CN1275306C - Electronic component bonding method and electronic component bonding device - Google Patents

Abstract

The invention bonds electronic components such as IC contacts on a flexible substrate by vibration, and does not cause scratches on the substrate. The method for bonding electronic components includes the following steps: a step of supporting and fixing the electronic component by a magnetic head; moving the electronic component to the 1 st predetermined position; a step of moving the flexible substrate to a 2 nd predetermined position by using a flexible substrate made of resin as the substrate; a step of supporting and fixing the flexible substrate by a substrate mounting work table having a mounting surface on which the flexible substrate is mounted and a surface roughness of 0.01 to 0.5 μm; a step of bonding the electronic component and the flexible substrate by pressure welding by vibration of either or both of the magnetic head and the substrate mounting stage; a step of changing the state of the electronic component supported and fixed by the magnetic head to a state of being not supported and fixed by the magnetic head; and a step of changing the state of the flexible substrate supported by the work platform for carrying the substrate to the state of being unsupported.

Description

Electronic component bonding method and electronic component bonding device

technical field

The present invention relates to an electronic component bonding method and an electronic component bonding apparatus for crimping and bonding electronic components to a flexible substrate using vibration.

Background technique

Conventionally, devices that apply vibration to bond electronic components and substrates made of ceramics have been widely used. The vibrator used in these devices is usually one. Since the ceramic substrate material is hard, it is difficult to deform even if it is subjected to vibration. Therefore, if the ceramic substrate is physically fixed, it will not move with the vibration of the electronic component. Then, relative motion is generated between the electronic component and the ceramic substrate, and frictional engagement can be smoothly performed.

However, in the case of only one vibrator, since there is only one vibration direction, there is a disadvantage that the shape of the joint portion is elongated and elliptical in the vibration direction. , in order to solve this problem, as shown in Patent Document 1, a technique of using two vibrators to have two vibration directions can be adopted.

The technology described in Patent Document 1 relates to a bonding method and its device for flip-chip bonding electronic components such as SAW (Surface Acoustic Wave) devices. In this method, the electrodes formed on the ceramic substrate and the metal protrusions formed of electronic components such as SAW devices are heated, and the two are pressure-bonded. The current technology is characterized in that it includes a first vibrator for vibrating the ceramic substrate and a second vibrator for vibrating the electronic components, and these two vibrators apply vibration to the crimped part from multiple directions. Ultrasonic waves are used to make the protrusion shape of the cladding part nearly circular.

On the other hand, in order to make electronic components thinner, a simple TCP (Tape Carrier Package) with a thin case is often used. As the manufacturing method of TCP, there are TAB (Tape Automated Bonding) method and COF (Chip On Flexible Circuit Board or Chip On Film) method. Among these two methods, the COF method is more widely used in actual flipping.

However, since the magnetic tape on which the IC connector is actually mounted is flexible, that is to say, it is bendable, the vibration crimping method, which uses ultrasonic vibration to crimp electronic components such as the IC connector, cannot be used. This is because the flexible substrate absorbs the energy of ultrasonic waves. Therefore, in joining magnetic tapes and electronic components in the TAB method and the COF method, soldering, Au-Sn bonding of metal protrusions and tin protrusions are usually used, and ACF (anisotropic conductive film) as an anisotropic conductive film is used. The method uses various adhesion methods such as ACP (anisotropic conductive paste) which is an anisotropic conductive paste, and NCP (non conductive paste).

[Patent Document 1] JP-A-11-284028 Gazette (Outline)

Since the material of the magnetic tape constituting the flexible resin substrate is soft, there is a problem that deformation is likely to occur when vibration is applied. That is, when the electronic component is fixed to the flexible resin substrate by crimping, the portion of the flexible resin substrate in contact with the electronic component vibrates to some extent as the electronic component vibrates. Therefore, the relative movement (friction) between the surface of the electronic component and the surface of the flexible resin substrate pressed against it can be greatly reduced. In particular, this tendency is stronger in a small-amplitude vibration mode whose vibration frequency is high in Hertz and whose amplitude is several tens of micrometers.

Therefore, the conventional method of using only one vibrator cannot be practically used even if the electronic component is bonded to the flexible resin substrate by pressure because the bonding strength is very low. In addition, the method of using two vibrators to vibrate both the electronic component and the flexible resin substrate has improved crimping strength compared to the method of using only one vibrator. practical use. Therefore, the bonding method of press-bonding an electronic component and a flexible resin substrate by utilizing vibration has not been practically used so far.

Furthermore, conventional joining methods such as soldering as described above have problems in that the bonding strength is low and the reliability of quality is poor compared to the joining method using vibration and pressure bonding. For example, the Au-Sn bonding method has the problems of high solid phase diffusion temperature and large thermal stress, so there are great restrictions on the target parts that can be practically used.

The inventors of the present invention think that it is necessary to study how to fix the electronic component on the flexible resin substrate by crimping so that there will be no variation in the method, and the variation in the bonding strength when two vibrators are used Continuous analysis, research was carried out. As a result, it was found that there is a certain correlation between the crimping strength and the respective frequencies and amplitudes of the two vibrators.

Then, it became clear that the required adhesive strength can be obtained even if only ultrasonic vibration is applied to the electronic component through the flexible resin substrate. Therefore, the application range of this vibration crimping method has been expanded. However, regardless of whether two vibrators or one vibrator is used, the roughness of the surface of the stage on which the flexible resin substrate is mounted will be transferred to the resin substrate, and the resin substrate will be scratched visually.

For example, as shown in FIG. 13 , by the vibration of the electronic component 101 side, the metal protrusion 102 provided under the electronic component 101 vibrates to the electronic component 101 side and is arranged on the flexible resin substrate 103 as the lead portion of the electrode. In the case of 104 bonding, the surface roughness of the substrate mounting stage 105 is transferred to the resin substrate 103 . Such transcribed surface roughness, as indicated by arrows A and B on the inner surface of the resin substrate 103, visually gives a scratched impression.

It is an object of the present invention to provide an electronic component bonding method and an electronic component bonding apparatus capable of bonding electronic components such as IC connectors to a flexible resin substrate by vibration in order to solve the above problems. In addition, other inventions provide an electronic component bonding method and an electronic component bonding apparatus that do not scratch the substrate even when electronic components such as IC connectors are bonded to a flexible resin substrate by vibration.

Contents of the invention

In order to achieve the above object, the bonding method of electronic components of the present invention is to bond the electronic components supported and fixed on the magnetic head on the substrate by vibration pressure bonding, which includes the following steps: the above-mentioned magnetic head supports and fixes the above-mentioned electronic components; The process of moving the supported and fixed electronic components to the first predetermined position; the process of using a flexible substrate made of resin as the above-mentioned substrate, and moving the flexible substrate to the second predetermined position; The process of the substrate; the process of bringing the electronic component closer to the above-mentioned flexible substrate; in the state where the vibration frequency of the above-mentioned magnetic head exceeds the vibration frequency of the work platform for substrate mounting, the above-mentioned electronic component and the flexible substrate are pressed while vibrating both The process of bonding; the process of separating the above-mentioned electronic components from the magnetic head; the process of separating the flexible substrate fixedly supported on the above-mentioned work platform for substrate mounting from the work platform for substrate mounting.

In the bonding method of electronic components of the present invention, a vibrating magnetic head is used as the magnetic head.

The invention can bond electronic components such as IC joints and flexible substrates through vibration. That is, when the frequency of the vibration applied to the resin flexible substrate by the substrate mounting table is lowered, the vibration can be effectively transmitted to the pressure-bonded surface of the flexible substrate and the electronic component. On the other hand, because the vibration of the magnetic head has a range, even if the frequency is high, it can be effectively transmitted to the crimping surface of the flexible substrate and the electronic component. In order to apply high-energy vibration to the pressure-bonding surface between the flexible substrate and the electronic component, it is very effective to make the vibration frequency on the head side higher than that on the substrate mounting table side.

In addition, the pressure-bonding step may be performed by pressure-bonding the electronic component and the flexible substrate while vibrating both in a state where the vibration amplitude of the substrate mounting table is greater than the vibration amplitude of the magnetic head. Even in this way, electronic components such as IC connectors can be crimped to the flexible substrate by vibration.

When COF tape is used as a flexible substrate, polyimide resin and PET resin are often used, and these have more significant vibration attenuation than ceramics. Furthermore, since the flexible substrate is easily deformed, the transmission efficiency is poor not only in the longitudinal vibration direction but also in the lateral vibration direction. As in this process, by making the vibration amplitude of the board mounting stage larger than the amplitude of the magnetic head, which vibrates the flexible board, which is significantly attenuated by driving vibration and has poor transmission efficiency, it is possible to apply well-balanced vibration between the flexible board and the electronic component. on the crimping surface.

In order to achieve the above object, in the electronic component bonding method of the present invention, in the substrate mounting stage, the surface roughness of the mounting surface on which the flexible substrate is mounted is 0.01 to 0.5 μm.

On the basis of being able to crimp electronic components such as IC connectors on the flexible substrate through vibration, the present invention controls the surface roughness of the substrate mounting work platform between 0.01 μm and 0.5 μm, so it is guaranteed accurately At the same time of bonding, there will be no scratches on the flexible substrate, or even if there are scratches, it is very subtle.

In addition, the electronic component bonding method of the present invention is to bond the electronic component supported and fixed on the magnetic head to the substrate by vibration pressure bonding, which includes the following steps: the process of supporting and fixing the electronic component by the magnetic head; The process of moving the electronic components to the first predetermined position; the process of using a flexible substrate made of resin as the above-mentioned substrate, and moving the flexible substrate to the second predetermined position; the surface roughness of the mounting surface on which the above-mentioned flexible substrate is mounted It is a process of supporting and fixing the above-mentioned flexible substrate with a working platform for substrate mounting of 0.01 to 0.5 μm; performing pressure-bonding bonding of the above-mentioned electronic component and the flexible substrate by vibration of either or both of the above-mentioned magnetic head and the substrate-mounting working platform process; the process of changing the above-mentioned electronic component from being supported and fixed by the magnetic head to being not supported and fixed by the magnetic head; the process of changing the above-mentioned flexible substrate from being supported by the working platform for substrate mounting to an unsupported state.

This invention can also press-bond electronic components such as IC connectors to flexible substrates by vibration. In addition, since the surface roughness of the workbench for substrate mounting is between 0.01 μm and 0.5 μm, the bonding is ensured accurately and at the same time, there will be no scratches on the flexible substrate, or even if there are scratches, it will not be damaged. very subtle.

In addition, like the anti-vibration material, the thicker the resin material, the more difficult it is for vibration to be transmitted. Therefore, reducing the thickness of the resin flexible substrate can achieve good vibration transmission to a certain extent. Therefore, the thickness of the flexible substrate made of resin is controlled between 10 and 200 μm. According to such a composition, since the vibration can be transmitted to the crimping surface between the flexible substrate made of resin and the electronic component very effectively, the crimping strength can be improved. Moreover, if the distance between the inner side of the quadrangular opening of the substrate holding plate that presses the flexible substrate and the electronic components bonded to it is controlled within a range of 0.5 to 5 mm, vibrations can be effectively transmitted to the resin flexible substrate and the electronic components. The crimping surface between parts can improve the crimping strength.

Furthermore, a COF tape or a TAB tape is used as a flexible substrate. By adopting such a composition, it is possible to manufacture TCP without scratching the tape.

In addition, the thickness of the flexible substrate is controlled within a range of 10 to 50 μm. In this way, the electronic component and the flexible substrate can be crimped only by the vibration toward the electronic component, and adverse effects (for example, cracking of the substrate, etc.) due to the vibration can be prevented.

In addition, at least one of the electronic component and the flexible substrate is heated. With such a composition, the crimping strength between the electronic component and the flexible substrate can be greatly enhanced.

In addition, the electronic component bonding apparatus of the present invention has a magnetic head that supports and fixes the electronic component, and a substrate mounting stage on which the substrate is mounted, and presses the electronic component by applying vibration to the magnetic head and the substrate mounting stage. connected to the substrate; wherein, the substrate can be a COF tape or a TAB tape with a thickness of 10-200 μm. In addition, both can vibrate under the condition that the vibration frequency of the above-mentioned magnetic head is higher than the vibration frequency of the work platform for substrate mounting; are able to vibrate.

These devices can press-bond electronic components such as IC connectors to extremely thin flexible substrates by vibration.

Furthermore, the magnetic head and the stage for mounting the substrate can vibrate reciprocally at an angle of 90 degrees to each other in the horizontal direction. Since the magnetic head and the stage for mounting the substrate can reciprocate and vibrate in a direction of 90 degrees to each other, the bonding strength can be improved structurally. In addition, since both are driven to vibrate by respective vibrators, vibration control can be easily performed.

In addition, in the electronic component bonding apparatus of the present invention, a flexible substrate is used as the substrate, and in the substrate mounting stage, the surface roughness of the mounting surface on which the substrate is mounted is 0.01 to 0.5 μm.

Because the surface roughness of the working platform for substrate mounting of the present invention is between 0.01 μm and 0.5 μm, while the bonding is ensured accurately, the flexible substrate will not be scratched, or even if there is scratches, it will not be scratched. It's also very subtle. Also, with such a composition, the newly discovered problem of scratches on the flexible substrate can be solved, and a flexible substrate with electronic components having an attractive appearance and high reliability can be provided.

In addition, the surface roughness of the flexible substrate is 0.05 to 0.2 μm. With such a composition, while obtaining a highly reliable TCP, the surface of the tape will not be scratched or if scratched, it will be very fine.

In addition, it is also provided with a vibrator for a magnetic head that vibrates the magnetic head and a vibrator for a substrate that vibrates the work platform for mounting the substrate, so that the magnetic head and the work platform for mounting the substrate are aligned in the horizontal direction. , reciprocating vibrations in directions kept at 90 degrees to each other, and at the same time, different vibrations are performed according to at least one or both of the respective vibration frequencies or respective vibrations of the magnetic head and the substrate mounting work platform. In this configuration, since the magnetic head and the substrate mounting table vibrate back and forth while keeping each other at 90 degrees, the bonding strength is improved. In addition, since the two vibrate with their respective vibrators, control of the vibration is also simplified. Furthermore, since two types of vibrators are configured to vibrate with at least one of the vibration frequency or the amplitude different, it becomes easy to improve the bonding strength.

Furthermore, said magnetic head can vibrate, and in the state of fixing the working platform for substrate mounting, the electronic component supported and fixed on the magnetic head is reciprocated in the horizontal direction by 0.2-3.6 μm through ultrasonic vibration, so that the Said electronic components are crimp bonded to the flexible substrate. Compared with the currently generally used configuration, this configuration only vibrates the side of the electronic component, thereby achieving the purpose of improving the quality stability of the device and reducing the cost. In addition, since the amount of vibration is in the range of 0.2 to 3.6 μm, stable bonding can be performed even if the substrate is a thin tape.

According to the electronic component bonding method and electronic component bonding apparatus of the present invention, electronic components such as IC contacts can be crimp-bonded on a flexible substrate. In addition, according to the electronic component bonding method and electronic component bonding apparatus in the present invention, when electronic components such as IC contacts are crimped on the flexible substrate, the flexible substrate is not scratched.

Description of drawings

Fig. 1 is a diagram showing the main components of an electronic component bonding apparatus according to Embodiment 1 of the present invention, and shows a section of a part of a work platform for mounting a substrate and a substrate hold-down plate.

FIG. 2 is a plan view of a board placement side member in the electronic component bonding apparatus shown in FIG. 1 .

FIG. 3 is a plan view showing the relationship between the COF tape 11 and the substrate presser in the electronic component bonding apparatus shown in FIG. 1 .

FIG. 4 is a view illustrating an alignment process of electronic components and COF tape 11 in the electronic component bonding apparatus shown in FIG.

5 is a perspective view of a camera used in the electronic component bonding apparatus shown in FIG. 1 , (a) is a plan view, (b) is a left side view, and (c) is a front view.

FIG. 6 is a flowchart illustrating a method of aligning IC contacts and COF tape 11 using the electronic component bonding apparatus shown in FIG. 1 .

FIG. 7 is a flowchart illustrating a method of crimping IC contacts and COF tape 11 using the electronic component bonding apparatus shown in FIG. 1 .

Fig. 8 is an evaluation diagram of a product manufactured by applying ultrasonic vibrations from two directions up and down using the electronic component bonding apparatus shown in Fig. 1. Tape) strength, substrate scratches, and product evaluation.

9 is a configuration diagram of a positioning drive device used in the electronic component bonding apparatus shown in FIG. 1 .

Fig. 10 is a main configuration diagram of an electronic component bonding apparatus according to Embodiment 2 of the present invention, and is also a front view showing a section of a part of the substrate mounting worktable and a substrate hold-down plate.

Fig. 11 is an evaluation diagram of a product manufactured by applying ultrasonic vibration only from above using the electronic component bonding apparatus shown in Fig. 10. , In the case of scratches generated on the inner surface of the substrate, each evaluation result of product evaluation is displayed.

Fig. 12 is an evaluation diagram of a product manufactured by applying ultrasonic vibration only from above using the electronic component bonding apparatus shown in Fig. 10. It is also a graph of scratches caused by poor transfer and crimping strength with respect to the roughness of the mounting surface. The display graph of item evaluation.

Fig. 13 is a diagram illustrating the position of a flaw generated during crimping.

Explanation of symbols

1 electronic component joining device; 2 vibrating head; 2a vibrating honing head; 2b vibrating head crimping part; 2c vibrator for vibrating head; 6 Working platform for substrate loading; 6a Mounting surface; 6b Platform; 6c Engagement hole; 6d Small diameter part; 6e Long hole; 7 Heater; 8 Temperature sensor; 9 Vacuum suction hole; 9a Vertical part; part; 9c small mouth-shaped groove; 9d elliptical recess; 10 vacuum tube; 11 COF tape (flexible substrate); 11a punching; 12 IC contact (electronic component); 13 substrate platen; 14 opening; 17 camera; 18 optical system; 19 camera department; 20a 20b camera opening; 21 prism; 22a 22b mirror; 23, 24 CCD; 25 alignment device; 26 X-axis work platform; 27 Y-axis work platform; 29 Lighting Ring 30 Device Controller; 31 Motor Driver; 32 Image Processing Device; 33 Flash Lighting Control Device; 51 Electronic Parts Engaging Device; 52 Board Mounting Side Part

Detailed ways

Hereinafter, embodiments of the electronic component bonding method and electronic component bonding apparatus according to the present invention will be described with reference to the drawings. First, Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 9 .

This electronic component bonding apparatus uses vibrations such as ultrasonic waves to bond electronic components. The ultrasonic bonding method that utilizes ultrasonic bonding is to place the electronic components to be bonded in close contact with the substrate side, and to carry out bonding while applying pressure while emitting ultrasonic waves. Therefore, in this specification, joining using vibrations such as ultrasonic waves is referred to as pressure bonding.

During crimping, in the initial stage of vibration, the oxide film and dirt on the bonding interface are removed, and at the same time, frictional heat is generated in the contact part. When the specified bonding time or energy is reached, the bonding is completed. If the interface is clean, a strong joint effect can be obtained. In addition, when the distance between crystal particles is close to the atomic distance, a strong attractive force will be generated to complete the solid phase diffusion bonding.

Fig. 1 shows the main components of an electronic component bonding apparatus (hereinafter, simply referred to as bonding apparatus) according to Embodiment 1 of the present invention. The bonding apparatus 1 is provided with a vibrating magnetic head 2 for electronic components (manufactured by Branson Corporation) and a substrate mounting side member 3 .

The vibration head 2 includes a vibration honing head 2a, a vibration head crimping portion 2b, and a vibration head vibrator 2c. The substrate mounting side member 3 is provided with a substrate vibrator 3 a , a heat insulating layer 4 , a substrate heating unit 5 , a stage 6 for mounting a substrate, a heater 7 , a temperature sensor 8 , a vacuum suction hole 9 and a vacuum tube 10 .

Between the vibrating magnetic head 2 and the mounting substrate member 3 , a COF tape 11 of a flexible resin substrate is arranged in a state of intermittently traveling from the left side to the right side in FIG. 1 . Electronic component IC connectors 12 are mounted on this COF tape 11 . A substrate hold-down plate 13 is provided on the stage 6 for mounting the substrate.

The structure of the bonding apparatus 1 is such that the IC connector 12 is pressure-bonded to the COF tape 11 by the vibrating head 2 provided on the upper side and the substrate mounting side member 3 provided on the lower side.

As shown in Figure 1, on the bottom surface of the top end of the vibrating honing head 2a, a vibrating head crimping portion 2b is provided; at the rear end of the vibrating honing head 2a, a vibrating head vibrator 2c made of piezoelectric devices is provided . The vibrating head crimping portion 2b is made of superhard material, but it is not limited thereto, and it is also suitable to cover the surface of the vibrating head crimping portion 2b with titanium nitride, titanium carbide or the like. If such a surface treatment is carried out, no matter what the base material is, its durability can be significantly improved.

The vibration of the vibrating head vibrator 2c is transmitted through the vibrating honing head 2a, and converges at the vibrating head crimping portion 2b. In order to make the vibration of the vibrating head crimping part 2b in the vertical direction 0, the installation of the vibrating honing head 2a is kept at a certain angle relative to the horizontal plane, so that the vibrating head crimping part 2b can only be parallel to the COF tape of the flexible substrate. The plane 11 vibrates in the horizontal direction, and its vibration frequency is 10-60KHz. In order to absorb the IC connector 12, check the position, retreat from the camera 17, and retreat from the COF tape described later, a driving device (not shown) that can move the vibrating head 2 up, down, left, and right is provided.

An adsorption hole with a diameter of 0.8mm is provided on the crimping portion 2b of the vibrating honing head for vacuuming the IC connector 12 to fix it on the vibrating head 2 (not shown). The suction hole provided in the vibrating head 2 has the same structure as the vacuum suction hole 9 provided in the substrate mounting stage 6 . Furthermore, a heater for heating the IC connector 12 may be embedded in the vibration honing head 2a. In this case, the same configuration as that of the substrate heating unit 5 can be employed.

In addition to the function of applying the vibration generated by the vibration of the substrate vibrator 3a to the COF tape 11, the substrate mounting side member 3, which is a vibrating magnetic head for the substrate, also has the function of attracting and fixing the COF tape 11, and heating the COF tape. Tape 11 features.

The substrate vibrator 3 a uses a giant magnetic strain device capable of expanding and contracting according to a magnetic field applied from the outside, and its vibration frequency is 10 to 30 KHz. The heat resistance of the giant magnetic strain device is very poor. Therefore, an insulating layer 4 is provided between the substrate vibration vibrator 3a and the substrate heating part 5 to prevent the substrate vibrator from being damaged due to the heat generated by the substrate heating part 5. 3a is overheated. Moreover, giant magnetic strain devices, like piezoelectric devices, can generate high-frequency vibrations, but compared with piezoelectric devices, they can exhibit excellent characteristics in a low-frequency region. In the technical field of joining electronic components, piezoelectric devices may be used instead of supermagnetic strain devices, and supermagnetic strain devices may be used instead of piezoelectric devices.

The heat insulation layer 4 is mainly composed of porous ceramics. Compared with other materials, porous ceramics are excellent in comprehensive properties such as high temperature resistance, vibration attenuation, and high strength.

The substrate heating part 5 is arranged between the heat insulating layer 4 and the working platform 6 for mounting the substrate, and the substrate heating part 5 is provided with a heater 7, a temperature sensor 8, and a vacuum tube 10 connected to a vacuum source for generating vacuum. In terms of design, the heat generated by the substrate heating unit 5 is hardly transferred to places other than the substrate mounting stage 6 . Wherein, the heater 7 is a packaged heater, and the temperature sensor 8 is a thermal (thermo) couple.

In addition to the function of mounting and supporting (absorbing and fixing) the COF tape 11 of the flexible substrate made of resin, the work platform 6 for substrate mounting also has the function of bearing the weight of the vibrating head 2 during crimping, and the COF tape 11 The function of transferring heat to the heater 7. On the substrate mounting work platform 6 , a mounting surface 6 a on which the COF tape 11 is mounted, and stage portions 6 b provided at both ends in the traveling direction of the COF tape 11 are also provided. Four screw engaging holes 6c, one small-diameter hole 6d, and one elongated hole 6e are provided on the stand portion 6b.

As shown in Figure 1 and Figure 2, the vacuum suction hole 9 has five vertical parts 9a extending in the vertical direction, two "mouth" shaped grooves 9b, 9c of different sizes surrounding the IC connector 12, and a bottom side. An elliptical concave portion 9d connected to the five vertical portions 9a. Furthermore, the top ends of the four vertical portions 9a are provided in pairs on the groove portions 9b, 9c, and only the central vertical portion 9a is provided on the mounting surface 6a.

In FIG. 1 , the vertical height of the substrate mounting stage 6 is 12 mm, the depth of the grooves 9 b and 9 c is 0.5 mm, and the depth of the recess 9 d is 1 mm. Therefore, the length of the vertical portion 9a is 10.5 mm. The surface roughness of the mounting surface 6a surrounding the "口"-shaped groove portion 9b, the surface roughness of that part of the mounting surface 6a surrounded by the "口"-shaped groove portion 9b and 9c, and the surface roughness of the mounting surface 6a surrounded by the small "口"-shaped groove portion The surface roughness of the part surrounded by 9c is the same, and is set to R MAX 0.05~0.2μm.

Furthermore, as will be described later, this numerical value can also be set within the range of 0.01 to 0.5 μm. In addition, this kind of mirror finishing should at least be applied to the portion surrounded by the small “mouth”-shaped groove portion 9c, that is, only on the IC mounting surface on which the IC contacts 12 are mounted. In this embodiment, the above-mentioned mirror finish of R MAX 0.05 to 0.2 μm is performed on all the mounting surfaces 6a in contact with the COF tape 11. In addition, since the conventional apparatus does not perform this processing, the surface roughness of the mounting surface 6a is several micrometers or more. Hereinafter, only the evaluation data of conventional devices having different surface roughnesses on the mounting surface 6 a will be appropriately described.

The substrate mounting side member 3 can move in the vertical direction when feeding the COF tape 11 in the direction of arrow A shown in FIG.

As shown in FIG. 3 , a quadrangular opening 14 is provided at the center of the substrate hold-down plate 13 , and notches 15 are provided at the front and rear in the traveling direction. This opening 14 can be put into vibrating magnetic head 2 top end bottom surface and vibrating magnetic head crimping part 2b, in addition, in order to prevent contact with vibrating magnetic head 2, the outer periphery of opening 14 has been chamfered at a large angle, that is to say, there is The thicker slope 13a on the outside.

In addition, the substrate hold-down plate 13 can move in the vertical direction, and its purpose is to make it when the COF tape 11 is conveyed, it will not be connected with the electrically connected post 16 formed on the COF tape 11 (the part indicated by the dashed line in Fig. 3 and Fig. 4 ). ) contact with the IC contact 12 to be bonded to cause damage. This electrical connection post 16 corresponds to the conventional lead portion 104 shown in FIG. 13 . Furthermore, when the COF tape 11 is pressed and fixed by the substrate pressing plate 13, each electrical connection post 16 formed on the COF tape 11 and each IC contact 12 crimped and bonded with the COF tape 11 are connected through the opening 14 and the slot 15. It is retracted away, so it will not come into contact with the substrate holding plate 13 .

The COF tape 11 is supported and fixed on the substrate mounting work platform 6 by the vacuum suction of the vacuum suction holes 9 and the pressing of the substrate presser 13 . On the other hand, the distance between the crimping surface (upper side in FIG. 1 ) of the COF tape 11 and the substrate mounting stage 6 is the thickness of the COF tape 11 . Since the COF tape 11 is flexible, even if the COF tape 11 is fixed by the substrate holding plate 13, unlike a substrate made of hard ceramics, the pressure-bonded surface of the COF tape 11 cannot be completely fixed without moving. That is to say, since there is a soft resin part between the upper and lower surfaces of the COF tape 11, even if the surroundings of the COF tape 11 are firmly fixed, if the upper and lower sides of the opening 14 of the COF tape 11 are subjected to vibration, they will vibrate in the horizontal direction. stretching occurs.

Furthermore, the fixing degree of the crimping surface of the COF tape 11 is not only related to the thickness of the above-mentioned tape, but also related to the distance between the inner end surface of the opening 14 on the substrate holding plate 13 and the IC contact 12 . The function of the vacuum suction hole 9 is mainly to improve the fixing strength of the COF tape 11. The COF tape 11 can be fixed by suction through the vacuum suction hole 9, or can be firmly fixed by pressing the substrate pressing plate 13.

In Fig. 1 and Fig. 3, for the convenience of looking at the figure, the distance between the substrate pressing plate 13 and the IC contact 12 is enlarged, but within the scope of not contacting with the vibrating magnetic head 2, the distance should be as small as possible . In this embodiment, the minimum distance from the end surface of the partition opening 14 to the IC contact 12 inside the opening 14 is 1.5 mm, and the minimum distance is preferably 0.5 mm to 5 mm, more preferably 0.8 mm to 2 mm. When the value exceeds 0.5 mm, the contact probability between the vibrating head 2 and the substrate holding plate 13 can be continuously reduced, and when the value is below 5 mm, the movement of the COF tape 11 arranged in the opening 14 can be suppressed to a considerable extent.

In addition, the vibrating direction of the vibrating magnetic head crimping portion 2b and the vibrating direction of the substrate mounting stage 6 are both horizontal and perpendicular to each other. Such a perpendicular intersection allows the 2 vibrations not to cancel the amplitude. Furthermore, by making both vibration frequencies different, the resultant vector of the two vibrations is not merely in a certain direction, but in random arbitrary directions.

The IC contacts 12 are provided on the COF tape 11 so that the stage 6 for mounting the board and the vibrator 2c for the vibrating magnetic head intersect each other perpendicularly and vibrate in the horizontal direction as shown below.

When setting the vibration frequency of the vibrating head 2c above 40KHz, the amplitude of the vibration honing head 2a is about 3 μm (micron), the amplitude of the IC contact 12 is 1.8 μm, and the amplitude of the IC contact 12 is attenuated to the vibration honing head 2a About 60% of. When setting the vibrating frequency of vibrator 2c for vibrating magnetic head when more than 60KHz, the amplitude of vibration honing head 2a is about 1 μm (micron), the amplitude of IC contact 12 is 0.2 μ m, and the amplitude of IC contact 12 is attenuated to that of vibration honing head 2a. 20% or so.

As mentioned above, because the higher the vibration frequency, the greater the vibration energy, but the greater the loss in transmission, so the vibration attenuation should be considered before deciding the vibration frequency. Furthermore, if the size of the reciprocating vibration (amplitude) of the IC contact 12 as an electronic component is between 0.2 and 3.6 μm, the bonding strength can be improved and scratches can be prevented.

FIG. 3 is a plan view showing the relationship between the COF tape 11 and the substrate holder 13. As shown in FIG. On both ends of the COF tape 11, through-holes 11a serving as joint holes for feeding are continuously formed at close intervals, and wiring (not shown) and electrical connection terminals 16 are formed in the center. The COF tape 11 is fed in the direction of arrow A in FIG. 3 . The slot 15 at the front of the direction of travel is used to prevent the electrical connection post 16 on the COF tape 11 from contacting the substrate holding plate 13, and the slot 15 at the rear side of the direction of travel is used to prevent electrical connection. The relief portion where the terminal post 16 or the IC contact 12 to be press-bonded comes into contact with the substrate holding plate 13 .

Because the COF tape 11 has flexibility, so in order to make the substrate press plate 13 can press stably, not only around the IC contact 12, but press the COF tape 11 in a wide range, so when setting the shape of the substrate press plate 13, make it The width W should be 2 to 7 times the mounting interval of the IC contacts 12 (the distance between the IC contacts 12 ).

Fig. 4 is after vibrating magnetic head crimping part 2b is sucked, with camera 17 to the IC contact 12 that moves to prescribed position (the first prescribed position) and the COF magnetic tape 11 that is sent to prescribed position (the 2nd prescribed position) An explanatory diagram of the process of connecting terminal 16 to take pictures and perform position calibration. In FIG. 4, the IC contact 12 is sucked to the vibration head crimping portion 2b provided on the bottom of the top end portion of the vibration honing head 2a. In addition, the substrate holding plate 13 and the substrate mounting side member 3 are omitted in FIG. 4 .

An illumination ring 29 (refer to FIG. 9 , omitted in FIG. 4 ) is provided on the periphery of the opening 14 of the camera 17 , and the camera 17 photographs the IC contacts 12 after receiving light from the illumination ring 29 . In addition, flash photography is also possible when the lighting ring 29 is used. Likewise, unbonded electrical connection posts 16 provided on the COF tape 11 are photographed using the camera 17 . And, on the COF magnetic tape 11 of Fig. 4, show the unjoined electrical connection post 16 (in Fig. 4, enlarge in the height direction with respect to the unjoined part) and the IC contact 12 that has been crimped, and then in Fig. 4 The direction in which the COF tape 11 is transported is indicated by an arrow A.

5 is a perspective view illustrating the internal structure of the camera 17, (a) is a plan view, (b) is a left side view, and (c) is a front view. The camera 17 is composed of two components capable of photographing upper and lower subjects. The camera 17 is composed of an optical system 18 and an imaging unit 19 .

The optical system 18 is divided into two systems, one of which reads the image of the electrical connection post 16 on the COF tape 11 from the lower camera opening 20a, and makes it turn 90 degrees from the vertical direction to the horizontal direction through the prism 21, and then Make it turn 90 degrees in the horizontal direction again on the input CCD (Charge Coupled Device) 23 by mirror 22a. A camera unit on one side is composed of a camera opening 20a, a prism 21, a mirror 22a, and a CCD 23. The image input to the CCD 23 is converted into an electrical signal in the imaging unit 19, and the signal is sent to the image processing device 32 (see FIG. 9 ). In FIG. 5 , solid arrows indicate the traveling direction of the system light.

Another of the optical system 18 reads the image of the IC contact 12 adsorbed on the vibrating head crimping portion 2b from the upper side camera opening 20b, makes it turn 90 degrees from the vertical direction to the horizontal direction by the prism 21, and makes it turn by the mirror 22b again. It turns 90 degrees and input to CCD24 (Charge Coupled Device). The camera part on the other side is composed of the camera opening 20b, the prism 21, the mirror 22b and the CCD 24. The image input to the CCD 24 is converted into an electrical signal in the imaging unit 19 , and the signal is sent to the image processing device 32 . In Fig. 5, the dotted arrows indicate the direction of light travel of the system.

5(b), (c) show the camera openings 20a, 20b and the prism 21 on the lower and upper sides. As shown in the figure, in this embodiment, the subject images on the upper and lower sides are read through the camera openings 20a and 20b respectively, the images are transmitted by each of the two optical systems 18 arranged on the same plane, and the images are transmitted by the CCDs 23 and 24. converted to a digital signal.

After aligning the IC contacts 12 and the COF tape 11 supported by the vibrating head 2 and retracting the camera 17 , the vibrating head 2 is lowered to press the IC contacts 12 to the COF tape 11 .

Usually, after the COF tape 11 is aligned, the vibration head 2 is lowered in the vertical direction, and the alignment accuracy will decrease. In order to prevent the drop of alignment accuracy, it is very effective to shorten the moving distance of the vibrating head 2 . Therefore, in this embodiment, the thickness (width in the vertical direction) near the camera openings 20a, 20b is reduced. In order to reduce the thickness of the camera 17 in the vicinity of the camera openings 20a, 20b, the following method is recommended. As shown in this embodiment, the optical system 18 divided into two systems can be installed on the same plane, and the optical system 18 and the imaging unit 19 can be distinguished. , making the optical system 18 thinner than the imaging unit 19 .

Furthermore, in order to check the position of the COF tape 11, a method of using a position mark (check mark) provided on the COF tape 11 is used. The alignment of the IC contacts 12 supported by the vibrating head 2 uses the circuit wiring lattice drawn on the IC contacts 12 . When the COF tape 11 is crimped with a circuit board instead of the IC contacts 12, the position marks provided on the circuit board are used. The shape of the location mark is an O mark with a diameter of 0.2 mm. In addition, other shapes, such as squares, X marks, etc., can also be used, and the size is preferably 0.1 to 5 mm.

6 is a flow chart of alignment (position calibration) of electronic components (here, IC contacts 12 ) and electrical connection posts 16 on resin flexible substrates (here, COF tape 11 ). In addition, the control of the following operations is performed by the device controller 30 (see FIG. 9 ) of the joining device 1 .

First, the process of supporting the IC contacts 12 by the vibrating head 2 starts. That is to say, move the vibrating head 2 to the groove (not shown) where the IC contacts 12 are placed, and support the vibrating head 2 by absorbing and fixing the IC contacts 12 on the vibrating head crimping portion 2b (step S1). Also, in the case of lining by tape, and cutting the spacer substrate according to the point in time, the liner tape can be used instead of the groove.

Next, it proceeds to the step of moving the IC contact 12 to the first predetermined position. That is, in order to move the IC contact 12 to the position (first predetermined position) that is pressed against the COF tape 11, the vibrating magnetic head 2 supported by the suction-fixed IC contact 12 is moved to the first predetermined position (step S2) .

Next, it proceeds to the process of moving the COF tape 11 to the second predetermined position. That is to say, the COF tape 11 is moved to the position where the electrical connection post 16 and the IC contact point 12 are crimped by the device controller 30 in a free state away from the substrate mounting work platform 6 and the substrate holding plate 13 (the first 2 specified position) (step S3).

Next, the process proceeds to the process of supporting and fixing the COF tape 11 on the stage 6 for substrate mounting. That is to say, by raising the substrate loading side member 3, the substrate loading working platform 6 is raised, and the substrate loading working platform 6 is adsorbed by the COF tape 11 by the suction force generated by the vacuum suction hole 9 to support and fix the COF tape 11 ( Step S4). After this, the substrate presser 13 is lowered, and the COF tape 11 is fixed between the substrate mounting stage 6 and the substrate presser 13 (step S5). As a result, the work platform 6 for substrate mounting can firmly support the COF tape 11 .

Next, it proceeds to the step of aligning the IC contacts 12 and the COF tape 11 . First, move the camera 17 to a position where the position mark can be photographed (step S6). Moreover, the camera 17 simultaneously takes pictures of the position mark of the COF tape 11 and the loop wiring lattice or position mark of the IC contact 12, and reads the captured image data into the camera 17 (step S7).

Next, the image processing device 32 (see FIG. 9 ) calculates the position mark coordinates of the COF tape 11 and the predetermined position or position mark coordinates of the loop wiring lattice of the IC contact 12 (step S8). When the coordinate data error related to the position mark of the COF tape 11 or the position mark of the IC contact 12 (or the fixed position of the loop wiring grid) exceeds the specified range (YES in step S9), the device control 30 ( Referring to FIG. 9 ), it is judged whether its position is shifted, and the vibrating magnetic head 2 is moved and driven to align with the IC contacts 12 (step S10). When the coordinate error of the photographed position marker is within the specified range (NO in step S9), the device controller 30 judges whether the position is offset, no longer moves the vibrating head 2, and enters the next process.

In the present embodiment, because the position mark on the COF tape 11 can be directly read without passing through the magnetic tape and the transparent substrate, the position reading accuracy will not be reduced due to the distortion of the light generated when using the transparent substrate, and it is possible to Improve the detection accuracy of the marked position.

In addition, the alignment accuracy of the two parts is to measure the coordinates of the two parts at different times, and each coordinate must be calculated separately, and the error of each coordinate from the origin must be calculated cumulatively. On the other hand, when the positions of two parts are measured on the same member at the same time as described above, if the mutual relationship between the two measurement positions can be grasped, the two parts can be aligned. Therefore, there is no need to consider individual errors in the coordinates of the two components from the origin. In other words, even if the camera 17 is moved, the alignment data of the two components can be read with high precision. Such simultaneous imaging by the optical system 18 of the same member is a very effective method for open control which is a position control method that does not detect residual vibration. Hereinafter, this point will be described.

After each alignment, the camera 17 moves to the specified position of the position mark and the circuit wiring lattice (hereinafter referred to as the position mark) and takes pictures. Rewinds from the shooting position. Since it is difficult for the camera 17 to completely stop in a short time, residual vibration occurs.

When the residual vibration reaches a certain level, if the position mark on the IC contact 12 and the position mark on the COF tape 11 are photographed at different times, the measured and calculated position mark coordinates include the influence of the residual vibration. However, if the position mark of the COF tape 11 is used as the reference for the alignment of the IC contacts 12, and the simultaneous shooting is performed, the above-mentioned problems will not occur. That is to say, if the same camera 17 is used to simultaneously photograph the position mark of the IC contact 12 and the position mark on the COF tape 11, the residual vibration of the camera 17 will not become a problem.

In this way, if the alignment method of this embodiment is adopted, the alignment accuracy of the two components can be significantly improved. In addition, in the above-mentioned step S7, by taking pictures of the upper and lower subjects and reading their images at the same time, it is possible to omit the time required to wait for the residual vibration to decrease in order to read the data, and to speed up the pace.

7 is a flow chart about a method of bonding the shock electrode (corresponding to the metal protrusion 102 in the prior art) of the IC contact 12 to the electrical connection post 16 on the COF tape 11 by ultrasonic vibration.

The alignment step SA is basically the same as the alignment steps S1 to S10 described above with respect to the IC contacts 12 and the COF tape 11. Also, at this time, simultaneous shooting in step S7 is not an essential condition. This is because the alignment of the IC contact 12 and the COF tape 11 has already been completed, and also because only a slight correction was performed in step SA.

Hereinafter, the steps after alignment will be described with reference to FIG. 7 .

First, the device controller 30 retracts the alignment camera 17 (step S11). Then, at least until the next step S12 is performed, the temperature of the vibration honing head 2a is set to 300°C, and the temperature of the substrate heating unit 5 is set to 200°C. This heating may not be performed on the vibrating head 2 side, but may be performed only on the substrate heating unit 5 .

Next, the device controller 30 moves the IC contact 12 closer to the COF tape 11 by lowering the vibrating head 2 (step S12).

In the next step, the device controller 30 vibrates and vibrates the magnetic head vibrator 2c and the substrate vibrator 3a under the condition that the vibration frequency of the magnetic head vibrator 2c is higher than the vibration frequency of the substrate vibrator 3a, and the IC contacts are vibrated. 12 and COF tape 11 for crimp joint.

More specifically, under the condition that the vibration frequency of the vibrator 2c for vibrating the magnetic head is 40KHz, and the vibration frequency of the vibrator 3a for vibrating the substrate is 18KHz, the vibrator 2c for the vibrating magnetic head and the vibrator 3a for the substrate are aligned in the horizontal direction. Vibrate in perpendicularly intersecting directions (step S13). At this time, the vibration amplitude of the vibrating head crimping portion 2 b was 8 μm, and the vibration amplitude of the substrate mounting stage was 14 μm.

From the close position of the two, the vibrating magnetic head 2 is further descended, so that the IC contact 12 is pressed on the electrical connection post 16 of the COF magnetic tape 11 for 0.5 seconds (step S14). Furthermore, in this embodiment, the dimensions of the IC contacts 12 are 2×10 mm in length and width, 0.04 mm in thickness, and the number of terminals (protrusions) is 40. The crimping load was about 100 g/protrusion, 40 N (Newton) overall. In addition, the mirror finish of the mounting surface 6a is as described above, and the degree of unevenness of the surface is controlled within the range of R Max of 0.05 to 2.0 μm.

Next, a step in which the device controller 30 separates the IC contacts 12 from the vibrating magnetic head 2 is implemented. Specifically, the device controller 30 turns off the vacuum state holding the IC contact 12, and separates the vibrating head crimping portion 2b from the IC contact 12 (step S15).

Next, the device controller 30 separates the COF tape 11 fixed on the substrate mounting stage 6 from the substrate mounting stage 6 . Specifically, the device controller 30 turns off the vacuum holding the COF tape 11, lifts the substrate platen 13, and puts the COF tape 11 in a free state (step S16). On this basis, the vibrating magnetic head 2 is moved to the position for picking the next IC contact 12 through the device controller 30 .

Next, under the control of the device controller 30 , the substrate mounting stage 6 is lowered (step S17 ). Then, the COF tape 11 advances by one pitch, and proceeds to the next splicing operation (step S18).

In this embodiment, the vibration frequency of the vibrator 2c for a magnetic head is higher than the vibration frequency of the vibrator 3a for a substrate. In addition, the amplitude of the vibration is opposite to the vibration frequency, and the amplitude of vibrating the substrate mounting table 6 by the vibrator 3a for the substrate is larger than the amplitude of vibrating the vibrating head crimping part 2b by vibrating the vibrator 2c for the magnetic head. . By making the vibration frequency of the upper and lower sides different, random sliding can be performed and good crimping strength can be obtained.

If the vibration frequency of the vibrating head vibrator 2c is lower than that of the substrate vibrator 3a, the energy efficiency will be lowered, and it will be difficult to obtain good crimping strength. This is because the higher the vibration frequency given to the COF tape 11 , the greater the attenuation of energy transmitted to the substrate vibrator 3 a on the pressure-bonded surface of the COF tape 11 is. On the other hand, since the energy attenuation of the IC contact 12 is very small, it is effective to increase the vibration frequency to a certain extent and increase the energy. From this, it can be seen that the vibration frequency of the vibrator 2c for the magnetic head may be 1.2 to 4 times the vibration frequency of the substrate vibrator 3a, and it is more preferably 1.5 to 2.5 times. However, even if the vibration frequency of the vibrating head vibrator 2c is lower than the vibration frequency of the substrate vibrator 3a, the crimping strength is better than when both vibration frequencies are the same.

In the present invention, tests were performed under the condition that the vibration amplitude of the vibrator 2c for a magnetic head is 2 to 12 μm, and the vibration amplitude of the substrate vibrator is 3 to 20 μm. As a result, in order to make the vibration amplitude of the vibrating head vibrator 2c larger than that of the substrate vibrator 3a, the vibration frequency of the vibrating magnetic head vibrator 2c must be lowered, so that it is difficult to obtain good crimping strength while deteriorating the energy efficiency. . Therefore, the amplitude of the vibration head vibrator 2 c is preferably 1/4 to 1/1.2 times, more preferably 1/2.5 to 1/1.5 times that of the substrate vibrator 3 a.

When the vibration frequency of the vibrator 2c for the vibrating magnetic head, that is, the vibration frequency of the vibrating honing head 2a was 40KHz, the amplitude of the vibrating honing head 2a was about 3 μm, and the amplitude of the IC contact 12 pressed on the COF magnetic tape 11 was attenuated to the vibration honing 60-70% of the head 2a is about 1.8-2 μm. On the other hand, when the vibration frequency of the vibrating honing head 2a is 60KHz, the amplitude of the vibrating honing head 2a is about 1 μm, and the amplitude of the IC contact 12 pressed on the COF magnetic tape 11 is attenuated to 20% of the vibrating honing head 2a, about 0.2 μm. Thus, when the vibration frequency of the vibrator 2c for vibrating the magnetic head, that is, the vibration frequency of the vibration honing head 2a is about 40KHz, the amplitude of the vibration honing head 2a is increased compared with when the vibration frequency of the vibration honing head 2a is about 60KHz. , and the attenuation of the vibration transmitted to the IC contact 12 is small, and the energy loss given to the junction of the IC contact 12 is also small.

In terms of the timing when each vibrator 2c, 3a starts to vibrate and the IC contact 12 is pressed against the COF tape 11, the timing of each vibrator 2c, 3a may be earlier than the pressing time of the IC contact 12. It is most perfect to start vibrating each vibrator 2a, 3c and carry out the crimping of the IC contact 12 at the same time.

FIG. 8 shows the relationship between the thickness of the COF tape 11 and practicality.

The COF magnetic tape 11 used is resin-made polyimide resin with a thickness of 5-300 micrometers. When the crimping strength is greater than the actual application requirements, it is marked with O, when it is lower than the actual application requirements, it is marked with ×, and when it is between the two, it is marked with △. Similarly, if the strength of the magnetic tape (=substrate strength) is greater than the actual application requirement, it will be marked with O, if it is lower than the actual use requirement, it will be marked with ×, and if it is between the two, it will be marked with △. In addition, when the surface roughness of the mounting surface 6a of the substrate mounting work platform 6 has not been transferred to the inner surface of the COF tape 11, it is marked with O, and it is marked with △ if it is transferred but very fine scratches can be confirmed. Prominent words are marked with X.

Judging from FIG. 8 , the thickness of the COF tape 11 is preferably 10-200 μm, and in consideration of work performance, etc., the thickness of the COF tape 11 is more preferably 20-70 μm. Furthermore, even in conventional devices in which the surface roughness of the mounting surface 6 a is several μm or more, the evaluation data of the crimping strength and the substrate strength are the same as those shown in FIG. 8 . Moreover, although the initial device (the device with the roughness of the mounting surface 6a is more than several μm) did not evaluate whether the flaws on the substrate were transferred, it can be inferred from other evaluation data later that the defects on the substrate were transferred to the image. 8 on flexible substrates of various thicknesses.

9 is a main configuration diagram of an alignment device 25 for determining the horizontal position of the IC contacts 12 mounted on the bottom of the top end of the vibrating head 2 relative to the COF tape 11 in the bonding device 1 .

As shown in Figure 9, the alignment device 25 includes: the X-axis working platform 26 that makes the vibrating magnetic head 2 move on the X-axis direction, the Y-axis working platform 27 that makes the vibrating magnetic head 2 move on the Y-axis direction, a camera 17, Lighting ring 29 , device controller 30 , motor driver 31 , image processor 32 , and strobe lighting control device 33 . The alignment device 25 aligns the COF tape 11 with respect to the IC contacts 12, and moves the vibrating honing head 2a holding the IC contacts 12 to the X-axis and the Y-axis.

The X-axis working platform 26 is used to control the X-axis direction (direction perpendicular to the paper in FIG. 1 ) driving of the vibrating honing head 2a, and it includes an encoder for detecting the X-axis position of the vibrating honing head 2a. The X-axis working table 26 usually transmits the position data of the vibrating honing head 2 a in the X-axis direction to the device controller 30 , the motor driver 31 and the image processor 32 .

The Y-axis working table 27 is used to control the drive in the Y-axis direction of the vibrating honing head 2a (the traveling direction of the COF tape 11), and it includes an encoder for detecting the Y-axis position of the vibrating honing head 2a. The Y-axis worktable 27 usually transmits the Y-axis direction position data of the vibratory honing head 2 a to the device controller 30 , motor driver 31 and image processor 32 .

The device controller 30 is used to manage the overall control of the bonding device 1, specifically, to control the X-axis work platform 26, the Y-axis work platform 27, the motor driver 31, the image processor 32, the flash lighting control device 33, The substrate loading side member 3 (omitted in FIG. 9 ), the substrate presser 13 (omitted in FIG. 9 ), and the conveyance of the COF tape 11 operate separately.

The device controller 30 controls the motor driver 31, the image processing device 32, the flashlight lighting control, and The operation of the device 33 , the substrate loading side member 3 , the substrate platen 13 , and the transport mechanism of the COF tape 11 . In addition, the device controller 30 can also periodically scan the position data of the IC contacts 12 and the COF tape 11 fixedly supported on the vibrating head 2, and then read them intermittently.

The device controller 30, based on the position data of the X-axis working platform 26 and the Y-axis working platform 27, recognizes that the IC contact 12 is close to the COF tape 11 above the specified position in the horizontal direction, and sends an instruction signal for reading an image to the image processing unit. Device 32. At the same time, the device controller 30 sends an instruction signal for flash lighting to the flash lighting control device 33 . Also, position data of the work platforms 26, 27 are monitored. The delay time until the command signal is sent to the strobe lighting control device 33 based on this data should be 0, but as long as it is less than 1/10 of the residual vibration frequency of the work platforms 26 and 27, there is no major problem.

The motor driver 31 drives the vibration head 2 through the control of the device controller 30—that is, the vibration honing head 2a moves in the X-axis direction and the Y-axis direction; image processing. The image processing device 32 receives position data from the X-axis stage 26 and the Y-axis stage 27 simultaneously with image data from the camera 17 .

Then, while the image processing device 32 receives the command signal from the device controller 30 and controls the camera 17 to perform shooting operation, it also sends a command signal to the flash lighting control device 33 to perform flash lighting at the same time. The flash lighting control device 33 drives the lighting ring 29 to perform flash lighting after receiving the command signals sent by the image processing device 32 and the device controller 30 respectively.

While the flash light is on, the camera 17 simultaneously photographs the position marks of the COF tape 11 and the IC contact 12 , and the impact electrode of the IC contact 12 and the electrical connection post 16 of the COF tape 11 . The captured image is processed by the image processing device 32 as described above, and the position state is calculated by the device controller 30 . Then, align according to the calculation result.

The alignment method described in FIG. 6 can improve the alignment accuracy and shorten the time of the alignment of the above-mentioned electronic components such as the IC contacts 12 and the resin flexible substrates such as the COF tape 11 on which the electronic components are actually mounted. As the substrate, use is not limited to flexible resin substrates (including magnetic tapes), and relatively rigid resin tapes, relatively rigid resin substrates, and highly rigid ceramic substrates are also suitable. However, the surface roughness of the substrate mounting stage 6 is transferred to the inner surface of the substrate, which can only occur with flexible substrates. Mirror finishing of the substrate mounting stage 6a is suitable for crimping electronic components on flexible substrates. .

In addition, the alignment method in FIG. 6 and the pressure bonding method in FIG. 7 are described using two vibrators 2c and 3a as an example, but the methods described in FIGS. 6 and 7 are also applicable to the case of only one vibrator. , for example, only the vibrator 2c for vibrating the magnetic head.

Next, an electronic component bonding apparatus and an electronic component bonding method according to Embodiment 2 of the present invention will be described with reference to FIGS. 10 to 12 . Because the electronic component bonding device 51 of embodiment 2 is compared with the bonding device of embodiment 1, the only difference is that a vibrator is provided on the vibrating magnetic head 2 side, and the others are completely consistent, so the same symbol is used for the same component identification here. , and omit or simplify the corresponding description.

As shown in FIG. 10 , the bonding device 51 includes the vibrating magnetic head 2 and a substrate mounting side member 52 . The vibration head vibrator 2c vibrates at a frequency of 10 to 60 KHz, whereby the vibration honing head 2a also vibrates at the frequency of 10 to 60 KHz. The substrate placement side member 52 is provided with the substrate placement vibrator 3 a and the heat insulating layer 4 mounted on the substrate placement side member 3 of the bonding apparatus 1 according to the first embodiment.

The mounting surface 6a of the work platform 6 for substrate mounting was mirror-finished so that the surface roughness R Max was 0.2 μm. However, when developing the bonding device 51, firstly, non-mirror-finished components were used, and it was confirmed how much thickness of the flexible substrate was required to meet the needs of the product in the case of only one vibrator. The evaluation items were three items excluding scratches on the substrate, and FIG. 11 shows the results. As shown in FIG. 11, if the thickness of the flexible substrate (COF tape 11) is 5-100 μm, a satisfactory product can be obtained to a certain extent, and if it is 10-20 μm, a very good product can be obtained.

However, the surface roughness of the mounting surface 6a that has not been mirror-finished is completely transferred to the inner surface of all COF tapes 11, including those with a product evaluation of O, and is expressed as scratches. Therefore, the final product evaluation of all products shown in FIG. 11 was x. In order to solve the new problem that the surface roughness is transferred, the mounting surface 6a is mirror-finished. At this time, an experiment was carried out to determine how much the mirror finish should be in relation to the degree of transcription of the surface roughness. In the experiment, the surface roughness of the mounting surface 6a was taken to be R Max in the range of 0.001 μm to 2.0 μm. The experimental results are shown in Figure 12.

As shown in Figure 12, for the adverse problems caused by transcription, the surface roughness can be basically solved when the R Max is in the range of 0.01 μm to 0.5 μm, and the surface roughness is more ideally 0.001 μm to 0.2 μm . On the other hand, for the surface of crimping strength, when the surface roughness R Max is above 0.1 μm, this problem can be basically solved, and more ideally it is above 0.05 μm. When the experimental results shown in FIG. 12 were obtained, the thickness of the COF tape 11 used as the flexible substrate was 5 to 50 μm. Specifically, in the experimental results shown in FIG. 11 , the crimp strength was evaluated as 0 for five types of 5 μm, 10 μm, 20 μm, 30 μm, and 50 μm.

It can be inferred from the data shown in FIG. 12 that when the surface roughness exceeds a certain level, the friction increases, which can improve the position fixing strength of the COF tape 11 and improve the crimping strength. On the other hand, when the surface roughness is lower than R Max 0.5μm, the flexible substrate exerts its elastic properties, the surface roughness is no longer transcribed, and basically there will be no scars.

Moreover, when acquiring the data shown in FIG. 12, the vibrating magnetic head 2 is vibrated in a direction perpendicular to the paper surface of FIG. 10. FIG. This direction is a direction at right angles to the direction in which the electrical connection post 16 extends (the direction in which the fixing portion of the guide portion protrudes). The vibration direction may also be the traveling direction of the COF tape 11 or other directions.

The various embodiments described above are preferred implementation examples of the present invention, but various changes can be made as long as they do not exceed the scope of the claims of the present invention. For example, in the various embodiments described above, the COF tape 11 made of resin is used as the flexible substrate, but a TAB tape used in the TAB system may also be used. In addition, as long as it is a flexible substrate, a substrate other than a magnetic tape or a substrate other than resin can also be used.

In addition, the above-mentioned embodiment shows an example in which ultrasonic vibrations are applied from two directions, up and down, and an example in which ultrasonic vibrations are applied from above, but ultrasonic vibrations may be applied from below. In addition, the vibrator used can provide ultrasonic vibration, but depending on the nature and required strength of the two members to be joined, it may be not ultrasonic but other vibrations can be provided.

In addition, when ultrasonic waves are applied from two directions, up and down, it is preferable to apply them in two directions perpendicular to each other as described above, but it is also possible to apply vibrations in the same direction or in a direction with a crossing angle different from 90 degrees. Furthermore, when ultrasonic waves are applied from two vertical directions, it is recommended to make the frequencies and amplitudes of the two types of vibrations different, but the frequencies and amplitudes of the two types of vibrations may be the same. In addition, when the frequency and the amplitude are different from each other, it is also possible to set the completely opposite relationship to that of the first embodiment.

In addition, the electronic components bonded to the flexible substrate may be other electronic components such as surface acoustic wave devices and resistive devices in addition to IC contacts. In addition, the substrate loading side members 3, 52 may not include the substrate heater 5; the flexible substrate is fixedly supported on the loading surface 6a by vacuum suction and the pressing force of the substrate pressing plate 13, but it may also be only through the In either case, a fixing method such as magnet adsorption may be used instead. In addition, besides vacuum adsorption, the electronic components supported and fixed by the vibrating magnetic head 2 can also be supported and fixed by claws or the like.

In addition, the bonding method of the present invention can also be carried out by a bonding device including some of the components described in FIGS. 1 and 9 . Furthermore, the bonding method of the electronic component of this invention can be applied to the product manufactured by this method, for example, can be applied to TCP.

Claims (15)

1. the joint method of an electronic unit, it is bonded on the electronic unit utilization vibration crimping of supporting to be fixed on the magnetic head on the substrate, and it includes following operation:

The operation of the fixing above-mentioned electronic unit of said head support;

The electronic unit that is supported to fix is moved to the operation of the 1st assigned position;

Aforesaid substrate adopts resinous flexible substrate, and this flexible substrate is moved to the operation of the 2nd assigned position;

Substrate carries the operation with the above-mentioned flexible substrate of workbench support fixation;

Electronic unit is near the operation of above-mentioned flexible substrate;

Vibration frequency in said head surpasses under the state of substrate lift-launch with the vibration frequency of workbench, on one side both are vibrated, Yi Bian above-mentioned electronic unit is carried out the operation that crimping engages with flexible substrate;

The operation that above-mentioned electronic unit leaves from magnetic head;

Be fixedly supported on aforesaid substrate and carry the operation of leaving with workbench from the substrate lift-launch with the flexible substrate on the workbench.

2. the joint method of an electronic unit, it is bonded on the electronic unit utilization vibration crimping of supporting to be fixed on the magnetic head on the substrate, and it includes following operation:

The operation of the fixing above-mentioned electronic unit of said head support;

The electronic unit that is supported to fix is moved to the operation of the 1st assigned position;

Aforesaid substrate adopts resinous flexible substrate, and this flexible substrate is moved to the operation of the 2nd assigned position;

Substrate carries the operation with the above-mentioned flexible substrate of workbench support fixation;

Above-mentioned electronic unit is near the operation of above-mentioned flexible substrate;

Carry with under the state of vibration amplitude greater than the magnetic head vibration amplitude of workbench at aforesaid substrate, on one side both are vibrated, Yi Bian make above-mentioned electronic unit and flexible substrate carry out the operation that crimping engages;

The operation that above-mentioned electronic unit leaves from magnetic head;

Be fixedly supported on aforesaid substrate and carry the operation of leaving with workbench from the substrate lift-launch with the flexible substrate on the workbench.

3. the joint method of electronic unit as claimed in claim 1 or 2, wherein said head adopts the vibration magnetic head.

4. the joint method of electronic unit as claimed in claim 1 or 2, wherein

Aforesaid substrate carries with in the workbench, and the surface roughness that is equipped with the lift-launch face of above-mentioned flexible substrate is 0.01～0.5 μ m.

5. the joint method of electronic unit as claimed in claim 1 or 2 is characterized in that said flexible substrate, and it is that thickness is the resin system flexible substrate of 10～200 μ m.

6. the joint method of electronic unit as claimed in claim 5 is characterized in that said flexible substrate is COF tape or TAB tape.

7. the joint method of electronic unit as claimed in claim 1 or 2, the thickness that it is characterized in that said flexible substrate is 10～50 μ m.

8. the joint method of electronic unit as claimed in claim 1 or 2 is characterized in that at least a side being heated in said electronic unit and the flexible substrate.

9. electronic unit coupling device, the substrate lift-launch workbench that it has the magnetic head of support fixation electronic unit and is equipped with substrate, and, apply vibration with workbench above-mentioned electronic unit crimping is bonded on the substrate by carrying to said head and substrate;

Wherein, it is COF tape or the TAB tape of 10～200 μ m that aforesaid substrate can adopt thickness,

Vibration frequency in said head is carried under the state of the vibration frequency of using workbench greater than substrate, and both can vibrate and constitute.

10. electronic unit coupling device, the substrate lift-launch workbench that it has the magnetic head of support fixation electronic unit and is equipped with substrate, and, apply vibration with workbench above-mentioned electronic unit crimping is bonded on the substrate by carrying to said head and substrate;

Wherein, it is COF tape or the TAB tape of 10～200 μ m that aforesaid substrate can adopt thickness,

Carry with under the state of vibration amplitude greater than the vibration amplitude of magnetic head of workbench at aforesaid substrate, both can vibrate and constitute.

11. as claim 9 or 10 described electronic unit coupling devices, it is characterized in that said magnetic head and substrate lift-launch are used workbench, can be an angle of 90 degrees in the horizontal direction mutually and carry out double vibrations.

12. as claim 9 or 10 described electronic unit coupling devices,

Wherein, aforesaid substrate adopts flexible substrate, and

Aforesaid substrate carries with in the workbench, and the surface roughness that is equipped with the lift-launch face of aforesaid substrate is 0.01～0.5 μ m.

13. electronic unit coupling device as claimed in claim 12, the surface roughness that it is characterized in that said flexible substrate are 0.05～0.2 μ m.

14. electronic unit coupling device as claimed in claim 13, it is characterized in that its also be provided with make the vibration of said magnetic head magnetic head with ticker with make said substrate carry the substrate ticker that vibrates with workbench, said magnetic head and substrate are carried with workbench to be kept carrying out double vibrations on 90 directions of spending in the horizontal direction, mutually, simultaneously, carry with workbench vibration frequency or at least one side or the both sides of vibration separately in the two separately according to said magnetic head and substrate and carry out different vibrations.

15. electronic unit coupling device as claimed in claim 13, it is characterized in that said magnetic head can vibrate, and carry with under the state of workbench at fixing base, make the electronic unit of supporting to be fixed on the magnetic head by ultrasonic vibration, carry out the double vibrations of 0.2～3.6 μ m in the horizontal direction, thereby said electronic unit crimping is bonded on the flexible substrate.

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