) so that wafer module is tested, it mainly comprises rectangular base 10, the lid 20 that is combined on the matrix 10 and can moves with respect to matrix 10, cover plate 30, spring 40, a pair of insert 50, the a pair of mobile in the horizontal direction operating parts 60 of lid 20 that drives, surround and be fixed in first stiffener 80 of cover plate 30, encirclement is fixed in second stiffener 82 of matrix 10, wherein, the two ends of spring 40 are connected to first stiffener 80 and second stiffener 82 respectively, the intensity of first stiffener 80 and second stiffener 82 is much larger than the intensity of cover plate 30 with matrix 10, and in present embodiment, first stiffener 80 and second stiffener 82 are to be made of metal.
Lid 20 has a main part 201 in order to accommodate wafer module, and this main part 201 is provided with a plurality of perforates 2010, so that the conductive spacer of wafer module (not shown) extends through.Lid 20 is provided with the protuberance 204 of a pair of certain spacing arrangement of being separated by in the one end, and this protuberance 204 is provided with first accepting groove 206 in its bottom.This main part 201 has four sidewalls (not label), is respectively equipped with the clamping part 202 of certain spacing arrangement of being separated by on the two relative sidewalls, and this clamping part 202 is provided with hook part 2020 in its bottom.
Matrix 10 has an oblong-shaped board 101, has a determining deviation with two relative first sidepieces 102 of the adjacent setting of two opposite sides end of board 101 and with two relative second sidepiece, 103, the first sidepieces 102 and 103 of second sidepieces of the adjacent setting of another two opposite sides end of this board 101.Board 101 is provided with a plurality of terminal holes 1010 with ccontaining conducting terminal (not shown), and this terminal hole 1010 is corresponding with the perforate 2010 of lid 20.Board 101 is in being respectively equipped with stria 1014 near first sidepiece 102 and second sidepiece, 103 positions, and this stria 1014 is used to accommodate the clamping part 202 of lid 20.Be respectively equipped with first trip 104 on first sidepiece 102 and second sidepiece 103, the top of this first trip 104 outwards convexes with the first protruding hook part 1040.Extend upward on first sidepiece 102 and be provided with projection 106, and wherein extend outward a cylinder 108 respectively on one first sidepiece 102 and one second sidepiece 103, this cylinder 108 is positioned matrix 10 on the circuit board.The end of two second sidepieces 103 is respectively equipped with second accepting groove 1020, and one of them second accepting groove 1020 and a cylinder 108 adjacent settings.
Cover plate 30 is a rectangular configuration, and main part 201 positions corresponding to lid 20 on it are provided with a central opening 301, and wafer module can pass on the main part 201 that this opening 301 is inserted into lid 20.Be respectively equipped with a pair of first docking groove 304 on the two opposite side walls of cover plate 30, these first docking grooves 304 are in order to be immobilizated in insert 50 below the cover plate 30, projection 106 positions corresponding to matrix 10 on the two opposite side walls of cover plate 30 are provided with groove 306, first trip, 104 positions corresponding to matrix 10 then are provided with second trip 302, the end of this second trip 302 is provided with the second protruding hook part 3020 corresponding to 1040 positions, the first protruding hook part on first trip 104, this second trip 302 is provided with interior guide channel 3022, to accommodate first trip 104 in wherein.
Insert 50 comprises that horizontal part 501 reaches from extended vertical portion 502, horizontal part 501 centre positions.Be respectively equipped with second docking groove 503 in 501 liang of opposite end portions of horizontal part, the centre position of vertical portion 502 is provided with rotation slot 505, and this rotation slot 505 is in order to be hinged with operating parts 60.
Operating parts 60 comprise first action bars 601, second action bars 602, respectively with combined first 603 and second 604 of first, second action bars 601,602.Rotation slot 505 positions corresponding to insert 50 on first action bars 601 and second action bars 602 are respectively equipped with first through hole 6010 and second through hole 6020, and operating parts 60 rotates by a rotation axis 70 and is installed in the insert 50.
First stiffener 80 is the square hollow structure, be provided with two pairs of first outer walls 800 that are provided with in opposite directions and enclose first receiving space 806 that forms by first outer wall 800, first stiffener 80 non-axial location on two relative first outer walls 800 respectively is provided with one first hinge hole 802, and four corners, the bottom of first stiffener 80 are respectively equipped with blind hole (not shown).
Second stiffener 82 is the square hollow structure, be provided with two pairs of second outer walls 820 that are provided with in opposite directions and enclose second receiving space 826 that forms by second outer wall 820, second stiffener 82 non-axial location on two relative second outer walls 820 respectively is provided with one second hinge hole 822, is provided with the blind hole of blind hole 828 to establish corresponding to first stiffener, 80 bottoms of four symmetries in addition in second outer wall 820 of second stiffener 82.
When this socket connector 1 in when assembling, earlier lid 20 is assembled on the matrix 10, and matrix 10 is placed in second receiving space 826 of second stiffener 82, utilize reference column (not shown) that second stiffener 82 is positioned testing circuit board (not shown) by second hinge hole 822 again, after cover plate 30 is placed in first receiving space 806 of first stiffener 80, screw 84 is fixed in cover plate 30 with first stiffener 80 by first hinge hole 802, then with first 603 and second 604 of operating parts 60 respectively rotation be contained in second accepting groove 1020 of first accepting groove 206 of lid 20 and matrix 10, first action bars 601 and second action bars 602 are then respectively by rotation axis 70 and combined with insert 50, this moment, insert 50 was combined in the below of the two opposite side walls of cover plate 30, then spring 40 is positioned in the blind hole 828 of second stiffener 82 again, and be connected to the blind hole of first stiffener, 80 bottoms simultaneously, promptly, spring 40 location also are connected between first stiffener 80 and second stiffener 82, this moment, cover plate 30 was installed on above the operating parts 60, and this cover plate 30 can move with respect to matrix 10 in the vertical directions.
When this socket connector 1 is combined with wafer module, wafer module is combined with lid 20 by the central opening 301 of cover plate 30, the conductive spacer of wafer module then passes a plurality of perforates 2010 of lid 20 and is inserted into zero insertion force in the terminal hole 1010 of matrix 10, this moment, socket connector 1 was in the release position, and lid 20 and operating parts 60 also are in primary importance respectively, and this moment wafer module conductive spacer do not form with conducting terminal (not shown) and electrically contact.
When cover plate 30 is subjected to the external force effect and moves downward, the external force that puts on the cover plate 30 will pass to first action bars 601 and second action bars 602 of operating parts 60 by cover plate 30, first action bars 601 and second action bars 602 rotate in first 603 and second 604 under the drive of rotation axis 70, thereby make first action bars 601 and second action bars 602 rotatablely move and change into the horizontal force that puts on first 603 it produced jointly, therefore, this horizontal force will make first 603 driving lid 20 move to the second place from primary importance in the horizontal direction, this moment, lid 20 also placed drive the wafer module on the lid 20 to move to the second place from primary importance, and then the conductive spacer that the makes wafer module conducting terminal interior with being placed in matrix 10 forms electrical the contact.When lid 20 when primary importance moves to the second place, spring 40 will be compressed.In addition, the projection 106 of matrix 10 is contained in the groove 306 of cover plate 30, to prevent that cover plate 30 is with respect to matrix 10 motions.After putting on external force on the cover plate 30 and removing, spring 40 will drive first stiffener 80 and drive cover plate 30 and move upward under the effect of its compression stress, thus make first 603 driving lid 20 from second site reversion to primary importance.
Utilize the structure of socket connector 1 of the present invention, this socket connector 1 is when using, side in cover plate 30 applies external force, so that cover plate 30 drives operating parts 95 and orders about lid 91 relative matrix 90 motions, in this process, the elastic force of spring 40 puts on first stiffener 80 but not directly acts on cover plate 30, and therefore, cover plate 30 will only be subjected to uniform external force effect and buckling deformation can not take place.

Claims (5)

1. socket connector, comprise matrix, movably be combined in the lid on the matrix and be set up in cover plate on the lid, matrix is provided with a plurality of terminal holes to accommodate a plurality of conducting terminals in wherein, it is characterized in that: this socket connector also comprises first stiffener that is connected in cover plate, second stiffener that is connected in matrix, and a plurality of springs that are connected to first stiffener and second stiffener respectively.
2. socket connector as claimed in claim 1 is characterized in that: first stiffener encloses the periphery that is fixed in cover plate.
3. socket connector as claimed in claim 1 is characterized in that: second stiffener encloses the periphery that is fixed in matrix.
4. socket connector as claimed in claim 1, it is characterized in that: first stiffener is provided with relative two couple first outer wall and encloses first receiving space that forms by these outer walls, and second stiffener is provided with relative two couple second outer wall and encloses second receiving space that forms by these outer walls.
5. socket connector as claimed in claim 4 is characterized in that: the non-axial location of first outer wall of first stiffener is provided with first hinge hole, and the non-axial location of second outer wall of second stiffener is provided with second hinge hole.
CN 03152916 2003-08-30 2003-08-30 Socket connector Expired - Fee Related CN1291524C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03152916 CN1291524C (en) 2003-08-30 2003-08-30 Socket connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03152916 CN1291524C (en) 2003-08-30 2003-08-30 Socket connector

Publications (2)

Publication Number Publication Date
CN1591991A CN1591991A (en) 2005-03-09
CN1291524C true CN1291524C (en) 2006-12-20

Family

ID=34597744

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03152916 Expired - Fee Related CN1291524C (en) 2003-08-30 2003-08-30 Socket connector

Country Status (1)

Country Link
CN (1) CN1291524C (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7736166B2 (en) * 2007-08-31 2010-06-15 Hon Hai Precision Ind. Co., Ltd. Socket with push finger
CN108281847B (en) * 2018-02-02 2023-07-21 江苏艾科半导体有限公司 Quick plug device of SMP connector

Also Published As

Publication number Publication date
CN1591991A (en) 2005-03-09

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Granted publication date: 20061220

Termination date: 20100830