CN1267389A - 电可寻址无源器件,电寻址该器件的方法以及所述器件和方法的使用 - Google Patents
电可寻址无源器件,电寻址该器件的方法以及所述器件和方法的使用 Download PDFInfo
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- CN1267389A CN1267389A CN98808217A CN98808217A CN1267389A CN 1267389 A CN1267389 A CN 1267389A CN 98808217 A CN98808217 A CN 98808217A CN 98808217 A CN98808217 A CN 98808217A CN 1267389 A CN1267389 A CN 1267389A
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/42—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically- coupled or feedback-coupled
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
- G11C13/0016—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material comprising polymers
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/04—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
- G11C17/165—Memory cells which are electrically programmed to cause a change in resistance, e.g. to permit multiple resistance steps to be programmed rather than conduct to or from non-conduct change of fuses and antifuses
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/16—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/71—Three dimensional array
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/77—Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Optical Recording Or Reproduction (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Semiconductor Integrated Circuits (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
- Credit Cards Or The Like (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Control Of El Displays (AREA)
Abstract
Description
Claims (37)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NO972803 | 1997-06-17 | ||
| NO972803A NO972803D0 (no) | 1997-06-17 | 1997-06-17 | Elektrisk adresserbar logisk innretning, fremgangsmåte til elektrisk adressering av samme og anvendelse av innretning og fremgangsmåte |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1267389A true CN1267389A (zh) | 2000-09-20 |
| CN100440374C CN100440374C (zh) | 2008-12-03 |
Family
ID=19900838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB988082179A Expired - Lifetime CN100440374C (zh) | 1997-06-17 | 1998-06-17 | 电可寻址器件,该器件电寻址的方法以及所述器件和方法的使用 |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6055180A (zh) |
| EP (1) | EP0990235B1 (zh) |
| JP (1) | JP3415856B2 (zh) |
| KR (1) | KR100362053B1 (zh) |
| CN (1) | CN100440374C (zh) |
| AT (1) | ATE237182T1 (zh) |
| AU (1) | AU735299B2 (zh) |
| CA (1) | CA2294834C (zh) |
| DE (1) | DE69813218T2 (zh) |
| DK (1) | DK0990235T3 (zh) |
| ES (1) | ES2196585T3 (zh) |
| NO (1) | NO972803D0 (zh) |
| RU (1) | RU2182732C2 (zh) |
| WO (1) | WO1998058383A2 (zh) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100342453C (zh) * | 2000-11-27 | 2007-10-10 | 薄膜电子有限公司 | 铁电存储电路及其制造方法 |
| CN100367403C (zh) * | 2001-02-26 | 2008-02-06 | 薄膜电子有限公司 | 被选存储单元非破坏性读出的方法及设备 |
| WO2008019616A1 (en) * | 2006-08-14 | 2008-02-21 | Hong Kong Applied Science And Technology Research Institute Co., Ltd | Electrical thin film memory |
| US7719001B2 (en) | 2006-06-28 | 2010-05-18 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device with metal oxides and an organic compound |
| US7811880B2 (en) | 2007-05-14 | 2010-10-12 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Fabrication of recordable electrical memory |
| US7935957B2 (en) | 2005-08-12 | 2011-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and a semiconductor device |
| CN102077346A (zh) * | 2008-06-30 | 2011-05-25 | 桑迪士克3D公司 | 通过使用正型光刻胶进行二次图案化而制造高密度柱结构的方法 |
| CN110366780A (zh) * | 2017-01-15 | 2019-10-22 | 赛因托鲁株式会社 | 光检测器阵列 |
Families Citing this family (308)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7071913B2 (en) | 1995-07-20 | 2006-07-04 | E Ink Corporation | Retroreflective electrophoretic displays and materials for making the same |
| US7999787B2 (en) | 1995-07-20 | 2011-08-16 | E Ink Corporation | Methods for driving electrophoretic displays using dielectrophoretic forces |
| US7193625B2 (en) * | 1999-04-30 | 2007-03-20 | E Ink Corporation | Methods for driving electro-optic displays, and apparatus for use therein |
| US7109968B2 (en) | 1995-07-20 | 2006-09-19 | E Ink Corporation | Non-spherical cavity electrophoretic displays and methods and materials for making the same |
| US5673218A (en) | 1996-03-05 | 1997-09-30 | Shepard; Daniel R. | Dual-addressed rectifier storage device |
| NO309500B1 (no) | 1997-08-15 | 2001-02-05 | Thin Film Electronics Asa | Ferroelektrisk databehandlingsinnretning, fremgangsmåter til dens fremstilling og utlesing, samt bruk av samme |
| US7247379B2 (en) | 1997-08-28 | 2007-07-24 | E Ink Corporation | Electrophoretic particles, and processes for the production thereof |
| US6839158B2 (en) | 1997-08-28 | 2005-01-04 | E Ink Corporation | Encapsulated electrophoretic displays having a monolayer of capsules and materials and methods for making the same |
| US7002728B2 (en) | 1997-08-28 | 2006-02-21 | E Ink Corporation | Electrophoretic particles, and processes for the production thereof |
| US7075502B1 (en) | 1998-04-10 | 2006-07-11 | E Ink Corporation | Full color reflective display with multichromatic sub-pixels |
| WO1999059101A2 (en) | 1998-05-12 | 1999-11-18 | E-Ink Corporation | Microencapsulated electrophoretic electrostatically-addressed media for drawing device applications |
| ATE349722T1 (de) | 1998-07-08 | 2007-01-15 | E Ink Corp | Verbesserte farbige mikroverkapselte elektrophoretische anzeige |
| US7256766B2 (en) | 1998-08-27 | 2007-08-14 | E Ink Corporation | Electrophoretic display comprising optical biasing element |
| US7157314B2 (en) | 1998-11-16 | 2007-01-02 | Sandisk Corporation | Vertically stacked field programmable nonvolatile memory and method of fabrication |
| US6385074B1 (en) | 1998-11-16 | 2002-05-07 | Matrix Semiconductor, Inc. | Integrated circuit structure including three-dimensional memory array |
| US6842657B1 (en) | 1999-04-09 | 2005-01-11 | E Ink Corporation | Reactive formation of dielectric layers and protection of organic layers in organic semiconductor device fabrication |
| US6531997B1 (en) | 1999-04-30 | 2003-03-11 | E Ink Corporation | Methods for addressing electrophoretic displays |
| NO311317B1 (no) | 1999-04-30 | 2001-11-12 | Thin Film Electronics Asa | Apparat omfattende elektroniske og/eller optoelektroniske kretser samt fremgangsmåte til å realisere og/eller integrerekretser av denne art i apparatet |
| US7119772B2 (en) * | 1999-04-30 | 2006-10-10 | E Ink Corporation | Methods for driving bistable electro-optic displays, and apparatus for use therein |
| US7012600B2 (en) * | 1999-04-30 | 2006-03-14 | E Ink Corporation | Methods for driving bistable electro-optic displays, and apparatus for use therein |
| US6504524B1 (en) | 2000-03-08 | 2003-01-07 | E Ink Corporation | Addressing methods for displays having zero time-average field |
| US7038655B2 (en) | 1999-05-03 | 2006-05-02 | E Ink Corporation | Electrophoretic ink composed of particles with field dependent mobilities |
| US8115729B2 (en) | 1999-05-03 | 2012-02-14 | E Ink Corporation | Electrophoretic display element with filler particles |
| US7030412B1 (en) | 1999-05-05 | 2006-04-18 | E Ink Corporation | Minimally-patterned semiconductor devices for display applications |
| JP4744757B2 (ja) * | 1999-07-21 | 2011-08-10 | イー インク コーポレイション | アクティブマトリクス駆動電子ディスプレイの性能を高めるための蓄電キャパシタの使用 |
| NO315728B1 (no) | 2000-03-22 | 2003-10-13 | Thin Film Electronics Asa | Multidimensjonal adresseringsarkitektur for elektroniske innretninger |
| US7893435B2 (en) | 2000-04-18 | 2011-02-22 | E Ink Corporation | Flexible electronic circuits and displays including a backplane comprising a patterned metal foil having a plurality of apertures extending therethrough |
| DE60139463D1 (de) * | 2000-04-18 | 2009-09-17 | E Ink Corp | Prozess zur herstellung von dünnfilmtransistoren |
| US6631085B2 (en) | 2000-04-28 | 2003-10-07 | Matrix Semiconductor, Inc. | Three-dimensional memory array incorporating serial chain diode stack |
| US8575719B2 (en) | 2000-04-28 | 2013-11-05 | Sandisk 3D Llc | Silicon nitride antifuse for use in diode-antifuse memory arrays |
| US6856572B2 (en) * | 2000-04-28 | 2005-02-15 | Matrix Semiconductor, Inc. | Multi-headed decoder structure utilizing memory array line driver with dual purpose driver device |
| US6567287B2 (en) | 2001-03-21 | 2003-05-20 | Matrix Semiconductor, Inc. | Memory device with row and column decoder circuits arranged in a checkerboard pattern under a plurality of memory arrays |
| US6956757B2 (en) * | 2000-06-22 | 2005-10-18 | Contour Semiconductor, Inc. | Low cost high density rectifier matrix memory |
| EP1170799A3 (de) * | 2000-07-04 | 2009-04-01 | Infineon Technologies AG | Elektronisches Bauelement und Verfahren zum Herstellen eines elektronischen Bauelements |
| US6683333B2 (en) | 2000-07-14 | 2004-01-27 | E Ink Corporation | Fabrication of electronic circuit elements using unpatterned semiconductor layers |
| TW531846B (en) * | 2000-08-09 | 2003-05-11 | Infineon Technologies Ag | Memory element and method for fabricating a memory element |
| EP2988331B1 (en) * | 2000-08-14 | 2019-01-09 | SanDisk Technologies LLC | Semiconductor memory device |
| AU2001265068A1 (en) * | 2000-10-31 | 2002-05-15 | The Regents Of The University Of California | Organic bistable device and organic memory cells |
| US6950129B1 (en) | 2000-11-22 | 2005-09-27 | Hewlett-Packard Development Company, L.P. | One-time-use digital camera |
| FR2817604B1 (fr) * | 2000-12-01 | 2004-04-23 | Biomerieux Sa | Vannes activees par des polymeres electro-actifs ou par des materiaux a memoire de forme, dispositif contenant de telles vannes et procede de mise en oeuvre |
| US6687149B2 (en) | 2001-02-05 | 2004-02-03 | Optabyte, Inc. | Volumetric electro-optical recording |
| US6817531B2 (en) * | 2001-03-07 | 2004-11-16 | Hewlett-Packard Development Company, L.P. | Apparatus and methods for marking content of memory storage devices |
| US6919633B2 (en) * | 2001-03-07 | 2005-07-19 | Hewlett-Packard Development Company, L.P. | Multi-section foldable memory device |
| US6504753B1 (en) | 2001-03-21 | 2003-01-07 | Matrix Semiconductor, Inc. | Method and apparatus for discharging memory array lines |
| US6545898B1 (en) | 2001-03-21 | 2003-04-08 | Silicon Valley Bank | Method and apparatus for writing memory arrays using external source of high programming voltage |
| US6522594B1 (en) | 2001-03-21 | 2003-02-18 | Matrix Semiconductor, Inc. | Memory array incorporating noise detection line |
| US7177181B1 (en) | 2001-03-21 | 2007-02-13 | Sandisk 3D Llc | Current sensing method and apparatus particularly useful for a memory array of cells having diode-like characteristics |
| US6618295B2 (en) | 2001-03-21 | 2003-09-09 | Matrix Semiconductor, Inc. | Method and apparatus for biasing selected and unselected array lines when writing a memory array |
| US7424201B2 (en) * | 2001-03-30 | 2008-09-09 | Sandisk 3D Llc | Method for field-programming a solid-state memory device with a digital media file |
| US7230750B2 (en) | 2001-05-15 | 2007-06-12 | E Ink Corporation | Electrophoretic media and processes for the production thereof |
| US6996660B1 (en) | 2001-04-09 | 2006-02-07 | Matrix Semiconductor, Inc. | Memory device and method for storing and reading data in a write-once memory array |
| US7062602B1 (en) | 2001-04-09 | 2006-06-13 | Matrix Semiconductor, Inc. | Method for reading data in a write-once memory device using a write-many file system |
| US7003619B1 (en) | 2001-04-09 | 2006-02-21 | Matrix Semiconductor, Inc. | Memory device and method for storing and reading a file system structure in a write-once memory array |
| US6895490B1 (en) * | 2001-04-09 | 2005-05-17 | Matrix Semiconductor, Inc. | Method for making a write-once memory device read compatible with a write-many file system |
| AU2002340793A1 (en) * | 2001-05-07 | 2002-11-18 | Coatue Corporation | Molecular memory device |
| KR100900080B1 (ko) * | 2001-05-07 | 2009-06-01 | 어드밴스드 마이크로 디바이시즈, 인코포레이티드 | 자기 조립형 폴리머 막을 구비한 메모리 디바이스 및 그제조 방법 |
| JP4514016B2 (ja) | 2001-05-07 | 2010-07-28 | アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド | 複合分子材料を使用したフローティングゲートメモリデバイス |
| CN100367528C (zh) * | 2001-05-07 | 2008-02-06 | 先进微装置公司 | 具储存效应的开关装置 |
| AU2002340795A1 (en) | 2001-05-07 | 2002-11-18 | Advanced Micro Devices, Inc. | Reversible field-programmable electric interconnects |
| US6873540B2 (en) * | 2001-05-07 | 2005-03-29 | Advanced Micro Devices, Inc. | Molecular memory cell |
| US20100148385A1 (en) * | 2001-05-15 | 2010-06-17 | E Ink Corporation | Electrophoretic media and processes for the production thereof |
| US6795778B2 (en) * | 2001-05-24 | 2004-09-21 | Lincoln Global, Inc. | System and method for facilitating welding system diagnostics |
| US6756620B2 (en) * | 2001-06-29 | 2004-06-29 | Intel Corporation | Low-voltage and interface damage-free polymer memory device |
| US6624457B2 (en) | 2001-07-20 | 2003-09-23 | Intel Corporation | Stepped structure for a multi-rank, stacked polymer memory device and method of making same |
| US6967640B2 (en) * | 2001-07-27 | 2005-11-22 | E Ink Corporation | Microencapsulated electrophoretic display with integrated driver |
| US6806526B2 (en) * | 2001-08-13 | 2004-10-19 | Advanced Micro Devices, Inc. | Memory device |
| US6768157B2 (en) * | 2001-08-13 | 2004-07-27 | Advanced Micro Devices, Inc. | Memory device |
| US6838720B2 (en) * | 2001-08-13 | 2005-01-04 | Advanced Micro Devices, Inc. | Memory device with active passive layers |
| RU2256957C2 (ru) * | 2001-08-13 | 2005-07-20 | Кригер Юрий Генрихович | Ячейка памяти |
| US6858481B2 (en) | 2001-08-13 | 2005-02-22 | Advanced Micro Devices, Inc. | Memory device with active and passive layers |
| DE60130586T2 (de) | 2001-08-13 | 2008-06-19 | Advanced Micro Devices, Inc., Sunnyvale | Speicherzelle |
| TW559751B (en) * | 2001-08-24 | 2003-11-01 | Delta Optoelectronics Inc | Driving circuit and method of organic light-emitting diode |
| US7275135B2 (en) * | 2001-08-31 | 2007-09-25 | Intel Corporation | Hardware updated metadata for non-volatile mass storage cache |
| US6724665B2 (en) | 2001-08-31 | 2004-04-20 | Matrix Semiconductor, Inc. | Memory device and method for selectable sub-array activation |
| US6735546B2 (en) | 2001-08-31 | 2004-05-11 | Matrix Semiconductor, Inc. | Memory device and method for temperature-based control over write and/or read operations |
| US20030061436A1 (en) * | 2001-09-25 | 2003-03-27 | Intel Corporation | Transportation of main memory and intermediate memory contents |
| US7152125B2 (en) * | 2001-09-25 | 2006-12-19 | Intel Corporation | Dynamic master/slave configuration for multiple expansion modules |
| US20030058681A1 (en) * | 2001-09-27 | 2003-03-27 | Intel Corporation | Mechanism for efficient wearout counters in destructive readout memory |
| EP1302441B1 (en) * | 2001-10-10 | 2007-01-03 | Rohm And Haas Company | An improved method for making lithium borohydride |
| US20030074524A1 (en) * | 2001-10-16 | 2003-04-17 | Intel Corporation | Mass storage caching processes for power reduction |
| NO20015509D0 (no) * | 2001-11-09 | 2001-11-09 | Hans Gude Gudesen | Elektrodeanordning, fremgangsmåte til dets fremstilling, apparat omfattende elektrodeanordningene, samt bruk av sistnevnte |
| US6833593B2 (en) | 2001-11-09 | 2004-12-21 | Thin Film Electronics Asa | Electrode means, a method for its manufacture, an apparatus comprising the electrode means as well as use of the latter |
| DE10156470B4 (de) * | 2001-11-16 | 2006-06-08 | Infineon Technologies Ag | RF-ID-Etikett mit einer Halbleiteranordnung mit Transistoren auf Basis organischer Halbleiter und nichtflüchtiger Schreib-Lese-Speicherzellen |
| US6889307B1 (en) | 2001-11-16 | 2005-05-03 | Matrix Semiconductor, Inc. | Integrated circuit incorporating dual organization memory array |
| US6768685B1 (en) | 2001-11-16 | 2004-07-27 | Mtrix Semiconductor, Inc. | Integrated circuit memory array with fast test mode utilizing multiple word line selection and method therefor |
| US7202847B2 (en) | 2002-06-28 | 2007-04-10 | E Ink Corporation | Voltage modulated driver circuits for electro-optic displays |
| US7528822B2 (en) * | 2001-11-20 | 2009-05-05 | E Ink Corporation | Methods for driving electro-optic displays |
| US7952557B2 (en) * | 2001-11-20 | 2011-05-31 | E Ink Corporation | Methods and apparatus for driving electro-optic displays |
| US8125501B2 (en) | 2001-11-20 | 2012-02-28 | E Ink Corporation | Voltage modulated driver circuits for electro-optic displays |
| US8593396B2 (en) | 2001-11-20 | 2013-11-26 | E Ink Corporation | Methods and apparatus for driving electro-optic displays |
| US9412314B2 (en) | 2001-11-20 | 2016-08-09 | E Ink Corporation | Methods for driving electro-optic displays |
| US9530363B2 (en) | 2001-11-20 | 2016-12-27 | E Ink Corporation | Methods and apparatus for driving electro-optic displays |
| US8558783B2 (en) | 2001-11-20 | 2013-10-15 | E Ink Corporation | Electro-optic displays with reduced remnant voltage |
| US6646903B2 (en) * | 2001-12-03 | 2003-11-11 | Intel Corporation | Ferroelectric memory input/output apparatus |
| WO2003050607A1 (en) | 2001-12-13 | 2003-06-19 | E Ink Corporation | Electrophoretic electronic displays with films having a low index of refraction |
| US6914839B2 (en) * | 2001-12-24 | 2005-07-05 | Intel Corporation | Self-timed sneak current cancellation |
| US6570440B1 (en) | 2001-12-24 | 2003-05-27 | Intel Corporation | Direct-timed sneak current cancellation |
| US6952375B2 (en) * | 2001-12-24 | 2005-10-04 | Intel Corporation | Self-timed voltage-subtraction sneak current cancellation method and apparatus |
| DE10200475A1 (de) * | 2002-01-09 | 2003-07-24 | Samsung Sdi Co | Nichtflüchtiges Speicherelement und Anzeigematrizen daraus |
| US6864118B2 (en) * | 2002-01-28 | 2005-03-08 | Hewlett-Packard Development Company, L.P. | Electronic devices containing organic semiconductor materials |
| KR100433407B1 (ko) * | 2002-02-06 | 2004-05-31 | 삼성광주전자 주식회사 | 업라이트형 진공청소기 |
| US6900851B2 (en) | 2002-02-08 | 2005-05-31 | E Ink Corporation | Electro-optic displays and optical systems for addressing such displays |
| NO20021057A (no) * | 2002-03-01 | 2003-08-25 | Thin Film Electronics Asa | Minnecelle |
| US6853049B2 (en) | 2002-03-13 | 2005-02-08 | Matrix Semiconductor, Inc. | Silicide-silicon oxide-semiconductor antifuse device and method of making |
| GB2386462A (en) * | 2002-03-14 | 2003-09-17 | Cambridge Display Tech Ltd | Display driver circuits |
| US7103724B2 (en) * | 2002-04-01 | 2006-09-05 | Intel Corporation | Method and apparatus to generate cache data |
| US6842357B2 (en) * | 2002-04-23 | 2005-01-11 | Intel Corporation | Nondestructive sensing mechanism for polarized materials |
| US6738307B2 (en) | 2002-05-13 | 2004-05-18 | Hewlett-Packard Development Company, L.P. | Address structure and methods for multiple arrays of data storage memory |
| US7727777B2 (en) * | 2002-05-31 | 2010-06-01 | Ebrahim Andideh | Forming ferroelectric polymer memories |
| JP4282951B2 (ja) * | 2002-05-31 | 2009-06-24 | パイオニア株式会社 | 半導体記憶素子及びその寿命動作開始装置、並びに該半導体記憶素子を備えた情報記録媒体 |
| US20080024482A1 (en) * | 2002-06-13 | 2008-01-31 | E Ink Corporation | Methods for driving electro-optic displays |
| US6737675B2 (en) | 2002-06-27 | 2004-05-18 | Matrix Semiconductor, Inc. | High density 3D rail stack arrays |
| DE10231646B4 (de) * | 2002-07-12 | 2007-01-18 | Infineon Technologies Ag | Nichtflüchtige Speicherzellen |
| JP2004047791A (ja) * | 2002-07-12 | 2004-02-12 | Pioneer Electronic Corp | 有機薄膜スイッチングメモリ素子及びメモリ装置 |
| US7240564B2 (en) * | 2002-07-30 | 2007-07-10 | Alliant Techsystems Inc. | Method and apparatus for detecting and determining event characteristics with reduced data collection |
| US6753561B1 (en) * | 2002-08-02 | 2004-06-22 | Unity Semiconductor Corporation | Cross point memory array using multiple thin films |
| US7312916B2 (en) | 2002-08-07 | 2007-12-25 | E Ink Corporation | Electrophoretic media containing specularly reflective particles |
| US7012276B2 (en) * | 2002-09-17 | 2006-03-14 | Advanced Micro Devices, Inc. | Organic thin film Zener diodes |
| DE10245554B4 (de) * | 2002-09-30 | 2008-04-10 | Qimonda Ag | Nanopartikel als Ladungsträgersenke in resistiven Speicherelementen |
| JP3929867B2 (ja) * | 2002-10-11 | 2007-06-13 | 独立行政法人物質・材料研究機構 | 基板結合型遷移金属触媒、及びその製造方法 |
| US20130063333A1 (en) | 2002-10-16 | 2013-03-14 | E Ink Corporation | Electrophoretic displays |
| US6870183B2 (en) * | 2002-11-04 | 2005-03-22 | Advanced Micro Devices, Inc. | Stacked organic memory devices and methods of operating and fabricating |
| US6847047B2 (en) * | 2002-11-04 | 2005-01-25 | Advanced Micro Devices, Inc. | Methods that facilitate control of memory arrays utilizing zener diode-like devices |
| US6859410B2 (en) | 2002-11-27 | 2005-02-22 | Matrix Semiconductor, Inc. | Tree decoder structure particularly well-suited to interfacing array lines having extremely small layout pitch |
| US6954394B2 (en) * | 2002-11-27 | 2005-10-11 | Matrix Semiconductor, Inc. | Integrated circuit and method for selecting a set of memory-cell-layer-dependent or temperature-dependent operating conditions |
| US6773954B1 (en) | 2002-12-05 | 2004-08-10 | Advanced Micro Devices, Inc. | Methods of forming passive layers in organic memory cells |
| US6746971B1 (en) | 2002-12-05 | 2004-06-08 | Advanced Micro Devices, Inc. | Method of forming copper sulfide for memory cell |
| US6770905B1 (en) | 2002-12-05 | 2004-08-03 | Advanced Micro Devices, Inc. | Implantation for the formation of CuX layer in an organic memory device |
| US7220985B2 (en) * | 2002-12-09 | 2007-05-22 | Spansion, Llc | Self aligned memory element and wordline |
| US7800932B2 (en) * | 2005-09-28 | 2010-09-21 | Sandisk 3D Llc | Memory cell comprising switchable semiconductor memory element with trimmable resistance |
| US7051251B2 (en) * | 2002-12-20 | 2006-05-23 | Matrix Semiconductor, Inc. | Method for storing data in a write-once memory array using a write-many file system |
| US7233522B2 (en) * | 2002-12-31 | 2007-06-19 | Sandisk 3D Llc | NAND memory array incorporating capacitance boosting of channel regions in unselected memory cells and method for operation of same |
| US7005350B2 (en) * | 2002-12-31 | 2006-02-28 | Matrix Semiconductor, Inc. | Method for fabricating programmable memory array structures incorporating series-connected transistor strings |
| US7505321B2 (en) * | 2002-12-31 | 2009-03-17 | Sandisk 3D Llc | Programmable memory array structure incorporating series-connected transistor strings and methods for fabrication and operation of same |
| WO2004070789A2 (en) * | 2003-02-03 | 2004-08-19 | The Regent Of The University Of California | Rewritable nano-surface organic electrical bistable devices |
| US6656763B1 (en) | 2003-03-10 | 2003-12-02 | Advanced Micro Devices, Inc. | Spin on polymers for organic memory devices |
| US6868022B2 (en) * | 2003-03-28 | 2005-03-15 | Matrix Semiconductor, Inc. | Redundant memory structure using bad bit pointers |
| US10726798B2 (en) | 2003-03-31 | 2020-07-28 | E Ink Corporation | Methods for operating electro-optic displays |
| US6822903B2 (en) * | 2003-03-31 | 2004-11-23 | Matrix Semiconductor, Inc. | Apparatus and method for disturb-free programming of passive element memory cells |
| US6879505B2 (en) * | 2003-03-31 | 2005-04-12 | Matrix Semiconductor, Inc. | Word line arrangement having multi-layer word line segments for three-dimensional memory array |
| US7233024B2 (en) * | 2003-03-31 | 2007-06-19 | Sandisk 3D Llc | Three-dimensional memory device incorporating segmented bit line memory array |
| US6825060B1 (en) | 2003-04-02 | 2004-11-30 | Advanced Micro Devices, Inc. | Photosensitive polymeric memory elements |
| US7049153B2 (en) * | 2003-04-23 | 2006-05-23 | Micron Technology, Inc. | Polymer-based ferroelectric memory |
| US6960783B2 (en) * | 2003-05-13 | 2005-11-01 | Advanced Micro Devices, Inc. | Erasing and programming an organic memory device and method of fabricating |
| US6977389B2 (en) * | 2003-06-02 | 2005-12-20 | Advanced Micro Devices, Inc. | Planar polymer memory device |
| US8174490B2 (en) * | 2003-06-30 | 2012-05-08 | E Ink Corporation | Methods for driving electrophoretic displays |
| US6787458B1 (en) | 2003-07-07 | 2004-09-07 | Advanced Micro Devices, Inc. | Polymer memory device formed in via opening |
| US6803267B1 (en) | 2003-07-07 | 2004-10-12 | Advanced Micro Devices, Inc. | Silicon containing material for patterning polymeric memory element |
| US7259039B2 (en) * | 2003-07-09 | 2007-08-21 | Spansion Llc | Memory device and methods of using and making the device |
| WO2005020199A2 (en) | 2003-08-19 | 2005-03-03 | E Ink Corporation | Methods for controlling electro-optic displays |
| US6987689B2 (en) * | 2003-08-20 | 2006-01-17 | International Business Machines Corporation | Non-volatile multi-stable memory device and methods of making and using the same |
| US7274035B2 (en) * | 2003-09-03 | 2007-09-25 | The Regents Of The University Of California | Memory devices based on electric field programmable films |
| US7177183B2 (en) | 2003-09-30 | 2007-02-13 | Sandisk 3D Llc | Multiple twin cell non-volatile memory array and logic block structure and method therefor |
| US7057958B2 (en) * | 2003-09-30 | 2006-06-06 | Sandisk Corporation | Method and system for temperature compensation for memory cells with temperature-dependent behavior |
| US6955939B1 (en) | 2003-11-03 | 2005-10-18 | Advanced Micro Devices, Inc. | Memory element formation with photosensitive polymer dielectric |
| US7184289B2 (en) * | 2003-11-12 | 2007-02-27 | Intel Corporation | Parallel electrode memory |
| US8928562B2 (en) * | 2003-11-25 | 2015-01-06 | E Ink Corporation | Electro-optic displays, and methods for driving same |
| WO2005086627A2 (en) * | 2003-12-03 | 2005-09-22 | The Regents Of The University Of California | Three-terminal electrical bistable devices |
| US7221588B2 (en) * | 2003-12-05 | 2007-05-22 | Sandisk 3D Llc | Memory array incorporating memory cells arranged in NAND strings |
| US7023739B2 (en) * | 2003-12-05 | 2006-04-04 | Matrix Semiconductor, Inc. | NAND memory array incorporating multiple write pulse programming of individual memory cells and method for operation of same |
| US20050128807A1 (en) * | 2003-12-05 | 2005-06-16 | En-Hsing Chen | Nand memory array incorporating multiple series selection devices and method for operation of same |
| FR2863767B1 (fr) * | 2003-12-12 | 2006-06-09 | Commissariat Energie Atomique | Support memoire irreversible a deformation plastique et procede de realisation d'un tel support |
| US7034332B2 (en) * | 2004-01-27 | 2006-04-25 | Hewlett-Packard Development Company, L.P. | Nanometer-scale memory device utilizing self-aligned rectifying elements and method of making |
| DE102004004863B4 (de) * | 2004-01-30 | 2007-01-25 | Infineon Technologies Ag | Resistiv arbeitende Speicherzelle |
| US7492339B2 (en) * | 2004-03-26 | 2009-02-17 | E Ink Corporation | Methods for driving bistable electro-optic displays |
| NO321555B1 (no) * | 2004-03-26 | 2006-05-29 | Thin Film Electronics Asa | Organisk elektronisk innretning og fremgangsmate til fremstilling av en slik innretning |
| US7608855B2 (en) * | 2004-04-02 | 2009-10-27 | Spansion Llc | Polymer dielectrics for memory element array interconnect |
| WO2006001923A2 (en) * | 2004-05-17 | 2006-01-05 | The Regents Of The University Of California | Bistable nanoparticle- polymer composite for use in memory devices |
| US7554111B2 (en) * | 2004-05-20 | 2009-06-30 | The Regents Of The University Of California | Nanoparticle-polymer bistable devices |
| NO20042771D0 (no) | 2004-06-30 | 2004-06-30 | Thin Film Electronics Asa | Optimering av driftstemperatur i et ferroelektrisk eller elektret minne |
| US8044387B1 (en) | 2004-07-07 | 2011-10-25 | Spansion Llc | Semiconductor device built on plastic substrate |
| US11250794B2 (en) | 2004-07-27 | 2022-02-15 | E Ink Corporation | Methods for driving electrophoretic displays using dielectrophoretic forces |
| US7453445B2 (en) | 2004-08-13 | 2008-11-18 | E Ink Corproation | Methods for driving electro-optic displays |
| US7398348B2 (en) * | 2004-08-24 | 2008-07-08 | Sandisk 3D Llc | Method and apparatus for using a one-time or few-time programmable memory with a host device designed for erasable/rewritable memory |
| CN100557813C (zh) | 2004-10-18 | 2009-11-04 | 株式会社半导体能源研究所 | 半导体器件及其驱动方法 |
| GB2437188A (en) * | 2004-10-28 | 2007-10-17 | Univ California | Organic-complex thin film for nonvolatile memory applications |
| US7675123B2 (en) * | 2004-10-29 | 2010-03-09 | Agfa-Gevaert Nv | Printable non-volatile passive memory element and method of making thereof |
| US20070057311A1 (en) * | 2004-10-29 | 2007-03-15 | Agfa-Gevaert | Conventionally printable non-volatile passive memory element and method of making thereof |
| US20060098485A1 (en) * | 2004-10-29 | 2006-05-11 | Agfa-Gevaert | Printable non-volatile passive memory element and method of making thereof |
| US7876596B2 (en) | 2004-11-08 | 2011-01-25 | Waseda University | Memory element and method for manufacturing same |
| US7443711B1 (en) * | 2004-12-16 | 2008-10-28 | Hewlett-Packard Development Company, L.P. | Non-volatile programmable impedance nanoscale devices |
| US7218570B2 (en) * | 2004-12-17 | 2007-05-15 | Sandisk 3D Llc | Apparatus and method for memory operations using address-dependent conditions |
| KR100913903B1 (ko) * | 2004-12-24 | 2009-08-26 | 삼성전자주식회사 | 양자점을 이용하는 메모리 소자 |
| KR101114770B1 (ko) * | 2004-12-24 | 2012-03-05 | 삼성전자주식회사 | 비휘발성 유기 메모리 소자의 제조 방법 및 그에 의해수득된 비휘발성 유기 메모리 소자 |
| KR100990291B1 (ko) * | 2004-12-28 | 2010-10-26 | 삼성전자주식회사 | 덴드리머를 이용하는 메모리소자 |
| US7277336B2 (en) * | 2004-12-28 | 2007-10-02 | Sandisk 3D Llc | Method and apparatus for improving yield in semiconductor devices by guaranteeing health of redundancy information |
| US7298665B2 (en) * | 2004-12-30 | 2007-11-20 | Sandisk 3D Llc | Dual-mode decoder circuit, integrated circuit memory array incorporating same, and related methods of operation |
| US7286439B2 (en) * | 2004-12-30 | 2007-10-23 | Sandisk 3D Llc | Apparatus and method for hierarchical decoding of dense memory arrays using multiple levels of multiple-headed decoders |
| KR101078125B1 (ko) * | 2005-02-07 | 2011-10-28 | 삼성전자주식회사 | 다공성 물질을 이용한 비휘발성 나노 채널 메모리 소자 |
| KR101078150B1 (ko) * | 2005-03-17 | 2011-10-28 | 삼성전자주식회사 | 유기-무기 복합체 다공성 물질을 이용한 비휘발성 나노 채널 메모리 소자 |
| KR101322747B1 (ko) * | 2005-03-25 | 2013-11-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 및 전자기기 |
| US7272052B2 (en) * | 2005-03-31 | 2007-09-18 | Sandisk 3D Llc | Decoding circuit for non-binary groups of memory line drivers |
| US7054219B1 (en) | 2005-03-31 | 2006-05-30 | Matrix Semiconductor, Inc. | Transistor layout configuration for tight-pitched memory array lines |
| US7359279B2 (en) * | 2005-03-31 | 2008-04-15 | Sandisk 3D Llc | Integrated circuit memory array configuration including decoding compatibility with partial implementation of multiple memory layers |
| US7142471B2 (en) * | 2005-03-31 | 2006-11-28 | Sandisk 3D Llc | Method and apparatus for incorporating block redundancy in a memory array |
| US7344913B1 (en) | 2005-04-06 | 2008-03-18 | Spansion Llc | Spin on memory cell active layer doped with metal ions |
| KR100719346B1 (ko) * | 2005-04-19 | 2007-05-17 | 삼성전자주식회사 | 저항 메모리 셀, 그 형성 방법 및 이를 이용한 저항 메모리배열 |
| CN101167189B (zh) * | 2005-04-27 | 2013-09-18 | 株式会社半导体能源研究所 | 半导体器件的制造方法 |
| US7868320B2 (en) | 2005-05-31 | 2011-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| NO20052904L (no) * | 2005-06-14 | 2006-12-15 | Thin Film Electronics Asa | Et ikke-flyktig elektrisk minnesystem |
| US7212454B2 (en) * | 2005-06-22 | 2007-05-01 | Sandisk 3D Llc | Method and apparatus for programming a memory array |
| US20070009821A1 (en) * | 2005-07-08 | 2007-01-11 | Charlotte Cutler | Devices containing multi-bit data |
| WO2007016419A2 (en) * | 2005-07-29 | 2007-02-08 | The General Hospital Corporation | Methods and compositions for reducing skin damage |
| EP1798732A1 (en) * | 2005-12-15 | 2007-06-20 | Agfa-Gevaert | Ferroelectric passive memory cell, device and method of manufacture thereof. |
| AT502657B1 (de) * | 2006-01-20 | 2007-05-15 | Univ Linz | Speicherelement für eine optische signalausgabe |
| WO2007105575A1 (en) * | 2006-03-10 | 2007-09-20 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device |
| FR2898910B1 (fr) * | 2006-03-23 | 2008-06-20 | Centre Nat Rech Scient | Nouveau procede d'application en couche mince de materiaux moleculaires a transition de spin |
| US7593256B2 (en) * | 2006-03-28 | 2009-09-22 | Contour Semiconductor, Inc. | Memory array with readout isolation |
| US20070260615A1 (en) * | 2006-05-08 | 2007-11-08 | Eran Shen | Media with Pluggable Codec |
| US9680686B2 (en) * | 2006-05-08 | 2017-06-13 | Sandisk Technologies Llc | Media with pluggable codec methods |
| US7283414B1 (en) | 2006-05-24 | 2007-10-16 | Sandisk 3D Llc | Method for improving the precision of a temperature-sensor circuit |
| US7486537B2 (en) * | 2006-07-31 | 2009-02-03 | Sandisk 3D Llc | Method for using a mixed-use memory array with different data states |
| US7450414B2 (en) * | 2006-07-31 | 2008-11-11 | Sandisk 3D Llc | Method for using a mixed-use memory array |
| US20080023790A1 (en) * | 2006-07-31 | 2008-01-31 | Scheuerlein Roy E | Mixed-use memory array |
| US20110019459A1 (en) * | 2007-01-11 | 2011-01-27 | Guobiao Zhang | Three-Dimensional Mask-Programmable Read-Only Memory with Reserved Space |
| US8885384B2 (en) | 2007-01-11 | 2014-11-11 | Chengdu Haicun Ip Technology Llc | Mask-programmed read-only memory with reserved space |
| KR20080089949A (ko) * | 2007-04-03 | 2008-10-08 | 삼성전자주식회사 | 트리페닐아민 코어를 가지는 덴드리머, 이를 이용한 유기메모리 소자 및 그의 제조방법 |
| US7966518B2 (en) * | 2007-05-15 | 2011-06-21 | Sandisk Corporation | Method for repairing a neighborhood of rows in a memory array using a patch table |
| US7958390B2 (en) * | 2007-05-15 | 2011-06-07 | Sandisk Corporation | Memory device for repairing a neighborhood of rows in a memory array using a patch table |
| UA81208C2 (en) * | 2007-06-01 | 2007-12-10 | Yurii Bogdanovych Zarvanytskyi | Three-dimensional device for processing information and a method for processing information |
| US7773446B2 (en) * | 2007-06-29 | 2010-08-10 | Sandisk 3D Llc | Methods and apparatus for extending the effective thermal operating range of a memory |
| US7813157B2 (en) * | 2007-10-29 | 2010-10-12 | Contour Semiconductor, Inc. | Non-linear conductor memory |
| US20090113116A1 (en) * | 2007-10-30 | 2009-04-30 | Thompson E Earle | Digital content kiosk and methods for use therewith |
| US7759201B2 (en) | 2007-12-17 | 2010-07-20 | Sandisk 3D Llc | Method for fabricating pitch-doubling pillar structures |
| US7746680B2 (en) | 2007-12-27 | 2010-06-29 | Sandisk 3D, Llc | Three dimensional hexagonal matrix memory array |
| US7887999B2 (en) * | 2007-12-27 | 2011-02-15 | Sandisk 3D Llc | Method of making a pillar pattern using triple or quadruple exposure |
| US7706169B2 (en) * | 2007-12-27 | 2010-04-27 | Sandisk 3D Llc | Large capacity one-time programmable memory cell using metal oxides |
| US7764534B2 (en) * | 2007-12-28 | 2010-07-27 | Sandisk 3D Llc | Two terminal nonvolatile memory using gate controlled diode elements |
| US20090225621A1 (en) * | 2008-03-05 | 2009-09-10 | Shepard Daniel R | Split decoder storage array and methods of forming the same |
| US7981592B2 (en) | 2008-04-11 | 2011-07-19 | Sandisk 3D Llc | Double patterning method |
| US7859887B2 (en) * | 2008-04-11 | 2010-12-28 | Sandisk 3D Llc | Multilevel nonvolatile memory device containing a carbon storage material and methods of making and using same |
| US7812335B2 (en) * | 2008-04-11 | 2010-10-12 | Sandisk 3D Llc | Sidewall structured switchable resistor cell |
| US7723180B2 (en) * | 2008-04-11 | 2010-05-25 | Sandisk 3D Llc | Multilevel nonvolatile memory device containing a carbon storage material and methods of making and using same |
| US8048474B2 (en) * | 2008-04-11 | 2011-11-01 | Sandisk 3D Llc | Method of making nonvolatile memory cell containing carbon resistivity switching as a storage element by low temperature processing |
| US7830698B2 (en) * | 2008-04-11 | 2010-11-09 | Sandisk 3D Llc | Multilevel nonvolatile memory device containing a carbon storage material and methods of making and using same |
| US7786015B2 (en) * | 2008-04-28 | 2010-08-31 | Sandisk 3D Llc | Method for fabricating self-aligned complementary pillar structures and wiring |
| US20090296445A1 (en) * | 2008-06-02 | 2009-12-03 | Shepard Daniel R | Diode decoder array with non-sequential layout and methods of forming the same |
| US7944728B2 (en) * | 2008-12-19 | 2011-05-17 | Sandisk 3D Llc | Programming a memory cell with a diode in series by applying reverse bias |
| US7781269B2 (en) * | 2008-06-30 | 2010-08-24 | Sandisk 3D Llc | Triangle two dimensional complementary patterning of pillars |
| US8014185B2 (en) * | 2008-07-09 | 2011-09-06 | Sandisk 3D Llc | Multiple series passive element matrix cell for three-dimensional arrays |
| US7733685B2 (en) * | 2008-07-09 | 2010-06-08 | Sandisk 3D Llc | Cross point memory cell with distributed diodes and method of making same |
| US7943515B2 (en) * | 2008-09-09 | 2011-05-17 | Sandisk 3D Llc | Shared masks for x-lines and shared masks for y-lines for fabrication of 3D memory arrays |
| US8076056B2 (en) * | 2008-10-06 | 2011-12-13 | Sandisk 3D Llc | Method of making sub-resolution pillar structures using undercutting technique |
| US8325556B2 (en) * | 2008-10-07 | 2012-12-04 | Contour Semiconductor, Inc. | Sequencing decoder circuit |
| US8475868B2 (en) * | 2008-10-23 | 2013-07-02 | The Invention Science Fund I Llc | Foam-like structures based on reactive composite materials |
| US8440923B2 (en) * | 2008-10-23 | 2013-05-14 | The Invention Science Fund I Llc | Electrical closing switch made from reactive composite materials |
| US8871121B2 (en) * | 2008-10-23 | 2014-10-28 | The Invention Science Fund I Llc | Optical and metamaterial devices based on reactive composite materials |
| US20100104823A1 (en) * | 2008-10-23 | 2010-04-29 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Reactive composite material structures with multiple reaction-propagation circuits |
| US20100104493A1 (en) * | 2008-10-23 | 2010-04-29 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Reactive composite material structures with endothermic reactants |
| US20100104834A1 (en) * | 2008-10-23 | 2010-04-29 | Searete Llc, A Limited Liability Corporation Of The State Of Delaware | Foam-like structures based on reactive composite materials |
| US8080443B2 (en) * | 2008-10-27 | 2011-12-20 | Sandisk 3D Llc | Method of making pillars using photoresist spacer mask |
| US7978496B2 (en) | 2008-12-18 | 2011-07-12 | Sandisk 3D Llc | Method of programming a nonvolatile memory device containing a carbon storage material |
| US7910407B2 (en) * | 2008-12-19 | 2011-03-22 | Sandisk 3D Llc | Quad memory cell and method of making same |
| WO2010080437A2 (en) | 2008-12-19 | 2010-07-15 | Sandisk 3D Llc | Quad memory cell and method of making same |
| US7923812B2 (en) * | 2008-12-19 | 2011-04-12 | Sandisk 3D Llc | Quad memory cell and method of making same |
| US8114765B2 (en) * | 2008-12-31 | 2012-02-14 | Sandisk 3D Llc | Methods for increased array feature density |
| US8084347B2 (en) * | 2008-12-31 | 2011-12-27 | Sandisk 3D Llc | Resist feature and removable spacer pitch doubling patterning method for pillar structures |
| US7846756B2 (en) * | 2008-12-31 | 2010-12-07 | Sandisk 3D Llc | Nanoimprint enhanced resist spacer patterning method |
| US8023310B2 (en) * | 2009-01-14 | 2011-09-20 | Sandisk 3D Llc | Nonvolatile memory cell including carbon storage element formed on a silicide layer |
| US7940554B2 (en) * | 2009-04-24 | 2011-05-10 | Sandisk 3D Llc | Reduced complexity array line drivers for 3D matrix arrays |
| US7923305B1 (en) | 2010-01-12 | 2011-04-12 | Sandisk 3D Llc | Patterning method for high density pillar structures |
| US8026178B2 (en) | 2010-01-12 | 2011-09-27 | Sandisk 3D Llc | Patterning method for high density pillar structures |
| TWI591604B (zh) | 2010-04-09 | 2017-07-11 | 電子墨水股份有限公司 | 用於驅動電光顯示器的方法 |
| US8284589B2 (en) * | 2010-08-20 | 2012-10-09 | Sandisk 3D Llc | Single device driver circuit to control three-dimensional memory element array |
| EP2458526A1 (en) * | 2010-11-29 | 2012-05-30 | Printechnologics GmbH | System and method for retrieving information from a data carrier |
| US8934292B2 (en) | 2011-03-18 | 2015-01-13 | Sandisk 3D Llc | Balanced method for programming multi-layer cell memories |
| US9117493B2 (en) | 2011-09-01 | 2015-08-25 | Chengdu Haicun Ip Technology Llc | Discrete three-dimensional memory comprising off-die address/data translator |
| US9558842B2 (en) | 2011-09-01 | 2017-01-31 | HangZhou HaiCun Information Technology Co., Ltd. | Discrete three-dimensional one-time-programmable memory |
| US9305605B2 (en) | 2011-09-01 | 2016-04-05 | Chengdu Haicun Ip Technology Llc | Discrete three-dimensional vertical memory |
| US9396764B2 (en) | 2011-09-01 | 2016-07-19 | HangZhou HaiCun Information Technology Co., Ltd. | Discrete three-dimensional memory |
| US9093129B2 (en) | 2011-09-01 | 2015-07-28 | Chengdu Haicun Ip Technology Llc | Discrete three-dimensional memory comprising dice with different BEOL structures |
| US9299390B2 (en) | 2011-09-01 | 2016-03-29 | HangZhou HaiCun Informationa Technology Co., Ltd. | Discrete three-dimensional vertical memory comprising off-die voltage generator |
| US8890300B2 (en) | 2011-09-01 | 2014-11-18 | Chengdu Haicun Ip Technology Llc | Discrete three-dimensional memory comprising off-die read/write-voltage generator |
| US9190412B2 (en) | 2011-09-01 | 2015-11-17 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional offset-printed memory |
| US9666300B2 (en) | 2011-09-01 | 2017-05-30 | XiaMen HaiCun IP Technology LLC | Three-dimensional one-time-programmable memory comprising off-die address/data-translator |
| US8699257B2 (en) | 2011-09-01 | 2014-04-15 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional writable printed memory |
| US9559082B2 (en) | 2011-09-01 | 2017-01-31 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional vertical memory comprising dice with different interconnect levels |
| US9123393B2 (en) | 2011-09-01 | 2015-09-01 | HangZhou KiCun nformation Technology Co. Ltd. | Discrete three-dimensional vertical memory |
| US9024425B2 (en) | 2011-09-01 | 2015-05-05 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional memory comprising an integrated intermediate-circuit die |
| US9305604B2 (en) | 2011-09-01 | 2016-04-05 | HangZhou HaiCun Information Technology Co., Ltd. | Discrete three-dimensional vertical memory comprising off-die address/data-translator |
| US9508395B2 (en) | 2011-09-01 | 2016-11-29 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional one-time-programmable memory comprising off-die read/write-voltage generator |
| US8921991B2 (en) | 2011-09-01 | 2014-12-30 | Chengdu Haicun Ip Technology Llc | Discrete three-dimensional memory |
| US9001555B2 (en) | 2012-03-30 | 2015-04-07 | Chengdu Haicun Ip Technology Llc | Small-grain three-dimensional memory |
| US9476981B2 (en) | 2013-01-08 | 2016-10-25 | Massachusetts Institute Of Technology | Optical phased arrays |
| KR102350191B1 (ko) * | 2013-01-08 | 2022-01-17 | 메사추세츠 인스티튜트 오브 테크놀로지 | 광학 위상 어레이들 |
| US9293509B2 (en) | 2013-03-20 | 2016-03-22 | HangZhou HaiCun Information Technology Co., Ltd. | Small-grain three-dimensional memory |
| US10211258B2 (en) | 2014-04-14 | 2019-02-19 | HangZhou HaiCun Information Technology Co., Ltd. | Manufacturing methods of JFET-type compact three-dimensional memory |
| CN104978990B (zh) | 2014-04-14 | 2017-11-10 | 成都海存艾匹科技有限公司 | 紧凑型三维存储器 |
| US10304553B2 (en) | 2014-04-14 | 2019-05-28 | HangZhou HaiCun Information Technology Co., Ltd. | Compact three-dimensional memory with an above-substrate decoding stage |
| US10079239B2 (en) | 2014-04-14 | 2018-09-18 | HangZhou HaiCun Information Technology Co., Ltd. | Compact three-dimensional mask-programmed read-only memory |
| US10304495B2 (en) | 2014-04-14 | 2019-05-28 | Chengdu Haicun Ip Technology Llc | Compact three-dimensional memory with semi-conductive address line portion |
| US10199432B2 (en) | 2014-04-14 | 2019-02-05 | HangZhou HaiCun Information Technology Co., Ltd. | Manufacturing methods of MOSFET-type compact three-dimensional memory |
| US10446193B2 (en) | 2014-04-14 | 2019-10-15 | HangZhou HaiCun Information Technology Co., Ltd. | Mixed three-dimensional memory |
| CN104979352A (zh) | 2014-04-14 | 2015-10-14 | 成都海存艾匹科技有限公司 | 混合型三维印录存储器 |
| US9886571B2 (en) | 2016-02-16 | 2018-02-06 | Xerox Corporation | Security enhancement of customer replaceable unit monitor (CRUM) |
| US11170863B2 (en) | 2016-04-14 | 2021-11-09 | Southern University Of Science And Technology | Multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAM) |
| CN109119121A (zh) | 2016-04-14 | 2019-01-01 | 厦门海存艾匹科技有限公司 | 双偏置的三维一次编程存储器 |
| CN107316869A (zh) | 2016-04-16 | 2017-11-03 | 成都海存艾匹科技有限公司 | 三维纵向一次编程存储器 |
| US10559574B2 (en) | 2016-04-16 | 2020-02-11 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional vertical one-time-programmable memory comprising Schottky diodes |
| US10490562B2 (en) | 2016-04-16 | 2019-11-26 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional vertical one-time-programmable memory comprising multiple antifuse sub-layers |
| JP2018057342A (ja) * | 2016-10-06 | 2018-04-12 | 株式会社東芝 | 細胞分取装置および細胞分取システム |
| US9806256B1 (en) | 2016-10-21 | 2017-10-31 | Sandisk Technologies Llc | Resistive memory device having sidewall spacer electrode and method of making thereof |
| US10978169B2 (en) | 2017-03-17 | 2021-04-13 | Xerox Corporation | Pad detection through pattern analysis |
| US10566388B2 (en) | 2018-05-27 | 2020-02-18 | HangZhou HaiCun Information Technology Co., Ltd. | Three-dimensional vertical memory |
| US10497521B1 (en) | 2018-10-29 | 2019-12-03 | Xerox Corporation | Roller electric contact |
| KR102342308B1 (ko) * | 2018-10-31 | 2021-12-22 | 재단법인대구경북과학기술원 | 메모리 셀 유닛, 스위칭 저항 메모리 소자 및 이를 포함하는 뇌신경모사 소자 |
| US11311958B1 (en) * | 2019-05-13 | 2022-04-26 | Airgas, Inc. | Digital welding and cutting efficiency analysis, process evaluation and response feedback system for process optimization |
| US12063794B2 (en) | 2020-11-24 | 2024-08-13 | Southern University Of Science And Technology | High-density three-dimensional vertical memory |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3681754A (en) * | 1969-07-28 | 1972-08-01 | Thomas L Baasch | Self luminous shift register information display |
| US3612758A (en) * | 1969-10-03 | 1971-10-12 | Xerox Corp | Color display device |
| JPS6295882A (ja) * | 1985-10-23 | 1987-05-02 | Canon Inc | 電気的記憶装置 |
| JPS6295883A (ja) * | 1985-10-23 | 1987-05-02 | Canon Inc | 電気的記憶装置 |
| SU1378682A1 (ru) * | 1986-05-18 | 1994-12-30 | В.И. Овчаренко | Матричный накопитель для постоянного запоминающего устройства |
| EP0395886A2 (en) * | 1989-04-03 | 1990-11-07 | Olympus Optical Co., Ltd. | Memory cell and multidimensinal memory device constituted by arranging the memory cells |
| JPH03137894A (ja) * | 1989-10-23 | 1991-06-12 | Matsushita Giken Kk | スイッチング・メモリ複合機能素子アレイ |
| JPH03137896A (ja) * | 1989-10-23 | 1991-06-12 | Matsushita Giken Kk | 記憶素子および記憶装置 |
| JPH04145664A (ja) * | 1990-10-08 | 1992-05-19 | Canon Inc | 有機電子素子の駆動法 |
| JP3570692B2 (ja) * | 1994-01-18 | 2004-09-29 | ローム株式会社 | 不揮発性メモリ |
| JP3127751B2 (ja) * | 1995-01-04 | 2001-01-29 | 日本電気株式会社 | 強誘電体メモリ装置およびその動作制御方法 |
| US5889694A (en) * | 1996-03-05 | 1999-03-30 | Shepard; Daniel R. | Dual-addressed rectifier storage device |
| NO304859B1 (no) * | 1997-06-06 | 1999-02-22 | Opticom As | Optisk logisk element og fremgangsmÕter til henholdsvis dets preparering og optiske adressering, samt anvendelse derav i en optisk logisk innretning |
| CA2257936A1 (en) * | 1996-06-12 | 1997-12-18 | Opticom Asa | Optical logic element and optical logic device |
-
1997
- 1997-06-17 NO NO972803A patent/NO972803D0/no unknown
-
1998
- 1998-06-17 EP EP98933982A patent/EP0990235B1/en not_active Expired - Lifetime
- 1998-06-17 DK DK98933982T patent/DK0990235T3/da active
- 1998-06-17 RU RU2000100933/09A patent/RU2182732C2/ru not_active IP Right Cessation
- 1998-06-17 US US09/147,680 patent/US6055180A/en not_active Expired - Lifetime
- 1998-06-17 JP JP50422599A patent/JP3415856B2/ja not_active Expired - Fee Related
- 1998-06-17 DE DE69813218T patent/DE69813218T2/de not_active Expired - Lifetime
- 1998-06-17 ES ES98933982T patent/ES2196585T3/es not_active Expired - Lifetime
- 1998-06-17 CA CA002294834A patent/CA2294834C/en not_active Expired - Fee Related
- 1998-06-17 WO PCT/NO1998/000185 patent/WO1998058383A2/en not_active Ceased
- 1998-06-17 CN CNB988082179A patent/CN100440374C/zh not_active Expired - Lifetime
- 1998-06-17 AT AT98933982T patent/ATE237182T1/de not_active IP Right Cessation
- 1998-06-17 KR KR1019997011948A patent/KR100362053B1/ko not_active Expired - Fee Related
- 1998-06-17 AU AU83596/98A patent/AU735299B2/en not_active Ceased
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100342453C (zh) * | 2000-11-27 | 2007-10-10 | 薄膜电子有限公司 | 铁电存储电路及其制造方法 |
| CN100367403C (zh) * | 2001-02-26 | 2008-02-06 | 薄膜电子有限公司 | 被选存储单元非破坏性读出的方法及设备 |
| US7935957B2 (en) | 2005-08-12 | 2011-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and a semiconductor device |
| US8847209B2 (en) | 2005-08-12 | 2014-09-30 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and a semiconductor device |
| US7719001B2 (en) | 2006-06-28 | 2010-05-18 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device with metal oxides and an organic compound |
| CN101097935B (zh) * | 2006-06-28 | 2012-02-08 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
| WO2008019616A1 (en) * | 2006-08-14 | 2008-02-21 | Hong Kong Applied Science And Technology Research Institute Co., Ltd | Electrical thin film memory |
| US7811880B2 (en) | 2007-05-14 | 2010-10-12 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Fabrication of recordable electrical memory |
| CN102077346A (zh) * | 2008-06-30 | 2011-05-25 | 桑迪士克3D公司 | 通过使用正型光刻胶进行二次图案化而制造高密度柱结构的方法 |
| CN102077346B (zh) * | 2008-06-30 | 2013-05-01 | 桑迪士克3D公司 | 通过使用正型光刻胶进行二次图案化而制造高密度柱结构的方法 |
| CN110366780A (zh) * | 2017-01-15 | 2019-10-22 | 赛因托鲁株式会社 | 光检测器阵列 |
| CN110366780B (zh) * | 2017-01-15 | 2023-04-25 | 赛因托鲁株式会社 | 光检测器阵列 |
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| Publication number | Publication date |
|---|---|
| WO1998058383A3 (en) | 1999-04-01 |
| CA2294834A1 (en) | 1998-12-23 |
| JP3415856B2 (ja) | 2003-06-09 |
| AU735299B2 (en) | 2001-07-05 |
| EP0990235A2 (en) | 2000-04-05 |
| CN100440374C (zh) | 2008-12-03 |
| KR100362053B1 (ko) | 2002-11-22 |
| DE69813218T2 (de) | 2004-03-25 |
| CA2294834C (en) | 2005-01-25 |
| WO1998058383A9 (en) | 1999-05-20 |
| ES2196585T3 (es) | 2003-12-16 |
| WO1998058383A2 (en) | 1998-12-23 |
| JP2001503183A (ja) | 2001-03-06 |
| RU2182732C2 (ru) | 2002-05-20 |
| AU8359698A (en) | 1999-01-04 |
| DE69813218D1 (de) | 2003-05-15 |
| NO972803D0 (no) | 1997-06-17 |
| EP0990235B1 (en) | 2003-04-09 |
| KR20010013926A (ko) | 2001-02-26 |
| DK0990235T3 (da) | 2003-04-28 |
| US6055180A (en) | 2000-04-25 |
| ATE237182T1 (de) | 2003-04-15 |
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