CN1274452C - Laser micro-carving method - Google Patents
Laser micro-carving method Download PDFInfo
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- CN1274452C CN1274452C CN 02153305 CN02153305A CN1274452C CN 1274452 C CN1274452 C CN 1274452C CN 02153305 CN02153305 CN 02153305 CN 02153305 A CN02153305 A CN 02153305A CN 1274452 C CN1274452 C CN 1274452C
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- Prior art keywords
- laser
- workpiece
- micropore
- microscopic carvings
- hole
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000001788 irregular Effects 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 206010027146 Melanoderma Diseases 0.000 abstract 1
- 238000005553 drilling Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
The present invention discloses a new laser micro-carving method which relates to a laser drilling method. Laser light emitted from a laser source passes through a lens and acts on an engraved workpiece. The present invention is characterized in that a light diaphragm is arranged between the lens and the workpiece, and the shape of a light diaphragm hole is identical with the shape of a black spot which needs to be formed by micro carving. The present invention has the advantages of simple realization of micropore processing, good processing conformance and high processing speed.
Description
Technical field:
The present invention relates to a kind of processing method of micropore, particularly a kind of laser microscopic carvings method.
Background technology:
Laser beam has good directionality, brightness height, big three characteristics of illumination, reduces a bit, and the energy that is exactly laser beam is concentrated at spatial altitude.For highly parallel laser beam, can focus on very a little bit smaller behind the scioptics, produce high temperature at this point, make material fusing or gasification, penetrate workpiece by the shock wave that sharply expands, industrial this principle of extensively utilizing is punched, cutting, processing such as welding, because focusing on the diameter of back focus hot spot, laser is decided by the angle of divergence of used laser and the focal length of object lens, the diameter Stimulated Light spot diameter restriction in hole or little hole, want to obtain on workpiece micro-dimension hole or hole just is not easy very much, because the angle of divergence of used laser beam and the focal length of object lens are depended in the aperture of micropore, the angle of divergence and focal length are big more, the hole of getting is just big more, and their relation is: spot diameter (d) ≈ laser beam divergence (the θ) * focal length of lens (f), CO
2The angle of divergence of laser is generally 0.001, as with focal length being 100 millimeters lens, the diameter of focus place hot spot is so: d ≈ θ * f=0.001 * 100=0.1 millimeter=100 micron, this numerical value is almost the directly limit of punching of laser, and therefore laser boring method is difficult to obtain the more hole of minor diameter usually.
The laser microscopic carvings of often using in the present artistic process are that the Laser Microbeam that energy is very little moves on by the engraving workpiece, the technology that the part that needs hollow out is cut away along periphery.The laser miniature technology is widely used in the processing of the art work, and is very high by the hole week burr fineness little, the hole of laser microscopic carvings engraving, can use this technology to carve out very little micropore, to satisfy various application.But there is the shortcoming that be difficult to be controlled to be consistent size when needing engraving same scale micropore in existing laser miniature technology because micropore is carved one by one, and each micropore all needs to carve continuously and get along periphery, and speed of fulfiling hole is slow.
Summary of the invention:
The present invention overcomes in the prior art capillary processing field common laser processing method processing difficulties and microscopic carvings difficult processing with the uniformity and the slow-footed technological deficiency of capillary processing of control micropore, design a kind of laser microscopic carvings method of micropore, processing that can easy realization micropore and processing high conformity, process velocity are fast.
Technical scheme of the present invention is such: the laser that sends from lasing light emitter acts on the workpiece of being carved through behind the lens, it is characterized in that being provided with between lens and workpiece a diaphragm, and the shape in described diaphragm door screen hole is identical with the spot that needs microscopic carvings to become.
Described diaphragm is near workpiece.
Described spot is a micropore.
Described spot is little hole.
Described laser is produced by carbon dioxide laser.
Described diaphragm is made by metal material.
Described workpiece can be materials such as paper, plastics, timber, rubber.
Described workpiece can be a metallic film.
Micropore on the described workpiece and/or little hole are circular, and the diameter in circular hole and/or hole is the 30-120 micron.
Micropore on the described workpiece and/or little hole are oval, and the length range of its major axis is the 100-200 micron, and the length of minor axis is the 30-80 micron.
Micropore on the described workpiece and/or little hole are triangle.
Micropore on the described workpiece and/or little hole are irregular hole and/or hole.
The present invention is owing to be provided with a diaphragm between lens and workpiece, the shape in described diaphragm door screen hole is identical with the spot that needs microscopic carvings to become, laser beam focuses on after the effect of diaphragm through lens like this, the light that a part is dispersed and just be blocked with the inconsistent peripheral laser of spot shape, the only remaining laser beam that acts on the workpiece with the spot coupling of workpiece just can be engraved as workpiece required micropore.Owing to only just can realize the engraving of micropore, so the inventive method is simple and convenient, realizes easily by increasing by a diaphragm, again because the late hole of diaphragm is pre-set, only need travelling workpiece, just can carve out the extraordinary micropore of uniformity, and can realize punching at a high speed with same diaphragm.
Description of drawings:
Fig. 1 is a schematic diagram of the present invention;
Fig. 2 is that laser boring forms the profile after amplify in the hole.
The specific embodiment:
The laser 1 that carbon dioxide laser sends among Fig. 1 arrives lens 2 through light path, focus on the back and arrive workpiece 4 by diaphragm 3, because the shape of the spot that will carve out on late hole and the workpiece 4 on the diaphragm 3 is consistent, laser after the focusing is behind diaphragm 3, light of dispersing and unwanted light are blocked, and the light concentrated consistent with spot can arrive workpiece, like this, bright trace on the workpiece diminishes, be that the aperture diminishes, the inventive method can be got and be far smaller than 100 microns micropore, preferably can get 30-100 micron circular hole and/or little hole.
Micropore on the described workpiece and/or little hole can be ellipse, and the length range of its major axis is the 100-200 micron, and the length of minor axis is the 30-80 micron.Micropore on the described workpiece and/or little hole are triangle.
Micropore on the described workpiece and/or little hole are irregular hole and/or hole.
Diaphragm of the present invention is made by metal material, and workpiece can be nonmetallic materials such as paper, plastics, timber, rubber, also can be metallic film.
The profile in hole when showing laser boring among Fig. 2, aperture aberration one horn mouth, for common laser boring, big mouthful of diameter D2 of loudspeaker is generally with the ratio of transparent aperture D1:
D2/D1 ≈ 1.8-2 (when D1 when 150 μ m are following)
Therefore the occupied diameter of horn mouth is the nearly twice of actual loophole diameter, if aperture is formed pattern, guarantee workpiece that enough intensity is arranged and can not be perforated destroy, the pitch-row between the aperture should be more than or equal to 700 μ m, promptly usually laser boring can not get lean on very near micropore.The horn mouth of the aperture that common laser microscopic carvings method is got can dwindle, and reaches D2/D1 ≈ 1.2-1.3, realizes getting compact arranged two or more aperture, and burr are little simultaneously.The inventive method can realize the D2/D1 ratio close even littler with common microscopic carvings, so the present invention kept the advantage that laser microscopic carvings aperture burr are little, the hole is highly polished, and implementation method is very simple, can also realize quick punching.
Preferred embodiment: near workpiece, diaphragm can be the 10-20 micron apart from workpiece with described diaphragm.
Claims (10)
1. a laser microscopic carvings method will act on the workpiece of being carved through behind the lens from the laser that lasing light emitter sends, and it is characterized in that being provided with between lens and workpiece a diaphragm, and the shape in described diaphragm door screen hole is identical with the spot that needs microscopic carvings to become.
2. a kind of laser microscopic carvings method according to claim 1 is characterized in that described diaphragm is near workpiece.
3. a kind of laser microscopic carvings method according to claim 1 and 2 is characterized in that described spot is a micropore.
4. a kind of laser microscopic carvings method according to claim 1 and 2 is characterized in that described spot is little hole.
5. a kind of laser microscopic carvings method according to claim 1 and 2 is characterized in that diaphragm is a metal material.
6. a kind of laser microscopic carvings method according to claim 1 and 2 is characterized in that described workpiece can be paper, plastics, timber, rubber or metallic film.
7. a kind of laser microscopic carvings method according to claim 3 is characterized in that the micropore on the described workpiece is circle, and Circularhole diameter is the 30-120 micron.
8. a kind of laser microscopic carvings method according to claim 3 is characterized in that the micropore on the described workpiece is ellipse, and the length range of its major axis is the 100-200 micron, and the length of minor axis is the 30-80 micron.
9. a kind of laser microscopic carvings method according to claim 3 is characterized in that the micropore on the described workpiece is a triangle.
10. a kind of laser microscopic carvings method according to claim 3 is characterized in that the micropore on the described workpiece is irregular hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02153305 CN1274452C (en) | 2002-11-27 | 2002-11-27 | Laser micro-carving method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02153305 CN1274452C (en) | 2002-11-27 | 2002-11-27 | Laser micro-carving method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1502443A CN1502443A (en) | 2004-06-09 |
| CN1274452C true CN1274452C (en) | 2006-09-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02153305 Expired - Fee Related CN1274452C (en) | 2002-11-27 | 2002-11-27 | Laser micro-carving method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1274452C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102442028A (en) * | 2010-10-13 | 2012-05-09 | 鸿富锦精密工业（深圳）有限公司 | Manufacturing method of composite body of metal and resin |
| CN106199832B (en) * | 2015-05-08 | 2020-02-07 | 中兴通讯股份有限公司 | Optical waveguide plate and optical fiber coupling connection method, optical waveguide plate and communication transmission system |
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2002
- 2002-11-27 CN CN 02153305 patent/CN1274452C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1502443A (en) | 2004-06-09 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Inst. of Printing Science, Peolpe's Bank of China Assignor: China banknote printing and Minting Corporation Contract fulfillment period: 2008.11.11 to 2013.11.10 Contract record no.: 2008110000159 Denomination of invention: Laser micro-carving method Granted publication date: 20060913 License type: Exclusive license Record date: 2008.12.5 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.11.11 TO 2013.11.10; CHANGE OF CONTRACT Name of requester: PEOPLE'S BANK OF CHINA SCIENCE PRINTING TECHNOLOGY Effective date: 20081205 |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060913 Termination date: 20171127 |