CN1264272A - Electronic equipment - Google Patents

Abstract

An electric device is installed in heat-radiating shell. The shell contains at least one unit installed in heat-conducting inner sleeve which can provide RF isolation and is installed to shell surface in thermal contact mode. The unit wall has a the first slot for recepting the evaporator of heat tube between shell and inner sleeve. The condensator of heat tube is lower than evaporator and recepted by slot on shell wall. As the heat tube is clamped at its end part, so slot is unnecessary, resulting in easily detaching it.

Description

Electronic equipment

The present invention relates to a kind of electronic equipment that is loaded in the heat-dissipating casing.

Do not having under the situation of forced convertion, electronic equipment can be at the cover top portion ratio in bottom warm.For the electronic equipment that seals for outdoor application, owing to the inner heat that produces must be dissipated by shell, so worse off.In theory, the dissipate parts of big calorimetric should be placed to such an extent that be lower than the parts of the little calorimetric of dissipating in shell.But this can be always not possible.

With some heat pipes all parts liberated heats are transmitted to cooler position in the shell.Routinely, the evaporator of heat pipe is for example to carry out direct heat with clamping or connection method with power component to contact.Routinely, condenser is pressed into the shell wall further groove, carries out interference engagement in groove, to guarantee good thermo-contact.Heat pipe has circular cross section, and groove has corresponding rounded bottom.The step that heat pipe is pressed into groove also can be used to make the heat pipe distortion, flushes so that heat pipe is trimmed to groove top.

In fact, it is impossible removing heat pipe, thereby makes the dismounting of the circuit board that element is housed on it become very difficult.

In some shell, each independently must be isolated mutually with the interior cover of sealing the unit, disturbs with preventing RF (RF).It is difficult keeping RF to isolate around the heat pipe that will overlap in must entering.

Under this background, a kind of electronic equipment in the heat-dissipating casing that is loaded on is provided, shell is equipped with at least one and is loaded on the unit in the cover in the heat conduction, and interior cover provides RF to isolate, and to be loaded on the shell wall and its thermo-contact; Have first groove that receives heat pipe evaporator in the wall of this unit, heat pipe is held between shell and the interior cover, and the cold doubtful device of heat pipe is lower than evaporator in use, and it is held by a groove in the shell wall, and is sandwiched in wherein by a clamping component.

Because heat pipe is in its end clamping,, thereby can easily remove so need carry out interference engagement in any one groove.Interior cover can be kept RF and isolate.

Preferably, arrange first recess near the one or more power components in interior cover.

In order to reduce the size of shell, preferably condenser clamp is held in its groove by another unit of fulfiling the clamping components function.This another unit can include only some lower powered elements.

The most preferably, heat pipe has two relative flat substantially sides, and first and second grooves are flat shapes.This can simplify the processing of groove, and makes respectively and to become level and smooth facing to the wall of first and second grooves or the surface of clamping components.

Referring now to accompanying drawing, use case description one embodiment of the present of invention, in the accompanying drawings:

Fig. 1 is by embodying the schematic section of an electronic equipment part of the present invention, representing to be loaded on the interior cover on the shell wall;

Fig. 2 is a view of taking from the interior cover on Fig. 1 right side;

Fig. 3 is the sectional view shown in arrow A-A-among Fig. 1; With

Fig. 4 is the sectional view shown in arrow B-B among Fig. 2.

With reference to all figure, the base station of a mobile communications network has an electronic equipment that is loaded in the shell 2, and the part of electronic equipment only is shown in all figure.Shell is equipped with a broadband power amplifier 4 in all unit, and it is loaded on overlaps in the aluminium in 8, isolates so that RF to be provided; With an antenna duplexer 6.According to all internal elements that comprise power amplifier 8 and antenna duplexer 6 being installed with the mode of wall 7 thermo-contacts of shell 2.Shell 2 is made by light metal, and has the surface or the fin 9 of extension, so that the heat that all internal elements that comprise power amplifier 4 and antenna duplexer 6 by it are produced dissipates.

Shell 2 seals.Convection current in the enclosure is very little because the inner space that all unit stay wherein is installed.Convection current around the shell is not enforceable, thus cover top portion than bottom heat many.Compare with antenna transmit-receive switch 6, power amplifier 4 can produce quite a large amount of heat, thereby preferably power amplifier is placed on below the antenna duplexer of lower temperature.Yet, other design constraint but need power amplifier 4 be placed on antenna duplexer above.

In order to reduce the temperature of power amplifier 4, provide a kind of heat pipe 12.Lay the evaporator 13 of heat pipe 12 by the groove 14 in the wall 11 of aluminum hull 8.Heat pipe has two common smooth opposite flanks 16.The bottom 18 of groove 14 is level and smooth.The surface that wall 7 parts of power amplifier 4 are housed on it is level and smooth.With 4 screws 20 power amplifier 4 is installed on the wall.The coexist thickness of the heat pipe between its flat side of the degree of depth of groove 14 is similar, and heat pipe is held between wall 7 and the cover 8 further groove bottom 18.Can be as can be seen from Figure 4, the width of groove is enough big, so that heat pipe 12 is a kind of matched in clearance, and can remove easily.

In cover 8, some elements are loaded on the circuit board 19.Near the power component 21 of power transistor of the big calorimetric of dissipating and so on, groove 14 is laid evaporator 13.

Lay the condenser 22 of heat pipe 12 with the groove in the wall 7 24.The bottom of groove is level and smooth.The width of groove is fully big, make condenser become a kind of matched in clearance, thereby it can easily be removed.Clamping components with the form of an antenna duplexer 6 is held in condenser clamp in the groove.Antenna duplexer 6 is to install with screw 26, and it has a level and smooth surface 28, is used for thermo-contact wall 7 and heat pipe 12.The degree of depth of groove 24 is similar to the thickness of heat pipe between its flat side, and heat pipe is can be clamped between the smooth surface 28 of the bottom of wall 7 further groove 24 and antenna duplexer 6.

Claims (4)

1. one kind is loaded on an electronic equipment in the heat-dissipating casing, and shell is equipped with at least one and is loaded on the unit in the cover in the heat conduction, and interior cover provides RF to isolate and is loaded on the shell wall with its thermo-contact; A wall of this unit has first groove of laying heat pipe evaporator therein, heat pipe is held between shell and the interior cover, the condenser of heat pipe in use is lower than evaporator, holds cold doubtful device and with clamping components clamping condenser in groove with a groove in the shell wall.

2. electronic equipment according to claim 1, wherein: near the one or more power components in first groove is placed in the cover.

3. electronic equipment according to claim 1 and 2, wherein: condenser clamp is held in its groove with another unit of fulfiling the clamping components function.

4. require described electronic equipment according to any one aforesaid right, wherein: heat pipe has two relative flat substantially sides, and first and second groove parts are flat.

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