CN1257542C - Image sensor manufacturing method - Google Patents

Abstract

A method for fabricating an image sensor. In order to provide a sensor manufacturing method for preventing impurities from entering the sensor and improving the quality of the sensor, the invention is provided, which comprises the following steps: providing a substrate having upper and lower surfaces; step two: fixedly arranging a flange layer with a groove formed on the substrate on the upper surface of the substrate; step three: fixing the image sensing chip with a plurality of welding pads on the upper surface of the substrate and locating in the groove; step four: electrically connecting a plurality of wires between the bonding pads of the image sensor chip and the substrate; step five: arranging an adhesive medium in the groove; step six: covering the transparent layer on the flange layer to cover the image sensing chip to form an image sensor; step seven: the image sensor is centrifugally rotated to uniformly diffuse the adhesive medium to the upper surface of the substrate, and the impurities in the groove and the impurities electrostatically adsorbed on the image sensing chip and the light-transmitting layer can fall onto the adhesive medium and be adhered by the adhesive medium.

Description

Image sensor manufacturing method

technical field

The invention belongs to a sensor manufacturing method, in particular to an image sensor manufacturing method.

Background technique

General sensors can be used to sense signals that are either light signals or sound signals. The image sensor is used to receive light signals or image signals. After receiving the light signal, the light signal can be converted into an electrical signal through the image sensor, and transmitted to the circuit board through the substrate.

As shown in FIG. 1 , a conventional image sensor includes a substrate 10 , a flange layer 18 , an image sensing chip 26 , a plurality of wires 28 and a transparent layer 34 .

The substrate 10 has an upper surface 12 formed with a first contact 15 and a lower surface 14 formed with a second contact 16 .

The flange layer 18 is provided with a first surface 20 and a second surface 22 which are adhesively fixed on the upper surface 12 of the substrate 10 and form a groove 24 with the substrate 10 .

The image sensor chip 26 is disposed in the groove 24 formed by the substrate 10 and the flange layer 18 , and fixed on the upper surface 12 of the substrate 10 .

The plurality of wires 28 have a first terminal 30 electrically connected to the image sensor chip 26 and a second terminal 32 electrically connected to the first contact 15 of the substrate 10 .

The transparent layer 34 is adhered on the first surface 20 of the flange layer 18 .

This conventional image sensor must be packaged in a very clean, dust-free room, otherwise impurities in the air will enter the groove 24 and electrostatically adhere to the light-transmitting layer 34 and the image sensor chip 26 , so that its pixels cannot be effectively improved. However, even in a clean clean room, some tiny particles will fall into the groove 24 and affect the pixel enhancement of the image sensor; and the manufacturer of the image sensor must continuously improve the clean room. grades, so that the cost of its plant equipment is quite high, and it cannot meet the requirement of being completely free of impurities.

Contents of the invention

The object of the present invention is to provide a method for manufacturing an image sensor that prevents impurities from entering the sensor and improves the quality of the sensor.

The present invention includes step 1: providing a substrate with upper and lower surfaces; step 2: fixing a flange layer on the upper surface of the substrate and forming a groove with the substrate; step 3: installing an image sensor with a plurality of welding pads The chip is fixed on the upper surface of the substrate and located in the groove; step 4: electrically connect a plurality of wires between the pads of the image sensor chip and the substrate; step 5: set the adhesive medium in the groove; step 6: Covering the light-transmitting layer on the flange layer to cover the image sensor chip to form an image sensor; Step 7: Centrifugally rotate the image sensor to spread the adhesive medium evenly on the substrate surface, and the impurities in the groove, the image sensing chip, and the electrostatically adsorbed impurities on the light-transmitting layer can fall onto the adhesive medium and be stuck by the adhesive medium.

in:

A plurality of first contacts are formed on the upper surface of the substrate; a plurality of wires are electrically connected between the welding pads of the sensing chip and the first contacts of the substrate.

After the step of setting the adhesive medium in the groove, the centrifugation step is carried out.

The step of setting the adhesive medium in the groove is to set the adhesive medium in the groove by coating or spraying.

Step 1 of the present invention: providing a substrate with upper and lower surfaces; Step 2: fixing a flange layer on the upper surface of the substrate and forming a groove with the substrate; Step 3: installing an image sensor with a plurality of welding pads The chip is fixed on the upper surface of the substrate and located in the groove; step 4: electrically connect a plurality of wires between the pads of the image sensor chip and the substrate; step 5: set the adhesive medium in the groove; step 6: Covering the light-transmitting layer on the flange layer to cover the image sensor chip to form an image sensor; Step 7: Centrifugally rotate the image sensor to spread the adhesive medium evenly on the substrate surface, and the impurities in the groove, the image sensing chip, and the electrostatically adsorbed impurities on the light-transmitting layer can fall onto the adhesive medium and be stuck by the adhesive medium. When the image sensor is centrifugally rotated, the adhesive medium is evenly diffused to the upper surface of the substrate, and the impurities in the groove and the electrostatically adsorbed impurities on the image sensing chip and the light-transmitting layer can fall onto the adhesive medium and It is stuck by the adhesive medium, prevents impurities from entering the sensor, improves the quality of the sensor, and thus achieves the purpose of the present invention.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional image sensor structure.

Fig. 2 is a schematic diagram of Steps 1, 2, 3, 4 and 5 of Embodiment 1 of the present invention.

Fig. 3 is a schematic diagram of Step 6 of Embodiment 1 of the present invention.

Fig. 4 is a schematic diagram of Step 7 of Embodiment 1 of the present invention.

Fig. 5 is a schematic diagram of Embodiment 2 of the present invention.

Detailed ways

Embodiment one

The present invention comprises the steps:

step one

Provide substrate 40

As shown in FIG. 2 , the substrate 40 is provided with an upper surface 42 formed with a plurality of first contacts 46 and a lower surface 44 formed with a plurality of second contacts 48;

step two

Fixed flange layer 50

As shown in FIG. 2, the flange layer 50 is fixed on the upper surface 42 of the substrate 40, and forms a groove 52 with the substrate 40;

step three

Fixed image sensor chip 54

As shown in FIG. 2 , an image sensor chip 54 with a plurality of welding pads 55 is fixed on the upper surface 42 of the substrate 40 and is located in the groove 52;

step four

Connect multiple wires 56

As shown in FIG. 2 , a plurality of wires 56 are electrically connected between the bonding pad 55 of the image sensing chip 54 and the first contact 46 of the substrate 40, so that the signal of the image sensing chip 54 is transmitted to the substrate 40;

step five

Adhesive medium 58 is set in the groove

As shown in Figure 2, will be coated or sprayed in the groove 52 for the adhesive medium 58 of colloid;

step six

Set light-transmitting layer 60

As shown in FIG. 3 , the transparent layer 60 is covered on the flange layer 50 to cover the image sensor chip 54 to form an image sensor;

step seven

Centrifugal rotation

As shown in FIG. 4 , the image sensor is rotated centrifugally, so that the adhesive medium 58 is evenly diffused to the upper surface 42 of the substrate 40, and the impurities in the groove 52 and the static electricity on the image sensor chip 54 and the light-transmitting layer 60 The adsorbed impurities may fall onto the adhesive medium 58 and be stuck by the adhesive medium 58 .

Embodiment two

As shown in Figure 5, the present invention comprises the following steps:

step one

Provide substrate 40

The substrate 40 is provided with an upper surface 42 formed with a plurality of first contacts 46 and a lower surface 44 formed with a plurality of second contacts 48;

step two

Fixed flange layer 50

The flange layer 50 is fixed on the upper surface 42 of the substrate 40, and forms a groove 52 with the substrate 40;

step three

Fixed image sensor chip 54

An image sensor chip 54 with a plurality of pads 55 is fixed on the upper surface 42 of the substrate 40 and located in the groove 52;

step four

Connect multiple wires 56

A plurality of wires 56 are electrically connected between the bonding pad 55 of the image sensing chip 54 and the first contact 46 of the substrate 40, so that the signal of the image sensing chip 54 is transmitted to the substrate 40;

step five

Adhesive medium 58 is set in the groove

Coating or spraying the colloidal adhesive medium 58 in the groove 52;

step six

Centrifugal rotation

performing centrifugal rotation to spread the adhesive medium 58 evenly to the upper surface 42 of the substrate 40;

step seven

Set light-transmitting layer 60

As shown in FIG. 4 , the transparent layer 60 is covered on the flange layer 50 to cover the image sensing chip 54 to form an image sensor;

step eight

Centrifugal rotation

The image sensor is rotated centrifugally, so that the impurities in the groove 52 and the electrostatically adsorbed impurities on the image sensor chip 54 and the light-transmitting layer 60 can fall onto the adhesive medium 58 and be stuck by the adhesive medium 58 .

As mentioned above, the impurities in the groove 52 can be stuck by the adhesive medium 58 to improve the sensing quality of the image sensor, and the original static electricity adheres to the image sensor chip 54 and the light-transmitting layer 60 by means of centrifugal rotation. Impurities can also fall onto the adhesive medium 58, thus improving the sensing quality of the image sensor.

Claims (4)

1, a kind of image sensor manufacture method, it comprises step 1: the substrate that is provided with upper and lower surface is provided; Step 2: fixedly install with substrate in upper surface of base plate and to form reeded flange layer; Step 3: the image sensing wafer that will be provided with a plurality of weld pads is fixed in the upper surface of substrate, and is positioned at groove; Step 4: plural wires is electrically connected between the weld pad and substrate of image sensing wafer; After it is characterized in that described electrical connection plural wires step 4, also comprise step 5: will stick together medium and be located in the groove; Step 6: photic zone is covered on the flange layer, constitutes into image sensor to envelope image sensing wafer; Step 7: image sensor is carried out centrifugal rotation, so that diffuse to upper surface of base plate, and the impurity of Electrostatic Absorption on impurity in the groove and image sensing wafer, the photic zone can be fallen to stick together on the medium and the medium that gets adhered sticks together with sticking together homogeneous media.

2, image sensor manufacture method according to claim 1 is characterized in that described upper surface of base plate is formed with a plurality of first contacts; Between the weld pad and substrate first contact of complex lead system electrical connection as sensing wafer.

3, image sensor manufacture method according to claim 1 is characterized in that described the setting carry out centrifugal rotation step after sticking together the medium step in groove.

4, image sensor manufacture method according to claim 1 is characterized in that described the setting stick together medium step system and will stick together medium with coating or spray pattern and be located in the groove in groove.

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