CN1249360A - Micro etching agent of copper and copper alloy - Google Patents
Micro etching agent of copper and copper alloy Download PDFInfo
- Publication number
- CN1249360A CN1249360A CN 97101824 CN97101824A CN1249360A CN 1249360 A CN1249360 A CN 1249360A CN 97101824 CN97101824 CN 97101824 CN 97101824 A CN97101824 A CN 97101824A CN 1249360 A CN1249360 A CN 1249360A
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- Prior art keywords
- copper
- acid
- etching agent
- micro etching
- ion source
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
- 229910052802 copper Inorganic materials 0.000 title abstract 4
- 239000010949 copper Substances 0.000 title abstract 4
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 3
- 239000003795 chemical substances by application Substances 0.000 title abstract 3
- 238000005530 etching Methods 0.000 title 1
- 238000003466 welding Methods 0.000 abstract 2
- 239000004952 Polyamide Substances 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 229920002647 polyamide Polymers 0.000 abstract 1
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- ing And Chemical Polishing (AREA)
Abstract
A microetching agent for copper and copper alloy is prepared from the aqueous solution of oxidant containing copper and contains high-molecular compound with polyamide chain and/or cational group. Said microetching agent can be used to roughen the surface of copper and copper alloy in order to make the surface become concave-convex shape for binding it with welding flux closely, resulting in higher welding performance.
Description
The present invention relates to be used to handle the micro etching agent of copper surface and copper alloy surface.
In the process of making printed circuit board (PCB),,, usually grinding is carried out on the copper surface for improving cementability with resist, when the solder resist lid covers the copper surface.The method of grinding has mechanical grinding and little etches (chemical grinding) such as polishing wheel grinds, scrubs, and when processing has the printed circuit board (PCB) of line image, uses little etch usually.Generally speaking, but use micro etching agent etch copper about 1～5 μ m in surface.
As the micro etching agent that is used for above-mentioned little etch, for example, No. 4956035 specification sheets of United States Patent (USP) discloses a kind of micro etching agent of calling in quaternary ammonium salt cationic surfactant, and record, with this micro etching agent process metal surfaces, can make the metallic surface smooth, thereby improve the cementability of resist because of being ground.
Yet there is following problems in the smooth surface of handling with above-mentioned micro etching agent: and use the cementability of the high hardening of resin printing ink of preforming material and hardness (degree of crosslinking) insufficient, produce and peel off or bubble, infiltrate between metallic surface and the resin at thereafter soup treatment process herb liquid.
For addressing the above problem, the present inventor has carried out deep research, the result is surprised to find, in micro etching agent, add trace have the polyamine chain and (or) macromolecular compound of cationic group, can make copper surface and copper alloy surface can as United States Patent (USP) is put down in writing, not become smooth, and the concaveconvex shape of etch Cheng Shen, the surface that obtains thus has the cementability of excellent and solder resist etc., thereby has finished the present invention.Promptly, the micro etching agent of the copper and copper alloy that the present invention is made up of the aqueous solution of the oxygenant that contains copper, this micro etching agent is characterised in that, contain 0.000001～1.0% (weight %, as follows) have the polyamine chain and (or) polymer (to call the cationic high-molecular compound in the following text) of cationic group.
The cationic high-molecular compound that uses among the present invention be water-soluble, show cationic characteristic, molecular weight is more than thousand, be preferably thousands of to millions of macromolecular compounds, its object lesson comprises the polymkeric substance, cationic derivatived cellulose etc. of salt of multipolymer, aminoalkyl group acrylamide of polymkeric substance, quaternary diallyl amine and acrylamide of polymkeric substance, the quaternary diallyl amine of polymine, polyalkylene polyamine, the cinnamic polymkeric substance of quaternary, (methyl) vinylformic acid quaternary aminoalkyl ester.The example of above-mentioned salt comprises hydrochloride, vitriol, phosphoric acid salt, various organic acid salt etc.In the above-mentioned cationic high-molecular compound, preferably polyethylene imines, polyalkylene polyamine.Above-mentioned cationic high-molecular compound can share more than 2 kinds.In addition, as above-mentioned cationic high-molecular compound, also can use the amendment of polymer coagulant, the hair washing usefulness of static inhibitor, the use in waste water treatment of resin or the fiber market product on sale that becomes to grade.
The usage quantity of above-mentioned cationic high-molecular compound is 0.000001～1.0% of a micro etching agent.Especially preferred scope is looked the kind of macromolecular compound, the pH of liquid etc. and different, usually in 0.00001～0.5% scope.If if above-mentioned usage quantity is less than 0.000001%, then its effect is insufficient, is difficult to the concaveconvex shape of etch Cheng Shen, and greater than 1.0%, then plays the rust-preventive agent effect on the contrary, and etch becomes slick surface shape.
But as long as oxygenant etch (chemical grinding) copper surface or the copper alloy surface that the micro etching agent of above-mentioned cationic high-molecular compound contains copper, no particular restriction have been called in.Its object lesson has, for example, and by containing the micro etching agent that the ionogenic aqueous solution of bivalent cupric ion source, organic acid or mineral acid and halogen is formed.
The example in above-mentioned bivalent cupric ion source has organic acid mantoquita, cupric chloride (II), cupric bromide (II), copper hydroxide (II) etc.Above-mentioned bivalent cupric ion source can be share more than 2 kinds.The content in above-mentioned bivalent cupric ion source is converted into metallic copper, is preferably 0.01～20%.If if above-mentioned content is very few, then etch rates is slack-off, and too much, then is difficult to dissolving, produces stain shape material.When stain shape material was left on the copper surface, the aqueous solution of usable acid or alkali was removed.
Above-mentioned organic acid example comprises formic acid, acetate, propionic acid, butyric acid, valeric acid, saturated fatty acids such as caproic acid, vinylformic acid, butenoic acid, unsaturated fatty acidss such as methylacrylic acid, oxalic acid, propanedioic acid, Succinic Acid, pentanedioic acid, hexanodioic acid, aliphatics monounsaturated dicarboxylic acids such as pimelic acid, aliphatics unsaturated dibasic acids such as toxilic acid, phenylformic acid, phthalic acid, aromatic carboxylic acids such as styracin, oxyacetic acid, lactic acid, oxysuccinic acid, alcohol acids such as citric acid, thionamic acid, β-chloropropionic acid, nicotinic acid, xitix, hydroxy new pentane acid, levulinic acids etc. have substituent carboxylic acid and their derivative etc.In addition, the example of mineral acid comprises hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid etc.Above-mentioned organic acid and mineral acid can share more than 2 kinds.
The content of above-mentioned organic acid or mineral acid is preferably in about 0.1～30%.If above-mentioned content is very few, cupric oxide is fully dissolved, produce stain shape material, be difficult to obtain stable etch rates, and if too much, the then steady dissolution decline of copper, oxidation again etc. can appear in the copper surface.
The ionogenic example of above-mentioned halogen has chlorion, bromide anion plasma source, for example, comprising can be at hydrochloric acid, Hydrogen bromide, sodium-chlor, calcium chloride, Repone K, ammonium chloride, Potassium Bromide, cupric chloride, zinc chloride, iron(ic) chloride, iron bromide, Tin tetrabromide, cupric bromide and other halogen ionic compound that can dissociate out in solution.Above-mentioned halogen ion source can share more than 2 kinds.For example, cupric chloride (II) can be used as the compound of two aspect effects with halogen ion source and bivalent cupric ion source and uses, and hydrochloric acid can be used as the compound with halogen ion source and two aspect effects of acid and uses.
The ionogenic content of above-mentioned halogen is preferably in about 0.01～20% with the halogen ionometer.If above-mentioned content is very few, then can not obtain cementability and the good copper surface of weldability with resin, and if too much, the then steady dissolution decline of copper.
In addition, in micro etching agent of the present invention, for reducing the pH change in the etch processing, also can add salt such as organic acid sodium salt, sylvite, ammonium salt, be the steady dissolution that improves copper, also can add 1, coordination agents such as 2-quadrol, pyridine, aniline, ammonia, monoethanolamine, diethanolamine, trolamine, N methyldiethanol amine also can add other various additives as required.
Below, as the object lesson of micro etching agent of the present invention, the micro etching agent that contains the ferric ion source is described.This micro etching agent is formed by containing the ionogenic aqueous solution of ferric ion source, organic acid or mineral acid and halogen.
The example in above-mentioned ferric ion source comprises iron(ic) chloride (III), iron bromide (III), ferric iodide (III), ferric sulfate (III), iron nitrate (III), ironic acetate (III) etc.Above-mentioned ferric ion source can be share more than 2 kinds.The content in above-mentioned ferric ion source is converted into metallic iron, is preferably 0.01～20%.If if above-mentioned content is very few, then etch rates is slack-off, and too much, then can be difficult to dissolving, generates stain shape material.
The example of above-mentioned organic acid comprises formic acid, acetate, propionic acid, butyric acid, valeric acid, saturated fatty acids such as caproic acid, vinylformic acid, butenoic acid, unsaturated fatty acidss such as methylacrylic acid, oxalic acid, propanedioic acid, Succinic Acid, pentanedioic acid, hexanodioic acid, aliphatics monounsaturated dicarboxylic acids such as pimelic acid, aliphatics unsaturated dibasic acids such as toxilic acid, phenylformic acid, phthalic acid, aromatic carboxylic acids such as styracin, oxyacetic acid, lactic acid, oxysuccinic acid, alcohol acids such as citric acid, thionamic acid, β-chloropropionic acid, nicotinic acid, xitix, hydroxy new pentane acid, levulinic acids etc. have substituent carboxylic acid and their derivative etc.In addition, the example of mineral acid comprises hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid etc.Above-mentioned organic acid and mineral acid can share more than 2 kinds.
The content of above-mentioned organic acid or mineral acid is preferably in about 0.1～30%.If above-mentioned content is very few, cupric oxide is fully dissolved, produce stain shape material, be difficult to obtain stable etch rates, and if too much, the then steady dissolution decline of copper, oxidation again etc. can appear in the copper surface.
The ionogenic example of above-mentioned halogen has chlorion, bromide anion plasma source, for example, comprising can be at hydrochloric acid, Hydrogen bromide, sodium-chlor, calcium chloride, Repone K, ammonium chloride, Potassium Bromide, cupric chloride, zinc chloride, iron(ic) chloride, Tin tetrabromide, cupric bromide and other halogen ionic compound that can dissociate out in solution.Above-mentioned halogen ion source can share more than 2 kinds.For example, iron(ic) chloride (III) can be used as the compound of two aspect effects with halogen ion source and ferric ion source and uses, and hydrochloric acid can be used as the compound with halogen ion source and two aspect effects of acid and uses.
The ionogenic content of above-mentioned halogen is preferably in about 0.01～20% with the halogen ionometer.If above-mentioned content is very few, then can not obtain cementability and the good copper surface of weldability with resin, and if too much, then can not obtain cementability and the good copper surface of weldability with resin, and, the steady dissolution decline of copper.
In addition, same with the above-mentioned micro etching agent that contains the bivalent cupric ion source in the above-mentioned micro etching agent that contains the ferric ion source, can add various additives.
Using method to the micro etching agent of the invention described above does not have particular restriction.For example, can use method that processed copper or copper alloy are sprayed, copper or copper alloy are immersed in method in the surface treatment agent etc.In addition, for oxidation is created on univalent copper ion or ferrous ion in the treatment agent because of etch copper or copper alloy,, also can be blown into air by frothing etc. to recover the etch ability.
After handling with micro etching agent of the present invention, also can be as No. 3645772 specification sheets of United States Patent (USP) be disclosed for improving with the adaptation of resin, in the aqueous solution of azoles or alcoholic solution, handle.In addition, also can be coated with titanium system, zirconium system, aluminium system or silane is coupler.Also have, after handling with micro etching agent of the present invention, also can be called as the oxide treatment of brown oxidation and black oxidation.
Micro etching agent of the present invention can be widely used in the chemical grinding of copper or copper alloy etc.Especially because the surface of the copper handled etc. is formed with dark concavo-convex, therefore, good with the adaptation of resins such as preforming material, solder resist, dry-film resist, galvanic deposit resist, it is useful especially manufacturing to be comprised that semiconductor packages such as grid contact pin array (PGA) is used, ball grid array (BGA) is used are used in interior various printed circuit board (PCB)s.And, also can be used for the surface treatment of lead frame.
For example, when making the copper foil laminate of use in printed circuit board, handle with micro etching agent of the present invention and to carry out roughening, can make its surface have excellent and bonding strength preforming material, and when forming pattern, have the erosion of excellence.In addition, if be used for the roughening on the copper surface of the internal substrate when making multilayer printed circuit board, then can make its surface have excellent and bonding strength preforming material, and have the characteristic that excellent anti-pink rings forms.Also have, when making printed circuit board (PCB), use micro etching agent of the present invention to carry out the roughening on copper surface, can improve the bonding strength of copper surface and insulating resin with combined method.In addition, with micro etching agent surface treated of the present invention and with in the past sulfuric acid hydrogen peroxide is that surface treated such as etchant is compared, gloss is few, therefore, when coating photosensitive resin or lamination, except that the adaptation that can improve with resin, the scattering of light during exposure reduces, thereby has improved the exploring degree of photosensitive resin.
In addition, the surface that obtains with micro etching agent processing of the present invention has excellent metal adhesional wetting property, and therefore, micro etching agent of the present invention also can be used as the surface treatment agent of the printed circuit board (PCB) before equal welder's preface and the electronic unit installation.
Embodiment 1～4
Each composition shown in the mixture table 1 is prepared micro etching agent of the present invention.Then, the gained micro etching agent is sprayed toward the copper foil surface of thick 70 μ m under 40 ℃ condition carry out etch 60 seconds.
Then, the gained Copper Foil is superimposed on the multilayer circuit board preforming material (GEPL-170 that Mitsubishi's gas chemistry (strain) is produced) of 2 thick 0.15mm, and heating and pressurizing is made veneer sheet.Then,,, Copper Foil is peeled off from preforming material, estimated its intensity (stripping strength) according to JIS C 6481 (1990) for the Copper Foil of mensuration gained veneer sheet and the cementability of preforming material.The results are shown in Table 1.Comparative example 1～3
Similarly to Example 1, micro etching agent is estimated shown in the preparation table 1.The results are shown in Table 1.
Table 1
| Form (%) | Stripping strength (kgf/cm) | |
| Embodiment 1 | Copper acetate (II) 5 acetic acid 7 ammonium chlorides 4 Epomine P-1000 0.0005 (molecular weight of Japanese catalyst (strain) production is 70,000 polymine) deionized water surplus | ??1.5 |
| Embodiment 2 | Iron chloride (III) 2 hydrates 1 formic acid 5 Epomine SP-200 0.0002 (molecular weight of Japanese catalyst (strain) production is 10,000 polymine) deionized water surplus | ??1.5 |
| Embodiment 3 | Iron chloride (III) 2 hydrates 2 malic acid 5 Sunflock 700 0.0002 (Sanyo changes into the cationic high-molecular agglutinant that industry (strain) is produced) deionized water surplus | ??1.4 |
| Embodiment 4 | Copper bromide (II) 2 acetic acid 6 Consens CP-104 0.0001 (molecular weight that Senka (strain) produces is the polymer of 200,000 quaternary diallylamine) surplus deionized water | ??1.3 |
| Comparative example 1 | Iron(ic) chloride (III) 2 hydrates 1 acetate 5 deionized water surpluses | ??0.6 |
| Comparative example 2 | Sulfuric acid 10 hydrogen peroxide 5 deionized water surpluses | ??0.4 |
| Comparative example 3 | Cupric chloride (II) 4 formic acid 6 Concens CP-104 5 (Senka (strain) production) surplus deionized water | ??0.5 |
With micro etching agent of the present invention copper or copper alloy are handled, can formation and the cementability of resins such as preforming material and solder resist is good and surface with excellent weldability.In addition, the gained surface is compared with using micro etching agent surface treated in the past, gloss is few, therefore, when being used as the substrate of photosensitive resin, remove the exploring to improve photosensitive resin and be outside one's consideration, when the circuit of printed circuit board (PCB) being detected, also have the effect of minimizing flase operation with automated optical detector (AOI).Therefore, for making the pattern printed circuit board (PCB) of graph thinning and densification day by day from now on, micro etching agent of the present invention is a kind of micro etching agent that can adapt fully with it.
Claims (6)
1. the micro etching agent of copper and copper alloy is made up of the aqueous solution of the oxygenant that contains copper, it is characterized in that, contains the macromolecular compound with polyamine chain and/or cationic group of 0.000001-1.0 weight %.
2. micro etching agent as claimed in claim 1 is characterized in that the oxygenant of copper is the bivalent cupric ion source, contains organic acid or mineral acid and halogen ion source.
3. micro etching agent as claimed in claim 2 is characterized in that, the bivalent cupric ion source is cupric chloride (II).
4. micro etching agent as claimed in claim 1 is characterized in that the oxygenant of copper is the ferric ion source, contains organic acid or mineral acid and halogen ion source.
5. micro etching agent as claimed in claim 4 is characterized in that, the ferric ion source is iron(ic) chloride (III).
6. micro etching agent as claimed in claim 1, it is characterized in that the macromolecular compound with polyamine chain and/or cationic group is the polymkeric substance or the cationic derivatived cellulose of salt of multipolymer, aminoalkyl group acrylamide of polymkeric substance, quaternary diallyl amine and acrylamide of polymkeric substance, the quaternary diallyl amine of polymine, polyalkylene polyamine, the cinnamic polymkeric substance of quaternary, (methyl) vinylformic acid quaternary aminoalkyl ester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB971018243A CN1195895C (en) | 1997-01-29 | 1997-01-29 | Micro etching agent of copper and copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB971018243A CN1195895C (en) | 1997-01-29 | 1997-01-29 | Micro etching agent of copper and copper alloy |
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| Publication Number | Publication Date |
|---|---|
| CN1249360A true CN1249360A (en) | 2000-04-05 |
| CN1195895C CN1195895C (en) | 2005-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB971018243A Expired - Lifetime CN1195895C (en) | 1997-01-29 | 1997-01-29 | Micro etching agent of copper and copper alloy |
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| CN100436645C (en) * | 2003-02-27 | 2008-11-26 | 美格株式会社 | Etching solution of copper or copper alloy and method for producing electronic substrate using the solution |
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- 1997-01-29 CN CNB971018243A patent/CN1195895C/en not_active Expired - Lifetime
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